JP2019154158A - Electric conversion device - Google Patents

Abstract

To provide an electric conversion device capable of increasing cooling efficiency of a bus bar.SOLUTION: An electric conversion device comprises a semiconductor module 2, a cooler 3, and a plurality of bus bars 4. Each of the bus bars 4 is connected to a power terminal 22 of the semiconductor module 2. At least one bus bar 4 of the plurality of bus bars 4 is a bent bus bar 4having a bus bar main body part 41 and a bent part 42. The bus bar main body part 41 is arranged at a position overlapped with the cooler 3 when viewing it from a projection direction of the power terminal 22. The bent part 42 extends in a Z direction from the bus bar main body part 41, and is configured so that the bent part 42 and the cooler 3 are overlapped when viewing it from a thickness direction of the bent part 42.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a power conversion device including a semiconductor module containing a semiconductor element, a cooler for cooling the semiconductor module, and a bus bar connected to the semiconductor module.

  2. Description of the Related Art Conventionally, there is known a power conversion device that includes a semiconductor module incorporating a semiconductor element, a cooler that cools the semiconductor module, and a bus bar connected to the semiconductor module (see Patent Document 1 below). This power conversion device is configured to switch the semiconductor element so as to boost a DC voltage input from a DC power supply or convert DC power to AC power.

  When the semiconductor element is switched, the semiconductor module generates heat. Therefore, in the power converter, the semiconductor module is cooled using the cooler. The semiconductor module includes a plurality of power terminals. The bus bar is connected to the power terminal. The DC power source and the like are electrically connected to the semiconductor module via the bus bar.

  The bus bar is arranged at a position adjacent to the cooler in the protruding direction of the power terminal (see FIG. 14). Since heat is generated when a current flows through the bus bar, the bus bar is arranged in a position adjacent to the cooler in this manner to cool the bus bar.

JP 2013-146118 A

  However, the power conversion device has room for improvement in the cooling efficiency of the bus bar. That is, in the power converter, a part of the bus bar does not face the cooler (see FIG. 14). Therefore, the area of the bus bar facing the cooler is small, and it is difficult to efficiently cool the bus bar.

  This invention is made | formed in view of this subject, and it aims at providing the power converter device which can raise the cooling efficiency of a bus bar more.

One aspect of the present invention is a semiconductor module (2) comprising a module body (20) containing a semiconductor element (21), and a power terminal (22) protruding from the module body.
A cooler (3) for cooling the semiconductor module;
A plurality of bus bars (4) connected to the power terminals,
At least one bus bar among the plurality of bus bars is disposed at a position overlapping with the cooler when viewed from the projecting direction (Z) of the power terminal, and the thickness direction of the bus bar coincides with the projecting direction ( and 41), a bent portion extending into the condenser side in the protruding direction from the bus bar main body portion (42) bent busbar and a (4 _B),
When it sees from the thickness direction of the said bending part, it exists in the power converter device (1) comprised so that the said bending part and the said cooler may overlap.

In the power converter, at least one of the plurality of bus bars connected to the semiconductor module is the bent bus bar. This bent bus bar includes a bus bar main body portion disposed at a position overlapping the cooler when viewed from the protruding direction, and the bent portion. When viewed from the thickness direction of the bent portion, the bent portion and the cooler overlap each other.
Therefore, the bus bar main body portion of the bent bus bar can be disposed to face the cooler, and the bent portion can be placed to face the cooler. Therefore, both the bus bar main body part and the bent part can be cooled by the cooler, and the cooling efficiency of the bent bus bar can be increased.

As mentioned above, according to the said aspect, the power converter device which can improve the cooling efficiency of a bus bar can be provided.
In addition, the code | symbol in the parenthesis described in the means to solve a claim and a subject shows the correspondence with the specific means as described in embodiment mentioned later, and limits the technical scope of this invention. It is not a thing.

It is sectional drawing of the power converter device in Embodiment 1, Comprising: It is II sectional drawing of FIG. The figure which removed the bus bar etc. from FIG. III-III sectional drawing of FIG. IV-IV sectional drawing of FIG. VV sectional drawing of FIG. FIG. 3 is a perspective view of connection terminals and terminal blocks in the first embodiment. The circuit diagram of the power converter device in Embodiment 1. FIG. The fragmentary sectional view of the power converter device in Embodiment 2. FIG. The perspective view of the negative electrode bus bar in Embodiment 2. FIG. XX sectional drawing of FIG. The fragmentary sectional view of the power converter device in Embodiment 3. FIG. The fragmentary sectional view of the power converter device in Embodiment 4. FIG. FIG. 10 is a perspective view of a connection terminal and a terminal block in Embodiment 5. Sectional drawing of the power converter device in a comparison form.

(Embodiment 1)
An embodiment according to the power conversion device will be described with reference to FIGS. Power converter 1 of this embodiment, as shown in FIGS. 1 to 3 comprises a semiconductor module 2, and the cooler 3, a plurality of bus bars 4 and _{(4 P, 4 N, 4} L). The semiconductor module 2 includes a module main body 20 in which a semiconductor element 21 (see FIG. 7) is built, and a power terminal 22 protruding from the module main body 20. The cooler 3 is provided to cool the semiconductor module 2. The bus bar 4 is connected to the power terminal 22.

As shown in FIGS. 1, 4, and 5, one bus bar 4 among the plurality of bus bars 4 is a bent bus bar 4 _B having a bus bar main body portion 41 and a bent portion 42. The bus bar main body 41 is arranged at a position overlapping the cooler 3 when viewed from the protruding direction (Z direction) of the power terminal. The bus bar main body 41 is arranged so that its thickness direction coincides with the Z direction. The bent portion 42 extends from the bus bar main body portion 41 to the cooler 3 side in the Z direction.

  As shown in FIGS. 4 and 5, the bent portion 42 and the cooler 3 overlap each other when viewed from the thickness direction (X direction) of the bent portion 42.

  The power conversion device 1 of this embodiment is a vehicle-mounted power conversion device to be mounted on a vehicle such as an electric vehicle or a hybrid vehicle. As shown in FIG. 7, the power conversion device 1 of this embodiment includes a plurality of semiconductor modules 2 and a smoothing capacitor 11. Each semiconductor module 2 is electrically connected to the reactor 7. The semiconductor module 2 and the plurality of reactors 7 constitute a booster circuit 17.

Each semiconductor module 2 includes a switching element 21 _S , a free wheel diode 21 _F connected in reverse parallel to the switching element 21 _S , and a rectifier diode 21 _D. The power conversion device 1 of this embodiment is configured to boost the DC voltage of the DC power supply 8 by turning on and off the switching element 21 _S.

The power conversion device 1 includes eight switching elements 21 _S. A switching element group 29 is constituted by the two switching elements 21 _S. Individual switching element group 29 (29 _A ~29 _D) are respectively connected to a separate reactor 7. In this embodiment, the plurality of switching element groups 29 (29 _{A to} 29 _D ) are turned on and off with their phases shifted from each other. Thereby, it is suppressed that a big electric current flows into each reactor 7, and the lifetime reduction of the reactor 7 is suppressed.

The power conversion apparatus 1 includes output terminals 46 _P and 46 _N that output boosted DC power. The output terminals 46 _P and 46 _N are connected to an inverter (not shown). Using this inverter, the boosted DC power is converted to AC power, and a three-phase AC motor (not shown) is driven. As a result, the vehicle is running.

As shown in FIG. 2, the power conversion device 1 of this embodiment includes two cases 5, an inner case 5 _I and an outer case 5 _E. The inner casing 5 the _I, the semiconductor module 2, cooler 3, a capacitor 11, etc. are accommodated. These cases 5 _I and 5 _E are made of metal.

As shown in FIG. 2, in this embodiment, the stacked body 10 is configured by stacking a plurality of semiconductor modules 2 and a plurality of cooling pipes 30. The cooler 3 is constituted by a plurality of cooling pipes 30. A pressure member 16 (leaf spring) is disposed at a position adjacent to the stacked body 10 in the stacking direction (X direction) of the stacked body 10. Using this pressure member 16, the laminate 10 is pressurized in the X direction. Accordingly, while securing a contact pressure between the semiconductor module 2 and the cooling pipe 30, secure the laminate 10 to the inner casing 5 the _I.

A connecting pipe 31 that connects these two cooling pipes 30 adjacent to each other in the X direction is disposed. The connecting pipe 31 is disposed at both ends of the cooling pipe 30 in the longitudinal direction (Y direction) of the cooling pipe 30. An end cooling pipe 30 _A arranged at one end in the X direction among the plurality of cooling pipes 30 includes an introduction pipe 13 for introducing the refrigerant 15 and a lead-out pipe 14 for leading the refrigerant 15. Connected. When the refrigerant 15 is introduced from the introduction pipe 13, the refrigerant 15 flows through all the cooling pipes 30 through the connection pipe 31 and is led out from the lead-out pipe 14. Thereby, each semiconductor module 2 is cooled.

As shown in FIGS. 2 and 3, the semiconductor module 2 includes a module main body 20 containing a semiconductor element 21 (see FIG. 7), a power terminal 22 protruding from the module main body 20, and a control terminal 23. . The control terminal 23 is connected to the control circuit board 18. The control circuit board 18 is used to control the on / off operation of the switching element 21 _S.

As shown in FIGS. 1 and 3, the power terminal 22 includes a reactor connection terminal 22 _L electrically connected to the reactor 7 (see FIG. 7) and a negative electrode terminal 22 _N electrically connected to the negative electrode of the DC power supply 8. And a positive electrode terminal 22 _P that outputs a boosted DC voltage. In addition, the power conversion device 1 includes, as the bus bar 4, a reactor connection bus bar 4 _L connected to the reactor connection terminal 22 _L , a negative electrode bus bar 4 _N connected to the negative electrode terminal 22 _N , and a positive electrode bus bar connected to the positive electrode terminal 22 _P. 4 _P is provided.

As shown in FIG. 1, the reactor connection bus bar 4 _L includes a reactor connection terminal 48 for connection to the reactor 7 (see FIG. 7). Further, the positive bus bar 4 _P and the negative electrode bus bar 4 _N, is superposed at a predetermined interval. The positive electrode bus bar 4 _P and the negative electrode bus bar 4 _N are connected to the terminals 111 (111 _P , 111 _N ) of the capacitor 11, respectively.

In this embodiment, the negative bus bar 4 _N is the bent bus bar 4 _B. That is, the bent portion 42 is formed in the negative electrode bus bar 4 _N. The bent portion 42 of this embodiment is a connection terminal 42 _C for connecting the bent bus bar 4 _B to an external device (ie, DC power supply 8).

As shown in FIGS. 1, 4, and 5, the bent bus bar 4 _B includes the bus bar main body portion 41 and the bent portion 42. The bus bar main body portion 41 includes a module connection portion 411 connected to the power terminal 22 (22 _N ) of the semiconductor module 2 and a terminal formation portion 412. The terminal forming portion 412 is formed separately from the module connecting portion 411 and is bolted to the module connecting portion 411. The bent portion 42 protrudes from the terminal forming portion 412 in the Z direction.

4, as shown in FIG. 5, the inner case 5 _I, the terminal block 6 is provided with an insulating material. The connection terminal 42 _C (that is, the bent portion 42) is fixed to the terminal block 6.

As shown in FIG. 6, the terminal block 6 includes a rectangular parallelepiped terminal block main body 61 and a protrusion 62 protruding from the terminal block main body 61 in the Y direction. A through hole 620 is formed in the protrusion 62. Bolts are inserted into the through holes 620 and screwed into the female screw portions 59 (see FIG. 4) of the case 5 (inner case 5 _I ). Thereby, the terminal block 6 is fixed to the case 5.

Further, as shown in FIG. 6, the terminal forming portion 412 has two through holes 44 _A and 44 _B, and the bent portion 42 has one through hole 44 _C. 44 _{A of} 1st through-holes are used in order to bolt the terminal formation part 412 to the module connection part 411 (refer FIG. 1). The second through hole 44 _B is used to fasten the terminal forming portion 412 to the terminal block 6. Further, the through hole 44 _C of the bent portion 42 is used for fastening the power bus bar 19 (see FIG. 5) to the bent portion 42. The bent bus bar 4 _B (that is, the negative bus bar 4 _N ) is electrically connected to the negative electrode of the DC power supply 8 through the power bus bar 19.

The effect of this form is demonstrated. As shown in FIGS. 4 and 5, in this embodiment, one bus bar 4 among the plurality of bus bars 4 (4 _L , 4 _P , 4 _N ) connected to the semiconductor module 2 is a bent bus bar 4 _B. The bent bus bar 4 _B includes a bus bar main body portion 41 disposed at a position overlapping the cooler 3 when viewed from the Z direction, and the bent portion 42. As shown in FIG. 4, the bent portion 42 and the cooler 3 overlap each other when viewed from the thickness direction (X direction) of the bent portion 42.
Therefore, the bus bar main body 41 of the bent bus bar 4 _B can be disposed opposite to the cooler 3, and the bent portion 42 can be disposed opposite to the cooler 3. Accordingly, both the bus bar main body portion 41 and the bent portion 42 can be cooled by the cooler 3, it is possible to increase the cooling efficiency of the bent busbar 4 _B.

That is, as shown in FIG. 14, the bus bar 4 is not bent in the conventional power converter. Therefore, the bus bar 4 can be opposed to the cooler 3 only from one direction (Z direction), and it is difficult to improve the cooling efficiency of the bus bar 4. On the other hand, as shown in FIGS. 4 and 5, if the bent portion 42 is formed by bending a part of the bus bar 4 as in this embodiment, the bus bar main body portion 41 is moved to the cooler 3 in the Z direction. The bent portion 42 can be opposed to the cooler 3 in the X direction. Therefore, the area of the bus bar 4 (folded bus bar 4 _B ) facing the cooler 3 can be increased, and the cooling efficiency can be increased.

As shown in FIGS. 4 and 5, the bent portion 42 of this embodiment is a connection terminal 42 _C for electrically connecting the bent bus bar 4 _B to an external device (DC power supply 8 in this embodiment).
In this way, it is possible to increase the cooling efficiency of the bent busbar 4 _B with bent portions 42, the bent portion 42, can be used as connection terminals for external connection.

As shown in FIGS. 4 and 5, the power conversion device 1 of this embodiment includes a metal case 5 (5 _I ) that houses the semiconductor module 2 and the cooler 3. The case 5 is provided with a terminal block 6 made of an insulating material. The connection terminal 42 _C (that is, the bent portion 42) is fixed to the terminal block 6.
If it does in this way, case 5 can be cooled with cooler 3, and terminal block 6 can be further cooled. Therefore, it cools the bent portion 42 attached to the terminal base 6 can be more effectively cooled bent busbar 4 _B.

Further, as shown in FIG. 1, the bus bar main body 41 of this embodiment includes the module connecting portion 411 and a terminal forming portion 412 formed separately from the module connecting portion 411. A connection terminal 42 _C (that is, a bent portion 42) is formed on the terminal forming portion 412.
In this case, since the terminal forming portion 412 is formed separately from the module connecting portion 411, the area of the module connecting portion 411 can be reduced. Therefore, the manufacturing yield of the module connection part 411 can be increased. Further, when the module connection portion 411 and the terminal formation portion 412 are separated, it is easy to finely adjust the position of the connection terminal 42 _C when the power conversion device 1 is manufactured.

Further, as shown in FIG. 7, in this embodiment, a booster circuit 17 is configured by the semiconductor module 2 and a plurality of reactors 7. The negative electrode bus bar 4 _N is the bent bus bar 4 _B.
When the booster circuit 17 is configured using a plurality of reactors 7, the current of the DC power supply 8 branches and flows to the reactor connection bus bar 4 _L , so that the current flowing through the individual reactor connection terminals 48 is relatively small. For this reason, the amount of heat generated by the reactor connection terminal 48 is relatively small. On the other hand, the connection terminal 42 _C of the negative bus bar 4 _N easily generates heat because the current I of the DC power supply 8 flows in common. As described above, the connection terminal 42 _C of the negative electrode bus bar 4 _N is particularly likely to generate heat, but in this embodiment, the connection terminal 42 _C is bent and overlapped with the cooler 3, so that the connection terminal 42 _C is effective. Cooling can be suppressed and temperature rise can be suppressed.

  As described above, according to this embodiment, it is possible to provide a power conversion device that can further improve the cooling efficiency of the bus bar.

In the present embodiment, as shown in FIG. 1, the two cases 5 of the inner case 5 _I and the outer case 5 _E are provided, but the present invention is not limited to this. That is, only one case 5 may be provided, and the terminal block 6 may be provided in this case 5. Further, in this embodiment, as shown in FIG. 7, only the booster circuit 17 is formed using a plurality of semiconductor modules 2, but the present invention is not limited to this, and both the booster circuit 17 and the inverter circuit are formed. You may do it.

In this embodiment, only one bus bar 4 (4 _N ) among the plurality of bus bars 4 (4 _P , 4 _N , 4 _L ) is a bent bus bar 4 _B , but the present invention is not limited to this. it may be more than one bus bar 4 to bend busbar 4 _B.

  In the following embodiments, the same reference numerals used in the drawings among the reference numerals used in the drawings represent the same constituent elements as those in the first embodiment unless otherwise indicated.

(Embodiment 2)
The present embodiment is an example in which the shape of the bent bus bar 4 _B is changed. As shown in FIGS. 8 and 9, the bent bus bar 4 _B of this embodiment includes two bent portions 42, a first bent portion 42 _A and a second bent portion 42 _B. As shown in FIG. 10, the first bent portion 42 _A is interposed between the pair of cooling pipes 30. In the present embodiment, the first bent portion 42 _A is pressed toward the cooling pipe 30 using the pressing force F of the pressing member 16.

As shown in FIGS. 9 and 10, in this embodiment, the first bent portion 42 _A is sealed with an insulating member 49. Thus, it has secured insulation between the cooling tube 30 and the first bent portion 42 _A. The insulating member 49 is made of synthetic resin.

Further, as shown in FIG. 8, the second bent portion 42 _B is disposed outside the inner case 5 _I. The second bent portion 42 _B is a connection terminal 42 _C for connecting to an external device. A terminal block 6 is mounted on the inner case 5 _I , and a connection terminal 42 _C (that is, the second bent portion 42 _B ) is fixed to the terminal block 6. The second bent portion 42 _B is configured to overlap the cooler 3 when viewed from the thickness direction (Y direction) of the second bent portion 42 _B.

In this embodiment, the negative electrode bus bar 4 _N is a bent bus bar 4 _B as in the first embodiment. The second bent portion 42 _B (that is, the connection terminal 42 _C ) is electrically connected to the negative electrode of the DC power supply 8. The semiconductor module 2 and a plurality of reactors 7 (see FIG. 7) constitute a booster circuit 17.

The effect of this form is demonstrated. In this embodiment, as shown in FIG. 10, the bent portion 42 (first bent portion 42 _A ) is pressed toward the cooling pipe 30 using the pressure member 16.
In this way, the bent portion 42 can be directly cooled by the cooling pipe 30. Therefore, the bent portion 42 can more efficiently cooled, it is possible to further improve the cooling efficiency of the bent busbar 4 _B.

In this embodiment, a bent portion 42 is interposed between the two cooling pipes 30.
In this way, the bent part 42 can be cooled by the cooling pipe 30 from both sides in the X direction. Therefore, the cooling efficiency of the bent bus bar 4 _B can be particularly enhanced.

In this embodiment, as shown in FIG. 8, the negative bus bar 4 _N is a bent bus bar 4 _B. The connection terminal 42 _C of the negative electrode bus bar 4 _N is used as a second bent portion 42 _B. Further, a booster circuit 17 (see FIG. 7) is configured using the semiconductor module 2 and a plurality of reactors 7.
In this case, since the current I of the DC power supply 8 (see FIG. 7) flows in common to the connection terminal 42 _C (second bent portion 42 _B ) of the negative electrode bus bar 4 _N , the connection terminal 42 _C particularly generates heat. Although it is easy, in this embodiment, the connection terminal 42 _C is bent so that the connection terminal 42 _C overlaps the cooler 3 when viewed from the Y direction. Therefore, the connection terminal 42 _C can be effectively cooled. Also, the first bent part 42 _A directly by the cooling tube 30, to be cooled, it is possible to particularly increase the cooling effect of the bent busbar 4 _B. Therefore, the connection terminal 42 _C that easily generates heat can be efficiently cooled.
In addition, the same configuration and operational effects as those of the first embodiment are provided.

(Embodiment 3)
In this embodiment, the configuration of the insulating member 49 is changed. As shown in FIG. 11, in this embodiment, a plate-like insulating member 49 is interposed between the first bent portion 42 _A and the cooling pipe 30. The insulating member 49 is made of ceramics.
In addition, the configuration and operational effects similar to those of the second embodiment are provided.

(Embodiment 4)
This embodiment is an example of changing the cooling structure of the first bent portion 42 _A. As shown in FIG. 12, in this embodiment, the cooling pipe 30 is not interposed between the first bent portion 42 _A and the pressurizing member 16. In this embodiment, the pressure member 16 is in contact with the first bent portion 42 _A. The first bent portion 42 _A is cooled by the cooling pipe 30 only from one side in the X direction.
In addition, the configuration and operational effects similar to those of the second embodiment are provided.

(Embodiment 5)
This embodiment is an example in which the structure of the bent portion 42 is changed. As shown in FIG. 13, the bent portion 42 of the present embodiment includes a first portion 421 extending in the Z direction from the terminal forming portion 412, a shoulder portion 422 protruding in the X direction from the first portion 421, and the shoulder And a third portion 423 extending from the portion 422 in the Z direction. A through hole 44 _C is formed in the third portion 423. Power bus bar 19 (see FIG. 5) to the third portion 423 overlapping, by inserting a bolt into the through hole 44 _C are configured to be screwed into the nut in the terminal block 6. Accordingly, the power bus bar 19 is configured to be fastened to the third portion 423 and the terminal block 6.

In the present embodiment, the second through hole 44 _B is formed in the shoulder 422. Bolts are inserted into the through holes 44 _B and screwed into the nuts in the terminal block 6. Thereby, the bent part 42 is fixed to the terminal block 6. In this embodiment, since the second through-hole 44 _B is formed in the shoulder 422, the bent portion 42 can be fixed at a position close to the through-hole 44 _C for fastening the power bus bar 19. Therefore, the power bus bar 19 (see FIG. 5) is swung by vibration from the outside, even when a force in the region around the through-hole 44 _C of the bent portion 42 is applied, firmly fixing the bent portion 42 be able to.
In addition, the same configuration and operational effects as those of the first embodiment are provided.

  The present invention is not limited to the above embodiments, and can be applied to various embodiments without departing from the scope of the invention.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Semiconductor module 20 Module main-body part 21 Semiconductor element 22 Power terminal 3 Cooler 4 Bus bar 4 _B bending bus bar 41 Bus bar main body 42 Bending part

Claims (7)

A semiconductor module (2) comprising a module body (20) containing a semiconductor element (21) and a power terminal (22) protruding from the module body;
A cooler (3) for cooling the semiconductor module;
A plurality of bus bars (4) connected to the power terminals,
At least one bus bar among the plurality of bus bars is disposed at a position overlapping with the cooler when viewed from the projecting direction (Z) of the power terminal, and the thickness direction of the bus bar coincides with the projecting direction ( and 41), a bent portion extending into the condenser side in the protruding direction from the bus bar main body portion (42) bent busbar and a (4 _B),
The power converter device (1) comprised so that the said bending part and the said cooler may overlap when it sees from the thickness direction of the said bending part. The bent portion is a connection terminal for electrically connecting the bent busbar to the external device (42 _C), the power converter according to claim 1.   A metal case (5) for housing the semiconductor module and the cooler is further provided, and a terminal block (6) made of an insulating material is provided in the case, and the connection terminal is fixed to the terminal block. The power conversion device according to claim 2, wherein   The bus bar body includes a module connection part (411) connected to the power terminal of the semiconductor module, and a terminal formation part (412) formed separately from the module connection part. The power converter according to claim 2, wherein the connection terminal is formed in a part.   The cooler includes a plurality of cooling pipes (30), and a plurality of the semiconductor modules and the plurality of cooling pipes are stacked to form a stacked body (10), and a pressure member (16) is used. The power converter according to claim 1, wherein the bent portion is pressed toward the cooling pipe.   The power converter according to claim 5, wherein the bent portion is interposed between the two cooling pipes. The semiconductor module and a plurality of reactors (7) constitute a booster circuit (17). The power terminals include a reactor connection terminal (22 _L ) electrically connected to the reactor, and a DC power supply (8). A negative electrode terminal (22 _N ) electrically connected to the negative electrode of the first and a positive electrode terminal (22 _P ) for outputting a boosted DC voltage, and the bus bar includes a reactor connection bus bar (4 _L ), a negative bus bar (4 _N ) connected to the negative terminal, and a positive bus bar (4 _P ) connected to the positive terminal, and each of the reactors is connected to the reactor via the reactor connection bus bar. 5. The power conversion device according to claim 2, wherein the power conversion device is electrically connected to a terminal, and the negative bus bar is used as the bent bus bar.

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