JP2018057190A - Electric power conversion system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric power conversion system that can reduce pressure loss of refrigerant and can be downsized.SOLUTION: The electric power conversion system comprises a plurality of electronic components 2 constituting an electric power conversion circuit, and a cooling plate 3 and a cooler 4 which cool the components. The cooling plate 3 comprises a main flow path 31and a sub flow path 31through which refrigerant 11 flows, and a bulkhead 32 interposed between the flow paths. The main flow path 31is connected with a main pipe 5and the sub flow path 31is connected with a sub pipe 5. In the cooling plate 3, at the opposite side of a side where are provided the pipes 5and 5are formed a main connection port 6through which the cooler 4 is connected to the main flow path 31and a sub connection port 6through which the cooler 4 is connected to the sub flow path 31. The main pipe 5is arranged between the sub pipe 5and the main connection port 6when viewed from a thickness direction of the cooling plate 3.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a power conversion device including a plurality of electronic components, a cooler that cools the electronic components, and a cooling plate.

  There is known a power conversion device including a plurality of electronic components constituting a power conversion circuit and a cooler for cooling the electronic components (see Patent Document 1 below). Examples of the electronic component include a semiconductor module having a built-in switching element and a capacitor. This power converter is configured to convert DC power supplied from a DC power source into AC power by turning on and off the switching element. When the power converter is operated, the electronic component generates heat. Therefore, the electronic component is cooled using the cooler.

  In recent years, it has been studied to provide a cooling plate separately from the cooler and to cool a plurality of electronic components using the cooler and the cooling plate. For example, two flow paths, a main flow path and a sub flow path, through which the coolant flows are formed in the cooling plate (see FIGS. 20 and 21). Then, two pipes, a main pipe connected to the main flow path and a sub pipe connected to the sub flow path, are provided on the opposite side of the cooling plate from the side where the cooler is provided. In addition, a main connection port that connects the main flow path and the cooler and a sub connection port that connects the sub flow path and the cooler are formed on the side of the cooling plate on which the cooler is arranged. In this case, for example, when the refrigerant is introduced from the sub pipe, the refrigerant passes through the sub flow path, the sub connection port, and the cooler, and further flows through the main connection port and the main flow path, and is led out from the main pipe. Therefore, all of the introduced refrigerant can be passed through the main flow path in the cooler, and the electronic component can be efficiently cooled by the cooling plate. The same applies when the direction of the refrigerant is reversed.

JP 2008-198750 A

  However, in the above power converter, the positional relationship between the two pipes and the main connection port has not been sufficiently considered. Therefore, there is a possibility that the pressure loss of the refrigerant in the main channel cannot be reduced. That is, if the sub pipe and the main pipe are arranged in a direction (orthogonal direction) perpendicular to the arrangement direction of the sub pipe and the main connection port, the distance from the main connection port to the main pipe becomes long ( FIG. 20). Therefore, the distance that the refrigerant flows through the main flow path becomes long, and the pressure loss of the refrigerant tends to increase. Therefore, it is difficult to cool the electronic component.

  Further, since the main pipe and the sub pipe are respectively connected to different flow paths in the cooler, it is necessary to arrange these two pipes apart from each other to some extent. Therefore, as described above, when the sub pipe and the main pipe are arranged in a direction (orthogonal direction) perpendicular to the arrangement direction of the sub pipe and the main connection port, the length of the cooling plate in the orthogonal direction is set. Tends to be long. Therefore, the area of the cooling plate tends to be large, and it is difficult to reduce the size of the power converter.

  This invention is made | formed in view of this subject, and it aims at providing the power converter device which can reduce the pressure loss of a refrigerant | coolant and can be reduced in size.

One aspect of the present invention is a plurality of electronic components (2) constituting a power conversion circuit;
A cooling plate (3) that is formed in a plate shape and cools the electronic component;
A cooler (4) that is provided on one side in the thickness direction of the cooling plate and cools the electronic component;
The cooling plate is partitioned from the main flow path by the main flow path (31 _m ) through which the refrigerant (11) flows, and the partition (32) interposed between the main flow path and the main flow path, and the refrigerant flows. A secondary flow path (31 _s ),
On the other side of the cooling plate in the thickness direction, a main pipe (5 _m ) connected to the main flow path and a sub pipe (5 _s ) connected to the sub flow path are arranged,
The cooler has an in-device flow path (40) through which the refrigerant flows, and the cooling plate has a main connection connecting the main flow path and the in-device flow path on the one side in the thickness direction. A port (6 _m ) and a sub-connection port (6 _s ) connecting the sub-channel and the in-device channel,
The power conversion device (1), wherein the main pipe is disposed between the sub pipe and the main connection port when viewed from the thickness direction.

In the power converter, the main pipe is disposed between the sub pipe and the main connection port when viewed from the thickness direction.
Therefore, the distance from the main connection port to the main pipe can be shortened. Therefore, the distance that the refrigerant flows through the main flow path can be shortened, and the pressure loss of the refrigerant can be reduced. Therefore, the cooling efficiency of electronic components can be increased.

  In the above power converter, since the main pipe is provided between the sub pipe and the main connection port, a plurality of pipes are not arranged in a direction (orthogonal direction) orthogonal to the arrangement direction. . Therefore, the length of the cooling plate in the orthogonal direction can be shortened. Therefore, the area of the cooling plate can be reduced, and the power converter can be reduced in size.

As mentioned above, according to the said aspect, the pressure loss of a refrigerant | coolant can be reduced and the power converter device which can be reduced in size can be provided.
In addition, the code | symbol in the parenthesis described in the means to solve a claim and a subject shows the correspondence with the specific means as described in embodiment mentioned later, and limits the technical scope of this invention. It is not a thing.

The side view of the power converter device in the state which removed the DC-DC converter in Embodiment 1. FIG. II-II sectional drawing of FIG. III-III sectional drawing of FIG. IV-IV sectional drawing of FIG. VV sectional drawing of FIG. FIG. 3 is a perspective view of a cooling plate and a cooling pipe in the first embodiment. VII-VII sectional drawing of FIG. The circuit diagram of the power converter device in Embodiment 1. FIG. Sectional drawing of the power converter device in Embodiment 2. FIG. It is sectional drawing of the power converter device in Embodiment 3, Comprising: It is XX sectional drawing of FIG. XI-XI sectional drawing of FIG. The perspective view of the semiconductor module in Embodiment 3. FIG. The perspective view of the power converter device in Embodiment 4. FIG. The perspective view of the power converter device in the state which removed the electronic component in Embodiment 4. FIG. The XV arrow directional view of FIG. Sectional drawing of the power converter device in Embodiment 4. FIG. The perspective view of the semiconductor module in Embodiment 4. FIG. Sectional drawing of the power converter device in Embodiment 5. FIG. The side view of the power converter device in Embodiment 6. FIG. The side view of the power converter device in the state which removed the electronic component in a comparison form. XXI-XXI sectional drawing of FIG.

  The power conversion device can be a vehicle-mounted power conversion device to be mounted on an electric vehicle, a hybrid vehicle, or the like.

(Embodiment 1)
An embodiment according to the power conversion device will be described with reference to FIGS. As shown in FIGS. 2 and 3, the power conversion device 1 of the present embodiment includes a plurality of electronic components 2 (2 _S , 2 _L , 2 _D ), a cooling plate 3, and a cooler 4. The plurality of electronic components 2 constitute a power conversion circuit. The plurality of electronic components 2 are cooled by the cooling plate 3 and the cooler 4. The cooling plate 3 is formed in a plate shape. The cooler 4 is arranged on one side of the cooling plate 3 in the thickness direction (X direction) of the cooling plate 3.

The cooling plate 3 includes a main channel 31 _m and a sub-channel 31 _s through which the refrigerant 11 flows, and a partition wall 32 interposed therebetween. The electronic component 2 (2 _L , 2 _D ) is cooled by the refrigerant 11 flowing through the main flow path 31 _m . The sub-channel 31 _s is partitioned from the main channel 31 _m by the partition wall 32.

On the other side of the cooling plate 3 in the X direction, a main pipe 5 _m and a sub pipe 5 _s are arranged. The main pipe 5 _m is connected to the main flow path 31 _m . Further, the sub pipe 5 _s is connected to the sub flow path 31 _s .

The cooler 4 includes an in-device flow path 40 through which the refrigerant 11 flows. On the one side of the cooling plate 3 in the X direction, a main connection port 6 _m and a sub connection port 6 _s are formed. The main connection port 6 _m connects the main flow path 31 _m and the in-device flow path 40. The sub connection port 6 _s connects the sub flow path 31 _s and the in-device flow path 40.
As shown in FIG. 1, when viewed from the X direction, the main pipe 5 _m is arranged between the sub pipe 5 _s and the main connection port 6 _m .

The power conversion device 1 of this embodiment is a vehicle-mounted power conversion device to be mounted on a vehicle such as an electric vehicle or a hybrid vehicle. As shown in FIG. 8, the power conversion device 1 of this embodiment includes, as the electronic component 2, a semiconductor module 2 _S that includes a switching element 20, a boosting reactor 2 _L, and a DC-DC converter 2 _D. Further, the power conversion device 1 includes a filter capacitor 28 and a smoothing capacitor 29.

In the power converter 1, a booster unit 200 and an inverter unit 201 are formed. The step-up unit 200 includes a reactor 2 _L , a step-up semiconductor module 2 _SB, and a filter capacitor 28. The DC voltage of the DC power supply 81 is boosted by turning on / off the switching element 20 in the boosting semiconductor module _2SB . The inverter unit 201 includes a plurality of inverter semiconductor modules 2 _SI and a smoothing capacitor 29. By switching the switching element 20 in the inverter semiconductor module 2 _SI on and off, the DC power after boosting is converted into AC power. As a result, the AC load 82 (three-phase AC motor) is driven to drive the vehicle.

A DC-DC converter 2 _D is connected in parallel with the filter capacitor 28. The DC-DC converter 2 _D is provided to step down the voltage of the direct current power supply 81 and charge the low voltage battery 83.

As shown in FIG. 7, the semiconductor module 2 _S includes a main body 21 incorporating the switching element 20, a plurality of power terminals 22 protruding from the main body 21, and a control terminal 23. The power terminal 22 includes a positive terminal 22 _p and a negative terminal 22 _{n to} which a DC voltage is applied, and an AC terminal 22 _a connected to an AC load 82 (see FIG. 8). The control terminal 23 is connected to the control circuit board 13. The on / off operation of the switching element 20 is controlled by the control circuit board 13.

As shown in FIGS. 3 and 5, in this embodiment, a stacked body 10 is formed by stacking a plurality of semiconductor modules 2 _S and a plurality of cooling pipes 41. Two cooling pipes 41 adjacent in the X direction are connected by a connecting pipe 42. Further, the end cooling pipe 41 _a disposed at one end in the X direction and the cooling plate 3 are connected by an end connecting pipe 42 _a . The cooler 4 is constituted by the cooling pipes 41 and 41 _a and the connecting pipes 42 and 42 _a .

A reactor 2 _L (electronic component 2) is interposed between the end cooling pipe 41 _a and the cooling plate 3. The laminated body 10 and the reactor 2 _L are accommodated in the case 14.

The case 14 is formed with a through hole 149 penetrating in the X direction. The through hole 149 is closed from the outside of the case by the cooling plate 3. Further, a DC-DC converter _2D is provided outside the case. The DC-DC converter 2 _D and the reactor 2 _L are in contact with the cooling plate 3.

As shown in FIGS. 2 and 3, the sub flow path 31 _s is formed in the cooling plate 3 so as to penetrate in the X direction. As shown in FIG. 1, the main flow path 31 _m has a substantially rectangular shape when viewed from the X direction. The main flow path 31 _m has a length L _Y in the direction (Y direction) in which the main connection port 6 _m and the main pipe 5 _m are arranged in the orthogonal direction (Z direction) orthogonal to both the X direction and the Y direction. It is longer than the L _Z.

Radiating fins 7 are disposed in the main flow path 31 _m . The refrigerant 11 flows in the Y direction through the radiating fins 7. As shown in FIG. 4, the radiating fins 7 are made of corrugated plates. The radiation fins 7 are in contact with the wall portions 39 of the cooling plate 3. Part of the heat generated from the electronic components 2 _L and 2 _D is transmitted to the wall 39 and the heat radiating fins 7 and further transmitted to the refrigerant 11. In this embodiment, by providing the radiation fin 7, to increase the contact area of the refrigerant 11 in the main flow passage 31 in _m, to enhance the cooling efficiency of the electronic component 2 _L, 2 _D.

As shown in FIG. 3, when the refrigerant 11 is introduced into the sub pipe 5 _s , the refrigerant 11 is distributed to the plurality of cooling pipes 41 through the sub flow path 31 _s , the sub connection port 6 _s , and the connecting pipes 42 _a and 42. The Thereafter, the refrigerant 11 merges, flows through the main connection port 6 _m of the cooling plate 3 and the main flow path 31 _m, and is led out from the main pipe 5 _m . Thereby, the plurality of electronic components 2 (2 _S , 2 _L , 2 _D ) are cooled.

Further, as shown in FIG. 2, a pressure member 12 (plate spring) is disposed in the case 14. The laminated body 10 is pressurized toward the cooling plate 3 by using the pressure member 12. Thereby, the contact pressure between the cooling pipe 41 and the electronic component 2 (2 _S , 2 _L ) is secured, and the laminated body 10 and the reactor 2 _L are fixed in the case 14.

Further, as shown in FIGS. 2 and 3, the main pipe 5 _m and the sub pipe 5 _s are arranged adjacent to each other to form a pipe pair 50. A pipe horizontal electronic component 2 _p (DC-DC converter 2 _D ) that is an electronic component 2 cooled by the cooling plate 3 is arranged at a position adjacent to the pipe pair 50 in the Y direction.

The main pipe 5 _m and the sub pipe 5 _s are connected to an external cooling device (not shown) that cools the refrigerant 11. The main flow path 31 _m is configured so that the refrigerant 11 flows from the cooler 4 to the external cooling device.

As shown in FIGS. 2 and 3, the power conversion device 1 of this embodiment is configured such that a part of the pipe lateral electronic component 2 _p and the main connection port 6 _m overlap each other when viewed from the X direction. Yes.

Next, the effect of this form is demonstrated. As shown in FIG. 1, in this embodiment, when viewed from the X direction, the main pipe 5 _m is arranged between the sub pipe 5 _s and the main connection port 6 _m .
Therefore, the distance from the main connection port 6 _m to the main pipe 5 _m can be shortened. Therefore, the distance that the refrigerant 11 flows through the main flow path 31 _m can be shortened, and the pressure loss of the refrigerant 11 can be reduced. Therefore, the cooling efficiency of the electronic component 2 (2 _L , 2 _D ) can be increased.

Further, as described above, in this embodiment, since the main pipe 5 _m is provided between the sub pipe 5 _s and the main connection port 6 _m , the direction (Z direction) orthogonal to the arrangement direction (Y direction) thereof. In the direction), a plurality of pipes 5 _m and 5 _s are not arranged. Therefore, the length of the cooling plate 3 in the Z direction can be shortened. Therefore, the area of the cooling plate 3 can be reduced, and the power converter 1 can be reduced in size.

That is, as shown in FIGS. 20 and 21, the sub pipe 5 _s and the main connection port 6 _m are arranged in the Y direction, and the main pipe 5 _m is arranged at a position adjacent to the sub pipe 5 _s in the Z direction. Then, the distance from the main connection port 6 _m to the main pipe 5 _m tends to be long. Therefore, the distance that the refrigerant 11 flows through the main flow path 31 _m becomes long, and the pressure loss of the refrigerant 11 tends to increase. Moreover, since the length of the cooling plate 3 in the Z direction becomes long, the area of the cooling plate 3 tends to increase. In contrast, as shown in FIG. 1, as in the present embodiment, the main pipe 5 be provided _m, main connection port 6 from _m primary pipe 5 _m between the sub-pipe 5 _s and the main connection port 6 _m Can be shortened. Therefore, the distance that the refrigerant 11 flows through the main flow path 31 _m can be shortened, and the pressure loss of the refrigerant 11 can be reduced. Therefore, the refrigerant 11 can flow smoothly and the cooling efficiency of the electronic components 2 _L and 2 _D can be increased. In this embodiment, since the two pipes 5 _m and 5 _s are not arranged in the Z direction, the length of the cooling plate 3 in the Z direction can be shortened. Therefore, the area of the cooling plate 3 can be reduced, and the power converter 1 can be reduced in size.

Further, in this embodiment, as shown in FIG. 1, the radiating fins 7 are arranged between the main pipe 5 _m and the main connection port 6 _m in the main flow path 31 _m . Therefore, the heat generated from the electronic component 2 (2 _L , 2 _D ) can be transmitted to the refrigerant 11 via the radiation fins 7 and the cooling efficiency of the electronic component 2 can be increased. Further, in this embodiment, the positions of the main connection port 6 _m and the main pipe 5 _m in the direction (Z direction) orthogonal to the direction (Y direction) in which the refrigerant 11 flows in the radiating fins 7 are equal to each other. Therefore, it becomes easy to equalize the amount of the refrigerant 11 flowing in the heat radiation fin 7, it becomes easy to uniformly cool the electronic components 2 _L, 2 _D.

That is, as shown in FIG. 20, when the Z direction positions of the main pipe 5 _m and the main connection port 6 _m are different from each other, the main connection port 6 _m is arranged on one side of the radiating fin 7 in the Z direction, and on the other side. The main pipe 5 _m will be arranged. That is, it becomes difficult to dispose the main connection port 6 _m and the main pipe 5 _m near the center of the radiating fin 7 in the Z direction. Therefore, the distance from the main connection port 6 _m to the radiation fin 7 becomes uneven. Therefore, the amount of the refrigerant 11 flowing through the heat radiating fins 7 tends to be uneven, and it becomes difficult to cool the electronic components 2 _L and 2 _D evenly. For example, a portion 71 close to the main connection port 6 _m in the Z direction in the heat radiating fin 7 has a small pressure loss between the main connection port 6 _m and a large amount of the refrigerant 11 flows through the portion 71. The portion 72 away from the main connection port 6 _m in the Z direction, since the pressure loss between the main connection port 6 _m is large, the amount of the refrigerant 11 that flows to this portion 72 is small. For this reason, the amount of the refrigerant 11 flowing in the radiating fin 7 is biased, and it becomes difficult to cool the electronic component 2 evenly. On the other hand, as shown in FIG. 1, if the positions of the main pipe 5 _m and the main connection port 6 _{m in} the Z direction are equal as in this embodiment, the main pipe 5 _m and the main connection port 6 _m can be arranged. Therefore, it becomes easy to make the distance from the main connection port 6 _m to the radiation fin 7 uniform, and it becomes easy to equalize the amount of the refrigerant 11 flowing in the radiation fin 7. Therefore, the electronic components 2 _L and 2 _D can be evenly cooled.

As shown in FIGS. 2 and 5, in this embodiment, when viewed from the X direction, at least a part of the electronic component 2 (2 _L , 2 _D ) and the main flow path 31 _m overlap each other.
Therefore, the electronic component 2 (2 _L , 2 _D ) can be actively cooled. That is, the electronic component 2 is reactor 2 _L and DCDC converter 2 _D, generates heat. When viewed from the X direction, by configuring such that the electronic component 2 _L, 2 _D a main channel 31m to heat generation overlap, with the main flow passage 31 _m, the these electronic components 2 _L, 2 _D It can be cooled efficiently.

The main pipe 5 _m and the sub pipe 5 _s are connected to an external cooling device that cools the refrigerant 11. The refrigerant 11 flows from the cooler 4 to the external cooling device through the main flow path 31 _m . In other words, the refrigerant 11 that is directed from the external cooling device to the cooler 4 flows through the sub flow path 31 _s .
Therefore, the low-temperature refrigerant 11 cooled by the external cooling device can be passed through the cooler 4. Therefore, the cooling efficiency of the electronic component 2 (semiconductor module 2 _s ) cooled by the cooler 4 can be increased.

In this embodiment, as shown in FIGS. 3 and 5, the pipe horizontal electronic component 2 _p that is the electronic component 2 cooled by the cooling plate 3 is provided on the side of the cooling plate 3 where the pipes 5 _m and 5 _s are provided. It is arranged.
Therefore, the surface S1 of the cooling plate 3 on the side where the pipes 5 _m and 5 _s are provided can be effectively used as a surface for cooling the electronic component 2 (2 _p ).

Further, the main pipe 5 _m and the sub pipe 5 _s are adjacent to each other to form a pipe pair 50. Then, the pipe lateral electronic component 2 _p, is arranged in a position adjacent to the pipe-to-50 in the Y direction.
In this way, since the two pipes 5 _m and 5 _s can be arranged together, the surface S1 of the cooling plate 3 for cooling the pipe lateral electronic component 2 _p can be widened. Therefore, the cooling efficiency of the pipe horizontal electronic component 2 _p can be increased.

As shown in FIG. 3, the power conversion device 1 of the present embodiment is configured such that a part of the pipe lateral electronic component 2 _p and the main connection port 6 _m overlap when viewed from the X direction.
Therefore, the portion 38 formed on the opposite side of the main connection port 6 _m in the X direction in the cooling plate 3 can be effectively used as a portion for cooling the pipe lateral electronic component 2 _p . Thus, the pipe lateral electronic component 2 _p can be wider area for cooling, thereby enhancing the cooling efficiency of the pipe transverse electronic component 2 _p.

  As described above, according to this embodiment, it is possible to provide a power converter that can reduce the pressure loss of the refrigerant and can be downsized.

In this embodiment, the reactor 2 _L and the DC-DC converter 2 _D are cooled by the cooling plate 3, but the present invention is not limited to this, and the semiconductor module 2 _S , the capacitor, and the like are cooled by the cooling plate 3. May be.

  In the following embodiments, the same reference numerals used in the drawings among the reference numerals used in the drawings represent the same constituent elements as those in the first embodiment unless otherwise indicated.

(Embodiment 2)
This embodiment is an example in which the shape of the cooling plate 3 is changed. As shown in FIG. 9, in this embodiment, the auxiliary flow path 31 _s is formed in the cooling plate 3 so as to extend in the Y direction. A partition wall 32 is interposed between the main flow path 31 _m and the sub flow path 31 _s . In this embodiment, to cool the DC-DC converter 2 _D by the main flow passage 31 _m, to cool the reactor 2 _L by the auxiliary flow channel 31 _s.

With the above configuration, it is possible to cool the electronic component 2 (Reactor 2 _L) by sub-passage 31 _s, it is possible to further improve the cooling efficiency of the electronic component 2 by the cooling plate 3.
In addition, the same configuration and operational effects as those of the first embodiment are provided.

(Embodiment 3)
This embodiment is an example in which the structure of the cooler 4 is changed. As shown in FIGS. 10 and 11, the cooler 4 of this embodiment includes a box-shaped cooling main body 47 and a connecting pipe 42. The cooling main body 47 and the cooling plate 3 are connected by the connecting pipe 42. In addition, the semiconductor module 2 _S is placed on the cooling main body 47.

As shown in FIG. 12, the semiconductor module 2 _S includes a main body 21, three AC terminals 22 (22 _u , 22 _v , 22 _w ) protruding from the main body 21, and a positive terminal 22 _{p to} which a DC voltage is applied. And a negative terminal 22 _n and a control terminal 23. The main body 21 incorporates a plurality of switching elements 20 (not shown).
In addition, the same configuration and operational effects as those of the first embodiment are provided.

(Embodiment 4)
This embodiment is an example in which the structures of the cooling plate 3 and the cooler 4 are changed. As shown in FIG. 13, in this embodiment, the cooling plate 3 and the cooler 4 are integrally formed. The cooling plate 3 and the cooler 4 can be formed by, for example, die casting. In the cooler 4, an in-device flow path 40 through which the refrigerant 11 flows is formed.

As shown in FIG. 14, the cooler 4 has an opening 45 and a recess 46. The electronic component 2 (reactor 2 _L ) is accommodated in the recess 46. The opening 45 opens to the in-device flow path 40. As shown in FIG. 13, the semiconductor module 2 _S is inserted into the opening 45, and the main body 21 (see FIG. 17) of the semiconductor module 2 _S is disposed in the in-device flow path 40. The semiconductor module 2 _S is directly cooled by the refrigerant 11 flowing through the in-device flow path 40.

As shown in FIG. 17, the semiconductor module 2 _S includes a main body portion 21 in which the switching element 20 is built, and a flange portion 24 extending from the main body portion 21. A bolt insertion hole 25 is formed through the flange 24. As described above, in this embodiment, the main body portion 21 is inserted into the in-device flow path 40 from the opening 45. A bolt 250 (see FIG. 13) is inserted into the bolt insertion hole 25, and the bolt 250 is screwed into a female screw portion 491 (see FIG. 14) formed in the cooler 4. Thereby, the semiconductor module 2 _S is fixed to the cooler 4. Further, the opening 45 is closed by the flange 24 to prevent the refrigerant 11 from leaking.

As shown in FIGS. 15 and 16, the cooling plate 3 of the present embodiment includes a main flow path 31 _m and a sub flow path 31 _s as in the first embodiment. The main pipe 5 _m is connected to the main flow path 31 _m , and the sub pipe 5 _s is connected to the sub flow path 31 _s . The cooling plate 3 is formed with a main connection port 6 _m that connects the main flow path 31 _m and the in-device flow path 40. As shown in FIG. 15, when viewed from the X direction, the main pipe 5 _m is provided between the sub pipe 5 _s and the main connection port 6 _m .

Further, as shown in FIG. 16, in the cooler 4, an in-device flow path 40 is formed so as to surround the reactor 2 _L. The semiconductor module 2 _S and the reactor 2 _L are cooled by the refrigerant 11 flowing through the in-device flow path 40. Further, on the side of the cooling plate 3 where the pipes 5 _m and 5 _s are provided, a pipe horizontal electronic component 2 _p (DC-DC converter 2 _D ) is arranged. The main flow path 31 _m is provided with heat radiation fins 7 through which the refrigerant 11 flows in the Y direction. The pipe horizontal electronic component 2 _p and the reactor 2 _L are cooled by the refrigerant 11 flowing through the main flow path 31 _m .

The effect of this form is demonstrated. In this embodiment, since the cooling plate 3 and the cooler 4 are integrally formed, the number of parts can be reduced. Therefore, the manufacturing cost of the power converter device 1 can be reduced.
In addition, the same configuration and operational effects as those of the first embodiment are provided.

(Embodiment 5)
This embodiment is an example in which the direction in which the refrigerant 11 flows is changed. As shown in FIG. 18, in this embodiment, the refrigerant 11 is introduced from the main pipe 5 _m and the refrigerant 11 is led out from the sub pipe 5 _s . The main pipe 5 _m and the sub pipe 5 _s are connected to an external cooling device that cools the refrigerant 11 as in the first embodiment. The refrigerant 11 flows from the external cooling device to the cooler 4 in the main flow path 31 _m .

Therefore, the refrigerant 11 having a low temperature that has just been cooled by the external cooling device can be passed through the main flow path 31 _m . Therefore, the cooling efficiency of the electronic component 2 (2 _L , 2 _D ) cooled by the main flow path 31 _m can be increased.
In addition, the same configuration and operational effects as those of the first embodiment are provided.

(Embodiment 6)
This embodiment is an example in which the shape of the main flow path 31 _m is changed. As shown in FIG. 19, the main flow path 31 _m of this embodiment is formed only between the main pipe 5 _m and the main connection port 6 _m when viewed from the X direction. That is, the main flow path 31 _m is not formed outside the main pipe 5 _m and the main connection port 6 _{m in} the Y direction. Further, in the Z direction, the main flow path 31 _m is not formed above and below the main pipe 5 _m and the main connection port 6 _{m in} FIG.
Therefore, the cross-sectional area of the main flow path 31 _m in the XZ plane can be reduced, and the flow rate of the refrigerant 11 can be increased. Therefore, the cooling efficiency of the electronic components 2 _L and 2 _p can be further increased.

Moreover, as shown in FIG. 19, the radiation fin 7 of this embodiment is disposed only between the main pipe 5 _m and the main connection port 6 _m when viewed from the X direction. That is, in the Z direction, a part of the radiating fins 7 does not exist above and below the main pipe 5 _m and the main connection port 6 _{m in} FIG.
Therefore, the cross-sectional area in the XZ plane of the radiation fin 7 can be reduced, and the speed of the refrigerant 11 flowing through the radiation fin 7 can be increased. Therefore, the cooling efficiency of the electronic components 2 _L and 2 _p can be further increased.
In addition, the same configuration and operational effects as those of the first embodiment are provided.

1 power converter 11 refrigerant second electronic component 3 cooling plate 31 _m main passage 31 _s sub-passage 4 cooler 5 _m primary pipe 5 _s sub pipe 6 _m main connection port

Claims (10)

A plurality of electronic components (2) constituting a power conversion circuit;
A cooling plate (3) that is formed in a plate shape and cools the electronic component;
A cooler (4) that is provided on one side in the thickness direction of the cooling plate and cools the electronic component;
The cooling plate is partitioned from the main flow path by the main flow path (31 _m ) through which the refrigerant (11) flows, and the partition (32) interposed between the main flow path and the main flow path, and the refrigerant flows. A secondary flow path (31 _s ),
On the other side of the cooling plate in the thickness direction, a main pipe (5 _m ) connected to the main flow path and a sub pipe (5 _s ) connected to the sub flow path are arranged,
The cooler has an in-device flow path (40) through which the refrigerant flows, and the cooling plate has a main connection connecting the main flow path and the in-device flow path on the one side in the thickness direction. A port (6 _m ) and a sub-connection port (6 _s ) connecting the sub-channel and the in-device channel,
The power conversion device (1), wherein the main pipe is disposed between the sub pipe and the main connection port when viewed from the thickness direction.   The power conversion device according to claim 1, wherein in the main flow path, a radiating fin (7) through which the refrigerant flows in the arrangement direction is arranged between the main pipe and the main connection port.   3. The power conversion device according to claim 1, wherein when viewed from the thickness direction, at least a part of the electronic component and the main flow path overlap each other. The main pipe and the sub pipe are adjacent to each other to form a pipe pair (50), and the cooling plate is located at a position adjacent to the pipe pair in the arrangement direction of the main pipe and the main connection port. The power conversion device according to any one of claims 1 to 3, wherein a pipe horizontal electronic component (2 _p ), which is the electronic component cooled by the air, is arranged.   5. The power conversion device according to claim 4, wherein when viewed from the thickness direction, a part of the pipe lateral electronic component and the main connection port overlap each other.   The power converter according to any one of claims 1 to 5, wherein the cooling plate and the cooler are integrally formed.   The main pipe and the sub pipe are connected to an external cooling device that cools the refrigerant, and the main flow path is configured such that the refrigerant flows from the cooler toward the external cooling device. The power converter device as described in any one of Claims 1-6.   The main pipe and the sub pipe are connected to an external cooling device that cools the refrigerant, and the main flow path is configured such that the refrigerant flows from the external cooling device to the cooler. The power converter device as described in any one of Claims 1-6.   The power converter according to any one of claims 1 to 8, wherein the main flow path is formed only between the main pipe and the main connection port when viewed from the thickness direction.   A radiating fin through which the refrigerant flows in the alignment direction of the main pipe and the main connection port is provided in the main flow path, and when viewed from the thickness direction, the radiating fin is connected to the main pipe. The power conversion device according to claim 9, which is disposed only between the main connection port.

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