JP4900202B2 - Power converter - Google Patents

Description

  The present invention relates to a power conversion device including a cooling means for a semiconductor module constituting a power conversion circuit.

Conventionally, a power conversion circuit such as a DC-DC converter circuit or an inverter circuit is sometimes used to generate a drive current for energizing an AC motor that is a power source of an electric vehicle or a hybrid vehicle.
In general, in an electric vehicle, a hybrid vehicle, and the like, a large driving current is required to secure a large driving torque from an AC motor.
Therefore, in the power conversion circuit that generates a drive current for the AC motor, heat generated from a semiconductor module including a power semiconductor element such as an IGBT constituting the power conversion circuit tends to increase.

  Therefore, as shown in FIG. 20, a large number of cooling pipes 922 are provided between a pair of headers 923 responsible for supplying and discharging the refrigerant so that the plurality of semiconductor modules 921 constituting the power conversion circuit can be uniformly cooled. An arranged power conversion device 9 has been proposed (see Patent Document 1). The power conversion device 9 includes a semiconductor laminated unit 92 having a semiconductor module 921 sandwiched between cooling pipes 922, and a spring that pressurizes the semiconductor laminated unit 92 in the lamination direction at an end portion of the semiconductor laminated unit 92 in the lamination direction. Member 931.

  The spring member 931 is in contact with the main surface 920 of the cooling pipe 922 that forms the end surface in the stacking direction of the semiconductor stacking unit 92 via the contact plate 932. Thereby, the pressing force by the spring member 931 acts on the main surface 920 of the cooling pipe 922.

  However, the conventional power converter 9 has the following problems. That is, since the contact plate 932 and the spring member 931 are separate bodies, it is necessary to assemble the spring plate 931 and the power conversion device 9 while overlapping them so that the spring member 931 does not fall off the contact plate 932. Therefore, there is a problem that the contact plate 932 and the spring member 931 cannot be easily assembled.

  Further, since the spring member 931 is not fixed to the contact plate 932, the spring member 931 may be disposed at a position deviated from a predetermined position, which makes it difficult to position the spring member 931. There's a problem.

  Furthermore, if the bending rigidity of the contact plate 932 is insufficient, the contact plate 932 pressed by the spring member 931 may be warped around the contact portion with the spring member 931. For this reason, it may be difficult to press the semiconductor multilayer unit 92 uniformly in the stacking direction. For this reason, it may be difficult to sufficiently transfer heat from the semiconductor module 92 to the cooling pipe 922 by bringing the semiconductor module 92 and the cooling pipe 922 into surface contact to ensure adhesion between the two. As a result, it may be difficult to sufficiently cool the semiconductor module 921.

JP 2005-143244 A

  The present invention has been made in view of such conventional problems, and provides a power conversion device that can easily assemble a pressure member and position a spring member and can sufficiently cool a semiconductor module. It is what.

The present invention is a power conversion device having a semiconductor laminated unit formed by alternately laminating a semiconductor module constituting a part of a power conversion circuit and a cooling pipe for cooling the semiconductor module,
A pressure member that pressurizes the semiconductor lamination unit in the lamination direction is disposed at an end of the semiconductor lamination unit in the lamination direction,
The pressure member includes a contact plate that contacts an end portion in the stacking direction of the semiconductor stacked unit, and a spring member that presses the contact plate toward the semiconductor stacked unit.
The contact plate includes a front surface portion that contacts the main surface of the cooling pipe, a pair of ribs formed in a direction away from the semiconductor stacked unit at both ends in the width direction of the front surface portion, and the pair of ribs. A rear support part that is formed from at least one of the two toward the other and supports the spring member is configured integrally.
The spring member may be held between the front portion, the pair of ribs, and the rear support portion (Claim 1).

Next, the effects of the present invention will be described.
The spring member is held between the front surface portion, the pair of ribs, and the rear support portion. By holding the spring member on the contact plate in this way, it is possible to prevent the spring member from falling off the contact plate. Thereby, since the pressurization member formed by integrating the spring member and the contact plate can be assembled to the power conversion device, the pressurization member can be easily assembled.
In addition, by restricting the back and forth movement of the spring member by the rear support portion, it is possible to suppress the spring member from swinging with respect to the contact plate. As a result, the spring member can be easily positioned.

  And the said contact plate comprises the said front part, the said pair of rib, and the said back support part integrally. That is, the rear support part is constituted by a part of the contact plate. Therefore, in forming the rear support portion, there is no need to fix another member to the contact plate. For example, the rear support portion can be formed by bending a single plate-like body. it can. Therefore, the number of parts of the pressure member can be reduced, the manufacturing process can be simplified, and the manufacturing cost can be reduced.

  The contact plate is provided with the pair of ribs. That is, the contact plate has improved bending rigidity by the rib. Therefore, even when pressed by the elastic force of the spring member, the contact plate can be prevented from warping. Therefore, the semiconductor stacked unit can be uniformly pressed in the stacking direction over the entire surface by the front surface portion of the contact plate. Thereby, the semiconductor module and the cooling pipe can be brought into surface contact with each other and sufficiently adhered, and heat can be sufficiently transferred from the semiconductor module to the cooling pipe. As a result, the semiconductor module can be sufficiently cooled.

  As described above, according to the present invention, it is possible to provide a power conversion device that can easily assemble a pressing member and position a spring member and can sufficiently cool a semiconductor module.

In the present invention (Claim 1), examples of the power converter include a DC-DC converter and an inverter. Moreover, the said power converter device can be used for the production | generation of the drive current which supplies with electricity to the alternating current motor which is motive power sources, such as an electric vehicle and a hybrid vehicle, for example.
In addition, the said semiconductor module and the said cooling pipe may be closely_contact | adhered directly, and may be closely_contact | adhered via an insulating material etc.
Moreover, in this specification, the direction in which the said pressurizing member presses the said semiconductor lamination unit is called the front, and the other side is called back.

Moreover, it is preferable that the said back support part has a back convex part protruded to the said spring member side (Claim 2).
In this case, the rocking | fluctuation of the front-back direction with respect to the contact plate of a spring member can be prevented easily and reliably. For example, when the rear support portion is formed by bending from the rib, the spring member can be sufficiently supported by providing the rear protrusion even if the rear support portion is not sufficiently bent.

The rear support portion includes a convex portion forming portion that forms the rear convex portion, and a bent connecting portion that connects and bends the convex portion forming portion and the rib, and the convex portion The width of the forming portion is preferably larger than the width of the bent connecting portion.
In this case, the rear support portion can be easily formed, and the rear convex portion can be easily formed. That is, by making the width of the convex portion forming portion relatively large, the rear convex portion can be easily formed on the convex portion forming portion, and the width of the bent connecting portion is made relatively small. Accordingly, the rear support portion can be easily bent at the bent connecting portion.

The rear support portion extends from only one rib of the pair of ribs, and the other rib has an inward protruding portion that protrudes from a surface of the rib facing the one rib. It is preferable that the spring member is disposed at a position between the inward convex portion and the front surface portion.
In this case, the spring member can be more stably held on the contact plate.

Further, it is preferable that the other rib has an extending portion that extends further rearward than the other portion around the formation portion of the inward convex portion.
In this case, the inward convex portion can be easily formed.

Moreover, the said back support part may be extended from both of said pair of ribs (Claim 6).
In this case, the spring member can be held on the contact plate by the two rear support portions.

In addition, it is preferable that at least one of the pair of ribs is formed with a flange portion extending in a direction away from the other rib.
In this case, the work of assembling the pressurizing member to the power converter can be easily performed.
For example, when the pressurizing member is assembled inside the power conversion device, the pressing member can be handled by gripping the collar portion, and the assembly can be easily performed. In particular, when automating the assembly of the power conversion device, the robot or the like can easily carry the pressurizing member, assemble it, etc. by gripping the collar.
Or the said collar part can also be used as a positioning means for positioning the said pressurization member in the positioning jig used when, for example, the said pressurization member is assembled | attached to a power converter device.

Moreover, it is preferable that the said collar part is formed in both of said pair of ribs (Claim 8).
In this case, the work of assembling the pressure member to the power converter can be performed more easily.
That is, for example, by using the collar provided on one rib as the gripping means described above and the collar provided on the other rib as the positioning means described above, the pressure member can be easily and accurately powered. Can be assembled to the conversion device.

Moreover, the said back support part can also be extended from the one rib of said pair of ribs to the position exceeding the other rib (Claim 9).
In this case, a portion of the rear support portion that exceeds the other rib can have the same function as the collar portion.

In addition, the spring member includes a plurality of leaf spring portions and a joining member for joining the plurality of leaf spring portions, and the joining member is provided on the front portion side of the spring member. It is preferable to have a front projecting portion projecting on the surface, and the front projecting portion is inserted and disposed in a front hole formed in the front surface portion.
In this case, the spring member and the contact plate can be easily and reliably positioned in the width direction and the length direction.

Moreover, the said joining member has the back protrusion part which protruded in the surface on the opposite side to the said front part in the said spring member, and the said back support part is comprised so that the said back protrusion part may be supported from back. (Claim 11).
Also in this case, the spring member can be easily and reliably held on the contact plate.

Example 1
A power converter according to an embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the power conversion device 1 of this example is a semiconductor stacked unit formed by alternately stacking semiconductor modules 21 constituting a part of a power conversion circuit and cooling pipes 22 for cooling the semiconductor modules 21. 2
A pressure member 3 that pressurizes the semiconductor multilayer unit 2 in the stacking direction is disposed at an end of the semiconductor stack unit 2 in the stacking direction.

As shown in FIGS. 2 to 4, the pressing member 3 includes a contact plate 32 that contacts an end portion in the stacking direction of the semiconductor stacked unit 2 and a spring member that presses the corresponding contact plate 32 toward the semiconductor stacked unit 2. 31.
The contact plate 32 includes a front surface portion 320 that contacts the main surface of the cooling pipe 22, a pair of ribs 321 formed in a direction away from the semiconductor multilayer unit 2 at both ends in the width direction of the front surface portion 320, and the pair A rear support portion 322 that is formed from one of the ribs 321 toward the other and supports the spring member 31 is integrally configured.
The spring member 31 is held between the front surface portion 320, the pair of ribs 321, and the rear support portion 322 in the contact plate 32.

  As shown in FIG. 4, the rear support portion 322 has a rear protrusion 323 that protrudes toward the spring member 31. The rear convex portion 323 is formed by embossing a part of the rear support portion 322 from a surface opposite to the spring member 31 to a surface on the spring member 31 side. For example, the protruding amount of the rear protrusion 323 can be approximately equal to or less than the thickness of the rear support 322, that is, approximately 2 mm or less.

  As shown in FIG. 3 and FIG. 8, the rear support part 322 includes a convex part forming part 324 that forms the rear convex part 323, and a bent connection that connects and bends the convex part forming part 324 and the rib 321. Part 325. The width of the convex portion forming portion 324 is larger than the width of the bent connecting portion 325. That is, the convex portion forming part 324 has a substantially circular shape, and its diameter is larger than the width of the bent forming part 325. Further, the rear convex portion 323 is formed at a substantially central position of the convex portion forming portion 324.

  As shown in FIG. 4, the rear support portion 322 extends from only one rib 321 a of the pair of ribs 321. Further, the other rib 321b has an inward protruding portion 326 that protrudes from the surface of the rib 321b facing the one rib 321a. The spring member 31 is disposed at a position between the inward convex portion 326 and the front surface portion 320. The protruding amount of the inward convex portion 326 can also be set to be approximately equal to or less than the thickness of the rib 321, that is, approximately 2 mm or less.

As shown in FIG. 5, the rib 321 b has an extending portion 327 that extends further rearward than the other portions around the portion where the inward convex portion 326 is formed.
As shown in FIGS. 2 to 4, one rib 321 a is formed with two flange portions 33 a extending in a direction away from the other rib 321 b. The flange portion 33 a is also formed by bending a part of the rib 321 a and is integrally formed with the contact plate 32.

The other rib 321b is also formed with a flange portion 33b extending in a direction away from the one rib 321a. The flanges 33b are also formed at two locations, and are formed integrally with the contact plate 32 as a part of the rib 321b.
Therefore, the flange portions 33 a and 33 b have the same thickness as the rib 321 and the front surface portion 320.

Further, as shown in FIGS. 1, 2, and 9, the spring member 31 has a central portion curved toward the front surface 320 side of the contact plate 32.
As shown in FIGS. 4 and 9, the spring member 31 is formed by superimposing a front leaf spring 311 and a rear leaf spring 312, and a joining member for joining the front leaf spring 311 and the rear leaf spring 312. 315. The joining member 315 has a rear protrusion 313 protruding on the surface opposite to the front surface 320 and a front protrusion 314 protruding on the surface on the front surface 320 side.

  As shown in FIGS. 2 and 3, the rear support 322 is formed so as not to interfere with the rear protrusion 313. Further, as shown in FIGS. 4 and 9, the front protruding portion 314 is inserted into the front hole portion 35 formed in the front surface portion 320. Note that the amount of protrusion of the front protrusion 314 is equal to or less than the thickness of the contact plate 32.

  When the pressure member 3 is obtained by assembling the spring member 31 to the contact plate 32, first, the state shown in FIGS. 6 to 8, that is, the state where the rear support 322 is on the same plane as the rib 321. With respect to the plate 32, the spring member 31 is disposed between the front surface portion 320, the pair of ribs 321, and the inward convex portion 326. At this time, the front protruding portion 314 of the spring member 31 is disposed in the front hole portion 35 formed in the front surface portion 320 of the contact plate 32. In addition, as shown in FIG. 8, the notch part 329 is formed in the rib 321a in the both sides of the base of the bending | flexion connection part 325 of the back support part 322. As shown in FIG. The notch 329 makes it easy to bend the rear support 322.

Next, as shown in FIGS. 2 to 4, the rear support portion 322 is bent so as to be substantially perpendicular to the rib 321. At this time, the rear support portion 322 is bent at the bent connecting portion 325.
As a result, the spring member 31 is held between the front surface portion 320, the pair of ribs 321, the inward convex portion 326, and the rear support portion 322 in the contact plate 32, and is not detached from the contact plate 32.
Thus, the pressure member 3 can be obtained.

  As shown in FIG. 1, both end portions of the rear leaf spring 312 in the length direction of the spring member 31 are engaged with two fixing pins 11 fixed in the case 10 of the power conversion device 1. The pressure member 3 is disposed at one end of the semiconductor multilayer unit 2 with the spring member 31 biased in the direction of expanding in the front-rear direction between the fixing pin 11 and the semiconductor multilayer unit 2. The stacking unit 2 is pressed in the stacking direction.

The power conversion device 1 is, for example, a DC-DC converter or an inverter. And the power converter device 1 can be used for the production | generation of the drive current which supplies with electricity the alternating current motor which is motive power sources, such as an electric vehicle and a hybrid vehicle, for example.
In addition to the semiconductor laminated unit 2, the power conversion device 1 includes a control board (not shown) that inputs a control signal to the semiconductor module 21, a power circuit (not shown) that includes a capacitor, a reactor, and the like.

  As shown in FIG. 1, the semiconductor lamination unit 2 is formed by alternately laminating a plurality of semiconductor modules 21 and cooling pipes 22, and both ends of each cooling pipe 22 are connected to a refrigerant supply header 232 for supplying refrigerant and refrigerant. It is a unit having a multilayer structure that communicates with a refrigerant discharge header 233 that performs discharge. In this example, two semiconductor modules 21 are arranged in parallel between the cooling pipes 22 stacked side by side.

  The cooling pipe 22 of this example includes, for example, water mixed with ethylene glycol antifreeze, natural refrigerants such as water and ammonia, fluorocarbon refrigerants such as fluorinate, chlorofluorocarbon refrigerants such as HCFC123 and HFC134a, methanol, and the like. It is a tube having a hollow portion through which a refrigerant such as an alcohol refrigerant such as alcohol and a ketone refrigerant such as acetone flows.

As shown in FIG. 1, the refrigerant supplied from the refrigerant inlet 231 to the cooling pipe 22 via the supply side connecting pipe 232 passes through the cooling pipe 22 and the insulating material when passing through the cooling pipe 22. Heat is received from a heat radiating plate (not shown) of the semiconductor module 21 provided so as to be in surface contact. Then, the heat-received refrigerant further passes through the cooling pipe 22, flows toward the refrigerant outlet 234 via the discharge side connecting pipe 233, and is discharged therefrom.
Thus, in the semiconductor laminated unit 2, the semiconductor module 21 is cooled by circulating the refrigerant in the cooling pipe 22 and exchanging heat with the semiconductor element.
As described above, the pressing member 3 including the contact plate 32 and the spring member 31 is disposed at the end in the stacking direction of the semiconductor stacking unit 2 as shown in FIG.

Next, the function and effect of this example will be described.
The spring member 31 is held between the front surface portion 320, the pair of ribs 321, and the rear support portion 322. By holding the spring member 31 on the contact plate 32 in this way, it is possible to prevent the spring member 31 from falling off the contact plate 32. Thereby, since the pressurization member 3 formed by integrating the spring member 31 and the contact plate 32 can be assembled to the power converter 1, the pressurization member 3 can be easily assembled.
Further, the back support portion 322 restricts the spring member 31 from moving back and forth, whereby the spring member 31 can be prevented from swinging with respect to the contact plate 32. As a result, the spring member 1 can be easily positioned.

  The contact plate 32 is configured by integrally forming a front surface portion 320, a pair of ribs 321, and a rear support portion 322. That is, the rear support part 322 is configured by a part of the contact plate 32. Therefore, when forming the rear support portion 322, there is no need to fix another member to the contact plate 32, and the rear support portion 322 can be formed by bending a single plate-like body. . Therefore, the number of parts of the pressure member 3 can be reduced, the manufacturing process can be simplified, and the manufacturing cost can be reduced.

  The contact plate 32 is provided with a pair of ribs 321. Here, since the bending rigidity of the contact plate 32 is increased by the ribs 321, the contact plate 32 can be prevented from warping even when pressed by the elastic force of the spring member 31. Therefore, the semiconductor stacked unit 2 can be uniformly pressed in the stacking direction over the entire surface by the front surface portion 320 of the contact plate 32. Thereby, the semiconductor module 21 and the cooling pipe 22 can be brought into surface contact and sufficiently adhered. Therefore, heat can be sufficiently transferred from the semiconductor module 21 to the cooling pipe 22. As a result, the semiconductor module 21 can be sufficiently cooled.

  Moreover, since the back support part 322 has the back convex part 323, the rocking | fluctuation of the front-back direction with respect to the contact plate 32 of the spring member 31 can be prevented easily and reliably. When the rear support portion 322 is bent from the rib 321, the spring member 31 can be sufficiently supported by providing the rear protrusion 323 even if the rear support portion 322 is not sufficiently bent. That is, the rear support portion 322 is formed by bending a part of the contact plate 32. If the contact plate 32 has a thickness of, for example, about 2 mm or more, the rear support portion 322 is sufficiently bent. May be difficult to do. Therefore, by providing the rear convex portion 323 on the rear support portion 322, the spring member 31 can be supported by the rear convex portion 323, and the spring member 31 swings back and forth in the contact plate 32. Can be effectively suppressed.

  Further, the rear support part 322 has a convex part forming part 324 and a bent connecting part 325, and the width of the convex part forming part 324 is larger than the width of the bent connecting part 325. Therefore, the rear support part 322 can be easily formed, and the rear convex part 323 can be easily formed. That is, by making the width of the convex portion forming portion 324 relatively large, the rear convex portion 323 can be easily formed on the convex portion forming portion 324, and the width of the bent connecting portion 325 is made relatively small. Accordingly, the rear support part 322 can be easily bent at the bent connection part 325.

The rib 321 b on the side where the rear support portion 322 is not formed has an inward convex portion 326, and the spring member 31 is disposed at a position between the inward convex portion 326 and the front surface portion 320. . Thereby, the spring member 31 can be more stably held on the contact plate 32.
Moreover, since the rib 321 provided with the inward convex portion 326 has the extending portion 327 around the portion where the inward convex portion 326 is formed, the inward convex portion 326 can be easily formed.

  In addition, since the flange portion 321a is formed on the rib 321a on the side where the rear support portion 322 is provided, when the pressure member 3 is assembled inside the power conversion device 1, the flange portion 33a is gripped and pressurized. The member 3 can be handled and can be easily assembled. In particular, when the assembly of the power converter 1 is automated, the pressure member 3 can be easily transported, assembled, and the like by a robot or the like holding the flange 33a.

Further, the flange portion 33b formed on the other rib 321b serves as positioning means for positioning the pressing member 3 on a positioning jig (not shown) used when the pressing member 3 is assembled to the power converter 1. Can be used.
That is, by using the flange 33a provided on one rib 321a as the above-described gripping means and using the flange 33b provided on the other rib 321b as the above-described positioning means, the pressing member 3 can be easily and The power converter 1 can be accurately assembled.

  Further, the spring member 31 has a front protrusion 314 formed by a bonding member 315 for bonding a plurality of leaf springs, and the front protrusion 314 is formed on the front surface 320 of the contact plate 32. The front hole 35 is inserted and arranged. For this reason, the spring member 31 and the contact plate 32 can be easily and reliably positioned in the width direction and the length direction.

  As described above, according to this example, it is possible to provide a power conversion device that can easily assemble the pressure member and position the spring member and sufficiently cool the semiconductor module.

(Example 2)
In this example, as shown in FIGS. 10 and 11, the rear support portion 322 extends from one rib 321 b of the pair of ribs 321 to a position exceeding the other rib 321 a.
The rear support portion 322 of this example is formed wider than that shown in the first embodiment, and an opening 328 is formed near the center thereof. A rearward protruding portion 313 of the spring member 31 is disposed in the opening 328.
Others are the same as in the first embodiment.

In the case of this example, the portion 34 beyond the other rib 321b of the rear support portion 322 can have the same function as the flange portion 33a in the first embodiment. Therefore, the flange portion 33a is not formed on the contact plate 32 in this example.
In addition, the same effects as those of the first embodiment are obtained.

Example 3
In this example, as shown in FIGS. 12 and 13, the rear support portion 322 extends from both of the pair of ribs 321.
That is, the pair of rear support members 322 are formed so as to face each other from the pair of ribs 321 to a position close to the rear protrusion 313 of the spring member 31.
In this example, the flange 33a is formed as in the first embodiment.
Others are the same as in the second embodiment.

In the case of this example, the spring member 31 can be held on the contact plate 32 by the two rear support portions 322.
In addition, the same effects as those of the first embodiment are obtained.

Example 4
In this example, as shown in FIGS. 14 to 16, the rear support portion 322 supports the rear protrusion 313 of the joining member 315 from behind, thereby holding the spring member 31 in the contact plate 32. .
That is, the rear support portion 322 extends to the rear position in the spring member 31. Further, the rear protrusion 313 is preferably in contact with the rear support 322.
Moreover, in this example, unlike Example 1, the rear support part 322 is not provided with a rear convex part (see reference numeral 323 in FIG. 4).
Others are the same as in the first embodiment.
Also in the case of this example, the spring member 31 can be easily and reliably held on the contact plate 32, and the same effects as those of the first embodiment can be obtained.

(Example 5)
As shown in FIGS. 17 to 19, this example has a configuration in which the rear support portion 322 supports the rear protrusion 313 of the joining member 315 from the rear as in the fourth embodiment, while the inner convex portion (FIG. 14). To the reference numeral 326 in FIG. 17).
Others are the same as in the fourth embodiment.
Also in the case of this example, the spring member 31 can be easily and reliably held on the contact plate 32, and the same effects as those of the fourth embodiment can be achieved.

Sectional explanatory drawing of the power converter device in Example 1. FIG. 3 is a perspective view of a pressure member in Embodiment 1. FIG. FIG. 3 is a rear view of the pressure member in the first embodiment. FIG. 4 is a cross-sectional view taken along line AA in FIG. 3. FIG. 3 is an explanatory diagram of a rib on the side where the inward convex portion of the contact plate is formed in the first embodiment. The perspective view of the contact plate in Example 1 before bending a back support part. FIG. 7 is a cross-sectional view taken along line B-B in FIG. 6. Plane explanatory drawing of the back support part in Example 1 before bending. 2 is a cross-sectional view of a pressure member in Embodiment 1. FIG. The rear view of the pressurization member in Example 2. FIG. FIG. 11 is a cross-sectional view taken along line CC in FIG. 10. The rear view of the pressurization member in Example 3. FIG. The DD sectional view taken on the line of FIG. FIG. 10 is a perspective view of a pressure member in Embodiment 4. The rear view of the pressurization member in Example 4. FIG. FIG. 16 is a cross-sectional view taken along line EE in FIG. 15. FIG. 10 is a perspective view of a pressure member in Embodiment 5. The rear view of the pressurizing member in Example 5. FIG. FIG. 19 is a cross-sectional view taken along line FF in FIG. 18. Sectional explanatory drawing of the power converter device in a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Power converter 2 Semiconductor laminated unit 21 Semiconductor module 22 Cooling pipe 220 Main surface 3 Pressurizing member 31 Spring member 32 Contact plate 320 Front surface part 321 Rib 322 Back support part

Claims (11)

A power conversion device having a semiconductor stacked unit formed by alternately stacking a semiconductor module constituting a part of a power conversion circuit and a cooling pipe for cooling the semiconductor module,
A pressure member that pressurizes the semiconductor lamination unit in the lamination direction is disposed at an end of the semiconductor lamination unit in the lamination direction,
The pressure member includes a contact plate that contacts an end portion in the stacking direction of the semiconductor stacked unit, and a spring member that presses the contact plate toward the semiconductor stacked unit.
The contact plate includes a front surface portion that contacts the main surface of the cooling pipe, a pair of ribs formed in a direction away from the semiconductor stacked unit at both ends in the width direction of the front surface portion, and the pair of ribs. A rear support part that is formed from at least one of the two toward the other and supports the spring member is configured integrally.
The power conversion device according to claim 1, wherein the spring member is held between the front portion, the pair of ribs, and the rear support portion.   The power converter according to claim 1, wherein the rear support portion has a rear convex portion protruding toward the spring member.   In Claim 2, the back support portion has a convex portion forming portion that forms the rear convex portion, and a bent connecting portion that is connected and bent between the convex portion forming portion and the rib, The width | variety of the said convex part formation part is larger than the width | variety of the said bending connection part, The power converter device characterized by the above-mentioned.   In any 1 paragraph of Claims 1-3, the above-mentioned back support part is extended from only one rib of the above-mentioned pair of ribs, and the other rib is the above-mentioned one rib in the above-mentioned rib It has an inward convex part which protruded in the counter surface, and the above-mentioned spring member is arranged in the position between the above inward convex part and the above-mentioned front part.   5. The power conversion device according to claim 4, wherein the other rib has an extending portion extending further rearward than the other portion around the forming portion of the inward convex portion.   The power converter according to claim 1, wherein the rear support portion is extended from both of the pair of ribs.   The power conversion device according to any one of claims 1 to 6, wherein a flange extending in a direction away from the other rib is formed on at least one of the pair of ribs. .   The power conversion device according to claim 7, wherein the flange portion is formed on both of the pair of ribs.   8. The power conversion device according to claim 1, wherein the rear support portion extends from one rib of the pair of ribs to a position exceeding the other rib.   The spring member according to any one of claims 1 to 9, wherein the spring member is formed by overlapping a plurality of leaf spring portions, and has a joining member for joining the plurality of leaf spring portions, And a front projecting portion projecting from a surface of the spring member on the front surface side, and the front projecting portion is inserted and disposed in a front hole formed in the front surface portion. apparatus.   11. The joining member according to claim 10, wherein the joining member has a rear projecting portion projecting on a surface of the spring member opposite to the front surface portion, and the rear support portion supports the rear projecting portion from the rear. The power converter characterized by being made.

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