JP6115430B2 - Power converter - Google Patents

Description

  The present invention relates to a power conversion device.

  Power conversion devices such as DC-DC converters are used in hybrid cars and electric vehicles. As such a power converter, there exists a thing shown by patent document 1. FIG. The power conversion device of Patent Document 1 includes a semiconductor unit having a semiconductor module incorporating a semiconductor element such as a switching element, a control circuit board for controlling the operation of the semiconductor module, and a case for housing these. Yes.

  The case has an outer fixing portion disposed along the outer peripheral edge of the control circuit board, and an inner fixing portion disposed to face the inner side of the control circuit board. The outer fixing portion and the inner fixing portion The control circuit board is fixed on In this way, by fixing the control circuit board not only along the outer peripheral edge of the control circuit board but also at the inner part, the distance between the fixed points is shortened, and the vibration of the control circuit board is suppressed. Have

JP 2006-191765 A

However, the power conversion device disclosed in Patent Document 1 has the following problems.
In the power converter of Patent Document 1, the case itself vibrates if the rigidity of the case fixing the control circuit board is low. Therefore, the vibration of the case is transmitted to the control circuit board, and the control circuit board vibrates.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a power conversion device capable of effectively suppressing vibration of a control circuit board.

One embodiment of the present invention is a semiconductor unit including a semiconductor module;
A control circuit board connected to a control terminal of the semiconductor module;
A housing for housing the semiconductor unit and the control circuit board;
The case includes a wall portion formed so as to surround the semiconductor unit and the control circuit board from a direction orthogonal to a normal direction of the control circuit board, and an outer peripheral fixing portion that fixes an outer peripheral side of the control circuit board. And a partition portion that divides the space inside the wall portion into a first accommodation space and a second accommodation space arranged in the normal direction,
The control circuit board is arranged in the first housing space,
Above the second accommodation space, and the semi-conductor unit is arranged,
The partition portion includes a communication hole through which the control terminal is inserted, an inner fixing boss that fixes the control circuit board inside the outer peripheral fixing portion when viewed from the normal direction of the partition portion, and the normal line It has a rib that protrudes in the direction and connects the inner fixed boss and the wall ,
The rib is formed in the power conversion device, wherein the rib is formed so as to be partially divided by the communication hole .

  In the power conversion apparatus, the partition portion includes the rib formed so as to connect the inner fixed boss and the wall portion. Therefore, vibration of the control circuit board can be suppressed and stably held.

  That is, by forming the ribs in the partition part, it is possible to effectively increase the cross-sectional secondary moment in the partition part. Therefore, the rigidity in the partition part can be improved and vibration of the partition part can be effectively suppressed.

  And since the said rib is formed so that the said inner side fixed boss | hub and the said wall part may be connected, the vibration in the site | part in which the said inner side fixed boss | hub was distribute | arranged can be suppressed especially effectively. Therefore, by fixing the control circuit board to the inner fixed boss in addition to the outer periphery fixing part, it is possible to more effectively suppress the occurrence of vibration in the control circuit board.

  As described above, according to the power conversion device, vibration of the control circuit board can be effectively suppressed and stably fixed.

The top view of the power converter device in Example 1. FIG. II-II arrow sectional drawing in FIG.

  In the power converter, the rib is preferably formed along a straight line extending from the inner fixed boss toward the wall portion when viewed from the normal direction. In this case, the rigidity improvement effect by the rib can be increased, and the vibration of the portion where the inner fixed boss is formed can be more effectively suppressed.

Example 1
The Example concerning the said power converter device is described with reference to FIG.1 and FIG.2.
As shown in FIGS. 1 and 2, the power conversion device 1 includes a semiconductor unit 2 having a semiconductor module 21, a control circuit board 3 connected to a control terminal 212 of the semiconductor module 21, a semiconductor unit 2, and a control circuit board. 3 for housing 3.
The case 4 includes a wall 42 formed so as to surround the semiconductor unit 2 and the control circuit board 3 from a direction orthogonal to the normal direction Z of the control circuit board 3, and an outer peripheral fixing that fixes the outer peripheral side of the control circuit board 3. And a partition portion 43 that divides the space inside the wall portion 42 into a first accommodation space 401 and a second accommodation space 402 arranged in the normal direction Z.

The control circuit board 3 is disposed in the first housing space 401, and the semiconductor unit 2 is disposed in the second housing space 402.
The partition portion 43 includes a unit side communication hole 431 through which the control terminal 212 is inserted, an inner side fixing boss 44 that fixes the control circuit board 3 inside the outer periphery fixing portion 45 when viewed from the normal direction Z, and a normal line The first rib 461, the second rib 462, the third rib 463, and the fourth rib 464 are formed to protrude in the direction Z.
The 1st rib 461-the 4th rib 464 are formed so that the inner side fixed boss | hub 44 and the wall part 42 may be connected, respectively.

This will be described in more detail below.
As shown in FIGS. 1 and 2, in this example, the stacking direction in the semiconductor unit 2 is the front-rear direction X, the normal direction of the partition 45 is the normal direction Z, and both the front-rear direction X and the normal direction Z are A direction orthogonal to the horizontal direction Y will be described below.

  In the front-rear direction X, the front ends of the refrigerant introduction pipe 221 and the refrigerant discharge pipe 222 are defined as the front, and the opposite sides are defined as the rear. In the normal direction Z, the side on which the first accommodation space 401 is disposed is defined as the upper side, and the opposite side is defined as the lower side.

The power conversion apparatus 1 of this example is an apparatus for generating a drive current (U phase, V phase, W phase) for energizing a three-phase AC motor (not shown) from a DC power source in, for example, a hybrid vehicle. is there.
As shown in FIGS. 1 and 2, the power conversion device 1 includes a semiconductor unit 2 including a semiconductor module 21, a reactor 61 as an auxiliary electronic component that forms a power conversion circuit together with the semiconductor unit 2, a smoothing capacitor 62, and a filter capacitor. 63, a current sensor 64, a control circuit board 3 connected to the semiconductor unit 2 and auxiliary electronic components, and a case 4 for housing them.

As shown in FIGS. 1 and 2, the semiconductor unit 2 includes a plurality of semiconductor modules 21 incorporating switching elements, and a cooler 22 that cools the semiconductor modules 21.
The semiconductor module 21 includes a main body 211 having a switching element, a plurality of control terminals 212 extending upward from the main body 211, and a plurality of main electrode terminals 213 extending downward from the main body 211. Yes.

The semiconductor module 21 constituting the semiconductor unit 2 includes a switching element such as an IGBT (insulated gate bipolar transistor) or a MOSFET (MOS field effect transistor). The main body 211 in the semiconductor module 21 of this example has a flat plate shape, and is formed by resin-molding two switching elements.
A control terminal 212 formed so as to extend upward from the main body 211 is connected to the control circuit board 3 and receives a control current for controlling the switching element.
The main electrode terminal 213 formed so as to extend downward from the main body 211 is connected to a bus bar (not shown).

  As shown in FIG. 1 and FIG. 2, the cooler 22 has a heat exchange part 221 that exchanges heat with the semiconductor module 21, a refrigerant introduction pipe 221 and a refrigerant discharge pipe 222 for circulating the refrigerant to the heat exchange part 221. doing. In this example, the heat exchanging part 221 is configured by a plurality of cooling pipes 224 formed of a metal such as aluminum, and has a refrigerant flow path through which a refrigerant flows. The plurality of heat exchanging parts 221 are arranged so as to sandwich the semiconductor module 21 from both sides, and adjacent heat exchanging parts 221 are connected to each other by connecting pipes 223 in the vicinity of both ends in the front-rear direction X. The semiconductor unit 2 is formed by alternately stacking the heat exchanging units 221 and the semiconductor modules 21. The semiconductor unit 2 is pressed and fixed to the wall portion 42 disposed forward by an urging member 5 made of a leaf spring.

  The refrigerant introduction pipe 221 and the refrigerant discharge pipe 222 protrude forward from the front surface of the heat exchange part 221 arranged at the front end of the semiconductor unit 2 and are pipe insertion holes formed in the wall part 42 of the case 4. 421 is provided so as to be inserted through each of them.

  In the cooler 22, the refrigerant introduced from the refrigerant introduction pipe 221 passes through the connection pipe 223 as appropriate, is distributed to each heat exchange unit 221, and flows in the longitudinal direction (front-rear direction X). The refrigerant exchanges heat with the semiconductor module 21 while flowing through each heat exchanging unit 221. The refrigerant whose temperature has increased due to heat exchange passes through the downstream connection pipe 223 and is led to the refrigerant discharge pipe 222 and discharged. Examples of the refrigerant include natural refrigerants such as water and ammonia, water mixed with ethylene glycol antifreeze, fluorocarbon refrigerants such as Fluorinert (registered trademark), Freon refrigerants such as HCFC123 and HFC134a, methanol, alcohol, and the like A refrigerant such as an alcohol refrigerant or a ketone refrigerant such as acetone can be used.

  In this example, the auxiliary electronic components include a reactor 61, a smoothing capacitor 62, a filter capacitor 63, and a current sensor 64. The smoothing capacitor 62, the filter capacitor 63, and the current sensor 64 are each provided with a connection terminal 65 erected upward and connected to the control circuit board 3.

  As shown in FIGS. 1 and 2, the case 4 includes a case main body 41 that opens upward and downward, a case lid 47 that is arranged to cover the upper end of the case main body 41, and a lower end of the case main body 41. And a case bottom 48 arranged so as to cover.

The case main body 41 includes a wall portion 42 formed so as to surround the semiconductor unit 2, the control circuit board 3, and the auxiliary electronic components, an outer peripheral fixing portion 45 that fixes the outer peripheral side of the control circuit board 3, and an inner side of the wall portion 42. Partition part 43 which divides the space into a first accommodation space 401 and a second accommodation space 402 arranged in the normal direction Z.
The wall portion 42 has a rectangular cylindrical shape including four wall surfaces arranged in a direction orthogonal to the normal direction Z of the control circuit board 3 with respect to the semiconductor unit 2, the control circuit board 3, and the auxiliary electronic component. .

  The partition portion 43 is formed in a space formed on the inner periphery of the wall portion 42 so as to be parallel to the control circuit board 3, and in the normal direction Z, the first accommodation space 401 disposed above And a second accommodating space 402 disposed below. In this example, the control circuit board 3 is accommodated in the first accommodation space 401, and the semiconductor unit 2 and auxiliary electronic components are arranged in the second accommodation space 402. In the second housing space 402, the semiconductor unit 2 is disposed at a substantially central position in the lateral direction Y on the front side, and the reactor 61 is disposed side by side on the rear side of the semiconductor unit 2. Further, in the lateral direction Y, the smoothing capacitor 62 and the current sensor 64 are arranged so as to sandwich the semiconductor unit 2 and the reactor 61, and the filter capacitor 63 is arranged at a position further rearward of the current sensor 64 and the reactor 61. Has been.

The partition portion 43 is formed above the semiconductor unit 2 and through the unit side communication hole 431 through which the control terminal 212 is inserted, and the connection terminal 65 formed above the smoothing capacitor 62, the filter capacitor 63 and the current sensor 64. A component-side communication hole 432 is formed through. Two component side communication holes 432 are formed above the filter capacitor 63.
Further, on the upper surface of the partition portion 43, a plurality of outer peripheral fixing portions 45 and inner fixing bosses 44 for fixing the control circuit board 3, and the first inner fixing boss 44 and the wall portion 42 are connected to each other. Ribs 461 to fourth ribs 464 are formed.

  The plurality of outer peripheral fixing portions 45 are arranged along the inner peripheral surface of the wall portion 42 and are formed to protrude upward. The outer periphery fixing portion 45 has a screw hole opened in the upper end surface, and is configured to be able to fix the control circuit board 3 by screwing a fixing screw into the screw hole.

  The inner fixed boss 44 is erected upward at a position adjacent to the rear of the unit side communication hole 431 in the partition portion 43 and at a substantially central position in the lateral direction Y. The inner fixing boss 44 has a screw hole opened in the upper end surface, and the control circuit board 3 can be fixed by screwing a fixing screw into the screw hole. In this example, the number of the inner fixed bosses 44 is one, but the present invention is not limited to this, and a plurality of inner fixed bosses 44 may be provided.

  The first rib 461 to the fourth rib 464 are formed along the straight line connecting the inner fixed boss 44 and the inner peripheral surface of the wall portion 42 on the upper surface of the partition portion 43. In this example, four ribs of the first rib 461 to the fourth rib 464 are formed, but the present invention is not limited to this, and the number of ribs can be changed as appropriate.

The first rib 461 is formed so as to connect with the inner peripheral surface of the wall portion 42 disposed on the rear side along the front-rear direction X from the inner fixed boss 44 and to pass over the reactor 61 and the filter capacitor 63. Yes. The first rib 461 is partially divided at a component side communication hole 432 formed to face the filter capacitor 63.
The second rib 462 connects the inner fixed boss 44 and the corner of the wall portion 42 disposed on the side where the smoothing capacitor 62 is disposed in the lateral direction Y and above the reactor 61 and the smoothing capacitor 62. It is formed to pass through.

The third rib 463 is disposed between the component side communication hole 432 disposed on the current sensor 64 and the component side communication hole 432 disposed on the filter capacitor 63, on the side where the current sensor 64 in the lateral direction Y is disposed. The wall portion 42 and the inner fixed boss 44 are connected to each other. The third rib 463 is formed so as to pass above the reactor 61 and the current sensor 64.
The fourth rib 464 is formed so as to connect the inner fixed boss 44 and the wall portion 42 disposed on the side where the smoothing capacitor 62 is disposed in the lateral direction Y. The fourth rib 464 is partially divided by the unit side communication hole 431.

Next, the function and effect of this example will be described.
In the power conversion device 1, the partition portion 43 includes a first rib 461 to a fourth rib 464 that are formed so as to connect the inner fixed boss 44 and the wall portion 42. Therefore, vibration of the control circuit board 3 can be suppressed and stably held.

  That is, by forming the first rib 461 to the fourth rib 464 in the partition portion 43, the cross-sectional secondary moment in the partition portion 43 can be effectively increased. Therefore, the rigidity in the partition part 43 can be improved and the vibration of the partition part 43 can be suppressed effectively.

  And since the 1st rib 461-the 4th rib 464 are formed so that the inner side fixed boss | hub 44 and the wall part 42 may be connected, the vibration in the site | part in which the inner side fixed boss | hub 44 was distribute | arranged is suppressed especially effectively. can do. Therefore, by fixing the control circuit board 3 to the inner fixing boss 44 in addition to the outer peripheral fixing part 45, the occurrence of vibration in the control circuit board 3 can be more effectively suppressed.

  In the power conversion device 1, when viewed from the normal direction Z, the first rib 461 to the fourth rib 464 are formed along a straight line extending from the inner fixed boss 44 toward the wall portion 42. Therefore, the rigidity improvement effect by a rib can be increased and the vibration of the site | part in which the inner side fixed boss | hub 44 was formed can be suppressed more effectively.

  The semiconductor unit 2 includes a cooler 22 for cooling the semiconductor module 21, and the cooler 22 and the partition portion 43 are in thermal contact. Therefore, the partition part 43 can be cooled by the cooler 22. Thereby, the inside of the power converter device 1 can be cooled by the partition part 43.

  In addition, auxiliary electronic components that constitute a power conversion circuit together with the semiconductor unit 2 are arranged in the second housing space 402, and when viewed from the normal direction Z, at least one of the first rib 461 to the fourth rib 464 is provided. The part is formed to overlap the auxiliary electronic component. Therefore, the cross-sectional area in the part which provided the rib of the partition part 43 can be increased. Therefore, it is possible to improve the heat conduction performance in the portion where the rib is provided and to effectively cool the auxiliary electronic component.

  As described above, according to the power conversion device 1 of this example, the vibration of the control circuit board 3 can be effectively suppressed and stably fixed.

  In addition, the position, the number, and the shape of the rib and the inner fixed boss shown in the first embodiment are examples, and can be appropriately changed as necessary.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Semiconductor module 21 Semiconductor unit 212 Control terminal 22 Cooler 3 Control circuit board 4 Case 402 2nd accommodation space 42 Wall part 43 Partition part 44 Inner side fixed boss 45 Outer periphery fixed part 461,462,463,464 Rib 61 , 62, 63, 64 Auxiliary electronic components

Claims (4)

A semiconductor unit (2) having a semiconductor module (21);
A control circuit board (3) connected to a control terminal (212) of the semiconductor module (21);
A case (4) for housing the semiconductor unit (2) and the control circuit board (3);
The case (4) includes a wall (42) formed so as to surround the semiconductor unit (2) and the control circuit board (3) from a direction perpendicular to the normal direction of the control circuit board (3). An outer periphery fixing portion (45) for fixing the outer peripheral side of the control circuit board (3), and a first accommodation space (401) and a second accommodation in which the space inside the wall portion (42) is aligned in the normal direction. A partition (43) that is divided into a space (402),
The control circuit board (3) is arranged in the first housing space (401),
Above the second accommodation space (402), and the semi-conductor unit (2) is arranged,
The partition part (43) is located on the inner side of the communication hole (431) through which the control terminal (212) is inserted and the outer periphery fixing part (45) when viewed from the normal direction of the partition part (43). An inner fixed boss (44) for fixing the control circuit board (3), and a rib ( 464) formed so as to protrude in the normal direction and connect the inner fixed boss (44) and the wall (42). Have
The rib ( 464) is formed so as to be partially divided by the communication hole (431 ). The rib ( 464) is formed along a straight line extending from the inner fixed boss (44) toward the wall (42) when viewed from the normal direction. Item 2. The power conversion device (1) according to item 1.   The semiconductor unit (2) includes a cooler (22) for cooling the semiconductor module (21), and the cooler (22) and the partition (43) are in thermal contact with each other. The power conversion device (1) according to claim 1 or 2, wherein the power conversion device (1) is provided. In the second housing space (402), an auxiliary electronic component (62) that constitutes a power conversion circuit together with the semiconductor unit (2 ) is arranged, and when viewed from the normal direction, the rib ( 464). 4) The power conversion device (1) according to claim 3, wherein at least a part of the auxiliary electronic component (62) overlaps the auxiliary electronic component (62 ).

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