JP2019221129A - Electric power conversion device - Google Patents

Abstract

To provide an electric power conversion device which can achieve long life of electronic components.SOLUTION: An electric power conversion device 1 has: a semiconductor module 2; a cooler 3 which cools the semiconductor module 2; at least two electronic components 4 directly or indirectly connected to the semiconductor module 2; and a metallic case 5 which houses the semiconductor module 2, the cooler 3, and the electronic components 4. The case 5 has partition walls 51 which partition an interior. The two electronic components 4 are disposed at opposite sides across the cooler 3 in a divided manner. The two electronic components 4 are disposed adjacent to the cooler 3 through the partition walls 51.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a power converter.

  A power conversion device such as an inverter has a plurality of electronic components in addition to a semiconductor module. The semiconductor module and the electronic component are housed in a case. The power conversion device described in Patent Literature 1 has an inner wall portion formed inside the case in order to reduce the weight and size while securing the rigidity of the case. Such an inner wall portion also serves as a partition wall that partitions the inside of the case. The electronic components are accommodated and arranged in each of the plurality of accommodation spaces partitioned by the partition walls.

JP 2015-149810 A

  However, in the power conversion device disclosed in Patent Document 1, electronic components (for example, a capacitor and a current sensor) are arranged so as to be adjacent to each other with a partition wall interposed therebetween. Therefore, it is easy for the electronic components to exchange heat through the partition walls. Then, with the increase in power of the power converter, there is a concern that the life of the electronic component may be shortened.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide a power conversion device capable of extending the life of components.

A first aspect of the present invention provides a semiconductor module (2),
A cooler (3) for cooling the semiconductor module;
At least two electronic components (4) directly or indirectly connected to the semiconductor module;
A metal case (5) for housing the semiconductor module, the cooler, and the electronic component;
The case has a partition (51) that partitions the inside,
On the opposite side of the cooler, the two electronic components are separately arranged,
The two electronic components are in the power converters (1, 10) which are arranged adjacent to the cooler via the partition walls, respectively.

A second aspect of the present invention provides a semiconductor module (2),
A cooler (3) for cooling the semiconductor module;
A heat-generating component (8) connected to the semiconductor module and having a ground terminal (81);
A metal case (5) for housing the semiconductor module, the cooler, and the heat-generating component;
The case has a partition (51) that partitions the inside,
The ground terminal of the heat-generating component is a cooling partition (511a, 511b, 511c), which is the partition disposed facing the cooler, or a continuous partition, which is the partition that is continuous with the cooling partition. The power converter (10) is fixed to the partition (512a, 512b, 512c).

In the power converter according to the first aspect, the two electronic components are separately arranged on opposite sides of the cooler. This makes it easy to suppress thermal interference between the two electronic components. Further, the two electronic components are arranged adjacent to the cooler via the partition walls. Therefore, the two electronic components easily radiate heat to the cooler via the partition wall made of metal.
That is, heat interference between the plurality of electronic components can be suppressed, and the heat dissipation of the plurality of electronic components can be improved. As a result, the life of a plurality of electronic components can be extended.

  In the power converter according to the second aspect, the ground terminal of the heat generating component is fixed to the cooling partition or the continuous partition. This makes it easier to radiate the heat of the heat-generating component to the cooler via the cooling partition. As a result, the life of the heat generating component can be extended.

As described above, according to the above aspect, it is possible to provide a power converter that can extend the life of components.
The reference numerals in the parentheses described in the claims and the means for solving the problems indicate the correspondence with the specific means described in the embodiments described below, and limit the technical scope of the present invention. Not something.

FIG. 2 is an explanatory cross-sectional view of the power converter according to the first embodiment as viewed from the Z direction. FIG. 2 is an explanatory sectional view taken along line II-II in FIG. 1. FIG. 3 is an explanatory sectional view taken along line III-III in FIG. 1. FIG. 10 is an explanatory cross-sectional view of the power conversion device as viewed from the Z direction in the second embodiment. FIG. 13 is a cross-sectional explanatory view of the power conversion device according to the third embodiment as seen from the Z direction. Sectional explanatory drawing of the electric power converter in Embodiment 4 seen from the Z direction. FIG. 13 is an explanatory diagram of the power converter according to the fifth embodiment viewed from the Z direction. FIG. 8 is an explanatory sectional view taken along line VIII-VIII in FIG. 7. FIG. 9 is a partial cross-sectional explanatory view corresponding to a cross section taken along line IX-IX in FIG. 7. FIG. 13 is a circuit configuration diagram of a power conversion device according to a fifth embodiment.

(Embodiment 1)
An embodiment according to a power converter will be described with reference to FIGS.
As shown in FIGS. 1 and 2, the power converter 1 of the present embodiment includes a semiconductor module 2, a cooler 3, at least two electronic components 4, and a metal case 5.

  The cooler 3 cools the semiconductor module 2. The electronic component 4 is directly or indirectly connected to the semiconductor module 2. The case 5 houses the semiconductor module 2, the cooler 3, and the electronic component 4.

The case has a partition wall 51 that partitions the inside.
Two electronic components 4 are separately arranged on opposite sides of the cooler 3.
The two electronic components 4 are arranged adjacent to the cooler 3 with the partition wall 51 interposed therebetween.

  In addition, as the state of the adjacent arrangement, components that hinder heat radiation of the electronic components, such as heat-generating components and heat insulating members, are particularly provided between the cooler 3 and the partition 51 and between the partition 51 and the electronic component 4. Represents a state where it is not arranged. Then, a gap or the like may exist between the cooler 3 and the partition wall 51 or between the partition wall 51 and the electronic component 4. Alternatively, the partition wall 51 may be in contact with at least one of the cooler 3 and the electronic component 4.

  The two electronic components 4 that are arranged separately on opposite sides of the cooler 3 are any two of a current sensor, a capacitor, and a reactor. In the present embodiment, the two electronic components 4 that are separately arranged on opposite sides of the cooler 3 are a current sensor 41 and a capacitor 42.

  As shown in FIG. 1, the cooler 3 has a plurality of cooling pipes 31 stacked together with the semiconductor module 2. Two electronic components 4 are separately arranged on opposite sides of the stacked body 11 of the plurality of cooling tubes 31 and the semiconductor module 2. The two electronic components 4 are arranged adjacent to the stacked body 11 with the partition wall 51 interposed therebetween.

  In the present embodiment, the stacked body 11 is formed by alternately stacking a plurality of semiconductor modules 2 and a plurality of cooling pipes 31. The stacking direction of the stacked body 11 will be appropriately referred to as an X direction hereinafter. The cooling pipe 31 has a refrigerant flow path through which the refrigerant flows. The coolant flow path is formed along a direction orthogonal to the X direction. The direction in which the coolant flow path is formed is appropriately referred to as a Y direction. Further, a direction orthogonal to both the X direction and the Y direction is appropriately referred to as a Z direction.

  The cooling tubes 31 adjacent to each other in the X direction with the semiconductor module 2 interposed therebetween are connected to each other near both ends in the Y direction. The cooler 3 has a cooling plate 310 at one end in the X direction. A refrigerant introduction pipe 321 and a refrigerant discharge pipe 322 protrude outward from the cooling plate 310 in the X direction. The refrigerant introduction pipe 321 and the refrigerant discharge pipe 322 protrude outside the case 5.

  The semiconductor module 2 has a switching element built therein. As the switching element, for example, IGBT (short for insulated gate bipolar transistor) and MOSFET (short for MOS field effect transistor) can be used. Power terminals 21 protrude from the semiconductor module 2 in the Z direction.

  Further, as shown in FIG. 2, the semiconductor module 2 has a plurality of signal terminals 22 protruding on the side opposite to the power terminals 21. These signal terminals 22 are connected to the control board 15. The control board 15 is arranged to face the stacked body 11 with the main surface facing in the Z direction.

  The electronic component 4 is arranged adjacent to the stacked body 11 configured as described above on both sides in the Y direction with the partition wall 51 interposed therebetween. As shown in FIGS. 1 and 2, both ends in the Y direction of the stacked body 11 are both ends of the plurality of cooling pipes 31, and are portions where connection pipes 33 connecting these are formed. That is, both ends in the Y direction of the stacked body 11 are part of the cooler 3. Therefore, the electronic components 4 are adjacently arranged on both sides of the cooler 3 in the Y direction via the partition walls 51, respectively.

  More specifically, a current sensor 41 is disposed on one side in the Y direction of the cooler 3 with a partition wall 51 interposed therebetween. The condenser 42 is disposed on the other side of the cooler 3 in the Y direction with a partition wall 51 interposed therebetween.

  As shown in FIGS. 1 and 2, the number of the electronic components 4 adjacent to the cooler 3 via the partition wall 51 in the same direction is one. That is, the electronic component 4 adjacently arranged on the one side in the Y direction of the cooler 3 via the partition wall 51 is only the current sensor 41, and the other electronic components are not adjacently arranged. Further, the electronic component 4 adjacently disposed on the other side in the Y direction of the cooler 3 via the partition wall 51 is only the capacitor 42, and other electronic components are not disposed adjacently.

  Here, one electronic component 4 means one component. Therefore, for example, even if a component has a plurality of elements built therein, a component that is one component corresponds to “one electronic component 4”.

  The case 5 is made of, for example, a metal such as aluminum. As shown in FIGS. 1 to 3, an input connector 61 and an output connector 62 are fixed to the outer surface on one side in the Y direction of the case 5. The input connector 61 is configured to be connected to a connector of a power supply line connected to a DC power supply. The output connector 62 is configured to be connected to a connector of a load wiring connected to an AC load such as a rotating electric machine.

  As shown in FIGS. 1 and 3, the input connector 61 has a pair of terminals 61 a and is connected to a pair of terminals 421 of the capacitor 42 via a pair of input bus bars 71. At least one of the pair of input bus bars 71 is adjacent to the cooler 3 via the partition wall 51. That is, the input bus bar 71 is adjacent to the cooler 3 via the partition wall 51 in the X direction.

  The capacitor 42 is connected to a part of the power terminals 21 of the semiconductor module 2 in the stacked body 11 at a pair of terminals 422 provided at positions different from the terminals 421 connected to the input bus bar 71. In FIG. 1, the illustration of the connection state between the terminal 422 and the power terminal 21 is omitted.

  The other power terminals 21 of the semiconductor module 2 in the stacked body 11 are connected to the terminals of the output connector 62 via the output bus bar 72. A plurality of output bus bars 72 are arranged. In the output bus bar 72, the current sensor 41 is arranged around the plurality of output bus bars 72. The current sensor 41 is electrically or magnetically connected to the output bus bar 72. That is, the current sensor 41 is the electronic component 4 indirectly connected to the semiconductor module 2. Then, the current sensor 41 can detect the output current by detecting the current flowing through the output bus bar 72.

  As shown in FIGS. 2 and 3, the case 5 has a base plate 52 whose main surface faces in the Z direction. In addition, the case 5 has an outer peripheral wall 53 erected in the Z direction on the outer peripheral edge of the base plate 52. The outer peripheral wall portion 53 protrudes from the base plate 52 on both sides in the Z direction. Therefore, a space surrounded by the outer peripheral wall 53 exists on each of the two main surfaces of the base plate 52.

  As shown in FIG. 2, the laminated body 11 and the plurality of electronic components 4 are arranged on one side of the base plate 52, and the control board 15 is arranged on the other side of the base plate 52. In the Z direction, the side on which the stacked body 11 is disposed with respect to the base plate 52 is referred to as an upper side for convenience, and the opposite side is referred to as a lower side. However, these expressions do not particularly limit the arrangement posture of the power conversion device 1.

  The base plate 52 is partially provided with an opening 521. The signal terminal 22 of the semiconductor module 2 protrudes toward the control board 15 via the opening 521. An upper lid 541 and a lower lid 542 are fixed to the upper edge and the lower edge of the outer peripheral wall 53, respectively.

  The partition wall 51 stands upright from the base plate 52. As shown in FIG. 1, the partition wall 51 includes a partition wall 51 whose main surface is directed in the Y direction and a partition wall 51 whose main surface is directed in the X direction. Two partition walls 51 whose main surfaces face in the Y direction are respectively arranged on both sides of the laminate 11 in the Y direction. The electronic component 4 is disposed adjacent to the stacked body 11 via the partition walls 51. That is, the electronic component 4 is arranged adjacent to the cooler 3 via these partition walls 51. In the present embodiment, the cooler 3 and the electronic component 4 are not particularly in contact with the partition wall 51, but are arranged close to each other.

  As shown in FIGS. 1 and 3, an input bus bar 71 is arranged adjacent to the stacked body 11 via a partition wall 51 whose main surface faces in the X direction.

  As shown in FIGS. 2 and 3, the space in the case 5 is continuous above the upper end edge of the partition wall 51. The semiconductor module 2 and the electronic component 4 are connected via this space. That is, the output bus bar 72 and the terminal 422 of the capacitor 42 are arranged so as to pass above the partition wall 51, respectively.

Next, the operation and effect of the present embodiment will be described.
In the power conversion device 1, two electronic components 4 are separately arranged on opposite sides of the cooler 3. Thereby, it is easy to suppress that the two electronic components 4 thermally interfere with each other. Further, the two electronic components 4 are arranged adjacent to the cooler 3 with the partition wall 51 interposed therebetween. Therefore, the two electronic components 4 easily radiate heat to the cooler 3 via the partition wall 51 made of metal.

  That is, it is possible to suppress the thermal interference between the plurality of electronic components 4 and improve the heat dissipation of the plurality of electronic components 4. As a result, the life of the plurality of electronic components 4 can be extended.

  The number of electronic components 4 adjacent to the cooler 3 in the same direction via the partition wall 51 is one. Thereby, the electronic component 4 can be cooled more efficiently, and the thermal interference between the plurality of electronic components 4 can be effectively suppressed.

  The two electronic components 4 arranged separately on the opposite sides of the cooler 3 are a current sensor 41 and a capacitor 42. In general, the current sensor 41 and the capacitor 42 are electronic components that are relatively difficult to extend the life. Therefore, by suppressing such thermal degradation, it is possible to effectively extend the life of these electronic components 4.

  Two electronic components 4 are separately arranged on opposite sides of the stacked body 11 of the plurality of cooling pipes 31 and the semiconductor module 2 with the stacked body 11 interposed therebetween. The two electronic components 4 are arranged adjacent to the stacked body 11 with the partition wall 51 interposed therebetween. Thus, the cooler 3 can efficiently cool the semiconductor module 2 and also effectively cool the electronic component 4.

  As described above, according to the present embodiment, it is possible to provide a power conversion device that can extend the life of electronic components.

(Embodiment 2)
In the present embodiment, as shown in FIG. 4, two electronic components 4 that are separately arranged on opposite sides of the cooler 3 are formed as a capacitor 42 and a reactor 43.
That is, the condenser 42 is disposed adjacent to the cooler 3 on one side in the Y direction via the partition wall 51, and the reactor 43 is disposed adjacent to the other side in the Y direction via the partition wall 51. ing.

  The power converter 1 of the present embodiment includes a boost converter that boosts DC power input from a DC power supply and supplies the boosted DC power to an inverter. The reactor 43 is disposed in the case 5 as a component of the boost converter.

  FIG. 4 is an explanatory diagram showing a positional relationship among the laminate 11, the capacitor 42, the reactor 43, and the case 5, and other components, wiring, and the like are omitted as appropriate.

  Other configurations are the same as in the first embodiment. In addition, among the reference numerals used in the second and subsequent embodiments, the same reference numerals as those used in the above-described embodiments represent the same components and the like as those in the above-described embodiments unless otherwise specified.

In the case of the present embodiment, the heat interference between the capacitor 42 and the reactor 43 can be suppressed, and the heat dissipation of the electronic components 4 can be improved. Thus, by suppressing thermal deterioration of the capacitor 42 and the reactor 43, it is possible to effectively extend the life of the electronic component 4. That is, the reactor 43, like the capacitor 42 and the like, is generally an electronic component in which it is relatively difficult to extend the life. Therefore, with the configuration of the present embodiment, it is possible to effectively extend the life of the entire power conversion device 1 by suppressing the thermal degradation of the capacitor 42 and the reactor 43.
In addition, it has the same function and effect as the first embodiment.

(Embodiment 3)
In the present embodiment, as shown in FIG. 5, two electronic components 4 which are separately arranged on opposite sides of the cooler 3 are formed as a current sensor 41 and a reactor 43.
That is, the current sensor 41 is disposed adjacent to the cooler 3 on one side in the Y direction via the partition wall 51, and the reactor 43 is disposed adjacent to the other side in the Y direction via the partition wall 51. Have been.

FIG. 5 is an explanatory diagram showing a positional relationship among the laminate 11, the current sensor 41, the reactor 43, and the case 5, and other components, wiring, and the like are omitted as appropriate.
Other configurations are the same as those of the first or second embodiment.

In the case of the present embodiment, thermal interference between the current sensor 41 and the reactor 43 can be suppressed, and the heat radiation of these electronic components 4 can be improved. Thus, by suppressing thermal degradation of the current sensor 41 and the reactor 43, it is possible to effectively extend the life of these electronic components 4.
In addition, the third embodiment has the same functions and effects as those of the first and second embodiments.

(Embodiment 4)
As shown in FIG. 6, the present embodiment is in the form of a power converter 1 in which two electronic components 4 are separately arranged on both sides in the X direction with respect to a cooler 3 via partition walls 51. is there.
In the present embodiment, the current sensor 41 is arranged adjacent to the cooling pipe 31 arranged at one end in the X direction of the cooler 3 via the partition wall 51. A condenser 42 is arranged adjacent to the other end of the cooler 3 in the X direction with a partition wall 51 interposed therebetween.

  The cooler 3 bends the refrigerant introduction pipe 321 and the refrigerant discharge pipe 322 protruding from the cooling pipe 31 at one end in the stacking direction (that is, the X direction) (that is, the end on the arrangement side of the condenser 42) in the Y direction. . The refrigerant introduction pipe 321 and the refrigerant discharge pipe 322 protrude from the outer peripheral wall 53 of the case 5 to the same side in the Y direction.

In addition, the condenser 42 is disposed adjacent to a portion along the Y direction of the refrigerant discharge pipe 322 in the case 5 from the X direction with a partition wall 51 interposed therebetween.
FIG. 6 is an explanatory diagram showing a positional relationship among the laminate 11, the current sensor 41, the capacitor 42, and the case 5, and other components, wirings, and the like are omitted as appropriate.
Other configurations are the same as in the first embodiment.

Also in the case of the present embodiment, it is possible to suppress the thermal interference between the plurality of electronic components 4 (that is, the current sensor 41 and the capacitor 42) and to improve the heat dissipation of the plurality of electronic components 4. As a result, the life of the plurality of electronic components 4 can be extended.
In addition, it has the same function and effect as the first embodiment.

  In this embodiment, the arrangement of the refrigerant introduction pipe 321 and the refrigerant discharge pipe 322 may be reversed, and the condenser 42 may be arranged adjacent to the refrigerant introduction pipe 321 via the partition wall 51. it can. In this case, the cooling efficiency of the condenser 42 can be further improved.

  Further, in this embodiment, the refrigerant introduction pipe 321 and the refrigerant discharge pipe 322 have been described as being bent to the same side in the Y direction, but may be bent to opposite sides or bent in the Z direction. it can.

In the present embodiment, the positional relationship between the current sensor 41 and the condenser 42 with respect to the cooler 3 can be reversed.
Further, also in the present embodiment, a reactor 43 can be arranged instead of the current sensor 41 or the capacitor 42 as the electronic component 4 arranged adjacent to the cooler 3 in the X direction via the partition wall 51. .

(Embodiment 5)
As shown in FIGS. 7 to 10, this embodiment is a form of a power converter 10 that is further connected to the semiconductor module 2 and further includes a heat generating component 8 having a ground terminal 81.
As shown in FIGS. 7 and 8, the ground terminal 81 of the heat generating component 8 is fixed to the cooling partition walls 511a, 511b, 511c or the continuous partition walls 512a, 512b. The cooling partition walls 511a, 511b, and 511c are the partition walls 51 arranged facing the cooler 3. The continuous partition walls 512a and 512b are the partition walls 51 that are continuous with one of the cooling partition walls 511a, 511b and 511c.

  In this embodiment, the ground terminal 81 is fixed to a continuous partition wall 512a that is continuous with the cooling partition wall 511a. The ground terminal 81 is fastened to the continuous partition wall 512a by a metal fastening member such as the bolt 12.

  At least some of the cooling partition walls 511a and 511c face the plurality of cooling pipes 31 and the connection pipe 33, and are formed along the stacking direction X of the plurality of cooling pipes 31. That is, some of the cooling partition walls 511a and 511c are arranged to face the cooler 3 in the Y direction. The cooling partition walls 511a and 511c face the cooler 3 throughout the cooler 3 in the X direction. In the present embodiment, such cooling partition walls 511a and 511c are arranged on both sides of the cooler 3 in the Y direction. In the present embodiment, there is a continuous partition wall 512a as the partition wall 51 in which one of the cooling partition walls 511a is extended in the X direction.

  A space surrounded by the continuous partition wall 512a, a part of each of the two outer peripheral wall portions 53, a cooling partition wall 511b having a main surface directed in the X direction, and a continuous partition wall 512b continuous to the cooling partition wall 511b. The heat-generating component 8 is disposed at the bottom (see FIGS. 7 to 9). In the present embodiment, the heat-generating component 8 is a grounding capacitor in which one electrode is grounded. The grounding capacitor includes two capacitor elements 82. The two capacitor elements 82 are connected in series as shown in FIG. The ground terminal 81 is electrically connected to the wiring between the two capacitor elements 82.

  The grounding capacitor as the heat-generating component 8 is connected in parallel with another capacitor 42. The other capacitor 42 is a smoothing capacitor that smoothes a voltage input to the inverter circuit 20 including the plurality of semiconductor modules 2. Further, the grounding capacitor (that is, the heat generating component 8) has a function of removing noise current included in the DC power of the DC power supply BAT.

As shown in FIG. 7, the case 5 has an earth boss 54 provided on the outer surface of the outer peripheral wall 53. An earth boss 54 is arranged on an extension of the partition wall 51 to which the earth terminal 81 is fixed. That is, the ground boss 54 is disposed on an extension of the cooling partition 511a and the continuous partition 512a in the X direction.
A ground wiring terminal (not shown) (for example, a terminal such as a harness) is fastened to the ground boss 54.

The case 5 has a first cooling partition wall 511a and a second cooling partition wall 511b, which are different cooling partition walls. The grounding capacitor serving as the heat-generating component 8 has a first fixed part 121 and a second fixed part 122. The first fixing part 121 is defined as a fixing part fixed to the first cooling partition 511a or the first continuous partition 512a that is continuous with the first cooling partition 511a. The second fixing part 122 is defined as a fixing part fixed to the second cooling partition 511b or the second continuous partition 512b continuous with the second cooling partition 511b.
In the present embodiment, the first fixing portion 121 is fixed to the first continuous partition wall 512a. Further, the second fixing portion 122 is fixed to the second cooling partition wall 511b.

Further, at least the first fixing portion 121 is configured by the ground terminal 81. In the present embodiment, the first fixing portion 121 is configured by the ground terminal 81, but the second fixing portion 122 is configured by a part of the insulating casing of the grounding capacitor. That is, the flange portion 83 provided on a part of the housing made of resin or the like accommodating the capacitor element 82 is fixed to the partition wall 51 as the second fixing portion 122.
Others are the same as the first embodiment.

Next, the operation and effect of this embodiment will be described.
In the power converter 10 of the present embodiment, the ground terminal 81 of the grounding capacitor as the heat-generating component 8 is fixed to the continuous partition 512a. Thereby, the heat of the grounding capacitor can be easily radiated to the cooler 3 via the continuous partition wall 512a and the cooling partition wall 511a. As a result, the life of the grounding capacitor can be extended.

  Also, the noise current flowing through the grounding capacitor can be released to the ground via the case 5. That is, the structure in which the ground terminal 81 is fixed to the continuous partition wall 512a can fulfill not only the function of releasing the noise current but also the heat radiation function of the grounding capacitor.

  Further, a cooling partition wall 511a faces the plurality of cooling pipes 31 and the connecting pipes 33 and is formed along the X direction. Thus, the heat of the grounding capacitor (that is, the heat-generating component 8) is easily radiated to the cooler 3 more efficiently.

  The ground boss 54 is arranged on an extension of the partition 51 to which the ground terminal 81 is fixed (in the present embodiment, the continuous partition 512a). Thereby, the current path from the ground terminal 81 to the ground boss 54 can be shortened. As a result, the noise current flowing through the grounding capacitor can be quickly released to the ground.

The grounding capacitor serving as the heat-generating component 8 has a first fixing part 121 and a second fixing part 122. Thereby, the grounding capacitor can be fixed to the case 5 stably. At the same time, the heat of the grounding capacitor can be radiated from the second fixing part 122 together with the heat radiated from the first fixing part 121. Even if the second fixing part 122 is not a terminal, the heat radiation path from the second fixing part 122 can serve as an auxiliary heat radiation path for the heat radiation path from the first fixing part 121.
In addition, it has the same function and effect as the first embodiment.

  The present invention is not limited to the above embodiments, and can be applied to various embodiments without departing from the gist thereof.

REFERENCE SIGNS LIST 1 power conversion device 2 semiconductor module 3 cooler 4 electronic component 5 case 51 partition

Claims (10)

A semiconductor module (2);
A cooler (3) for cooling the semiconductor module;
At least two electronic components (4) directly or indirectly connected to the semiconductor module;
A metal case (5) for housing the semiconductor module, the cooler, and the electronic component;
The case has a partition (51) that partitions the inside,
On the opposite side of the cooler, the two electronic components are separately arranged,
The power converter (1, 10), wherein the two electronic components are arranged adjacent to the cooler via the partition walls, respectively.   The power converter according to claim 1, wherein the number of the electronic components adjacent to the cooler via the partition wall in the same direction is one.   2. The two electronic components, which are arranged separately on opposite sides of the cooler, are any two of a current sensor (41), a capacitor (42), and a reactor (43). 3. Or the power converter according to 2.   The power converter according to claim 3, wherein the two electronic components arranged separately on opposite sides of the cooler are a current sensor and a capacitor.   The cooler has a plurality of cooling pipes (31) stacked together with the semiconductor module, and has two cooling pipes on opposite sides of the stacked body (11) of the plurality of cooling pipes and the semiconductor module. 5. The electronic device according to claim 1, wherein the two electronic components are arranged separately, and the two electronic components are arranged adjacent to the stacked body via the partition walls. The power converter according to claim 1. A heating component (8) connected to the semiconductor module and having a ground terminal;
The ground terminal of the heat-generating component is a cooling partition (511a, 511b, 511c), which is the partition disposed facing the cooler, or a continuous partition, which is the partition that is continuous with the cooling partition. The power conversion device (10) according to any one of claims 1 to 5, wherein the power conversion device (10) is fixed to a partition (512a, 512b, 512c). A semiconductor module (2);
A cooler (3) for cooling the semiconductor module;
A heat-generating component (8) connected to the semiconductor module and having a ground terminal (81);
A metal case (5) for housing the semiconductor module, the cooler, and the heat-generating component;
The case has a partition (51) that partitions the inside,
The ground terminal of the heat-generating component is a cooling partition (511a, 511b, 511c), which is the partition disposed facing the cooler, or a continuous partition, which is the partition that is continuous with the cooling partition. The power converter (10) fixed to the partition (512a, 512b, 512c).   The cooler has a plurality of cooling pipes (31) stacked together with the semiconductor module, and a connecting pipe (33) connecting the plurality of cooling pipes. The power converter according to claim 6, wherein the power conversion device is formed to face the plurality of cooling pipes and the connection pipe along a stacking direction (X) of the plurality of cooling pipes.   The case has an earth boss (54) provided on the outer surface of the outer peripheral wall (53), and the earth boss is arranged on an extension of the partition wall to which the earth terminal is fixed. The power converter according to any one of claims 6 to 8.   The case has a first cooling section partition (511a) and a second cooling section partition (511b), which are different cooling section partitions, and the heat-generating component is the first cooling section partition or the first cooling section. The first fixed portion (121) fixed to the first continuous partition wall (512a) connected to the partition wall and the second cooling partition wall or the second continuous partition wall (512b) continuous to the second cooling partition wall. The power converter according to any one of claims 6 to 9, further comprising a fixed second fixing portion (122), wherein at least the first fixing portion is configured by the ground terminal.

Images