JP2009094257A - Power conversion device - Google Patents

Power conversion device Download PDF

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JP2009094257A
JP2009094257A JP2007262804A JP2007262804A JP2009094257A JP 2009094257 A JP2009094257 A JP 2009094257A JP 2007262804 A JP2007262804 A JP 2007262804A JP 2007262804 A JP2007262804 A JP 2007262804A JP 2009094257 A JP2009094257 A JP 2009094257A
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refrigerant
supply pipe
discharge pipe
pipe
cooling
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JP5012389B2 (en
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Yoshihiko Oyama
佳彦 大山
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Denso Corp
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Denso Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power conversion device allowing a sealing material to be arranged on a coolant supply pipe and a coolant discharge pipe without deforming a plurality of stacked cooling pipes. <P>SOLUTION: This power conversion device 1 includes: a semiconductor stacked unit 2 composed by alternately stacking a plurality of semiconductor modules 21 and a plurality of cooling tubes 22 cooling the semiconductor modules 21; and a case 3 storing the semiconductor stacked unit 2. The semiconductor stacked unit 2 is formed by connecting a coolant supply tube 41 for supplying a coolant to the cooling tubes 22 from the outside and a coolant discharge tube 42 for discharging the coolant to the outside from the cooling tubes 22 to the cooling tube 22 at one end in the stacking direction. Sealing materials 5 are arranged between the coolant supply tube 41 and the coolant discharge tube 42, and the case 3. The coolant supply tube 41 and the coolant discharge tube 42 have tool engagement parts 61 for engaging holding tools for holding the coolant supply tube 41 and the coolant discharge tube 42 in partial parts on the semiconductor stacked unit 2 side relative to the sealing materials 5. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、複数の半導体モジュールによって構成される電力変換装置に関する。   The present invention relates to a power conversion device including a plurality of semiconductor modules.

ＤＣ−ＤＣコンバータ回路やインバータ回路等の電力変換回路は、例えば、電気自動車やハイブリッド自動車等の動力源である交流モータに通電する駆動電流を生成するために用いられる。
一般に、電気自動車やハイブリッド自動車等では、交流モータから大きな駆動トルクを得る必要があるため、大きな駆動電流が必要である。それゆえ、その交流モータ向けの駆動電流を生成する電力変換装置においては、上記電力変換回路を構成するＩＧＢＴ等の電力用半導体素子を含む半導体モジュールからの発熱が大きくなる傾向にある。 A power conversion circuit such as a DC-DC converter circuit or an inverter circuit is used to generate a drive current for energizing an AC motor that is a power source of an electric vehicle or a hybrid vehicle, for example.
In general, an electric vehicle, a hybrid vehicle, and the like require a large driving current because it is necessary to obtain a large driving torque from an AC motor. Therefore, in a power conversion device that generates a drive current for the AC motor, heat generated from a semiconductor module including a power semiconductor element such as an IGBT constituting the power conversion circuit tends to increase.

そこで、図１１に示すごとく、電力変換装置９には、半導体モジュール９２１を冷却する冷却ユニットが組み込まれている。具体的には、電力変換装置９は、電力変換回路の一部を構成する複数の半導体モジュール９２１と該複数の半導体モジュール９２１を冷却する互いに連結された複数の冷却管９２２とを交互に積層してなる半導体積層ユニット９２と、該半導体積層ユニット９２を内側に収容するケース９３とを有する（例えば、特許文献１参照）。   Therefore, as shown in FIG. 11, the power conversion device 9 incorporates a cooling unit for cooling the semiconductor module 921. Specifically, the power conversion device 9 alternately stacks a plurality of semiconductor modules 921 constituting a part of the power conversion circuit and a plurality of cooling pipes 922 connected to each other for cooling the plurality of semiconductor modules 921. And a case 93 that accommodates the semiconductor multilayer unit 92 inside (see, for example, Patent Document 1).

また、半導体積層ユニット９２は、積層方向の一端の冷却管９２２において、ケース９３の外部から冷却管９２２の内部に冷却媒体を供給するための冷媒供給管９４１と、冷却管９２２からケース９３の外部に冷却媒体を排出するための冷媒排出管９４２とに接続されている。
また、冷媒供給管９４１及び冷媒排出管９４２とケース９３との間には、防水用のシール材９５が配設されている。 In addition, the semiconductor lamination unit 92 includes a refrigerant supply pipe 941 for supplying a cooling medium from the outside of the case 93 to the inside of the cooling pipe 922 and an outside of the case 93 from the cooling pipe 922 in the cooling pipe 922 at one end in the stacking direction. And a refrigerant discharge pipe 942 for discharging the cooling medium.
Further, a waterproof sealing material 95 is disposed between the refrigerant supply pipe 941 and the refrigerant discharge pipe 942 and the case 93.

電力変換装置９を組み立てるに当たっては、まず、複数の冷却管９２２を積層する。このとき、積層方向の一端の冷却管９２２には、冷媒供給管９４１と冷媒排出管９４２とを接続する。
次いで、冷媒供給管９４１及び冷媒排出管９４２の外周にシール材９５を嵌合する。
その後、積層された複数の冷却管９２２の間に半導体モジュール９２１を配設する。 In assembling the power conversion device 9, first, a plurality of cooling pipes 922 are stacked. At this time, the refrigerant supply pipe 941 and the refrigerant discharge pipe 942 are connected to the cooling pipe 922 at one end in the stacking direction.
Next, a sealing material 95 is fitted to the outer periphery of the refrigerant supply pipe 941 and the refrigerant discharge pipe 942.
Thereafter, the semiconductor module 921 is disposed between the plurality of stacked cooling pipes 922.

ここで、冷媒供給管９４１及び冷媒排出管９４２の外周にシール材９５を嵌合するに当たっては、積層された複数の冷却管９２２の部分を保持することが考えられる。
しかしながら、上記のごとく積層された複数の冷却管９２２を把持しながらシール材９５の嵌合作業を行うと、冷却管９２２同士の間隔が狭まったり、冷却管９２２が歪んだりしてしまうおそれがある。 Here, when the sealing material 95 is fitted to the outer periphery of the refrigerant supply pipe 941 and the refrigerant discharge pipe 942, it is conceivable to hold a plurality of stacked cooling pipes 922.
However, when the sealing material 95 is fitted while gripping the plurality of cooling pipes 922 stacked as described above, the interval between the cooling pipes 922 may be narrowed or the cooling pipes 922 may be distorted. .

その結果、半導体モジュール９２１を冷却管９２２同士の間に配設できなくなってしまうという問題が生じるおそれがある。また、半導体モジュール９２１と冷却管９２２の主面とが充分に接触することができなくなったり、冷却管９２２内部の通水路が変形することにより冷却媒体が流れにくくなったりして、半導体モジュール９２１を充分に冷却することができなくなってしまうという問題が生じるおそれがある。   As a result, there is a concern that the semiconductor module 921 cannot be disposed between the cooling pipes 922. Further, the semiconductor module 921 and the main surface of the cooling pipe 922 cannot be sufficiently in contact with each other, or the water flow path inside the cooling pipe 922 is deformed to make it difficult for the cooling medium to flow. There is a possibility that the problem that it cannot be sufficiently cooled occurs.

特開２００７−５３３０７号公報JP 2007-53307 A

本発明は、かかる従来の問題点に鑑みてなされたもので、積層された複数の冷却管を変形させることなく冷媒供給管及び冷媒排出管にシール材を配設することができる電力変換装置を提供しようとするものである。   The present invention has been made in view of such a conventional problem, and provides a power conversion device capable of disposing a sealing material on a refrigerant supply pipe and a refrigerant discharge pipe without deforming a plurality of stacked cooling pipes. It is something to be offered.

本発明は、電力変換回路の一部を構成する複数の半導体モジュールと該複数の半導体モジュールを冷却する互いに連結された複数の冷却管とを交互に積層してなる半導体積層ユニットと、該半導体積層ユニットを内側に収容するケースとを有する電力変換装置であって、
上記半導体積層ユニットは、上記ケースの外部から上記複数の冷却管の内部に冷却媒体を供給するための冷媒供給管と、上記複数の冷却管から上記ケースの外部に冷却媒体を排出するための冷媒排出管とを、積層方向の一端の上記冷却管にそれぞれ接続してなり、
上記冷媒供給管及び上記冷媒排出管と上記ケースとの間には、防水用のシール材が配設されており、
上記冷媒供給管及び上記冷媒排出管は、上記シール材よりも上記半導体積層ユニット側の側面部の一部に、上記冷媒供給管及び上記冷媒排出管を把持する把持治具を係合するための治具係合部を有することを特徴とする電力変換装置にある(請求項１)。 The present invention relates to a semiconductor lamination unit in which a plurality of semiconductor modules constituting a part of a power conversion circuit and a plurality of mutually connected cooling pipes that cool the plurality of semiconductor modules are alternately laminated, and the semiconductor lamination A power conversion device having a case for housing the unit inside,
The semiconductor laminated unit includes a refrigerant supply pipe for supplying a cooling medium from the outside of the case to the inside of the plurality of cooling pipes, and a refrigerant for discharging the cooling medium from the plurality of cooling pipes to the outside of the case A discharge pipe is connected to the cooling pipe at one end in the stacking direction,
Between the refrigerant supply pipe and the refrigerant discharge pipe and the case, a waterproof sealing material is disposed,
The coolant supply pipe and the coolant discharge pipe are for engaging a gripping jig for gripping the coolant supply pipe and the coolant discharge pipe with a part of the side surface portion closer to the semiconductor lamination unit than the sealing material. A power converter having a jig engaging portion (claim 1).

次に、本発明の作用効果につき説明する。
上記冷媒供給管及び上記冷媒排出管は、上記シール材よりも上記半導体積層ユニット側の側面部の一部に、上記冷媒供給管及び上記冷媒排出管を把持する把持治具を係合するための治具係合部を有する。かかる構成によれば、把持治具によって冷媒供給管及び冷媒排出管を把持した状態で、シール材を冷媒供給管及び冷媒排出管に配設することができる。したがって、シール材を配設するに当たって、積層された複数の冷却管に力が作用することを防ぐことができる。
それゆえ、冷却管を変形させることなく冷媒供給管及び冷媒排出管にシール材を配設することができる。 Next, the effects of the present invention will be described.
The coolant supply pipe and the coolant discharge pipe are for engaging a gripping jig for gripping the coolant supply pipe and the coolant discharge pipe with a part of the side surface portion on the semiconductor laminated unit side of the sealing material. It has a jig engaging part. According to this configuration, the sealing material can be disposed on the refrigerant supply pipe and the refrigerant discharge pipe in a state where the refrigerant supply pipe and the refrigerant discharge pipe are held by the holding jig. Therefore, when the sealing material is provided, it is possible to prevent a force from acting on the plurality of stacked cooling pipes.
Therefore, the sealing material can be disposed in the refrigerant supply pipe and the refrigerant discharge pipe without deforming the cooling pipe.

以上のごとく、本発明によれば、積層された複数の冷却管を変形させることなく冷媒供給管及び冷媒排出管にシール材を配設することができる電力変換装置を提供することができる。   As described above, according to the present invention, it is possible to provide a power converter capable of disposing a sealing material on a refrigerant supply pipe and a refrigerant discharge pipe without deforming a plurality of stacked cooling pipes.

本発明（請求項１）において、上記電力変換装置は、例えば、自動車用インバータのほか、産業機器のモータ駆動インバータ、ビル空調用のエアコンインバータ等に用いることができる。
上記半導体モジュールには、例えば、ＩＧＢＴ等の半導体素子とダイオードとを内蔵することができる。 In the present invention (Claim 1), the power conversion device can be used for, for example, an automotive inverter, a motor drive inverter for industrial equipment, an air conditioner inverter for building air conditioning, and the like.
For example, a semiconductor element such as an IGBT and a diode can be incorporated in the semiconductor module.

上記冷却媒体としては、例えば、エチレングリコール系の不凍液が混入した水、水やアンモニア等の自然冷媒、フロリナート等のフッ化炭素系冷媒、ＨＣＦＣ１２３、ＨＦＣ１３４ａ等のフロン系冷媒、メタノール、アルコール等のアルコール系冷媒、アセトン等のケトン系冷媒などを用いることができる。
なお、上記治具係合部は、上記シール材を位置決めするための位置決め手段としても用いることができる。 Examples of the cooling medium include water mixed with ethylene glycol antifreeze, natural refrigerants such as water and ammonia, fluorocarbon refrigerants such as fluorinate, chlorofluorocarbon refrigerants such as HCFC123 and HFC134a, and alcohols such as methanol and alcohol. A system refrigerant, a ketone refrigerant such as acetone, and the like can be used.
The jig engaging portion can also be used as a positioning means for positioning the sealing material.

また、上記治具係合部は、上記冷媒供給管及び上記冷媒排出管の側面部の一部を外側に向かって突出させた状態で形成されていることが好ましい（請求項２）。
この場合には、冷媒供給管及び冷媒排出管を内側から外側に向かって突出させることにより、治具係合部を容易に形成することができる。また、把持治具を治具係合部の冷却管側の面に当接させながら、シール材を冷媒供給管及び冷媒排出管に嵌合させることができる。また、冷媒供給管内及び冷媒排出管内の断面積が小さくなることがないため、冷却媒体の流量が低減することもない。 Moreover, it is preferable that the said jig engaging part is formed in the state which made a part of side part of the said refrigerant | coolant supply pipe | tube and the said refrigerant | coolant discharge pipe protrude outside.
In this case, the jig engaging portion can be easily formed by projecting the refrigerant supply pipe and the refrigerant discharge pipe from the inside toward the outside. Further, the sealing material can be fitted to the refrigerant supply pipe and the refrigerant discharge pipe while the gripping jig is brought into contact with the surface of the jig engaging portion on the cooling pipe side. Further, since the cross-sectional areas in the refrigerant supply pipe and the refrigerant discharge pipe are not reduced, the flow rate of the cooling medium is not reduced.

また、上記治具係合部は、上記冷媒供給管及び上記冷媒排出管の側面部の一部を内側に向かって窪ませた状態で形成されていてもよい（請求項３）。
この場合にも、冷媒供給管及び冷媒排出管を外側から内側に向かって窪ませることにより、治具係合部を容易に形成することができる。また、把持治具を治具係合部に嵌入させで係合させながら、シール材を冷媒供給管及び冷媒排出管に嵌合させることができる。 Further, the jig engaging portion may be formed in a state in which a part of the side surface portion of the refrigerant supply pipe and the refrigerant discharge pipe is recessed inward.
Also in this case, the jig engaging portion can be easily formed by recessing the refrigerant supply pipe and the refrigerant discharge pipe from the outside toward the inside. Further, the sealing material can be fitted to the refrigerant supply pipe and the refrigerant discharge pipe while the gripping jig is fitted and engaged with the jig engaging portion.

また、上記治具係合部は、上記冷媒供給管及び上記冷媒排出管における側面部の一部の全周にわたって形成されていることが好ましい（請求項４）。
この場合には、把持治具を治具係合部に確実に係合することができる。 Moreover, it is preferable that the said jig engaging part is formed over the perimeter of a part of side part in the said refrigerant | coolant supply pipe | tube and the said refrigerant | coolant discharge pipe (Claim 4).
In this case, the gripping jig can be reliably engaged with the jig engaging portion.

また、上記冷媒供給管及び上記冷媒排出管は、側面部の一部に、それぞれ上記ケースの外部から上記冷媒供給管に冷却媒体を供給するための外部供給ホース及び上記冷媒排出管から上記ケースの外部に冷却媒体を排出するための外部排出ホースを位置決めするためのホース位置決め部を有し、該ホース位置決め部は、上記冷媒供給管及び上記冷媒排出管の一部を変形させてなることが好ましい（請求項５）。
この場合には、ホース位置決め部を目印として、外部供給ホース及び外部排出ホースを、冷媒供給管及び冷媒排出管の所定の位置に容易に配置することができる。 In addition, the refrigerant supply pipe and the refrigerant discharge pipe are respectively connected to a part of the side surface portion from the outside supply hose and the refrigerant discharge pipe for supplying a cooling medium to the refrigerant supply pipe from the outside of the case. It has a hose positioning part for positioning an external discharge hose for discharging the cooling medium to the outside, and the hose positioning part is preferably formed by deforming a part of the refrigerant supply pipe and the refrigerant discharge pipe. (Claim 5).
In this case, the external supply hose and the external discharge hose can be easily disposed at predetermined positions of the refrigerant supply pipe and the refrigerant discharge pipe with the hose positioning portion as a mark.

また、上記ホース位置決め部は、上記冷媒供給管及び上記冷媒排出管の側面部の一部を外側に向かって突出させた状態で形成されていることが好ましい（請求項６）。
この場合には、外部供給ホース及び外部排出ホースをホース位置決め部に当接させることにより、冷媒供給管及び冷媒排出管のそれぞれの所定の位置に容易に配置することができる。 Moreover, it is preferable that the said hose positioning part is formed in the state which made a part of side part of the said refrigerant | coolant supply pipe | tube and the said refrigerant | coolant discharge pipe protrude outward.
In this case, the external supply hose and the external discharge hose can be easily disposed at predetermined positions of the refrigerant supply pipe and the refrigerant discharge pipe by bringing the external supply hose and the external discharge hose into contact with the hose positioning portion.

（実施例１）
本発明の実施例に係る電力変換装置につき、図１〜図８を用いて説明する。
本例の電力変換装置１は、図１に示すごとく、電力変換回路の一部を構成する複数の半導体モジュール２１と該複数の半導体モジュール２１を冷却する互いに連結された複数の冷却管２２とを交互に積層してなる半導体積層ユニット２と、該半導体積層ユニット２を内側に収容するケース３とを有する。 Example 1
A power converter according to an embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the power conversion apparatus 1 of this example includes a plurality of semiconductor modules 21 that constitute a part of a power conversion circuit and a plurality of cooling pipes 22 that are connected to each other to cool the plurality of semiconductor modules 21. It has the semiconductor laminated unit 2 laminated | stacked alternately, and the case 3 which accommodates this semiconductor laminated unit 2 inside.

半導体積層ユニット２は、図１、図２に示すごとく、ケース３の外部から複数の冷却管２２の内部に冷却媒体を供給するための冷媒供給管４１と、複数の冷却管２２からケース３の外部に冷却媒体を排出するための冷媒排出管４２とを、積層方向の一端の冷却管２２にそれぞれ接続してなる。   As shown in FIGS. 1 and 2, the semiconductor laminated unit 2 includes a refrigerant supply pipe 41 for supplying a cooling medium from the outside of the case 3 to the inside of the plurality of cooling pipes 22, and a plurality of cooling pipes 22 that A refrigerant discharge pipe 42 for discharging the cooling medium to the outside is connected to the cooling pipe 22 at one end in the stacking direction.

そして、冷媒供給管４１及び冷媒排出管４２とケース３との間には、図１、図５〜図８に示すごとく、防水用のシール材５が配設されている。
冷媒供給管４１及び冷媒排出管４２は、シール材５よりも半導体積層ユニット２側の側面部の一部に、冷媒供給管４１及び冷媒排出管４２を把持する把持治具７を係合するための治具係合部６１を有する。 As shown in FIGS. 1 and 5 to 8, a waterproof seal material 5 is disposed between the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 and the case 3.
The refrigerant supply pipe 41 and the refrigerant discharge pipe 42 are for engaging the holding jig 7 that holds the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 with a part of the side surface portion closer to the semiconductor lamination unit 2 than the sealing material 5. The jig engaging portion 61 is provided.

また、治具係合部６１は、図３、図６〜図８に示すごとく、冷媒供給管４１及び冷媒排出管４２における側面部の一部の全周にわたって、外側に向かって突出させた状態で形成されている。すなわち、本例においては、治具係合部６１は、治具係合部６１が形成されていない部分の冷媒供給管４１及び冷媒排出管４２よりも外径が大きい。   In addition, as shown in FIGS. 3 and 6 to 8, the jig engaging portion 61 is protruded outward over the entire circumference of a part of the side surface portion of the refrigerant supply pipe 41 and the refrigerant discharge pipe 42. It is formed with. That is, in this example, the jig engaging portion 61 has an outer diameter larger than that of the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 where the jig engaging portion 61 is not formed.

本例の電力変換装置１につき、以下に詳細に説明する。
本例の電力変換装置１は、例えば、電気自動車やハイブリッド自動車等の動力源である交流モータに通電する駆動電流の生成に用いられるインバータ等の電力変換装置であるが、そのほか、産業機器のモータ駆動インバータ、ビル空調用のエアコンインバータ等にも用いることができる。
半導体モジュール２１には、例えば、ＩＧＢＴ等の半導体素子とダイオードとを内蔵することができる。 The power converter 1 of this example will be described in detail below.
The power conversion device 1 of this example is a power conversion device such as an inverter used for generating a drive current to be supplied to an AC motor that is a power source of an electric vehicle, a hybrid vehicle, or the like. It can also be used for drive inverters, air conditioner inverters for building air conditioning, and the like.
For example, a semiconductor element such as an IGBT and a diode can be incorporated in the semiconductor module 21.

冷却媒体としては、例えば、エチレングリコール系の不凍液が混入した水、水やアンモニア等の自然冷媒、フロリナート等のフッ化炭素系冷媒、ＨＣＦＣ１２３、ＨＦＣ１３４ａ等のフロン系冷媒、メタノール、アルコール等のアルコール系冷媒、アセトン等のケトン系冷媒などを用いることができる。   Cooling media include, for example, water mixed with ethylene glycol antifreeze, natural refrigerants such as water and ammonia, fluorocarbon refrigerants such as fluorinate, chlorofluorocarbon refrigerants such as HCFC123 and HFC134a, and alcohols such as methanol and alcohol. A refrigerant or a ketone-based refrigerant such as acetone can be used.

半導体積層ユニット２は、上記のごとく、複数の半導体モジュール２１と複数の冷却管２２とを交互に積層してなる。
また、冷却管２２同士は、図１、図２、図４〜図８に示すごとく、上流側においては供給側連結部２２１によって連結されており、下流側においては排出側連結部２２２によって連結されている。 As described above, the semiconductor lamination unit 2 is formed by alternately laminating a plurality of semiconductor modules 21 and a plurality of cooling pipes 22.
Further, as shown in FIGS. 1, 2, and 4 to 8, the cooling pipes 22 are connected to each other on the upstream side by a supply side connecting portion 221 and on the downstream side by a discharge side connecting portion 222. ing.

また、冷媒供給管４１及び冷媒排出管４２を設けた側とは反対側における半導体積層ユニット２とケース３との間には、図１に示すごとく、弾性力を有するバネ部材１１が配設されている。
ここで、ケース３は、バネ部材１１の幅方向の両端部を係止する固定用部材１２が当接する部材当接部３２と、冷媒供給管４１及び冷媒排出管４２を設けた側の端部における冷却管２２の主面に当接する主面当接部３３とを有する。 Further, as shown in FIG. 1, a spring member 11 having elastic force is disposed between the semiconductor laminated unit 2 and the case 3 on the side opposite to the side where the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 are provided. ing.
Here, the case 3 includes a member abutting portion 32 with which the fixing member 12 that engages both ends in the width direction of the spring member 11 abuts, and an end portion on the side where the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 are provided. And a main surface contact portion 33 that contacts the main surface of the cooling pipe 22.

そして、バネ部材１１は、冷媒供給管４１及び冷媒排出管４２を設けた側と反対側の端部における冷却管２２の主面に当接する当接板部１３と固定用部材１２との間において、半導体積層ユニット２をケース３の内部において冷媒供給管４１及び冷媒排出管４２側に向かって押圧する方向に付勢された状態で配設される。
このバネ部材１１の付勢力により、冷媒供給管４１及び冷媒排出管４２を設けた側の端部における冷却管２２の主面が主面当接部３３と当接する。 The spring member 11 is disposed between the fixing plate 12 and the contact plate 13 that contacts the main surface of the cooling pipe 22 at the end opposite to the side where the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 are provided. The semiconductor laminated unit 2 is arranged in a state of being urged in the direction of pressing the semiconductor laminated unit 2 toward the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 in the case 3.
Due to the urging force of the spring member 11, the main surface of the cooling pipe 22 at the end on the side where the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 are provided comes into contact with the main surface contact portion 33.

冷媒供給管４１及び冷媒排出管４２は、図１に示すごとく、側面部の一部に、それぞれケース３の外部から冷媒供給管４１に冷却媒体を供給するための外部供給ホース６２１及び冷媒排出管４２からケース３の外部に冷却媒体を排出するための外部排出ホース６２２を位置決めするためのホース位置決め部６２を有する。そして、本例においては、ホース位置決め部６２は、冷媒供給管４１及び冷媒排出管４２において、治具係合部６１よりも外部供給ホース６２１及び外部排出ホース６２２側に配設されている。   As shown in FIG. 1, the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 are partly provided on an external supply hose 621 and a refrigerant discharge pipe for supplying a cooling medium to the refrigerant supply pipe 41 from the outside of the case 3, respectively. A hose positioning portion 62 for positioning an external discharge hose 622 for discharging the cooling medium from the case 42 to the outside of the case 3 is provided. In this example, the hose positioning portion 62 is disposed on the external supply hose 621 and external discharge hose 622 side of the jig engaging portion 61 in the refrigerant supply pipe 41 and the refrigerant discharge pipe 42.

そして、ホース位置決め部６２は、冷媒供給管４１及び冷媒排出管４２の側面部の一部を外側に向かって突出させた状態で形成されている。すなわち、本例においては、ホース位置決め部６２は、ホース位置決め部６２が形成されていない部分の冷媒供給管４１及び冷媒排出管４２よりも外径が大きい。   And the hose positioning part 62 is formed in the state which made a part of side part of the refrigerant | coolant supply pipe | tube 41 and the refrigerant | coolant discharge pipe 42 protrude toward the outer side. That is, in this example, the hose positioning part 62 has an outer diameter larger than that of the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 where the hose positioning part 62 is not formed.

また、上記のごとく、冷媒供給管４１及び冷媒排出管４２とケース３との間には、防水用のシール材５が配設されている。そして、ケース３の側面部の一部には、図６に示すごとく、シール材５よりも若干径が小さい切欠部３５が形成されている。かかる切欠部３５にシール材５が嵌合されている。   Further, as described above, the waterproof seal material 5 is disposed between the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 and the case 3. Further, as shown in FIG. 6, a cutout portion 35 having a slightly smaller diameter than the seal material 5 is formed in a part of the side surface portion of the case 3. The sealing material 5 is fitted in the notch 35.

次に、本例の電力変換装置１の組立手順につき説明する。
まず、供給側連結部２２１同士及び排出側連結部２２２同士を連結して、図４〜図６に示すような複数の冷却管２２を積層した積層型冷却器２０を形成する。このとき、積層型冷却器２０の片方の端部の冷却管２２には、冷媒供給管４２及び冷媒排出管４１を接続する。 Next, the assembly procedure of the power conversion device 1 of this example will be described.
First, the supply side connecting portions 221 and the discharge side connecting portions 222 are connected to each other to form a stacked cooler 20 in which a plurality of cooling pipes 22 as shown in FIGS. 4 to 6 are stacked. At this time, the refrigerant supply pipe 42 and the refrigerant discharge pipe 41 are connected to the cooling pipe 22 at one end of the stacked cooler 20.

次いで、図４、図５に示すごとく、治具係合部６１に把持治具７を係合させた状態で、把持治具７によって冷媒供給管４１及び冷媒排出管４２を把持する。
次いで、内側の穴が円環形状であって冷媒供給管４１及び冷媒排出管４２の外径よりも若干小さい内径を有するシール材５を、図５に示す矢印Ａの方向に挿入していき、ホース位置決め部６２を通過させた後、治具係合部６１に当接するまで冷媒供給管４１及び冷媒排出管４２の外周に嵌入させる。このとき、シール材５はホース位置決め部６２の外径よりも小さい内径を有するが、例えば伸縮性に優れたゴム部材などを使用すれば、ホース位置決め部６２を容易に通過させることができ、シール性能に影響はない。 Next, as shown in FIGS. 4 and 5, the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 are gripped by the gripping jig 7 with the gripping jig 7 engaged with the jig engaging portion 61.
Next, the sealing material 5 having an inner hole in an annular shape and having an inner diameter slightly smaller than the outer diameter of the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 is inserted in the direction of the arrow A shown in FIG. After passing through the hose positioning part 62, the hose positioning part 62 is fitted into the outer periphery of the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 until it comes into contact with the jig engaging part 61. At this time, the sealing material 5 has an inner diameter smaller than the outer diameter of the hose positioning portion 62. For example, if a rubber member having excellent stretchability is used, the hose positioning portion 62 can be easily passed, There is no impact on performance.

次いで、図６に示すごとく、積層型冷却器２０をケース３に収容する。このとき、切欠部３５にシール材５が嵌合される。
次いで、図７に示すごとく、各冷却管２２同士の間にそれぞれ二個ずつの半導体モジュール２１を並列に挿入して半導体積層ユニット２を形成する。 Next, as shown in FIG. 6, the stacked cooler 20 is accommodated in the case 3. At this time, the sealing material 5 is fitted into the notch 35.
Next, as shown in FIG. 7, two semiconductor modules 21 are inserted in parallel between the cooling pipes 22 to form the semiconductor laminated unit 2.

次いで、図１、図８に示すごとく、冷媒供給管４１及び冷媒排出管４２を設けた側と反対側における半導体積層ユニット２とケース３のばね当接面３２との間にバネ部材１１を配設する。これにより、該バネ部材１１は、固定用部材１２と当接板部１３との間で付勢されて、ケース３の内部において半導体モジュール２１と冷却管２２とが密着するように半導体積層ユニット２を積層方向に押圧する。
さらに、その後、図１に示すごとくホース位置決め手段６２に当接するまで、外部供給ホース６２１及び外部排出ホース６２２を、それぞれ冷媒供給管４１及び冷媒排出管４２に挿入する。 Next, as shown in FIGS. 1 and 8, the spring member 11 is disposed between the semiconductor laminated unit 2 and the spring contact surface 32 of the case 3 on the side opposite to the side where the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 are provided. Set up. As a result, the spring member 11 is urged between the fixing member 12 and the abutting plate portion 13 so that the semiconductor module 21 and the cooling pipe 22 are in close contact with each other inside the case 3. Is pressed in the stacking direction.
Further, thereafter, the external supply hose 621 and the external discharge hose 622 are inserted into the refrigerant supply pipe 41 and the refrigerant discharge pipe 42, respectively, until they abut against the hose positioning means 62 as shown in FIG.

なお、本例においては、図１に示すごとく、冷媒供給管４１及び冷媒排出管４２を外側に向かって突出させてなる治具係合部６１を示したが、治具係合部６１は、例えば、冷媒供給管４１及び冷媒排出管４２の外周に別部材を取り付けて形成することもできる。
また、冷媒供給管４１及び冷媒排出管４２における治具係合部６１とホース位置決め部６２との間に、シール材５を位置決めするためのシール位置決め部を形成することもできる。 In addition, in this example, as shown in FIG. 1, the jig engagement portion 61 formed by projecting the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 toward the outside is shown. For example, separate members can be attached to the outer periphery of the refrigerant supply pipe 41 and the refrigerant discharge pipe 42.
In addition, a seal positioning portion for positioning the sealing material 5 can be formed between the jig engaging portion 61 and the hose positioning portion 62 in the refrigerant supply pipe 41 and the refrigerant discharge pipe 42.

次に、本例の作用効果につき説明する。
冷媒供給管４１及び冷媒排出管４２は、シール材５よりも半導体積層ユニット２側の側面部の一部に、冷媒供給管４１及び冷媒排出管４２を把持する把持治具７を係合するための治具係合部６１を有する。かかる構成によれば、把持治具７によって冷媒供給管４１及び冷媒排出管４２を把持した状態で、シール材５を冷媒供給管４１及び冷媒排出管４２に配設することができる。したがって、シール材５を配設するに当たって、積層された複数の冷却管２２に力が作用することを防ぐことができる。
それゆえ、冷却管２２を変形させることなく冷媒供給管４１及び冷媒排出管４２にシール材５を配設することができる。 Next, the function and effect of this example will be described.
The refrigerant supply pipe 41 and the refrigerant discharge pipe 42 are for engaging the holding jig 7 that holds the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 with a part of the side surface portion closer to the semiconductor lamination unit 2 than the sealing material 5. The jig engaging portion 61 is provided. According to such a configuration, the sealing material 5 can be disposed on the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 in a state where the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 are held by the holding jig 7. Therefore, when the sealing material 5 is disposed, it is possible to prevent a force from acting on the plurality of stacked cooling pipes 22.
Therefore, the sealing material 5 can be disposed on the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 without deforming the cooling pipe 22.

また、治具係合部６１は、冷媒供給管４１及び冷媒排出管４２の側面部の一部を外側に向かって突出させた状態で形成されている。すなわち、冷媒供給管４１及び冷媒排出管４２を内側から外側に向かって突出させることにより、治具係合部６１を容易に形成することができる。また、把持治具７を治具係合部６１の冷却管２２側の面に当接させながら、シール材５を冷媒供給管４１及び冷媒排出管４２に嵌合させることができる。また、冷媒供給管４１内及び冷媒排出管４２内の断面積が小さくなることがないため、冷却媒体の流量が低減することもない。   Moreover, the jig engaging part 61 is formed in a state in which a part of the side surface part of the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 protrudes outward. That is, the jig engaging portion 61 can be easily formed by projecting the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 from the inside toward the outside. Further, the sealing material 5 can be fitted to the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 while the gripping jig 7 is brought into contact with the surface of the jig engaging portion 61 on the cooling pipe 22 side. Further, since the cross-sectional areas in the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 are not reduced, the flow rate of the cooling medium is not reduced.

また、治具係合部６１は、冷媒供給管４１及び冷媒排出管４２における側面部の一部の全周にわたって形成されているため、把持治具７を治具係合部６１に確実に係合することができる。
また、ホース位置決め部６２は、冷媒供給管４１及び冷媒排出管４２の一部を変形させてなる。これにより、ホース位置決め部６２を目印として、外部供給ホース６２１及び外部排出ホース６２２を、冷媒供給管４１及び冷媒排出管４２の所定の位置に容易に配置することができる。 Further, since the jig engaging portion 61 is formed over the entire circumference of a part of the side surface portion of the refrigerant supply pipe 41 and the refrigerant discharge pipe 42, the gripping jig 7 is securely engaged with the jig engaging portion 61. Can be combined.
The hose positioning part 62 is formed by deforming a part of the refrigerant supply pipe 41 and the refrigerant discharge pipe 42. Thereby, the external supply hose 621 and the external discharge hose 622 can be easily arranged at predetermined positions of the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 with the hose positioning part 62 as a mark.

また、ホース位置決め部６２は、冷媒供給管４１及び冷媒排出管４２の側面部の一部を外側に向かって突出させた状態で形成されている。そのため、外部供給ホース６２１及び外部排出ホース６２２を、ホース位置決め部６２に当接させることにより冷媒供給管４１及び冷媒排出管４２のそれぞれの所定の位置に容易に配置することができる。   Moreover, the hose positioning part 62 is formed in a state in which part of the side parts of the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 protrudes outward. Therefore, the external supply hose 621 and the external discharge hose 622 can be easily disposed at predetermined positions of the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 by contacting the hose positioning portion 62.

以上のごとく、本例によれば、積層された複数の冷却管を変形させることなく冷媒供給管及び冷媒排出管にシール材を配設することができる電力変換装置を提供することができる。   As described above, according to this example, it is possible to provide a power conversion device that can dispose a sealing material on a refrigerant supply pipe and a refrigerant discharge pipe without deforming a plurality of stacked cooling pipes.

（実施例２）
本例は、図９、図１０に示すごとく、治具係合部６１が、冷媒供給管４１及び冷媒排出管４２の側面部の一部を内側に向かって窪ませた状態で形成されている半導体積層ユニット２の例である。すなわち、本例においては、治具係合部６１は、治具係合部６１が形成されていない部分の冷媒供給管４１及び冷媒排出管４２よりも外径が小さい。
そして、本例の半導体積層ユニット２においては、図１０に示すごとく、把持治具７を治具係合部６１に嵌入させて係合させながら、シール材５を冷媒供給管４１及び冷媒排出管４２に嵌合させることができる。 (Example 2)
In this example, as shown in FIGS. 9 and 10, the jig engaging portion 61 is formed in a state where a part of the side surface portions of the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 are recessed inward. 2 is an example of a semiconductor stacked unit 2. That is, in this example, the jig engaging portion 61 has an outer diameter smaller than that of the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 where the jig engaging portion 61 is not formed.
In the semiconductor laminated unit 2 of this example, as shown in FIG. 10, the sealing material 5 is inserted into and engaged with the jig engaging portion 61 while the gripping jig 7 is engaged with the refrigerant supply pipe 41 and the refrigerant discharge pipe. 42 can be fitted.

なお、上記治具係合部６１を、冷媒供給管４１及び冷媒排出管４２の側面部の一部において全周ではなく外周の一部に形成することとすれば、治具係合部６１以外の部分で内部の通水路の断面積を確保することができ、冷媒供給管４１内及び冷媒排出管４２内の断面積が小さくなることを抑制することができる。その結果、冷媒供給管４１及び冷媒排出管４２内を流れる冷却媒体の流量が低減することを抑制することができる。
その他は、実施例１と同様の構成及び作用効果を有する。 Note that if the jig engaging portion 61 is formed not on the entire circumference but on a part of the outer periphery in part of the side surfaces of the refrigerant supply pipe 41 and the refrigerant discharge pipe 42, the jig engaging section 61 is not included. It is possible to secure the cross-sectional area of the internal water passage in this portion, and it is possible to suppress the cross-sectional areas in the refrigerant supply pipe 41 and the refrigerant discharge pipe 42 from becoming small. As a result, it is possible to suppress a reduction in the flow rate of the cooling medium flowing through the refrigerant supply pipe 41 and the refrigerant discharge pipe 42.
Others have the same configuration and effects as the first embodiment.

実施例１における、電力変換装置の上面図。The top view of the power converter device in Example 1. FIG. 実施例１における、半導体積層ユニットの上面図。FIG. 3 is a top view of the semiconductor stacked unit in the first embodiment. 実施例１における、冷媒供給管及び冷媒排出管の斜視図。FIG. 2 is a perspective view of a refrigerant supply pipe and a refrigerant discharge pipe in the first embodiment. 実施例１における、冷媒供給管及び冷媒排出管にシール材を配設している状態を示す説明図。FIG. 3 is an explanatory diagram illustrating a state in which a sealing material is disposed in the refrigerant supply pipe and the refrigerant discharge pipe in the first embodiment. 実施例１における、冷媒供給管及び冷媒排出管にシール材を配設した後の状態を示す説明図。Explanatory drawing which shows the state after arrange | positioning the sealing material in the refrigerant | coolant supply pipe | tube and the refrigerant | coolant discharge pipe in Example 1. FIG. 実施例１における、ケースに積層冷却器を配設している状態を示す斜視説明図。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory perspective view showing a state in which a laminated cooler is disposed in a case in Example 1. 実施例１における、半導体モジュールを積層冷却器に配設して半導体積層ユニットを構成している状態を示す斜視説明図。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective explanatory view showing a state in which a semiconductor stacked unit is configured by disposing a semiconductor module in a stacked cooler in Example 1; 実施例１における、押圧部材により、冷却管同士の間隔を狭めている状態を示す斜視説明図。FIG. 3 is a perspective explanatory view showing a state where the interval between the cooling pipes is narrowed by the pressing member in the first embodiment. 実施例２における、半導体積層ユニットの側面図。The side view of the semiconductor lamination unit in Example 2. 実施例２における、冷媒供給管及び冷媒排出管にシール材を配設している状態を示す説明図。FIG. 6 is an explanatory diagram illustrating a state in which a sealing material is disposed on the refrigerant supply pipe and the refrigerant discharge pipe in the second embodiment. 従来例における、電力変換装置の上面図。The top view of the power converter device in a prior art example.

符号の説明Explanation of symbols

１ 電力変換装置
２ 半導体積層ユニット
２１ 半導体モジュール
２２ 冷却管
３ ケース
４１ 冷媒供給管
４２ 冷媒排出管
６１ 治具係合部 DESCRIPTION OF SYMBOLS 1 Power converter 2 Semiconductor lamination | stacking unit 21 Semiconductor module 22 Cooling pipe 3 Case 41 Refrigerant supply pipe 42 Refrigerant discharge pipe 61 Jig engaging part

Claims (6)

電力変換回路の一部を構成する複数の半導体モジュールと該複数の半導体モジュールを冷却する互いに連結された複数の冷却管とを交互に積層してなる半導体積層ユニットと、該半導体積層ユニットを内側に収容するケースとを有する電力変換装置であって、
上記半導体積層ユニットは、上記ケースの外部から上記複数の冷却管の内部に冷却媒体を供給するための冷媒供給管と、上記複数の冷却管から上記ケースの外部に冷却媒体を排出するための冷媒排出管とを、積層方向の一端の上記冷却管にそれぞれ接続してなり、
上記冷媒供給管及び上記冷媒排出管と上記ケースとの間には、防水用のシール材が配設されており、
上記冷媒供給管及び上記冷媒排出管は、上記シール材よりも上記半導体積層ユニット側の側面部の一部に、上記冷媒供給管及び上記冷媒排出管を把持する把持治具を係合するための治具係合部を有することを特徴とする電力変換装置。 A plurality of semiconductor modules constituting a part of the power conversion circuit and a plurality of mutually connected cooling pipes for cooling the plurality of semiconductor modules, and a semiconductor lamination unit on the inside A power conversion device having a case to house,
The semiconductor laminated unit includes a refrigerant supply pipe for supplying a cooling medium from the outside of the case to the inside of the plurality of cooling pipes, and a refrigerant for discharging the cooling medium from the plurality of cooling pipes to the outside of the case A discharge pipe is connected to the cooling pipe at one end in the stacking direction,
Between the refrigerant supply pipe and the refrigerant discharge pipe and the case, a waterproof sealing material is disposed,
The coolant supply pipe and the coolant discharge pipe are for engaging a gripping jig for gripping the coolant supply pipe and the coolant discharge pipe with a part of the side surface portion closer to the semiconductor lamination unit than the sealing material. A power converter having a jig engaging portion. 請求項１において、上記治具係合部は、上記冷媒供給管及び上記冷媒排出管の側面部の一部を外側に向かって突出させた状態で形成されていることを特徴とする電力変換装置。   2. The power converter according to claim 1, wherein the jig engaging portion is formed in a state in which a part of a side surface portion of the refrigerant supply pipe and the refrigerant discharge pipe is protruded outward. . 請求項１において、上記治具係合部は、上記冷媒供給管及び上記冷媒排出管の側面部の一部を内側に向かって窪ませた状態で形成されていることを特徴とする電力変換装置。   2. The power conversion device according to claim 1, wherein the jig engaging portion is formed in a state in which a part of a side surface portion of the refrigerant supply pipe and the refrigerant discharge pipe is recessed inward. . 請求項１〜３のいずれか一項において、上記治具係合部は、上記冷媒供給管及び上記冷媒排出管における側面部の一部の全周にわたって形成されていることを特徴とする電力変換装置。   4. The power conversion according to claim 1, wherein the jig engaging portion is formed over a whole circumference of a part of a side surface portion of the refrigerant supply pipe and the refrigerant discharge pipe. apparatus. 請求項１〜４のいずれか一項において、上記冷媒供給管及び上記冷媒排出管は、側面部の一部に、それぞれ上記ケースの外部から上記冷媒供給管に冷却媒体を供給するための外部供給ホース及び上記冷媒排出管から上記ケースの外部に冷却媒体を排出するための外部排出ホースを位置決めするためのホース位置決め部を有し、該ホース位置決め部は、上記冷媒供給管及び上記冷媒排出管の一部を変形させてなることを特徴とする電力変換装置。   The refrigerant supply pipe and the refrigerant discharge pipe according to any one of claims 1 to 4, wherein the refrigerant supply pipe and the refrigerant discharge pipe are externally supplied to a part of the side surface portion from the outside of the case to the refrigerant supply pipe. A hose positioning part for positioning an external discharge hose for discharging the cooling medium from the hose and the refrigerant discharge pipe to the outside of the case, the hose positioning part being provided for the refrigerant supply pipe and the refrigerant discharge pipe; A power converter characterized by being partially deformed. 請求項５において、上記ホース位置決め部は、上記冷媒供給管及び上記冷媒排出管の側面部の一部を外側に向かって突出させた状態で形成されていることを特徴とする電力変換装置。   6. The power conversion device according to claim 5, wherein the hose positioning portion is formed in a state in which a part of side portions of the refrigerant supply pipe and the refrigerant discharge pipe are protruded outward.
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