JP2011114968A - Power conversion apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact power conversion apparatus ensuring superior heat dissipation by suppressing deformation of an electronic circuit board. <P>SOLUTION: The power conversion apparatus 1 includes a first electronic circuit board 21 and a second electronic circuit board 22 laminated in the thickness direction while being spaced apart from each other, a plurality of semiconductor modules 3 disposed on the surface opposite to the second electronic circuit board 22 in the first electronic circuit board 21 and equipped with signal terminals 31 connected to the first electronic circuit board 21, fixing members 4 fixing the first electronic circuit board 21 and the second electronic circuit board 22 to each other, and spacers 5 each of which is installed between the first electronic circuit board 21 and the second electronic circuit board 22 with space between both. The spacers 5 are arranged and installed at arrangement regions of the plurality of semiconductor modules 3 when viewed from a laminated direction of the first electronic circuit board 21 and the second electronic circuit board 22. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a power conversion device such as an inverter or a converter provided with a plurality of electronic circuit boards.

For example, electric vehicles, hybrid vehicles, and the like are equipped with power conversion devices such as inverters and converters for converting power supply power into drive power for driving a drive motor. Such a power converter performs power conversion by switching operations of a plurality of semiconductor modules.
The power converter is mounted with an electronic circuit board having a drive circuit for switching and driving the plurality of semiconductor modules, a control circuit for controlling a drive state based on various vehicle information, and the like.

As this electronic circuit board, two boards for a high voltage system and a low voltage system may be used. For example, a high-voltage electronic circuit board that constitutes a drive circuit and a low-voltage electronic circuit board that constitutes a control circuit may be used. When arranging the two electronic circuit boards in the power converter, they are arranged so as to be stacked in the thickness direction while providing a space between them. At this time, it is considered that a boss is interposed between the two electronic circuit boards as shown in FIG.
That is, as shown in FIG. 22, the two electronic circuit boards 92 are fixed to each other via the bosses 93 in the vicinity of the corners. In addition, the two electronic circuit boards 92 fixed to each other are fixed to the case.

  However, if the two electronic circuit boards 92 are fixed using the bosses 93 only in the vicinity of the corner end of the electronic circuit board 92, there is a problem that the electronic circuit board 92 is easily deformed when an external force is applied due to, for example, a vehicle collision. . Therefore, when the electronic circuit board 92 is deformed, in order to prevent the two electronic circuit boards 92 from coming into contact with each other, it is necessary to increase the distance between the two. As a result, it is difficult to reduce the size of the power converter.

  To solve this problem, as shown in FIG. 23, a power conversion device is proposed in which a pair of stays 94 are disposed between two electronic circuit boards 92 along opposite sides of the electronic circuit board 92. (Patent Document 2).

Japanese Utility Model Publication No. 58-34790 JP 2009-159767 A

However, even if the pair of stays 94 are arranged along the pair of edges constituting the sides facing each other in the electronic circuit board 92 as in the power conversion device disclosed in Patent Document 2, the electronic circuit board 92 It is not possible to sufficiently prevent deformation such as deflection near the center of the plate.
Further, since the two sides of the space between the two electronic circuit boards 92 are blocked by the pair of stays 94, the air in the space tends to stay, and the electronic circuit board 92 There is a risk of temperature rise.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a power converter that suppresses deformation of an electronic circuit board, is small, and has excellent heat dissipation.

The present invention includes a first electronic circuit board and a second electronic circuit board that are stacked in the thickness direction while providing a space between them,
A plurality of semiconductor modules disposed on a surface of the first electronic circuit board opposite to the second electronic circuit board and having signal terminals connected to the first electronic circuit board;
A fixing member for fixing the first electronic circuit board and the second electronic circuit board to each other;
A spacer interposed between the first electronic circuit board and the second electronic circuit board and maintaining a distance between the two,
The spacer is disposed in an arrangement region of the plurality of semiconductor modules when viewed from the stacking direction of the first electronic circuit board and the second electronic circuit board. (Claim 1).

In the power conversion device, a spacer is provided between the first electronic circuit board and the second electronic circuit board so as to maintain a distance therebetween. Thereby, the space | interval between a 1st electronic circuit board and a 2nd electronic circuit board can be maintained, and it can prevent effectively that both deform | transform in the direction which approaches.
This makes it possible to reduce the distance between the first electronic circuit board and the second electronic circuit board, that is, taking into account the deformation of the board, the first electronic circuit board and the second electronic circuit board. Since there is no need to increase the distance between the electronic circuit board and the power converter, it is possible to reduce the size of the power converter.

  Further, the spacer is an arrangement region of the plurality of semiconductor modules when viewed from the stacking direction of the first electronic circuit board and the second electronic circuit substrate (hereinafter, referred to as “semiconductor module arrangement region” as appropriate). It is arranged. Therefore, it is possible to suppress deformation of the first electronic circuit board and the second electronic circuit board in at least a portion where the signal terminals of the semiconductor module are connected. Thereby, the short circuit of the signal terminal at the time of a vehicle collision etc. can be prevented effectively.

In the semiconductor module arrangement region, no other electronic component is mounted on the first electronic circuit board. In this semiconductor module arrangement region, the space between the first electronic circuit board and the second electronic circuit board (hereinafter, referred to as “inter-substrate space” as appropriate) includes the first electronic circuit board and the signal. Only the connection with the terminal is arranged. Therefore, there is a sufficient space in the inter-substrate space in the semiconductor module placement region.
Therefore, by disposing the spacer in this space, deformation of the first electronic circuit board and the second electronic circuit board can be suppressed without increasing the areas of the first electronic circuit board and the second electronic circuit board. it can. Therefore, an increase in size of the power conversion device can be prevented.

  In addition, since the spacer is disposed in the semiconductor module placement region, the inter-substrate space is not blocked at the edge of the first electronic circuit board and the second electronic circuit board. Therefore, the air circulation between the inter-substrate space and the outside thereof can be prevented from being hindered, and the temperature rise of the air in the inter-substrate space can be prevented. As a result, the temperature rise of the first electronic circuit board and the second electronic circuit board can be prevented. That is, the heat dissipation of the first electronic circuit board and the second electronic circuit board can be improved.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a power converter that suppresses deformation of an electronic circuit board, is small, and has excellent heat dissipation.

The perspective view of the power converter device in Example 1. FIG. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. FIG. 3 is a sectional view taken along line B-B in FIG. 2. FIG. 3 is an explanatory diagram of a semiconductor module arrangement region in the first embodiment. Sectional drawing of the power converter device in Example 2. FIG. CC sectional view taken on the line of FIG. The perspective view seen from diagonally downward of the spacer in Example 2. FIG. The perspective view seen from diagonally downward of the other spacer in Example 2. FIG. The perspective view of the power converter device in Example 3. FIG. FIG. 10 is a sectional view taken along line D-D in FIG. 9. FIG. 11 is a cross-sectional view taken along line EE in FIG. 10. The perspective view of the spacer in Example 3. FIG. The top view of the power converter device seen in the state which removed the 2nd electronic circuit board in Example 4. FIG. The perspective view of the spacer in Example 4. FIG. The perspective view of the power converter device in Example 5. FIG. FIG. 16 is a cross-sectional view taken along line F-F in FIG. 15. FIG. 17 is a sectional view taken along line GG in FIG. 16. The perspective view of the spacer in Example 5. FIG. Sectional drawing of the power converter device in Example 6. FIG. Sectional drawing of the power converter device in Example 7. FIG. FIG. 21 is a cross-sectional view taken along line HH in FIG. 20. The perspective view of the laminated structure of the two electronic circuit boards in a prior art example. The perspective view of the laminated structure of the two electronic circuit boards in another prior art example.

  In the present invention, the material of the spacer is not particularly limited, but is preferably composed of an insulator such as a resin. In this case, even if the spacer contacts the signal terminal of the semiconductor module, there is no problem such as shorting the signal terminal.

Further, it is preferable that the first electronic circuit board and the second electronic circuit board have a rectangular shape, and the space between the two has openings corresponding to the four sides of the rectangular shape. 2).
In this case, since the inter-substrate space is released to the external space on all four sides, air circulation between the inter-substrate space and the external space can be ensured. As a result, heat in the inter-substrate space can be released from all sides, and the heat dissipation of the electronic circuit board can be further improved.

The spacer is preferably in contact with the first electronic circuit board between the signal terminals of the adjacent semiconductor modules.
In this case, it is possible to effectively suppress deformation of a portion that is particularly easily deformed in the first electronic circuit board. In addition, since the deformation of the first electronic circuit board at the portion to which the signal terminal is connected can be suppressed, it is possible to effectively prevent a short circuit of the signal terminal due to the deformation of the first electronic circuit board and the second electronic circuit board. it can.

In addition, the signal terminal penetrates the first electronic circuit board, the spacer has a continuous waveform with a constant amplitude, and one top of the waveform is adjacent to the adjacent semiconductor. Preferably, the signal terminals of the module are in contact with the first electronic circuit board, and the other top is in contact with the second electronic circuit board.
In this case, since the spacer by one member can be arrange | positioned over the wide range of a 1st electronic circuit board and a 2nd electronic circuit board, an assembly | attachment operation | work can be made efficient.

The spacer preferably has a rectangular wave shape.
In this case, the top of the corrugation becomes a flat surface, and this flat surface comes into contact with the first electronic circuit board and the second electronic circuit board. Therefore, deformation of the first electronic circuit board and the second electronic circuit board can be more effectively prevented.

The signal terminal penetrates the first electronic circuit board, and the spacer has a relief hole provided on a surface facing the first electronic circuit board and protrudes from the first electronic circuit board. Preferably, the signal terminal is disposed in the escape hole.
In this case, the spacer can be disposed so as not to interfere with the signal terminal while increasing the thickness of the spacer, that is, increasing the cross-sectional area of the spacer in parallel with the first electronic circuit board. . Thereby, the strength of the spacer can be improved, and the degree of freedom of arrangement of the spacer can be increased.

The plurality of semiconductor modules are arranged in one or a plurality of rows along a direction parallel to the first electronic circuit board, and the spacer is a length formed along the arrangement direction of the semiconductor modules. It is preferable to have a ceiling plate made of a scale member and in contact with the second electronic circuit board, and a pair of standing portions standing from the both ends in the width direction of the ceiling board toward the first electronic circuit board. (Claim 7).
In this case, since the pair of standing portions are in contact with the first electronic circuit board along the arrangement direction of the semiconductor modules, spacers may be provided so as not to interfere with the signal terminals. It becomes easy. That is, when the semiconductor modules are arranged in a predetermined direction, the signal terminals are also arranged in the predetermined direction, and a region where no signal terminals exist is also continuous in the predetermined direction. Therefore, it becomes easy to contact the standing part of the long member along the arrangement direction in this region.
Moreover, since the said spacer has a ceiling board and a pair of standing part, it can support a 1st electronic circuit board and a 2nd electronic circuit board stably.

Example 1
A power converter according to an embodiment of the present invention will be described with reference to FIGS.
As shown in FIGS. 1 and 2, the power conversion device 1 of the present example includes the following first electronic circuit board 21 and second electronic circuit board 22, a plurality of semiconductor modules 3, a fixing member 4, a spacer 5, and the like. Have

The first electronic circuit board 21 and the second electronic circuit board 22 are stacked in the thickness direction while providing a space between them.
The semiconductor module 3 is disposed on the surface of the first electronic circuit board 21 opposite to the second electronic circuit board 22, and a signal terminal 31 is connected to the first electronic circuit board 21.

The fixing member 4 fixes the first electronic circuit board 21 and the second electronic circuit board 22 to each other.
The spacer 5 is interposed between the first electronic circuit board 21 and the second electronic circuit board 22 and keeps the distance therebetween.
As shown in FIG. 3, the spacer 5 is a region where the plurality of semiconductor modules 3 are arranged when viewed from the stacking direction of the first electronic circuit board 21 and the second electronic circuit board 22 (the semiconductor module arrangement shown in FIG. In the region 12). As shown in FIG. 4, the semiconductor module placement region 12 is a rectangular region with a large gap and formed so as to cover all the semiconductor modules 3.

The power conversion apparatus 1 of this example is mounted on an electric vehicle or a hybrid vehicle, and performs power conversion between a DC power supply (not shown) and a three-phase AC rotating electric machine (not shown) as a vehicle drive source. is there.
In this example, the first electronic circuit board 21 is a relatively high-voltage high-voltage electronic circuit board having a drive circuit for switchingly driving the plurality of semiconductor modules 3, and the second electronic circuit board 21 is And a low-voltage electronic circuit board having a control circuit for controlling the driving state based on various vehicle information.

As shown in FIGS. 2 to 4, in addition to the semiconductor module 3, an electronic component 111 such as an IC, a capacitor, or a resistor that constitutes the drive circuit is mounted on the first electronic circuit board 21. These electronic components 111 are mounted on the surface of the first electronic circuit board 21 on the second electronic circuit board 22 side, excluding the semiconductor module placement area 12.
The second electronic circuit board 22 is also mounted with a plurality of electronic components 112 that constitute the control circuit. These electronic components 112 are mounted on the surface of the second electronic circuit board 22 opposite to the first electronic circuit board 21 side.

Further, as shown in FIG. 3, the first electronic circuit board 21 and the second electronic circuit board 22 have a rectangular shape. And as shown in FIG. 1, the space (inter-substrate space 13) between both has opened the part corresponding to rectangular four sides.
That is, the first electronic circuit board 21 and the second electronic circuit board 22 are fixed to each other by the fixing members 4 arranged at these four corners (FIG. 3). Except for the position where the fixing member 4 is disposed, the inter-substrate space 13 is open to the outside at positions corresponding to the four sides of the first electronic circuit board 21 and the second electronic circuit board 22.

  The fixing member 4 is erected between the four corners of the first electronic circuit board 21 and the second electronic circuit board 22, and as shown in FIG. The first electronic circuit board 21 and the second electronic circuit board 22 are fixed. The four fixing members 4 have the same height, and the first electronic circuit board 21 and the second electronic circuit board 22 are arranged in parallel with a predetermined interval.

As shown in FIGS. 1 and 2, the semiconductor module 3 includes a main body portion 30 containing a switching element and five signal terminals 31 protruding from one end face of the main body portion 30. As shown in FIG. 3, the signal terminal 31 is arranged to be biased to one side in the longitudinal direction on the end face.
A main electrode terminal that is electrically connected to the DC power source or the three-phase AC rotating electric machine is formed on the end surface of the main body 30 opposite to the standing side of the signal terminal 31. FIG. 2 is omitted.

The plurality of semiconductor modules 3 are alternately stacked together with cooling pipes (not shown) for cooling them, and are arranged in two rows in the stacking direction. The alignment direction is parallel to the first electronic circuit board 21 and the second electronic circuit board 22 and to these long sides.
The signal terminal 31 is inserted into a through hole provided in the first electronic circuit board 21 and soldered to an electrode pad formed on the surface of the first electronic circuit board 21 on the second electronic circuit board 22 side. Yes.

As shown in FIG. 3, the spacer 5 is in contact with the first electronic circuit board 21 between the signal terminals 31 of the adjacent semiconductor modules 3. The spacer 5 is also in contact with the second electronic circuit board 22. The spacer 5 is fixed to at least one of the first electronic circuit board 21 and the second electronic circuit board 22 by a fixing means such as an adhesive.
In this example, as shown in FIGS. 1 to 3, the spacer 5 is made of a substantially elliptical columnar resin molded body and is disposed between the signal terminals 31 of the semiconductor modules 3 adjacent in the stacking direction.
In addition, a plurality of spacers 5 are arranged, and these spacers 5 all have the same height, and this height matches the interval of the inter-substrate space 13.

Next, the function and effect of this example will be described.
In the power conversion device 1, the spacer 5 is interposed between the first electronic circuit board 21 and the second electronic circuit board 22 so as to maintain the distance between them. Thereby, the space | interval between the 1st electronic circuit board 21 and the 2nd electronic circuit board 22 can be maintained, and it can prevent effectively that both deform | transform in the direction which approaches.
This makes it possible to reduce the distance between the first electronic circuit board 21 and the second electronic circuit board 22, that is, considering the deformation of the board and the first electronic circuit board 21 and the second electronic circuit board 22. Since there is no need to increase the distance between the two electronic circuit boards 22, the power converter 1 can be downsized.

  Moreover, as shown in FIG. 3, the spacer 5 is arrange | positioned in the semiconductor module arrangement | positioning area | region 12 (FIG. 4). Therefore, it is possible to suppress deformation of the first electronic circuit board 21 and the second electronic circuit board 22 at least at a portion where the signal terminal 31 of the semiconductor module 3 is connected. Thereby, the short circuit of the signal terminal 31 at the time of a vehicle collision etc. can be prevented effectively.

Further, as shown in FIG. 4, in the semiconductor module placement region 12, no other electronic component 111 is mounted on the first electronic circuit board 21. In the semiconductor module placement region 12, the space between the first electronic circuit board 21 and the second electronic circuit board 22 (inter-board space 13) includes the first electronic circuit board 21 and the signal terminal 31. Only the connection is arranged. Therefore, a sufficient space exists in the inter-substrate space 13 in the semiconductor module placement region 12.
Therefore, by disposing the spacer 5 in this space, the first electronic circuit board 21 and the second electronic circuit board 22 can be deformed without increasing the areas of the first electronic circuit board 21 and the second electronic circuit board 22. Can be suppressed. Therefore, the enlargement of the power converter 1 can be prevented.

  In addition, since the spacer 5 is disposed in the semiconductor module arrangement region 12, the inter-substrate space 13 is not blocked at the edges of the first electronic circuit board 21 and the second electronic circuit board 22. Therefore, it is possible to prevent the air circulation between the inter-substrate space 13 and the outside thereof from being inhibited, and to prevent the temperature of the air in the inter-substrate space 13 from rising. As a result, the temperature rise of the first electronic circuit board 21 and the second electronic circuit board 22 can be prevented. That is, the heat dissipation of the first electronic circuit board 21 and the second electronic circuit board 22 can be improved.

  The inter-substrate space 13 has openings corresponding to the four rectangular sides. That is, since the inter-substrate space 13 is released to the external space in the four directions, air circulation between the inter-substrate space 13 and the external space can be ensured. As a result, heat in the inter-substrate space 13 can be released from all directions, and the heat dissipation of the electronic circuit boards (the first electronic circuit board 21 and the second electronic circuit board 22) can be further improved.

  The spacer 5 is in contact with the first electronic circuit board 21 between the signal terminals 31 of the adjacent semiconductor modules 3. Therefore, it is possible to effectively suppress deformation of the first electronic circuit board 21 that is particularly easily deformed. In addition, since the deformation of the first electronic circuit board 21 at the portion to which the signal terminal 31 is connected can be suppressed, the short circuit of the signal terminal 31 due to the deformation of the first electronic circuit board 21 and the second electronic circuit board 22 is effective. Can be prevented.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a power converter that suppresses deformation of an electronic circuit board, is small, and has excellent heat dissipation.

(Example 2)
In this example, as shown in FIG. 5 to FIG. 8, an escape hole 52 is provided in the surface 51 of the spacer 5 facing the first electronic circuit board 21, and the signal terminal 31 protruding from the first electronic circuit board 21 is provided as the escape hole 52. This is an example of arrangement.
In the case of this example, as shown in FIGS. 5 and 6, the spacer 5 is arranged in the inter-substrate space 13 at the arrangement position of the semiconductor modules 3 arranged in one of the two columns. The signal terminals 31 of the plurality of semiconductor modules 3 are disposed in the respective escape holes 52, and the contact surfaces 51 of the spacers 5 around the escape holes 52 are arranged around the signal terminals 31 of the semiconductor module 3 in the first electronic circuit. It is in contact with the substrate 21.

As shown in FIG. 7, one escape hole 52 may be formed in each spacer 5, and a plurality of signal terminals 5 in one semiconductor module 3 may be arranged, or as shown in FIG. A plurality of spacers 5 may be formed, and one signal terminal 31 may be inserted and disposed in each escape hole 52.
In this example, the escape hole 52 does not penetrate the spacer 5, but an escape hole that penetrates the spacer 5 in the height direction may be provided.
Others are the same as in the first embodiment.

In the case of this example, the spacer 5 is arranged so as not to interfere with the signal terminal 31 while making the spacer 5 thick, that is, increasing the cross-sectional area of the spacer 5 in parallel to the first electronic circuit board 21. be able to. Thereby, the strength of the spacer 5 can be improved, and the degree of freedom of arrangement of the spacer 5 can be increased.
In addition, the same effects as those of the first embodiment are obtained.

(Example 3)
In this example, as shown in FIGS. 9 to 11, a spacer 5 having a continuous waveform in a waveform having a constant amplitude is used.
Then, one top portion 531 in the wave shape is in contact with the first electronic circuit board 21 between the signal terminals 31 of the adjacent semiconductor modules 3, and the other top portion 532 is in contact with the second electronic circuit board 22. Yes.
The spacer 5 has a rectangular wave shape as shown in FIGS. That is, each of the top portion 531 and the other top portion 532 has a flat surface. The one top portion 531 and the other top portion 532 are connected to each other by a standing portion 533 that is erected in the stacking direction of the first electronic circuit board 21 and the second electronic circuit board 22.

Further, in this example, as shown in FIG. 11, the signal terminals 31 in the semiconductor modules 3 in one row and the signal terminals 31 in the semiconductor modules 3 in the other row are biased toward the end portions on the side close to each other. Placed in position.
As shown in FIG. 10, the spacer 5 protrudes from the first electronic circuit board 21 in a space formed between the top part 532 in contact with the second electronic circuit board 22 and the standing parts 533 at both ends thereof. The signal terminal 31 is disposed in the inter-substrate space 13 so that the signal terminal 31 is disposed.
Others are the same as in the first embodiment.

In the case of this example, since the spacer 5 by one member can be arrange | positioned over the wide range of the 1st electronic circuit board 21 and the 2nd electronic circuit board 22, an assembly | attachment operation | work can be made efficient.
Further, since the spacer 5 has a rectangular wave shape, the corrugated top portions 531 and 532 become flat surfaces, and the flat surfaces come into contact with the first electronic circuit board 21 and the second electronic circuit board 22. Therefore, deformation of the first electronic circuit board 21 and the second electronic circuit board 22 can be more effectively prevented.
In addition, the same effects as those of the first embodiment are obtained.

  In this example, for example, the spacer 5 can be shaped like a sine wave. In this case, although the top portions 531 and 532 do not become flat surfaces, it is possible to reinforce them over a wide range of the first electronic circuit board 21 and the second electronic circuit board 22 only by arranging the spacer 5 as one member. From the viewpoint of being able to do so, the same effect can be obtained.

Example 4
Further, in this example, as shown in FIGS. 13 and 14, the rectangular wave spacer 5 is arranged in the inter-substrate space 13.
However, in this example, the amplitude direction of the rectangular wave is a direction orthogonal to the stacking direction of the first electronic circuit board 21 and the second electronic circuit board 22, and compared with the case of Example 3, the spacer 5 The orientation is in a state of being rotated 90 ° around the longitudinal direction.

One top portion 531 of the spacer 5 is disposed between the signal terminals 31 of two semiconductor modules 3 adjacent to each other in a direction orthogonal to the thickness direction of the semiconductor module 3, and the other top portion 532 is adjacent to the thickness direction. It is arranged between the signal terminals 31 of the two semiconductor modules 3.
That is, the signal terminal 31 is disposed between one top portion 531 of the spacer 5 and the pair of standing portions 533 at both ends thereof.
Others are the same as in the third embodiment.

Also in this example, it is possible to reinforce the first electronic circuit board 21 and the second electronic circuit board 22 over a wide range only by arranging the spacer 5 as one member.
In addition, the same effects as those of the first embodiment are obtained.
In this example, for example, the spacer 5 can be shaped like a sine wave. Also in this case, the same effect can be obtained.

(Example 5)
In this example, as shown in FIGS. 15 to 18, the spacer 5 made of a long member formed along the arrangement direction of the semiconductor modules 3 is used.
The spacer 5 includes a ceiling plate 541 that is in contact with the second electronic circuit board 22 and a pair of standing portions 542 that are erected from both ends in the width direction of the ceiling board 541 toward the first electronic circuit board 21. And have.

One standing portion 542 contacts the first electronic circuit board 21 outside the signal terminal 31 of the semiconductor module 3 in one row, and the other standing portion 542 is a signal of the semiconductor module 3 in the other row. The first electronic circuit board 21 is in contact with the outside of the terminal 31.
That is, the signal terminals 31 of all the semiconductor modules 3 are disposed between the pair of standing portions 542 in the spacer 5.
Others are the same as in the third embodiment.

In the case of this example, the pair of upright portions 542 abut on the first electronic circuit board 21 along the arrangement direction of the semiconductor modules 3, so that the spacer 5 is not interfered with the signal terminal 31. It becomes easy to arrange. That is, when the semiconductor modules 3 are arranged in a predetermined direction, the signal terminals 31 are also arranged in the predetermined direction, and a region where the signal terminals 31 do not exist is continuous in the predetermined direction. Therefore, it becomes easy to abut the erect portion 542 of the long member along the arrangement direction in this region.
Moreover, since the spacer 5 has the ceiling board 541 and a pair of standing part 542, it can support the 1st electronic circuit board 21 and the 2nd electronic circuit board 22 stably.
In addition, the same effects as those of the first embodiment are obtained.

(Example 6)
In this example, as shown in FIG. 19, the flange portion 543 is provided on the pair of standing portions 542 of the spacer 5.
The flange portion 543 is bent at a right angle at the end portion of the standing portion 542 and is in surface contact with the first electronic circuit board 21.
Others are the same as in the fifth embodiment.

In the case of this example, since the spacer 5 also comes into surface contact with the first electronic circuit board 21, the deformation of the first electronic circuit board 21 can be further suppressed.
In particular, when the spacer 5 is fixed to the first electronic circuit board 21, the fixing can be easily performed at the flange portion 543.
In addition, the same effects as those of the fifth embodiment are obtained.

(Example 7)
In this example, as shown in FIGS. 20 and 21, one standing portion 542 of the spacer 5 is brought into contact with the first electronic circuit board 21 between the signal terminals 31 of the semiconductor modules 3 in two rows. It is an example.
That is, the signal terminal 31 of the semiconductor module 3 in one of the two rows is disposed between the pair of standing portions 542 in the spacer 5, and the signal terminal 31 of the semiconductor module 3 in the other row is connected to the spacer 5. It will be arranged outside.
Others are the same as in the fifth embodiment.
In the case of this example, since the spacer 5 can be reduced in size, the weight and cost of the apparatus can be reduced.
In addition, the same effects as those of the fifth embodiment are obtained.

  In Examples 5 to 7, the standing portion 542 may be provided with an opening or a notch. In this case, air can circulate in the space between the pair of upright portions 542 and the outer space through the opening and the notch, thereby further improving the heat dissipation of the electronic circuit board. be able to.

DESCRIPTION OF SYMBOLS 1 Power converter 111,112 Electronic component 12 Semiconductor module arrangement | positioning area | region 13 Space between board | substrates 21 1st electronic circuit board 22 2nd electronic circuit board 3 Semiconductor module 31 Signal terminal 4 Fixing member 5 Spacer

Claims (7)

A first electronic circuit board and a second electronic circuit board that are stacked in the thickness direction while providing a space between them;
A plurality of semiconductor modules disposed on a surface of the first electronic circuit board opposite to the second electronic circuit board and having signal terminals connected to the first electronic circuit board;
A fixing member for fixing the first electronic circuit board and the second electronic circuit board to each other;
A spacer interposed between the first electronic circuit board and the second electronic circuit board and maintaining a distance between the two,
The power converter according to claim 1, wherein the spacer is disposed in an arrangement region of the plurality of semiconductor modules when viewed from a stacking direction of the first electronic circuit board and the second electronic circuit board.   2. The power conversion device according to claim 1, wherein the first electronic circuit board and the second electronic circuit board have a rectangular shape, and a space between the two has openings corresponding to the four sides of the rectangular shape. The power converter characterized by being made to do.   3. The power conversion device according to claim 1, wherein the spacer is in contact with the first electronic circuit board between the signal terminals of the adjacent semiconductor modules.   4. The power conversion device according to claim 3, wherein the signal terminal penetrates the first electronic circuit board, and the spacer has a shape that is continuous with a wave shape having a constant amplitude. One of the top portions is in contact with the first electronic circuit board between the signal terminals of the adjacent semiconductor modules, and the other top portion is in contact with the second electronic circuit board. apparatus.   The power converter according to claim 4, wherein the spacer has a rectangular wave shape.   4. The power conversion device according to claim 1, wherein the signal terminal passes through the first electronic circuit board, and the spacer is provided on a surface facing the first electronic circuit board. A power conversion device comprising: an escape hole, wherein the signal terminal protruding from the first electronic circuit board is disposed in the escape hole.   4. The power conversion device according to claim 1, wherein the plurality of semiconductor modules are arranged in one or a plurality of rows along a direction parallel to the first electronic circuit board. The spacer is formed of a long member formed along the arrangement direction of the semiconductor modules, and the ceiling plate abutting on the second electronic circuit board and the first electronic circuit board from both ends in the width direction of the ceiling board. A power conversion device comprising: a pair of upright portions standing upright.

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