JP2012195559A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device which can easily fix a semiconductor module and a cooler.SOLUTION: A semiconductor device 10 comprises: a semiconductor module 40; a cooler 30 for cooling the semiconductor module 40; a terminal board 20 with a capacitor to be electrically connected with a terminal of the semiconductor module 40; a leaf spring 50 serving as a spring member; and a bracket 60 serving as a spring member support. The leaf spring 50 is arranged on the semiconductor module 40 and the cooler 30 arranged on the terminal board 20 with the capacitor in a laminated manner to push the semiconductor module 40 and the cooler 30 toward the terminal board 20. The bracket 60 is arranged on the leaf spring 50 and fixed to the terminal board 20 with the capacitor to bias the leaf spring 50 to push the semiconductor module 40 and the cooler 30 toward the terminal board 20 with the capacitor.

Description

  The present invention relates to a semiconductor device.

  Patent Document 1 discloses a technique for pressing and fixing a semiconductor module to a heat sink or a heat radiating plate with a pressing plate spring and its reinforcing beam. Specifically, a presser leaf spring is disposed on the semiconductor module, and a reinforcing beam for reinforcing the presser leaf spring is disposed thereon. In addition, a heat sink or a heat sink is disposed under the semiconductor module. The semiconductor module is fixed to the heat sink or the heat radiating plate through the screw through hole of the semiconductor module from the side of the reinforcing beam with screws through the reinforcing beam and the pressing leaf spring.

JP 2007-329167 A

  However, because the structure is such that the semiconductor module is pressed against the heat sink or the heat sink by the holding plate spring and the reinforcing beam, a screw for fixing the heat sink or the heat sink is required, and the semiconductor module has a screw through hole. It is necessary to provide.

  An object of the present invention is to provide a semiconductor device capable of easily fixing a semiconductor module and a cooler.

  In the invention according to claim 1, the semiconductor module, a cooler for cooling the semiconductor module, a terminal block for electrically connecting to a terminal of the semiconductor module, and a layered arrangement on the terminal block are arranged. A spring member for pressing the semiconductor module and the cooler against the terminal block; and a spring member disposed on the spring member. And a spring member support for applying an urging force for pressing the semiconductor module and the cooler against the terminal block.

  According to invention of Claim 1, a semiconductor module and a cooler are laminated | stacked and arrange | positioned on a terminal block, and a spring member is arrange | positioned on this. The semiconductor module and the cooler are pressed against the terminal block by the spring member. At this time, an urging force for pressing the semiconductor module and the cooler against the terminal block is applied to the spring member by the spring member supporter disposed on the spring member. As a result, the semiconductor module and the cooler can be easily fixed.

According to a second aspect of the present invention, there is provided a semiconductor device according to the first aspect, wherein a control board for controlling the semiconductor module is fixed on the spring member support.
According to the second aspect of the present invention, since the control board for controlling the semiconductor module is fixed on the spring member support, a member for fixing the control board can be dispensed with.

  The invention according to claim 3 is summarized in that in the semiconductor device according to claim 2, the spring member support is used as a noise shield material between the semiconductor module and the control board.

  According to the third aspect of the present invention, even if noise occurs in the semiconductor module, the spring member supporter functions as a noise shield material, and the control board can be made less susceptible to noise.

  In invention of Claim 4, in the semiconductor device of any one of Claims 1-3, the said cooler is arrange | positioned on the said terminal block, and the said semiconductor module is arrange | positioned on the said cooler The gist is that a capacitor is embedded in the terminal block.

According to the fourth aspect of the present invention, the capacitor embedded in the terminal block can be cooled by the cooler.
The gist of the invention described in claim 5 is that, in the semiconductor device according to any one of claims 1 to 4, coolers are stacked and arranged above and below the semiconductor module.

According to invention of Claim 5, a semiconductor module can be further cooled using the cooler laminated | stacked on the upper and lower sides of the semiconductor module.
The gist of the invention described in claim 6 is that, in the semiconductor device according to any one of claims 1 to 5, the terminal block and the terminal of the semiconductor module are positioned by concave-convex fitting.

According to invention of Claim 6, a terminal block and the terminal of a semiconductor module can be easily positioned by uneven | corrugated fitting.
As described in claim 7, in the semiconductor device according to any one of claims 1 to 6, the terminal block is made of a resin and is electrically connected to a terminal of the semiconductor module. It can be set as the structure which has these.

  According to an eighth aspect of the present invention, in the semiconductor device according to any one of the first to seventh aspects, the terminals for power supply are collectively arranged on one of both sides sandwiching the semiconductor module, and the other The gist is that terminals for control signals are arranged in an integrated manner. According to the eighth aspect of the present invention, the wiring configuration can be simplified. As a result, it is possible to reduce the size without generating a useless space in the apparatus.

  According to a ninth aspect of the present invention, in the semiconductor device according to any one of the first to eighth aspects, the size of the surface of the cooler and the spring member support that faces the semiconductor module is the semiconductor. The gist is that it is set based on the dimensions of the module mounting area. According to the ninth aspect of the present invention, it is possible to reduce the size without generating a useless space in the apparatus.

  According to a tenth aspect of the present invention, in the semiconductor device according to any one of the first to ninth aspects, the terminal block has a mounting portion on which the cooler is mounted, and the spring member support is fixed. The gist is to have a fixing part. According to the invention described in claim 10, the terminal block can be provided with a function as a part for mounting the cooler and a part for fixing the spring member support. That is, as compared with a case where the fixing portion of the spring member support is separately provided in another component, it is possible to reduce the size of the device without generating a useless space in the device.

  According to the present invention, the semiconductor module and the cooler can be easily fixed.

The top view of the semiconductor device in this embodiment. The longitudinal cross-sectional view of the semiconductor device in the AA line of FIG. The electric block diagram of the driving motor drive system of a hybrid vehicle. (A) is a top view for demonstrating the component structure of a semiconductor device, (b) is a longitudinal cross-sectional view in the AA of (a). (A) is a top view for demonstrating the component structure of a semiconductor device, (b) is a longitudinal cross-sectional view in the AA of (a). (A) is a top view for demonstrating the component structure of a semiconductor device, (b) is a longitudinal cross-sectional view in the AA of (a). (A) is a top view for demonstrating the component structure of a semiconductor device, (b) is a longitudinal cross-sectional view in the AA of (a). The perspective view which shows the whole semiconductor device. The top view which shows the state which removed the cover from the upper housing | casing of the semiconductor device. The top view which shows the state which mounted the cooler on the upper part of the terminal block with a capacitor | condenser. The top view which shows the state which mounted the semiconductor module on the upper part of a cooler. The top view which shows the state which mounted the leaf | plate spring in the upper part of the semiconductor module. The top view which shows the state which mounted the bracket on the upper part of a leaf | plate spring. The top view which shows the state which mounted the circuit board for control on the upper part of a bracket. The top view which shows the back surface side of a bracket. The longitudinal cross-sectional view of the semiconductor device of another example. (A) is a top view for demonstrating the component structure in the semiconductor device of another example, (b) is a longitudinal cross-sectional view in the AA line of (a). FIG. 6 is a longitudinal sectional view corresponding to the line AA in FIG.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
As shown in FIGS. 1 and 2, the semiconductor device 10 according to this embodiment includes a terminal block with a capacitor 20, a cooler 30, a semiconductor module 40, a leaf spring 50 as a spring member, and a spring member support. A bracket 60 and a control circuit board 70 as a control board are provided.

  The terminal block with capacitor 20 is disposed inside the aluminum casing 80, and the terminal block with capacitor 20 is fixed to the casing 80 by screws S1. Specifically, the terminal block 20 with a capacitor is placed on the inner bottom surface of a box-shaped casing 80 having an open top surface, and the terminal S of the casing 80 passes through the mounting arm 20a of the terminal block 20 with a capacitor through the screw S1. The terminal block with capacitor 20 is attached to the housing 80 by being screwed into the attachment portion 80a.

  The terminal block with capacitor 20 includes a resin insulating base 21 and a capacitor 22. A capacitor 22 is embedded in the insulating base 21 by molding, and the insulating base 21 and the capacitor 22 are integrated. The capacitor 22 is exposed on one side surface 21 a of the insulating base 21.

  A recess 27 is formed on the upper surface 21 b of the insulating base 21, and a cooler 30 is placed on the bottom surface of the recess 27. The heat generated in the capacitor 22 is released to the cooler 30 through the insulating base 21 of the terminal block with capacitor 20.

  The semiconductor module 40 is placed on the cooler 30 via the silicone grease 90. The heat generated in the semiconductor module 40 is released to the cooler 30 through the silicone grease 90.

In the present embodiment, the semiconductor module 40 constitutes the upper and lower arms (for one phase) of the inverter of FIG.
Here, the electrical configuration of the semiconductor device of this embodiment will be described with reference to FIG.

  In FIG. 3, the semiconductor device constitutes a travel motor drive device of a hybrid vehicle. The hybrid vehicle includes a battery 100, a traveling motor 110, an inverter 130 that drives the traveling motor 110, and a boost converter 120 provided between the battery 100 and the inverter 130. The voltage is boosted by the boost converter 120. Boost converter 120 includes low voltage capacitor 121, reactor 122, upper arm transistor 123, diode D 1, lower arm transistor 124, diode D 2, and high voltage capacitor 125. The transistors 123 and 124 are IGBTs, and are turned on / off by adjusting the gate voltage.

  The transistors 123 and 124 are connected in series between the power supply line of the inverter 130 and the earth line. The collector of the transistor 123 is connected to the power supply line, and the emitter of the transistor 123 is connected to the collector of the transistor 124. The emitter of the transistor 124 is connected to the ground line and the negative electrode of the battery 100. A connection point A between the emitter of the transistor 123 and the collector of the transistor 124 is connected to one end of the reactor 122. The other end of the reactor 122 is connected to the positive electrode of the battery 100. Diodes D1 and D2 are respectively connected between the collector and emitter of the transistor 123 and the transistor 124 so that a current flows from the emitter side to the collector side.

  A low voltage capacitor 121 is connected to an input terminal (a connection terminal with the battery 100) of the boost converter 120. Further, a high voltage capacitor 125 is connected to a connection terminal (between the power supply line and the ground line of the inverter 130) to the inverter 130 which is an output terminal of the boost converter 120. That is, the high voltage capacitor 125 is connected in parallel to the upper arm transistor 123 and the lower arm transistor 124 connected in series.

  Inverter 130 converts the DC power supplied from boost converter 120 into AC power and supplies it to traveling motor 110. As a result, the traveling motor 110 is rotationally driven. Specifically, inverter 130 includes U-phase, V-phase, and W-phase arms arranged in parallel with each other between a power supply line and an earth line. Each arm is composed of two transistors (IGBT) 131, 132, 133, 134, 135, 136 connected in series. Further, diodes D3, D4, D5, D6, D7, and D8 that flow current from the emitter side to the collector side are respectively provided between the collectors and the emitters of the transistors 131, 132, 133, 134, 135, and 136 that constitute each arm. Has been placed.

  Returning to the description of FIGS. 1 and 2, FIGS. 4A and 4B show a state where the control circuit board 70 in FIGS. FIGS. 5A and 5B show a state where the bracket 60 in FIGS. 4A and 4B is removed. FIGS. 6A and 6B show a state in which the leaf spring 50 in FIGS. 5A and 5B is removed. FIGS. 7A and 7B show a state where the semiconductor module 40 in FIGS. 6A and 6B is removed.

  In FIG. 7, the terminal block with capacitor 20 is used for fixing the cooler 30 and fastening power terminals of the semiconductor module 40. A bracket mounting portion 28 is erected on the upper surface 21b of the insulating base 21 in the terminal block 20 with a capacitor. A plurality of the bracket attaching portions 28 are provided. A screw hole 28 a is provided on the upper surface of each bracket mounting portion 28.

  The capacitor 22 of the terminal block with capacitor 20 constitutes the high-voltage capacitor 125 of FIG. 3 and has a positive electrode terminal 23 and a negative electrode terminal 24. The positive electrode terminal 23 and the negative electrode terminal 24 have a strip shape. The positive electrode terminal 23 and the negative electrode terminal 24 extend upward along one side surface 21 a of the insulating base 21, and further extend in the horizontal direction along the upper surface 21 b of the insulating base 21.

  Further, an output terminal (connection terminal) 25 is arranged in parallel between the positive terminal 23 and the negative terminal 24 on the upper surface 21 b of the insulating base 21. The output terminal 25 has a strip shape. The output terminal 25 extends to a connector 81 (see FIG. 1) provided on the housing 80.

  The cooler 30 has a thin box shape, and is a water-cooling type in which cooling water passes through and cools. The cooler 30 is arranged such that its lower surface is in contact with the bottom surface of the concave portion 27 of the terminal block with capacitor 20.

  In FIG. 6, the semiconductor module 40 is placed on the cooler 30 via the silicone grease 90. One semiconductor module 40 includes the transistors 131 and 132 and the diodes D3 and D4 shown in FIG. That is, the transistors 131 and 132 as the semiconductor elements and the diodes D3 and D4 are sealed with resin.

  In FIG. 6 and the like, only one semiconductor module 40 of the three semiconductor modules is illustrated. That is, in addition to the semiconductor module 40 including the transistors 131 and 132 and the diodes D3 and D4 in FIG. 3, the semiconductor module including the transistors 133 and 134 and the diodes D5 and D6, and the transistors 135 and 136 and the diodes D7 and D8. The semiconductor module having a built-in structure is configured similarly to the semiconductor module 40. The other two semiconductor modules other than the semiconductor module 40 are juxtaposed with the semiconductor module 40 on the cooler 30. A three-phase inverter 130 is constituted by these three semiconductor modules.

  The semiconductor module 40 includes a main body 41, a control signal terminal 42, an output terminal 43, a power line terminal 44, and a ground line terminal 45. A semiconductor element is resin-sealed in the main body portion 41 to form a thin box shape. Each terminal 42, 43, 44, 45 protrudes from the side surface of the main body 41. A plurality of control signal terminals 42 made of pins are provided and extend upward. The output terminal 43, the power supply line terminal 44, and the ground line terminal 45 are plate-like and extend in a state of being arranged horizontally. The output terminal 43, the power line terminal 44, and the ground line terminal 45 of the semiconductor module 40 are connected to each terminal (positive terminal 23, negative terminal 24) of the capacitor 22 on the upper surface 21b of the insulating base 21 of the terminal block with capacitor 20, and It extends toward the output terminal 25.

  Under the power supply line terminal 44 of the semiconductor module 40, the positive electrode terminal 23 of the capacitor 22 is laminated and disposed. In addition, the negative electrode terminal 24 of the capacitor 22 is laminated and disposed under the ground line terminal 45 of the semiconductor module 40. Further, the output terminal 25 is stacked and disposed under the output terminal 43 of the semiconductor module 40. Then, by screwing the screw S2 for fastening the semiconductor module into the terminal block with capacitor 20, the power line terminal 44 of the semiconductor module 40 and the positive terminal 23 of the capacitor 22 are connected to the ground line terminal 45 of the semiconductor module 40. The negative terminal 24 of the capacitor 22 is electrically connected to the output terminal 43 and the output terminal 25 of the semiconductor module 40. The output terminal 25 is connected to an external device (travel motor 110) via the connector 81. In this way, the terminal block with capacitor 20 can be electrically connected to the terminals of the semiconductor module 40.

  In FIG. 5, the leaf | plate spring 50 is mounted on the semiconductor module 40, and the leaf | plate spring 50 consists of spring steel plates. The leaf spring 50 as a spring member is bent so that the central portion 51 is horizontal and the both side portions 52 spread obliquely downward.

In FIG. 4, a bracket 60 is disposed on the leaf spring 50. The bracket 60 is made of a metal plate material such as aluminum.
The main body 61 of the bracket 60 has a rectangular plate shape. A plurality of control circuit board mounting column portions 62 are formed on the upper surface of the main body portion 61 of the bracket 60. A screw hole 62a is provided on the upper surface of each control circuit board mounting column 62.

  A bracket 60 is placed on the bracket mounting portion 28 of the insulating base 21 of the terminal block with capacitor 20. The bracket 60 is fixed to the capacitor-equipped terminal block 20 by screwing the bracket fixing screw S3 through the bracket 60 into the bracket mounting portion 28 of the insulating base 21 of the capacitor-equipped terminal block 20. . That is, the bracket 60 can be fixed to the terminal block with capacitor 20 with the screw S3.

  At this time, the plate spring 50 is deformed by pressing the bracket 60 from above. As a result, the semiconductor module 40 and the cooler 30 are pressed downward by the downward biasing force of the leaf spring 50.

  In this way, the semiconductor module 40 and the cooler 30 can be sandwiched between the bracket 60 (plate spring 50) and the terminal block with capacitor 20, and the semiconductor module 40 and the cooler 30 are pressed and fixed by the plate spring 50. is doing. At this time, the fixing screw for the semiconductor module 40 is not required, and the fixing screw for the cooler 30 is not required.

  In addition, both the semiconductor module 40 and the capacitor 22 are cooled by the cooler 30. Furthermore, by stacking and supporting the semiconductor module 40, the cooler 30, and the capacitor 22, the wiring is shortened and the inductance is reduced.

  1 and 2, a rectangular control circuit board 70 is placed on the control circuit board mounting column 62 of the bracket 60. The control circuit board 70 is fixed by screwing the control circuit board fixing screw S4 through the control circuit board 70 and screwing it into the control circuit board mounting column 62 of the bracket 60. .

  The control circuit board 70 is electrically connected to the semiconductor module 40 by a control signal terminal (pin) 42 of the semiconductor module 40. A control device (IC or the like) for driving the transistors 131 and 132 of the semiconductor module 40 is mounted on the control circuit board 70. The bracket 60 is also grounded (grounded) and functions as a noise shield plate between the semiconductor module 40 and the control circuit board 70. That is, even if radiation noise occurs in the semiconductor module 40 due to the switching operation of the transistors 131 and 132, the bracket 60 serves as a noise shield material, and adverse effects on the control circuit board 70 can be reduced.

Next, the operation of the semiconductor device 10 configured as described above will be described.
When assembling, first, as shown in FIGS. 7A and 7B, the cooler 30 is placed on the bottom surface of the concave portion 27 of the terminal block 20 with a capacitor. At this time, silicone grease 90 is applied to the upper surface of the cooler 30.

The silicone grease 90 may be applied to the back surface of each semiconductor module 40.
Then, as shown in FIGS. 6A and 6B, the semiconductor module 40 is placed on the cooler 30 via the silicone grease 90. Further, the screws S2 are connected to each other (the power line terminal 44 of the semiconductor module 40 and the positive terminal 23 of the capacitor 22, the ground line terminal 45 of the semiconductor module 40, the negative terminal 24 of the capacitor 22, and the output terminal 43 of the semiconductor module 40). The output terminal 25) is fixed.

Subsequently, the leaf spring 50 is placed on the semiconductor module 40 as shown in FIGS.
Then, as shown in FIGS. 4A and 4B, the bracket 60 is placed on the terminal block 20 with a capacitor from above the leaf spring 50, and is fastened with a screw S3. At this time, the semiconductor module 40 and the cooler 30 are urged by the urging force of the leaf spring 50, and the movement is restricted.

Further, as shown in FIGS. 1 and 2, the control circuit board 70 is placed on the bracket 60 and fixed with screws S <b> 4.
The terminals may be fixed after the bracket 60 is fixed.

  In this way, the plate spring 50 is pressed by the bracket 60, and the plate spring 50 simultaneously presses and fixes the semiconductor module 40 under the plate spring 50 and the cooler 30 thereunder to the terminal block 20 with a capacitor. can do.

According to the above embodiment, the following effects can be obtained.
(1) The semiconductor device 10 includes a semiconductor module 40, a cooler 30 for cooling the semiconductor module 40, a terminal block 20 with a capacitor for electrical connection with terminals of the semiconductor module 40, and a spring member. A leaf spring 50 and a bracket 60 as a spring member support are provided. The leaf spring 50 is disposed on the semiconductor module 40 and the cooler 30 that are stacked on the terminal block 20 with capacitor, and presses the semiconductor module 40 and the cooler 30 against the terminal block 20 with capacitor. belongs to. The bracket 60 is disposed on the leaf spring 50 and is fixed to the terminal block 20 with a capacitor, and a biasing force for pressing the semiconductor module 40 and the cooler 30 against the terminal block 20 with the capacitor against the leaf spring 50. It is for giving.

  As a result, in the structure in which the semiconductor module is pressed against and fixed to the heat sink or the heat sink by the holding plate spring and the reinforcing beam as disclosed in Patent Document 1, screws for fixing the heat sink or the heat sink are required. In addition, there is a restriction that the semiconductor module is limited to a semiconductor module provided with a screw through hole at the center. On the other hand, in the present embodiment, a dedicated screw for fixing the cooler 30 is not required, and a screw through hole is not required in the semiconductor module 40, so that it is difficult to be restricted.

  As a result, the semiconductor module 40 and the cooler 30 can be easily fixed. In addition, fixing members (screws or the like) for the semiconductor module 40 and the cooler 30 are not required, the number of parts can be reduced, and cost and size can be reduced.

  Furthermore, in the semiconductor device described in Patent Document 1, a reinforcing beam is required only for reinforcing the pressing plate spring, but in this embodiment, the reinforcing beam can be omitted. Furthermore, in the semiconductor device disclosed in Patent Document 1, no merit (such as downsizing) can be expected in the entire semiconductor device, but in this embodiment, downsizing or the like can be achieved.

  (2) Since the capacitor 22 is embedded in the terminal block (20), the capacitor 22 can be cooled by the cooler 30. More specifically, since the cooler 30 is in close contact with both the semiconductor module 40 and the terminal block with capacitor 20, the capacitor 22 inside the semiconductor module 40 and the terminal block with capacitor 20 can be cooled. As described above, the semiconductor device of Patent Document 1 does not have a structure in which the surface opposite to the surface on which the semiconductor module is pressed and fixed in the heat sink or the heat radiating plate can be effectively used. The surface opposite to the surface on which the semiconductor module 40 is pressed and fixed can be effectively used as the heat dissipation surface.

(3) Since the semiconductor module 40 and the terminal block 20 with a capacitor can be arranged close to each other, the electrical wiring is shortened, and the wiring inductance can be reduced.
(4) Since the control circuit board 70 as the control board for controlling the semiconductor module 40 is fixed on the bracket 60, a member for fixing the control circuit board 70 can be made unnecessary. That is, since the control circuit board 70 is fixed to the bracket 60, it is not necessary to attach the control circuit board 70 to another member as in the prior art.

  (5) Since the bracket 60 is used as a noise shield material between the semiconductor module 40 and the control circuit board 70, even if noise occurs in the semiconductor module 40, the bracket 60 functions as a noise shield material and is controlled. The circuit board 70 can be less affected by noise. Further, by using the bracket 60 as a noise shield material, it is not necessary to separately provide a dedicated noise shield material.

  (6) Since the terminal block with capacitor 20 is made of resin and has a positive electrode terminal 23, a negative electrode terminal 24, and an output terminal 25 as terminal portions electrically connected to the terminals of the semiconductor module 40, it is practically preferable.

(Second Embodiment)
Hereinafter, a second embodiment of the present invention will be described with reference to FIGS.
Note that, in the embodiments described below, the same components as those in the embodiments described above are denoted by the same reference numerals, and redundant descriptions thereof are omitted or simplified.

  As shown in FIG. 8, the housing K of the semiconductor device 10A includes an upper housing Ka and a lower housing Kb. Both the upper casing Ka and the lower casing Kb are made of aluminum. The housing K has a space for housing various components constituting the semiconductor device 10A inside by fastening the upper housing Ka and the lower housing Kb at a plurality of locations (seven locations in the present embodiment) with bolts B1. It is formed. Similarly to the semiconductor device 10 described in the first embodiment, the housing K includes, in order from the bottom, a terminal block with capacitor 20A (capacitor 22), a cooler 30A, a semiconductor module 40A, a leaf spring 50A, a bracket 60A, The control circuit board 70A is accommodated in a stacked state.

  The semiconductor device 10A corresponds to the semiconductor device 10 in the first embodiment, and the function as the device is the same. The terminal block with capacitor 20A corresponds to the terminal block with capacitor 20 in the first embodiment, and the cooler 30A corresponds to the cooler 30 in the first embodiment, and the functions as the respective components are the same. The semiconductor module 40A corresponds to the semiconductor module 40 in the first embodiment, and the leaf spring 50A corresponds to the leaf spring 50 in the first embodiment, and functions as respective components are the same. The bracket 60A corresponds to the bracket 60 in the first embodiment, and the control circuit board 70A corresponds to the control circuit board 70 in the first embodiment, and functions as components are the same.

  A mounting hole H1 for inserting and mounting a power line connector (not shown) for inputting power of the battery 100 is formed in the front wall of the upper casing Ka. In addition, a motor line connector (not shown) for outputting electric power to the traveling motor 110 is inserted and attached to the front wall of the upper casing Ka so as to be arranged in parallel to the left of the mounting hole H1. A mounting hole H2 is formed. Both mounting holes H1 and H2 have an elliptical shape in front view, and are formed through the front wall. The power line connector is connected to a power input terminal T1 disposed in the housing K corresponding to the mounting hole H1. The motor wire connector is connected to a motor output terminal T2 disposed in the housing K corresponding to the mounting hole H2.

  On the upper wall of the upper housing Ka, a lid F for covering the fastening hole H3 having an elliptical shape shown in FIG. 9 is fastened at a plurality of locations (six locations in the present embodiment) by bolts B2. . The fastening hole H3 is formed so as to correspond to the power input terminal T1 and the motor output terminal T2 arranged in parallel in the left-right direction. The fastening hole H3 is used when the power line connector inserted into the mounting hole H1 is fastened to the power input terminal T1. The fastening hole H3 is used when the motor line connector inserted into the mounting hole H2 is fastened to the motor output terminal T2.

  On the right wall of the upper casing Ka, signal line connectors C1 and C2 for connecting signal lines of signals inputted to and outputted from the control circuit board 70A are attached. The signal line connectors C1, C2 are arranged side by side in the vertical direction.

Mounting legs L1, L2, L3, and L4 for mounting the semiconductor device 10A to the housing of the traveling motor 110 are formed on the lower housing Kb.
Also, from both the left and right walls of the housing K, an inflow pipe P1 that serves as an inlet for the refrigerant to the cooler 30A accommodated and an outflow pipe P2 that serves as an outlet for the refrigerant after heat exchange are provided outside the housing K. Is exposed. The inflow pipe P1 and the outflow pipe P2 are exposed to the outside from the boundary between the upper casing Ka and the lower casing Kb. That is, the communication hole H4 which connects the inside and outside of the housing | casing K is formed in the right-and-left both walls of the upper housing | casing Ka and the lower housing | casing Kb.

Hereinafter, a housing structure for various components in the housing K will be described with reference to FIGS. Note that the housing structure of the present embodiment is basically the same as the housing structure of the first embodiment.
As shown in FIG. 10, a cooler 30A is arranged on the upper part of the terminal block with capacitor 20A arranged at the bottom of the lower housing Kb. The cooler 30 </ b> A has a configuration in which an inflow pipe P <b> 1 and an outflow pipe P <b> 2 are attached to both sides of a flat main body 31 that has a rectangular shape in plan view. In the cooler 30A, the length X1 between the root portion of the inflow pipe P1 and the root portion of the outflow pipe is set to 200 mm to 250 mm. The cooler 30A has a width Y1 orthogonal to the length X1 set to 50 to 70 mm. The main body 31 of the cooler 30A is set to have a thickness of 6 to 15 mm. Note that a fin member is disposed inside the cooler 30A, and a refrigerant flow path is formed by the fin member.

  The capacitor-equipped terminal block 20A having a mounting surface as a mounting portion of the cooler 30A is formed in a rectangular plate shape in plan view. The length of the terminal block with capacitor 20A is set to be substantially the same as the length X1 of the cooler 30A, and the width is set to be larger than the width Y1 of the cooler 30A. Moreover, the thickness of the terminal block with capacitor 20 </ b> A varies depending on the output of the capacitor 22. Specifically, the thickness when the output is 50 Kw is set to about 30 mm, and the thickness when the output is 80 Kw is set to about 60 mm. In the semiconductor device 10A of the present embodiment, the dimension of the terminal block with capacitor 20A (capacitor 22) is adjusted by the thickness according to the output. At the time of assembly, the casing 80 prepares a lower casing Kb set to a height corresponding to the output of the capacitor 22 to be accommodated, and the lower casing Kb and the upper casing Ka are combined.

  Further, a terminal group including a pair of the positive terminal 23, the negative terminal 24, and the output terminal 25 is provided on one side edge of the terminal block with capacitor 20A along the length direction of the terminal block with capacitor 20A ( In this embodiment, three sets) are arranged. The lower housing Kb is provided with a power input terminal T1 and a motor output terminal T2 along one side edge where the terminal group of the terminal block with capacitor 20A is provided. In addition, two sets of current sensors SA are disposed in the lower housing Kb. 10 to 12, the positive terminals 23 of the terminal groups on both sides overlap with the terminals of the current sensor SA. Further, two power input terminals T1 are provided as shown in FIGS. On the other hand, three motor output terminals T2 are provided. 9 to 14 show the motor output terminal T2 at the center, and the two motor output terminals T2 on both sides overlap the terminals of the current sensor SA.

  As shown in FIG. 11, a plurality (three in this embodiment) of semiconductor modules 40A are arranged in the direction along the length X1 of the cooler 30A on the top of the cooler 30A. Each semiconductor module 40A is placed on the cooler 30A via silicone grease (not shown). Each semiconductor module 40A has a length X2 set to 40 mm to 60 mm. Each semiconductor module 40A has a width Y2 orthogonal to the length X2 set to 50 to 70 mm. The size of the cooler 30A having the mounting surface of each semiconductor module 40A is set according to the size and number of the semiconductor modules 40A to be mounted. That is, the size of the cooler 30A is set based on the size of the region (mounting region) when all the semiconductor modules 40A are mounted on the upper surface of the cooler 30A. The size of the cooler 30A is a size defined by the length X1 and the width Y1 described above, and this size is the size of the surface facing the mounted semiconductor module 40A.

  In each semiconductor module 40A, two sets of transistors (IGBT) TR and two sets of diodes D are sealed with resin. The transistor TR is a square element having a width of about 15 mm in plan view, and the diode D is an element having a size of about one half of the transistor TR.

  Each semiconductor module 40A includes a power line terminal 44 connected to the positive terminal 23 of the terminal block with capacitor 20A, a ground line terminal 45 connected to the negative terminal 24, and an output terminal 43 connected to the output terminal 25. It has. And each semiconductor module 40A is arrange | positioned for every terminal group of terminal block 20A with a capacitor | condenser. Moreover, each terminal 43-45 of each semiconductor module 40A is electrically connected by being fastened and fixed with the volt | bolt B3 with respect to the terminal group of 20 A of corresponding terminal blocks with a capacitor | condenser. The state of being fastened and fixed by the bolt B3 is shown in FIG.

  Each semiconductor module 40 </ b> A includes a control signal terminal 42. The control signal terminal 42 is disposed at an end facing the end of the semiconductor module 40A where the power line terminal 44, the ground line terminal 45, and the output terminal 43 are disposed. As a result, in the semiconductor device 10A of the present embodiment, the terminals on the power supply line side are concentrated on one side, while the terminals on the control signal line side are concentrated on one side opposite to the terminals on the power supply line side. Will be placed. The terminals on the power line side are a terminal group of the terminal block with capacitor 20A, the terminals 43 to 45 of each semiconductor module 40A, the power input terminal T1, and the motor output terminal T2. The terminal on the control signal line side is a control signal terminal 42 of each semiconductor module 40A.

  As shown in FIG. 12, a leaf spring 50A is disposed on the top of each semiconductor module 40A. The leaf spring 50A is made of a spring steel plate. The leaf spring 50A of the present embodiment has a plurality (three in this embodiment) of pressing portions 53 configured by bending both side portions 52 of the horizontal central portion 51 so as to spread obliquely downward. Each pressing portion 53 is provided with a horizontal connecting portion 54. Each pressing portion 53 is provided at a predetermined interval so as to apply a pressing force in the vicinity of the central portion of each semiconductor module 40A when the leaf spring 50A is disposed on the upper portion of the semiconductor module 40A.

  As shown in FIG. 13, a bracket 60A is disposed on the top of the leaf spring 50A. The bracket 60A is made of a metal plate material such as aluminum. The bracket 60 </ b> A has a main body portion 61 that has a rectangular plate shape in plan view, and attachment portions 63 that project obliquely outward are formed at four corners of the main body portion 61. The bracket 60A is fastened and fixed to the bracket mounting portion 28b as the fixing portion formed at the four corners of the terminal block with capacitor 20A by the bolt B4 via the mounting portion 63. The bracket attachment portion 28b is shown in FIGS.

  Further, as shown in FIG. 15, a holding portion 64 of a leaf spring 50A is formed on the back surface of the bracket 60A. A plurality of (three in this embodiment) holding parts 64 can accommodate the pressing parts 53 at positions corresponding to the respective pressing parts 53 in a state where the leaf springs 50 are arranged on the upper portions of the respective semiconductor modules 40A. A recess 60c is provided. In addition, the holding portion 64 has a horizontal contact portion 60d in surface contact with the connecting portion 54 at a position corresponding to each connecting portion 54 in a state where the leaf spring 50 is disposed. The contact portion 60d is formed in a concave shape, and the depth thereof is shallower than that of the concave portion 60c.

  According to such a configuration of the bracket 60A, the leaf spring 50A placed on the upper portion of the semiconductor module 40A is held by the holding portion 64 formed on the back surface of the bracket 60A. At this time, the leaf spring 50A is pressed and deformed from above by the bracket 60A being fastened and fixed to the terminal block with capacitor 20A. Thereby, each semiconductor module 40A and the cooler 30A are fixed by being pressed downward by the downward biasing force of the leaf spring 50A. The leaf spring 50A is a semiconductor having an appropriate urging force even when the pressing portion 53 is held in the recess 60c of the bracket 60A so that the bracket 60A is fastened and fixed to the terminal block with capacitor 20A. The module 40A is pressed.

  As shown in FIG. 14, a control circuit board 70A is disposed on the upper portion of the bracket 60A. The control circuit board 70A is formed in a rectangular plate shape in plan view. A plurality (eight in this embodiment) of screwing portions 71 are formed on the side edge of the long side of the control circuit board 70A. As shown in FIG. 13, the bracket 60A on which the control circuit board 70A is placed has a convex control circuit board mounting column at a position corresponding to the screwing portion 71 of the control circuit board 70A. A portion 62 is formed. Of the plurality (eight in this embodiment) of control circuit board mounting pillars 62, the control circuit board mounting pillars 62 at the four corners of the bracket 60A are for attaching the bracket 60A to the terminal block with capacitor 20A. It is formed in the attachment part 63. On the other hand, the remaining control circuit board mounting column 62 is formed on the side edge of the long side of the bracket 60A. The control circuit board 70A is fastened and fixed to the control circuit board mounting column portion 62 of the bracket 60A by screws B5 via screw fixing portions 71.

  Since the bracket 60A applies a pressing force to each semiconductor module 40A via the leaf spring 50A, the size thereof is set according to the size and the number of the semiconductor modules 40A in the same manner as the cooler 30A. For this reason, by setting the dimensions of the control circuit board 70A in accordance with the dimensions of the bracket 60A, the control circuit board mounting column 62 is provided on the bracket 60A as a mounting portion for mounting the control circuit board 70A. be able to. That is, it is not necessary to provide the mounting portion in the lower housing Kb or the terminal block with capacitor 20A, which contributes to the downsizing of the semiconductor device 10A. The dimension of the bracket 60A is a dimension defined by the length X3 and the width Y3 shown in FIG. 13, and this dimension is the dimension of the surface facing the semiconductor module 40A when mounted on the upper part of the semiconductor module 40A. .

  Further, a terminal mounting portion 72 for mounting the control signal terminal 42 of each semiconductor module 40A is formed on the control circuit board 70A along one side edge on the long side of the control circuit board 70. Yes. In addition, the terminal attaching part 72 is collectively arranged on one side of the opposite side in a state of facing the terminal on the power line side, like the control signal terminal 42 of each semiconductor module 40A.

  The semiconductor device 10A of the present embodiment is assembled by the same assembling procedure as the semiconductor device 10 of the first embodiment. In other words, the terminal block with capacitor 20A, the cooler 30A, the plurality of semiconductor modules 40A, the leaf spring 50A, the bracket 60A, and the control circuit board 70A are stacked in this order. In the semiconductor device 10A of the present embodiment, the cooler 30A and each semiconductor module 40A are fixed by the action of the leaf spring 50A and the bracket 60A. In the semiconductor device 10A of the present embodiment, each semiconductor module 40A is cooled by the action of the cooler 30A.

Therefore, according to this embodiment, in addition to the same effects (1) to (5) as those of the first embodiment, the following effects are also achieved.
(6) Since the dimensions of the components such as the cooler 30A and the bracket 60A are set based on the dimensions of the region where the semiconductor module 40 is mounted, the semiconductor device 10A does not generate a useless space in the housing 80. The overall size can be reduced.

  (7) By using the flat (thin) cooler 30A, the distance between the capacitor 22 and each semiconductor module 40A can be shortened, and a design with a small wiring inductance can be realized. That is, a circuit configuration with little loss can be realized.

  (8) The main parts such as the terminal block with capacitor 20A, the cooler 30A, the semiconductor module 40A, the leaf spring 50A, the bracket 60A, and the control circuit board 70A are stacked in the housing 80. For this reason, at the time of manufacture, these components may be stacked in order, so that the assemblability is excellent and the manufacturing cost can be reduced.

  (9) Since the terminals on the power supply line side and the terminals on the control signal line side are arranged in a confronting state, the wiring configuration can be simplified. That is, it is possible to reduce the size of the entire semiconductor device 10A without generating a useless space in the housing 80.

(10) By making the cooler 30 </ b> A a separate component from the casing K, the degree of freedom of layout in the casing K can be improved. As a result, the semiconductor device 10A can be downsized.
(11) By arranging the plurality of semiconductor modules 40A in a planar manner on the top of the cooler 30A, the height of the semiconductor device 10A can be suppressed. As a result, the semiconductor device 10A can be downsized.

The embodiment is not limited to the above, and may be embodied as follows, for example.
The material, shape, etc. of the component parts in the above embodiment are appropriately changed according to the specifications (uses) of the semiconductor device.

-The whole structure of the semiconductor device in the said embodiment can be suitably changed according to the specification (application) of a semiconductor device.
In the above embodiment, the terminal blocks with capacitors 20 and 20A including the capacitors 22 are used as the terminal blocks. However, terminal blocks that do not include capacitors may be used. That is, in the above embodiment, the capacitor-equipped terminal blocks 20 and 20A (the capacitor and the terminal block are integrated) are used, but it is not necessary to be integrated depending on the specifications (uses) of the semiconductor device.

  In this case, as the functions of the brackets 60 and 60A, the leaf springs 50 and 50A can be pressed, the control circuit boards 70 and 70A can be fixed, and the semiconductor modules 40 and 40A can be controlled by being made of metal. The circuit board 70, 70A can be shielded.

  In the above embodiment, the brackets 60 and 60A are made of metal (aluminum), but may be made of resin. However, in order to obtain the noise shielding effect, at least a part of it needs to be made of metal.

  In the above embodiment, the brackets 60 and 60A are fixed to the terminal block (terminal block with capacitor 20). However, the brackets 60 and 60A may be fixed to an external housing or the like, or fixed to the coolers 30 and 30A. It can change suitably according to (use). When the brackets 60 and 60A are fixed to the coolers 30 and 30A, a boss (attachment member) is provided on the coolers 30 and 30A, and the brackets 60 and 60A are arranged thereon and fixed by screwing or the like. Good. FIG. 18 is a diagram that embodies another example in which the bracket 60 is fixed to the housing 80. 18 is a longitudinal sectional view corresponding to the line AA in FIG. 1. FIG. 1 shows the bracket 60 without the leg portion 60a, but the leg portion 60a is shown in FIG. Overlaps the upper side of the mounting arm 20a. In another example shown in FIG. 18, the bracket 60 is provided with a leg portion 60 a that overlaps the mounting arm 20 a of the terminal block 20 with a capacitor. The bracket 60 and the terminal block with capacitor 20 are fastened and fixed to the terminal block mounting portion 80a of the housing 80 with the screw S1 with the mounting arm 20a of the terminal block with capacitor 20 interposed from the leg 60a side of the bracket 60. To do. That is, in another example shown in FIG. 18, the terminal block with capacitor 20, the bracket 60, and the casing 80 are fastened together by the screw S1. In the specific example shown in FIG. 18, the bracket mounting portion 28 erected on the terminal block 20 with the capacitor and the bracket 60 are fastened to the bracket mounting portion 28 from the semiconductor device 10 shown in FIG. 2 in the first embodiment. The screw S3 for fixing is unnecessary.

  The other example shown in FIG. 18 can also be applied to the semiconductor device 10A of the second embodiment. That is, in the second embodiment, the mounting portion 63 and the bracket mounting portion 28b provided on the bracket 60A are vertically stacked as shown in FIG. 18, and the bracket mounting portion 28b is interposed from the mounting portion 63 side. The bracket 60A and the terminal block with capacitor 20A are fastened and fixed to the casing K (lower casing Kb) with bolts B4. Also in this case, the terminal block with capacitor 20A, the bracket 60A, and the casing K (lower casing Kb) are collectively fastened by the bolt B4. In the first and second embodiments and another example shown in FIG. 18, the terminal blocks with capacitors 20 and 20 </ b> A have fixing portions for fixing the brackets 60 and 60 </ b> A. That is, in the first and second embodiments, the terminal blocks with capacitors 20 and 20A fix the brackets 60 and 60A by the bracket mounting portions 28 and 28b. Further, in another example shown in FIG. 18, the terminal blocks with capacitors 20, 20A, the brackets 60, 60A and the housings 80, K are fastened and fixed together, but the brackets 60, Since 60A is fixed, the bracket attaching portions 28 and 28b function as fixing portions.

  In the above embodiment, the leaf springs 50 and 50A are used as the spring members, but springs of other shapes such as a disc spring may be used. That is, it can be appropriately changed according to the specification (use) of the semiconductor device.

  In the above embodiment, the water-cooled coolers 30 and 30A are used, but an air-cooled heat sink, a heat sink (block), or the like may be used. That is, it can be appropriately changed according to the specification (use) of the semiconductor device.

  In the above embodiment, the silicone grease 90 is used between the semiconductor modules 40, 40A and the coolers 30, 30A, but other heat conducting members such as a heat radiating sheet may be used. That is, it can be appropriately changed according to the specification (use) of the semiconductor device.

  In the above embodiment, nothing is interposed between the coolers 30 and 30A and the terminal blocks with capacitors 20 and 20A, but a heat conducting member such as silicone grease or a heat radiating sheet is interposed as necessary. Also good.

  Instead of FIG. 2, as shown in FIG. 16, a cooler 150 may be disposed between the semiconductor module 40 and the leaf spring 50 via silicone grease 151 (the cooler 150 is also provided above the semiconductor module 40. It may be installed via silicone grease 151). That is, one cooler is added so that the semiconductor module 40 is sandwiched from above and below. In this way, heat can be radiated from the upper side of the semiconductor module 40 by adopting a structure in which the both sides of the semiconductor module 40 are held by the coolers 30 and 150 and pressed against the terminal block 20 with a capacitor by the leaf spring 50 (spring). Improves.

  As shown in FIG. 17, rod-shaped protrusions 160 and 161 are formed on the outer side surfaces of the electrical connection terminals in the semiconductor module 40, that is, the plate-shaped power line terminal 44 and the ground line terminal 45, and the capacitor Concave members (protrusions) 170 and 171 having shapes that fit into the protrusions 160 and 161 are provided on the upper surface 21b (terminal mounting surface) of the insulating base 21 of the terminal block 20. The process of providing the protrusions 160 and 161 on the power supply line terminal 44 and the ground line terminal 45 of the semiconductor module 40 may be performed simultaneously with the terminal outline processing. This eliminates the need for additional processing and does not increase costs.

  The semiconductor module 40 is positioned by fitting the rod-shaped protrusions 160 and 161 of the power supply line terminal 44 and the earth line terminal 45 of the semiconductor module 40 and the concave members 170 and 171 of the terminal block 20 with capacitor. At this time, since the positioning is performed by the terminal, the positional deviation of the terminal fastening portion can be reduced. Thereby, assembly property improves. In addition to positioning, it also has an anti-rotation action (positioning and rotation prevention can be performed).

  Thus, it is set as the structure which positions the terminal block 20 with a capacitor | condenser, and the terminal of the semiconductor module 40 by uneven | corrugated fitting. As a result, the terminal block with capacitor 20 and the terminals of the semiconductor module 40 can be easily positioned by concave and convex fitting.

  In FIG. 17, one semiconductor module 40 is illustrated, but the other semiconductor modules have the same configuration. In FIG. 17, two protrusions (160, 161) are provided on the outer side surfaces of the power line terminal 44 and the ground line terminal 45, but the position and number of the protrusions may be changed as appropriate. Further, the power supply line terminal 44 and the ground line terminal 45 of the semiconductor module 40 are provided with a convex shape (with rod-shaped protrusions 160 and 161), and the terminal block with capacitor 20 is provided with a concave shape (concave members 170 and 171). However, by reversing this, a convex shape (bar-shaped protrusion) may be provided on the terminal block 20 with a capacitor, and a concave shape (concave member) may be provided on the power line terminal 44 and the ground line terminal 45 of the semiconductor module 40.

In the above embodiment, the brackets 60 and 60A have a function as a noise shield material, but it is not always necessary to have a function as a noise shield material.
In the above embodiment, the semiconductor device is applied to a travel motor drive device for a hybrid vehicle. However, the present invention is not limited thereto, and may be applied to a travel motor drive device (inverter) for an electric vehicle (EV vehicle), for example. .

  In the semiconductor modules 40 and 40A in FIG. 6 and the like, the arrangement order of the output terminal 43, the power line terminal 44, and the earth line terminal 45 can be freely changed to some extent. In order to reduce inductance, it is desirable that the power line terminal 44 and the ground line terminal 45 be adjacent to each other.

  20, 20A ... Terminal block with capacitor, 22 ... Capacitor, 30, 30A ... Cooler, 40, 40A ... Semiconductor module, 50, 50A ... Leaf spring, 60, 60A ... Bracket, 70, 70A ... Control circuit board, 150 ... cooler, 160 ... protrusion, 161 ... protrusion, 170 ... concave member, 171 ... concave member.

Claims (10)

A semiconductor module;
A cooler for cooling the semiconductor module;
A terminal block for electrical connection with the terminals of the semiconductor module;
A spring member that is disposed on the semiconductor module and the cooler that are stacked on the terminal block, and that presses the semiconductor module and the cooler against the terminal block;
A spring member support that is disposed on the spring member, and applies a biasing force to the spring member to press the semiconductor module and the cooler against the terminal block;
A semiconductor device comprising:   The semiconductor device according to claim 1, wherein a control board for controlling the semiconductor module is fixed on the spring member support.   The semiconductor device according to claim 2, wherein the spring member support is used as a noise shield material between the semiconductor module and the control board.   The said cooler is arrange | positioned on the said terminal block, the said semiconductor module is arrange | positioned on the said cooler, and the capacitor | condenser was embed | buried under the said terminal block. The semiconductor device described.   The semiconductor device according to claim 1, wherein coolers are stacked and disposed above and below the semiconductor module.   The semiconductor device according to claim 1, wherein the terminal block and the terminal of the semiconductor module are positioned by concave-convex fitting.   The semiconductor device according to claim 1, wherein the terminal block is made of resin and has a terminal portion that is electrically connected to a terminal of the semiconductor module.   8. The power supply terminals are gathered and arranged on one side of both sides of the semiconductor module, and the control signal terminals are gathered and arranged on the other side. The semiconductor device according to item.   The size of a surface of the cooler and the spring member support that faces the semiconductor module is set based on a size of a mounting area of the semiconductor module. 2. A semiconductor device according to item 1.   The semiconductor device according to claim 1, wherein the terminal block includes a mounting portion on which the cooler is mounted and a fixing portion that fixes the spring member support.