JP2013074721A - Power conversion device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power conversion device capable of being easily downsized.SOLUTION: A power conversion device 1 includes a stack 4 including a stack of a plurality of semiconductor modules constituting a part of a power conversion circuit and a plurality of coolant passages 3 cooling the semiconductor modules, and a capacitor 5 electrically connected to the semiconductor modules, and is configured so as to convert a DC power inputted from a pair of input terminals 11 into an AC power and to output the AC power from a plurality of output terminals 12. A pair of electrodes of the capacitor 5 are electrically connected to the pair of input terminals 11. The output terminals 12 are drawn in the same direction orthogonal to both the stacking direction of the stack 4 and a projection direction of main electrode terminals of the semiconductor module. The input terminals 11 are drawn in the same direction in the stacking direction X of the stack 4.

Description

  The present invention relates to a power conversion device including a stacked body in which a plurality of semiconductor modules and a plurality of refrigerant flow paths for cooling the semiconductor modules are stacked, and including a capacitor electrically connected to the semiconductor module. .

  For example, as a power conversion device such as an inverter that converts DC power into AC power, a stack formed by stacking a plurality of semiconductor modules that constitute a part of a power conversion circuit and a plurality of refrigerant channels that cool the semiconductor modules Some have a body (Patent Document 1). And this power converter device is provided with capacitors, such as a smoothing capacitor for smoothing the voltage of the input direct-current power.

For example, the power conversion device described in the example of Patent Document 1 is configured to convert DC power input from a pair of input terminals and output the power from three output terminals as three-phase AC power. . In other words, this power conversion device includes two input terminals connected to a DC power supply and three output terminals connected to a three-phase AC load (rotating electric machine). The pair of electrodes of the capacitor are electrically connected to the pair of input terminals, respectively. Specifically, a pair of terminals of the capacitor is a pair of input terminals in a power converter connected to a power source.
In the power conversion device, the pair of input terminals are drawn out in the same direction orthogonal to the stacking direction with respect to the stacked body together with the three output terminals.

JP 2011-114966 A

However, as described above, when both the input terminal and the output terminal are to be pulled out in the same direction perpendicular to the stacking direction with respect to the stacked body, the power is required to secure a sufficient arrangement space between the input terminal and the output terminal. In some cases, the size of the conversion device must be increased. That is, for example, when two input terminals and three output terminals are pulled out in the same direction orthogonal to the stacking direction as described above, these five terminals are aligned in the stacking direction, and the stacking direction of the arrangement space May be larger than the dimensions of the laminate. In particular, in the case of a power conversion device with a small number of semiconductor modules, such as an inverter that does not include a converter for step-up / step-down, the dimension of the stack in the stacking direction tends to be small. In this case, when both the input terminal and the output terminal are arranged in the same direction perpendicular to the stacking direction with respect to the stacked body, the physique in the stacking direction of the power converter is reduced due to the input terminal and the output terminal. It will become bigger.
Therefore, there is a limit to downsizing the power conversion device, and it becomes difficult to save the space for mounting the power conversion device.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a power conversion device that can be easily made compact.

One embodiment of the present invention includes a stacked body in which a plurality of semiconductor modules forming a part of a power conversion circuit and a plurality of refrigerant flow paths for cooling the semiconductor modules are stacked. A power conversion device configured to convert DC power input from a pair of input terminals and output from a plurality of output terminals as AC power,
The pair of electrodes of the capacitor are electrically connected to the pair of input terminals, respectively.
The output terminal is drawn out in the same direction orthogonal to both the stacking direction of the stacked body and the protruding direction of the main electrode terminal of the semiconductor module,
The input terminal is drawn out in the same direction as the stacking direction of the stacked body (claim 1).

  In the power conversion device, the output terminal is drawn out in the same direction perpendicular to both the stacking direction of the stacked body and the protruding direction of the main electrode terminal of the semiconductor module, and the input terminal is stacked in the stacked body of the stacked body. It is pulled out in the same direction. That is, the input terminal is drawn out in a different direction from the output terminal. Thereby, the input terminal and the output terminal are not arranged side by side in the stacking direction, and it is possible to prevent the arrangement space of these terminals from becoming long in the stacking direction.

As a result, the physique in the stacking direction of the entire power conversion device can be prevented from increasing due to the input terminal and the output terminal, particularly when the number of stacking layers of the stack is small and the dimension in the stacking direction of the stack is small. .
As a result, the power converter can be easily made compact.

  As described above, according to the present invention, it is possible to provide a power converter that can be easily downsized.

Plane explanatory drawing of the power converter device in Example 1. FIG. Plane explanatory drawing of a laminated body and an alternating current bus bar in Example 1. FIG. FIG. 2 is a cross-sectional view taken along line AA in FIG. Plane explanatory drawing of the power converter device provided with the case in Example 1. FIG. BRIEF DESCRIPTION OF THE DRAWINGS FIG. Sectional explanatory drawing of the terminal block which fastened the DC bus bar, the input terminal, and the DC cable terminal in Example 1. FIG. The circuit diagram of the power converter device in Example 1. FIG. FIG. 3 is an explanatory plan view of a case in the first embodiment. Plane explanatory drawing of the other case in Example 1. FIG. Plane | planar explanatory drawing of a power converter device when three output terminals and two input terminals are pulled out in the same direction of a horizontal direction. Plane explanatory drawing of the laminated body and alternating current bus bar in Example 2. FIG. Plane | planar explanatory drawing of the power converter device in Example 3. FIG. Plane | planar explanatory drawing of the power converter device in Example 4. FIG.

  In the power conversion device, a refrigerant introduction pipe that introduces a cooling medium into the plurality of refrigerant flow paths and a refrigerant discharge pipe that discharges the cooling medium from the plurality of refrigerant flow paths from one end in the stacking direction of the stacked body. Preferably, the pair of input terminals are drawn out in the same direction as the protruding direction of the refrigerant introduction pipe and the refrigerant discharge pipe. In this case, it can prevent more effectively that a power converter device enlarges by providing the said input terminal. That is, the refrigerant introduction pipe and the refrigerant discharge pipe protrude from the laminated body in the lamination direction, but a dead space is formed between the refrigerant introduction pipe and the refrigerant discharge pipe or on the side of these pipes. Easy to be. Therefore, by pulling out the input terminals in the protruding direction of these pipes, the dead space can be effectively used and the power converter can be made compact.

  In addition, a refrigerant introduction pipe that introduces a cooling medium into the plurality of refrigerant flow paths and a refrigerant discharge pipe that discharges the cooling medium from the plurality of refrigerant flow paths protrude in the same direction from one end in the stacking direction of the stacked body. The pair of input terminals may be drawn out in a direction opposite to a protruding direction of the refrigerant introduction pipe and the refrigerant discharge pipe (claim 3). In this case, the pair of input terminals is not arranged between the refrigerant introduction pipe and the refrigerant discharge pipe or using the dead space beside them, but a plurality of output terminals and a pair of inputs are not provided. Since it is possible to prevent the terminals from being arranged in the stacking direction, the dimensions of the power conversion device in the stacking direction can be suppressed.

  Further, a refrigerant introduction pipe for introducing a cooling medium into the plurality of refrigerant flow paths and a refrigerant discharge pipe for discharging the cooling medium from the plurality of refrigerant flow paths from one end and the other end in the stacking direction of the stacked body. The pair of input terminals may be drawn out in the same direction as the protruding direction of the refrigerant introduction pipe or the protruding direction of the refrigerant discharge pipe. In this case, in the power conversion device in which the refrigerant introduction pipe and the refrigerant discharge pipe are protruded in opposite directions, the physique can be made compact. That is, with the above arrangement, the input terminal can be arranged by effectively using a dead space formed on the side of the refrigerant introduction pipe or the refrigerant discharge pipe. As a result, the power converter can be easily made compact.

  The pair of input terminals are preferably terminals integrated with the capacitor. In this case, since the capacitors can be electrically connected at the input terminals, it is possible to efficiently assemble the capacitors in the power converter.

  In addition, the power module includes a pair of DC bus bars connected to the main electrode terminals of the semiconductor module and connected to the input terminals. The bus bar terminals of the DC bus bars and the input terminals are provided in the power converter. It is preferable that the terminal blocks are drawn out to overlap each other and are configured to be fastened together with the terminal blocks by bolts (Claim 6). In this case, the input terminal and the bus bar terminal can be easily connected to each other, and can be easily connected to an external power supply terminal.

  The plurality of output terminals are provided at the other end of a plurality of AC bus bars whose one ends are connected to the main electrode terminals in the plurality of semiconductor modules, and the AC bus bars are arranged in a stacking direction and a protruding direction of the main electrode terminals. It is preferable that it is pulled out so as to extend in a direction perpendicular to both of the two (claim 7). In this case, the arrangement space of the plurality of AC bus bars can be prevented from spreading in the stacking direction of the laminate, and the power converter can be prevented from being enlarged due to the arrangement of the AC bus bars. Therefore, it is possible to obtain a power conversion device that can be more easily downsized.

  Moreover, it is preferable that the said power converter device is comprised so that the input DC power may be converted into AC power, without raising / lowering pressure (Claim 8). In this case, a converter for boosting or stepping down is not provided, and there is no need to provide a semiconductor module for the converter. Therefore, the number of semiconductor modules arranged in the stacked body can be reduced, and the number of stacked stages of the stacked body can be reduced. As a result, the dimension of the stacked body in the stacking direction can be further reduced. Therefore, in such a power converter, the size of the power converter can be effectively reduced by reducing the dimension in the stacking direction by arranging the input terminals.

Example 1
Examples of the power conversion device will be described with reference to FIGS.
As shown in FIGS. 1 and 2, the power conversion device 1 of this example includes a plurality of semiconductor modules 2 constituting a part of the power conversion circuit and a plurality of refrigerant flow paths 3 for cooling the semiconductor modules 2. And a capacitor 5 electrically connected to the semiconductor module 2. The power conversion apparatus 1 is configured to convert DC power input from the pair of input terminals 11 and output the power from a plurality of output terminals 12 as AC power.

The pair of electrodes of the capacitor 5 are electrically connected to the pair of input terminals 11, respectively.
The output terminal 12 is in the same direction as a direction orthogonal to both the stacking direction X of the stacked body 4 and the protruding direction of the main electrode terminal 21 of the semiconductor module 2 (this direction is hereinafter referred to as “lateral direction Y”). Has been pulled out.
The input terminal 11 is drawn out in the same direction as the stacking direction X of the stacked body 4.

The laminated body 4 and the capacitor 5 are overlapped with each other in a direction orthogonal to both the lamination direction X and the lateral direction Y (the normal direction of the paper surface of FIG. 1 and hereinafter referred to as “height direction Z”). Has been placed. The capacitor 5 is arranged on the protruding side of the main electrode terminal 21 of the semiconductor module 2 in the laminated body 4, and the control circuit board is arranged on the opposite side of the laminated body 4 from the capacitor 5 (not shown).
The output terminal 12 protrudes in the lateral direction Y of the capacitor 5, and the input terminal 11 protrudes in the stacking direction X of the capacitor 5. The input terminal 11 and the output terminal 12 are configured by a plate-shaped metal plate, and the thickness directions thereof are arranged so as to face the height direction Z (see FIG. 3).

  In this example, the input terminal 11 is a terminal integrated with the capacitor 5, and the pair of terminals drawn out from the pair of electrodes of the capacitor 5 is the input terminal 11. One of the pair of input terminals 11 is a positive electrode terminal 11p connected to the positive electrode of the DC power supply 61 (see FIG. 7), and the other is a negative electrode terminal 11n connected to the negative electrode of the DC power supply 61.

  Further, three output terminals 12 are formed, and are drawn out in parallel in the same direction of the lateral direction Y of the laminate 4. These three output terminals 12 are arranged in the stacking direction X. Each of these three output terminals 12 includes a U-phase terminal 12u and a V-phase terminal connected to the U-pole, V-pole, and W-pole of a three-phase AC load (a three-phase AC rotating electrical machine 62 described later), respectively. 12v, W-phase terminal 12w.

As shown in FIG. 4, the power conversion apparatus 1 includes a refrigerant introduction pipe 331 that introduces a cooling medium into the plurality of refrigerant flow paths 3 and a refrigerant discharge pipe 332 that discharges the cooling medium from the plurality of refrigerant flow paths 3. The stacked body 4 is formed so as to protrude from one end in the stacking direction X in the same direction.
The pair of input terminals 11 are drawn out in the same direction as the protruding direction of the refrigerant introduction pipe 331 and the refrigerant discharge pipe 332. Further, the pair of input terminals 11 are arranged between the refrigerant introduction pipe 331 and the refrigerant discharge pipe 332.

  As shown in FIG. 2, the refrigerant flow path 3 laminated with the semiconductor module 2 is constituted by a cooling pipe made of a metal such as an aluminum alloy, and the adjacent refrigerant flow paths 3 are arranged in the longitudinal direction (lateral direction Y). Are connected to each other by a connecting pipe 32 in the vicinity of both ends. Then, the refrigerant introduction pipe 331 and the refrigerant discharge respectively project from the vicinity of both ends in the longitudinal direction (lateral direction Y) of the cooling pipe (refrigerant flow path 3) arranged at one end in the lamination direction X so as to protrude in the lamination direction X. The pipe 332 protrudes. Thus, the cooler 30 is configured by the plurality of refrigerant flow paths 3 (cooling pipes), the plurality of connection pipes 32, the refrigerant introduction pipe 331, and the refrigerant discharge pipe 332.

Two semiconductor modules 2 are sandwiched between two adjacent refrigerant flow paths 3 in the cooler 30 configured as described above. Thereby, the laminated body 4 in which the refrigerant flow paths 3 and the semiconductor modules 2 are alternately laminated is configured.
In the present example, the refrigerant flow path 3 is formed by a cooling pipe, and the cooling pipe is brought into contact with the semiconductor module 2, but the power conversion device of the present invention is not limited to this. . That is, for example, a coolant channel can be provided so that the cooling medium directly contacts the semiconductor module 2.

  The cooling medium introduced into the cooler 30 from the refrigerant introduction pipe 331 flows through the connecting pipe 32 as appropriate and is distributed to the plurality of refrigerant flow paths 3. At this time, the cooling medium cools the semiconductor module 2 by exchanging heat with the semiconductor module 2. The cooling medium after heat exchange with the semiconductor module 2 is discharged from the refrigerant discharge pipe 332 through the connection pipe 32 as appropriate from the downstream side of the refrigerant flow path 3.

In this example, the stacked body 4 includes four refrigerant channels 3 and six semiconductor modules 2. Each semiconductor module 2 includes one switching element. As the switching element, for example, an IGBT (insulated gate bipolar transistor) can be used. In this case, the semiconductor module 2 also includes a rectifying element (for example, a flywheel diode) connected in reverse parallel to the switching element.
As the switching element, for example, a MOSFET (MOS field effect transistor) can be used.

The power conversion apparatus 1 of this example is configured to convert input DC power into AC power without stepping up or down. That is, as shown in FIG. 7, the power conversion device 1 does not include a boost converter or the like.
The power converter 1 is configured to convert the DC power of the DC power supply 61 connected to the input terminal 11 into three-phase AC power and drive the rotating electrical machine 62 as a three-phase AC load connected to the output terminal 12. It is. Further, the power conversion device 1 is configured so that AC power generated by the rotating electrical machine 62 can be converted into DC power and recovered by the DC power source 61.

In the power conversion device 1, there are three series bodies composed of two semiconductor modules 2 connected in series with each other between the positive electrode bus bar 13 p and the negative electrode bus bar 13 n connected to the positive electrode and the negative electrode of the DC power supply 61, respectively. They are connected in parallel. These three series bodies constitute a U-phase arm, a V-phase arm, and a W-phase arm, respectively, in the inverter circuit. The connection points of the pair of semiconductor modules 2 in each series body are connected to the U pole, V pole, and W pole of the rotating electrical machine 62 via the AC bus bar 120.
In addition, the capacitor 5 is connected to the DC power supply 61 between the positive bus bar 13p and the negative bus bar 13n, and the DC voltage of the DC power supply 61 is smoothed.

  As shown in FIGS. 1 and 3, the power conversion device 1 includes a pair of DC bus bars 13 connected to the main electrode terminal 21 of the semiconductor module 2 and to the input terminal 11. That is, this pair of DC bus bars 13 is a positive bus bar 13p and a negative bus bar 13n.

  The bus bar terminal 131 and the input terminal 12 of the DC bus bar 13 are drawn out to overlap each other at the terminal block 14 provided in the power converter 1, and are fastened to the terminal block 14 by bolts 141 as shown in FIG. It is configured to be. That is, in a state where the power conversion device 1 is connected to the DC power supply 61, the bus bar terminal 131, the input terminal 12, and the DC cable terminal 611 of the DC cable connected to the DC power supply 61 are connected to the terminal block 14 by the bolt 141. It is tightened together. The terminal block 14 is made of a resin molded body, and is provided with a female screw portion 142 that is open on one side in the height direction Z.

  The bus bar terminal 131 of the DC bus bar 13, the input terminal 11 that is the terminal of the capacitor 5, and the DC cable terminal 611 are stacked in this order on the terminal block 14, and bolts are inserted into the insertion holes provided in each terminal. 141 and fasten together. Note that the end of the DC bus bar 13 opposite to the bus bar terminal 131 is supported by the resin support base 143 in a positioned state.

  As shown in FIG. 2, the output terminal 12 is provided at the other end of a plurality of AC bus bars 120 having one end connected to the main electrode terminal 21 in the semiconductor module 2. The AC bus bar 120 is drawn out so as to extend in the lateral direction Y. That is, each AC bus bar 120 is connected to one main electrode terminal 21 in a pair of semiconductor modules 2 arranged side by side in the horizontal direction Y, and extends in the horizontal direction Y therefrom. The output terminal 12 is provided at the tip. Here, each AC bus bar 120 is slightly bent from the connection portion with the main electrode terminal 21 of the semiconductor module 2 to the output terminal 12, but hardly fluctuates in the stacking direction X or the height direction Z. It extends in the lateral direction Y.

  Further, in the AC bus bar 120, the thickness direction at the part connected to the main electrode terminal 21 of the semiconductor module 2 faces the stacking direction X, and the thickness direction at the part provided with the output terminal 12 faces the height direction Z. It is configured as follows. The output terminal 12 is formed with an insertion hole for inserting a fastening bolt.

Each output terminal 12 is connected to an AC cable terminal of an AC cable connected to the rotating electrical machine 62. An illustration of the connection structure is omitted.
Further, as shown in FIG. 4, the power conversion device 1 is configured by housing components in a case 16 made of aluminum alloy or the like, and the input terminal 11 and the output terminal 12 are also accommodated in the case 16. The refrigerant introduction pipe 321 and the refrigerant discharge pipe 322 protrude from the case 16 in the stacking direction X.

  The case 16 has a terminal insertion opening for inserting a DC cable terminal and an AC cable terminal in the drawing direction of the input terminal 11 and the output terminal 12, respectively (not shown). As shown in FIG. 8, the case 16 has a bolt fastening for fastening the bolt 41 at each terminal at a position facing the input terminal 11 and the output terminal 12 from the thickness direction thereof, that is, from the height direction Z. Opening portions 161 and 162 are provided. These bolt fastening openings 161 and 162 are closed by a lid (not shown) after the bolt fastening.

  The bolt fastening opening 161 opens toward the pair of input terminals 11, and the bolt fastening opening 162 opens toward the three output terminals 12. Therefore, the bolt fastening opening 161 is formed as a long hole in the stacking direction X in the vicinity of one end in the lateral direction Y of the case 16. The bolt fastening opening 162 is formed as a long hole in the lateral direction Y in the vicinity of one end in the stacking direction X of the case 16.

Further, the two bolt fastening openings 161 and 162 may be connected to each other as shown in FIG. In this case, the two bolt fastening openings 161 and 162 are one opening formed in a substantially L shape.
When the bolt fastening openings 161 and 162 shown in FIG. 8 are independent from each other, there is an advantage that it is easy to improve the sealing performance at this portion. On the other hand, the bolt fastening openings 161 and 162 shown in FIG. 9 tend to be advantageous from the viewpoint of productivity.

Next, the function and effect of this example will be described.
In the power converter 1, as shown in FIG. 1, the output terminal 12 is drawn out in the same direction in the lateral direction Y, and the input terminal 11 is drawn out in the same direction in the stacking direction X. That is, the input terminal 11 is pulled out in a direction different from the output terminal 12. Thereby, the input terminal 11 and the output terminal 12 are not arranged side by side in the stacking direction X, and the arrangement space of these terminals can be prevented from becoming long in the stacking direction X.

As a result, the physique in the stacking direction X of the entire power conversion device 1 for the input terminal 11 and the output terminal 12 is large especially when the number of stacking layers of the stack 4 is small and the dimension of the stacking direction X of the stack 4 is small. Can be prevented.
As a result, the power conversion device 1 can be easily made compact.

  Further, as shown in FIG. 4, the pair of input terminals 11 are drawn out in the same direction as the protruding direction of the refrigerant introduction pipe 321 and the refrigerant discharge pipe 322. Therefore, it is possible to more effectively prevent the power conversion device 1 from being enlarged by providing the input terminal 11. That is, the refrigerant introduction pipe 321 and the refrigerant discharge pipe 322 protrude from the stacked body 4 in the stacking direction X. However, a dead space is provided between the refrigerant introduction pipe 321 and the refrigerant discharge pipe 322 or beside these pipes. Is easily formed. Therefore, by pulling out the input terminal 11 in the protruding direction of these pipes, the dead space can be effectively used and the power conversion device 1 can be made compact.

  As shown in FIGS. 5 and 6, the bus bar terminal 131 and the input terminal 11 of the DC bus bar 13 are drawn out to overlap each other in the terminal block 14 and are fastened together with the terminal block 14 by bolts. Thereby, while being able to connect the input terminal 11 and the bus-bar terminal 131 easily, these can be easily connected to the DC cable terminal 611.

  Further, as shown in FIG. 2, the AC bus bar 120 is drawn out so as to extend in the lateral direction Y. Thereby, the arrangement space of the plurality of AC bus bars 120 can be prevented from spreading in the stacking direction X, and the power converter 1 can be prevented from being enlarged due to the arrangement of the AC bus bars 120. Therefore, it is possible to obtain the power conversion device 1 that can be more easily downsized.

  The power conversion device 1 is configured to convert input DC power into AC power without stepping up or down, and does not include a converter for boosting or stepping down. That is, the power conversion device 1 of this example does not need to include a converter semiconductor module. Therefore, the number of semiconductor modules 2 arranged in the stacked body 4 can be reduced, and the number of stacked stages of the stacked body 4 can be reduced. That is, in this example, the number of stacking stages of the semiconductor module 2 in the stacking direction X is three. As a result, the dimension of the stacked body 4 in the stacking direction X can be reduced. Therefore, in the power conversion device 1, the size of the power conversion device 1 can be effectively reduced by reducing the dimension in the stacking direction X by the arrangement of the input terminals 11.

This will be described with reference to FIG. By reducing the number of steps of the stacked body 4 as described above, the dimension of the stacked body 4 in the stacking direction X is reduced. On the other hand, as shown in FIG. 10, if two input terminals 11 are pulled out in the same direction in the lateral direction Y in addition to the three output terminals 12, five terminals are arranged in the stacking direction X. It becomes. If it does so, the arrangement space of these terminals may become long in the lamination direction X, and the dimension may exceed the dimension of the laminated body 4. In this case, even if the stacked body 4 is made compact in the stacking direction X, it is difficult to reduce the size of the entire power converter due to the arrangement space of the input terminal 11 and the output terminal 12 after all.
Such a situation is likely to occur particularly when the number of stacked layers 4 is reduced. In the power conversion device having such a configuration, the power conversion device 1 can be reduced in size by devising the drawing direction of the input terminal 11 as described above. Can be effectively achieved.

  As described above, according to this example, it is possible to provide a power converter that can be easily downsized.

(Example 2)
As shown in FIG. 11, this example is an example of a power conversion device 1 that uses a so-called 2-in-1 semiconductor module that includes two switching elements as the semiconductor module 2.
Each semiconductor module 2 is formed by modularizing serial bodies constituting the U-phase arm, V-phase arm, and W-phase arm in the inverter circuit. Therefore, in this example, the laminated body 4 includes the three semiconductor modules 2 and the four refrigerant flow paths 3.
Each semiconductor module 2 includes three main electrode terminals 21. One of the main electrode terminals 21 is connected to the positive bus bar 13p (see FIGS. 1, 3, and 7), and the other is connected to the negative bus bar 13n (see FIGS. 1, 3, and 7). The other one is connected to the AC bus bar 120 as shown in FIG.

The main electrode terminal 21 connected to the AC bus bar 120 is disposed on one end of the three main electrode terminals 21 and is disposed on one end side in the lateral direction Y. Then, the AC bus bar 120 linearly extends from the main electrode terminal 21 arranged on one end side in the lateral direction Y to one end side in the lateral direction Y, and the tip portion constitutes the output terminal 12.
Others are the same as in the first embodiment.

In the case of this example, the number of semiconductor modules 2 can be reduced, and the shape of the AC bus bar 120 can be further simplified. Therefore, it is possible to provide the power conversion device 1 that can be made more compact.
In addition, the same effects as those of the first embodiment are obtained.

(Example 3)
This example is an example of the power conversion device 1 in which a pair of input terminals 11 are drawn in a direction opposite to the protruding direction of the refrigerant introduction pipe 331 and the refrigerant discharge pipe 332 as shown in FIG.
In this example, the protruding direction of the refrigerant introduction pipe 331 and the refrigerant discharge pipe 332 is opposite to the stacking direction X with respect to the power conversion device 1 shown in the first embodiment.
Others are the same as in the first embodiment.

In the case of this example, the pair of input terminals 11 is not arranged between the refrigerant introduction pipe 331 and the refrigerant discharge pipe 332 or using the dead space beside these, but the three output terminals 12 are not provided. And the pair of input terminals 11 can be prevented from being arranged in the stacking direction X, so that the dimension of the power conversion device 1 in the stacking direction X can be suppressed.
In addition, the same effects as those of the first embodiment are obtained.

Example 4
In this example, as shown in FIG. 13, the refrigerant introduction pipe 331 and the refrigerant discharge pipe 332 are formed so as to protrude in opposite directions from one end and the other end in the stacking direction X in the stacked body 4.
The pair of input terminals 11 are drawn out in the same direction as the protruding direction of the refrigerant introduction pipe 331.
Others are the same as in the first embodiment.

In the case of this example, in the power conversion device 1 in which the refrigerant introduction pipe 331 and the refrigerant discharge pipe 332 protrude in opposite directions, the physique can be made compact. That is, with the arrangement as described above, the input terminal 11 can be arranged by effectively using the dead space formed on the side of the refrigerant introduction pipe 331 or the like. As a result, the power converter 1 can be easily made compact.
In addition, the same effects as those of the first embodiment are obtained.

  In this example, the pair of input terminals 11 can be pulled out in the same direction as the direction in which the refrigerant discharge pipe 332 protrudes, not in the direction in which the refrigerant introduction pipe 331 protrudes. Even in this case, the same effect can be obtained.

DESCRIPTION OF SYMBOLS 1 Power converter 11 Input terminal 12 Output terminal 2 Semiconductor module 21 Main electrode terminal 3 Refrigerant flow path 4 Laminated body 5 Capacitor X Lamination direction

Claims (8)

A laminate comprising a plurality of semiconductor modules constituting a part of the power conversion circuit and a plurality of refrigerant flow paths for cooling the semiconductor modules, and a capacitor electrically connected to the semiconductor module. A power conversion device configured to convert DC power input from a pair of input terminals and output from a plurality of output terminals as AC power,
The pair of electrodes of the capacitor are electrically connected to the pair of input terminals, respectively.
The output terminal is drawn out in the same direction orthogonal to both the stacking direction of the stacked body and the protruding direction of the main electrode terminal of the semiconductor module,
The power converter according to claim 1, wherein the input terminal is drawn out in the same direction as the stacking direction of the stacked body.   2. The power conversion device according to claim 1, wherein a refrigerant introduction pipe that introduces a cooling medium into the plurality of refrigerant flow paths and a refrigerant discharge pipe that discharges the cooling medium from the plurality of refrigerant flow paths in the laminate. The power conversion device, wherein the power conversion device is formed so as to protrude in the same direction from one end in the stacking direction, and the pair of input terminals are drawn out in the same direction as the protruding direction of the refrigerant introduction pipe and the refrigerant discharge pipe.   2. The power conversion device according to claim 1, wherein a refrigerant introduction pipe that introduces a cooling medium into the plurality of refrigerant flow paths and a refrigerant discharge pipe that discharges the cooling medium from the plurality of refrigerant flow paths in the laminate. The power conversion device, wherein the power conversion device is formed so as to protrude in the same direction from one end in the stacking direction, and the pair of input terminals are drawn out in a direction opposite to a protruding direction of the refrigerant introduction pipe and the refrigerant discharge pipe.   2. The power conversion device according to claim 1, wherein a refrigerant introduction pipe that introduces a cooling medium into the plurality of refrigerant flow paths and a refrigerant discharge pipe that discharges the cooling medium from the plurality of refrigerant flow paths in the laminate. Projecting in opposite directions from one end and the other end in the stacking direction, the pair of input terminals are drawn out in the same direction as the protruding direction of the refrigerant introduction pipe or the protruding direction of the refrigerant discharge pipe. The power converter characterized by the above-mentioned.   The power converter according to any one of claims 1 to 4, wherein the pair of input terminals are terminals integrated with the capacitor.   6. The power conversion device according to claim 1, further comprising a pair of DC bus bars connected to the main electrode terminal of the semiconductor module and connected to the input terminal, and the bus bar of the DC bus bar. The power conversion, wherein the terminal and the input terminal are pulled out overlapping each other in a terminal block provided in the power converter, and are configured to be fastened to the terminal block by bolts apparatus.   7. The power conversion device according to claim 1, wherein the plurality of output terminals are provided at the other ends of the plurality of AC bus bars, one end of which is connected to the main electrode terminal of the plurality of semiconductor modules. The AC bus bar is drawn out so as to extend in a direction orthogonal to both the stacking direction and the protruding direction of the main electrode terminal.   The power converter according to any one of claims 1 to 7, wherein the power converter is configured to convert input DC power into AC power without stepping up or down.

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