JP2011200057A - Power conversion device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power conversion device whose miniaturization becomes easy and which is excellent in productivity, and to provide a method of manufacturing the same.SOLUTION: The power conversion device 1 accommodates a semiconductor stacked unit 4 structured by stacking semiconductor modules 2 and cooling tubes 3 in a frame 5. A pressing member 6 is arranged at one end of the stacking direction X of the semiconductor stacked unit. The pressing member 6 has a press contact plate 61, an engagement plate 62, which can rotate around a rotation axis A to the press contact plate, and a spring member 63 arranged between the press contact plate and the engagement plate. The frame has an insertion opening 51 at a position facing one end of the stacking direction of the semiconductor stacked unit. The engagement plate is larger than the width D of the insertion opening in the dimension L in the longitudinal direction and smaller than the width D in the dimension W in the short-side direction. In a state that the short-direction of the engagement plate intersects the width direction of the insertion opening, the engagement plate is engaged with the inner wall 52 of the frame at both sides of the width direction of the insertion opening.

Description

  The present invention relates to a power conversion device having a semiconductor stacked unit in which semiconductor modules constituting a part of a power conversion circuit and cooling pipes for cooling the semiconductor modules are alternately stacked, and a method for manufacturing the same.

  For example, there is a power conversion device for converting power between an AC motor that is a power source of an electric vehicle or a hybrid vehicle, and a DC battery mounted on the vehicle. The power conversion device has a plurality of semiconductor modules with built-in switching elements, and these semiconductor modules generate heat by a controlled current flowing therethrough. In particular, in recent years, with the increase in driving force required for the AC motor, the controlled current increases and the amount of heat generated by the semiconductor module tends to increase.

  Therefore, it is necessary to suppress the temperature rise of the semiconductor module due to this heat generation. Therefore, the power conversion device 9 includes a cooler 930 for cooling the plurality of semiconductor modules 92 as shown in FIG. The cooler 930 is formed by connecting a plurality of cooling pipes 93 provided with a refrigerant flow path through which a cooling medium flows. Then, the power conversion device 9 accommodates in a frame 95 a semiconductor laminated unit 94 having a semiconductor module 92 sandwiched between cooling pipes 93 and a leaf spring 96 that pressurizes the semiconductor laminated unit 94 in the lamination direction X. (See Patent Document 1).

  Further, both end portions 961 of the leaf spring 96 are engaged with a pair of support pins 97 arranged in the frame 95. The leaf spring 96 is bent in such a manner that the inner part of both end portions 961 is convex toward the semiconductor lamination unit 94, and is urged so as to press the semiconductor lamination unit 94 in the lamination direction X at the center thereof. It is arranged by.

  In assembling the power conversion device 9, first, as shown in FIGS. 14 and 15, the semiconductor laminated unit 94 is arranged in the frame 95. In addition, a leaf spring 96 in a free state is disposed in one end of the semiconductor lamination unit 94 in the lamination direction X and in the frame 95. Then, as shown in FIGS. 16 and 17, the vicinity of both end portions 961 of the plate spring 96 is pressed toward the semiconductor lamination unit 94 by a pressing jig (not shown), and the plate spring 96 is elastically deformed.

In a state where the plate spring 96 is elastically deformed by a predetermined amount, as shown in FIGS. 18 and 19, the support pins 97 are perpendicular to the stacking direction X between both end portions 961 of the plate spring 96 and the inner wall of the frame 95. Insert from the direction.
Next, by releasing the pressing by the pressing jig, as shown in FIGS. 20 and 21, the leaf spring 96 is partially restored, and both end portions 961 of the leaf spring 96 are supported by the support pins 97, and both end portions The support pin 97 is sandwiched between 961 and the inner wall of the frame 95. Thereby, the biased state of the leaf spring 96 is maintained, and the semiconductor stacked unit 94 is pressed in the stacking direction X by the biasing force of the leaf spring 96.

JP 2009-27805 A

  However, when the plate spring 96 is assembled, as described above, the plate spring 96 in a free state, that is, the plate spring 96 having a large dimension in the stacking direction X is disposed in the frame 95 together with the semiconductor stacked unit 94. Therefore (see FIGS. 14 and 15), the size of the frame 95 needs to be increased. Furthermore, when the plate spring 96 is assembled, a jig used for elastically deforming the plate spring 96 is also arranged in the frame 95, so that the size of the frame 95 needs to be further increased.

Further, since the support pin 97 is disposed between the leaf spring 96 and the inner wall of the frame 95, the space for disposing the support pin 97 also leads to an increase in the size of the frame 95.
As a result, the power converter 9 is increased in size.
Further, since it is necessary to dispose the support pin 97 between the leaf spring 96 and the inner wall of the frame 95 after the leaf spring 96 is disposed, there is a problem that the number of assembling steps increases.

  The present invention has been made in view of such problems, and is intended to provide a power conversion device that is easy to downsize and has excellent productivity, and a method for manufacturing the same.

A first invention is a power conversion apparatus in which a semiconductor laminated unit formed by alternately laminating a semiconductor module constituting a part of a power conversion circuit and a cooling pipe for cooling the semiconductor module is accommodated in a frame. Because
At one end in the stacking direction of the semiconductor stacking unit, a pressure member that pressurizes the semiconductor stacking unit in the stacking direction is disposed,
The pressure member includes a pressure contact plate that contacts the semiconductor lamination unit, an engagement plate that is rotatable about a rotation axis parallel to the stacking direction with respect to the pressure contact plate and that engages with the frame, and A spring member that is arranged between the pressure contact plate and the engagement plate and that can expand and contract in the stacking direction;
The frame has an insertion opening for inserting the engagement plate from the stacking direction at a position facing one end of the stacking direction of the semiconductor stacking unit,
The engagement plate has a shape in which the dimension in the longitudinal direction is larger than the width of the insertion opening, and the dimension in the short direction is smaller than the width of the insertion opening,
The engagement plate is engaged with the inner wall of the frame on both sides in the width direction of the insertion opening in a state where at least the short direction of the engagement plate intersects the width direction of the insertion opening. (1).

A second invention is a method of manufacturing the power converter according to the first invention,
The semiconductor multilayer unit is disposed on the frame such that one end of the semiconductor multilayer unit in the stacking direction faces the insertion opening, and the pressure contact plate is disposed in the frame in the stacking direction of the semiconductor multilayer unit. And after the spring member is inserted and arranged inside the insertion opening,
The engagement plate disposed at one end of the spring member is inserted into the frame from the outside of the frame through the insertion opening with at least the longitudinal direction of the engagement plate intersecting the width direction of the insertion opening. So as to compress and deform the spring member by pushing toward the semiconductor laminated unit
When the engagement plate is pushed inward from the inner wall of the frame on both sides in the width direction of the insertion opening, the engagement plate is rotated around the rotation axis with respect to the frame,
Next, in the method of manufacturing the power converter, the engagement plate is engaged with the inner wall by releasing the pushing force of the engagement plate and restoring the spring member.

  The power converter according to the first aspect of the present invention has the insertion opening at a position facing the one end in the stacking direction of the semiconductor stacked unit in the frame. And the said pressurization member is provided with the said engaging plate which has a shape whose dimension of a longitudinal direction is larger than the width | variety of the said insertion opening part, and whose dimension of a transversal direction is smaller than the width | variety of the said insertion opening part. Therefore, the spring member can be compressed from the outside of the frame toward the semiconductor stacked unit when the pressure member is disposed at one end of the semiconductor stacked unit in the stacking direction.

That is, since the dimension of the engagement plate in the short direction is smaller than the width of the insertion opening, for example, the engagement plate is placed outside the frame or in a posture in which the short direction coincides with the width direction of the insertion opening. The engaging plate can be inserted from the insertion opening to the inside of the frame (semiconductor lamination unit side) by being pushed toward the semiconductor lamination unit from the state of being arranged inside the insertion opening. Then, when the engagement plate is pushed inward from the inner wall of the frame, the engagement plate is rotated around the rotation axis with respect to the frame, for example, the longitudinal direction of the engagement plate matches the width direction of the insertion opening. By doing so, the engagement plate can be engaged with the frame.
Thereby, a pressurizing member can be arrange | positioned in a flame | frame in the state which presses a semiconductor lamination | stacking unit.

As described above, when the pressure member is disposed, the spring member can be compressed from the outside of the frame toward the semiconductor multi-layer unit. Therefore, a pressing jig for pressing the pressure member is provided in the frame. There is no need to place them. In other words, it is not necessary to provide a space for arranging the pressing jig in the frame.
In addition, holding of the pressing force to the semiconductor laminated unit by the pressurizing member can be realized by engaging the engagement plate with the frame, so that it is not necessary to arrange a support pin or the like in the frame.
As a result, the frame can be easily downsized and the power converter can be easily downsized.

As described above, the assembly of the pressure member to the power converter can be performed by pushing the engaging plate in the stacking direction and rotating the engaging plate, so that the number of assembling steps can be reduced. . As a result, a power conversion device with excellent productivity can be obtained.
Further, as described above, since the spring member can be compressed from the outside of the frame in the stacking direction toward the semiconductor stack unit, the assembly workability is also improved from the viewpoint of easily pressing the semiconductor stack unit in a balanced manner. Can be improved.

  According to a second aspect of the present invention, there is provided a method for manufacturing the power conversion device, wherein the engagement plate is pushed toward the semiconductor lamination unit so as to be inserted into the frame through the insertion opening from outside the lamination direction of the frame. As a result, the spring member is compressed and deformed. Therefore, it is not necessary to arrange a pressing jig for pressing the pressing member in the frame. In other words, it is not necessary to provide a space for arranging the pressing jig in the frame.

Further, when the engagement plate is pushed inward from the inner wall of the frame, the engagement plate is rotated to partially restore the spring member, thereby engaging the engagement plate with the inner wall. As described above, the assembly of the pressure member to the power converter can be performed by pushing the engaging plate in the stacking direction and rotating the engaging plate, so that the number of assembling steps can be reduced.
Moreover, this makes it easy to press the semiconductor laminated unit in a balanced manner, and improves the assembly workability.

  In addition, since the pressing force can be held on the semiconductor laminated unit by engaging the engagement plate with the frame, it is not necessary to dispose a support pin or the like in the frame. Therefore, the size of the frame can be reduced, and the power converter can be easily reduced in size.

  As described above, according to the present invention, it is possible to provide a power conversion device that is easy to downsize and has excellent productivity, and a method for manufacturing the same.

Plane explanatory drawing of the manufacturing method of the power converter device in Example 1 before compression of a pressurization member. V1 view of FIG. Plane explanatory drawing of the manufacturing method of the power converter device in Example 1 after compression of a pressurization member. Plane explanatory drawing of the manufacturing method of the power converter device after rotating the engaging plate in Example 1. FIG. V2 view of FIG. Plane explanatory drawing of the power converter device in Example 1. FIG. V3 view of FIG. Sectional explanatory drawing of the press-contact board and spring member which provided the escape groove | channel in Example 1. FIG. Sectional explanatory drawing with the spring member which provided the press-contacting plate and the chamfering part in Example 1. FIG. FIG. 3 is an explanatory plan view of the front end surface of the spring member in the first embodiment. Plane explanatory drawing of the manufacturing method of the power converter device in Example 2 before compression of a pressurization member. Plane | planar explanatory drawing of the power converter device in Example 2. FIG. Sectional explanatory drawing of the contact part vicinity of a press-contacting plate and a spring member in Example 2. FIG. Plane explanatory drawing of the manufacturing method of the power converter device before compression of a spring member in background art. BB cross-sectional explanatory drawing of FIG. Plane explanatory drawing of the manufacturing method of the power converter device after compression of the spring member in background art. BB cross-sectional explanatory drawing of FIG. Plane explanatory drawing of the manufacturing method of the power converter device after support pin arrangement | positioning in background art. BB cross-sectional explanatory drawing of FIG. Plane | planar explanatory drawing of the power converter device in background art. BB cross-section explanatory drawing of FIG.

In the first invention and the second invention, examples of the power converter include a DC-DC converter and an inverter. Moreover, the said power converter device can be used for the production | generation of the drive current which supplies with electricity to the alternating current motor which is motive power sources, such as an electric vehicle and a hybrid vehicle, for example.
In addition, the said semiconductor module and the said cooling pipe may be closely_contact | adhered directly, and may be closely_contact | adhered via an insulating material etc.

In the first aspect of the invention, the engagement plate is located on both sides of the insertion opening in the width direction in a state in which the longitudinal direction of the engagement plate coincides with or substantially coincides with the width direction of the insertion opening. It is preferable to engage with the inner wall of the frame.
In the second aspect of the invention, the engagement plate is inserted from the outside of the frame in the posture in which the short direction of the engagement plate coincides with or substantially coincides with the width direction of the insertion opening. Through the frame.

Next, at least one of a static friction moment between the engagement plate and the spring member and a static friction moment between the spring member and the press contact plate is between the press contact plate and the semiconductor multilayer unit. Preferably, each static friction moment is a static friction moment around the rotation axis (claim 2).
In this case, when the engagement plate is rotated about the rotation shaft, the engagement plate is rotated while being slid between the engagement plate and the spring member or between the spring member and the pressure contact plate. be able to. Therefore, it can prevent that the said press-contacting board rotates with respect to the said semiconductor lamination unit. As a result, the pressure contact plate can be arranged at an accurate position at the end of the semiconductor multilayer unit, and the semiconductor multilayer unit can be pressed in a balanced manner by the pressing member.

  Further, by rotating at least one of the static friction moment between the engagement plate and the spring member and the static friction moment between the spring member and the pressure contact plate, the engagement plate is rotated. It is possible to suppress the momentary couple from being transmitted to the semiconductor stacked unit through the pressure contact plate. For this reason, it is possible to prevent an unreasonable stress from being generated in the semiconductor stacked unit other than the stacking direction.

The spring member is formed of a spiral coil spring, and at least one of a contact surface between the spring member and the pressure contact plate and a contact surface between the spring member and the engagement plate is in the stacking direction. Preferably, it is formed inside the outer peripheral edge of the spring member when viewed from above (Claim 3).
In this case, the static frictional moment can be reduced on at least one of the contact surface between the spring member and the pressure contact plate and the contact surface between the spring member and the engagement plate. That is, since at least one contact surface of the pressure contact plate and the engagement plate in the spring member can be formed at a position close to the rotation axis, the static friction moment can be reduced.
As a result, the engagement plate can be easily rotated, and the assembly work of the pressure member can be further facilitated.
Further, it is possible to further suppress transmission of a couple force when rotating the engagement plate to the semiconductor laminated unit via the pressure contact plate.

The spring member includes a leaf spring having a central curved portion that is curved so as to be convex in the stacking direction, and a pair of wing portions formed on both sides of the central curved portion. The central curved portion is brought into contact with one of the engagement plates, and the pair of wings are brought into contact with the other, and the contact portion between the central curved portion and the press contact plate or the engagement plate is the rotating shaft. It may be formed on top (Claim 4).
In this case, the contact portion is formed in the central curved portion, and the corresponding contact portion is disposed on the rotation shaft. Therefore, the contact portion forms a contact surface concentrated at a position close to the rotation shaft. Will be. Therefore, the static friction moment on the contact surface, that is, the static friction moment between the spring member and the press contact plate or the engagement plate can be effectively reduced.

Further, it is preferable that the spring member is connected to the pressure contact plate or the engagement plate in a state in which the spring member can be rotated around the rotation shaft at the central curved portion.
In this case, since the spring member and the pressure contact plate or the engagement plate can be integrated, the workability is improved when the pressure member is assembled to the power converter. Can do. Further, the connection does not hinder the rotation between the spring member and the pressure contact plate or the engagement plate.

Further, it is preferable that the spring member has the central curved portion in contact with the pressure contact plate and the pair of wing portions in contact with the engagement plate.
In this case, it becomes easy to use the long leaf spring as the spring member. That is, the static friction moment between the spring member and the press contact plate can be reduced by bringing the central curved portion into contact with the press contact plate. Therefore, when the engagement plate is rotated, it can be slid between the spring member and the pressure contact plate without sliding between the engagement plate and the spring member.

Accordingly, by keeping the longitudinal direction of the spring member (plate spring) coincident with the longitudinal direction of the engagement plate, the spring member and the engagement plate are pushed into the frame from the insertion opening of the frame, and the spring member is moved together with the engagement plate. The assembly procedure of rotating the can be easily realized. Therefore, even if the spring member is a long leaf spring, the pressure member can be easily assembled in the frame.
Since the spring member (leaf spring) can be made long, the stroke can be increased, and the dimensional tolerance in the stacking direction of the semiconductor stacked unit that can be absorbed by the pressure member can be increased.

Example 1
A power converter according to an embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 6, the power conversion device 1 of this example is a semiconductor stacked unit in which semiconductor modules 2 that constitute a part of a power conversion circuit and cooling tubes 3 that cool the semiconductor modules 2 are alternately stacked. 4 is accommodated in a frame 5.

At one end in the stacking direction X of the semiconductor stacking unit 4, a pressing member 6 that pressurizes the semiconductor stacking unit 4 in the stacking direction X is disposed.
The pressure member 6 is a pressure contact plate 61 that is in contact with the semiconductor lamination unit 4, and an engagement plate 62 that is rotatable about a rotation axis A parallel to the lamination direction X with respect to the pressure contact plate 61 and that engages the frame 4. And a spring member 63 that can be expanded and contracted in the stacking direction X, disposed between the pressure contact plate 61 and the engagement plate 62.

The frame 5 has an insertion opening 51 into which the engagement plate 62 can be inserted from the stacking direction X at a position facing one end of the semiconductor stacking unit 4 in the stacking direction X.
As shown in FIG. 2, the engagement plate 62 has a shape in which the dimension L in the longitudinal direction is larger than the width D of the insertion opening 51 and the dimension W in the short direction is smaller than the width D of the insertion opening 51. In this example, the engagement plate 62 has a rectangular shape when viewed from the stacking direction X. Note that this shape is not limited to a rectangle, and may be another shape having different dimensions depending on the orientation, such as an ellipse or an ellipse.

  The engagement plate 62 is engaged with the inner wall 52 of the frame 5 on both sides of the insertion opening 51 in the width direction, with at least the short direction of the engagement plate 62 intersecting the width direction of the insertion opening 51. In this example, as shown in FIGS. 6 and 7, the engagement plate 62 is attached to the inner wall 52 of the frame 5 in a state where the longitudinal direction of the engagement plate 62 coincides with or substantially coincides with the width direction of the insertion opening 51. Is engaged.

As shown in FIG. 6, the semiconductor lamination unit 4 is formed by alternately laminating the semiconductor modules 2 and the cooling pipes 3. The semiconductor module 2 includes a switching element such as an IGBT and a diode such as an FWD (not shown).
The plurality of cooling pipes 3 are long in a direction perpendicular to the stacking direction X, and adjacent cooling pipes 3 can be deformed at both ends in the longitudinal direction (hereinafter, this direction is appropriately referred to as “lateral direction Y”). The cooler 30 is configured by being connected by the connecting pipe 32. The cooler 30 has both ends in the lateral direction Y in the cooling pipe 3 arranged at one end in the stacking direction X (hereinafter, referred to as “front end” where appropriate, and the opposite end as “rear end”). A refrigerant introduction pipe 331 and a refrigerant discharge pipe 332 connected to each other. The cooler 30 is made of aluminum or an alloy thereof.

  Thereby, the cooling medium introduced from the refrigerant introduction pipe 331 passes through the connection pipe 32 as appropriate, is distributed to the respective cooling pipes 3 and circulates in the longitudinal direction (lateral direction Y). The cooling medium exchanges heat with the semiconductor module 2 while flowing through each cooling pipe 3. The cooling medium whose temperature has been increased by heat exchange passes through the downstream connecting pipe 32 as appropriate, is led to the refrigerant discharge pipe 332, and is discharged from the cooler 30.

  Examples of the cooling medium include natural refrigerants such as water and ammonia, water mixed with ethylene glycol-based antifreeze, fluorocarbon refrigerants such as fluorinate, chlorofluorocarbon refrigerants such as HCFC123 and HFC134a, and alcohol-based alcohols such as methanol and alcohol. A refrigerant such as a refrigerant or a ketone-based refrigerant such as acetone can be used.

  The frame 5 has openings on both sides in the height direction orthogonal to both the stacking direction X and the lateral direction Y, and the shape viewed from the height direction has a substantially rectangular shape. Then, as shown in FIG. 7, an insertion opening 51 formed over the entire height direction is disposed on the rear wall 53 constituting one side of the rectangular shape. The insertion opening 51 is formed at the center position in the lateral direction Y of the rear wall 53. Further, the insertion opening 51 opens toward the center in the lateral direction Y of the semiconductor multilayer unit 4.

  The power conversion device 1 can be configured as a case serving as an outer shell by covering the both sides of the frame 5 in the height direction, and the components together with the frame 5 are accommodated in a separately prepared case. It can also be configured. That is, in the former case, the frame 5 is a part of the case, and in the latter case, the frame 5 is accommodated inside the case.

The front end 41 of the semiconductor multilayer unit 4 is in contact with the inner wall of the front wall portion 54 in the frame 5.
The refrigerant introduction pipe 331 and the refrigerant discharge pipe 332 are disposed in a recess provided in the front wall portion 54 of the frame 5 and project outside the frame 5.

  The pressure contact plate 61 and the engagement plate 62 in the pressure member 6 are made of, for example, carbon steel and have sufficient rigidity. The pressure contact plate 61 is in surface contact with the cooling pipe 3 at the rear end 42 of the semiconductor multilayer unit 4 in a wide range. Thereby, the pressurizing member 6 is prevented from pressing the cooling pipe 3 locally, and the deformation of the cooling pipe 3 is prevented.

  Moreover, the spring member 63 in the pressurizing member 6 is formed of a coil spring formed in a spiral shape. That is, the spring member 63 is formed by spirally winding a metal wire having a rectangular cross section made of, for example, a spring steel material. The diameter of the spring member 63 is smaller than the width D of the insertion opening 51 and is not more than the dimension W in the short direction of the engagement plate 62.

  The spring member 63 is disposed such that the winding center axis thereof coincides with the rotation axis A. In addition, one end (front end) of the spring member 63 contacts the pressure contact plate 61, and the other end (rear end) contacts the engagement plate 62. As shown in FIG. 8, the pressure contact plate 61 is formed with a core 611 protruding from the inside of the spring member 63, and a direction perpendicular to the stacking direction X between the pressure contact plate 61 and the spring member 63. The shift is prevented.

Further, as shown in FIGS. 8 to 10, the contact surface 631 between the spring member 63 and the pressure contact plate 61 is located on the inner side, particularly on the inner periphery, of the outer peripheral edge 632 of the spring member 63 when viewed from the stacking direction X. Is formed. In order to form such a state, for example, as shown in FIG. 8, an annular relief groove 612 is provided on the surface of the pressure contact plate 61 that faces the spring member 63, and the spring member 63 is partly on the inner peripheral side. Only the contact surface 631 with the pressure contact plate 61 can be formed. Alternatively, as shown in FIG. 9, a curved or tapered chamfered portion 633 is formed on the outer peripheral edge of the front end surface of the spring member 63, so that only a part of the inner peripheral side of the curved surface or the tapered contact portion 61 is connected to the press contact plate 61. The contact surface 631 can also be formed.
A configuration similar to this configuration can also be formed between the spring member 63 and the engagement plate 62. Alternatively, this configuration may be employed both between the spring member 63 and the pressure contact plate 61 and between the spring member 63 and the engagement plate 62.

The static friction moment M2 between the spring member 63 and the press contact plate 61 is smaller than the static friction moment M1 between the press contact plate 61 and the semiconductor laminated unit 4. In this specification, the “static friction moment” means a static friction moment around the rotation axis A.
The static friction moment M3 between the engagement plate 62 and the spring member 63 may be smaller than the static friction moment M1. That is, the static friction moments M1, M2, and M3 only need to satisfy at least M1> M2 or M1> M3, and may satisfy M1> M2 and M1> M3.

Next, a method for manufacturing the power conversion device of this example will be described with reference to FIGS.
First, as shown in FIG. 1, the semiconductor multilayer unit 4 is arranged on the frame 5 so that the rear end 42 of the semiconductor multilayer unit 4 faces the insertion opening 51. The pressure contact plate 61 is disposed at the rear end 42 of the semiconductor multilayer unit 4 in the frame 5, and the spring member 63 is inserted and disposed inside the insertion opening 51.

  Thereafter, as shown in FIG. 2, the engagement plate 62 disposed at the rear end of the spring member 63 in a posture in which the longitudinal direction of the engagement plate 62 intersects the width direction of the insertion opening 51 is arranged in the frame 5 as shown in FIG. 3. Is pushed from the outside toward the semiconductor multilayer unit 4 so as to be inserted into the frame 5 through the insertion opening 51. Thereby, the spring member 63 is compressed and deformed. During this operation, in this example, the short direction of the engagement plate 62 is made to coincide with the width direction of the insertion opening 51.

As shown in FIG. 3, when the engagement plate 62 is pushed inward from the inner wall 52 of the frame 5 on both sides in the width direction of the insertion opening 51, the engagement plate 62 is moved to the frame 5 as shown in FIGS. Is rotated by 90 ° about the rotation axis A (arrow R). Thereby, the longitudinal direction of the engagement plate 62 is made to coincide with the width direction of the insertion opening 51 of the frame 5.
Next, as shown in FIGS. 6 and 7, the engagement plate 62 is engaged with the inner wall 52 by releasing the pushing force of the engagement plate 62 and restoring the spring member 63.
As described above, the semiconductor multilayer unit 4 can be held in the frame 5 while maintaining the state in which the semiconductor multilayer unit 4 is pressed in the stacking direction X by the pressure member 6.

  As described above, when the engagement plate 62 is rotated, at least one of the contact surface between the spring member 63 and the pressure contact plate 61 and the contact surface between the spring member 63 and the engagement plate 62 is rotated. Each member slides and rotates, and the pressure contact plate 61 does not rotate with respect to the semiconductor laminated unit 4.

Next, the function and effect of this example will be described.
The power conversion device 1 has an insertion opening 51 at a position facing the one end (rear end 42) in the stacking direction X of the semiconductor stacked unit 4 in the frame 5. The pressure member 6 includes an engagement plate 62 having a shape in which the dimension L in the longitudinal direction is larger than the width D of the insertion opening 51 and the dimension W in the short direction is smaller than the width D of the insertion opening 51. . Therefore, as described above, when the pressure member 6 is disposed at one end (rear end 42) in the stacking direction X of the semiconductor stacked unit 4, the spring member 63 is compressed from the outside of the frame 5 toward the semiconductor stacked unit 4. (FIGS. 1 and 3).

Therefore, it is not necessary to arrange a pressing jig (not shown) for pressing the pressing member 6 in the frame 5. In other words, there is no need to provide a space for placing the pressing jig in the frame 5.
In addition, since the pressurizing member 6 can also hold the pressing force to the semiconductor laminated unit 4 by engaging the engaging plate 62 with the frame 5, a support pin (see reference numeral 97 in FIGS. 18 to 21) or the like can be used. It is not necessary to arrange in the frame 5.
As a result, the frame 5 can be easily downsized, and the power converter 1 can be easily downsized.

And as above-mentioned, in the arrangement | positioning of the pressurization member 6 to the power converter device 1, since it can carry out by pushing in of the engagement board 62 to the lamination direction X, and rotation of the engagement board 62, an assembly man-hour is carried out. Can be reduced. As a result, it is possible to obtain the power conversion device 1 that is excellent in productivity.
Further, as described above, since the spring member 6 can be compressed from the outside of the frame 5 toward the semiconductor multilayer unit 4, the assembly workability is improved from the viewpoint of easily pressing the semiconductor multilayer unit 4 in a balanced manner. Can be made.

  As described above, according to this example, it is possible to provide a power conversion device that is easy to downsize and has excellent productivity, and a method for manufacturing the power conversion device.

(Example 2)
In this example, as shown in FIGS. 11 to 13, the spring member 63 of the pressurizing member 6 is formed on a central curved portion 634 that is curved so as to be convex in the stacking direction X, and on both sides of the central curved portion 634. It is an example of the power converter device 1 comprised with the leaf | plate spring which has a pair of wing | blade part 635.
As shown in FIG. 12, the central curved portion 634 is brought into contact with the pressure contact plate 61 and the pair of wing portions 635 are brought into contact with the engagement plate 62. A contact portion 636 between the central curved portion 634 and the pressure contact plate 61 is formed on the rotation axis A.

The spring member 63 has an elongated shape, and is provided with a central curved portion 634 at the center in the longitudinal direction, and a pair of wing portions 635 are provided on both sides of the central curved portion 634 in the longitudinal direction.
Further, as shown in FIG. 13, the spring member 63 is connected to the press contact plate 61 and the central bending portion 634 in a state of being rotatable with respect to each other about the rotation axis A. That is, in the contact portion 636, the coupling pin 64 is loosely fitted in the through holes respectively formed in the spring member 63 and the press contact plate 61, so that the spring can be rotated around the rotation axis A. The member 63 and the press contact plate 61 are connected.

In manufacturing the power conversion device 1 of this example, first, the semiconductor laminated unit 4 is arranged in the frame 5 and the pressure member 6 is arranged at the rear end 42 of the semiconductor laminated unit 4 as in the first embodiment. To do.
When the pressing member 6 is disposed at the rear end 42 of the semiconductor laminated unit 4, as shown in FIG. 11, the spring member 63 and the engaging plate 62 are aligned with each other in the longitudinal direction, and the short direction is inserted. The pressure contact plate 61 is brought into contact with the rear end 42 of the semiconductor multilayer unit 4 in a state where the opening 51 is aligned with the width direction of the opening 51. A part of the spring member 63 is disposed inside the insertion opening 51.

Next, the spring plate 63 is compressed and deformed by pushing the engagement plate 62 toward the semiconductor laminated unit 4 side. The engaging plate 62 is rotated together with the spring member 63 when the engaging plate 62 is pushed inward from the inner walls 52 on both sides of the insertion opening 51 in the frame 5. Thereby, the longitudinal directions of the engagement plate 62 and the spring member 63 are made to coincide with the width direction of the insertion opening 51.
Next, by releasing the pushing force of the engagement plate 62, the spring member 63 is restored, and the engagement plate 62 is engaged with the pair of inner walls 52 of the frame 5 as shown in FIG.
The power converter device 1 of this example is obtained by the above.
Others are the same as in the first embodiment.

  In the case of this example, since the contact portion 636 is formed in the central curved portion 634 and the contact portion 636 is disposed on the rotation axis A, the contact portion 636 is concentrated at a position close to the rotation axis A. Will form the contact surface. Therefore, the static friction moment on the contact surface, that is, the static friction moment M2 between the spring member 63 and the press contact plate 61 can be effectively reduced.

  Further, the spring member 63 is connected to the press contact plate 61 and the central bending portion 634 in a state of being rotatable with respect to each other about the rotation axis A. Thereby, since the spring member 63 and the press-contacting plate 61 can be integrated, the workability | operativity can be improved in the assembly | attachment operation | work of the pressurization member 6 to the power converter device 1. FIG. Further, the above connection does not hinder the rotation between the spring member 63 and the press contact plate 61.

As shown in FIG. 12, the spring member 6 has the central curved portion 634 in contact with the pressure contact plate 61 and the pair of wing portions 635 in contact with the engagement plate 62. That is, the spring member 63 is arranged in a direction in which the convex side of the central bending portion 634 is on the pressure contact plate 61 side.
Therefore, it becomes easy to use a long leaf spring as the spring member 63. That is, by bringing the central curved portion 634 into contact with the press contact plate 61, the static friction moment M2 between the spring member 63 and the press contact plate 61 can be reduced. Therefore, when the engagement plate 62 is rotated, it can be slid between the spring member 63 and the pressure contact plate 61 without sliding between the engagement plate 62 and the spring member 63.

Thus, as described above, the spring member 63 and the engagement plate 62 are moved from the insertion opening 51 of the frame 5 to the frame by keeping the longitudinal direction of the spring member (plate spring) 63 in line with the longitudinal direction of the engagement plate 62. 5 can be easily realized by pushing inward 5 and rotating the spring member 63 together with the engagement plate 62. Therefore, even if the spring member 63 is a long leaf spring, the pressing member 6 can be easily assembled in the frame 5.
Since the spring member (leaf spring) 63 can be made long, the stroke can be increased, and the dimensional tolerance in the stacking direction X of the semiconductor stacked unit 4 that can be absorbed by the pressing member 6 is increased. be able to.
In addition, the same effects as those of the first embodiment are obtained.

In the first and second embodiments, the example in which the pressure member 6 is disposed at the rear end 42 side of the semiconductor multilayer unit 4 is shown. However, the pressure member 6 is disposed at the semiconductor multilayer unit 4. It can also be the front end 41 side.
Further, as the spring member 63, a member other than the coil spring and the leaf spring shown in the first and second embodiments can be used.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Semiconductor module 3 Cooling tube 4 Semiconductor lamination | stacking unit 5 Frame 51 Insertion opening part 52 Inner wall 6 Pressure member 61 Pressure contact plate 62 Engagement plate 63 Spring member A Rotating shaft D Width of insertion opening L Length direction of engagement plate Dimensions W Dimension of engagement plate in short direction

Claims (7)

A power conversion device in which a semiconductor laminated unit formed by alternately laminating a semiconductor module constituting a part of a power conversion circuit and a cooling pipe for cooling the semiconductor module is housed in a frame,
At one end in the stacking direction of the semiconductor stacking unit, a pressure member that pressurizes the semiconductor stacking unit in the stacking direction is disposed,
The pressure member includes a pressure contact plate that contacts the semiconductor lamination unit, an engagement plate that is rotatable about a rotation axis parallel to the stacking direction with respect to the pressure contact plate and that engages with the frame, and A spring member that is arranged between the pressure contact plate and the engagement plate and that can expand and contract in the stacking direction;
The frame has an insertion opening for inserting the engagement plate from the stacking direction at a position facing one end of the stacking direction of the semiconductor stacking unit,
The engagement plate has a shape in which the dimension in the longitudinal direction is larger than the width of the insertion opening, and the dimension in the short direction is smaller than the width of the insertion opening,
The engagement plate is engaged with the inner wall of the frame on both sides in the width direction of the insertion opening in a state where at least the short direction of the engagement plate intersects the width direction of the insertion opening. Power converter.   2. The power converter according to claim 1, wherein at least one of a static friction moment between the engagement plate and the spring member and a static friction moment between the spring member and the pressure contact plate is the pressure contact plate. And the semiconductor laminated unit is smaller than the static friction moment, and each static friction moment is a static friction moment around the rotation axis.   The power conversion device according to claim 2, wherein the spring member is formed of a spiral coil spring, a contact surface between the spring member and the pressure contact plate, and a contact surface between the spring member and the engagement plate. Is formed inside the outer peripheral edge of the spring member when viewed from the stacking direction.   3. The power conversion device according to claim 2, wherein the spring member includes a central curved portion that is curved so as to be convex in the stacking direction, and a pair of wing portions that are formed on both sides of the central curved portion. The central curved portion is abutted against one of the pressure contact plate and the engagement plate, and the pair of wing portions is abutted with the other. The central curved portion and the pressure contact plate or the engagement plate The abutment portion is formed on the rotating shaft.   5. The power conversion device according to claim 4, wherein the spring member is connected to the pressure contact plate or the engagement plate and the central bending portion so as to be rotatable with respect to each other about the rotation shaft. A power converter.   6. The power conversion device according to claim 4, wherein the spring member has the central curved portion in contact with the pressure contact plate and the pair of wing portions in contact with the engagement plate. Power converter. A method for manufacturing the power conversion device according to any one of claims 1 to 6,
The semiconductor multilayer unit is disposed on the frame such that one end of the semiconductor multilayer unit in the stacking direction faces the insertion opening, and the pressure contact plate is disposed in the frame in the stacking direction of the semiconductor multilayer unit. And after the spring member is inserted and arranged inside the insertion opening,
The engagement plate disposed at one end of the spring member is inserted into the frame from the outside of the frame through the insertion opening with at least the longitudinal direction of the engagement plate intersecting the width direction of the insertion opening. So as to compress and deform the spring member by pushing toward the semiconductor laminated unit
When the engagement plate is pushed inward from the inner wall of the frame on both sides in the width direction of the insertion opening, the engagement plate is rotated around the rotation axis with respect to the frame,
Next, the pushing force of the engagement plate is released to restore the spring member, whereby the engagement plate is engaged with the inner wall.

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