JP6111891B2 - Power supply - Google Patents

Description

  The present invention relates to a power supply device, and more particularly, to a power supply device including a circuit board and a radiator.

  Japanese Patent Laying-Open No. 2012-9309 (Patent Document 1) includes a battery module that houses a plurality of battery cells and a housing case that houses the battery module, and converts the electric charge stored in the battery module into AC power. A power storage system that supplies power to a load is disclosed. In the power storage system, the storage case has a rectangular parallelepiped shape with a surface having the largest area arranged on the base as a front surface portion. The battery module has a rectangular parallelepiped shape, and a plurality of battery modules are arranged in the storage case so that the battery module can be inserted into and taken out from the side surface of the storage case, and the front surface portion of the storage case and the battery module have the largest area. A plurality of lines are positioned and arranged so that the surfaces face each other. A control unit that controls the conversion to AC power or the charging / discharging of the battery module is disposed in the storage case.

JP 2012-9309 A JP 2012-9310 A JP 2011-192809 A Japanese Patent No. 2893677 Japanese Patent No. 4442150 JP 2012-253966 A Japanese Patent No. 5141815 Japanese Patent No. 4841666

  However, in the power storage system described in Patent Document 1, for example, when a heat sink is attached to the battery module and the control unit, the battery module disposed below the storage case is cooled well, There is a case where the cooling of the control unit arranged on the upper side of the case becomes insufficient.

  This invention was made in order to solve the above-mentioned subject, The objective is to provide the electric power supply device which can thermally radiate the heat which generate | occur | produces in a circuit board favorably, and can improve cooling performance. is there.

  (1) In order to solve the above-described problem, a power supply device according to an aspect of the present invention is a power supply device, and includes a circuit board, a radiator for radiating heat generated in the circuit board, The circuit board and a housing for accommodating the heat radiator, and the power supply device includes a plurality of sets of the circuit board and the heat radiator, and each of the groups is arranged in a vertical direction of the housing. The heat dissipating members of all or part of each set are provided so as to face different directions from the inside to the outside of the housing.

  (7) In order to solve the above problems, a power supply device according to another aspect of the present invention is a power supply device, and includes a circuit board, and a heat radiator for radiating heat generated in the circuit board. The circuit board and a housing for housing the heat dissipation body, and the power supply device includes a plurality of sets of the circuit board and the heat dissipation body, and each set is arranged in a horizontal direction of the housing. Arranged side by side, each set of the radiators is provided to face in different directions from the inside to the outside of the housing.

  ADVANTAGE OF THE INVENTION According to this invention, the heat which generate | occur | produces in a circuit board can be thermally radiated favorably and cooling performance can be improved.

FIG. 1 is a diagram showing a configuration of a power supply system according to an embodiment of the present invention. FIG. 2 is a perspective view of the power supply apparatus according to the embodiment of the present invention as viewed from the right side. FIG. 3 is a perspective view of the circuit unit according to the embodiment of the present invention as seen from the inside thereof. FIG. 4 is a front view of the circuit unit shown in FIG. 3 as viewed from the inside. FIG. 5 is a side view of the circuit unit shown in FIG. FIG. 6 is a diagram schematically showing the direction in which the heat radiating body faces in the power supply apparatus according to the embodiment of the present invention. FIG. 7 is a diagram schematically showing the direction in which the heat radiating body faces in the power supply apparatus according to the embodiment of the present invention. FIG. 8 is a perspective view of the circuit units arranged in the horizontal direction in the power supply apparatus according to the embodiment of the present invention, as viewed from the right side. FIG. 9 is a cross-sectional view showing a cross section taken along line IX-IX in FIG. 8 of the circuit units arranged in the horizontal direction in the power supply apparatus according to the embodiment of the present invention. FIG. 10 is a perspective view of the power supply apparatus according to the embodiment of the present invention as viewed from the right side surface.

  First, the contents of the embodiment of the present invention will be listed and described.

  (1) A power supply device according to an embodiment of the present invention is a power supply device, and includes a circuit board, a radiator for radiating heat generated in the circuit board, the circuit board, and the radiator. And the power supply device includes a plurality of sets of the circuit board and the heat radiating body, and the sets are arranged side by side in the vertical direction of the casing. All or a part of the heat radiator is provided to face in different directions from the inside to the outside of the housing.

  With such a configuration, it is possible to reduce the possibility that the warmed air rises in one set of radiators and the warmed air hits another set of radiators.

  Thereby, since the fall of the thermal radiation amount of the said other set of heat radiator can be suppressed, the heat which generate | occur | produces in a circuit board can be thermally radiated favorably, and the cooling performance in an electric power supply apparatus can be improved.

  (2) Preferably, the power supply device further includes a plurality of plate members that are provided corresponding to the sets, to which the heat radiators of the corresponding sets are fixed, and are fixed to the housing, The arrangement of the radiators in the plate member is common.

  With such a configuration, the specifications of the plate member and the radiator can be unified, so that the design cost and manufacturing cost of the plate member and radiator can be reduced.

  In addition, by unifying the specifications of the plate member and the radiator, for example, it is possible to change the configuration of the power generation device, the load, the battery panel, and the commercial power source that are electrically connected to the power supply device. This can be easily handled by increasing / decreasing the number of plate members and radiator sets to be fixed. That is, using a unitized set, a small lot and a variety of power supply devices can be realized at a low cost and with a short delivery time.

  (3) More preferably, the circuit board is fixed to the radiator.

  With such a configuration, for example, even when the specifications of the circuit arranged on the circuit board are changed, it can be handled by changing the specifications of the light and small radiator and the circuit board. The plate member can be used as it is without changing specifications.

  (4) More preferably, each said group is arrange | positioned along with the up-down direction of the said housing | casing, and is arrange | positioned along with the horizontal direction of the said housing | casing, and the said heat radiator and the said circuit board are connected in the said group. In the radiator, the surface opposite to the surface connected to the circuit board faces the outside of the housing, and the surface connected to the radiator in the circuit board. The surface on the opposite side is directed to the inside of the casing.

  With such a configuration, it is possible to simplify the wiring of the cable connecting the circuit boards in the group arranged side by side in the horizontal direction of the housing, and therefore the cable can be efficiently wired.

  (5) Preferably, the power supply device further includes a plurality of plate members that are provided corresponding to the set, to which the heat radiator of the corresponding set is fixed, and fixed to the housing, In the set, the heat radiator and the circuit board are connected, and the heat radiator is fixed to the plate member via an insulator.

  With such a configuration, it is possible to reduce the leakage current flowing from the circuit board to the plate member via the radiator.

  (6) More preferably, the power supply device is further provided corresponding to the set, the plurality of plate members fixed to the housing, the heat sink of the corresponding set being fixed, and A plurality of inductors provided corresponding to the sets and electrically connected to the circuit boards of the corresponding sets, and the arrangement of the inductors with respect to the plate members is common. The plate members that are arranged side by side in the vertical direction of the casing, are arranged side by side in the horizontal direction of the casing, and correspond to the two sets that are arranged side by side in the horizontal direction are the two groups. Are fixed to the casing so that the current flow directions in the windings of the inductor corresponding to the above are opposite to each other.

  With this configuration, the direction of the magnetic field generated by the inductor in one set and the direction of the magnetic field generated by the inductor in the other set are opposite to each other between the two sets of inductors. The magnetic field between two sets of inductors can be weakened.

  As a result, in the power supply device, the cable can be wired between the two sets of inductors without being affected by the induction noise so much, so that the degree of freedom of the cable wiring in the power supply device can be increased.

  Further, since it is not necessary to change the direction of the inductor and the type of the inductor for each group, it is possible to avoid erroneously setting the direction in which the inductor is assembled and the type of the inductor to be assembled when the inductor is assembled to the plate member. .

  (7) The power supply device according to the embodiment of the present invention is a power supply device, and includes a circuit board, a heat radiator for radiating heat generated in the circuit board, the circuit board, and the heat radiator. And the power supply device includes a plurality of sets of the circuit board and the radiator, and the sets are arranged in a horizontal direction of the casing. The heat radiator is provided to face different directions from the inside to the outside of the housing.

  With such a configuration, it is possible to reduce the possibility that the warmed air rises in one set of radiators and the warmed air hits another set of radiators.

  Thereby, since the fall of the thermal radiation amount of the said other set of heat radiator can be suppressed, the heat which generate | occur | produces in a circuit board can be thermally radiated favorably, and the cooling performance in an electric power supply apparatus can be improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated.

[Power supply system]
FIG. 1 is a diagram showing a configuration of a power supply system according to an embodiment of the present invention.

  Referring to FIG. 1, power supply system 401 includes power generation devices 511A, 511B, and 511C, power supply device 101, battery panel B1, commercial power supply 512, and load 513. The power supply apparatus 101 may include a load 513. The power supply apparatus 101 includes circuit units 10A, 10B, and 10C. The circuit unit 10A includes a control unit 15A, a converter circuit 31A, and an inverter circuit 33A. The circuit unit 10B includes a control unit 15B, a converter circuit 31B, and an inverter circuit 33B. The circuit unit 10C includes a control unit 15C, a converter circuit 31C, and a bidirectional converter circuit 34.

  Hereinafter, each of the power generation devices 511A, 511B, and 511C is also referred to as a power generation device 511. Each of the circuit units 10A, 10B, and 10C is also referred to as a circuit unit 10. Each of the control units 15A, 15B, and 15C is also referred to as a control unit 15. Each of converter circuits 31A, 31B, and 31C is also referred to as converter circuit 31. Each of the inverter circuits 33A and 33B is also referred to as an inverter circuit 33.

  In FIG. 1, three power generation devices 511 are representatively shown, but two or less or four or more power generation devices 511 may be provided. In FIG. 1, one power supply apparatus 101 is representatively shown, but a plurality of power supply apparatuses 101 may be provided. In FIG. 1, three circuit units 10 are representatively shown, but two or less or four or more circuit units 10 may be provided. In FIG. 1, one load 513 is representatively shown, but a plurality of loads 513 may be provided. In FIG. 1, one battery board B1 is representatively shown, but a plurality of battery boards B1 may be provided.

  The power supply system 401 is used, for example, for buffers of energy output from photovoltaic power generation, wind power generation, and the like whose generated power fluctuates, power failure countermeasures, and power sales to commercial systems.

  More specifically, the power generation devices 511A and 511B in the power supply system 401 are specifically solar power generation devices. For example, when the power generation devices 511 </ b> A and 511 </ b> B receive sunlight, the power generation devices 511 </ b> A and 511 </ b> B convert the received solar energy into DC power, and output the converted DC power to the power supply device 101. The power generation device 511C is specifically a wind power generation device. The power generation device 511C converts, for example, kinetic energy generated from a windmill that receives wind force into DC power, and outputs the converted DC power to the power supply device 101.

  The power supply apparatus 101 is installed in a place where installation space is limited, such as a rooftop or a mountaintop of a commercial facility, for example. For example, the power supply device 101 converts the power received from the power generation device 511 and outputs the converted power to the commercial power supply 512, the load 513, and the battery panel B1. In addition, the power supply device 101 converts, for example, the power received from the battery panel B1, and outputs the converted power to the commercial power supply 512 and the load 513.

  More specifically, in the power supply apparatus 101, the circuit unit 10 is provided corresponding to the power generation apparatus 511, for example. The control unit 15 in each circuit unit 10 exchanges information such as the power generation amount of the power generation device 511, the state of the commercial power supply 512, the size of the load 513, the amount of power stored in the battery panel B1, and the like with respect to each circuit unit 10. To control.

  Specifically, circuit units 10A, 10B, and 10C convert electric power received from power generation devices 511A, 511B, and 511C, respectively, according to control by control units 15A, 15B, and 15C. Further, the circuit unit 10C converts the electric power received from the battery panel B1 according to the control by the control unit 15C. The circuit units 10A, 10B, and 10C output the converted power to the commercial power supply 512, the load 513, and the battery panel B1 according to control by the control units 15A, 15B, and 15C, respectively.

  The converter circuit 31 in the circuit unit 10 boosts the DC power received from the power generator 511, that is, the DC voltage, and outputs the boosted voltage to the inverter circuit 33 and the bidirectional converter circuit 34.

  Inverter circuit 33 generates an AC voltage from the DC voltage received from converter circuit 31 and bidirectional converter circuit 34, and outputs the generated AC voltage to load 513 or commercial power supply 512. Moreover, the inverter circuit 33 arranges the phase of the alternating current output to the load 513 and the commercial power supply 512, for example.

  The load 513 is, for example, a communication device or a monitoring camera, and operates with an AC voltage received from the inverter circuit 33B.

  For example, the bidirectional converter circuit 34 monitors the voltage and temperature of the storage battery in the battery panel B1, and performs charge / discharge control of the storage battery in the battery panel B1 based on the monitoring result.

  More specifically, bidirectional converter circuit 34 charges the storage battery in battery panel B1 by boosting or stepping down the DC voltage received from converter circuit 31. Bidirectional converter circuit 34 boosts or steps down the DC voltage received from the storage battery in battery panel B <b> 1 and outputs the boosted voltage to inverter circuit 33.

  Battery panel B1 charges the DC power received from bidirectional converter circuit 34 in power supply apparatus 101, and discharges energy stored in battery panel B1 to bidirectional converter circuit 34 as DC power.

[Configuration of power supply device]
FIG. 2 is a perspective view of the power supply apparatus according to the embodiment of the present invention as viewed from the right side.

  Referring to FIG. 2, the power supply apparatus 101 includes a housing 2 that accommodates each member, and circuit units 10 </ b> E, 10 </ b> W, 10 </ b> F, and 10 </ b> R corresponding to the circuit unit 10 illustrated in FIG. 1. Hereinafter, each of the circuit units 10E, 10W, 10F, and 10R is also referred to as a circuit unit 10.

FIG. 3 is a perspective view of the circuit unit according to the embodiment of the present invention as seen from the inside thereof.
FIG. 4 is a front view of the circuit unit shown in FIG. 3 as viewed from the inside.
FIG. 5 is a side view of the circuit unit shown in FIG.

  Referring to FIG. 3, circuit unit 10 includes a circuit board 41, a heat radiating body 42, inductors 44 DC and 44 AC, insulators 45 </ b> A and 45 </ b> B, a control board 47, and a plate member 48. 4 to 5, the circuit unit 10 includes a communication terminal 46.

  Hereinafter, each of the inductors 44DC and 44AC is also referred to as an inductor 44. Each of the insulators 45A and 45B is also referred to as an insulator 45.

  Referring to FIG. 2 again, circuit units 10F, 10R, 10W, and 10E are, for example, arranged side by side in the vertical direction of casing 2 and arranged side by side in the horizontal direction of casing 2. And the heat radiating body 42 in the circuit units 10F, 10R, 10W, and 10E is provided so as to face different directions from the inside of the housing 2 to the outside, for example.

  Specifically, the heat radiating bodies 42 in the circuit units 10F, 10R, 10W, and 10E are provided to face the front side, the rear side, the left side, and the right side of the housing 2, respectively.

  In more detail, the housing | casing 2 accommodates the 1 or several circuit unit 10, for example, and is specifically a 19-inch rack. The housing 2 includes a top plate 21, a bottom plate 23, front columns 11FW and 11FE, and rear columns 11RW and 11RE. Hereinafter, each of the columns 11FW, 11FE, 11RW, and 11RE is also referred to as a column 11.

  The support 11 </ b> FW has a first end fixed to a left front corner of the top plate 21 and a second end fixed to a left front corner of the bottom plate 23. The support column 11FE has a first end fixed to the right front corner of the top plate 21 and a second end fixed to the right front corner of the bottom plate 23. The support 11 </ b> RE has a first end fixed to the right rear corner of the top plate 21 and a second end fixed to the right rear corner of the bottom plate 23. The column 11 RW has a first end fixed to the left rear corner of the top plate 21 and a second end fixed to the left rear corner of the bottom plate 23.

  FIG. 6 is a diagram schematically showing the direction in which the heat radiating body faces in the power supply apparatus according to the embodiment of the present invention.

  FIG. 6 shows a cross-sectional view of the power supply apparatus 101 when viewed from the upper side. In FIG. 6, a part of the circuit unit 10 is not shown in order to facilitate understanding of the orientation of the heat radiator 42 and the structure of the housing 2.

  Referring to FIG. 6, on the front side of housing 2, side portions 22 </ b> F that are spaces defined by the thicknesses of pillars 11 </ b> FW and 11 </ b> FE in the front-rear direction and top plate 21 and bottom plate 23 are formed. On the right side of the housing 2, side portions 22 </ b> E that are spaces defined by the thicknesses of the support columns 11 </ b> FE and 11 </ b> RE and the top plate 21 and the bottom plate 23 are formed. On the rear side of the housing 2, side portions 22 </ b> R that are spaces defined by the thicknesses of the support columns 11 </ b> RE and 11 </ b> RW in the front-rear direction and the top plate 21 and the bottom plate 23 are formed. On the left side of the housing 2, side portions 22 </ b> W that are spaces defined by the thicknesses of the columns 11 </ b> RW and 11 </ b> FW in the left-right direction and the top plate 21 and the bottom plate 23 are formed. Hereinafter, each of the side portions 22F, 22E, 22R, and 22W is also referred to as a side portion 22.

  The heat radiating body 42 of the circuit unit 10F is provided, for example, so as to face in the direction from the side portion 22F to the outside of the housing 2. The heat radiator 42 of the circuit unit 10E is provided so as to face, for example, the direction from the side portion 22E to the outside of the housing 2. The heat radiating body 42 of the circuit unit 10 </ b> R is provided, for example, so as to face the direction from the side portion 22 </ b> R to the outside of the housing 2. The heat radiating body 42 of the circuit unit 10 </ b> W is provided, for example, so as to face the direction from the side portion 22 </ b> W to the outside of the housing 2. That is, the heat radiating body 42 of each circuit unit 10 is provided, for example, so as to face in the direction from the different side portion 22 of the housing 2 to the outside of the housing 2.

  Moreover, the heat radiating body 42 of each circuit unit 10 is provided so as to face the substantially horizontal direction of the housing 2, for example.

  The heat radiator 42 of the circuit unit 10F is provided so that, for example, a part or all of the heat radiator 42 is included in the side portion 22F. The heat radiating body 42 of the circuit unit 10E is provided so that, for example, a part or all of the heat radiating body 42 is included in the side portion 22E. The heat radiator 42 of the circuit unit 10R is provided so that, for example, a part or all of the heat radiator 42 is included in the side portion 22R. The heat radiating body 42 of the circuit unit 10W is provided, for example, such that part or all of the heat radiating body 42 is included in the side portion 22W. Note that the heat radiator 42 of the circuit unit 10 does not protrude from the side portion 22 to the outside of the housing 2, for example.

  FIG. 7 is a diagram schematically showing the direction in which the heat radiating body faces in the power supply apparatus according to the embodiment of the present invention.

  FIG. 7 shows a cross-sectional view of the power supply apparatus 101 when viewed from the upper side. In FIG. 7, a part of the circuit unit 10 is not shown in order to facilitate understanding of the orientation of the heat radiating body 42 and the structure of the housing 2.

  Referring to FIG. 7, for example, side plates 24 </ b> F, 24 </ b> E, 24 </ b> R, and 24 </ b> W may be provided on the front side, the right side, the rear side, and the left side of the housing 2. More specifically, the housing 2 is provided with side plates 24F, 24E, 24R, and 24W that extend downward from the top plate 21, for example. The bottom plate 23 extends between the side plates 24F, 24E, 24R, 24W. Hereinafter, each of the side plates 24F, 24E, 24R, and 24W is also referred to as a side plate 24.

  Each support | pillar 11 is contained in the casing comprised by the top plate 21, the side plate 24, and the bottom plate 23, for example.

  The surfaces of the side plates 24F, 24E, 24R, and 24W on the outside of the power supply device 101 form side surfaces 25F, 25E, 25R, and 25W of the housing 2, respectively. Hereinafter, each of the side surfaces 25F, 25E, 25R, and 25W is also referred to as a side surface 25.

  In the case of the configuration shown in FIG. 7, the heat radiating body 42 of the circuit unit 10 </ b> F is provided so as to face the front side surface 25 </ b> F of the housing 2, for example. Further, the heat radiating body 42 of the circuit unit 10E is provided so as to face the right side surface 25E of the housing 2, for example. Moreover, the heat radiating body 42 of the circuit unit 10 </ b> R is provided, for example, so as to face the rear side surface 25 </ b> R of the housing 2. Further, the heat radiating body 42 of the circuit unit 10W is provided so as to face the left side surface 25W of the housing 2, for example. That is, the heat radiating body 42 of each circuit unit 10 is provided so as to face different side surfaces 25 of the housing 2, for example.

[Configuration of circuit unit]
Referring to FIGS. 3 to 5 again, circuit board 41 is fixed to heat radiator 42, for example. Specifically, for example, as illustrated in FIG. 5, the circuit board 41 includes an external mounting surface 77 that is a main surface on the heat radiating body 42 side, and an internal mounting surface 78 that is opposite to the external mounting surface 77. Have The shapes of the outer side mounting surface 77 and the inner side mounting surface 78 are substantially rectangular.

  The heat radiator 42 has, for example, a heat receiving surface 75 that is a main surface facing the inside of the housing 2 when the power supply device 101 is completed, and a heat radiating surface 76 opposite to the heat receiving surface 75. The heat receiving surface 75 is shown in FIG. 3, and the heat radiating surface 76 is shown in FIG. The heat receiving surface 75 and the heat radiating surface 76 of the heat radiating body 42 have a substantially rectangular shape.

  For example, as shown in FIG. 3, the circuit board 41 has a heat receiving surface 75 of the radiator 42 and an external mounting surface 77 of the circuit board 41 that are substantially parallel and do not contact the plate member 48. It is fixed to the heat receiving surface 75 of the heat radiating body 42 with a bolt through a spacer 61.

  An electronic component 79 that requires cooling, such as an IGBT (Insulated Gate Bipolar Transistor), is fixed to the external mounting surface 77 of the circuit board 41, for example, as shown in FIG. Further, for example, as shown in FIG. 3, a large volume electronic component such as a capacitor and a choke coil, and the circuit board 41 are electrically connected to other circuits on the inner side mounting surface 78 of the circuit board 41. A connector for receiving the cable terminal is fixed.

  As shown in FIG. 4, for example, electronic components constituting the converter circuit 31 are mainly arranged in the region RgC on both mounting surfaces of the circuit board 41. In the region RgI on both mounting surfaces of the circuit board 41, for example, electronic components constituting the inverter circuit 33 are mainly arranged.

  The radiator 42 is connected to the circuit board 41, for example. Specifically, as shown in FIG. 5, a heat receiving surface 75 (not shown in FIG. 5) of the radiator 42 is an electronic component 79 that is fixed to the external mounting surface 77 of the circuit board 41 and requires cooling. Connected. More specifically, the heat receiving surface 75 of the radiator 42 and the electronic component 79 that is fixed to the circuit board 41 and requires cooling are, for example, a connection plate that is a thin plate having good thermal conductivity and insulating properties. Connected, i.e. in thermal contact.

  Referring to FIG. 2 again, a plurality of fins 43 are formed on the heat radiating surface 76 of the heat radiating body 42 so as to extend in one direction along the vertical direction of the housing 2. The heat radiator 42 radiates heat generated in the circuit board 41 by the heat radiating surface 76 and the plurality of fins 43.

  At this time, the air between the plurality of fins 43 is warmed. The heated air moves from between the plurality of fins 43 to above the power supply apparatus 101. Then, new air enters between the plurality of fins 43 from below the power supply device 101. That is, the direction of the air flow path for cooling is from the lower side to the upper side of the power supply apparatus 101.

  Specifically, the air that cools the radiator 42 in the circuit unit 10E flows, for example, in the flow path 81E from the lower side of the side part 22E to the upper side of the side part 22E in the housing 2. The air that cools the radiator 42 in the circuit unit 10F flows, for example, in the flow path 81F from the lower side of the side part 22F to the upper side of the side part 22F in the housing 2. Although not shown in part below, the air that cools the heat radiator 42 in the circuit unit 10W flows, for example, in the flow path 81W from the lower side 22W to the upper side 22W in the housing 2. The air that cools the radiator 42 in the circuit unit 10R flows, for example, in the flow path 81R from the lower side of the side part 22R to the upper side of the side part 22W in the housing 2.

  Here, the lower the temperature of the air that newly enters between the plurality of fins 43, the higher the heat dissipation effect. In the power supply apparatus 101, the radiators 42 in the other circuit units 10 are not arranged in the vertical direction of the radiator 42 in the circuit unit 10.

  With such a configuration, it is possible to suppress the air warmed in the radiator 42 in the circuit unit 10 from entering between the plurality of fins 43 in the radiator 42 of the other circuit unit 10. Thereby, in each circuit unit 10, the heat generated in each circuit unit 10 can be efficiently radiated.

  Moreover, in the power supply apparatus 101, since the heat radiator 42 is cooled by natural air cooling, power consumption in the power supply apparatus 101 can be reduced as compared with the case where the heat radiator 42 is cooled using, for example, an electric fan.

  3 to 5 again, the plate member 48 is, for example, a plate-like member having a rectangular main surface. The plate member 48 is L-shaped along a valley line substantially parallel to the short side of the rectangle. It is formed by bending it into a shape. The plate member 48 has a main inner side surface 71, a sub inner side surface 73, a main outer side surface 72, and a sub outer side surface 74.

  The main inner side surface 71 and the sub inner side surface 73 are surfaces facing the inner side of the housing 2 when the power supply device 101 is completed. The main external side surface 72 and the sub external side surface 74 are surfaces facing the outside of the housing 2 when the power supply apparatus 101 is completed.

  The main inner side surface 71 and the sub inner side surface 73 are L-shaped valley side surfaces of the plate member 48, and are continuous via the valley line. The main inner side surface 71 and the sub inner side surface 73 are substantially rectangular. One of the short sides of the main internal side surface 71 and one of the long sides of the sub internal side surface 73 correspond to the valley line.

  The main external side surface 72 and the sub external side surface 74 are surfaces opposite to the main internal side surface 71 and the sub internal side surface 73 in the plate member 48, respectively. The main external side surface 72 and the sub external side surface 74 are substantially rectangular. One of the short sides of the main external side surface 72 and one of the long sides of the sub external side surface 74 correspond to a mountain line corresponding to the valley line.

  Engaging portions 63 are provided at the long side end portions of the main inner side surface 71 and the main outer side surface 72. The plate member 48 is fixed to the housing 2 by, for example, the engaging portion 63 being engaged with the support column 11 by a bolt and a nut.

  The plate member 48 has, for example, a through hole 62. More specifically, the through hole 62 is formed at a common position among the plate members 48 and has a common shape and size, for example.

  Specifically, the through hole 62 has a substantially rectangular cross section and penetrates through the main inner side surface 71 and the main outer side surface 72. For example, as shown in FIG. 4, the cross section of the through hole 62 is slightly larger than the heat receiving surface 75 of the radiator 42 and the inner side mounting surface 78 of the circuit board 41.

  The radiator 42 is fixed to the plate member 48 via, for example, insulators 45A and 45B. For example, the arrangement of the radiator 42 in each plate member 48 is common. More specifically, the radiator 42 is provided, for example, at a common position and common orientation between the plate members 48.

  Specifically, the insulators 45A and 45B are, for example, acrylic plates. The thickness of the insulators 45A and 45B is, for example, larger than the thickness of the connection plate that connects the heat receiving surface 75 of the radiator 42 and the electronic component 79 that is fixed to the circuit board 41 and requires cooling. The insulators 45A and 45B are fixed by bolts and nuts, for example, on the main inner side surface 71 of the plate member 48 in the vicinity of the through hole 62 and on both sides in the horizontal direction of the through hole 62 when the power supply device 101 is completed. Is done.

  The radiator 42 is fixed to the insulators 45A and 45B with bolts and nuts so that, for example, the heat receiving surface 75 and the main inner side surface 71 of the radiator 42 are substantially parallel and do not contact the plate member 48. The At this time, the heat radiating body 42 is fixed to the plate member 48 such that the heat receiving surface 75 of the heat radiating body 42 faces the inside of the housing 2, for example.

  Therefore, the heat radiating surface 76 of the heat radiating body 42 fixed to the plate member 48 faces the outside of the housing 2 when the power supply device 101 is completed. Further, the inner side mounting surface 78 of the circuit board 41 fixed to the heat radiating body 42 faces the inside of the housing 2 when the power supply device 101 is completed.

  Further, for example, as shown in FIG. 4, when the heat radiating body 42 is viewed from the direction perpendicular to the main inner side surface 71, the heat radiating body 42 and the circuit board 41 fixed to the heat radiating body 42 are formed in the through holes 62. Are fixed to the insulators 45A and 45B. In addition, the heat radiator 42 is fixed to the insulators 45A and 45B so that, for example, at least a part of the fins 43 in the heat radiator 42 protrudes from the main external side surface 72 to the outside of the housing 2.

  As described above, the heat receiving surface 75 of the radiator 42 and the electronic component 79 that is fixed to the circuit board 41 and requires cooling are connected via the connection plate. Therefore, a current flowing in the circuit board 41, specifically, a part of the high-frequency current may flow to the heat radiator 42 as a leakage current through the connection plate.

  Therefore, in the power supply apparatus 101, the heat radiator 42 is fixed to the plate member 48 via the insulator 45. Thereby, the magnitude of the leakage current flowing from the circuit board 41 to the plate member 48 via the radiator 42 can be reduced.

  For example, the control board 47 is fixed to the sub-inner side surface 73 of the plate member 48. More specifically, for example, as shown in FIG. 3, the control board 47 is fixed to the sub-inner side surface 73 through a spacer or the like so as not to contact the sub-inner side surface 73. The control board 47 includes, for example, a microcomputer corresponding to the control unit 15 for controlling the circuit unit 10 and a connector for receiving a cable terminal for electrically connecting the control board 47 to other circuits. Is fixed.

  For example, as shown in FIG. 5, the communication terminal 46 is fixed to the sub external side surface 74 of the plate member 48. The communication terminal 46 in the circuit unit 10 is connected to the communication terminal 46 and the like in the other circuit unit 10 by a communication cable. The microcomputer fixed to the control board 47 in the circuit unit 10 exchanges information with other circuit units 10 via the communication terminals 46.

  The inductor 44 is electrically connected to the circuit board 41, for example. Specifically, for example, as shown in FIG. 4, the inductor 44DC is electrically connected to the converter circuit 31 mainly disposed in the region RgC on both mounting surfaces of the circuit board 41 and receives direct current from the power generation device 511. Used for voltage boost. For example, the inductor 44AC is electrically connected to the inverter circuit 33 mainly disposed in the region RgI on both mounting surfaces of the circuit board 41, and is used for smoothing the AC voltage generated by the inverter circuit 33.

  For example, the arrangement of the inductors 44 in each plate member 48 is common. More specifically, for example, the inductor 44 is provided in a plurality of plate members 48 at a common position and a common orientation with respect to the plurality of plate members 48.

  With such a configuration, there is no need to change the direction of the inductor 44 and the type of the inductor 44 for each circuit unit 10. Therefore, when the inductor 44 is assembled to the plate member 48, the direction in which the inductor 44 is assembled, and the inductor 44 to be assembled It is possible to avoid the wrong type.

  Specifically, for example, as shown in FIG. 4, the inductor 44DC is disposed on the end side of the plate member 48 with respect to the through hole 62 in the plate member 48, and the winding direction of the inductor 44DC is mainly used. The inner side surface 71 is disposed along a surface substantially parallel to a surface orthogonal to the short side. For example, in the plate member 48, the inductor 44 </ b> AC is disposed on the end side of the plate member 48 with respect to the through hole 62, and the winding direction of the inductor 44 </ b> AC is perpendicular to the short side of the main inner side surface 71. It is arranged along a plane substantially parallel to the.

  By arranging the inductors 44DC and 44AC in this manner, the inductors 44DC and 44AC and the control board 47 can be arranged apart from each other, so that the control board 47 can suppress the influence of the magnetic field generated by the inductors 44DC and 44AC. it can.

  The inductors 44DC and 44AC may be disposed on the main external side surface 72 of the plate member 48, for example. Further, the inductors 44DC and 44AC may be arranged, for example, in the plate member 48 such that the winding direction of the inductors 44DC and 44AC is along a plane substantially parallel to the plane including the long side of the main inner side surface 71.

  Further, on both mounting surfaces of the circuit board 41, an electronic component constituting the converter circuit 31 is mainly arranged in the region RgC, and an electronic component constituting the inverter circuit 33 is mainly arranged in the region RgI. However, the present invention is not limited to this. For example, the circuit board 41 may have a configuration in which electronic components constituting at least one of the converter circuit 31, the inverter circuit 33, and the bidirectional converter circuit 34 are arranged.

  Further, the circuit configuration of the circuit board 41 may be different for each circuit unit 10. Further, the electronic components constituting the converter circuit 31, the inverter circuit 33, or the bidirectional converter circuit 34 may be arranged over two or more circuit boards 41.

[Combination of circuit units]
FIG. 8 is a perspective view of the circuit units arranged in the horizontal direction in the power supply apparatus according to the embodiment of the present invention, as viewed from the right side.

  FIG. 8 shows a state in which the circuit units 10W and 10E shown in FIG.

  Referring to FIG. 8, circuit unit 10E is fixed to housing 2 so as to be symmetric with circuit unit 10W, for example. The circuit unit 10E is fixed to the housing 2 so as to be symmetrical with respect to the horizontal direction of the circuit unit 10W and the housing 2, for example. More specifically, in the circuit units 10E and 10W, an axis passing through the center of the surface formed by the sub external side surface 74 of the circuit unit 10W and the sub external side surface 74 of the circuit unit 10E and perpendicular to the surface is an axis of symmetry. That is, it becomes a 2-fold axis.

  Referring to FIG. 2 again, similarly, circuit unit 10F is fixed to housing 2 so as to be symmetrical with circuit unit 10R, for example. The circuit unit 10F is fixed to the housing 2 so as to be symmetrical with respect to the horizontal direction of the circuit unit 10R and the housing 2, for example. More specifically, in the circuit units 10F and 10R, an axis passing through the center of the surface formed by the sub external side surface 74 of the circuit unit 10F and the sub external side surface 74 of the circuit unit 10R and perpendicular to the surface is an axis of symmetry. That is, it becomes a 2-fold axis.

  Specifically, the circuit unit 10 </ b> W is disposed via the engaging portion 63 in the plate member 48 such that the heat radiating body 42 faces the left side of the power supply device 101 and the sub external side surface 74 faces the front side of the power supply device 101. Are fixed to the columns 11FW and 11RW. The circuit unit 10E includes support columns 11FE and 11RE via the engaging portions 63 in the plate member 48 so that the heat radiating body 42 faces the right side of the power supply device 101 and the sub external side surface 74 faces the front side of the power supply device 101. Fixed to.

  The circuit unit 10F includes support columns 11FW and 11FE via the engaging portions 63 in the plate member 48 so that the heat radiator 42 faces the front side of the power supply device 101 and the sub external side surface 74 faces the right side of the power supply device 101. Fixed to. The circuit unit 10 </ b> R includes the support columns 11 </ b> RE and 11 </ b> RE through the engaging portions 63 in the plate member 48 such that the radiator 42 faces the rear side of the power supply device 101 and the sub external side surface 74 faces the right side of the power supply device 101. It is fixed to 11RW.

  The circuit units 10W and 10E are disposed above the circuit units 10F and 10R. The circuit units 10W and 10E may be disposed below the circuit units 10F and 10R.

  Referring to FIG. 8 again, span plate 51WE and reinforcing plate 52WE are fixed, for example, between plate member 48 in circuit unit 10W and plate member 48 in circuit unit 10E. Thereby, the strength of coupling of the circuit units 10W and 10E can be increased. Further, the spanning plate 51WE and the reinforcing plate 52WE can be used as a cable support.

  Although not shown, like the circuit units 10W and 10E, also in the circuit units 10F and 10R, the span plate 51FR and the reinforcing plate 52FR are fixed across the circuit units 10F and 10R.

  Further, the circuit boards 41 in the circuit units 10W and 10E face each other in the housing 2 as shown in FIG. Similarly, the circuit boards 41 in the circuit units 10F and 10R face each other in the housing 2 although not shown.

  In the configuration as described above, the circuit board 41 and the control board 47 in the two circuit units 10 fixed to the housing 2 are arranged symmetrically in the horizontal direction. It can be wired symmetrically.

  Thereby, since the wiring of the cable which connects between boards can be simplified, the cable which connects between boards can be wired efficiently. Further, since the space between the two circuit units 10 is widened, the cable wiring work between the two circuit units 10 can be performed efficiently.

  Further, in the two circuit units 10, the distance between the control boards 47 can be shortened, so that the electrical connection between the control boards 47 can be efficiently performed.

  Further, as shown in FIG. 8, in the circuit unit 10W, the inductor 44AC is disposed below the inductor 44DC, while in the circuit unit 10E, the inductor 44DC is disposed below the inductor 44AC.

  In addition, as shown in FIG. 2, in the circuit unit 10F, the inductor 44AC is disposed below the inductor 44DC. On the other hand, in the circuit unit 10R, the inductor 44DC is disposed below the inductor 44AC. The

  In the above arrangement, the vertical relationship of the inductor 44 in the circuit units 10W and 10F and the vertical relationship of the inductor 44 in the circuit units 10E and 10R are opposite to each other, so that the current flowing through the winding of the inductor 44 in the circuit units 10W and 10F And the direction of the current flowing in the winding of the inductor 44 in the circuit units 10E and 10R are opposite to each other.

  FIG. 9 is a cross-sectional view showing a cross section taken along line IX-IX in FIG. 8 of the circuit units arranged in the horizontal direction in the power supply apparatus according to the embodiment of the present invention.

  FIG. 9 representatively shows the magnetic field generated by the inductor 44 in the circuit units 10W and 10E. The magnetic field generated by the inductor 44 in the circuit units 10F and 10R is the same as the magnetic field generated by the inductor 44 in the circuit units 10W and 10E.

  Referring to FIG. 9, in the inductors 44AC and 44DC in the circuit unit 10W, for example, when a clockwise current flows when the casing 2 is viewed from the upper side to the lower side, the inductors 44AC and 44DC in the circuit unit 10W 44DC generates a magnetic field from the upper side to the lower side of the housing 2 inside the windings of the inductors 44AC and 44DC, respectively. Therefore, the inductors 44AC and 44DC in the circuit unit 10W generate magnetic fields from the lower side to the upper side of the housing 2 outside the windings of the inductors 44AC and 44DC, respectively.

  On the other hand, since the circuit unit 10E is arranged symmetrically with respect to the horizontal direction with respect to the circuit unit 10W, the direction of the current flowing through the windings of the inductors 44AC and 44DC in the circuit unit 10E is the winding of the inductors 44AC and 44DC in the circuit unit 10W. The direction of the current flowing through Thereby, the inductors 44AC and 44DC in the circuit unit 10E generate the following magnetic fields.

  That is, in the inductors 44AC and 44DC in the circuit unit 10E, a counterclockwise current flows when the casing 2 is viewed from the upper side to the lower side. Therefore, the inductors 44AC and 44DC in the circuit unit 10E are respectively inductors 44AC. , 44DC generates a magnetic field from the lower side to the upper side of the housing 2 inside the windings. Therefore, the inductors 44AC and 44DC in the circuit unit 10E generate magnetic fields from the upper side to the lower side of the housing 2 outside the windings of the inductors 44AC and 44DC, respectively.

  Therefore, the direction of the magnetic field generated by the inductor 44DC in the circuit unit 10W and the direction of the magnetic field generated by the inductor 44AC in the circuit unit 10E are mutually different between the winding of the inductor 44DC and the winding of the inductor 44AC. Since the opposite is true, the magnetic field between the two windings can be weakened.

  Similarly, the direction of the magnetic field generated by the inductor 44AC in the circuit unit 10W and the direction of the magnetic field generated by the inductor 44DC in the circuit unit 10E are mutually different between the winding of the inductor 44AC and the winding of the inductor 44DC. Since the opposite is true, the magnetic field between the two windings can be weakened.

  As shown in FIG. 8, even if the radiators 42 of the two circuit units 10 arranged side by side in the horizontal direction are not opposite to each other, the windings of the inductors 44 of the two circuit units 10 If the current flow directions are opposite to each other, the magnetic field between the two windings can be weakened.

  The effect of weakening the magnetic field is enhanced on the intermediate surface 80 which is a surface located between the main external side surface 72 in the circuit unit 10W and the main external side surface 72 in the circuit unit 10E.

  Therefore, since the magnetic field generated by the inductors 44DC and 44AC of the circuit units 10W and 10E can be reduced in the vicinity of the intermediate surface 80, even if a cable is wired in the vicinity of the intermediate surface 80, the magnetic field in the cable can be reduced. Inductive noise generated by can be reduced.

  Thereby, in the power supply apparatus 101, since a cable can be wired in the vicinity of the intermediate surface 80 without being affected by the induction noise so much, the degree of freedom of cable wiring in the power supply apparatus 101 can be increased.

  In the power supply apparatus 101 according to the embodiment of the present invention, the circuit units 10W, 10E, 10F, and 10R are fixed to the housing 2 as shown in FIG. 2, for example. It is not limited. For example, two or more circuit units 10 may be fixed to the housing 2.

  For example, when two circuit units 10 are fixed to the housing 2, the heat dissipating bodies 42 in the two circuit units 10 are provided so as to face different directions from the inside of the housing 2 to the outside. For example, the two circuit units 10 may be arranged side by side in the vertical direction of the casing 2, or the two circuit units 10 may be arranged side by side in the horizontal direction of the casing 2.

  In the power supply apparatus 101 according to the embodiment of the present invention, the circuit unit 10W, 10E and the circuit units 10F, 10R are arranged in two rows in the vertical direction in the housing 2. However, the present invention is not limited to this. In the housing 2, for example, the circuit units 10 may be arranged in three or more stages in the vertical direction.

  In the power supply apparatus 101 according to the embodiment of the present invention, the circuit unit 10W, 10E and the two circuit units 10F, 10R are arranged in the horizontal direction in the housing 2, but the present invention is limited to this. It is not a thing. In the housing 2, for example, three or more circuit units 10 may be arranged side by side in the horizontal direction.

  Further, in the power supply device 101 according to the embodiment of the present invention, in the case 2, two circuit units 10 arranged side by side in the horizontal direction have the radiators 42 facing in opposite directions to each other, and the sub units Although the outer side surface 74 is arranged to face the same direction, the present invention is not limited to this. The two circuit units 10 arranged side by side in the horizontal direction may be arranged such that the heat dissipating bodies 42 face in opposite directions and the sub-external side surfaces 74 face in opposite directions.

  Specifically, in the two circuit units 10 arranged side by side in the horizontal direction, for example, when the radiator 42 and the sub-external side surface 74 in one circuit unit 10 face the left side and the front side, respectively, the other circuit unit 10 The heat dissipating body 42 and the sub-external side surface 74 face the right side and the rear side, respectively. Thereby, compared with the case where the two circuit units 10 are arrange | positioned as shown in FIG. 2, the two circuit units 10 can be arrange | positioned compactly in a horizontal direction.

[Configuration of power supply apparatus when other devices are arranged in the housing]
FIG. 10 is a perspective view of the power supply apparatus according to the embodiment of the present invention as viewed from the right side surface.

  FIG. 10 shows the power supply apparatus 101 when the circuit units 10F and 10R are not arranged as compared with the power supply apparatus 101 shown in FIG. 10 shows a power supply apparatus 101 including a load 513.

  Referring to FIG. 10, for example, when the power supply device 101 is installed in a place where the installation space is limited, such as the rooftop or the top of a commercial facility, the casing 2 in the power supply device 101 has an effective space. In order to utilize, other devices 201A and 201B such as communication devices, that is, the load 513 may be arranged together with the circuit units 10W and 10E. Hereinafter, each of the other apparatuses 201A and 201B is also referred to as another apparatus 201.

  For example, the other device 201 arranged in the 19-inch rack sucks in air used for cooling the other device 201 from the front side of the power supply device 101, and uses the cooled air whose temperature has increased as the power supply device 101. Often exhausts from the rear.

  More specifically, for example, as shown in FIG. 10, the air that cools the other device 201 flows through a flow path 82 </ b> F that enters the other device 201 from the front side of the power supply device 101. Then, the air whose temperature is increased by cooling the components included in the other device 201 flows through the flow path 82R from the rear side of the other device 201 to the upper side of the side portion 22R in the housing 2.

  On the other hand, the heat radiator 42 in the circuit units 10W and 10E is not provided on the air flow path 82R after the other device 201 is cooled.

  With such a configuration, even when the other device 201 is arranged in the housing 2 in which the circuit units 10W and 10E are arranged, the high-temperature air after cooling the other device 201 is converted into the circuit unit 10W, It is possible to avoid hitting the radiator 42 at 10E.

  Thereby, since air with low temperature can be applied to circuit unit 10W, 10E, the fall of the cooling efficiency of the thermal radiation body 42 in circuit unit 10W, 10E can be suppressed.

  By the way, in the electrical storage system described in Patent Document 1, for example, when the heat sink is attached to the battery module and the control unit, the battery module disposed below the storage case is cooled well, while There is a case where the cooling of the control unit arranged on the upper side of the case becomes insufficient.

  Further, in the above power storage system, when a new circuit board is disposed in the storage case, it is not considered to cool the new circuit board. For this reason, when a new circuit board is arranged to expand the power supply function, for example, even if a new circuit board is arranged in the storage case instead of the battery module, the new circuit board can be cooled well. Is difficult.

  On the other hand, the power supply device according to the embodiment of the present invention accommodates the circuit board 41, the radiator 42 for radiating the heat generated in the circuit board 41, the circuit board 41 and the radiator 42. And a housing 2 for the purpose. The power supply apparatus 101 includes a plurality of circuit units 10 including a circuit board 41 and a radiator 42. The circuit units 10 are arranged side by side in the vertical direction of the housing 2. The heat radiator 42 of each circuit unit 10 is provided so as to face different directions from the inside of the housing 2 to the outside.

  In addition, the power supply device according to the embodiment of the present invention includes a circuit board 41, a radiator 42 for radiating heat generated in the circuit board 41, and a housing for housing the circuit board 41 and the radiator 42. A body 2. The power supply apparatus 101 includes a plurality of circuit units 10 including a circuit board 41 and a radiator 42. The circuit units 10 are arranged side by side in the horizontal direction of the housing 2. The heat radiator 42 of each circuit unit 10 is provided so as to face different directions from the inside of the housing 2 to the outside.

  With such a configuration, it is possible to reduce the possibility that the air heated in the heat radiating body 42 of the circuit unit 10 rises and the heated air hits the heat radiating body 42 of another circuit unit 10.

  Thereby, since the fall of the thermal radiation amount of the thermal radiation body 42 of the said other circuit unit 10 can be suppressed, the heat which generate | occur | produces in the circuit board 41 can be radiated favorably, and the cooling performance in the electric power supply apparatus 101 is improved. Can do.

  In addition, for example, even when a new circuit board 41 is arranged in the power supply apparatus 101 in order to expand the power supply function, the radiator 42 for radiating heat generated in the new circuit board 41 is replaced with another circuit. By providing the unit 10 in a direction different from the direction in which the heat radiating body 42 faces, the heat generated in the new circuit board 41 can be radiated well, and the cooling performance of the power supply apparatus 101 can be improved.

  Further, in the power supply device according to the embodiment of the present invention, the plurality of plate members 48 are provided corresponding to the circuit units 10, and the heat radiator 42 of the corresponding circuit unit 10 is fixed and fixed to the housing 2. Is done. And the arrangement | positioning of the heat radiator 42 in each board member 48 is common.

  With such a configuration, the specifications of the plate member 48 and the radiator 42 can be unified, so that the design cost and manufacturing cost of the plate member 48 and the radiator 42 can be reduced.

  Further, by unifying the specifications of the plate member 48 and the radiator 42, the housing 2 can be changed even when the configuration of the power generation device 511, the load 513, the battery panel B1, and the commercial power supply 512 in the power supply system 401 is changed. This can be easily handled by increasing or decreasing the number of circuit units 10 to be fixed. That is, by using the unitized circuit unit 10, it is possible to realize a small lot and a variety of power supply apparatuses 101 at a low cost and with a short delivery time.

  In the power supply device according to the embodiment of the present invention, the circuit board 41 is fixed to the heat radiator 42.

  With such a configuration, for example, even when the specifications of the circuit arranged on the circuit board 41 are changed, it is possible to cope by changing the specifications of the light and small radiator 42 and the circuit board 41. The heavy and large plate member 48 can be used as it is without changing specifications.

  Accordingly, it is possible to easily cope with a change in the electrical connection of the power generation device 511, the load 513, the battery panel B1, and the commercial power supply 512 in the power supply system 401.

  In the power supply device according to the embodiment of the present invention, the circuit units 10 are arranged side by side in the vertical direction of the housing 2 and are arranged in the horizontal direction of the housing 2. In the circuit unit 10, the radiator 42 and the circuit board 41 are connected. In the heat radiating body 42, the heat radiating surface 76 opposite to the surface connected to the circuit board 41 faces the outside of the housing 2, and the circuit board 41 is opposite to the surface connected to the heat radiating body 42. The main inner side surface 71 on the side faces the inside of the housing 2.

  With such a configuration, in the circuit unit 10 arranged side by side in the horizontal direction of the housing 2, it is possible to simplify the wiring of the cable connecting the circuit boards 41, so that the cable is efficiently wired. Can do.

  Further, in the power supply device according to the embodiment of the present invention, the plurality of plate members 48 are provided corresponding to the circuit units 10, and the heat radiator 42 of the corresponding circuit unit 10 is fixed and fixed to the housing 2. Is done. In the circuit unit 10, the radiator 42 and the circuit board 41 are connected. The radiator 42 is fixed to the plate member 48 via the insulator 45.

  With such a configuration, it is possible to reduce a leakage current flowing from the circuit board 41 to the plate member 48 via the radiator 42.

  Further, in the power supply device according to the embodiment of the present invention, the plurality of plate members 48 are provided corresponding to the circuit units 10, and the heat radiator 42 of the corresponding circuit unit 10 is fixed and fixed to the housing 2. Is done. The plurality of inductors 44 are provided corresponding to the circuit units 10 and are electrically connected to the circuit board 41 of the corresponding circuit unit 10. The arrangement of the inductor 44 with respect to each plate member 48 is common. The circuit units 10 are arranged side by side in the vertical direction of the housing 2 and are arranged side by side in the horizontal direction of the housing 2. The plate members 48 corresponding to the two circuit units 10 arranged side by side in the horizontal direction are arranged so that the current flow directions in the windings of the inductors 44 corresponding to the two circuit units 10 are opposite to each other. Fixed to the body 2.

  With this configuration, the direction of the magnetic field generated by the inductor 44 in one circuit unit 10 and the direction of the magnetic field generated by the inductor 44 in the other circuit unit 10 are opposite to each other between the two inductors 44. Therefore, the magnetic field between the two inductors 44 can be weakened.

  Thereby, even when a cable is wired between the two inductors 44, the induction noise generated by the magnetic field generated by the two inductors 44 in the cable can be reduced.

  Further, since it is not necessary to change the direction of the inductor 44 and the type of the inductor 44 for each circuit unit 10, when the inductor 44 is assembled to the plate member 48, the direction in which the inductor 44 is assembled and the type of the inductor 44 to be assembled are mistaken. Can be avoided.

  In addition, the effect of weakening the magnetic field is enhanced in the intermediate plane 80 which is a plane orthogonal to the plane including the two inductors 44 and is positioned between the two inductors 44. In other words, the effect of weakening the magnetic field is enhanced on the intermediate surface 80 located in the middle of the main external side surface 72 of each plate member 48 on which the two inductors 44 are respectively disposed.

  Accordingly, since the magnetic field generated by the inductors 44 of the two circuit units 10 can be further reduced in the vicinity of the intermediate surface 80, even if a cable is wired in the vicinity of the intermediate surface 80, The induced noise generated can be further reduced.

  Thereby, in the power supply apparatus 101, since a cable can be wired in the vicinity of the intermediate surface 80 without being affected by the induction noise so much, the degree of freedom of cable wiring in the power supply apparatus 101 can be increased.

  In the power supply device according to the embodiment of the present invention, all the heat radiating bodies 42 of each circuit unit 10 arranged in the housing 2 are provided so as to face in different directions from the inside of the housing 2 to the outside. However, the present invention is not limited to this. For example, when a plurality of circuit units 10 are arranged side by side in the vertical direction of the housing 2, a part of the radiators 42 of each circuit unit 10 faces in different directions from the inside of the housing 2 to the outside. The provided structure may be sufficient.

  Specifically, in the case 2, for example, when the six circuit units 10 are arranged in three stages of two in the vertical direction, the radiator 42 of the circuit unit 10 in the lowermost stage is the case 2. Are provided so as to face the right side, the left side, the front side, and the rear side of the housing 2, respectively.

  In the above case, the heat radiating bodies 42 of the circuit units 10 at the lowermost and uppermost stages are provided so as to face in the same direction from the inside of the housing 2 to the outside, but the lowermost and uppermost stages are not adjacent to each other. It is possible to reduce the amount of air heated by the heat radiating body 42 of the circuit unit 10 in the lower stage and hitting the heat radiating body 42 of the circuit unit 10 in the uppermost stage.

  Thereby, since the fall of the thermal radiation amount of the heat radiating body 42 in the uppermost circuit unit 10 can be suppressed, the heat generated in the circuit board 41 can be radiated well, and the cooling performance in the power supply device 101 can be improved. Can do.

  That is, in the case where a plurality of circuit units 10 are arranged in the vertical direction of the housing 2, the heat radiating bodies 42 of the circuit units 10 in adjacent stages are directed in different directions from the inside of the housing 2 to the outside. By providing in, the fall of the thermal radiation amount of the thermal radiation body 42 in each circuit unit 10 can be suppressed.

  Moreover, in the power supply device according to the embodiment of the present invention, the circuit board 41 in each circuit unit 10 arranged in the horizontal direction of the housing 2 is configured to face each other. It is not limited. In each circuit unit 10 arranged side by side in the horizontal direction of the housing 2, for example, the radiator 42 and the circuit board 41 are connected, the heat radiation surface 76 of the radiator 42 faces the outside, and the circuit What is necessary is just the structure in which the inner side mounting surface 78 in the board | substrate 41 faces inside.

  In the power supply apparatus according to the embodiment of the present invention, the inductor 44 is configured to be disposed on the plate member 48, but the present invention is not limited to this. For example, the inductor 44 may be arranged on the circuit board 41.

  Further, in the power supply device according to the embodiment of the present invention, the heat dissipating bodies 42 of the two circuit units 10 arranged in the horizontal direction are opposite to each other. However, the present invention is not limited to this. Absent. The heat radiation bodies 42 of the two circuit units 10 arranged side by side in the horizontal direction may have, for example, a configuration in which they are not opposite to each other, and are provided so as to face different directions from the inside of the housing 2 to the outside. Just do it.

  Moreover, although the power supply device according to the embodiment of the present invention is configured to receive power from the power generation device 511 and the battery panel B1, it is not limited thereto. For example, the power supply device 101 may include at least one of the power generation device 511 and the battery panel B1.

  The above embodiment should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

DESCRIPTION OF SYMBOLS 2 Housing | casing 10 Circuit unit 11 Support | pillar 15 Control part 21 Top plate 22 Side part 23 Bottom plate 24 Side board 25 Side surface 31 Converter circuit 33 Inverter circuit 34 Bidirectional converter circuit 41 Circuit board 42 Radiator 43 Fin 44 Inductor 45 Insulator 46 For communication Terminal 47 Control board 48 Plate member 51 Cross plate 52 Reinforcement plate 61 Spacer 62 Through-hole 63 Engagement part 71 Main internal side surface 72 Main external side surface 73 Sub internal side surface 74 Sub external side surface 75 Heat receiving surface 76 Heat radiation surface 77 External side mounting surface 78 Internal mounting surface 79 Electronic component 80 Intermediate surface 81 Flow path 101 Power supply device 201 Other device 401 Power supply system 511 Power generation device 512 Commercial power supply 513 Load B1 Battery panel

Claims (6)

A power supply device,
A circuit board;
A radiator for dissipating heat generated in the circuit board;
A housing for housing the circuit board and the radiator;
The power supply apparatus includes a plurality of sets of the circuit board and the heat radiator,
Each of the sets is arranged side by side in the vertical direction of the housing,
All or a part of the radiators of each set are provided to face different directions from the inside of the housing to the outside ,
The power supply device further includes:
A plurality of plate members provided corresponding to the set, the heat radiator of the set corresponding to the set is fixed, and fixed to the housing;
The arrangement of the radiators in each of the plate members is common,
Each of the sets is arranged side by side in the vertical direction of the casing, and is arranged side by side in the horizontal direction of the casing,
In the set, the radiator and the circuit board are connected, and in the radiator, the surface opposite to the surface connected to the circuit board faces the outside of the housing, and the circuit The electric power supply apparatus in which the surface on the opposite side of the surface connected to the said heat sink is facing the inside of the said housing | casing in the board | substrate . A power supply device,
A circuit board;
A radiator for dissipating heat generated in the circuit board;
A housing for housing the circuit board and the radiator;
The power supply apparatus includes a plurality of sets of the circuit board and the heat radiator,
Each of the sets is arranged side by side in the vertical direction of the housing,
All or a part of the radiators of each set are provided to face different directions from the inside of the housing to the outside,
The power supply device further includes:
A plurality of plate members provided corresponding to the set, the heat sinks of the corresponding set being fixed, and fixed to the housing;
A plurality of inductors provided corresponding to the set and electrically connected to the circuit board of the set;
The arrangement of the inductor with respect to each plate member is common,
Each of the sets is arranged side by side in the vertical direction of the casing, and is arranged side by side in the horizontal direction of the casing,
The plate members corresponding to the two sets arranged side by side in the horizontal direction are arranged on the casing so that current flow directions in the windings of the inductor corresponding to the two sets are opposite to each other. Fixed, power supply device. The power supply apparatus according to claim 1 , wherein the circuit board is fixed to the heat radiator. The radiator and the circuit board before Symbol sets are connected,
The power supply device according to any one of claims 1 to 3 , wherein the heat radiator is fixed to the plate member via an insulator. A power supply device,
A circuit board;
A radiator for dissipating heat generated in the circuit board;
A housing for housing the circuit board and the radiator;
The power supply apparatus includes a plurality of sets of the circuit board and the heat radiator,
Each of the sets is arranged side by side in the horizontal direction of the housing,
The radiators of each set are provided so as to face different directions from the inside of the housing to the outside ,
The power supply device further includes:
A plurality of plate members provided corresponding to the set, the heat radiator of the set corresponding to the set is fixed, and fixed to the housing;
The arrangement of the radiators in each of the plate members is common,
In the set, the radiator and the circuit board are connected, and in the radiator, the surface opposite to the surface connected to the circuit board faces the outside of the housing, and the circuit The electric power supply apparatus in which the surface on the opposite side of the surface connected to the said heat sink is facing the inside of the said housing | casing in the board | substrate . A power supply device,
A circuit board;
A radiator for dissipating heat generated in the circuit board;
A housing for housing the circuit board and the radiator;
The power supply apparatus includes a plurality of sets of the circuit board and the heat radiator,
Each of the sets is arranged side by side in the horizontal direction of the housing,
The radiators of each set are provided so as to face different directions from the inside of the housing to the outside,
The power supply device further includes:
A plurality of plate members provided corresponding to the set, the heat sinks of the corresponding set being fixed, and fixed to the housing;
A plurality of inductors provided corresponding to the set and electrically connected to the circuit board of the set;
The arrangement of the inductor with respect to each plate member is common,
The plate members corresponding to the two sets arranged side by side in the horizontal direction are arranged on the casing so that current flow directions in the windings of the inductor corresponding to the two sets are opposite to each other. Fixed, power supply device.

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