JP2015015864A - Power conversion device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power conversion device capable of being easily miniaturized in an alignment direction of a bearing body.SOLUTION: A power conversion device 1 includes: a semiconductor lamination unit 2 formed by laminating a semiconductor module 21 and a cooling pipe 22 for cooling the semiconductor module 21; and a frame 3 in which the semiconductor lamination unit 2 is arranged. A pressurizing member 4 for pressurizing the semiconductor lamination unit 2 in a lamination direction is provided inside of the frame 3. A pair of bearing bodies 5 are arranged between the pressurizing member 4 and an inner wall face 31 of the frame 3. The pressurizing member 4 has a plate spring member 41. The plate spring member 41 is formed of a pressurizing portion 411 curved so as to project the side of the semiconductor lamination unit 2, a pair of bearing portions 412 curved so as to project an opposite side to the semiconductor lamination unit 2 in both ends of the pressurizing portion 411, and a pair of extension portions 413 extending in an opposite side to the pressurizing portion 411 from the bearing portions 412. The bearing bodies 5 are interposed between the bearing portion 412 and the inner wall face 31 of the frame 3.

Description

  The present invention relates to a power conversion device including a pressing member that presses a semiconductor stacked unit in a stacking direction.

  Some power conversion devices such as converters and inverters include a semiconductor laminated unit in which a semiconductor module and a cooling pipe for cooling the semiconductor module are laminated. A pressure member for pressing the semiconductor multilayer unit in the stacking direction is disposed at the end of the semiconductor stacking unit in the stacking direction. The semiconductor laminated unit and the pressure member are disposed in the frame.

  The leaf spring member used for the pressure member includes a pressing portion curved so as to protrude toward the semiconductor lamination unit side, and a pair of support portions curved so as to protrude toward the semiconductor lamination unit side at both ends of the pressing portion. Have. A support body is disposed between the pair of support portions and the frame. Thereby, the leaf | plate spring member is supported in the pair of support part from the opposite side to the semiconductor lamination unit, and is pressing the semiconductor lamination unit by the press part (patent document 1).

When assembling the power conversion device, first, a leaf spring member is disposed in the frame together with the semiconductor laminated unit.
Next, a pressing jig is brought into contact with the pair of leaf spring ends of the leaf spring member to push the leaf spring member toward the semiconductor laminated unit. Accordingly, the pair of support bodies are arranged in the frame at the rear position of the pair of support portions in a shape in which the leaf spring member is elastically deformed.
Then, the leaf spring member is held in a state where the support body is held between the support portion and the inner wall of the frame by reversing the pressing jig and displacing the pair of support portions in a direction in which the plate spring member is restored. Let the base support. In this way, a power conversion device in which the semiconductor lamination unit is pressurized in the lamination direction by the leaf spring member is obtained.

JP 2009-27805 A

However, in order to secure the region where the pressing jig abuts at the end portion of the leaf spring as described above, it is necessary to dispose both ends of the leaf spring member sufficiently to the side of the support body. Therefore, the longitudinal dimension of the leaf spring member is increased, and it is difficult to reduce the size of the power converter in this direction.
Here, simply shortening the pressing portion and shortening the distance between the pair of support portions changes the spring characteristics of the leaf spring member. Therefore, it is difficult to reduce the distance between the pair of support portions in order to reduce the size of the power converter.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a power conversion device that facilitates downsizing in the direction in which the support bodies are arranged.

One aspect of the present invention is a semiconductor laminated unit formed by laminating a semiconductor module constituting a part of a power conversion circuit and a cooling pipe for cooling the semiconductor module;
A frame on which the semiconductor multilayer unit is disposed, and
Inside the frame, a pressure member disposed at an end portion in the stacking direction of the semiconductor stacking unit and pressing the semiconductor stacking unit in the stacking direction;
A pair of support bodies disposed between the pressure member and the inner wall surface of the frame,
The pressurizing member has a leaf spring member,
The leaf spring member includes a pressing portion curved so as to protrude toward the semiconductor multilayer unit side, a pair of support portions curved so as to protrude opposite to the semiconductor multilayer unit at both ends of the pressing portion, and the support A pair of extending portions extending from the portion to the opposite side to the pressing portion,
The said support body exists in the power converter device interposed between the said support part and the inner wall face of the said flame | frame.

  In the leaf spring member, the pair of support portions supported by the support body are curved so as to protrude to the opposite side of the semiconductor laminated unit at both ends of the pressing portion. Therefore, the distance between the pair of support portions can be shortened as compared to the case where the support portions curved so as to protrude toward the semiconductor multilayer unit are formed. As a result, even if the extending portion is not lengthened, it is easy to sufficiently secure a region projecting outside the pair of support bodies in the plate spring member in the direction in which the pair of support bodies are arranged. That is, when assembling the power conversion device, when the both ends of the leaf spring member are pushed and elastically deformed from the outside of the pair of support bodies by the pressing jig, the extension portion that can contact the pressing jig The length of the leaf spring member can be shortened while ensuring a sufficient area. Thereby, it becomes possible to reduce the size of the power converter in the direction in which the support bodies are arranged.

  In addition, since the pair of support parts are curved at both ends of the pressing part so as to protrude to the opposite side of the semiconductor laminated unit, the length between the support parts is shortened without shortening the length of the pressing part. can do. Therefore, it is possible to prevent difficulty in adjusting the spring constant of the leaf spring member.

  As described above, according to the present invention, it is possible to provide a power conversion device that can be easily downsized in the direction in which the support bodies are arranged.

The top view of the power converter device in Example 1. FIG. The perspective view of the leaf | plate spring member and support body in Example 1. FIG. Explanatory drawing of the manufacturing method of the power converter device in Example 1. FIG. Explanatory drawing of the support body in Example 2. FIG. The top view of the rear end of the power converter device in Example 3. FIG.

  Examples of the power converter include a converter and an inverter. Moreover, the said power converter device can be used for the production | generation of the drive current which supplies with electricity to the alternating current motor which is power sources, such as an electric vehicle and a hybrid vehicle, for example.

Example 1
Examples of the power conversion device will be described with reference to FIGS.
As shown in FIG. 1, the power conversion device 1 of this example includes a semiconductor stacked unit 2 formed by stacking a semiconductor module 21 that constitutes a part of a power conversion circuit and a cooling pipe 22 that cools the semiconductor module 21. And a frame 3 on which the semiconductor laminated unit 2 is disposed.
Inside the frame 3, a pressure member 4 that is disposed at an end portion in the stacking direction of the semiconductor stacked unit 2 and presses the semiconductor stacked unit 2 in the stacking direction is disposed. A pair of support bodies 5 is arranged between the two.

The pressure member 4 has a leaf spring member 41. The leaf spring member 41 includes a pressing portion 411 that is curved so as to protrude toward the semiconductor multilayer unit 2, and a pair of support portions 412 that are curved so as to protrude toward the opposite side of the semiconductor multilayer unit 2 at both ends of the pressing portion 411. It consists of a pair of extended parts 413 extended from the support part 412 to the opposite side to the press part 411 further.
The extended portion 413 is curved so that the leaf spring end portion 414, which is the end edge on the opposite side to the support portion 412, faces the opposite side to the semiconductor stacked unit 2.
The support body 5 is interposed between the support portion 412 and the inner wall surface 31 of the frame 3.

  As shown in FIG. 1, the semiconductor laminated unit 2 is formed by laminating a plurality of semiconductor modules 21 and a plurality of cooling pipes 22 that cool the plurality of semiconductor modules 21 from both main surfaces. The cooling pipes 22 adjacent to each other in the stacking direction are connected to each other by connecting pipes 23 in the vicinity of both ends in the longitudinal direction. The connecting pipe 23 is configured to be deformable in the stacking direction. From the cooling pipe 22 at one end in the stacking direction, a refrigerant introduction pipe 24 for introducing a cooling medium and a refrigerant discharge pipe 25 for discharging the cooling medium are formed so as to protrude. The cooling pipe 22, the connecting pipe 23, the refrigerant introduction pipe 24, and the refrigerant discharge pipe 25 are made of a metal such as aluminum.

  Between the pair of adjacent cooling pipes 22, two semiconductor modules 21 are arranged so as to be sandwiched, respectively. The semiconductor module 21 includes a switching element such as an IGBT (Insulated Gate Bipolar Transistor) or a MOSFET (MOS field effect transistor).

  The frame 3 is made of a rectangular frame and can be made of, for example, a metal or alloy such as aluminum or stainless steel. The pressure member 4 is disposed via a pair of support bodies 5 disposed in contact with the inner wall surface 31 of one of the four sides of the frame 3.

  As shown in FIG. 1, the pressing member 4 includes a leaf spring member 41 and a contact plate 42. The abutting plate 42 is a flat plate member having high rigidity. The pressing portion 411 of the leaf spring member 41 abuts on one surface thereof, and the other surface is in surface contact with the semiconductor laminated unit 2. This prevents the cooling pipe 22 with which the pressurizing member 4 comes into contact from being deformed.

  As shown in FIG. 2, the plate spring member 41 is formed by superposing a front plate spring 415 that contacts the contact plate 42 and a rear plate spring 410 that contacts the support body 5. The front leaf spring 415 is not overlapped with the rear leaf spring 410 at the portion where the support portion 412 and the extending portion 413 are formed. The plate spring member 41 and the contact plate 42 are each made of a metal such as carbon tool steel (SK85, old SK5).

  As shown in FIG. 1, the pressure member 4 is urged so that the support portion 412 of the leaf spring member 41 is supported by the support body 5 and the contact plate 42 presses the semiconductor stacked unit 2 in the stacking direction. It is arranged in a state. In this example, as shown in FIGS. 1 and 2, the support body 5 has a rectangular parallelepiped shape, and the contact surface 51 with the support portion 412 of the plate spring member 41 is a flat surface. Moreover, the dimension in the arrangement direction of a pair of support body 5 is shorter than the dimension in a lamination direction.

Next, a method for manufacturing the power conversion device of this example will be described.
First, the semiconductor laminated unit 2 is arranged on the frame 3 of the power conversion device 1.
Next, as shown in FIG. 3, a pressure member 4 having a leaf spring member 41 and a contact plate 42 is disposed at one end in the stacking direction of the semiconductor stacked unit 2.

  Next, the pressing jig 6 is brought into contact with the pair of leaf spring end portions 414 of the leaf spring member 41, and the leaf spring end portion 414 is pushed into the contact plate 42 side (arrow F in FIG. 3). Specifically, the pressing jig 6 includes a pair of pressing convex portions 61, and these are inserted behind the leaf spring end portion 414 of the leaf spring member 41 inside the frame 3. Then, the pair of pressing convex portions 61 are pressed against the pair of leaf spring end portions 414. In a state where the leaf spring member 41 is elastically deformed by the pressing jig 6, the pair of support bodies 5 are arranged on the frame 3 at the rear position of the support portion 412 and inside the pressing convex portion 61.

Subsequently, the support body 5 is held between the support portion 412 and the inner wall surface 31 of the frame 3 by moving the pair of support portions 412 in a direction in which the pressing jig 6 is moved backward to restore the leaf spring member 41. In this state, the leaf spring member 41 is supported on the support body 5.
Thus, the power conversion device 1 in which the semiconductor lamination unit 2 is pressurized in the lamination direction by the pressure member 4 is obtained.
In FIG. 3, the alternate long and short dash line denoted by reference numeral 3 represents the inner peripheral contour of the frame 3.

Next, the function and effect of this example will be described.
In the plate spring member 41, the pair of support portions 412 supported by the support body 5 are curved so as to protrude to the opposite side of the semiconductor laminated unit 2 at both ends of the pressing portion 411. Therefore, a pair of supports is formed as compared with a case where a support part curved so as to protrude toward the semiconductor multilayer unit 2 is formed (that is, when the support body 5 supports the leaf spring member 41 in the extended part 413). The distance between the parts 412 can be shortened.

  As a result, even if the extending portion 413 is not lengthened, it is easy to sufficiently secure a region of the leaf spring member 41 that protrudes outside the pair of support bodies 5 in the direction in which the pair of support bodies 5 are arranged. That is, when the power converter 1 is assembled, the pressing jig 6 can be brought into contact when the both ends of the leaf spring member 41 are pushed and elastically deformed by the pressing jig 6 from the outside of the pair of support bodies 5. The length of the leaf spring member 41 can be shortened while sufficiently securing the region of the extended portion 413 that can be formed. Thereby, it becomes possible to reduce the size of the power converter 1 in the direction in which the support bodies 5 are arranged.

  In addition, the pair of support portions 412 are curved at both ends of the pressing portion 411 so as to protrude to the opposite side of the semiconductor multi-layer unit 2, so that the length of the pressing portion 411 is not shortened. Can be shortened. Therefore, it is possible to prevent the adjustment of the spring constant of the leaf spring member 41 from becoming difficult.

  Further, the extended portion 413 of the leaf spring member 41 is curved so that the leaf spring end portion 414 that is the edge opposite to the support portion 412 faces the opposite side to the semiconductor stacked unit 2. Therefore, the pressing jig 6 can be stably brought into contact with the leaf spring end 414.

Moreover, since the support body 5 has a rectangular parallelepiped shape, the support body 5 can be easily disposed stably between the pressing member 4 and the frame 3. Moreover, it is easy to manufacture the support body 5 with a good yield.
The support body 5 has a flat contact surface 51 with the support portion 412 of the leaf spring member 41. Therefore, the support portion 412 of the leaf spring member 41 curved so as to protrude toward the support body 5 can be stably brought into contact.

Moreover, as for the support body 5, the dimension in the row direction of a pair of support body 5 is shorter than the dimension in a lamination direction. Therefore, in the direction in which the pair of support bodies 5 are arranged, it is easy to sufficiently secure a region of the leaf spring member 41 that protrudes outside the pair of support bodies 5. As a result, the length of the leaf spring member 41 can be easily shortened.
As described above, according to this example, it is possible to provide a power conversion device that can be easily miniaturized in the direction in which the support bodies 5 are arranged.

(Example 2)
In this example, as shown in FIG. 4, the support body 5 is an example in which the contact surface 51 of the leaf spring member 41 with the support portion 412 is a concave surface along the shape of the support portion 412. That is, the support portion 412 of the leaf spring member 41 is curved so as to protrude to the opposite side of the semiconductor laminated unit 2, but the contact surface 51 of the support body 5 with the support portion 412 is also curved in the same direction. Yes. The radius of curvature of the contact surface 51 in the support body 5 is equal to or slightly larger than the radius of curvature of the support portion 412 in the leaf spring member 41.

  Others are the same as in the first embodiment. Of the reference numerals used in this example or the drawings relating to this example, the same reference numerals as those used in the first embodiment represent the same configuration requirements as in the first embodiment unless otherwise specified.

In the case of this example, the positioning of the leaf spring member 41 with respect to the support body 5 can be facilitated. Further, the support of the leaf spring member 41 by the support body 5 can be realized stably.
In addition, the same effects as those of the first embodiment are obtained.

Example 3
In this example, as shown in FIG. 5, the support body 5 is provided with an engaging portion 52 that engages with an engaged portion 311 provided on the inner wall surface 31 of the frame 3 on the side opposite to the semiconductor laminated unit 2. It is. That is, a convex engagement portion 52 is formed on the contact surface of the support body 5 with the inner wall surface 31 of the frame 3. A pair of concave engaged portions 311 that are engaged with the engaging portions 52 of the support body 5 are formed on the inner wall surface 31 of the frame 3. The engaged portion 311 is formed in a groove shape that is continuous in a direction orthogonal to both the stacking direction and the alignment direction of the pair of support bodies 5.

  Others are the same as in the first embodiment. Of the reference numerals used in this example or the drawings relating to this example, the same reference numerals as those used in the first embodiment represent the same configuration requirements as in the first embodiment unless otherwise specified.

In this example, the support body 5 includes an engaging portion 52 that engages with the engaged portion 311 of the frame 3. Therefore, the positioning of the support body 5 with respect to the frame 3 can be facilitated. Moreover, the position shift of the support body 5 with respect to the frame 3 in the arrangement direction of the support bodies 5 can be reliably prevented.
In addition, the same effects as those of the first embodiment are obtained.

In Examples 1-3, although the example which made the support body 5 the rectangular parallelepiped shape was disclosed, the shape of the support body 5 is not necessarily restricted to this. In the present specification, the rectangular parallelepiped shape includes substantially rectangular parallelepiped shapes as shown in the second and third embodiments.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Semiconductor laminated unit 21 Semiconductor module 22 Cooling pipe 3 Frame 31 Inner wall surface 4 Pressure member 41 Leaf spring member 411 Press part 412 Support part 413 Extension part 5 Support body

Claims (7)

A semiconductor stacked unit (2) formed by stacking a semiconductor module (21) constituting a part of the power conversion circuit and a cooling pipe (22) for cooling the semiconductor module (21);
A frame (3) for arranging the semiconductor laminated unit (2) on the inside;
A pressure member (4) disposed inside the frame (3) at an end portion in the stacking direction of the semiconductor stacking unit (2) and pressing the semiconductor stacking unit (2) in the stacking direction;
A pair of support bodies (5) disposed between the pressure member (4) and the inner wall surface (31) of the frame (3),
The pressure member (4) has a leaf spring member (41),
The leaf spring member (41) includes a pressing portion (411) curved so as to protrude toward the semiconductor lamination unit (2), and opposite sides of the semiconductor lamination unit (2) at both ends of the pressing portion (411). A pair of support portions (412) curved so as to protrude to the side, and a pair of extension portions (413) extending from the support portion (412) to the side opposite to the pressing portion (411). ,
The power converter (1), wherein the support (5) is interposed between the support (412) and an inner wall surface (31) of the frame (3).   The said converter (5) makes the contact surface (51) with the said support part (412) of the said leaf | plate spring member (41) flat, The power converter device (1) of Claim 1 characterized by the above-mentioned. ).   The said support body (5) makes the contact surface (51) with the said support part (412) of the said leaf | plate spring member (41) the concave surface along the shape of the said support part (412), It is characterized by the above-mentioned. The power converter device (1) according to claim 1.   The said converter (5) has a rectangular parallelepiped shape, The power converter device (1) as described in any one of Claims 1-3 characterized by the above-mentioned.   The support body (5) has an engagement portion (52) that engages with an engaged portion (311) provided on the inner wall surface (31) of the frame (3) on the opposite side to the semiconductor laminated unit (2). The power converter device (1) according to any one of claims 1 to 3, further comprising:   The extended portion (413) of the leaf spring member (41) is curved so that the edge on the opposite side to the support portion (412) faces the opposite side to the semiconductor laminated unit (2). The power converter device (1) according to any one of claims 1 to 5, characterized by:   The electric power according to any one of claims 1 to 6, wherein the size of the support body (5) in the arrangement direction of the pair of support bodies (5) is shorter than the size in the stacking direction. Conversion device (1).

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