JP2019017250A - Electric power conversion system - Google Patents

Abstract

To provide an electric power conversion system capable of achieving vibration resistance and high radiation resistance of a heating component in a case.SOLUTION: An electric power conversion system 1 includes: a semiconductor module constituting a power converter circuit; a coolant 2 formed with a coolant passage for cooling the semiconductor module; a metallic case 3 which is in thermal contact with the coolant passage and stores the semiconductor module and stores the semiconductor module; and a first heating component 13 electrically connected with the semiconductor module. The case 3 has a metallic partition wall 6 which spatially partitions the semiconductor module and the first heating component 13 and is in thermal contact with the coolant passage.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a power conversion device in which a heat generating component is accommodated in an internal space in a case.

  For example, an electric vehicle, a hybrid vehicle, and the like are equipped with a power conversion device such as an inverter. Patent Document 1 discloses a power conversion device in which an electronic component such as a semiconductor module is accommodated in a case. In addition to the semiconductor module, a heat generating component such as a capacitor is accommodated in the case. The power converter is mounted on vehicle parts such as a motor and a transmission for the purpose of reducing the size of the entire vehicle and reducing the cost.

JP 2014-82822 A

However, since the power converter described in Patent Document 1 is mounted on a motor or the like, there are the following problems.
That is, since the power conversion device receives vibration directly from a motor or the like, it is necessary to improve vibration resistance and protect the electronic components in the case from vibration.

  In addition, in the above power conversion device, the electronic component housed in the case also receives heat from a motor or the like in addition to its own heat generation, so that there is also a problem that it tends to be high temperature.

  Even when the power converter is not mounted on a motor or the like, for example, in a vehicle-mounted power converter, improvement of vibration resistance and heat dissipation is an important issue.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a power converter capable of improving vibration resistance and heat dissipation of a heat generating component in a case.

As a reference invention, a semiconductor module incorporating a switching element;
A cooler for cooling the semiconductor module;
A metal case having an internal space for housing the semiconductor module and the cooler;
The case is configured by combining a first case member and a second case member, and an outer fixing portion for connecting and fixing the first case member and the second case member outside the inner space; An inner fixing portion for connecting and fixing the first case member and the second case member in the inner space, and a partition wall formed continuously from the inner fixing portion and partitioning the inner space,
In the internal space, there is a power conversion device in which a heat generating component arranged along the wall surface of the partition wall is accommodated.

  In the above power conversion device, the case includes an inner fixing portion that connects and fixes the first case member and the second case member in the inner space in addition to the outer fixing portion. Therefore, since the first case member and the second case member can be fixed also in the internal space of the case, the rigidity of the case can be improved. As a result, the vibration resistance of the power converter can be improved.

  The case has a partition wall that is formed continuously from the inner fixing portion and partitions the internal space. Further, the internal space accommodates a heat generating component disposed along the wall surface of the partition wall. Therefore, the heat of the heat generating component can be radiated to the outside of the case through the partition wall and the inner fixing portion, and the heat dissipation performance of the heat generating component can be improved.

As described above, according to the above-described reference invention, it is possible to provide a power conversion device that can improve vibration resistance and heat dissipation of heat generating components in the case.
One embodiment of the present invention is a semiconductor module constituting a power conversion circuit;
A cooling body formed with a coolant channel for cooling the semiconductor module;
A metal case that is in thermal contact with the refrigerant flow path and houses the semiconductor module;
A first heat generating component electrically connected to the semiconductor module,
The case is in a power conversion device having a partition wall made of metal that spatially partitions the semiconductor module and the first heat-generating component and is in thermal contact with the refrigerant flow path.

The perspective view of the power converter device in Example 1. FIG. The top view of the power converter device in Example 1. FIG. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. The partial cross section perspective view of the power converter device in Example 1. FIG. The figure which looked at the 1st case member in Example 1, and the components accommodated therein from the top. The figure seen from the 2nd case member in Example 1, and the components accommodated there.

  The power converter is mounted on, for example, an electric vehicle or a hybrid vehicle, and performs power conversion between a DC power source and a three-phase AC rotating electric machine as a vehicle drive source.

Example 1
An embodiment of the power conversion device will be described with reference to FIGS.
As shown in FIGS. 2 and 3, the power conversion device 1 of this example includes a semiconductor module 11 having a built-in switching element, a cooler 2 that cools the semiconductor module 11, and an interior that houses the semiconductor module 11 and the cooler 2. A metal case 3 having a space 300.

  As shown in FIGS. 1 and 3, the case 3 is configured by combining a first case member 31 and a second case member 32. As shown in FIGS. 2 and 3, the case 3 includes an outer fixing portion 4 that connects and fixes the first case member 31 and the second case member 32 outside the inner space 300, and the first case member 31 in the inner space 300. And an inner fixing part 5 for connecting and fixing the second case member 32 to each other. As shown in FIGS. 4 and 5, the case 3 has a partition wall 6 that is formed continuously from the inner fixing portion 5 and partitions the internal space 300. The internal space 300 accommodates the heat generating component 12 disposed along the wall surface of the partition wall 6.

  As shown in FIGS. 4 and 5, the internal space 300 accommodates the electronic component 13 arranged along the wall surface of the partition wall 6 opposite to the heat generating component 12 side. In this example, the heat generating component 12 is a reactor, and the electronic component 13 is a discharge resistor. Hereinafter, they are referred to as a reactor 12 and a discharge resistor 13 as appropriate.

As shown in FIGS. 3 to 5, the first case member 31 includes a substantially rectangular first bottom wall portion 311 and one of the first bottom wall portion 311 in the normal direction from the edge of the first bottom wall portion 311. And a first rectangular side wall portion 312 having a substantially rectangular tube shape. The first case member 31 opens toward the opposite side to the first bottom wall 311.
For convenience, in the following, the normal direction of the first bottom wall portion 311 is referred to as the vertical direction Z, the opening side of the first case member 31 in the vertical direction Z is referred to as the upper side, and the opposite side is referred to as the lower side.

  As shown in FIGS. 3, 4, and 6, the second case member 32 includes a substantially rectangular second bottom wall portion 321, and a substantially upright direction Z from an edge of the second bottom wall portion 321. And a second side wall portion 322 having a rectangular cylindrical shape. The second side wall part 322 also protrudes above the second bottom wall part 321. And the upper end part and lower end part of the 2nd case member 32 are opened to the up-down direction Z.

  As shown in FIGS. 1 and 3, the first case member 31 and the second case member 32 overlap in the vertical direction Z such that the upper end of the first side wall portion 312 and the lower end of the second side wall portion 322 are in contact with each other. Yes. An area surrounded by the first bottom wall portion 311, the first side wall portion 312, the second bottom wall portion 321, and the second side wall portion 322 is an internal space 300 of the case 3.

  As shown in FIGS. 3 to 5, the inner fixing portion 5 includes a first boss portion 51 provided on the first case member 31, a second boss portion 52 provided on the second case member 32, and a first boss. It consists of a bolt 53 that fastens the part 51 and the second boss part 52. The first boss 51 is erected upward from the first bottom wall 311. As shown in FIGS. 3 and 5, the first boss portion 51 is formed with a female screw hole for screwing the bolt 53 downward from the upper end surface.

  As shown in FIGS. 3, 4, and 6, the second boss portion 52 is erected downward from the second bottom wall portion 321. The second boss portion 52 is formed in a cylindrical shape, and has a bottom portion 521 having an upper end that opens to the upper surface side of the second bottom wall portion 321 and a bolt insertion hole at the lower end.

  As shown in FIGS. 1 and 2, the first boss portion 51 and the second boss portion 52 are formed at positions overlapping the vertical direction Z and are in contact with each other in the vertical direction Z. Then, by inserting the bolt 53 into the bolt insertion hole of the bottom 521 of the second boss 52 and screwing into the female screw hole of the first boss 51, the first boss 51 and the second boss 52 are connected. It is fastened and the inner side fixing | fixed part 5 is comprised.

  As shown in FIGS. 1 to 6, the outer fixing portion 4 includes a first flange portion 41 provided on the first case member 31, a second flange portion 42 provided on the second case member 32, and a first flange. It consists of a bolt 43 and a nut 44 that fasten the portion 41 and the second flange portion 42. The first flange portion 41 is formed from the upper end portion of the first side wall portion 312 toward the outside of the case 3, and the second flange portion 42 is directed from the lower end portion of the second side wall portion 322 to the outside of the case 3. Is formed. Bolt insertion holes are formed in the first flange portion 41 and the second flange portion 42.

  As shown in FIGS. 1 to 3, the first flange portion 41 and the second flange portion 42 are formed at positions overlapping the vertical direction Z and are in contact with each other in the vertical direction Z. Then, the bolts 43 are inserted into the bolt insertion holes of the first flange portion 41 and the bolt insertion holes of the second flange portion 42 and screwed into the nuts 104, whereby the first flange portion 41 and the second flange portion 42 are Are fastened to form the outer fixing portion 4. The outer fixing portion 4 is formed at a plurality of locations in the case 3.

  As shown in FIGS. 3, 4, and 6, the semiconductor module 11 and the cooler 2 are disposed in a region inside the second case member 32 in the internal space 300. The cooler 2 includes a plurality of cooling pipes 21. The plurality of cooling pipes 21 are stacked together with the plurality of semiconductor modules 11 to form the stacked structure 10. At one end of the stacked structure 10 in the stacking direction X, a pressure member 7 that pressurizes the stacked structure 10 in the stacking direction X is disposed. The pressure member 7 is supported by the support portion 8 from the side opposite to the stacked structure 10 in the stacking direction X. At least a part of the support portion 8 is constituted by the inner fixing portion 5.

The laminated structure 10 is arranged such that the lamination direction X coincides with the longitudinal direction of the second bottom wall portion 321. The laminated structure 10 is disposed on one side of the second boss portion 52 in the lamination direction X.
In the following, the side where the laminated structure 10 is arranged with respect to the second boss portion 52 in the stacking direction X will be referred to as the front, and the opposite side will be referred to as the rear.

  The semiconductor module 11 in the laminated structure 10 includes a switching element such as an IGBT (insulated gate bipolar transistor) and a diode such as an FWD (free wheel diode). Further, as shown in FIG. 3, the semiconductor module 11 has a control terminal 111 protruding upward. The semiconductor module 11 is sandwiched by a pair of cooling pipes 21 from both main surfaces. In the drawings other than FIG. 3, the control terminals are not shown.

  As shown in FIG. 4 and FIG. 6, the plurality of cooling pipes 21 are long in the direction orthogonal to the stacking direction X and the vertical direction Z, and are connected pipes in which adjacent cooling pipes 21 can be deformed at both ends in the longitudinal direction. 22 are connected. As shown in FIGS. 3, 4, and 6, the front end surface of the cooling pipe 21 disposed at the front end of the cooler 2 is in contact with the abutting portion 323 erected downward from the second bottom wall portion 321. It is in contact. In the cooling pipe 21 arranged at the front end of the cooler 2, a refrigerant introduction pipe 23 for introducing a cooling medium and a refrigerant discharge pipe 24 for discharging the cooling medium are formed to protrude forward. . A through hole 301 for passing a hose or the like attached to the refrigerant introduction pipe 23 and the refrigerant discharge pipe 24 is formed in front of the refrigerant introduction pipe 23 and the refrigerant discharge pipe 24 in the case 3.

  The cooling medium introduced from the refrigerant introduction pipe 23 passes through the connection pipe 22 as appropriate, is distributed to the respective cooling pipes 21 and circulates in the longitudinal direction thereof. The cooling medium exchanges heat with the semiconductor module 11 while flowing through each cooling pipe 21. The cooling medium whose temperature has increased due to heat exchange passes through the downstream connecting pipe 22 as appropriate, is led to the refrigerant discharge pipe 24, and is discharged from the cooler 2.

  As shown in FIGS. 3, 4, and 6, in the stacking direction X, the pressure member 7 is disposed behind the cooler 2 and in front of the second boss portion 52. As shown in FIG. 6, in this example, the pressing member 7 is a leaf spring that can be elastically deformed. The pressurizing member 7 is made of a heat transfer member and is arranged in a compressed state in the stacking direction X. As shown in FIGS. 3 and 6, the front end portion of the pressure member 7 is in contact with the rear end surface of the cooler 2. A highly rigid contact plate may be interposed between the pressure member 7 and the cooler 2.

  As shown in FIGS. 3, 4, and 6, the pressure member 7 is in contact with the support portion 8 via the support pins 70 at both ends in the longitudinal direction. The support pin 70 is made of a heat transfer member. In the present example, the second boss portion 52 of the second case member 32 serves as a support portion 8 that supports one end portion of the pressure member 7 in the longitudinal direction. Thereby, the inner side fixing | fixed part 5 is contacting with respect to the cooler 2 via the heat-transfer member. That is, the second boss portion 52 is in contact with the cooler 2 via the support pin 70 and the pressure member 7 that are heat transfer members.

  As shown in FIG. 3, the control terminal 111 of the semiconductor module 11 passes through the opening 302 formed in the second bottom wall portion 321 and is arranged on the upper side of the second bottom wall portion 321. It is connected to the. The control circuit board 14 controls the switching operation of the semiconductor module 11. The upper end of the case 3 is covered with a lid 100. The lid 100 is fixed to the upper end of the case 3 with a bolt (not shown). In the drawings other than FIG. 3, illustration of the control circuit board and the lid is omitted.

  As shown in FIGS. 4 and 5, the first case member 31 has a partition wall 6 extending from the first boss portion 51. The partition wall 6 extends from substantially the entire first boss portion 51 in the vertical direction Z. The partition wall 6 is erected upward from the first bottom wall portion 311.

  As shown in FIG. 5, when viewed from above, the partition wall 6 extends substantially linearly from the first boss portion 51 toward the rear, and is connected to a part of the first side wall portion 312. Further, a branch wall 62 extending in a direction perpendicular to the wall surface is branched from a part of the partition wall 6. The branch wall 62 is also connected to the first side wall portion 312.

  As shown in FIGS. 3 to 5, the reactor 12 and the discharge resistor 13 are disposed in the inner space 300 in the region inside the first case member 31. The reactor 12 is disposed along the partition wall 6 and the branch wall 62. Further, the side surface of the reactor 12 is disposed to face the wall surface of the partition wall 6 and the wall surface of the branch wall 62. The discharge resistor 13 is disposed along the partition wall 6 so that the side surface faces the wall surface of the partition wall 6 opposite to the reactor 12 side. That is, the partition wall 6 is interposed between the reactor 12 and the discharge resistor 13.

  The case 3 (including the inner fixing portion 5 and the partition wall 6) is made of a heat transfer member having thermal conductivity. The reactor 12 is thermally connected to the cooler 2 via the partition wall 6 and the branch wall 62, the first boss portion 51, the second boss portion 52, the support pin 70, and the pressure member 7. Further, the discharge resistor 13 is thermally connected to the cooler 2 via the partition wall 6, the first boss portion 51, the second boss portion 52, the support pin 70, and the pressure member 7.

Next, the function and effect of this example will be described.
In the power conversion device 1, the case 3 includes an inner fixing portion 5 that connects and fixes the first case member 31 and the second case member 32 in the inner space 300 in addition to the outer fixing portion 4. Therefore, since the first case member 31 and the second case member 32 can be fixed also in the internal space 300 of the case 3, the rigidity of the case 3 can be improved. As a result, the vibration resistance of the power converter 1 can be improved.

  The case 3 includes a partition wall 6 that is formed continuously from the inner fixing portion 5 and partitions the internal space 300. Furthermore, the reactor 12 arranged along the wall surface of the partition wall 6 is accommodated in the internal space 300. Therefore, the heat of the reactor 12 can be radiated to the outside of the case 3 through the partition wall 6 and the inner fixing portion 5, and the heat radiation performance of the reactor 12 can be improved.

  Further, the internal space 300 accommodates the discharge resistor 13 disposed along the wall surface of the partition wall 6 on the side opposite to the reactor 12 side. Therefore, it is possible to suppress the heat of the reactor 12 from being transmitted to the discharge resistor 13 having low heat resistance. As a result, it is possible to prevent the discharge resistor 13 from being defective due to the heat of the reactor 12 being transmitted to the discharge resistor 13. Further, since the discharge resistor 13 is also generating heat by itself, when heat received from the reactor 12 is added, a problem of heat resistance is likely to occur. It is not necessary to use a highly resistant discharge resistor. As a result, the discharge resistor 13 can be reduced in size and cost.

  Moreover, the inner side fixing | fixed part 5 is contacting with the cooler 2 via the heat-transfer member (The support pin 70, the pressurization member 7). Therefore, the heat of the reactor 12 can be radiated to the cooler 2 through the partition wall 6, the inner fixing portion 5, and the heat transfer member (support pin 70, pressure member 7).

  Further, at least a part of the support portion 8 is constituted by the inner fixing portion 5. Therefore, the inner fixing portion 5 plays a role of connecting the first case member 31 and the second case member 32 and a role of supporting the laminated structure 10. Therefore, the number of parts can be reduced and the size can be reduced.

  As described above, according to this example, it is possible to provide a power conversion device that can improve vibration resistance and heat dissipation of heat generating components in the case.

  Note that the shape and structure of the inner fixing portion are not limited to those shown in the above-described embodiments as long as the first case member and the second case member are connected and fixed in the internal space. Can be adopted.

  Moreover, although the inner side fixing | fixed part showed the example via the heat-transfer member with respect to the cooler in the said Example, the inner side fixing | fixed part may be contacting the cooler directly.

  Moreover, in the said Example, although the heat-emitting component was a reactor and the electronic component was discharge resistance, it is not restricted to this. Further, each of the heat generating component and the electronic component may be a single component or a plurality of components.

1 Power Converter 11 Semiconductor Module 12 Heating Component (Reactor)
2 Cooler 3 Case 300 Internal Space 31 First Case Member 32 Second Case Member 4 Outer Fixing Portion 5 Inner Fixing Portion 6 Partition

Claims (4)

A semiconductor module (11) constituting a power conversion circuit;
A cooling body (2) formed with a refrigerant flow path for cooling the semiconductor module;
A metal case (3) that is in thermal contact with the refrigerant flow path and houses the semiconductor module;
A first heat generating component (13) electrically connected to the semiconductor module,
The said case has a metal partition (6) which spatially partitions the said semiconductor module and said 1st heat-emitting component, and has a thermal contact with the said refrigerant | coolant flow path (1).   A control circuit board (14) for controlling the switching operation of the semiconductor module is further provided, and is connected to the case between the cooling body, the semiconductor module, the first heat generating component, and the control circuit board. The power converter (1) according to claim 1, wherein a metal wall portion (321) is disposed.   The power conversion device (1) according to claim 2, wherein the wall portion is disposed at a position closer to the semiconductor module and the cooling body than the first heat-generating component.   The semiconductor device further includes a second heat generating component (12) electrically connected to the first heat generating component and different from the semiconductor module, and the partition spatially connects the first heat generating component and the second heat generating component. The wall part is fixed to a metal fixing part (51) formed continuously with the partition, and the first heat generating component is disposed along the partition, The power converter (1) according to claim 2 or 3, wherein the fixing portion is in thermal contact with the refrigerant flow path.

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