JP2013115907A - Electric power conversion apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric power conversion apparatus which achieves excellent cooling efficiency of a capacitor module.SOLUTION: An electric power conversion apparatus 1 has: a laminated body 4 formed by laminating semiconductor modules 2, each of which incorporates a switching element therein, and multiple cooling pipes 3 cooling each semiconductor module 2 from both major surfaces; and a capacitor module 5 incorporating a capacitor element 51 therein. The capacitor module 5 includes multiple capacitor bus bars 52 connecting with an electrode of the capacitor element 51 and has a heat radiation protruding part 53 protruding from the capacitor bus bars 52. The heat radiation protruding part 53 is held between the cooling pipes 3 located adjacent to each other in the laminated body 4.

Description

  The present invention relates to a power conversion device including a laminated body formed by laminating a semiconductor module having a built-in switching element, a plurality of cooling pipes for cooling the semiconductor module from both main surfaces, and a capacitor module having a built-in capacitor element. .

  For example, Patent Document 1 includes a laminate formed by laminating a semiconductor module incorporating a switching element and a plurality of cooling pipes for cooling the semiconductor module from both main surfaces, and a capacitor module incorporating a capacitor element. A power conversion device is disclosed. In such a power conversion device, the semiconductor module is cooled by the cooling medium flowing through the cooling pipe to prevent the temperature of the semiconductor module from rising. However, no cooling means for cooling the capacitor module is provided. Therefore, when the heat generation of the capacitor module is large, the temperature may increase.

  In view of this, a power conversion device has been proposed in which a condenser module is placed in contact with a cooling plate having a refrigerant flow path (Patent Document 2). In this power conversion apparatus, a cooling medium flowing through a cooler that cools the semiconductor module is also introduced into the cooling plate to cool the capacitor module.

  As means for cooling the capacitor module provided in the power converter, Patent Documents 3 and 4 disclose a configuration in which a part of the terminals of the capacitor module is in thermal contact with the cooler.

JP 2007-174760 A JP 2005-19454 A JP 2010-252460 A JP 2005-252461 A

  However, since the power converter disclosed in Patent Document 2 has a configuration in which the side surface of the capacitor module is in contact with the cooling plate, it is difficult to increase the cooling efficiency of the capacitor module. That is, the capacitor module is formed by molding a capacitor element with resin. Therefore, in the configuration in which the capacitor module is in contact with the cooling plate on the side surface, a mold resin having inferior thermal conductivity is interposed between the capacitor element and the cooling plate. As a result, it becomes difficult to efficiently cool the capacitor element.

  Moreover, although the power converter device of patent document 3, 4 is making the terminal of a capacitor | condenser module contact the cooler thermally, the contact is performed only on the single side | surface. Therefore, it is difficult to increase the cooling efficiency of the capacitor module, and when the capacitor module generates a large amount of heat, it may be difficult to prevent the temperature rise.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a power conversion device excellent in cooling efficiency of a capacitor module.

One aspect of the present invention is an electric power including a stacked body in which a semiconductor module having a built-in switching element, a plurality of cooling pipes for cooling the semiconductor module from both main surfaces, and a capacitor module having a built-in capacitor element. A conversion device,
The capacitor module includes a plurality of capacitor bus bars connected to the electrodes of the capacitor elements, and protrudes a heat radiating protrusion from the capacitor bus bar.
The heat dissipation protrusion is sandwiched between the cooling pipes adjacent to each other in the laminated body (claim 1).

  In the power converter, the heat radiating protrusions protruding from the capacitor bus bar are sandwiched between the cooling pipes adjacent to each other in the laminate. Thereby, the heat | fever of a capacitor | condenser module can be thermally radiated to a cooling pipe via the said protrusion for heat radiation. Further, since the heat radiating protrusion protrudes from the capacitor bus bar connected to the electrode of the capacitor element, the heat of the capacitor element is transmitted to the heat radiating protrusion via the capacitor bus bar. Therefore, the capacitor module can be cooled from the inside by cooling the heat radiating protrusion with the cooling pipe, and the capacitor element can be efficiently cooled.

  Further, in particular, since the heat radiating protrusion is sandwiched between adjacent cooling pipes, the heat radiating protrusion can be cooled from both sides opposite to each other. Thereby, the protrusion part for heat radiation can be cooled efficiently, and the cooling efficiency of a capacitor module can be improved. Further, since the plurality of cooling pipes are originally stacked and arranged to cool the semiconductor modules in the stacked body, the cooling pipes may be disposed again only for holding the heat radiating protrusions, or the structure of the cooling pipes. There is no need to make a big change.

  As described above, according to the present invention, it is possible to provide a power conversion device that is excellent in cooling efficiency of a capacitor module.

FIG. 3 is a cross-sectional explanatory view of the power conversion device according to the first embodiment, and is an explanatory view corresponding to a cross section taken along line AA in FIG. Plane explanatory drawing of the power converter device seen in the height direction in Example 1. FIG. FIG. 3 is a perspective explanatory view of the capacitor module according to the first embodiment. The circuit diagram of the power converter device in Example 1. FIG. Explanatory drawing which shows the mode of the vibration of the laminated body which is not being fixed with respect to the capacitor module. FIG. 3 is an explanatory diagram showing a state of vibration of the laminated body fixed to the capacitor module in the first embodiment. Plane | planar explanatory drawing of the power converter device seen in the height direction in Example 2. FIG. FIG. 10 is a perspective explanatory view of a capacitor module in the third embodiment. FIG. 10 is a cross-sectional explanatory diagram of a part of the power conversion device according to the fourth embodiment. FIG. 10 is a perspective explanatory view of a capacitor module in Example 5. Sectional explanatory drawing of the power converter device in the state before assembling a laminated body and a capacitor module in Example 6. FIG. Explanatory drawing of the protrusion part for thermal radiation provided with the engaging part in one place of the height direction in Example 7. FIG. Explanatory drawing of the protrusion part for thermal radiation which provided the engaging part in two places of the height direction in Example 7. FIG. Explanatory drawing of the protrusion part for heat radiation which provided the engaging part in two places of the height direction in Example 7 by providing a recessed part. The circuit diagram of the power converter device in Example 8. FIG.

  The heat radiating protrusion may be formed integrally with the capacitor bus bar, or may be a separate member connected to the capacitor bus bar.

Further, the heat radiating protrusion is formed so as to be out of a current path between the capacitor element and the semiconductor module. In this case, an eddy current can be prevented from flowing through the cooling pipe. That is, in the case where the cooling pipe is made of metal, if the heat radiating protrusion is a part of the current path, an eddy current is generated in the cooling pipe arranged around the heat radiating protrusion. Thereby, there exists a possibility that the power loss of a power converter device may become large. Therefore, the loss of the power conversion device can be prevented from being increased by forming the heat radiating protrusion in a state of being out of the current path.
In addition, it is conceivable that the cooling pipe generates heat due to eddy currents. However, by forming the heat-dissipating protrusion in a state of being out of the current path, heat generation of the cooling pipe is prevented, and the cooling efficiency of the capacitor module is further improved. be able to.

  Moreover, it is preferable that the said heat dissipation protrusion part protrudes from the said capacitor | condenser bus bar nearer to the said laminated body among the said several capacitor | condenser bus bars. In this case, since the heat transfer distance between the condenser module and the cooling pipe via the heat radiating protrusion can be shortened, the cooling efficiency of the condenser module can be further improved.

  Moreover, it is preferable that each of the heat dissipation protrusions protrudes from the plurality of capacitor bus bars. In this case, since the capacitor element can be cooled from both electrode sides, the cooling efficiency of the capacitor module can be further improved.

  The heat dissipation protrusion is sandwiched between the adjacent cooling pipes together with the semiconductor module, and is disposed at a position on the upstream side of the cooling medium flowing in the cooling pipe from the semiconductor module. (Claim 5). In this case, the dimension in the stacking direction of the stacked body can be reduced, and the number of cooling pipes can be decreased. Thereby, it is possible to easily reduce the size of the power conversion device and reduce the manufacturing cost. In addition, since the heat radiating protrusion is disposed on the upstream side of the cooling medium from the semiconductor module, the heat radiating protrusion can be efficiently cooled by the cooling medium. That is, since the heat radiation protrusion can be cooled by the cooling medium before heat exchange with the semiconductor module, the cooling efficiency is high, and the capacitor module can be efficiently cooled.

  Further, the heat radiating protrusion is sandwiched between the adjacent cooling pipes in a pressurized state, and may function as a support member that fixes the multilayer body and the capacitor module to each other. Preferred (claim 6). In this case, vibration of the laminate can be suppressed. Thereby, the lifetime etc. of the connection part between a semiconductor module and a bus bar etc. connected to this can be improved, and the vibration resistance of a power converter device can be improved.

  The capacitor module is disposed in a direction perpendicular to the stacking direction with respect to the stacked body, and the heat-dissipating protrusion is arranged between the stacked body and the capacitor module with respect to the cooling pipe. It is preferable to provide an engaging portion that engages in the direction (claim 7). In this case, the vibration of the laminated body can be further suppressed, and the vibration resistance of the power converter can be further improved.

Example 1
Examples of the power conversion device will be described with reference to FIGS.
As shown in FIG. 1, the power conversion device 1 of this example includes a stacked body 4 in which a semiconductor module 2 incorporating a switching element and a plurality of cooling pipes 3 that cool the semiconductor module 2 from both main surfaces are stacked. And a capacitor module 5 incorporating a capacitor element 51.

The capacitor module 5 includes a plurality of capacitor bus bars 52 respectively connected to the electrodes of the capacitor element 51, and a heat radiating protrusion 53 protrudes from the capacitor bus bar 52.
The heat dissipation protrusion 53 is sandwiched between the cooling pipes 3 adjacent to each other in the multilayer body 4.

  The power conversion device 1 of this example is mounted on a vehicle such as an electric vehicle or a hybrid vehicle, converts DC power supplied from a DC power supply (battery) into AC power, and drives a three-phase AC rotating electrical machine. It is configured to be able to.

  As shown in FIGS. 1 and 2, the stacked body 4 is formed by stacking a plurality of semiconductor modules 2 together with a plurality of cooling pipes 3 made of a metal such as aluminum. Two semiconductor modules 2 are sandwiched between adjacent cooling pipes 3, and the cooling pipes 3 and the semiconductor modules 2 are alternately stacked except for a part. The semiconductor module 2 is not sandwiched between a pair of adjacent cooling pipes 3, and the heat radiating protrusion 53 is sandwiched.

  Note that the heat dissipation protrusion 53 is made of, for example, a metal such as copper, which is the same material as the capacitor bus bar 52. In this case, for example, an insulating film having excellent heat conductivity is interposed between the heat radiating protrusion 53 and the cooling pipe 3, and both are electrically insulated from each other.

  Specifically, for example, the laminated body 4 includes ten cooling pipes 3 arranged in parallel, and adjacent cooling pipes 3 are connected by connecting pipes 31 in the vicinity of both ends in the longitudinal direction. . In this case, the cooler 30 is constituted by the ten cooling pipes 3 and the connecting pipe 31 connecting them. Of the nine cooling gaps formed between the adjacent cooling pipes 3 in the ten cooling pipes 3, a pair of heat dissipation protrusions 53 are disposed in the middle (fifth stage) gap, The semiconductor module 2 is disposed in the gap.

  As shown in FIG. 2, the heat-dissipating protrusions 53 and the plurality of semiconductor modules 2 are arranged in two lines in a straight line in the stacking direction. That is, two semiconductor modules 2 are arranged in each of the eight stages of gaps between the cooling pipes 3, and two heat radiation protrusions 53 are arranged in the other one stage of gaps.

  Of these, the four semiconductor modules 2 arranged in the two-step gaps are the semiconductors on the upper arm side and the lower arm side of the boost converter unit 101 that constitutes a part of the power converter 1 (see FIG. 4) described later. Corresponds to module 2. Further, twelve semiconductor modules 2 arranged in six stages correspond to the semiconductor modules 2 on the upper arm side and the lower arm side of the inverter unit 102 constituting a part of the power conversion device 1 described later. In FIG. 4, there are two semiconductor modules 2 constituting the converter unit 101 and two semiconductor modules 2 constituting the inverter unit 102, but these semiconductor modules 2 shown in FIG. 4 are parallel to each other. A plurality of connected semiconductor modules 2 may be used. The configuration of the power conversion device 1 described in FIG. 1 and FIG. 2 shows an example in which each semiconductor module 2 shown in FIG.

Note that the number of stages of the cooling pipes 3 in the stacked body 4 is not particularly limited.
A refrigerant introduction pipe 321 for introducing a cooling medium into the cooler 30 and a refrigerant discharge pipe 322 for discharging the cooling medium from the cooler 30 are disposed at one end in the stacking direction of the stacked body 4. .

  A pressure member 12 that pressurizes the stacked body 4 in the stacking direction is disposed at the other end of the stacked body 4 in the stacking direction. The multilayer body 4 is disposed in a frame 11 having a rectangular shape as viewed from the direction in which the multilayer body 4 and the capacitor module 5 are arranged (hereinafter, referred to as “height direction” as appropriate). The pressure member 12 is disposed between the laminate 4 and the inner surface of the frame 11. Note that the “height direction” is a convenient expression, and this direction does not necessarily coincide with the vertical direction.

The pressurizing member 12 is made of a leaf spring and presses the other end of the laminated body 4 toward one end side (the side on which the refrigerant introduction pipe 321 and the refrigerant discharge pipe 322 are provided). Accordingly, the contact pressure between the cooling pipe 3 and the semiconductor module 2 is kept high, and the contact pressure between the cooling pipe 3 and the heat radiating protrusion 53 is increased.
The pressurizing member 12 may be disposed at one end of the laminated body 4 on the side where the refrigerant introduction pipe 321 and the refrigerant discharge pipe 322 are provided, and may be pressed toward the other end. In this case, the pressurizing member 12 is disposed between the refrigerant introduction pipe 321 and the refrigerant discharge pipe 322.

  As shown in FIG. 1, the capacitor module 5 is arranged in a direction (height direction) perpendicular to both the stacking direction and the longitudinal direction of the cooling pipe 3 with respect to the stacked body 4. As shown in FIGS. 1 and 3, the capacitor module 5 includes a plurality of capacitor elements 51, which are molded with resin. The plurality of capacitor elements 51 are arranged in parallel so that a pair of electrodes are arranged at both ends in the height direction. In this example, the side closer to the laminate 4 in the height direction is the positive electrode, and the far side is the negative electrode.

The capacitor element 51 is constituted by a film capacitor formed by winding a metallized film, for example, and is arranged so that its winding axis is in the height direction. The plurality of capacitor elements 51 are arranged in two rows in a straight line in the stacking direction.
In the power conversion device 1 of this example, a part of the plurality of capacitor elements 51 constitutes a smoothing capacitor 501 and the other part constitutes a filter capacitor 502.

  As shown in FIG. 4, the power conversion device 1 of this example includes a boost converter unit 101 and an inverter unit 102. That is, the power conversion device 1 boosts the voltage of the DC power supplied from the DC power supply 61 in the boost converter unit 101, converts the boosted DC power into three-phase AC power in the inverter unit 102, It is configured to drive a phase AC rotating electrical machine 62. Conversely, AC power generated by the rotating electrical machine 62 can be converted to DC power by the inverter unit 102, and stepped down by the boost converter 101 to charge the DC power supply 61.

  Boost converter unit 101 includes a reactor 63 and a plurality of semiconductor modules 2. The inverter unit 102 includes a plurality of semiconductor modules 2. A filter capacitor 502 for smoothing the voltage of the DC power supply 61 is provided between the DC power supply 61 and the boost converter unit 101, and the inverter unit 102 is connected between the boost converter unit 101 and the inverter unit 102. A smoothing capacitor 501 that smoothes the supplied boosted voltage is provided.

As shown in FIG. 3, the positive electrode of the capacitor element 51 constituting the smoothing capacitor 501 is connected to one capacitor bus bar 52 (hereinafter, referred to as “first positive capacitor bus bar 521” as appropriate), and the capacitor constituting the filter capacitor 502. The positive electrode of the element 51 is connected to another capacitor bus bar 52 (hereinafter referred to as “second positive capacitor bus bar 522” as appropriate).
In the capacitor module 5, the capacitor element 51 constituting the smoothing capacitor 501 and the negative electrode of the capacitor element 51 constituting the filter capacitor 502 are both one capacitor bus bar 52 (hereinafter referred to as “negative capacitor bus bar 523” as appropriate). It is connected to the.

  The three capacitor bus bars 52, that is, the first positive capacitor bus bar 521, the second positive capacitor bus bar 522, and the negative capacitor bus bar 523 are all electrode terminals from the resin mold portion of the capacitor module 5 toward the laminate 4 side. 524 is formed to protrude.

  The electrode terminals 524 of the first positive capacitor bus bar 521 and the negative capacitor bus bar 523 are appropriately connected to the power bus bar 13 connected to the main electrode terminal 21 of the plurality of semiconductor modules 2 or the positive electrodes of the DC power supply 61. As shown in FIG. 1, these power bus bars 13 are arranged between the laminate 4 and the capacitor module 5. Moreover, the electrode terminal 524 and the electric power bus bar 13 depicted in FIG. 1 indicate that they are connected to each other, and the arrangement and the like are not particularly accurately depicted. Further, in FIG. 1, the description of the frame 11 and the pressure member 12 is omitted.

  Among the plurality of capacitor bus bars 52, the negative capacitor bus bar 523 is farther from the stacked body 4 than the other two capacitor bus bars 52. The heat dissipation protrusions 53 protrude from the capacitor bus bar 52 close to the multilayer body 4, that is, from the first positive capacitor bus bar 521 and the second positive capacitor bus bar 522.

  The heat radiating protrusion 53 is formed in a state of being out of the current path between the capacitor element 51 and the semiconductor module 2. That is, the heat radiating protrusion 53 is connected to the capacitor bus bar 52 and is also electrically connected. In this connection state, the heat radiating protrusion 53 is located between the capacitor element 51 and the semiconductor module 2. It does not become part of the current path.

Further, the heat dissipation protrusion 53 is sandwiched between the adjacent cooling pipes 3 in a pressurized state. Thereby, it functions also as a support member which fixes the laminated body 4 and the capacitor | condenser module 5 mutually. That is, as shown in FIG. 2, the stacked body 4 is pressurized in the stacking direction by the pressurizing member 12, so that the heat dissipated between the pair of cooling pipes 3 at the center of the stacked body 4 in the stacking direction. The projecting portion 53 is pressed and clamped by the pair of cooling pipes 3. As a result, the heat radiating protrusion 53 is fixed to the laminate 4.
The heat dissipation protrusion 53 is also a member fixed to the main body of the capacitor module 5. Therefore, the capacitor module 5 and the multilayer body 4 are fixed to each other at the two heat dissipating protrusions 53.

Next, the function and effect of this example will be described.
In the power conversion device 1, the heat dissipation protrusion 53 protruding from the capacitor bus bar 52 is sandwiched between the cooling pipes 3 adjacent to each other in the multilayer body 4. Thereby, the heat of the capacitor module 5 can be radiated to the cooling pipe 3 via the heat radiating protrusion 53. Further, since the heat radiating protrusion 53 protrudes from the capacitor bus bar 52 connected to the electrode of the capacitor element 51, the heat of the capacitor element 51 is transmitted to the heat radiating protrusion 53 through the capacitor bus bar 52. Therefore, the capacitor module 5 can be cooled from the inside by cooling the heat radiating protrusion 53 with the cooling pipe 3, and the capacitor element 51 can be efficiently cooled.

  In particular, since the heat radiating protrusion 53 is sandwiched between adjacent cooling pipes 3, the heat radiating protrusion 53 can be cooled from both sides opposite to each other. Thereby, the heat dissipation protrusion 53 can be efficiently cooled, and the cooling efficiency of the capacitor module 5 can be improved. Further, since the plurality of cooling pipes 3 are originally stacked and arranged to cool the semiconductor module 2 in the stacked body 4, the cooling pipes 3 are newly arranged only for sandwiching the heat-dissipating protrusions 53. There is no need to greatly change the structure of 3.

In addition, since the heat radiating protrusion 53 is formed so as to be out of the current path between the capacitor element 51 and the semiconductor module 2, it is possible to prevent an eddy current from flowing through the cooling pipe 3. That is, when the heat dissipation protrusion 53 is a part of the current path, an eddy current is generated in the metal cooling pipe 3 disposed around the heat dissipation protrusion 53. Thereby, there exists a possibility that the power loss of the power converter device 1 may become large. Therefore, the loss of the power conversion device 1 can be prevented from being increased by forming the heat radiating protrusion 53 out of the current path.
In addition, it is conceivable that the cooling pipe 3 generates heat due to the eddy current. However, by forming the heat-dissipating protrusion 53 in a state of being out of the current path, heat generation of the cooling pipe 3 is prevented, and the cooling efficiency of the capacitor module 5 is further improved. Can be improved.

  Further, the heat radiating protrusion 53 protrudes from the capacitor bus bar 52 (the first positive capacitor bus bar 521 and the second positive capacitor bus bar 522) that is closer to the multilayer body 4 among the plurality of capacitor bus bars 52. As a result, the heat transfer distance between the condenser module 5 and the cooling pipe 3 via the heat radiating protrusion 53 can be shortened, so that the cooling efficiency of the condenser module 5 can be further improved.

  Further, the heat radiating protrusion 53 is sandwiched between the adjacent cooling pipes 3 in a pressurized state, and also functions as a support member that fixes the multilayer body 4 and the capacitor module 5 to each other. Thereby, the vibration of the laminated body 4 can be suppressed, the life of the connecting portion between the semiconductor module 2 and the power bus bar 13 connected to the semiconductor module 2 is improved, and the vibration resistance of the power conversion device 1 is improved. Can be made.

  That is, the laminated body 4 is fixed to the frame 11 at both ends in the laminating direction, but as shown in FIG. 5, if the heat radiating protrusion 53 is not pressure-clamped between the cooling pipes 3, Vibrations occur such that both ends become nodes and the center between them becomes a belly. If it does so, the vibration will become large easily, and there exists a possibility of causing a malfunction, such as stress being applied to a welding part, a soldering part, etc., for example.

On the other hand, as shown in FIG. 6, the heat radiating protrusion 53 also functions as a support member as described above, thereby fixing the multilayer body 4 to the capacitor module 5 even in the central portion in the stacking direction. Can do. Thereby, the rigidity of the laminated body 4 becomes high. And also when the laminated body 4 vibrates, the both ends and center part of the lamination direction in the laminated body 4 become a node of vibration, The amplitude becomes small. Therefore, it can prevent that the laminated body 4 vibrates largely, and can reduce the stress concerning a welding part or a soldering part.
In addition, the curve W in FIG. 5, FIG. 6 shows the stationary wave of the vibration of the laminated body 4. FIG.

  As described above, according to this example, it is possible to provide a power conversion device that is excellent in the cooling efficiency of the capacitor module.

(Example 2)
In this example, as shown in FIG. 7, the heat-dissipating protrusion 53 is sandwiched between the adjacent cooling pipes 3 together with the semiconductor module 2.
Further, the heat radiating protrusion 53 is disposed at a position on the upstream side of the cooling medium flowing through the cooling pipe 3 relative to the semiconductor module 2. That is, in the power conversion device 1 shown in FIG. 7, the cooling medium is introduced into the cooler 30 from the refrigerant introduction pipe 321. The cooling medium flows through the plurality of cooling pipes 3 through the connecting pipe 31 as appropriate, and is discharged from the refrigerant discharge pipe 322. Thus, the cooling medium flows through each cooling pipe 3 from one end to the other end in the longitudinal direction. Therefore, by disposing the heat radiating protrusion 53 closer to one end in the longitudinal direction of the cooling pipe 3 than the semiconductor module 2, the heat radiating protrusion 53 is disposed at a position upstream of the flow of the cooling medium with respect to the semiconductor module 2. The protrusion part 53 will be arrange | positioned.

Further, the heat radiating protrusion 53 is disposed between the connecting pipe 31 and the semiconductor module 2 arranged on the upstream side of the cooling pipe 3. In this example, the heat radiating protrusion 53 is also in contact with the connecting pipe 31.
Others are the same as in the first embodiment.

In the case of this example, the dimension of the laminated body 4 in the stacking direction can be reduced, and the number of cooling pipes can be reduced. Thereby, it is possible to easily reduce the size of the power conversion device 1 and to reduce the manufacturing cost. Moreover, since the heat dissipation protrusion 53 is disposed on the upstream side of the cooling medium from the semiconductor module 2, the heat dissipation protrusion 53 can be efficiently cooled by the cooling medium. That is, since the heat radiation protrusion 53 can be cooled by the cooling medium before heat exchange with the semiconductor module 2, the cooling efficiency is high, and the capacitor module 5 can be efficiently cooled.
In addition, the same effects as those of the first embodiment are obtained.

(Example 3)
In this example, as shown in FIG. 8, a heat dissipation protrusion 53 is provided so as to be branched from the electrode terminal 524 in the capacitor module 5.
That is, from the capacitor module 5, the electrode terminal 524 protrudes toward the multilayer body 4 as a terminal of the capacitor bus bar 52. And the heat dissipation protrusion 53 is continuously formed on the electrode terminals 524 extending from the first positive capacitor bus bar 521 and the second positive capacitor bus bar 522, respectively. The heat-dissipating protrusion 53 protrudes further in the height direction from the electrode terminal 524, extends to the stacked body 4, and is sandwiched between the cooling pipes 3 in the stacked body 4 (not shown).
Others are the same as in the first embodiment.
Also in the case of this example, the cooling efficiency of the capacitor module 5 can be improved as in the first embodiment.

Example 4
In this example, as shown in FIG. 9, the heat dissipation protrusion 53 is formed by extending the electrode terminal 524 in the capacitor module 5.
In other words, the power conversion device 1 of this example uses a part of the heat radiating protrusion 53 erected from the capacitor bus bar 52 as the electrode terminal 524. That is, the heat radiating protrusion 53 protrudes greatly from the capacitor module 5 toward the stacked body 4, and is partly sandwiched between the pair of cooling pipes 3. And between the laminated body 4 and the capacitor | condenser module 5, the electric power bus-bar 13 is electrically connected to the electrode terminal 524 which is a part of the protrusion part 53 for thermal radiation.
Others are the same as in the first embodiment.

In the case of this example, a part of the heat radiating protrusion 53 can be used as the electrode terminal 524, so that the structure can be simplified.
In addition, the same effects as those of the first embodiment are obtained.

(Example 5)
As shown in FIG. 10, the present example is an example in which a heat dissipation protrusion 53 is protruded from the negative capacitor bus bar 523 among the plurality of capacitor bus bars 52.
That is, in this example, the capacitor module 5 is arranged so that the negative electrode capacitor bus bar 523 is on the laminated body 4 side, and the heat dissipation protrusion 53 is protruded from the negative electrode capacitor bus bar 523 to the laminated body 4 side.

In addition, four radiating protrusions 53 are erected from the negative electrode capacitor bus bar 523. However, this number is not particularly limited, and may be 3 or less, or 5 or more.
Others are the same as in the first embodiment.

  Also in the case of this example, the cooling efficiency of the capacitor module 5 can be improved as in the first embodiment.

(Example 6)
In this example, as shown in FIG. 11, the heat-dissipating protrusion 53 is composed of a plurality of members.
That is, the heat-dissipating protrusion 53 includes a first protrusion 531 integrated with the capacitor bus bar 52 and a second protrusion 532 configured to be connected to the first protrusion 531. .
Others are the same as in the first embodiment.

In the case of this example, the power conversion device 1 can be easily manufactured.
That is, when the power conversion device 1 is assembled, the heat radiating protrusion 53 is sandwiched between a pair of adjacent cooling pipes 3 in the laminate 4. In this case, in this example, the heat radiating protrusion Only the second protrusion 532 of 53 may be sandwiched between the cooling pipes 3 in the stacked body 4. That is, similarly to the semiconductor module 2, the stacked body 4 can be assembled by sandwiching the second protrusion 532 between the cooling pipes 3.

  Thereafter, the second protrusion 532 that is a part of the multilayer body 4 may be connected to the first protrusion 531 that protrudes from the capacitor module 5. At this time, for example, by fastening the first projecting portion 531 and the second projecting portion 532 with a fastening member such as a screw, the two can be connected and function as the projecting portion 53 for heat dissipation.

Thus, according to this example, the work of assembling the laminated body 4 while holding the heat-dissipating protrusion 53 between the cooling pipes 3 can be performed separately from the capacitor module 5, so that the workability is improved. It can be greatly improved.
As a result, the productivity of the power conversion device 1 can be improved.
In addition, the same effects as those of the first embodiment are obtained.

(Example 7)
In this example, as shown in FIGS. 12 to 14, the heat radiating protrusion 53 is engaged with the cooling pipe 3 in the arrangement direction of the laminate 4 and the capacitor module 5, that is, in the height direction. This is an example in which 533 is provided.
12 is provided with an engaging portion 533 so as to engage with one end surface of the cooling pipe 3 in the height direction. Specifically, the engaging portion 533 of the heat radiating protrusion 53 is engaged with the end surface of the cooling pipe 3 opposite to the capacitor module 5.
13 is provided with a pair of engaging portions 533 so as to engage with both end surfaces of the cooling pipe 3 in the height direction.
14 is provided with a pair of engaging portions 533 so as to be engaged with both end surfaces of the cooling pipe 3 in the height direction by forming concave portions on both surfaces thereof.
Others are the same as in the first embodiment.

  In the case of this example, the vibration of the laminate 4 can be further suppressed, and the vibration resistance of the power conversion device 1 can be further improved. That is, it can be said that the power converter 1 in Example 1 has a structure in which the vibration in the height direction of the stacked body 4 is suppressed by the frictional force between the heat-dissipating protrusion 53 and the cooling pipe 3. Therefore, when a large force exceeding the frictional force acts between the multilayer body 4 and the capacitor module 5, it is conceivable that the heat radiating protrusion 53 is displaced with respect to the multilayer body 4.

On the other hand, in the case of this example, the heat dissipating engaging portion 53 is engaged with the stacked body 4 from the height direction by the engaging portion 533. Therefore, even if a large force acts between the multilayer body 4 and the capacitor module 5, it is possible to prevent the heat dissipation protrusion 53 from shifting with respect to the multilayer body 4.
In particular, a pair of engaging portions 533 are provided so as to engage with both end surfaces of the cooling pipe 3 in the height direction as in the heat dissipating protrusions 53 shown in FIG. However, it is possible to prevent the laminated body 4 from shifting to the protruding direction (front end side) or to the opposite side.

Furthermore, in the case of this example, since the engaging portion 533 can also be brought into contact with the cooling pipe 3, the heat radiation area of the heat radiation projection 53 can be increased, and an improvement in cooling efficiency can be expected.
In addition, the same effects as those of the first embodiment are obtained.

(Example 8)
This example is an example of the power conversion device 1 that does not have the boost converter unit 101 (see FIG. 4) as shown in FIG.
That is, the power conversion apparatus 1 of this example drives the three-phase AC rotating electrical machine 62 by converting the DC power supplied from the DC power supply 61 into three-phase AC power in the inverter unit 102 without boosting the DC power. It is configured as follows. In this case, the filter capacitor 502 shown in the first embodiment is also unnecessary. As a result, the capacitor module 5 in the power conversion device 1 of this example is configured by a plurality of capacitor elements 51 that configure the smoothing capacitor 501.
Others have the same configuration as that of the first embodiment, and the same operational effects can be obtained.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Semiconductor module 3 Cooling pipe 4 Laminated body 5 Capacitor module 51 Capacitor element 52 Capacitor bus bar 53 Radiation protrusion

Claims (7)

A power conversion device having a laminated body formed by laminating a semiconductor module incorporating a switching element and a plurality of cooling pipes for cooling the semiconductor module from both main surfaces, and a capacitor module incorporating a capacitor element,
The capacitor module includes a plurality of capacitor bus bars connected to the electrodes of the capacitor elements, and protrudes a heat radiating protrusion from the capacitor bus bar.
The heat dissipation projection is sandwiched between the cooling pipes adjacent to each other in the laminate.   2. The power conversion device according to claim 1, wherein the heat dissipation protrusion is formed in a state of being out of a current path between the capacitor element and the semiconductor module. 3.   3. The power conversion device according to claim 1, wherein the heat radiating protrusion protrudes from the capacitor bus bar closer to the laminated body among the plurality of capacitor bus bars. 4.   3. The power conversion device according to claim 1, wherein the heat radiating protrusions protrude from a plurality of the capacitor bus bars. 4.   5. The power conversion device according to claim 1, wherein the heat radiating protrusion is sandwiched with the semiconductor module between adjacent cooling pipes, and the cooling pipe rather than the semiconductor module. It is arrange | positioned in the position used as the upstream of the cooling medium which flows into this.   The power conversion device according to any one of claims 1 to 5, wherein the heat dissipation protrusion is sandwiched between the adjacent cooling pipes in a pressurized state, and the laminate and the capacitor. A power conversion device that also functions as a support member that fixes the modules to each other.   The power conversion device according to claim 6, wherein the capacitor module is disposed in a direction orthogonal to the stacking direction with respect to the stacked body, and the heat-dissipating protrusion is configured with respect to the cooling pipe. An electric power conversion device comprising an engaging portion that engages in the arrangement direction of the laminate and the capacitor module.

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