JP2012161133A - Power conversion device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power conversion device that can improve productivity by reducing the number of components and to provide a method of manufacturing the same.SOLUTION: A power conversion device 1 comprises: a semiconductor stacked unit 2 in which semiconductor modules 21 having a built-in semiconductor element and cooling pipes 22 are alternately stacked; a pressure member 3 pressing the semiconductor stacked unit 2 in a stacked direction X; and a frame 4 in which the semiconductor unit 2 and the pressure member 3 are disposed therein. The pressure member 3 has a contact plate 31 and a spring 32. The contact plate 31 has ribs 33 extending toward the opposite side of the semiconductor stacked unit 2. In the ribs 33, jig engagement portions 34 for engaging a compression jig 5 to compressively deform the spring 32 toward the contact plate 31 side are formed.

Description

  The present invention relates to a power conversion device including a cooling means for a semiconductor module constituting a power conversion circuit.

A power conversion circuit such as a DC-DC converter circuit or an inverter circuit is used to generate a drive current for energizing an AC motor that is a power source of an electric vehicle or a hybrid vehicle, for example.
In general, in an electric vehicle, a hybrid vehicle, and the like, a large driving current is required to secure a large driving torque from an AC motor. Therefore, in the power conversion circuit that generates a drive current for the AC motor, heat generated from a semiconductor module including a power semiconductor element such as an IGBT constituting the power conversion circuit tends to increase.

Thus, a power conversion device has been proposed in which a plurality of cooling pipes that allow a coolant to flow therein are alternately stacked with semiconductor modules so that a plurality of semiconductor modules constituting the power conversion circuit can be cooled (Patent Document 1). Patent Document 2).
Then, as shown in FIG. 8, the power conversion device 9 includes a semiconductor laminated unit 92 that is a laminated body of a semiconductor module 921 and a cooling pipe 922, and a spring member 93 that pressurizes the semiconductor laminated unit 92 in the laminating direction. .

  In assembling the power conversion device 9, first, as shown in FIG. 8, a semiconductor laminated unit 92 formed by laminating a plurality of semiconductor modules 921 and a plurality of cooling pipes 922 is arranged inside the frame 94. Further, as shown in the figure, a spring member 93 is disposed between one end portion 920 of the semiconductor multilayer unit 92 and one wall portion 940 of the frame 94.

  Next, the vicinity of both end portions of the pressing member 93 is directed to the wall 942 on the other side of the frame 94 in the stacking direction, and the pressing member 93 is pushed in, so that the pressing member 93 is elastically deformed. Compress in the stacking direction. Then, when the spring member 93 is deformed by a predetermined amount, a columnar support pin 941 is inserted between both end portions of the spring member 93 and the wall portion 940 on one side of the frame 94.

  Thereafter, the pair of support pins 941 are sandwiched between the spring member 93 and the one side wall portion 940 by moving the pressing jig in the direction of the one side wall portion 940 and separating from the spring member 93. It becomes a state. Accordingly, the semiconductor stacking unit 92 is pressurized in the stacking direction by the biasing force of the spring member 93, and the state where the semiconductor module 921 and the cooling pipe 922 are in pressure contact with each other is maintained.

JP 2008-245472 A JP 2007-166820 A

  However, when assembling the power conversion device 9, it is necessary to insert support pins 941 separate from the frame 94 between both end portions of the spring member 93 and the wall portion 940 on one side of the frame 94. Therefore, the number of parts increases and the manufacturing cost of the power converter tends to increase. Moreover, since the arrangement | positioning process of the support pin 941 is needed, there exists room for productivity improvement.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a power conversion device and a manufacturing method thereof that can reduce the number of parts and improve productivity.

1st invention is a semiconductor lamination unit formed by alternately laminating the semiconductor module which built in the semiconductor element, and the cooling pipe which cools the semiconductor module,
A pressure member disposed at one end in the stacking direction of the semiconductor stacking unit and pressurizing the semiconductor stacking unit in the stacking direction;
A frame that opens in a direction orthogonal to the stacking direction, and that has the semiconductor stacking unit and the pressure member disposed inside;
The pressure member includes a contact plate having a contact surface that contacts the cooling pipe disposed at one end in the stacking direction, and a spring member disposed on a surface of the contact plate opposite to the contact surface. Have
The contact plate has a rib extending to the side opposite to the semiconductor lamination unit side, and a jig for engaging a compression jig for compressing and deforming the spring member toward the contact plate side on the rib. The power converter is characterized in that an engaging portion is formed (claim 1).

A second invention includes a unit arrangement step of arranging the semiconductor laminated unit inside the frame;
Outside the frame, a spring deformation step of compressing and deforming the spring member by engaging the compression jig with the jig engaging portion;
A pressure member disposing step of disposing the pressure member in a state where the spring member is compressed and deformed at one end in the stacking direction of the semiconductor stacked unit inside the frame;
The compression of the spring member by the compression jig is released, and the restoring force of the spring member acts as a pressing force in the stacking direction on the semiconductor stacked unit, and the compression jig is removed from the pressure member. A method for manufacturing a power conversion device comprising a jig removing step (claim 7).

  In the power conversion device according to the first aspect of the present invention, the contact plate of the pressure member is formed with a rib extending to the side opposite to the semiconductor lamination unit side, and the rib is provided with the spring member. A jig engaging portion for engaging a compression jig for compressing and deforming toward the contact plate side is formed. Therefore, the pressure member can be compressed and deformed by a compression jig alone without being brought into contact with the semiconductor laminated unit or the frame.

  Thus, when the power conversion device is assembled, before the pressure member is arranged in the frame, the spring member of the pressure member is placed on the jig engagement portion outside the frame. And can be compressed and deformed. And the compression member can be arrange | positioned to the said flame | frame with the said semiconductor lamination | stacking unit after the compression deformation.

That is, in the assembly process of the power conversion device, it is not necessary to compress the pressure member after the pressure member is disposed in the frame. This means that it is not necessary to dispose a support pin separate from the frame and the semiconductor multilayer unit between the wall portion of the frame and the semiconductor multilayer unit. That is, a support pin made of a separate member for holding the urging force of the pressure member after assembly into the frame is not required, and the arrangement process thereof is also unnecessary. Therefore, the number of parts of the power conversion device can be reduced, the assembly process can be simplified, and productivity can be improved.

  In the method for manufacturing the power conversion device of the second invention, in the spring deformation step, the spring member of the pressure member is compressed and deformed outside the frame. In the pressurizing member arranging step, the pressurizing member in a state where the spring member is compressed and deformed is arranged in the frame. Therefore, since the compression of the pressure member after the arrangement in the frame is unnecessary, the above-described support pin is unnecessary. Therefore, the arrangement process of a support pin becomes unnecessary. That is, the number of parts of the power conversion device can be reduced, the assembly process can be simplified, and productivity can be improved.

  As described above, according to the present invention, it is possible to provide a power conversion device that can reduce the number of components and improve productivity, and a method for manufacturing the same.

The top view of the power converter device in Example 1. FIG. The perspective view seen from the contact plate side of the pressurization member in Example 1. FIG. The perspective view seen from the spring member side of the pressurization member in Example 1. FIG. FIG. 3 is a perspective view showing an engagement state of the compression jig with the pressure member in the first embodiment. The top view which shows the state before the compression deformation of the spring member of a pressurization member in Example 1. FIG. The top view which shows the state after the compression deformation of the spring member of a pressurization member in Example 1. FIG. The top view of a pressurizing member in Example 2. FIG. The top view of the power converter device in background art.

Moreover, as said spring member, a leaf | plate spring, a coil spring, etc. can be used, for example.
Examples of the power converter include a DC-DC converter and an inverter.
Moreover, the said power converter device can be used for the production | generation of the drive current which supplies with electricity to the alternating current motor which is motive power sources, such as an electric vehicle and a hybrid vehicle, for example.
In addition, the said semiconductor module and the said cooling pipe may be closely_contact | adhered directly, and may contact | adhere through an insulating material etc.

  Further, the contact plate has first ribs and second ribs as the ribs at both ends in the opening direction of the frame, and the jigs provided on the first rib and the second rib, respectively. The first jig engaging portion and the second jig engaging portion which are tool engaging portions are configured by through holes penetrating in the opening direction, and the compression jig is used as the first jig engaging portion. And the second jig engaging portion are preferably configured to be inserted and engaged in this order (claim 2). In this case, the pressure member can be prevented from being inclined when the spring member is compressed by the compression jig, and the spring member can be stably compressed and deformed.

  Further, the first jig engaging portion and the second jig engaging portion are different in shape from each other, and when viewed from the insertion direction of the compression jig, at least the outline of the second jig engaging portion. It is preferable that part is arrange | positioned inside the said 1st jig engaging part (Claim 3). In this case, the compression jig may be brought into contact with the second jig engagement portion from the insertion side while passing through the first jig engagement portion and the second jig engagement portion. It becomes possible. Accordingly, when the compression jig is inserted, the compression jig can be positioned in the insertion direction of the compression jig with respect to the first jig engagement portion and the second jig engagement portion of the compression jig. Therefore, productivity can be effectively improved.

  The first jig engaging portion preferably has a longer length in the width direction, which is a direction perpendicular to the stacking direction and the opening direction of the frame, than the second jig engaging portion. ). In this case, it is possible to realize the above-described positioning means for the compression jig of the pressure member while suppressing the protruding length of the rib in the stacking direction to be small. Therefore, productivity can be improved while realizing miniaturization of the power converter.

  Moreover, it is preferable that the said jig engaging part is formed in the center part of the width direction which is a direction orthogonal to the said lamination direction in the said contact plate, and the opening direction of the said frame (Claim 5). In this case, the spring member can be compressed with a good balance.

  Preferably, the frame is formed integrally with a spring support portion for supporting the spring member from the opposite side of the semiconductor multilayer unit so as to protrude toward the semiconductor multilayer unit. In this case, it is possible to more easily perform the work of placing the pressure member in a state where the spring member is compressed in the frame.

Example 1
A power converter according to an embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the power conversion device 1 of this example includes a semiconductor stacked unit 2 in which semiconductor modules 21 incorporating semiconductor elements and cooling tubes 22 that cool the semiconductor modules 21 are alternately stacked. A pressing member 3 that pressurizes the semiconductor multilayer unit 2 in the stacking direction X is disposed at one end 20 in the stacking direction X of the semiconductor stacked unit 2.
And the power converter device 1 has the flame | frame 4 opened in the direction orthogonal to the lamination direction X, as shown in FIG. This direction is hereinafter referred to as “opening direction Z”. The semiconductor stacked unit 2 and the pressure member 3 are disposed inside the frame 4.

As shown in FIGS. 1 to 3, the pressing member 3 includes a contact plate 31 having a contact surface 310 that contacts the cooling pipe 22 disposed at one end in the stacking direction X, and a contact between the contact plate 31 and the contact plate 31. And a spring member 32 disposed on the surface opposite to the contact surface 310.
The contact plate 31 has a rib 33 extending to the side opposite to the semiconductor laminated unit 2 side. The rib 33 is formed with a jig engaging portion 34 for engaging the compression jig 5 (see FIG. 4) for compressing and deforming the spring member 32 toward the contact plate 31 side.

Further, the contact plate 31 has first ribs 331 and second ribs 332 formed at both ends in the opening direction Z as ribs 33, respectively. The first rib 331 and the second rib 332 are provided with a first jig engaging portion 341 and a second jig engaging portion 342 as the jig engaging portion 34, respectively. These are constituted by through holes penetrating the rib 33 in the opening direction Z. And it is comprised so that the compression jig | tool 5 can be inserted and engaged in order of the 1st jig | tool engagement part 341 and the 2nd jig | tool engagement part 342. FIG.
The jig engaging portion 34 is formed in the center portion in the width direction Y orthogonal to the stacking direction X and the opening direction Z in the contact plate 31.

Further, as the spring member 32 of the pressurizing member 3 of the present example, the central curved portion 323 curved in a substantially arc shape, and curved in the same direction as the central curved portion 323 at both ends in the width direction Y of the central curved portion 323. A leaf spring 320 comprising the supported portion 322 is used.
As shown in FIG. 2, a loose fitting projection 321 is formed on the central curved portion 323 of the leaf spring 320.

A contact plate portion 312 having a contact surface 310 is formed on the contact plate 31. Further, a loose fitting hole 311 is formed in the central portion of the contact plate portion 312 so that the loose fitting projection 321 can be loosely fitted.
In the pressurizing member 3, the spring member 32 is placed on the surface of the contact plate portion 312 opposite to the contact surface 310 in a state where the loose fitting projection 321 is loosely fitted in the loose fit hole 311 of the contact plate 31. It is superimposed.

  As shown in FIG. 3, the pair of ribs 33 of the contact plate 31 are formed with holding pieces 333 that support the central curved portion 323 of the spring member 32 from the side opposite to the contact plate portion 312. . The pair of holding pieces 333 are formed to be bent at substantially right angles from the pair of ribs 33 toward each other at the center position in the longitudinal direction of the contact plate 31. Thus, the spring member 32 is held so as to be sandwiched between the pair of holding pieces 333 and the contact plate portion 312.

  Further, the holding piece 333 is bent from the side of the jig engaging portion 34 on the contact plate portion 312 side. The contact plate 31 is formed by bending a metal plate made of a plated steel plate or the like. The jig engaging portion 34 is formed by punching a part of a metal plate, but a part of the jig engaging portion 34 is formed by cutting and bending the holding piece 333. Therefore, in order to sufficiently secure the length of the holding piece 333, a relief portion 343 that protrudes in the protruding direction of the rib 33 is formed in a part of the jig engaging portion 34 more than the others.

  As shown in FIGS. 1 and 3, the first jig engaging portion 341 and the second jig engaging portion 342 are formed so as to have different shapes. Specifically, at least a part of the outline of the second jig engaging portion 342 is viewed from the insertion direction of the compression jig 5 (the surface direction in FIG. 1), which will be described later, the first jig engaging portion. 341 is disposed inside. Such a configuration is realized by forming the length of the first jig engaging portion 341 in the width direction Y to be longer than that of the second jig engaging portion 342. On the other hand, the first jig engaging portion 341 and the second jig engaging portion 342 have the same contour at both ends in the stacking direction X when viewed from the opening direction Z.

  As shown in FIG. 3, a pair of projecting pieces 334 are formed on the second rib 332 of the contact plate 31 with the second jig engaging portion 342 interposed therebetween. The protruding piece 334 functions as positioning means in the width direction Y with respect to the frame 4.

  Further, as shown in FIG. 1, the frame 4 is integrally formed with a spring support portion 41 that supports the spring member 32 from the opposite side of the semiconductor multilayer unit 2 so as to protrude toward the semiconductor multilayer unit 2. Yes.

The frame 4 has a substantially rectangular shape including a front wall portion 43 and a rear wall portion 44 that are arranged in parallel to each other on both sides in the stacking direction X, and a pair of side wall portions 45 that connect these at both ends in the width direction Y. It consists of a frame. The pressurizing member 3 is disposed between the rear wall portion 44 and the cooling pipe 22 at one end (rear end) of the semiconductor laminated unit 2. A pair of spring support portions 41 protrude from the rear wall portion 44 in the stacking direction X toward the semiconductor stacked unit 2 side. The protruding end portion of the spring support portion 41 has a shape that is substantially semicircular in a cross section orthogonal to the opening direction Z. The supported portion 322 of the spring member 32 of the pressure member 3 is supported by the pair of spring support portions 41.
A concave space 46 is formed outside the pair of spring support portions 41 and inside the side wall 45.

  As shown in FIG. 1, the semiconductor laminated unit 2 is formed by alternately laminating cooling pipes 22 and semiconductor modules 21. The semiconductor module 21 is sandwiched by cooling pipes 22 from both sides in the stacking direction X. Two semiconductor modules 21 are sandwiched between adjacent cooling pipes 22.

  As shown in FIG. 1, the plurality of cooling pipes 22 are long in the direction orthogonal to the stacking direction X, and are connected by connecting pipes 220 that can connect adjacent cooling pipes 22 at both ends in the width direction Y. In addition, a refrigerant introduction pipe 221 and a refrigerant discharge pipe 222 are connected to both ends in the width direction Y of the cooling pipe 22 arranged at one end in the stacking direction X.

  Thereby, the cooling medium introduced from the refrigerant introduction pipe 221 passes through the connection pipe 220 as appropriate, is distributed to each cooling pipe 22, and flows in the longitudinal direction (width direction Y). The cooling medium exchanges heat with the semiconductor module 21 while flowing through each cooling pipe 22. The cooling medium whose temperature has increased due to heat exchange passes through the downstream connecting pipe 220 as appropriate and is led to the refrigerant discharge pipe 222 to be discharged.

  Examples of the cooling medium include natural refrigerants such as water and ammonia, water mixed with ethylene glycol-based antifreeze, fluorocarbon refrigerants such as fluorinate, chlorofluorocarbon refrigerants such as HCFC123 and HFC134a, and alcohol-based alcohols such as methanol and alcohol. A refrigerant or a ketone-based refrigerant such as acetone can be used.

The refrigerant introduction pipe 221 and the refrigerant discharge pipe 222 protrude from the front wall portion 43 to the outside of the frame 4. That is, the pressurizing member 3 is arranged on the side opposite to the side where the refrigerant introduction pipe 221 and the refrigerant discharge pipe 222 are provided.
The refrigerant introduction pipe 221 and the refrigerant discharge pipe 222 may protrude from the rear wall portion 44. In this case, the pressurizing member 3 is disposed between the refrigerant introduction pipe 221 and the refrigerant discharge pipe 222. Further, one of the refrigerant introduction pipe 221 and the refrigerant discharge pipe 222 can be arranged on the front wall portion 43 side, and the other can be arranged on the rear wall portion 44 side.

Next, a method for manufacturing the power conversion device 1 of this example will be described with reference to FIGS. 1 and 3 to 6.
The manufacturing method of the power converter device 1 of this example includes a unit arranging step, a spring deformation step, a pressing member arranging step, and a jig removing step. This will be specifically described below.

First, in the unit arranging step, the semiconductor laminated unit 2 is arranged inside the frame 4 as shown in FIG.
Next, in the spring deformation step, as shown in FIG. 4, outside the frame 4, the jig engaging portion 34 (the first jig engaging portion 341 and the second jig engaging portion 342) in the pressing member 3. On the other hand, the compression jig 5 is inserted and engaged from the opening direction Z, and the spring member 32 is compressed and deformed.

  The compression jig 5 includes a center engaging portion 52 and a pair of spring end engaging portions 53 that are configured to be relatively movable. And while engaging the center engaging part 52 with the 1st jig engaging part 341 and the 2nd jig engaging part 342, a pair of spring end part engaging parts 53 are both ends of the width direction Y of the spring member 32. Each of them is brought into contact with the vicinity of the supported portion 322.

  Here, the center engaging portion 52 has a base portion 520 whose width in the width direction Y is slightly smaller than the first jig engaging portion 341 and larger than the second jig engaging portion 342, and the second jig engaging portion. The tip portion 521 is slightly smaller than 342. In addition, a pair of stepped surfaces 522 serving as the distal end surface of the base portion 520 are formed on both sides of the distal end portion 521.

  Thereby, when engaging the center engaging part 52 with the 1st jig engaging part 341 and the 2nd jig engaging part 342, the front-end | tip part 521 of the center engaging part 52 and the base | substrate part 520 are 1st healing. The front end portion 521 can penetrate the inside of the second jig engaging portion 342 through the tool engaging portion 341. Then, the stepped surface 522 is brought into contact with the second rib 332 around the second jig engaging portion 342, whereby the compression jig 5 can be positioned with respect to the pressing member 3.

  Then, as shown in FIG. 5, the compression jig 5 faces the rear side of the center engaging portion 52 relative to the spring end engaging portion 53 (opposite to the direction facing the contact surface 310). Move (arrow A). In other words, the pair of spring end engaging portions 53 are moved forward (in the direction of the contact surface 310) with respect to the central engaging portion 52 (arrow B). Thereby, as shown in FIG. 6, the spring member 32 is compressed and deformed.

Next, in the pressure member arranging step, the pressure member 3 in a compressed and deformed state is arranged at one end in the stacking direction X of the semiconductor stacked unit 2 inside the frame 4. At this time, each of the spring end engaging portions 53 is disposed in the concave space portion 46.
A positioning groove (not shown) is formed in the frame 4 for positioning the pressure member 3. When the pressurizing member 3 is arranged in the frame 4, the protruding piece 334 is engaged with the positioning groove, and the pressurizing member 3 in the frame 4 is positioned in the width direction Y.

  Next, in the jig removing step, the compression of the spring member 32 by the compression jig 5 is released, and the restoring force of the spring member 32 acts as a pressing force in the stacking direction X on the semiconductor stacking unit 2 and the compression treatment. The tool 5 is removed from the pressure member 3.

  As a result, as shown in FIG. 1, the spring support portion 41 of the frame 4 is engaged with the supported portion 322 of the compressed spring member 32 in the pressurizing member 3, and the compressed state of the spring member 32 can be maintained. it can. This state is also a state in which the semiconductor stacked unit 2 is compressed by a predetermined pressure in the stacking direction X by the urging force of the pressing member 3.

Next, the function and effect of this example will be described.
In the power conversion device 1 of this example, a jig engaging portion 34 for engaging the compression jig 5 is formed on the rib 33 of the contact plate 31. Therefore, the pressing member 3 can be compressed and deformed by the compression jig 5 alone without being brought into contact with the semiconductor laminated unit 2 or the frame 4.

  Thus, when the power conversion device 1 is assembled, the spring member 32 of the pressurizing member 3 is compressed by the jig engaging portion 34 outside the frame 4 before the pressurizing member 3 is arranged in the frame 4. The tool 5 can be engaged and compressed and deformed. Then, the pressure member 3 can be disposed on the frame 4 together with the semiconductor laminated unit 2 after the compression deformation.

  That is, in the assembly process of the power conversion device 1, it is not necessary to compress the pressure member 3 after the pressure member 3 is arranged in the frame 4. This means that it is not necessary to dispose a support pin separate from the frame 4 and the semiconductor multilayer unit 2 between the wall portion of the frame 4 and the semiconductor multilayer unit 2. That is, a support pin made of another member for holding the urging force of the pressure member 3 after being assembled in the frame 4 is not required, and the arrangement process thereof is also unnecessary. Therefore, the number of parts of the power conversion device 1 can be reduced, the assembly process can be simplified, and productivity can be improved.

  The contact plate 31 has first ribs 331 and second ribs 332 at both ends in the opening direction Z of the frame 4. The first jig engaging portion 341 and the second jig engaging portion 342 provided on the first rib 331 and the second rib 332, respectively, are configured by through holes penetrating in the opening direction Z. And it is comprised so that the compression jig | tool 5 can be inserted and engaged with the 1st jig engagement part 341 and the 2nd jig engagement part 342 in this order. Thereby, in this case, the inclination of the pressure member 3 when the spring member 32 is compressed by the compression jig 5 can be prevented, and the spring member 32 can be stably compressed and deformed.

  Further, the first jig engaging portion 341 and the second jig engaging portion 342 have different shapes, and when viewed from the insertion direction of the compression jig 5, as shown in FIG. At least a part of the contour of the portion 342 is disposed inside the first jig engaging portion 341. As a result, as shown in FIG. 4, the compression jig 5 is passed through the first jig engagement portion 341 and the second jig engagement portion 342 and applied to the second jig engagement portion 342 from the insertion side. It is possible to contact. Thus, when the compression jig 5 is inserted, the compression jig 5 can be positioned in the opening direction Z with respect to the first jig engagement portion 341 and the second jig engagement portion 342 of the compression jig 5. . Therefore, productivity can be effectively improved.

The first jig engaging portion 341 is longer in the width direction Y than the second jig engaging portion 342. Thereby, the positioning means of the compression jig 5 of the pressure member 3 described above can be realized while keeping the protruding length of the rib 33 in the stacking direction X small. Therefore, productivity can be improved while realizing miniaturization of the power conversion device 1.
The jig engaging portion 34 is formed at the center of the contact plate 31 in the width direction Y. Thereby, the spring member 32 can be compressed with good balance.

  The frame 4 is formed integrally with a spring support portion 41 so as to protrude toward the semiconductor laminated unit 2. Accordingly, the work of placing the pressure member 3 in a state where the spring member 32 is compressed in the frame 4 can be performed more easily.

  In the method for manufacturing the power conversion device 1 of this example, the spring member 32 of the pressing member 3 is compressed and deformed outside the frame 4 in the spring deformation step. In the pressurizing member arranging step, the pressurizing member 3 in a state where the spring member 32 is compressed and deformed is arranged in the frame 4. Therefore, it is not necessary to compress the pressure member 3 after the arrangement in the frame 4. The support pin described above is not necessary. Therefore, the arrangement process of the support pin is also unnecessary, that is, the number of parts of the power conversion device 1 can be reduced, the assembly process can be simplified, and the productivity can be improved. .

  As described above, according to this example, it is possible to provide a power conversion device that can reduce the number of components and improve productivity, and a method for manufacturing the same.

(Example 2)
In this example, as shown in FIG. 7, the spring member 32 of the pressurizing member 3 is configured by a plurality of coil springs 324 and a pressing plate 325.
Three coil springs 324 are arranged side by side in the width direction Y on the surface opposite to the contact surface 310 in the contact plate portion 312 of the contact plate 31. A pressing plate 325 is disposed in parallel with the contact plate portion 312 so that the three coil springs 324 are sandwiched between the contact plate portions 312. Note that the number of coil springs 324 and the manner in which they are arranged are not particularly limited.

The pressing plate 325 has a plate end portion 326 that is curved in a substantially arc shape so as to be convex toward the contact plate portion 312 side. A spring support portion 41 of the frame 4 is engaged with the plate end portion 326 so that the compressed state of the spring member 32 is maintained.
Others are the same as Example 1, and have the same effect.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Semiconductor laminated unit 21 Semiconductor module 22 Cooling pipe 3 Pressure member 31 Contact plate 32 Spring member 33 Rib 34 Jig latching part 4 Frame

Claims (7)

A semiconductor laminated unit in which a semiconductor module incorporating a semiconductor element and a cooling pipe for cooling the semiconductor module are alternately laminated;
A pressure member disposed at one end in the stacking direction of the semiconductor stacking unit and pressurizing the semiconductor stacking unit in the stacking direction;
A frame that opens in a direction orthogonal to the stacking direction, and that has the semiconductor stacking unit and the pressure member disposed inside;
The pressure member includes a contact plate having a contact surface that contacts the cooling pipe disposed at one end in the stacking direction, and a spring member disposed on a surface of the contact plate opposite to the contact surface. Have
The contact plate has a rib extending to the side opposite to the semiconductor lamination unit side, and a jig for engaging a compression jig for compressing and deforming the spring member toward the contact plate side on the rib. An electric power converter characterized in that an engaging portion is formed.   2. The power conversion device according to claim 1, wherein the contact plate includes a first rib and a second rib as the ribs at both ends in the opening direction of the frame, respectively. The first jig engaging portion and the second jig engaging portion, which are the jig engaging portions provided respectively on the two ribs, are configured by through holes penetrating in the opening direction, and the compression jig The power conversion device is configured to be inserted and engaged with the first jig engaging portion and the second jig engaging portion in this order.   3. The power conversion device according to claim 2, wherein the first jig engaging portion and the second jig engaging portion have different shapes from each other, and when viewed from the insertion direction of the compression jig, At least a part of the contour of the jig engaging portion is disposed inside the first jig engaging portion.   4. The power conversion device according to claim 3, wherein the first jig engaging portion has a length in a width direction that is a direction orthogonal to the stacking direction and the opening direction of the frame. The power converter characterized by being longer than a part.   5. The power conversion device according to claim 1, wherein the jig engaging portion is a center in a width direction that is a direction orthogonal to the stacking direction and the opening direction of the frame in the contact plate. The power converter characterized by being formed in the part.   6. The power conversion device according to claim 1, wherein the frame projects a spring support portion that supports the spring member from a side opposite to the semiconductor stacked unit toward the semiconductor stacked unit. A power converter characterized by being integrally formed as described above. A method for manufacturing the power conversion device according to any one of claims 1 to 6,
A unit arranging step of arranging the semiconductor laminated unit inside the frame;
Outside the frame, a spring deformation step of compressing and deforming the spring member by engaging the compression jig with the jig engaging portion;
A pressure member disposing step of disposing the pressure member in a state where the spring member is compressed and deformed at one end in the stacking direction of the semiconductor stacked unit inside the frame;
The compression of the spring member by the compression jig is released, and the restoring force of the spring member acts as a pressing force in the stacking direction on the semiconductor stacked unit, and the compression jig is removed from the pressure member. The manufacturing method of a power converter device provided with a jig | tool removal process.

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