JP2009027805A - Power conversion device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power conversion device excellent in manufacturing cost and manufacturing efficiency, in which a pressurizing member for pressurizing a semiconductor stacked unit can be easily arranged with a small force, and also to provide its production method. <P>SOLUTION: There is disclosed a manufacturing method for a power conversion device 1 having a semiconductor stacked unit 2 obtained by alternately stacking a semiconductor module 21 and a cooling pipe 22. After the semiconductor stacked unit 2 is arranged on the housing 11 of the power conversion device 1, a pressurizing member 3 with an abutting plate 31 and a spring member 32 is arranged at one end in the stacking direction of the semiconductor stacked unit 2. The spring member 32 has a press part 321 and a support part 322. A press tool 4 is abutted on a pair of spring ends 323 further outside than the support part 322 of the spring member 32 to push the spring end 323 in the abutting plate 31 side to arrange a pair of support bodies (support pines 13) with the spring member 32 elastically deformed. Then, the press tool 4 is retreated to support the support part 322 with the support body. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a power conversion device having a semiconductor stacked unit in which semiconductor modules constituting a part of a power conversion circuit and cooling pipes for cooling the semiconductor modules are alternately stacked, and a method for manufacturing the same.

Conventionally, a power conversion circuit such as a DC-DC converter circuit or an inverter circuit is sometimes used to generate a drive current for energizing an AC motor that is a power source of an electric vehicle or a hybrid vehicle.
In general, in an electric vehicle, a hybrid vehicle, and the like, a large driving current is required to secure a large driving torque from an AC motor. Therefore, in the power conversion circuit that generates the drive current for the AC motor, heat generated from the semiconductor module including the power semiconductor element such as IGBT constituting the power conversion circuit tends to increase.

  Therefore, as shown in FIG. 15, a large number of cooling pipes 922 are interposed between a pair of headers 923 that supply and discharge the cooling medium so that the plurality of semiconductor modules 921 constituting the power conversion circuit can be uniformly cooled. Has been proposed (see Patent Documents 1 and 2). The power conversion device 9 includes a semiconductor laminated unit 92 having a semiconductor module 921 sandwiched between cooling pipes 922, and a spring that pressurizes the semiconductor laminated unit 92 in the lamination direction at an end portion of the semiconductor laminated unit 92 in the lamination direction. Member 932.

  The spring member 932 includes a pressing portion 934 that is curved in a convex state toward the semiconductor multilayer unit 92, and support portions 933 formed at both ends of the pressing portion 934. The support portion 933 is locked to a support pin 913 disposed in the housing 911 of the power conversion device 9, and the spring member 932 presses the cooling pipe 922 and the semiconductor module 921 in the stacking direction at the pressing portion 934. It is arranged in such a biased state. The support pin 913 is disposed in a state of being sandwiched between the inner wall 912 of the casing 911 and the support portion 933 of the spring member 932.

In assembling the power conversion device 9, the semiconductor stacked unit 92 is disposed in the housing 911 of the power conversion device 9, and then the spring member 932 is disposed at the end of the semiconductor stacked unit 92 in the stacking direction. Next, the semiconductor stacked unit 92 is pressed in the stacking direction at the pressing portion 934 of the spring member 932 while the spring member 932 is displaced (elastically deformed). And the support pin 913 is arrange | positioned in the housing | casing 911 in the back position of the support part 933 of the spring member 932. FIG.
Next, the support member 933 of the spring member 932 is supported by the support pin 913 while restoring the spring member 932 in the pressure reducing direction. Thereby, the spring member 932 is settled in a state where a predetermined pressing force is applied to the semiconductor lamination unit 92 at a predetermined displacement.

  Here, when the spring member 932 is elastically deformed, as shown in FIG. 16, the pressing jig 40 is brought into contact with the rear surfaces inside the pair of support portions 933 to press the spring member 932 toward the semiconductor laminated unit 92 side. Push the tool 40 in. Then, the pair of support pins 913 are arranged in the housing 911 behind the pair of support portions 933 and on both sides of the pressing jig 40. That is, since it is necessary to dispose the support pin 913 on the housing 911 while the spring member 932 is being pressed by the pressing jig 40, the pressing jig 40 is disposed inside thereof, that is, inside the support portion 933. It is brought into contact with the spring member 932.

  However, if the pressing jig 40 is brought into contact with the spring member 932 inside the support portion 933 to elastically deform the spring member 932, it is necessary to apply a load larger than the load at the support portion 933. As a result, in the step of disposing the spring member 932, an excessive load is applied to the semiconductor laminated unit 92, and in some cases, the cooling pipe 922 is deformed or the semiconductor module 921 is damaged. There is a risk. In addition, in the step of arranging the spring member 932, there is a problem that a high specification is required for a load cell, a servo motor, or the like used when pressing the pressing jig 40.

  In addition, since the semiconductor lamination unit 92 is formed by alternately laminating a plurality of semiconductor modules 921 and a plurality of cooling pipes 922, the dimensional tolerance (lamination tolerance) in the laminating direction is the same as the dimensional tolerance of each semiconductor module 921. This is an integrated value with the dimensional tolerance of the cooling pipe 922 and may be a large value. Therefore, it is necessary to apply an appropriate pressing force by the spring member 932 to any semiconductor lamination unit 91 within the lamination tolerance.

  However, as described above, when the pressing jig 40 is brought into contact with the spring member 932 on the inner side of the support portion 933 and the spring member 932 is elastically deformed, the spring member 932 has a resistance against a change in load caused by the pressing jig 40. Since the displacement amount is small, if the stacking tolerance of the semiconductor stack unit 92 is large, it becomes difficult to apply an appropriate pressing force to the semiconductor stack unit 92. As a result, it is necessary to prepare various types of support pins 913 having different diameters as the support pins 913 for supporting the support portions 932 of the spring members 932 according to the dimensions of the semiconductor stack unit 92 in the stacking direction. Therefore, there are problems that the manufacturing cost increases and the production efficiency decreases.

JP 2005-143244 A JP 2007-166819 A

  The present invention has been made in view of such conventional problems, and can easily dispose the pressurizing member for pressurizing the semiconductor laminated unit with a small force, and has excellent manufacturing cost and production efficiency. It is an object of the present invention to provide a conversion device and a manufacturing method thereof.

1st invention is the method of manufacturing the power converter device which has a semiconductor lamination unit which laminates | stacks alternately the semiconductor module which comprises some power conversion circuits, and the cooling pipe which cools this semiconductor module, ,
After arranging the semiconductor laminated unit in the casing of the power converter,
A contact plate having a contact surface that contacts the main surface of the cooling pipe at one end in the stacking direction of the semiconductor stacked unit, and a spring disposed on a surface of the contact plate opposite to the contact surface A pressure member having a member,
The spring member has a pressing portion curved in a convex state toward the contact plate side, and support portions formed at both ends of the pressing portion,
In a state where the spring member is elastically deformed by bringing a pressing jig into contact with a pair of spring end portions outside the support portion of the spring member and pushing the spring end portion toward the contact plate. A pair of support bodies are disposed in the housing at a rear position of the pair of support parts,
Next, the support body is sandwiched between the support portion and the inner wall of the housing by moving the pair of support portions in a direction in which the spring member is restored by retracting the pressing jig. In the method of manufacturing a power converter, the support portion is supported by the support body (claim 1).

Next, the effects of the present invention will be described.
In the method for manufacturing the power conversion device, when the pressure member is attached to the casing, a pressing jig is brought into contact with a pair of spring end portions outside the support portion of the spring member, and the spring end The spring member is elastically deformed by pushing the portion toward the contact plate. That is, the spring member is elastically deformed by pressing the spring end with a pressing jig. Thereby, the spring member can be greatly elastically deformed with a relatively small load. That is, the spring member can be greatly elastically deformed with a small load as compared with a case where the pressing is performed at a portion inside the support portion.

  Therefore, in the process of disposing the pressure member, the pressing force by the pressing jig is reduced to prevent an excessive load from being applied to the semiconductor laminated unit, and there is a risk of deformation of the cooling pipe or damage of the semiconductor module. Can be eliminated. Also, there is an advantage that a particularly high specification is not required for a load cell, a servo motor, or the like used when pressing the pressing jig in the spring member arranging step.

  In addition, since the semiconductor lamination unit is formed by alternately laminating a plurality of semiconductor modules and a plurality of cooling pipes, the dimensional tolerance in the lamination direction (lamination tolerance) is the dimensional tolerance of each semiconductor module and the dimension of each cooling pipe. It becomes an integrated value with tolerance and may be large. Therefore, it is necessary to allow an appropriate pressing force to be applied by a spring member to any semiconductor laminated unit within this lamination tolerance.

  In the present invention, as described above, the pressing jig is brought into contact with the spring end on the outer side of the support portion, and the spring member is elastically deformed. Therefore, the amount of displacement of the spring member with respect to the change in load by the pressing jig is increased. be able to. Therefore, even if the stacking tolerance of the semiconductor stacked unit is large, it becomes easy to apply an appropriate pressing force to the semiconductor stacked unit. That is, when the dimension in the stacking direction of the semiconductor stacked unit is small, the pressing force applied to the spring member is made relatively small, and the amount of elastic deformation of the spring member is reduced. On the other hand, when the dimension in the stacking direction of the semiconductor stacked unit is large, the pressing force applied to the spring member is made relatively large to increase the amount of elastic deformation of the spring member. At this time, the elastic force of the spring member does not become too small, and the pressing force by the pressing jig can be prevented from becoming too large.

  As a result, it is not necessary to prepare many types of support bodies having different sizes as support bodies for supporting the support portions of the spring members in accordance with the dimensions in the stacking direction of the semiconductor stacked units. That is, it is possible to cope with the dimension in the stacking direction of the semiconductor stacked unit by using a small number of support bodies. Therefore, the manufacturing cost can be reduced and the production efficiency can be improved.

  As described above, according to the present invention, it is possible to easily dispose the pressurizing member that pressurizes the semiconductor lamination unit with a small force, and to provide a method for manufacturing a power conversion device that is excellent in manufacturing cost and production efficiency. can do.

A second invention is a power conversion device having a semiconductor lamination unit in which a semiconductor module constituting a part of a power conversion circuit and a cooling pipe for cooling the semiconductor module are alternately laminated,
A pressure member that pressurizes the semiconductor lamination unit in the lamination direction is disposed at one end in the lamination direction of the semiconductor lamination unit,
The pressurizing member includes a contact plate having a contact surface that contacts the main surface of the cooling pipe, and a spring member disposed on a surface of the contact plate opposite to the contact surface,
The spring member has a pressing portion curved in a convex state toward the contact plate side, and support portions formed at both ends of the pressing portion,
The spring member is configured such that the support portion is supported by a pair of support bodies interposed between an inner wall of the casing of the power converter and the support portion, and the pressing portion is contacted by the contact plate. , Arranged in a biased state so as to press the contact plate in a direction away from the support body,
The spring member has a pair of spring ends arranged outside the support body,
A power conversion device satisfying A ≧ 1.22B, where A is a distance between the pair of spring ends in the natural length and B is a distance between the pair of support portions in the natural length. (Claim 4).

Next, the effects of the present invention will be described.
The said spring member has arrange | positioned a pair of spring edge part outside the said support body. The distance A between the pair of spring end portions and the distance B between the pair of support portions satisfy A ≧ 1.22B. For this reason, the pair of spring end portions are arranged sufficiently outside the arrangement position of the support body. As a result, when a pressure member is disposed and pressed at one end of the semiconductor laminated unit, even if some dimensional tolerance or misalignment occurs, the pair of spring ends are pressed against each other without interfering with the support body. A tool can be made to contact reliably. Accordingly, the pair of spring end portions can be reliably pressed toward the contact plate by the pressing jig.

Therefore, as described above, in the step of disposing the pressure member, the pressing force by the pressing jig is reduced to prevent an excessive load from being applied to the semiconductor laminated unit, and the deformation of the cooling pipe and the semiconductor module The risk of damage can be eliminated. Also, there is an advantage that a particularly high specification is not required for a load cell, a servo motor, or the like used when pressing the pressing jig in the spring member arranging step.
Furthermore, there is no need to prepare multiple types of bearings with different diameters as the bearings for supporting the spring member bearings according to the dimensions of the semiconductor lamination unit in the direction of lamination, reducing manufacturing costs and improving production efficiency. Can be made.

  As described above, according to the present invention, it is possible to easily dispose the pressurizing member that pressurizes the semiconductor lamination unit with a small force, and to provide a power conversion device that is excellent in manufacturing cost and production efficiency. it can.

In the first invention (invention 1) and the second invention (invention 4), examples of the power converter include a DC-DC converter and an inverter. Moreover, the said power converter device can be used for the production | generation of the drive current which supplies with electricity to the alternating current motor which is motive power sources, such as an electric vehicle and a hybrid vehicle, for example.
In addition, the said semiconductor module and the said cooling pipe may be closely_contact | adhered directly, and may be closely_contact | adhered via an insulating material etc.
Further, in the present specification, unless otherwise specified, the direction in which the semiconductor stacked unit is pressed will be described as the front, and the opposite will be described as the rear.

Moreover, it is preferable that the said spring member provides a curved surface in the corner | angular part between the said bearing body side surface and end surface in the said spring end part (Claim 2, 5).
In this case, the pressing jig can be stably brought into contact with the spring end, and the spring member can be elastically deformed more reliably.

Preferably, the spring member is provided with a bent portion that is bent so as to protrude toward the support body between the support portion and the spring end portion (claims 3 and 6).
Also in this case, the pressing jig can be stably brought into contact with the spring end portion, and the spring member can be elastically deformed more reliably.

Example 1
A power converter according to an embodiment of the present invention and a manufacturing method thereof will be described with reference to FIGS.
As shown in FIG. 3, the power conversion device 1 of this example is a semiconductor stacked unit formed by alternately stacking semiconductor modules 21 constituting a part of a power conversion circuit and cooling pipes 22 for cooling the semiconductor modules 21. 2

A pressure member 3 that pressurizes the semiconductor multilayer unit 2 in the stacking direction is disposed at one end of the semiconductor stack unit 2 in the stacking direction.
The pressurizing member 3 includes a contact plate 31 having a contact surface 311 that contacts the main surface of the cooling pipe 22, and a spring member 32 disposed on the surface of the contact plate 31 opposite to the contact surface 311. Have.

As shown in FIGS. 2 to 4, the spring member 32 includes a pressing portion 321 that is curved in a convex state toward the contact plate 31, and support portions 322 formed at both ends of the pressing portion 321.
As shown in FIGS. 3 and 4, the spring member 32 supports the support portion 322 on a support pin 13 as a pair of support bodies interposed between the inner wall 111 of the casing 11 of the power conversion device 1 and the spring member 32. The pressing portion 321 is brought into contact with the contact plate 31 and is arranged in a state of being urged so as to press the contact plate 31 in a direction away from the support pin 13.
The spring member 32 has a pair of spring end portions 323 arranged outside the support pin 13.

As shown in FIG. 4, when A is the distance between the pair of spring ends 323 in the natural length and B is the distance between the pair of support portions 322 in the natural length, A ≧ 1.22B is satisfied. . Here, the distance B between the pair of support portions 322 refers to the distance between the centers of the contact portions of the support pin 13 and the support portion 322. Note that the dimensions A and B described in FIG. 4 indicate the length in a free state where no load is applied to the spring member 32. The same applies to dimensions A and B in FIG.
The pair of support pins 13 has a cylindrical shape.

  2 and 4, the spring member 32 is formed by laminating a plurality of leaf springs. That is, the spring member 32 includes a front leaf spring 33 that abuts against the abutment plate 31 and a rear leaf spring 34 disposed behind the front leaf spring 33. The front leaf spring 33 is in contact with the rear leaf spring 34 at least at both end portions 331 of the front leaf spring 33. The front leaf spring 33 and the rear leaf spring 34 are fastened to each other by rivets (not shown).

  The rear leaf spring 34 is curved in a large arc shape at the center, and both end portions in the length direction are curved in a small arc shape. The front leaf spring 33 is curved in an arc shape, and its radius of curvature is slightly smaller than the radius of curvature of the arc at the center of the rear leaf spring 34. And the front leaf | plate spring 33 is arrange | positioned so that it may overlap with the front of the center part of the back leaf | plate spring 34. FIG. As a result, the front leaf spring 33 abuts against the rear leaf spring 34 at both end portions 331 thereof.

Further, the contact plate 31 has a flat contact surface 311 that can come into surface contact with the main surface of the cooling pipe 22 disposed at the end of the semiconductor stacking unit 2 in the stacking direction.
The contact plate 31 and the spring member 32 are both made of a metal such as carbon tool steel (SK85, old SK5).

  Further, as shown in FIG. 3, the pressing member 3 causes the central pressing portion 321 of the spring member 32 to contact the contact plate 31, and the contact surface 311 of the contact plate 31 contacts the semiconductor stacked unit 2. In this state, it is assembled in the power conversion device 1. In addition, the support portion 322 of the spring member 32 is locked to the two support pins 13 arranged in the housing 11 of the power conversion device 1. The support pin 13 is sandwiched between the support portion 322 of the spring member 32 and the inner wall 111 of the housing 11. And the spring member 32 is arrange | positioned in the press part 321 of the center part in the state urged | biased so that the semiconductor lamination unit 2 may be pressed in the lamination direction via the contact plate 31. FIG.

  In addition, as shown in FIG. 3, the semiconductor laminated unit 2 includes a plurality of cooling pipes 22 so as to sandwich the semiconductor module 21 from both sides. That is, the cooling pipes 22 and the semiconductor modules 21 are alternately stacked. Each cooling pipe 22 is a flat pipe having a coolant channel (not shown) provided therein. For example, natural refrigerants such as water and ammonia, water mixed with ethylene glycol antifreeze, fluorocarbon refrigerants such as fluorinate, chlorofluorocarbon refrigerants such as HCFC123 and HFC134a, and alcohols such as methanol and alcohol. A cooling medium such as a refrigerant and a ketone-based refrigerant such as acetone can be circulated.

  The cooler 220 is formed by connecting the both ends of a plurality of cooling pipes 22 with connecting pipes 222 to form two header portions 223. In addition, a refrigerant inlet 224 and a refrigerant outlet 225 connected to the cooling pipe 22 disposed at one end of the semiconductor laminated unit 2 are provided at the ends of the two header portions 223, respectively. is there.

The cooling pipe 22, the connecting pipe 222, the refrigerant inlet 224 and the refrigerant outlet 225 constitute an aluminum cooler 220.
The semiconductor modules 21 are sandwiched between two adjacent cooling pipes 22 in the cooler 220 in a state where two semiconductor modules 21 are arranged in parallel. The semiconductor module 21 has heat radiating plates exposed on both surfaces, and the heat radiating plate and the main surface 221 of the flat cooling pipe 22 are brought into close contact with each other so that heat can be exchanged between them. ing.
In the cooler 220, for example, the connection pipe 222 is formed in a bellows shape, or a diaphragm portion is provided in an attachment portion between the connection pipe 222 and the cooling pipe 22, so that the interval between the adjacent cooling pipes 22 is increased to some extent. It is configured so that it can be changed.

Next, a method for manufacturing the power conversion device of this example will be described.
First, the semiconductor multilayer unit 2 is arranged in the housing 11 of the power conversion device 1.
Next, as shown in FIG. 1, a pressure member 3 having a contact plate 31 and a spring member 32 is disposed at one end in the stacking direction of the semiconductor stacked unit 2.

Next, the pressing jig 4 is brought into contact with the pair of spring end portions 323 in the spring member 32, and the spring end portion 323 is pushed into the contact plate 31 side. Thus, the pair of support pins 13 is disposed in the housing 11 at a position behind the pair of support portions 322 with the spring member 32 elastically deformed.
Next, the pressing pin 4 is moved backward to displace the pair of support portions 322 in the direction in which the spring member 32 is restored, whereby the support pin 13 is sandwiched between the support portion 322 and the inner wall 111 of the housing 11. In this state, the bearing pins 13 are supported.
As described above, as shown in FIG. 1, the power conversion device 1 in which the semiconductor lamination unit 2 is pressurized in the lamination direction by the pressure member 3 is obtained.

  As shown in FIG. 1, the pressing jig 4 is provided with a pair of pressing convex portions 41. Then, the pair of pressing convex portions 41 are inserted behind the spring end portion 323 of the spring member 32 inside the housing 11. Then, the pair of pressing convex portions 41 are pressed against the pair of spring end portions 323. In a state where the spring member 32 is elastically deformed by the pressing jig 4, the pair of support pins 13 are disposed on the housing 11 at a position behind the support portion 322 and inside the pressing convex portion 41.

Further, when the pressing jig 4 is pressed, a load cell is used to press the semiconductor multilayer unit 2 through the pressing jig 4 with a constant pressing force. At this time, in the semiconductor laminated unit 2, each connecting pipe 222 is compressed and deformed little by little, and the interval between the adjacent cooling pipes 22 is reduced. And the dimension of the lamination direction of the semiconductor lamination unit 2 shrinks.
The pressing force applied to the semiconductor multilayer unit 2 by the pressure member 3 after the pressure member 3 is disposed can sufficiently secure the cooling efficiency of the semiconductor module 21 and prevent deformation of the semiconductor multilayer unit 2. Within a predetermined range (2.1 to 5 kN in this example).
In addition, when the change of the lamination | stacking dimension of the semiconductor lamination | stacking unit 2 when predetermined | prescribed pressing force is given can be estimated to some extent, the press of the pressing jig 4 can also be performed by a fixed displacement amount.

Next, the function and effect of this example will be described.
In the method of manufacturing the power conversion device of this example, as shown in FIG. 5, when the pressure member 3 is attached to the housing 13, the pair of spring end portions 323 outside the support portion 322 of the spring member 32 is provided. The spring member 32 is elastically deformed by bringing the pressing jig 4 into contact and pushing the spring end 323 toward the contact plate 31. That is, the spring member 32 is elastically deformed by pressing the spring end 323 with the pressing jig 4. Thereby, the spring member 32 can be largely elastically deformed with a relatively small load.

That is, as shown in FIG. 6, the spring member 32 can be greatly elastically deformed with a small load as compared with the case where the pressing jig 40 is pressed against the inner portion of the support portion 322 and pressed.
This will be described with reference to FIG.
Basically, in the spring member 32, the position where the distance from the central portion of the pressing portion 321 that contacts the contact member 31 is longer can be displaced with a smaller force. Therefore, the load-displacement curve L0 when pressed at the support portion 322, the load-displacement curve L1 when pressed at the inside of the support portion 322, and the press at the outside (spring end portion 323) of the support portion 322. The load-displacement curve L2 in this case is as shown in FIG. That is, the larger the displacement of the pressing jig 4 against the spring member 32 is, the larger the displacement with respect to the load is.

The load-displacement characteristic at each pressing position proceeds in the direction of the arrow attached to each curve, and the elastic force when deforming in the pressurizing direction is larger than the elastic force when restoring in the depressurizing direction. Has hysteresis.
In addition, in FIG. 7, the load-displacement curve when pressing with the pressing jig 4 to the upper limit of 5 kN is shown.

  As shown in FIG. 7, when the pressing by the pressing jig 4 is performed at the spring end 323 as in this example (see the curve L <b> 2 and FIG. 5), the pressing by the pressing jig 4 is performed inside the support 322. The spring member 32 can be displaced more largely with the same pressing force than in the case of (1) (see curve L1, FIG. 6). Therefore, in the step of disposing the pressurizing member 3, the pressing force by the pressing jig 4 is reduced to prevent an excessive load from being applied to the semiconductor laminated unit 2, and the deformation of the cooling pipe 22 or the semiconductor module 21 is prevented. It is possible to eliminate the risk of damage. In addition, in the step of arranging the spring member 32, there is also an advantage that a particularly high specification is not required for a load cell, a servo motor, or the like used when the pressing jig 4 is pressed.

  Further, as shown in FIG. 3, the semiconductor lamination unit 2 is formed by alternately laminating a plurality of semiconductor modules 21 and a plurality of cooling pipes 22. Therefore, the dimensional tolerance (lamination tolerance) in the lamination direction is different for each semiconductor module. The integrated value of the dimensional tolerance and the dimensional tolerance of each cooling pipe may be large. Therefore, it is necessary to apply an appropriate pressing force (2.1 to 5 kN) by the spring member 32 to every semiconductor lamination unit 2 within the lamination tolerance.

In this example, as described above, the pressing jig 4 is brought into contact with the spring end 323 outside the support portion 322 to elastically deform the spring member 32, so that the spring member 32 with respect to a change in the load by the pressing jig 4. The amount of displacement can be increased.
That is, in this example, it is assumed that the pressing force applied to the semiconductor laminated unit 2 by the pressing member 3 is 2.1 kN or more in order to ensure the cooling efficiency of the semiconductor module 21. On the other hand, the upper limit value of the pressing force applied to the semiconductor multilayer unit 2 by the pressing jig 4 is 5 kN or less in relation to the strength of the semiconductor multilayer unit 2. The allowable displacement of the spring member 32 at this time is the displacement of the spring member 32 when the elastic force of the pressure member 3 (spring member 32) shown in FIG. 5A is the lower limit (2.1 kN). The difference xp2 from the displacement of the spring member 32 when the pressing force applied to the semiconductor multilayer unit 2 by the pressing jig 4 shown in FIG. 5B is the upper limit value (5 kN). This difference xp2 is also the difference xp2 shown in FIG.

  On the other hand, as shown in FIG. 6, when pressing the pressing jig 40 against the portion inside the support portion 322, the pressing to the semiconductor multilayer unit 2 by the pressing jig 40 shown in FIG. The displacement of the spring member 32 when the pressing force is the upper limit value (5 kN) is small. Therefore, the displacement of the spring member 32 when the elastic force of the pressure member 3 (spring member 32) shown in FIG. 6A is the lower limit (2.1 kN), and the pressing jig 40 shown in FIG. 6B. The difference xp1 from the displacement of the spring member 32 when the pressing force to the semiconductor laminated unit 2 by the upper limit value (5 kN) is small. This difference xp1 is also the difference xp1 shown in FIG.

Thus, in this example, since the difference xp2 between the upper limit and the lower limit of the allowable displacement of the spring member 32 is large, the stacking tolerance Lc of the semiconductor stacked unit 2 is large as shown in FIG. However, it becomes easy to apply an appropriate pressing force to the semiconductor laminated unit 2 by the pressing member 3.
That is, as shown in FIG. 11A, when the dimension in the stacking direction of the semiconductor stacked unit 2 is small, the pressing force applied to the spring member 32 is made relatively small (for example, the pressing force is 2.1 kN), and the spring The amount of displacement of the elastic deformation of the member 32 is reduced. On the other hand, as shown in FIG. 11C, when the dimension in the stacking direction of the semiconductor stacked unit 2 is large, the pressing force applied to the spring member 32 is made relatively large (for example, the pressing force is set to 5 kN), and the spring member 32. Increase the amount of elastic deformation. At this time, the elastic force of the spring member 32 does not become too small, and the pressing force by the pressing jig 4 can be prevented from becoming too large.

  As a result, as shown in FIG. 10, it is necessary to prepare many types of support pins 13 having different diameters as the support pins 13 for supporting the support portions 322 of the spring members 32 in accordance with the dimensions in the stacking direction of the semiconductor stacked unit 2. Disappear. That is, the dimensions of the semiconductor multilayer unit 2 in the stacking direction can be accommodated by a small number of support pins 13. Therefore, the manufacturing cost can be reduced and the production efficiency can be improved.

This will be described mainly with reference to FIGS.
Even when pressure is applied inside the support portion 322 of the spring member 32 to deform the spring member 32 (FIG. 6), as shown in FIG. 8, when the stacking tolerance Lc of the semiconductor stacking unit 2 is small, it is within the above allowable range. Even if the displacement width xp1 of the spring member 32 is small, it can be handled with a small number of types of support pins 13. For example, if xp1 ≧ Lc, one type of support pin 13 can be used.

  However, as shown in FIG. 9, when the stacking tolerance Lc of the semiconductor stacked unit 2 becomes large and xp1 <Lc, one type of support pin 13 cannot cope, and the semiconductor stacked unit 2 as shown in FIG. 9A. When the stacking dimension is small, a load cannot be applied between the support pin 13 and the semiconductor stacking unit 2 by the displacement of the spring member 32 that generates an elastic force of 2.1 kN. As shown in FIG. 9C, when the lamination dimension of the conductor lamination unit 2 is large, the displacement of the spring member 32 when a load of 5 kN is applied by the pressing jig 40 causes the support pin 13 and the semiconductor lamination unit 2 to be displaced. The spring member 32 cannot be disposed between the two.

Therefore, as shown in FIG. 10A, when the semiconductor laminate unit 2 has a small laminate dimension, it is necessary to use the support pin 13 having a large diameter. As shown in FIG. 10C, the laminate dimension of the semiconductor laminate unit 2 is obtained. When is large, it is necessary to use a bearing pin 13 having a small diameter.
This problem increases as the magnitude of Lc with respect to the displacement width xp (xp1, xp2 described above) of the spring member 32 within the allowable range increases. That is, if Lc / xp is 1 or less (that is, xp ≧ Lc), as described above, the diameter of the support pin 13 can be handled by one type. However, when Lc / xp exceeds 1, two or more types of diameters of the support pin 13 are required. Specifically, the minimum number Np of the necessary types of diameter of the support pin 13 is the minimum natural number that satisfies Np ≧ (Lc / xp).

  Therefore, in other words, by increasing xp, the minimum number Np of necessary types of diameter of the support pin 13 can be reduced. That is, as in the present invention, by pressing the spring member 32 with the pressing member 4 at the spring end 323, the displacement of the spring member 32 with respect to the load is increased, and xp is increased. Even if the stacking tolerance Lc in the unit 2 is increased, the support pins 13 to be prepared can be reduced.

  Further, the spring member 32 has a pair of spring end portions 323 arranged outside the support pin 13. The distance A between the pair of spring end portions 323 in the natural length and the distance B between the pair of support portions 322 in the natural length satisfy A ≧ 1.22B. Therefore, the pair of spring end portions 323 are disposed sufficiently outside the position where the support pin 13 is disposed. Thus, when the pressing member 3 is disposed and pressed at one end of the semiconductor laminated unit 2, even if some dimensional tolerance or misalignment occurs, the pair of spring end portions does not interfere with the support pin 13. Thus, the pressing jig 4 can be reliably brought into contact. Accordingly, the pair of spring end portions 323 can be reliably pressed toward the contact plate 31 by the pressing jig 4.

That is, as shown in FIG. 12, if the distance A between the pair of spring end portions 323 is smaller than the distance B between the pair of support portions 322, the pressing jig 4 is moved relative to the spring end portion 323. Thus, it is difficult to ensure contact. That is, it is difficult to bring the pressing jig 4 into contact with the spring end 323 from the outside of the pair of support pins 13. In particular, when a large-diameter support pin 13 is used, it is difficult to bring the pressing jig 4 into contact with the spring end 323 in consideration of dimensional tolerances and dislocations of the spring member 32 and the like.
In contrast, in the present invention, since A ≧ 1.22B is satisfied, the pressing jig 4 is reliably brought into contact with the pair of spring ends even if some dimensional tolerance or misalignment occurs. be able to.

  As described above, according to this example, it is possible to easily dispose the pressurizing member that pressurizes the semiconductor lamination unit with a small force, and to provide a power conversion device excellent in manufacturing cost and production efficiency and a manufacturing method thereof. Can be provided.

In Example 1, the lower limit value of the elastic force of the allowable spring member 32 is 2.1 kN, and the upper limit value of the pressing force to the semiconductor laminated unit 2 by the allowable pressing jig is 5 kN. The values are examples, and the present invention is not limited to these values.
Moreover, in the said Example 1, although the example which uses the cylindrical support pin 13 as a support body which supports the support part of a spring member was shown, as said support body, for example, a triangular prism shape, a quadrangular prism shape, a semi-cylinder A shape other than a cylindrical shape, such as a shape or an elliptical column shape, can also be used.

(Example 2)
In this example, as shown in FIG. 13, a curved surface is provided at a corner portion 326 between the surface 324 on the support pin 13 side and the end surface 325 in the spring end portion 323 of the spring member 32.
Others are the same as in the first embodiment.
In the case of this example, the pressing jig 4 can be stably brought into contact with the spring end 323, and the spring member 32 can be elastically deformed more reliably.
In addition, the same effects as those of the first embodiment are obtained.

(Example 3)
In this example, as shown in FIG. 14, a bent portion 327 that is bent so as to protrude toward the support pin 13 is provided between the support portion 322 and the spring end portion 323 of the spring member 32. In this example, the spring end 323 is substantially perpendicular to the stacking direction of the semiconductor stacked unit 2.
Others are the same as in the first embodiment.
Also in this example, the pressing jig 4 can be stably brought into contact with the spring end 323, and the spring member 32 can be elastically deformed more reliably.
In addition, the same effects as those of the first embodiment are obtained.

Explanatory drawing of the manufacturing method of the power converter device in Example 1. FIG. FIG. 3 is a perspective view of a spring member in the first embodiment. Explanatory drawing of the power converter device in Example 1. FIG. Explanatory drawing of the spring member in Example 1. FIG. (A) Explanatory drawing of a spring member when elastic force is a lower limit in Example 1, (B) Explanatory drawing of a spring member when a load is an upper limit. In a comparative example, (A) Explanatory drawing of a spring member when elastic force is a lower limit, (B) Explanatory drawing of a spring member when load is an upper limit. The diagram which shows the load-displacement characteristic of a spring member when it presses in three different places in Example 1, respectively. Explanatory drawing which shows the arrangement | positioning state of a spring member when the lamination | stacking tolerance of a semiconductor lamination | stacking unit in a comparative example is small. Explanatory drawing which shows the arrangement | positioning state of a spring member when the lamination | stacking tolerance of a semiconductor lamination | stacking unit is large in a comparative example. Explanatory drawing which shows the arrangement | positioning state of the spring member using the support body of a different diameter when the lamination | stacking tolerance of a semiconductor lamination unit in a comparative example is large. FIG. 3 is an explanatory diagram illustrating an arrangement state of spring members when the stacking tolerance of the semiconductor stacked unit is large in the first embodiment. Explanatory drawing which shows a problem in case the distance A between a pair of spring end parts is not large enough with respect to the distance B between a pair of support parts. Explanatory drawing showing the shape of the spring end part vicinity of a spring member in Example 2. FIG. Explanatory drawing showing the shape of the spring member vicinity of the spring member in Example 3. FIG. Explanatory drawing of the power converter device in a prior art example. Explanatory drawing of the manufacturing method of the power converter device in a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Power converter 11 Housing | casing 111 Inner wall 13 Support body 2 Semiconductor laminated unit 21 Semiconductor module 22 Cooling pipe 3 Pressure member 31 Contact member 311 Contact surface 32 Spring member 321 Press part 322 Support part 323 Spring end 4 Press member

Claims (6)

A method for producing a power conversion device having a semiconductor laminated unit in which a semiconductor module constituting a part of a power conversion circuit and a cooling pipe for cooling the semiconductor module are alternately laminated,
After arranging the semiconductor laminated unit in the casing of the power converter,
A contact plate having a contact surface that contacts the main surface of the cooling pipe at one end in the stacking direction of the semiconductor stacked unit, and a spring disposed on a surface of the contact plate opposite to the contact surface A pressure member having a member,
The spring member has a pressing portion curved in a convex state toward the contact plate side, and support portions formed at both ends of the pressing portion,
In a state where the spring member is elastically deformed by bringing a pressing jig into contact with a pair of spring end portions outside the support portion of the spring member and pushing the spring end portion toward the contact plate. A pair of support bodies are disposed in the housing at a rear position of the pair of support parts,
Next, the support body is sandwiched between the support portion and the inner wall of the housing by moving the pair of support portions in a direction in which the spring member is restored by retracting the pressing jig. And the manufacturing method of the power converter device which makes the said support part support on the said support body.   2. The method of manufacturing a power conversion device according to claim 1, wherein the spring member is provided with a curved surface at a corner portion between the end surface of the spring end portion and the surface on the support body side.   3. The power conversion device according to claim 1, wherein the spring member is provided with a bent portion bent so as to be convex toward the support body between the support portion and the spring end portion. Manufacturing method. A power conversion device having a semiconductor stacked unit formed by alternately stacking a semiconductor module constituting a part of a power conversion circuit and a cooling pipe for cooling the semiconductor module,
A pressure member that pressurizes the semiconductor lamination unit in the lamination direction is disposed at one end in the lamination direction of the semiconductor lamination unit,
The pressurizing member includes a contact plate having a contact surface that contacts the main surface of the cooling pipe, and a spring member disposed on a surface of the contact plate opposite to the contact surface,
The spring member has a pressing portion curved in a convex state toward the contact plate side, and support portions formed at both ends of the pressing portion,
The spring member is configured such that the support portion is supported by a pair of support bodies interposed between an inner wall of the casing of the power converter and the support portion, and the pressing portion is contacted by the contact plate. , Arranged in a biased state so as to press the contact plate in a direction away from the support body,
The spring member has a pair of spring ends arranged outside the support body,
A power conversion device satisfying A ≧ 1.22B, where A is a distance between the pair of spring ends in the natural length and B is a distance between the pair of support portions in the natural length. .   5. The power conversion device according to claim 4, wherein the spring member is provided with a curved surface at a corner portion between the end surface of the spring end portion and the surface on the support body side.   6. The power conversion device according to claim 4, wherein the spring member is provided with a bent portion bent so as to be convex toward the support body between the support portion and the spring end portion. .

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