JP2015023619A - Power conversion device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power conversion device that suppresses a temperature rise of busbars with a high current density, costs less to manufacture and is compact.SOLUTION: The power conversion device includes a plurality of semiconductor modules 2 and a plurality of busbars 4, 5. The busbars 4, 5 are connected to power terminals 22, respectively. The semiconductor modules 2 constitute a transformer circuit 11 for transforming a voltage of a DC power supply 7, and an inverter circuit 12 for converting the transformed DC voltage to an AC voltage. The busbars 4, 5 include a transformation busbar 4 connected to a semiconductor module 2 constituting the transformer circuit 11, and an AC output busbar 5 connected to a semiconductor module 2 constituting the inverter circuit 12. The transformation busbar 4 and the AC output busbar 5 have different current densities from each other. The transformation busbar 4 and the AC output busbar 5 are configured to cross in a sealing member 6 when viewed from a projection direction of the power terminals 22.

Description

  The present invention relates to a power converter having a transformer bus bar connected to a transformer circuit and an AC output bus bar connected to an inverter circuit.

  For example, a power conversion device that performs power conversion between DC power and AC power is known that includes a plurality of semiconductor modules incorporating semiconductor elements and a plurality of bus bars connected to the semiconductor modules. (See Patent Document 1 below). In this power converter, the semiconductor module is used to form a transformer circuit that transforms the voltage of the DC power source and an inverter circuit that converts the transformed DC voltage into an AC voltage.

  The bus bar includes a transformer bus bar connected to the semiconductor module constituting the transformer circuit and an AC output bus bar connected to the semiconductor module constituting the inverter circuit. A current sensor is attached to each bus bar.

JP 2010-115061 A

  However, the power conversion device has a problem that the temperature of one of the two types of bus bars, that is, the transformer bus bar and the AC output bus bar, is particularly likely to rise. That is, since the amount of flowing current is different between the transformer circuit and the inverter circuit, the current density is different between the transformer bus bar connected to the transformer circuit and the AC output bus bar connected to the inverter circuit. For this reason, a bus bar having a high current density is likely to generate more resistance heat and to rise in temperature. When the temperature of the bus bar rises, heat is transferred to the current sensor that measures the current of the bus bar, the temperature of the current sensor rises and the life is shortened.

  In addition, the power converter is configured to increase the current cross-sectional area of the bus bar in order to suppress the temperature rise of the bus bar, which tends to increase the current density, and to suppress the current increase of the current sensor. It is necessary to increase the clearance with the sensor. For this reason, the power changing device is likely to be large and the manufacturing cost is likely to increase.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a power conversion device that can suppress an increase in the temperature of a bus bar having a high current density, and that can be reduced in manufacturing cost and reduced in size.

One aspect of the present invention is a plurality of semiconductor modules in which power terminals protrude from a body portion incorporating a semiconductor element;
A plurality of bus bars connected to the power terminal,
The plurality of semiconductor modules are stacked in a state where each of the power terminals faces in the same direction,
The semiconductor module constitutes a transformer circuit that transforms the voltage of the DC power supply and an inverter circuit that converts the transformed DC voltage into an AC voltage.
The plurality of bus bars are integrated by a sealing member that seals a part of each of the bus bars, and the bus bar includes a transformer bus bar connected to the semiconductor module constituting the transformer circuit, and the inverter circuit. There is an AC output bus bar connected to the semiconductor module to be configured, and the transformer bus bar and the AC output bus bar have different current densities,
When viewed from the protruding direction of the power terminal, the transformer bus bar and the AC output bus bar intersect each other in the sealing member.

In the power converter, a plurality of bus bars are sealed with a sealing member and integrated. And when it sees from the said protrusion direction, the said transforming bus bar and the alternating current output bus bar are comprised so that it may cross | intersect in a sealing member.
Therefore, the transformer bus bar and the AC output bus bar can be brought close to each other in the sealing member. Therefore, of these two types of bus bars, heat is transferred via a sealing member from a bus bar having a high current density and a temperature that tends to be relatively high to a bus bar having a low current density and a temperature that tends to be relatively low. It becomes easy. That is, a bus bar having a high current density can be cooled using a bus bar having a low current density. Therefore, the amount of heat transferred from the bus bar having a high current density to the current sensor can be reduced, and the temperature rise of the current sensor can be suppressed. Therefore, it is possible to suppress a problem that the lifetime of the current sensor is reduced.

  Moreover, since the said power converter device can cool a bus bar with a high current density, the clearance of this bus bar and a current sensor can be narrowed. Therefore, it is easy to reduce the size of the power conversion device. Further, the power conversion device does not need to forcibly increase the current cross-sectional area of the bus bar, which tends to increase the current density, and thus the bus bar can be reduced in size. Therefore, the power conversion device can be further downsized and the manufacturing cost can be reduced.

  As described above, according to the present invention, it is possible to provide a power conversion device that can suppress an increase in temperature of a bus bar having a high current density, and that can be reduced in manufacturing cost and reduced in size.

The top view of the power converter device in Example 1. FIG. FIG. 3 is a partially transparent perspective view of the bus bar module according to the first embodiment. FIG. 3 is an enlarged plan view of the bus bar module in the first embodiment. IV-IV sectional drawing of FIG. V-V cross section of Fig. 1 The principal part enlarged view of FIG. The circuit diagram of the power converter device in Example 1. FIG. The principal part enlarged plan view of the power converter device in Example 2. FIG.

It is preferable that at least one bus bar of the transformer bus bar and the AC output bus bar is opposed to the other bus bar at a portion where the transformer bus bar and the AC output bus bar intersect.
In this case, since the main surface of one bus bar faces the other bus bar, heat conduction is likely to occur between these two types of bus bars. Therefore, the temperature rise of the bus bar having a high current density can be effectively suppressed.
The “main surface” means the surface having the largest area among the surfaces of the corresponding part in the bus bar.

Example 1
The Example which concerns on the said power converter device is described using FIGS. As shown in FIG. 1, the power conversion device 1 of this example includes a plurality of semiconductor modules 2 and a plurality of bus bars 4 and 5. The semiconductor module 2 includes a main body portion 21 in which a semiconductor element 20 (see FIG. 7) is built, and a power terminal 22 protruding from the main body portion 21. The bus bars 4 and 5 are connected to the power terminal 22. In this example, the laminated body 10 is configured by alternately laminating a plurality of semiconductor modules 2 and a plurality of cooling pipes 3.

  As shown in FIG. 7, the semiconductor module 2 constitutes a transformer circuit 11 that transforms the voltage of the DC power source 7 and an inverter circuit 12 that converts the transformed DC voltage into an AC voltage.

As shown in FIGS. 2 and 6, the plurality of bus bars 4 and 5 are integrated by a sealing member 6 that seals a part of each. The bus bars 4 and 5 include a transformer bus bar 4 connected to the semiconductor module 2 b constituting the transformer circuit 11 and an AC output bus bar 5 connected to the semiconductor module 2 a constituting the inverter circuit 12. The transformer bus bar 4 and the AC output bus bar 5 have different current densities.
The transformer bus bar 4 and the AC output bus bar 5 are configured to intersect within the sealing member 6 when viewed from the protruding direction (Z direction) of the power terminal 22.

  The power conversion device 1 of this example is a vehicle-mounted power conversion device to be mounted on a vehicle such as a hybrid vehicle or an electric vehicle.

  As shown in FIG. 7, the transformer circuit 11 of this example is a booster circuit 11 a for boosting the DC voltage of the DC power supply 7. The DC voltage boosted by the booster circuit 11a is converted into an AC voltage using the inverter circuit 12, and the three-phase AC motor 71 is driven. Further, the power conversion device 1 of this example includes a regenerative circuit 13. When braking the running vehicle, the generator 77 is used to generate electric power, and the AC power obtained is converted into DC power by the regenerative circuit 13 to charge the DC power supply 7. The regenerative circuit 13 is also formed by the semiconductor module 2.

  As shown in FIG. 6, the regenerative bus bar 8 (8 a to 8 c) is connected to the semiconductor module 2 c constituting the regenerative circuit 13. In this example, these three regenerative bus bars 8 (8a to 8c), the above-described transformer bus bar 4, and the three AC output bus bars 5 (5a to 5c) are sealed by a sealing member 6, and a bus bar module 60 is configured.

  In this example, the current density of the transformer bus bar 4 is about ¼ of the current density of the AC output bus bar 5. Therefore, the transformer bus bar 4 does not generate much resistance heat, and the temperature does not easily rise. Since the AC output bus bar 5 has a high current density, resistance heat is generated and the temperature easily rises. Further, the current density of the regenerative bus bar 8 is about half that of the AC output bus bar 5. For this reason, the temperature of the regenerative bus bar 8 does not become too high.

  On the other hand, the power converter device 1 of this example includes a case 17 that houses the laminate 10 as shown in FIGS. 1, 4, and 5. The case 17 accommodates a smoothing capacitor 73, a boosting reactor 72, a filter capacitor 78, and a control circuit board 79.

  Each semiconductor module 2 includes three power terminals 22 and a control terminal 23. As shown in FIGS. 5 and 6, the power terminal 22 includes a positive terminal 22a and a negative terminal 22b to which a direct current voltage is applied, and an alternating current terminal 22c. The positive electrode terminal 22a and the negative electrode terminal 22b are electrically connected to the smoothing capacitor 73 via a DC bus bar (not shown). The bus bars 4, 5, and 8 are connected to the AC terminal 22c. The control terminal 23 is connected to the control circuit board 79. This control circuit board 79 controls the switching operation of the semiconductor module 2.

  Further, as shown in FIG. 1, a pressure member 18 (plate spring) is provided in the case 17. Using this pressing member 18, the laminate 10 is pressed in the stacking direction (X direction) and pressed against the case wall 170. Thereby, the laminated body 10 is fixed in the case 17 while ensuring a contact pressure between the semiconductor module 2 and the cooling pipe 3.

  Two cooling pipes 3 adjacent to each other in the X direction are connected by connecting pipes 19 at both ends in the width direction (Y direction) orthogonal to both the X direction and the Z direction. In addition, among the plurality of cooling pipes 3, the cooling pipe 3 positioned at one end in the X direction is connected with an introduction pipe 14 for introducing the refrigerant 16 and an outlet pipe 15 for leading out the refrigerant 16. is there. When the refrigerant 16 is introduced from the introduction pipe 14, the refrigerant 16 flows through all the cooling pipes 3 through the connecting pipe 19 and is led out from the outlet pipe 15. Thereby, the semiconductor module 2 is configured to be cooled.

  As shown in FIG. 6, among the plurality of semiconductor modules 2, the semiconductor module 2 a constituting the inverter circuit 12 is arranged at a position farthest from the introduction pipe 14 and the lead-out pipe 15 in the X direction. Further, the semiconductor module 2 b constituting the transformer circuit 11 is arranged closer to the introduction pipe 14 and the lead-out pipe 15 than the semiconductor module 2 a constituting the inverter circuit 12. The semiconductor module 2 c constituting the regenerative circuit 13 is arranged closer to the introduction pipe 14 and the lead-out pipe 15 than the semiconductor module 2 b constituting the transformer circuit 11.

  On the other hand, in this example, as shown in FIG. 1, conductive plates 51 are connected to the AC output bus bars 5a to 5c, respectively. Then, a connector (not shown) is inserted from the connector insertion hole 171 (see FIG. 5) of the case 17, and this connector is connected to the conductive plate 51. A current sensor 52 is attached to the conductive plate 51. A current flowing through the AC output bus bar 5 is detected using the current sensor 52.

  Similarly, a conductive plate 81 is connected to the regenerative bus bar 8. A connector (not shown) is connected to the conductive plate 81. A current sensor 82 is attached to the conductive plate 81. Using this current sensor 82, the current flowing through the regenerative bus bar 8 is detected.

  As shown in FIG. 2, the AC output bus bar 5 includes a module connection side portion 53 connected to the power terminal 22 of the semiconductor module 2, a conductive plate connection side portion 55 connected to the conductive plate 51, the module connection side portion 53, and And a connecting portion 54 that connects the conductive plate connection side portions 55. The connecting portion 54 is sealed by the sealing member 6.

  The main surface S4 of the module connection side portion 53 is orthogonal to the X direction. The connecting portion 54 is bent in the sealing member 6 so as to extend in an oblique direction. Further, the conductive plate connection side portion 55 protrudes from the connecting portion 54 in the Z direction, and the tip 550 protrudes in the Y direction. The conductive plate 51 described above is bolted to the tip 550.

  The regenerative bus bar 8 has the same structure. That is, the regenerative bus bar 8 of this example includes a module connection side portion 83 connected to the power terminal 22 of the semiconductor module 2, a conductive plate connection side portion 85 connected to the conductive plate 81, the module connection side portion 83 and the conductive plate. And a connecting portion 84 that connects the connection side portions 85. The connecting portion 84 is sealed by the sealing member 6.

  The transformer bus bar 4 includes a module connection side portion 40 connected to the power terminal 22 of the semiconductor module 2, a stacking direction extending portion 41 extending in the stacking direction (X direction) connected to the module connection side portion 40, and It has the width direction extension part 42 extended in the said width direction (Y direction) from the lamination direction extension part 41, and the reactor connection part 43 extended from this width direction extension part 42 to the alternating current output bus-bar 5 side in a X direction. The extending portion 41 in the stacking direction has a first portion 41a whose main surface S1 is orthogonal to the Z direction and a second portion 41b whose main surface S2 is orthogonal to the Y direction. When viewed from the Z direction, the first portion 41a of the transformer bus bar 4 and the connecting portion 54 of the AC output bus bar 5 are configured to intersect each other.

  The main surface S3 of the width direction extending portion 42 is orthogonal to the X direction. Further, as shown in FIG. 4, a terminal 720 of the reactor 72 is connected to the tip 430 of the reactor connection portion 43. A current sensor 44 is attached to the reactor connection portion 43.

The effect of this example will be described. As shown in FIG. 1, in this example, the transformer bus bar 4 and the AC output bus bar 5 are sealed by a sealing member 6 and integrated. Then, the transformer bus bar 4 and the AC output bus bar 5 are configured to intersect within the sealing member 6 when viewed from the Z direction.
Therefore, the transformer bus bar 4 and the AC output bus bar 5 can be brought close to each other in the sealing member 6. Therefore, heat is easily transferred via the sealing member 6 from the AC output bus bar 5 whose current density is high and the temperature tends to be high to the transformer bus bar 4 whose current density is low and the temperature is likely to be low. That is, the AC output bus bar 5 whose temperature tends to be relatively high can be cooled using the transformer bus bar 4 whose temperature tends to be relatively low. Therefore, the amount of heat transferred from the AC output bus bar 5 to the current sensor 52 can be reduced, and the temperature rise of the current sensor 52 can be suppressed. Therefore, it is possible to suppress a problem that the life of the current sensor 52 is reduced.

  Moreover, since the power converter device 1 of this example can cool the alternating current output bus bar 5 with a high current density, the clearance between the alternating current output bus bar 5 and the current sensor 52 can be narrowed. Therefore, it becomes easy to reduce the size of the power conversion device 1. Moreover, since the power converter device 1 of this example does not need to increase the energization cross-sectional area of the AC output bus bar 5 forcibly, the AC output bus bar 5 can be downsized. Therefore, the power converter 1 can be further downsized and the manufacturing cost can be reduced.

Further, in this example, as shown in FIG. 2, the main surface S <b> 1 of the transforming bus bar 4 faces the alternating current output bus bar 5 at a portion where the transforming bus bar 4 and the alternating current output bus bar 5 intersect.
Therefore, the transformer bus bar 4 can easily receive the heat generated from the AC output bus bar 5. Therefore, the temperature rise of the AC output bus bar 5 can be more effectively suppressed.

  In addition, with the above configuration, the length of the sealing member 6 in the Z direction at a portion where the transforming bus bar 4 and the AC output bus bar 5 intersect as compared with the case where the main surface S1 is orthogonal to the Y direction. Can be shortened. Therefore, the bus bar module 60 can be further downsized.

Further, as shown in FIG. 6, in this example, the introduction pipe 14 and the outlet pipe 15 are attached to the cooling pipe 3 a located at one end in the X direction among the plurality of cooling pipes 3. The cooling pipes 3 adjacent to each other in the X direction are connected so that the refrigerant 16 flows between them at both ends in the Y direction. And the semiconductor module 2b which comprises the transformer circuit 11 is distribute | arranged to the position close | similar to the introduction pipe | tube 14 and the derivation | leading-out pipe 15 in the X direction rather than the semiconductor module 2a which comprises the inverter circuit 12.
If it does in this way, it becomes easy to cool the alternating current output bus bar 5 which tends to become high temperature using the transformation bus bar 4. That is, when the introduction pipe 14 and the outlet pipe 15 are attached to the cooling pipe 3a as described above and the cooling pipes 3 adjacent to each other in the X direction are connected, when the refrigerant 16 is introduced from the introduction pipe 14, the refrigerant 16 is connected. It flows into the plurality of cooling pipes 3 through the portion and is led out from the outlet pipe 15. Therefore, the cooling pipe 3 closer to the introduction pipe 14 and the outlet pipe 15 has a lower pressure loss of the refrigerant 16, the refrigerant 16 flows faster, and the cooling efficiency becomes higher. Therefore, by arranging the semiconductor module 2b constituting the transformer circuit 11 at a position close to the introduction pipe and the lead-out pipe, the cooling efficiency of the semiconductor module 2b can be increased, and the transformer bus bar 4 connected to the semiconductor module 2b. Can also be cooled efficiently. Therefore, heat conduction is likely to occur from the AC output bus bar 5 where the temperature is likely to rise to the transformer bus bar 4, and the AC output bus bar 5 can be cooled more effectively.

As shown in FIG. 6, the transformer bus bar 4 of this example includes a stacking direction extending portion 41, a width direction extending portion 42, and a reactor connecting portion 43. The stacking direction extending portion 41 extends in the X direction and intersects the AC output bus bar 5 when viewed from the Z direction. The width direction extending part 42 extends from the stacking direction extending part 41 in the Y direction. Reactor connecting portion 43 extends from width extending portion 42 to the AC output bus bar 5 side in the X direction. A reactor 72 is connected to the tip of the reactor connection portion 43.
This makes it easier to suppress noise interference between the AC output bus bar 5 and the transformer bus bar 4. That is, the transformer bus bar 4 is formed with a portion (width extending portion 42) that is substantially parallel to the connecting portion 54 and easily inductively coupled to the connecting portion 54. Therefore, assuming that the width direction extending portion 42 is formed at a position close to the connecting portion 54, an AC magnetic field generated around the width direction extending portion 42 by the current flowing in the width direction extending portion 42 is received, A noise current is likely to be induced in the connecting portion 54. Further, when an alternating current flows through the connecting portion 54, an alternating magnetic field is generated around the connecting portion 54. Therefore, a noise current is easily induced also in the width direction extending portion 42 due to this influence. However, in this example, the width direction extension part 42 is kept away from the AC output bus bar 5 so that the reactor connection part 43 connected to the width direction extension part 42 can be extended to the AC output bus bar 5 side in the X direction. As a result, the width-direction extending portion 42 and the connecting portion 54 are less likely to be inductively coupled, and noise current is less likely to be generated in these.

  As described above, according to this example, it is possible to provide a power conversion device that can suppress the temperature rise of a bus bar having a high current density, and that can be reduced in manufacturing cost and reduced in size.

  In this example, the AC output bus bar 5 has a higher current density than the transformer bus bar 4, but this may be reversed. That is, the transformer bus bar 4 may be configured to have a higher current density than the AC output bus bar 5.

  In this example, as shown in FIG. 2, only the transforming bus bar 4 has its main surface S <b> 1 opposed to the ac output bus bar 5 at the portion where the ac output bus bar 5 and the transforming bus bar 4 intersect. However, the present invention is not limited to this. That is, the main surface of the AC output bus bar 5 may be opposed to the transformer bus bar 4. Further, the main surface of the transformer bus bar 4 may be opposed to the AC output bus bar 5, and the principal surface of the AC output bus bar 5 may be opposed to the transformer bus bar 4.

  In this example, as shown in FIG. 6, when viewed from the Z direction, the transforming bus bar 4 and the AC output bus bar 5 intersect, and the regenerative bus bar 8 and the transforming bus bar 4 do not intersect. Is not limited to this. That is, when viewed from the Z direction, both the regenerative bus bar 8 and the AC output bus bar 5 may intersect with the transforming bus bar 4. In this way, it is possible to cool both the AC output bus bar 5 and the regenerative bus bar 8 using the transformer bus bar 4.

(Example 2)
In this example, the positional relationship between the semiconductor module 2 that constitutes each of the circuits 11 to 13 and the introduction pipe 14 and the lead-out pipe 15 is changed. As shown in FIG. 8, in this example, the introduction pipe 14 and the lead-out pipe 15 are attached to the cooling pipe 3b located on the reactor connecting portion 43 side in the X direction. The semiconductor module 2 a constituting the inverter circuit 12 is arranged at a position closest to the introduction pipe 14 and the lead-out pipe 15. Further, the semiconductor module 2 b constituting the transformer circuit 11 is provided at a position farther from the introduction pipe 14 and the lead-out pipe 15 than the semiconductor module 2 a constituting the inverter circuit 12. Further, the semiconductor module 2 c constituting the regenerative circuit 13 is provided at a position farther from the introduction pipe 14 and the lead-out pipe 15 than the semiconductor module 2 b constituting the transformer circuit 11. In this example, as in the first embodiment, the AC output bus bar 5 has a higher current density than the transformer bus bar 4.

  With the above configuration, the cooling efficiency of the semiconductor module 2a constituting the inverter circuit 12 can be increased. That is, the cooling pipe 3 close to the introduction pipe 14 and the outlet pipe 15 has high cooling efficiency because the pressure loss of the refrigerant 16 is small and the speed of the refrigerant 16 is high. Therefore, the cooling efficiency of the semiconductor module 2a can be increased by providing the semiconductor module 2a for the inverter circuit 12 at a position close to the introduction pipe 14 and the lead-out pipe 15. Therefore, it becomes easy to cool the AC output bus bar 5 connected to the semiconductor module 2a.

  Others are the same as in the first embodiment. Moreover, among the symbols used in the drawings relating to this example, the same symbols as those used in the first embodiment represent the same components as those in the first embodiment unless otherwise indicated.

DESCRIPTION OF SYMBOLS 1 Power converter 11 Transformer circuit 12 Inverter circuit 2 Semiconductor module 20 Semiconductor element 21 Main-body part 22 Power terminal 3 Cooling pipe 4 Transformer bus bar 5 AC output bus bar 6 Sealing member

Claims (4)

A plurality of semiconductor modules (2) having power terminals (22) protruding from a main body (21) containing a semiconductor element (20);
A plurality of bus bars (4, 5) connected to the power terminal (22);
The plurality of semiconductor modules (2) are stacked with the power terminals (22) facing in the same direction,
The semiconductor module (2) constitutes a transformer circuit (11) that transforms the voltage of the DC power supply (7) and an inverter circuit (12) that converts the transformed DC voltage into an AC voltage,
The plurality of bus bars (4, 5) are integrated by a sealing member (6) that seals a part of each of the bus bars (4, 5), and the transformer circuit (11) is connected to the bus bars (4, 5). There is a transformer bus bar (4) connected to the semiconductor module (2) to be configured, and an AC output bus bar (5) connected to the semiconductor module (2) to constitute the inverter circuit (12). 4) and the AC output bus bar (5) have different current densities,
When viewed from the protruding direction of the power terminal (22), the transformer bus bar (4) and the AC output bus bar (5) intersect in the sealing member (6). Power conversion device.   At a portion where the transformer bus bar (4) and the AC output bus bar (5) intersect, at least one of the transformer bus bar (4) and the AC output bus bar (5) has a main surface on the other side. The power converter (1) according to claim 1, wherein the power converter (1) faces the bus bar.   The plurality of semiconductor modules (2) and a plurality of cooling pipes (3) for cooling the semiconductor module (2) are stacked, and the semiconductor modules (2) of the plurality of cooling pipes (3) are stacked. The cooling pipe (3a) located at one end in the stacking direction is attached with an introduction pipe (14) for introducing the refrigerant (16) and a lead-out pipe (15) for leading out the refrigerant (16). The cooling pipes (3) adjacent to each other in the stacking direction are connected so that the refrigerant (16) flows between them, and the transformer bus bar (4) is more than the AC output bus bar (5). The semiconductor module (2) constituting the transformer circuit (11) has a lower current density and the introduction pipe (14) in the stacking direction than the semiconductor module (2) constituting the inverter circuit (12). And power converter according to claim 1 or claim 2, characterized in that arranged at a position closer to the outlet pipe (15) (1).   The transformer bus bar (4) extends in the stacking direction of the plurality of semiconductor modules (2), and extends in the stacking direction (41) intersecting with the AC output bus bar (5) when viewed from the projecting direction. From the width direction extending portion (41), the width direction extending portion (42) extending in the width direction perpendicular to both the stacking direction and the protruding direction is connected to the stack direction extending portion (41), and the width direction extending portion (42). The reactor connection part (43) which extends to the said alternating current output bus-bar (5) side in the said lamination direction and to which the reactor (72) connects is provided in any one of Claims 1-3 characterized by the above-mentioned. The power converter (1) described.

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