JP6119419B2 - Power converter - Google Patents

Description

  The present invention relates to a power conversion device in which a semiconductor module containing a semiconductor element and a cooling pipe for cooling the semiconductor module are stacked.

  For example, as a power conversion device that performs power conversion between direct current power and alternating current power, there is one having a laminated body in which a semiconductor module incorporating a semiconductor element and a cooling pipe for cooling the semiconductor module are laminated (the following patents) Reference 1). In this power converter, the laminate is accommodated in a case and fixed. The case includes a support plate that supports the cooling pipe, and a side wall that protrudes from the support plate in the thickness direction of the support plate. Two cooling pipes adjacent to each other in the stacking direction of the stacked body are connected at both ends by connecting pipes.

  In the power conversion device, the laminate is fixed to the case from the three directions of the lamination direction, the thickness direction of the support plate, and the width direction (a direction orthogonal to both the lamination direction and the thickness direction). Yes. Thereby, the laminated body is firmly fixed to the case, and the vibration resistance is improved.

  For example, the stacking direction is fixed as follows. That is, a pressure member such as a leaf spring is accommodated in the case, and using this pressure member, the stacked body is pressed in the stacking direction and pressed against the inner wall surface of the case. Thereby, the laminated body is being fixed to the lamination direction with respect to the case.

  Further, the thickness direction is fixed as follows. That is, the semiconductor module has a main body portion in which a semiconductor element is sealed, and a pair of protrusions that protrude from the main body portion in opposite directions in the width direction are formed. The protrusion is engaged with the connecting pipe. The connecting pipe is sandwiched and fixed in the thickness direction by the protrusion and the support plate. Thereby, the vibration resistance in the thickness direction of the laminate is enhanced.

  The laminate is press-fitted into the case with the pair of protrusions in contact with the side walls of the case. Thereby, the laminate is fixed in the width direction.

JP 2012-139038 A

  However, the power conversion device has a problem that the semiconductor module is easily increased in size. That is, since the distance from the main body part of the semiconductor module to the connecting pipe is relatively long, if the protruding part is extended to the connecting pipe, the length of the protruding part needs to be increased. Therefore, the size of the semiconductor module is easily increased, and the manufacturing cost of the semiconductor module is likely to increase.

  Moreover, since the said power converter device press-fits the laminated body in a case, there exists a problem that the assembly property at the time of manufacture is not good.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a power conversion device that has excellent vibration resistance, can suppress an increase in the size of a semiconductor module, and can improve the assembling property during manufacturing.

One embodiment of the present invention is a stacked body in which a plurality of semiconductor modules in which semiconductor elements are sealed and a plurality of cooling pipes that cool the semiconductor modules are stacked.
A support plate, and a case for accommodating the laminate while supporting the cooling pipe from one side in the thickness direction of the support plate by the support plate;
A pressure member that is provided at a position adjacent to the stack in the stacking direction of the stack, and presses the stack in the stacking direction, thereby fixing the stack in the case;
A pair of fixed members provided on both sides of the laminated body in the width direction orthogonal to both the laminating direction and the thickness direction, respectively fixed to the case;
The semiconductor module is fixed to the case in the thickness direction by a bus bar connecting the semiconductor module and the fixed member,
The semiconductor module includes a main body portion that seals the semiconductor element, and a pair of protrusions that protrude from the main body portion toward opposite sides in the stacking direction, and the protrusions are associated with the cooling pipe. The cooling pipe is sandwiched in the thickness direction by the protrusion and the support plate,
The power converter is characterized in that the cooling pipe is sandwiched in the width direction by the pair of fixed members.

In the power converter, the pair of protrusions protrude in the stacking direction from the main body. The protrusion is engaged with the cooling pipe, and the cooling pipe is sandwiched in the thickness direction by the protrusion and the support plate. Thereby, the laminated body is being fixed to the thickness direction with respect to the case.
Therefore, the enlargement of the semiconductor module can be suppressed. That is, since the semiconductor module and the cooling pipe are stacked, the semiconductor module exists at a position adjacent to the cooling pipe in the stacking direction. Therefore, if the protrusion protrudes in the stacking direction, it can be engaged with the cooling pipe even if the length of the protrusion is short. Therefore, it is possible to suppress an increase in the size of the semiconductor module.

In the power converter, the cooling pipe is sandwiched in the width direction and fixed by the pair of fixed members fixed to the support plate.
Therefore, at the time of manufacturing, for example, the laminated body and the pair of fixed members are accommodated in a case, and after fixing the cooling pipe in the width direction by the pair of fixed members, the fixed member is fixed to the case. Can do. Therefore, in order to fix the laminated body in the width direction, it is not necessary to press-fit the laminated body into the case as in the conventional case, and the assembling property at the time of manufacture can be improved.

  Moreover, the said power converter device has fixed the laminated body in the lamination direction using the pressurization member. Furthermore, as described above, the laminate is also fixed in the thickness direction and the width direction, respectively. As described above, in the power conversion device, since the laminate is fixed to the case from three directions orthogonal to each other, the laminate is less likely to wobble regardless of the direction from which vibration is applied, and vibration resistance can be improved. It becomes possible.

  As described above, according to the present invention, it is possible to provide a power conversion device that has excellent vibration resistance, can suppress an increase in size of a semiconductor module, and can improve the assembling property at the time of manufacture.

It is sectional drawing of the power converter device in Example 1, Comprising: II sectional drawing of FIG. II-II sectional drawing of FIG. III-III sectional drawing of FIG. The principal part enlarged view of FIG. VV sectional drawing of FIG. The principal part enlarged view of FIG. The figure for demonstrating the manufacturing process of the power converter device in Example 1. FIG. The circuit diagram of the power converter device in Example 1. FIG. The manufacturing process explanatory drawing of the power converter device in Example 2. FIG. Sectional drawing of the power converter device in Example 2. FIG. The expanded sectional view of the semiconductor module in Example 3, and a cooling pipe. The expanded sectional view of the semiconductor module in Example 4, and a cooling pipe. The expanded sectional view of the semiconductor module in Example 5, and a cooling pipe.

In the power conversion device, the pair of fixed members each have a width direction protrusion that protrudes toward the stacked body in the width direction, and the cooling pipe is sandwiched in the width direction by the width direction protrusion. Preferably it is.
In this case, since the site | part (width direction protrusion part) which protruded in the width direction was formed in the to-be-fixed member, it becomes easy to contact a to-be-fixed member to a cooling pipe in this width direction protrusion part. Therefore, it becomes easy to fix the cooling pipe in the width direction.

Further, it is preferable that a deformed portion that is elastically deformed or plastically deformed is interposed between the wall of the cooling tube and the fixed member.
In this case, it becomes easier to manufacture the power converter. That is, the length of the cooling pipe in the width direction varies in manufacturing, and the position where the cooling pipe is arranged also varies. Therefore, if the deformation portion is interposed between the wall of the cooling pipe and the fixed member, the variation can be absorbed by the deformation portion. Therefore, it becomes easy to manufacture a power converter.

Example 1
The Example which concerns on the said power converter device is described using FIGS. As shown in FIGS. 1 to 3, the power conversion device 1 of this example includes a laminated body 10, a case 4, a pressure member 11, and a pair of fixed members 5 (5 a and 5 b).
The stacked body 10 is formed by alternately stacking a plurality of semiconductor modules 2 in which semiconductor elements 25 (see FIG. 8) are sealed and a plurality of cooling pipes 3 for cooling the semiconductor modules 2. As shown in FIG. 1, the case 4 includes a support plate 40 and a side wall 41. The case 4 accommodates the laminate 10 while supporting the cooling pipe 3 from one side in the thickness direction (Z direction) of the support plate 40 by the support plate 40. The side wall 41 is erected in the Z direction from the support plate 40.

As shown in FIGS. 2 and 3, the pressure member 11 is provided at a position adjacent to the stacked body 10 in the stacking direction (X direction) of the stacked body 10. The pressing member 11 fixes the laminated body 10 in the case 4 by pressing the laminated body 10 in the X direction.
As shown in FIG. 1, the pair of fixed members 5 a and 5 b are provided on both sides of the stacked body 10 in the width direction (Y direction) orthogonal to both the X direction and the Z direction. The fixed members 5a and 5b are fixed to the case 4 respectively.

The semiconductor module 2 is fixed to the case 4 in the Z direction by a bus bar 12 connecting the semiconductor module 2 and the fixed member 5.
As shown in FIGS. 2 and 6, the semiconductor module 2 includes a main body 20 that seals the semiconductor element 25, and a pair of protrusions 22 that protrude from the main body 20 toward opposite sides in the X direction. . The protrusion 22 is engaged with the cooling pipe 3. The cooling pipe 3 is sandwiched in the Z direction by the protrusion 22 and the support plate 40.
Further, as shown in FIG. 1, the cooling pipe 3 is sandwiched in the Y direction by a pair of fixed members 5a and 5b.

  The power conversion device 1 of this example is a vehicle-mounted power conversion device to be mounted on a vehicle such as an electric vehicle or a hybrid vehicle.

  In this example, a capacitor 57 is used as one fixed member 5a, and a terminal block 58 is used as the other fixed member 5b. The capacitor 57 smoothes the DC voltage applied to the semiconductor module 2 (see FIG. 8). The terminal block 58 is a table for placing an external connection terminal 120 of an AC bus bar 12c described later.

  As shown in FIG. 1, the semiconductor module 2 includes the main body 20 and a control terminal 23 and a power terminal 21 protruding from the main body 20. The control terminal 23 and the power terminal 21 protrude on opposite sides in the Z direction. A control circuit board 17 that controls the switching operation of the semiconductor module 2 is connected to the control terminal 23.

  The power terminal 21 includes a positive terminal 21a and a negative terminal 21b to which a DC voltage is applied, and an AC terminal 21c that is electrically connected to an AC load 71 (see FIG. 8). The positive electrode terminal 21 a and the negative electrode terminal 21 b are electrically connected to the capacitor element 570 of the capacitor 57 via the bus bar 12. The AC bus bar 12c is connected to the AC terminal 21c. The external connection terminal 120 of the AC bus bar 12 c is placed on the terminal block 58. By switching the semiconductor module 2 with the control circuit board 17, the DC voltage applied between the positive terminal 21a and the negative terminal 21b is converted into an AC voltage and output from the AC terminal 21c.

  The DC bus bars 12 a and 12 b are fixed to a capacitor 57. The AC bus bar 12 c is fixed to the terminal block 58. The capacitor 57 and the terminal block 58 are fixed to the case 4 as described above. Therefore, the semiconductor module 2 is fixed to the case 4 via the bus bars 12a to 12c, the capacitor 57, and the terminal block 58.

  A through hole 49 penetrating in the Z direction is formed in the support plate 40 of the case 4. A part of the semiconductor module 2 is disposed in the through hole 49. Further, both end portions 300 of the cooling pipe 3 in the Y direction are supported by the support plate 40.

  As shown in FIG. 3, the two cooling pipes 3 adjacent to each other in the X direction are connected by connecting pipes 13 at both end portions 300. Moreover, in order to lead out the refrigerant | coolant 16 into the cooling pipe 3a located in one edge part in a X direction among the several cooling pipes 3 which comprise the laminated body 10, and introducing the refrigerant | coolant 16. As shown in FIG. The derivation pipe 15 is connected. When the refrigerant 16 is introduced from the introduction pipe 14, the refrigerant 16 flows through all the cooling pipes 3 through the connecting pipe 13 and is led out from the outlet pipe 15. Thereby, the semiconductor module 2 is configured to be cooled.

  In the case 4, a boosting reactor 18 is disposed at a position adjacent to the stacked body 10 in the X direction. A partition wall 43 is formed between the reactor 18 and the stacked body 10.

  Between the partition wall 43 and the laminated body 10, the above-described pressure member 11 (plate spring) is provided. The pressurizing member 11 pressurizes the laminate 10 toward the side wall 41a on the pipes 14 and 15 side. Thereby, the laminated body 10 is fixed in the case 4 while ensuring the contact pressure between the semiconductor module 2 and the cooling pipe 3.

  As shown in FIGS. 1 and 4, the fixed members 5 a and 5 b each have a width direction protrusion 50 protruding toward the laminated body 10 in the Y direction. The cooling tube 3 is sandwiched in the Y direction by the width direction protrusions 50. As shown in FIG. 4, a curved surface 59 that follows the outer edge shape of both end portions 300 of the cooling pipe 3 is formed in the width direction protrusion 50. Between the cooling pipe 3 and the width direction projection part 50, the elastic part 32 for tolerance absorption is interposed. The curved surface 59 is in contact with the elastic portion 32 from an oblique direction. As a result, a force is applied to the cooling pipe 3 from both the Y direction and the Z direction.

  As shown in FIG. 3, the capacitor 57 includes a capacitor case 51, a capacitor element 570 accommodated in the capacitor case 51, and a sealing member 53 that seals the capacitor element 570. The width direction protrusion 50 of the capacitor 57 is formed integrally with the capacitor case 51.

  The terminal block 58 includes a resin pedestal 580 for mounting the external connection terminal 120. The width direction protrusion 50 of the terminal block 58 is formed integrally with the pedestal 580.

  On the other hand, as shown in FIG. 5, the cooling pipe 3 is formed by joining two pipe walls 30 (30a, 30b). An intermediate wall 35 is interposed between the two pipe walls 30. A space between the tube wall 30 and the middle wall 35 is a flow path F through which the refrigerant 16 flows. Fins 34 for increasing the contact area with the refrigerant 16 are arranged in the flow path F. The tube wall 30 and the middle wall 35 are so-called brazing sheets in which a brazing material is applied to the surface of a metal plate such as aluminum. One of the two tube walls 30a and 30b is formed integrally with the elastic portion 32. That is, a part of the tube wall 30 a extends toward the width direction protrusion 50 to constitute the elastic part 32. The tip of the elastic portion 32 is bent in a bowl shape. The tip of the elastic portion 32 is in contact with the curved surface 59 of the width direction protrusion 50.

  As shown in FIG. 7, when manufacturing the power conversion device 1, first, the laminated body 10 is accommodated in the case 4, and the laminated body 10 is fixed to the case 4 using the pressure member 11 (see FIG. 3). To do. Thereafter, the two fixed members 5 are accommodated in the case 4, and the curved surface 59 of the width direction protruding portion 50 is pressed against the elastic portion 32 while fixing the fixed member 5 to the case 4 using the bolts 19. At this time, the elastic part 32 is plastically deformed. Thereby, it is comprised so that the shape variation of the cooling pipe 3 and the position variation may be absorbed. Further, the curved surface 59 is used to apply force to the cooling pipe 3 in both the Y direction and the Z direction.

  On the other hand, as shown in FIG. 1, the semiconductor module 2 includes a metal heat sink 27 electrically connected to the semiconductor element 25. The heat sink 27 is exposed from the main body 20. As shown in FIG. 6, an insulating plate 6 made of an insulating material such as ceramic is interposed between the heat radiating plate 27 and the cooling pipe 3. The insulating plate 6 is provided to electrically insulate the heat radiating plate 27 and the cooling pipe 3 from each other. The main body 20 of the semiconductor module 2 is formed with a recess 24 into which the insulating plate 6 is fitted. The recess 24 prevents the insulating plate 6 from being displaced in the Z direction or the Y direction.

  6, the length L1 from the surface of the insulating plate 6 to the joint 39 in the X direction is the length L2 of the protrusion 22 in the X direction (from the surface of the main body 20 to the end face 220 of the protrusion 22). Length in the X direction). Thereby, it is suppressed that the protrusion 22 contact | abuts to the junction part 39, and the contact pressure of the semiconductor module 2 and the cooling pipe 3 is made high.

  Moreover, as shown in FIG. 6, the shoulder part 38 which is a site | part which the protrusion 22 engages among the cooling pipes 3 is formed in the round shape. The protrusion 22 is formed with a rounded surface 28 that is in close contact with the shoulder 38.

  Next, a circuit diagram of the power conversion device 1 will be described with reference to FIG. As shown in the figure, in this example, the step-up unit 111 and the inverter unit 110 are configured by using the semiconductor module 2 or the like. Each semiconductor module 2 is sealed with two semiconductor elements 25 (IGBT elements). The power conversion apparatus 1 of this example is configured to boost the DC voltage of the DC power supply 70 using the booster 111 and convert the boosted DC voltage into an AC voltage using the inverter 110. The reactor 18 described above is used for the booster 111. Further, the power conversion device 1 of this example includes a capacitor element 550 for a filter. The capacitor element 550 is accommodated in the capacitor case 51 together with the smoothing capacitor element 570.

The effect of this example will be described. In this example, as shown in FIGS. 2 and 6, the pair of protrusions 22 protrude from the main body 20 in the X direction. The protrusion 22 is engaged with the cooling pipe 3, and the cooling pipe 3 is sandwiched in the Z direction by the protrusion 22 and the support plate 40. Thereby, the laminated body 10 is fixed to the case 4 in the Z direction.
By comprising in this way, the enlargement of the semiconductor module 2 can be suppressed. That is, since the semiconductor module 2 and the cooling pipe 3 are laminated, the semiconductor module 2 exists at a position adjacent to the cooling pipe 3 in the X direction. Therefore, if the protrusion 22 protrudes in the X direction, the protrusion 22 can be engaged with the cooling pipe 3 even if the length of the protrusion 22 is short. Therefore, it is possible to suppress an increase in size of the semiconductor module 2.

Further, as shown in FIG. 1, in this example, the cooling pipe 3 is sandwiched and fixed in the Y direction by a pair of fixed members 5 fixed to the support plate 40.
Therefore, when manufacturing the power converter 1, for example, as shown in FIG. 7, the laminated body 10 is first accommodated in the case 4, and then the pair of fixed members 5 are fixed to the support plate 40, The cooling pipe 3 can be held in the Y direction by the fixed member 5. Therefore, since the laminated body 10 is fixed in the Y direction at the time of manufacture, it is not necessary to press-fit the laminated body 10 into the case 4 as in the prior art, and the assemblability at the time of manufacture can be improved.

  Moreover, the power converter device 1 is fixing the laminated body 10 to the X direction using the pressurization member 11, as shown in FIG. 2, FIG. Further, as described above, the stacked body 10 is also fixed in the Z direction and the Y direction, respectively. Thus, in this example, since the laminated body 10 is fixed to the case 4 from three directions orthogonal to each other, the laminated body 10 is less likely to wobble regardless of which direction the vibration is applied, and the vibration resistance is improved. It becomes possible.

Moreover, as shown in FIG. 1, the to-be-fixed members 5a and 5b of this example have the said width direction protrusion part 50, respectively. The cooling tube 3 is sandwiched in the Y direction by the width direction protrusions 50.
In this case, since the fixed members 5a and 5b are formed with portions projecting in the Y direction (width direction protrusions 50), in the width direction protrusions 50, the fixed members 5a and 5b are cooled pipes. 3 is easy to contact. Therefore, it becomes easy to fix the cooling pipe 3 in the Y direction.

In this example, as shown in FIG. 4, a deforming portion 32 that plastically deforms is interposed between the tube wall 30 of the cooling tube 3 and the fixed member 5.
In this case, it becomes easier to manufacture the power conversion device 1. That is, the length of the cooling pipe 3 in the Y direction varies in manufacturing, and the position of the cooling pipe 3 also varies. Therefore, if the deformable portion 32 is interposed between the cooling pipe 3 and the fixed member 5, the variation can be absorbed by the deformable portion 32. Therefore, it becomes easy to manufacture the power conversion device 1.

Further, in this example, as shown in FIG. 4, a curved surface 59 is formed on the width direction protrusion 50. When the curved surface 59 abuts against the deformable portion 32 at an angle, the cooling pipe 3 is pressed and fixed in both the Y direction and the Z direction.
If the curved surface 59 is formed in this way, as shown in FIG. 7, when the power conversion device 1 is manufactured, the cooling member 3 is simply fixed by fixing the fixed member 5 close to the support plate 40 from the Z direction. Can be pressed in the Y direction. Therefore, it is not necessary to move the fixed member 5 in the Y direction, and the power conversion device 1 can be manufactured more easily.

Further, as shown in FIG. 5, the deformable portion 32 of this example is integrated with the tube wall 30 of the cooling tube 3.
Therefore, it is not necessary to prepare the deformable portion 32 as a separate member from the cooling pipe 3. Therefore, the number of parts can be reduced, and the manufacturing cost of the power conversion device 1 can be reduced.

Moreover, as shown in FIG. 6, the said shoulder part 38 of the cooling pipe 3 is formed in the round shape. The protrusion 22 is formed with a rounded surface 28 that is in close contact with the shoulder 38.
Therefore, the contact area between the protrusion 22 and the cooling pipe 3 can be increased. Thereby, it can suppress that a big stress is added to the cooling pipe 3, and can suppress a deformation | transformation of the cooling pipe 3. FIG.

As shown in FIG. 6, an insulating plate 6 is interposed between the main body 20 of the semiconductor module 2 and the cooling pipe 3. A recess 24 into which the insulating plate 6 is fitted is formed in the main body 20.
Therefore, the recess 24 can effectively suppress the displacement of the insulating plate 6.

As shown in FIG. 1, of the pair of fixed members 5 a and 5 b, one fixed member 5 a is a capacitor 57 that smoothes the DC voltage applied to the semiconductor module 2. The other fixed member 5b is a terminal block 58 on which the external connection terminal 120 of the bus bar 12c is placed.
In this case, the capacitor 57 and the terminal block 58 can be effectively used as the fixed member 5. That is, as shown in FIG. 8, the capacitor 57 needs to be electrically connected to all the semiconductor modules 2, and therefore needs to be disposed in the vicinity of the semiconductor module 2. The terminal block 58 is also arranged in the vicinity of the semiconductor module 2. Therefore, the capacitor 57 and the terminal block 58 are arranged in the vicinity of the cooling pipe 3. Therefore, the capacitor 57 and the terminal block 58 are suitable as members that sandwich the cooling pipe 3.

  As described above, according to this example, it is possible to provide a power conversion device that has excellent vibration resistance, can suppress an increase in the size of a semiconductor module, and can improve the assembling property at the time of manufacture.

  In this example, the capacitor 57 and the terminal block 58 are used as the fixed member 5, but other components may be used as the fixed member 5. For example, the reactor 18 can be used as the fixed member 5. Further, the capacitor 57 can be divided into a filter capacitor and a smoothing capacitor, and each can be used as the fixed member 5.

  Moreover, in this example, although the deformation | transformation part 32 was integrally formed with the pipe wall 30 of the cooling pipe 3, it is good also as a different body. Moreover, although the deformation | transformation part 32 of this example is metal and plastically deforms, it is not restricted to this, For example, you may comprise by elastic materials, such as rubber | gum.

  In this example, only one case 4 is used, but the case 4 may be doubled. That is, the laminated body 10 may be accommodated and fixed in the first case, and the first case may be accommodated and fixed in the second case.

(Example 2)
In this example, the shapes of the fixed member 5 and the cooling pipe 3 are changed. As shown in FIG. 10, in this example, the width direction protrusion 50 (see FIG. 1) is not formed on the fixed member 5. Further, the deformable portion 32 of this example protrudes from the tube wall 30 of the cooling tube 3 in the Y direction. The pair of fixed members 5 are in contact with the deformable portion 32 from the Y direction. In this example, as in the first embodiment, the capacitor 57 is used as one fixed member 5a, and the terminal block 58 is used as the other fixed member 5b.

  When manufacturing the power converter 1 of this example, as shown in FIG. 9, the laminated body 10 is put into the case 4 and fixed, and then the pair of fixed members 5 a and 5 b are accommodated in the case 4. At this time, the fixed members 5 a and 5 b are arranged at a position closer to the side wall 41 than the cooling pipe 3. Thereafter, the fixed members 5 a and 5 b are moved in the Y direction, and the side surfaces 56 of the pair of fixed members 5 a and 5 b are brought into contact with the deformable portion 32. Thereby, the cooling pipe 3 is clamped in the Y direction by the pair of fixed members 5a and 5b while the deformation portion 32 is deformed. Thereafter, the fixed members 5a and 5b are fixed to the case 4 using bolts 19 (see FIG. 10).

  In this example, the shape of the fixed member 5 (the capacitor 57 and the terminal block 58) can be simplified. Therefore, the manufacturing cost of the power converter device 1 can be reduced.

  Others are the same as in the first embodiment. Moreover, among the symbols used in the drawings relating to this example, the same symbols as those used in the first embodiment represent the same components as those in the first embodiment unless otherwise indicated.

(Example 3)
In this example, the shape of the semiconductor module 2 is changed. As shown in FIG. 11, in this example, the protrusion 22 was formed in a rectangular cross section. That is, in this example, the shoulder portion 38 of the cooling pipe 3 is formed in a round shape as in the first embodiment, but the round surface 28 (see FIG. 6) is not formed in the projection 22 and the projection Only the tip 225 of the portion 22 is in contact with the cooling pipe 38. The cooling pipe 3 is sandwiched and fixed in the Z direction by the tip 225 and the support plate 40 (see FIG. 1). Further, the main body portion 20 of the semiconductor module 2 is not formed with a recess 24 (see FIG. 6) into which the insulating plate 6 is fitted.

  If it does in this way, since the shape of the semiconductor module 2 is simple, the manufacturing cost of the semiconductor module 2 can be reduced.

  Others are the same as in the first embodiment. Moreover, among the symbols used in the drawings relating to this example, the same symbols as those used in the first embodiment represent the same components as those in the first embodiment unless otherwise indicated.

Example 4
In this example, the shape of the semiconductor module 2 is changed. As shown in FIG. 12, in this example, an insulating plate 6 is interposed between the semiconductor module 2 and the cooling pipe 3 as in the first embodiment. In this example, the insulating plate 6 is fitted. The recess 24 (see FIG. 6) is not formed. Further, the shoulder portion 38 of the cooling pipe 3 is formed in a round shape, and the protrusion 22 is formed with a round surface 28 that is in close contact with the shoulder portion 38.

  Others are the same as in the first embodiment. Moreover, among the symbols used in the drawings relating to this example, the same symbols as those used in the first embodiment represent the same components as those in the first embodiment unless otherwise indicated.

(Example 5)
In this example, the shape of the semiconductor module 2 is changed. As shown in FIG. 13, in this example, the protrusion 22 was formed in a rectangular cross section. That is, as in the first embodiment, the shoulder portion 38 of the cooling pipe 3 is formed in a round shape, but the round surface 28 (see FIG. 6) is not formed on the projection 22, and the projection 22 Only the tip 225 is in contact with the cooling pipe 38. This tip 225 is used to regulate the displacement of the cooling pipe 3 in the Z direction. Further, a recess 24 into which the insulating plate 6 is fitted is formed in the main body 20 of the semiconductor module 2.

  Others are the same as in the first embodiment. Moreover, among the symbols used in the drawings relating to this example, the same symbols as those used in the first embodiment represent the same components as those in the first embodiment unless otherwise indicated.

DESCRIPTION OF SYMBOLS 1 Power converter 10 Laminated body 11 Pressure member 2 Semiconductor module 20 Main body part 21 Power terminal 22 Protrusion part 3 Cooling pipe 4 Case 40 Support plate 41 Side wall 5 Fixed member

Claims (7)

A laminate (10) in which a plurality of semiconductor modules (2) encapsulating a semiconductor element (25) and a plurality of cooling pipes (3) for cooling the semiconductor modules (2) are laminated;
A case that includes a support plate (40) and accommodates the laminate (10) while supporting the cooling pipe (3) from one side in the thickness direction of the support plate (40) by the support plate (40). (4) and
The laminated body (10) is provided at a position adjacent to the laminated body (10) in the laminating direction, and the laminated body (10) is pressed in the laminating direction, whereby the laminated body (10) is A pressure member (11) to be fixed in the case (4);
A pair of fixed members (5, 5a, 5a, 5a, 5a, 5b) provided on both sides of the laminated body (10) in the width direction orthogonal to both the laminating direction and the thickness direction and respectively secured to the case (4). 5b)
The semiconductor module (2) is fixed in the thickness direction to the case (4) by a bus bar (12) connecting the semiconductor module (2) and the fixed member (5).
The semiconductor module (2) includes a main body (20) encapsulating the semiconductor element (25) and a pair of protrusions (22) protruding from the main body (20) toward opposite sides in the stacking direction. The protrusion (22) engages with the cooling pipe (3), and the cooling pipe (3) is inserted in the thickness direction by the protrusion (22) and the support plate (40). Is sandwiched between
The power converter (1), wherein the cooling pipe (3) is sandwiched in the width direction by the pair of fixed members (5).   The pair of fixed members (5) each have a width direction protrusion (50) protruding toward the laminate (10) in the width direction, and the cooling pipe (50) is formed by the width direction protrusion (50). The power conversion device (1) according to claim 1, wherein 3) is sandwiched in the width direction.   The deformed portion (32) that is elastically deformed or plastically deformed is interposed between the tube wall (30) of the cooling tube (3) and the fixed member (5). The power converter device (1) according to claim 2.   The power converter (1) according to claim 3, wherein the deforming part (32) is formed integrally with a pipe wall (30) of the cooling pipe (3).   Of the cooling pipe (3), a shoulder (33), which is a portion with which the protrusion (22) engages, is formed in a rounded shape, and the shoulder (33) is formed on the protrusion (22). The power conversion device (1) according to any one of claims 1 to 4, wherein a rounded surface (28) that is in close contact with the substrate is formed.   An insulating plate (6) is interposed between the main body (20) and the cooling pipe (3), and the main body (20) has a recess (24) into which the insulating plate (6) is fitted. The power conversion device (1) according to any one of claims 1 to 5, wherein the power conversion device (1) is formed.   One of the fixed members (5a) of the pair of fixed members (5) is a capacitor (57) that smoothes a DC voltage applied to the semiconductor module (2), and the other fixed member ( The electric power according to any one of claims 1 to 6, wherein 5b) is a terminal block (58) for mounting the external connection terminal (120) of the bus bar (12). Conversion device (1).

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