JP5262752B2 - Power converter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power conversion apparatus which can prevent the malfunction of a control circuit connected to the control terminal of each semiconductor module to enhance the connection assembling property of a power terminal relative to a power source or rotary electric machine. <P>SOLUTION: The power conversion apparatus 1 forms a power conversion circuit for controlling the rotary electric machine by arranging a plurality of semiconductor modules 3 on a circuit board 2. The respective semiconductor modules 3 have power terminals 33 to be connected to the power supply or the rotary electric machine on one side and have control terminals 34 to be connected to the control circuit on the other side. The plurality of semiconductor modules 3 are arranged in parallel on one side F1 and the other side F2 in a plane direction F on one surface side of the circuit board 2. The plurality of semiconductor modules 3 are arranged on the circuit board 2 in the state that the power terminals 33 are directed toward outside in the plane direction F of the circuit board 2, and the control terminals 34 are directed toward inside in the plane direction F of the circuit board 2. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a power converter formed by forming a power converter circuit that controls a rotating electrical machine by a switching element.

A motor generator or the like used in a hybrid vehicle or the like is controlled by a power conversion circuit such as an inverter circuit, and the power conversion circuit is configured by using a plurality of semiconductor modules formed by covering switching elements with a mold resin.
For example, in the inverter device of Patent Document 1, one of a plurality of circuit components including a boosting reactor, a switching unit for each phase, a boosting switching unit, a smoothing capacitor before boosting, and a smoothing capacitor after boosting. The portion is placed in contact with one surface of the cooling plate and the rest is placed in contact with the other surface of the cooling plate. And each circuit component of an inverter apparatus is cooled efficiently, and each circuit component is put together and efficiently arranged.

JP 2007-89258 A

  By the way, in a semiconductor module, in addition to a power terminal connected to a power supply or a rotating electrical machine, a control terminal used for a control signal of a switching element, various sensor signals, and the like is often provided. In this case, if no measures are taken when arranging a plurality of semiconductor modules on the circuit board, when the power terminal and the control terminal are close to each other, a large current flowing in the power terminal causes a noise current to flow to the control terminal. May occur.

  The present invention has been made in view of such a conventional problem, and prevents malfunction of a control circuit connected to a control terminal of each semiconductor module, and improves connection assembling property of a power terminal to a power supply or a rotating electrical machine. An object of the present invention is to provide a power conversion device capable of performing the above.

The present invention provides a power conversion device in which a plurality of semiconductor modules formed by covering a switching element with a mold resin are arranged on a circuit board, and a power conversion circuit for controlling a rotating electrical machine is formed by the switching element.
The semiconductor module is provided with a power terminal connected to a power source or the rotating electrical machine on one side thereof, and a control terminal connected to a control circuit on the other side,
The semiconductor modules on both sides of the one side and the other side are arranged with the power terminals facing outward in the planar direction of the circuit board and the control terminals facing inward in the planar direction of the circuit board. Thea is,
The control terminal in the semiconductor module on one side and the control terminal in the semiconductor module on the other side face each other on the inner side in the planar direction of the circuit board. Item 1).

The power conversion device of the present invention uses a semiconductor module in which power terminals and control terminals are arranged on opposite sides, and devise a method of arranging a plurality of semiconductor modules on a circuit board. That is, the plurality of semiconductor modules are arranged in parallel on one side and the other side in the planar direction on one surface side of the circuit board. And about each semiconductor module in the both sides of one side and the other side, while directing each power terminal to the outer side in the plane direction of a circuit board, each control terminal is orient | assigned to the inner side in the plane direction of a circuit board. Thereby, the control terminals in each semiconductor module face each other on the inner side in the planar direction of the circuit board, and the power terminals in each semiconductor module can all be directed in the direction farthest from the control terminal.
The plane direction means a direction of a two-dimensional plane parallel to the surface side of the circuit board.

  Therefore, it is possible to suppress a large current flowing through the power terminal from being superimposed as a noise current on the control terminal, and to prevent malfunction of the control circuit connected to the control terminal. In addition, power terminals having a cross-sectional area larger than that of the control terminals can be directed to the outside in the plane direction as directions opposite to each other, so that the power terminal or the rotating electrical machine can be easily connected and assembled.

  Therefore, according to the power conversion device of the present invention, it is possible to prevent malfunction of the control circuit connected to the control terminal of each semiconductor module, and to improve the assembling property of the power terminal to the power source or the rotating electrical machine.

Explanatory drawing which shows the planar arrangement | positioning state of each semiconductor module in a power converter device in an Example. In an Example, it is a figure which shows a power converter device, and is AA sectional view explanatory drawing in FIG. In an Example, it is a figure which shows a power converter device, and is BB arrow directional cross-sectional explanatory drawing in FIG. In an Example, explanatory drawing which shows the planar state of a semiconductor module. The circuit diagram which shows the schematic structure of a power converter circuit in an Example.

A preferred embodiment of the above-described power conversion device of the present invention will be described.
In the present invention, in the semiconductor module, the power terminal connected to the power source does not mean that it is directly connected to the power source, but also means that it is connected to the power source via a smoothing capacitor or the like. For example, when a booster circuit that boosts the voltage of the power supply is used, the power terminal can be connected to the power supply via a smoothing capacitor that has been boosted.

The main body portions of the plurality of semiconductor modules arranged on one side of the planar direction of the circuit board and the main body portions of the plurality of semiconductor modules arranged on the other side of the planar direction of the circuit board are the circuit board. Are preferably arranged symmetrically on one side and the other side in the plane direction.
In this case, a plurality of semiconductor modules can be efficiently aligned with respect to the one surface side of the circuit board, and the power conversion device can be formed compactly.
In addition, the main-body part of the said semiconductor module means the part which shape | molded the switching element with mold resin, and means the part except the part from which the said power terminal and control terminal were pulled out from mold resin.

The switching element in the semiconductor module constitutes two bridge circuits for separately controlling the two rotating electric machines, and the semiconductor module constituting the first bridge circuit for controlling one rotating electric machine The semiconductor modules that are arranged on one side of the circuit board in the planar direction and that constitute the second bridge circuit that controls the other rotating electrical machine are arranged on the other side of the circuit board in the planar direction. (Claim 3).
In this case, when two rotating electrical machines are controlled by the power converter, the malfunction of the control circuit is prevented and the connection and assembly of the power terminals are improved, and the semiconductor module constituting the two bridge circuits is efficiently used. They can be arranged in a well-aligned manner, and the power conversion device can be formed compactly.

The power conversion circuit includes an inverter circuit that controls the rotating electrical machine and a booster circuit that boosts a voltage supplied to the inverter circuit, and an inverter module that is the semiconductor module constituting the inverter circuit includes: The step-up module, which forms the first bridge circuit and the second bridge circuit, and is the semiconductor module constituting the step-up circuit, has the first bridge on one side in the planar direction of the circuit board. A first boosting module aligned with the inverter module constituting the circuit, and a second boosting module aligned with the inverter module constituting the second bridge circuit on the other side in the planar direction of the circuit board. (Claim 4).
In this case, when the power converter boosts the power supply voltage to control the two rotating electric machines, the inverter module and the boosting module are efficiently aligned with respect to one surface side of the circuit board. The power conversion device can be formed in a compact manner.

Further, it is preferable that at least one of both surfaces of the plurality of semiconductor modules is provided with a cooler formed by forming a refrigerant passage through which a refrigerant passes in a cylindrical frame made of a metal material. 5).
In this case, the cooler can shield the noise emitted from the semiconductor module toward at least one of the circuit board side and the opposite side, thereby achieving more effective noise reduction in the power converter. be able to.

Hereinafter, embodiments of the power conversion device of the present invention will be described with reference to the drawings.
As shown in FIGS. 1 to 3, the power conversion device 1 of this example is configured by arranging a plurality of semiconductor modules 3 formed by covering the switching elements 31 with a mold resin 32 on the circuit board 2, as shown in FIG. 5. The power conversion circuit 6 that controls the rotating electrical machines 5A and 5B by the switching element 31 is formed. As shown in the figure, each semiconductor module 3 has a boosted smoothing capacitor 64 or a power terminal 33 connected to the rotating electrical machines 5A and 5B disposed on one side and a switching element on the other side. And a control terminal 34 connected to a control circuit such as a drive circuit or an ECU (electronic control unit).
As shown in FIG. 1, the plurality of semiconductor modules 3 are arranged in parallel on one side F <b> 1 and the other side F <b> 2 in the plane direction F on one surface side E of the circuit board 2. The plurality of semiconductor modules 3 are arranged on the circuit board 2 with the power terminals 33 facing outward in the planar direction F of the circuit board 2 and the control terminals 34 facing inward in the planar direction F of the circuit board 2. It is. Here, the plane direction F refers to the direction of a two-dimensional plane parallel to the surface side E of the circuit board 2.

Below, it explains in full detail with reference to FIGS. 1-5 about the power converter device 1 of this example.
As shown in FIG. 5, the power conversion device 1 of this example is used to control rotating electric machines (motor generators) 5 </ b> A and 5 </ b> B for driving a vehicle (for driving a vehicle) in a hybrid vehicle or an electric vehicle. The power conversion apparatus 1 of this example is configured to control two rotating electrical machines 5A and 5B for driving a vehicle disposed in an automobile.
The power conversion circuit 6 of this example includes an inverter circuit 6A that controls the rotating electrical machines 5A and 5B, and a booster circuit 6B that boosts the voltage supplied to the inverter circuit 6A. On one surface side E of the circuit board 2, inverter modules 3A and 3B which are the semiconductor modules 3 constituting the inverter circuit 6A and boost modules 3C and 3D which are the semiconductor modules 3 constituting the boost circuit 6B are provided. Arranged. On one surface side E of the circuit board 2, the first rotating electrical machine 5 </ b> A is controlled by the switching elements 31 of the three first inverter modules 3 </ b> A arranged on the one side F <b> 1 in the planar direction F of the circuit board 2. A bridge circuit 6A (1) is formed, and a second rotating electrical machine 5B is controlled by the switching elements 31 of the three second inverter modules 3B arranged on the other side F2 in the plane direction F of the circuit board 2. A bridge circuit 6A (2) is formed.

  The power supply 61 is provided with a smoothing capacitor 62 before boosting, and a smoothing capacitor 64 after boosting is provided between the plus and minus lines after boosting. The step-up circuit 6B is configured to smooth the voltage boosted by the switching operation of the switching element 31 in the reactor 63 and the step-up modules 3C, 3D and store it by the smoothing capacitor 64 after the step-up.

  As shown in FIG. 5, each semiconductor module 3 (each inverter module 3A, 3B and each step-up module 3C, 3D) is a switching element constituted by an IGBT (insulated gate bipolar transistor) with a reflux diode 65 connected in parallel. Two 31 are connected in series. Note that the switching element 31 can also be composed of a MOSFET (field effect transistor) or the like. Further, as shown in FIG. 4, each semiconductor module 3 is formed in a plate shape, and is formed by pulling out the power terminal 33 from one side in the plane direction F of the plate shape and pulling out the control terminal 34 from the other side. is there.

  As shown in FIGS. 4 and 5, each semiconductor module 3 has, as a power terminal 33, a P terminal to which the collector terminal (or drain terminal) of one switching element 31 is connected to the plus side of the smoothing capacitor 64 after boosting, The emitter terminal (or source terminal) of the other switching element 31 has an N terminal connected to the negative side of the smoothing capacitor 64 after boosting, and an O terminal (output terminal) between the two switching elements 31. Yes. Each semiconductor module 3 measures, as the control terminal 34, a terminal for transmitting a switching signal to the gate terminal of each switching element 31, a terminal for measuring a current flowing through the switching element 31, and a temperature of the switching element 31. It has a terminal etc. for doing. In the semiconductor module 3 of this example, five control terminals 34 are formed for each switching element 31. 4 and 5, the O terminal (output terminal) of each semiconductor module 3 is indicated by the symbol O, the P terminal is indicated by the symbol P, and the N terminal is indicated by the symbol N.

As shown in FIG. 5, in the booster circuit 6 </ b> B of this example, two boosting modules 3 </ b> C and 3 </ b> D are connected in parallel to the post-boosting smoothing capacitor 64. As shown in FIG. 1, the first boosting module 3 </ b> C is arranged side by side with the three first inverter modules 3 </ b> A on one side F <b> 1 in the planar direction F of the circuit board 2. The second boosting module 3D is arranged side by side with the three second inverter modules 3B on the other side F2 in the planar direction F of the circuit board 2.
On the one surface side E of the circuit board 2, on the one side F1 in the plane direction F, three first inverter modules 3A and one first boost module 3C are arranged in a line. On the other side F2 in the plane direction F, three second inverter modules 3B and one second boosting module 3D are arranged in a line.

Further, as shown in FIG. 1, on one surface side E of the circuit board 2, main body portions of three first inverter modules 3 </ b> A arranged on one side F <b> 1 in the plane direction F and on the other side F <b> 2 in the plane direction F. The main body portions of the three arranged second inverter modules 3B are arranged symmetrically on one side F1 and the other side F2 in the plane direction F on one surface side E of the circuit board 2. Further, on one surface side E of the circuit board 2, the main body portion of one first boosting module 3C arranged on one side F1 in the plane direction F and one second on the other side F2 in the plane direction F. The main body of the step-up module 3D is arranged symmetrically on one side F1 and the other side F2 in the plane direction F on one surface side E of the circuit board 2.
The main body of each of the modules 3A to 3D is a portion where the switching element 31 is molded by the mold resin 32, and is a portion excluding the portion where the power terminal 33 and the control terminal 34 are drawn from the mold resin 32. That means.

  Further, as shown in FIG. 2, on one surface side E of the circuit board 2, each power terminal in the three first inverter modules 3A and the one first boost module 3C arranged on the one side F1 in the plane direction F. 33 is drawn toward the outside of one side F1 in the plane direction F, and is bent to the side opposite to the arrangement direction of the circuit board 2. On the other hand, on one surface side E of the circuit board 2, each control terminal 34 in the three first inverter modules 3A and one first boosting module 3C arranged on one side F1 in the planar direction F And is bent in the direction in which the circuit board 2 is disposed.

In addition, on one surface side E of the circuit board 2, each power terminal 33 in the three second inverter modules 3 </ b> B and one second boosting module 3 </ b> D arranged on the other side F <b> 2 in the planar direction F It is pulled out toward the outside of the other side F <b> 2, and is bent to the side opposite to the direction in which the circuit board 2 is disposed. On the other hand, on one surface side E of the circuit board 2, the control terminals 34 in the three second inverter modules 3B and one second boosting module 3D arranged on the other side F2 in the planar direction F are arranged in the planar direction F. And is bent in the direction in which the circuit board 2 is disposed.
Each power terminal 33 is connected to the plus side or minus side of the post-boosting smoothing capacitor 64, or to the coils of the rotating electrical machines 5A and 5B (in this example, coils in a three-phase stator) via a bus bar or the like. Further, the control terminal 34 in each semiconductor module 3 is wired to the circuit board 2.

  As shown in FIG. 1, coolers 41 each having a coolant passage 411 through which a coolant passes are disposed in a cylindrical frame made of an aluminum material. The cooler 41 is configured to pass the refrigerant sent from the radiator by a pump. The cooler 41 of this example is formed on a portion formed on one side F1 in the planar direction F of one surface side E of the circuit board 2 and on the other side F2 in the planar direction F of one surface side E of the circuit board 2. The semiconductor module 3 arranged on the one side F1 and the semiconductor module 3 arranged on the other side F2 are connected to each other at the end in the direction orthogonal to the facing direction, and formed in a U shape. .

  As shown in FIGS. 2 and 3, the power conversion device 1 of the present example has a circuit board 2 on one surface side E with respect to a power stack 30 in which coolers 41 are arranged on both surfaces of all the semiconductor modules 3. A leaf spring 42 and a back plate 43 are stacked between each other, and a support member 44 is stacked on the other surface side of the power stack 30. The back plate 43 is disposed facing the cooler 41 in the power stack 30 and receives a local elastic load from the leaf spring 42. When the leaf spring 42 and the support member 44 are fixed by screws or the like via the support pillars 442 formed on the support member 44, a pressing load by the leaf spring 42 is applied to the power stack 30 disposed therebetween. Then, the cooler 41 is brought into close contact with each semiconductor module 3. Further, capacitors 62 and 64 and a reactor 63 are disposed on the support member 44 on the side opposite to the side on which the power stack 30 is disposed. Further, the circuit board 2 and the support member 44 are fixed by screws or the like via support columns 441 formed on the support member 44.

The power conversion apparatus 1 of this example uses a semiconductor module 3 in which power terminals 33 and control terminals 34 are arranged on opposite sides, and devise a method of arranging a plurality of semiconductor modules 3 with respect to the circuit board 2. ing.
Specifically, the inverter modules 3A and 3B and the boost modules 3C and 3D as the plurality of semiconductor modules 3 of this example are arranged in parallel on one side F1 and the other side F2 on one surface side E of the circuit board 2. Are arranged symmetrically on one side F1 and the other side F2 in the plane direction F on one surface side E of the circuit board 2. Then, for the inverter modules 3A, 3B and boost modules 3C, 3D on both sides of the one side F1 and the other side F2, the power terminals 33 are directed outward in the plane direction F of the circuit board 2, and the control terminals 34 are set. The circuit board 2 faces inward in the plane direction F.

Thereby, the control terminals 34 in each semiconductor module 3 face each other on the inner side in the plane direction F of the circuit board 2, and the power terminals 33 in each semiconductor module 3 can all be directed in the direction farthest from the control terminal 34. .
Therefore, it is possible to suppress a large current flowing through the power terminal 33 from being superimposed on the control terminal 34 as a noise current, and to prevent malfunction of the control circuit connected to the control terminal 34. Also, the power terminal 33 having a larger cross-sectional area than the control terminal 34 can be directed outward in the plane direction F as opposite directions, and the connection of the power terminal 33 to the post-boosting smoothing capacitor 64 or the rotating electrical machines 5A and 5B Assembling property can be improved. The power terminal 33 can be connected to the post-boosting smoothing capacitor 64 or the rotating electrical machines 5A and 5B via a bus bar or the like.

In this example, when the voltage of the power supply 61 is boosted to control the two rotating electrical machines 5A and 5B, the inverter modules 3A and 3B are boosted with respect to one surface side E of the circuit board 2. The modules 3C and 3D can be efficiently aligned and arranged, and the power conversion device 1 can be formed compactly.
Furthermore, in this example, the cooler 41 can shield noise emitted from the semiconductor module 3 toward the circuit board 2 side and the opposite side thereof, thereby further reducing noise in the power conversion device 1. Can be achieved.

  Therefore, according to the power conversion device 1 of the present example, the malfunction of the control circuit connected to the control terminal 34 of each semiconductor module 3 is prevented, and the connection of the power terminal 33 to the post-boosting smoothing capacitor 64 or the rotating electrical machines 5A and 5B is prevented. Assembling property can be improved.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Circuit board 3 Semiconductor module 3A, 3B Inverter module 3C, 3D Boosting module 31 Switching element 33 Power terminal 34 Control terminal 41 Cooler 5A, 5B Rotating electrical machine 6 Power conversion circuit 6A Inverter circuit 6B Booster circuit 61 Power supply E One surface side F Plane direction F1 One side F2 The other side

Claims (5)

In a power conversion device formed by arranging a plurality of semiconductor modules formed by covering a switching element with a mold resin on a circuit board, and forming a power conversion circuit for controlling a rotating electrical machine by the switching element,
The semiconductor module is provided with a power terminal connected to a power source or the rotating electrical machine on one side thereof, and a control terminal connected to a control circuit on the other side,
The plurality of semiconductor modules are arranged in a state of being arranged in parallel on one side and the other side in a planar direction on one surface side of the circuit board ,
The semiconductor modules on both sides of the one side and the other side are arranged with the power terminals facing outward in the planar direction of the circuit board and the control terminals facing inward in the planar direction of the circuit board. Thea is,
The power conversion device according to claim 1, wherein the control terminal in the semiconductor module on one side and the control terminal in the semiconductor module on the other side face each other on the inner side in the planar direction of the circuit board .   The main body of the plurality of semiconductor modules arranged on one side in the planar direction of the circuit board and the main body of the plurality of semiconductor modules arranged on the other side of the planar direction of the circuit board according to claim 1. A power conversion device, wherein the power conversion device is arranged symmetrically on one side and the other side in the planar direction of the circuit board. In Claim 1 or 2, the switching element in the semiconductor module constitutes two bridge circuits to control the two rotating electric machines separately,
The semiconductor modules constituting the first bridge circuit that controls one rotating electrical machine are arranged on one side of the planar direction of the circuit board,
A power conversion device, wherein a semiconductor module constituting a second bridge circuit for controlling the other rotating electrical machine is arranged on the other side in the planar direction of the circuit board. In Claim 3, the power conversion circuit comprises an inverter circuit that controls the rotating electrical machine, and a booster circuit that boosts a voltage supplied to the inverter circuit,
The inverter module, which is the semiconductor module constituting the inverter circuit, forms the first bridge circuit and the second bridge circuit,
The step-up module, which is the semiconductor module constituting the step-up circuit, includes a first step-up module aligned with the inverter module constituting the first bridge circuit on one side in the planar direction of the circuit board, A power conversion device comprising: a second boosting module arranged along with the inverter module constituting the second bridge circuit on the other side of the circuit board in the planar direction.   5. The cooler according to claim 1, wherein at least one of both surfaces of the plurality of semiconductor modules is formed with a refrigerant passage through which a refrigerant passes in a cylindrical frame made of a metal material. A power converter characterized by being arranged.

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