JP6969333B2 - Manufacturing method of power converter - Google Patents

Description

The present invention relates to a process for the production of power conversion equipment.

Patent Document 1 discloses a power conversion device including a semiconductor laminated unit in which a semiconductor module and a cooling tube are laminated, and a pressurizing member that pressurizes the semiconductor laminated unit in the stacking direction. In such a power conversion device, a bearing body is interposed between the bearing wall provided in the housing and the pressurizing member.

In order to pressurize the semiconductor laminated unit with a pressing force within a predetermined range by a pressing member having a spring member, it is necessary to keep the amount of elastic deformation of the pressing member within a predetermined range. However, the dimensions of the semiconductor laminating unit in the laminating direction may vary, and there is a concern that the pressing force by the pressurizing member may vary due to this.

Therefore, in Patent Document 1, it is possible to prepare a plurality of types of bearings having different diameters as columnar bearings and select the bearings to be used according to the dimensions of the semiconductor laminated units in the stacking direction. It has been disclosed. As a result, the amount of elastic deformation of the pressure member is kept within a predetermined range, and the thermal resistance between the cooling tube and the semiconductor module is kept within a predetermined range.

Japanese Unexamined Patent Publication No. 2009-27805

However, in order to prepare bearings having a plurality of types of dimensions and to cope with the dimensional variation in the stacking direction of the semiconductor laminated unit, it is necessary to prepare many types of bearings. This is because the larger the dimensional variation in the stacking direction of the semiconductor stacking unit, the more types of bearings to be prepared need to be prepared. Then, for example, as the number of laminated semiconductor modules and cooling pipes in the semiconductor laminated unit increases, it becomes necessary to increase the types of bearings to be prepared.

Further, with the recent miniaturization of semiconductor elements and the increase in current, the amount of heat generated by semiconductor modules tends to increase. Then, it is necessary to efficiently dissipate heat from the semiconductor module to the cooling pipe, and the allowable range of pressure applied to the semiconductor laminated unit tends to be narrowed. As described above, when the allowable range of the pressure applied to the semiconductor laminated unit is narrowed, the allowable range of the elastic deformation amount of the pressure member is also narrowed. Therefore, it is necessary to strictly adjust the position of the pressure member by the bearing. As a result, the types of bearings to be prepared will increase.
This makes it difficult to reduce the manufacturing cost of the power conversion device.

The present invention has been made in view of these problems, while ensuring the heat dissipation of the semiconductor module, thereby reducing the manufacturing cost, it is intended to provide a method of manufacturing a power conversion equipment.

A reference embodiment of the present invention includes a semiconductor laminated unit (2) in which a semiconductor module (21) constituting a part of a power conversion circuit and a cooling tube (22) for cooling the semiconductor module are laminated.
A pressure member (3) arranged at one end of the semiconductor stacking unit in the stacking direction (X) and elastically pressurizing the semiconductor stacking unit in the stacking direction.
A housing (4) for accommodating the semiconductor laminated unit and the pressurizing member, and
A bearing body (5) interposed between the bearing wall (41) provided in the housing and the pressurizing member, and
Have,
The pressurizing member has a pressing portion (31) for pressing the semiconductor laminated unit and a pair of bearing portions (32) formed on both sides of the pressing portion.
The bearings are individually provided between each of the pair of bearings and the bearing wall.
Each of the bearings is in a power conversion device (1) in which a plurality of bearing blocks (50) are stacked in the stacking direction.

One aspect of the present invention is a method for manufacturing the above power conversion device.
The semiconductor laminated unit and the pressurizing member are arranged in the housing.
In the pressurizing member, a pair of portions on opposite sides of the pressing portion are pushed into the semiconductor laminating unit side in the laminating direction with a pressing force of a predetermined size to elastically deform the pressurizing member. At the same time, measure the bearing target position, which is the position of the bearing portion with respect to the bearing wall.
A plurality of the above-mentioned bearing blocks prepared in advance are appropriately combined, and the above-mentioned bearing body is assembled so as to have the dimensions in the above-mentioned stacking direction according to the above-mentioned bearing target position.
The bearing bodies are arranged between each of the pair of bearing portions and the bearing wall of the housing.
It is a method of manufacturing a power conversion device in which the bearing body is sandwiched between the bearing portion and the bearing wall.

In the power conversion device, each of the bearings has a plurality of bearing blocks stacked in the stacking direction. Therefore, the dimensions of the bearings in the stacking direction can be appropriately adjusted by combining the plurality of bearing blocks. Therefore, it is possible to easily cope with the dimensional variation in the lamination direction of the semiconductor lamination unit.

That is, the heat dissipation of the semiconductor module can be ensured by appropriately adjusting the dimensions of the support in the stacking direction according to the dimensions of the semiconductor stacking unit in the stacking direction. On the other hand, when a plurality of bearing blocks are stacked to form a bearing, the variation in the dimensions of the bearings can be increased depending on how the bearing blocks are combined. That is, it is possible to increase the variation in the dimensions of the bearing body without particularly increasing the types of bearing blocks. Therefore, it is possible to reduce the types of bearing blocks to be prepared. As a result, the manufacturing cost of the power conversion device can be reduced.

Further, in the method of manufacturing the power conversion device, a plurality of the bearing blocks prepared in advance are appropriately combined to assemble the bearing body so as to have dimensions in the stacking direction according to the bearing target position. This makes it possible to appropriately combine a small number of types of bearing blocks to obtain bearings of various dimensions. As a result, it is possible to reduce the manufacturing cost while applying an appropriate pressing force to the pressure member. That is, it is possible to reduce the manufacturing cost while ensuring the heat dissipation of the semiconductor module.

As described above, according to the above aspect, it is possible to provide a power conversion device and a method for manufacturing the same, which can reduce the manufacturing cost while ensuring the heat dissipation of the semiconductor module.
The reference numerals in parentheses described in the scope of claims and the means for solving the problem indicate the correspondence with the specific means described in the embodiments described later, and limit the technical scope of the present invention. It's not a thing.

The plan view of the power conversion apparatus in Embodiment 1. FIG. The enlarged plan view which shows the mounting state of the bearing body in Embodiment 1. FIG. The perspective view of the pressurizing member and a pair of bearings in Embodiment 1. FIG. The perspective view of the bearing block in Embodiment 1. FIG. The plan view of the bearing block in Embodiment 1. FIG. VI view of FIG. VII view of FIG. An explanatory diagram of a manufacturing process of a power conversion device having a relatively large bearing target dimension in the first embodiment. An explanatory diagram of a manufacturing process of a power conversion device having an intermediate bearing target dimension in the first embodiment. An explanatory diagram of a manufacturing process of a power conversion device having a relatively small bearing target dimension in the first embodiment. An explanatory diagram of a power conversion device having a relatively large bearing target dimension in the first embodiment. An explanatory diagram of a power conversion device having an intermediate bearing target dimension in the first embodiment. An explanatory diagram of a power conversion device having a relatively small bearing target dimension in the first embodiment. An explanatory diagram of a plurality of types of bearing blocks in the first embodiment. The enlarged plan view which shows the mounting state of the bearing body in Embodiment 2. FIG. FIG. 3 is an enlarged plan view showing a mounting state of the bearing in the third embodiment.

(Embodiment 1)
An embodiment relating to a power conversion device and a method for manufacturing the same will be described with reference to FIGS. 1 to 14.
As shown in FIG. 1, the power conversion device 1 of the present embodiment includes a semiconductor laminated unit 2, a pressurizing member 3, a housing 4, and a bearing 5.

The semiconductor stacking unit 2 is formed by stacking a semiconductor module 21 that constitutes a part of a power conversion circuit and a cooling tube 22 that cools the semiconductor module 21. The pressurizing member 3 is arranged at one end of the semiconductor laminating unit 2 in the laminating direction X, and elastically pressurizes the semiconductor laminating unit 2 in the laminating direction X. The housing 4 houses the semiconductor laminated unit 2 and the pressurizing member 3. The bearing body 5 is interposed between the bearing wall 41 provided in the housing 4 and the pressurizing member 3.

The pressurizing member 3 has a pressing portion 31 that presses the semiconductor laminated unit 2 and a pair of bearing portions 32 formed on both sides of the pressing portion 31. A bearing body 5 is individually provided between each of the pair of bearing portions 32 and the bearing wall 41. Each bearing 5 is formed by stacking a plurality of bearing blocks 50 in the stacking direction X.

The power conversion device 1 of the present embodiment is mounted on, for example, a vehicle or the like, and is configured to convert electric power between DC electric power and AC electric power.
As shown in FIG. 1, the semiconductor stacking unit 2 is formed by stacking a plurality of semiconductor modules 21 and a plurality of cooling tubes 22 for cooling the plurality of semiconductor modules 21 from both main surfaces. The cooling pipes 22 adjacent to each other in the stacking direction X are connected to each other by connecting pipes 23 in the vicinity of both ends in the longitudinal direction thereof. The connecting pipe 23 is configured to be deformable in the stacking direction X. The refrigerant introduction pipe 24 for introducing the refrigerant and the refrigerant discharge pipe 25 for discharging the refrigerant are formed so as to project from the cooling pipe 22 at one end in the stacking direction X. The cooling pipe 22, the connecting pipe 23, the refrigerant introduction pipe 24, and the refrigerant discharge pipe 25 are made of a metal such as aluminum.

In the present specification, the stacking direction X is also simply referred to as the X direction. Further, the arrangement direction of the pair of bearings 5 is called the Y direction. Further, the direction orthogonal to both the X direction and the Y direction is called the Z direction. In this embodiment, the longitudinal direction of the cooling pipe 22 coincides with the Y direction.

A semiconductor module 21 is arranged between a pair of adjacent cooling pipes 22 so as to be sandwiched between them. The semiconductor module 21 has a built-in switching element such as an IGBT (abbreviation of an insulated gate bipolar transistor) and a MOSFET (abbreviation of a MOS type field effect transistor).

The housing 4 can be made of, for example, a metal or alloy such as aluminum or stainless steel. The housing 4 has a substantially rectangular parallelepiped shape. Then, as shown in FIG. 1, the housing 4 has a rectangular shape when viewed from the Z direction. The wall portion corresponding to one of the four sides of the housing 4 as viewed from the Z direction is the bearing wall 41. A pressure member 3 is disposed on the inner surface of the bearing wall 41 via a pair of bearings 5 arranged in contact with each other.

Further, the housing 4 has a facing wall 42 that abuts on the semiconductor laminated unit 2 on the wall portion on the side opposite to the bearing wall 41 in the X direction. The cooling pipe 22 arranged at one end in the X direction of the semiconductor laminated unit 2 is in contact with the inner surface of the facing wall 42. That is, the semiconductor laminated unit 2 is arranged between the facing wall 42 and the bearing wall 41, and is pressurized in the X direction by the pressurizing member 3.

The pressurizing member 3 is made of a leaf spring. The leaf spring has a portion curved so as to project toward the semiconductor laminated unit 2, and a portion curved so as to project to the opposite side to the semiconductor laminated unit 2 at both ends thereof. The pressurizing member 3 has a pressing portion 31 in a portion curved so as to project toward the semiconductor laminating unit 2. Further, the pressure member 3 has a supported portion 32 in a pair of portions curved so as to project to the opposite side of the semiconductor laminated unit 2. The bearing body 5 is interposed between the bearing portion 32 and the bearing wall 41.

A contact plate 11 is arranged between the pressure member 3 and the semiconductor laminated unit 2. The contact plate 11 is a flat plate-shaped member having high rigidity. The pressing portion 31 of the pressurizing member 3 abuts on one surface of the abutting plate 11, and the other surface contacts the semiconductor laminated unit 2. This prevents the cooling pipe 22 with which the pressurizing member 3 comes into contact from being deformed.

As shown in FIGS. 2 and 3, the bearing body 5 is formed by stacking a plurality of bearing blocks 50 in the X direction.
The bearing block 50 has a block positioning unit 51 that positions in a direction orthogonal to the X direction with other bearing blocks 50 that are overlapped with each other. In this embodiment, the block positioning unit 51 performs positioning in the Y direction.

The bearing block 50 has, as the block positioning portion 51, a positioning convex portion 511 protruding toward the supported portion 32 side and a positioning concave portion 512 provided on the surface on the bearing wall 41 side. The positioning protrusion 511 and the positioning recess 512 are fitted to each other.

Further, the bearing wall 41 has a wall-side positioning portion 411. The wall-side positioning portion 411 positions the bearing block 50 in contact with the bearing wall 41 in a direction orthogonal to the X direction. In this embodiment, the wall-side positioning unit 411 positions in the Y direction. Further, the wall-side positioning portion 411 is a convex portion protruding inward from the inner side surface of the bearing wall 41.

As shown in FIGS. 4, 6 and 7, the bearing block 50 has a positioning protrusion 511 and a positioning recess 512 over the entire height direction orthogonal to both the stacking direction X and the arrangement direction of the pair of bearings 5. Is continuously formed. That is, the positioning convex portion 511 and the positioning concave portion 512 are formed continuously over the entire support block 50 in the Z direction, respectively. As shown in FIGS. 4 to 7, the bearing block 50 is a columnar body having the same cross-sectional shape orthogonal to the Z direction at any position in the Z direction. That is, the bearing block 50 is a columnar body having a cross-sectional shape orthogonal to the Z direction, for example, as shown in FIG.

As shown in FIGS. 4 and 5, the bearing block 50 includes a base portion 501, a positioning convex portion 511 protruding from the base portion 501 to one side in the X direction, and the other end in the base portion 501 in the Y direction in the X direction. It has a pair of blades 502 protruding to the side. A positioning recess 512 is formed between the pair of blades 502 in the Y direction.

Further, as shown in FIG. 5, a chamfered portion 521 is provided at a pair of corner portions in the Y direction on the protruding end surface of the positioning convex portion 511. A chamfered portion 522 is provided at a pair of inner corner portions in the Y direction on the bottom surface of the positioning recess 512. A chamfered portion 523 is provided at the corner of the inner end in the Y direction on the protruding end surface of the wing portion 502. In FIG. 4, the chamfered portion is omitted.

The plurality of bearing blocks 50 constituting the bearing body 5 have positioning protrusions 511 having the same dimensions and shape as each other, and positioning recesses 512 having the same dimensions and shape as each other. Then, as shown in FIGS. 2 and 3, the positioning convex portion 511 of one bearing block 50 fits into the positioning concave portion 512 of the other bearing block 50. As a result, the bearing blocks 50 are combined with each other in a state of being positioned in the Y direction to form the bearing body 5.

The dimensions of the positioning recess 512 in the Y direction are slightly larger than those of the positioning protrusion 511, and are substantially the same. Further, it is preferable that the depth of the positioning recess 512 in the X direction is slightly larger than the length of the positioning protrusion 511 in the X direction from the viewpoint of stability. However, it is not necessarily limited to this.

Further, as shown in FIG. 2, the wall-side positioning portion 411 formed on the support wall 41 has a shape that fits into the positioning recess 512 of the support block 50. That is, the wall-side positioning portion 411 has substantially the same shape as the positioning convex portion 511 of the bearing block 50 in the shape seen from the Z direction. As shown in FIG. 1, wall-side positioning portions 411 are formed at two locations in the Y direction on the bearing wall 41, respectively. The position of the wall-side positioning portion 411 in the Y direction corresponds to the position where the pair of supported portions 32 in the pressurizing member 3 are arranged. That is, the arrangement interval of the pair of wall-side positioning portions 411 is substantially the same as the arrangement interval of the pair of supported portions 32. The wall-side positioning portion 411 may be integrally formed with the support wall 41, or may be fixed to the support wall 41.

As described above, the bearing body 5 is configured by stacking a plurality of bearing blocks 50 in the X direction, but the number of stacked bearing blocks 50 is not particularly limited. Further, the bearing blocks 50 laminated with each other may have the same shape and dimensions, or may have different shapes and dimensions. However, even if the bearing blocks 50 have different shapes and dimensions, as described above, the shapes and dimensions of the positioning protrusions 511 and the positioning recesses 512 are the same among the bearing blocks 50.

Next, a method of manufacturing the power conversion device 1 of the present embodiment will be described with reference to FIGS. 8 to 14. It should be noted that FIGS. 8 to 10 do not show the state of the same process of different products, but do not arrange them in chronological order. The relationship between FIGS. 11 to 13 is similar to this. 8 shows a process in the middle of manufacturing the finished product shown in FIG. 11, FIG. 9 shows a process in the middle of manufacturing the finished product shown in FIG. 12, and FIG. 10 shows the manufacturing process of the finished product shown in FIG. It shows the process on the way.

First, the semiconductor laminated unit 2 and the pressurizing member 3 are arranged in the housing 4.
Next, as shown in FIGS. 8 to 10, a pair of portions of the pressurizing member 3 on opposite sides of the pressing portion 31 are pressed against the semiconductor lamination unit 2 in the lamination direction X by a predetermined magnitude. Push in with F. As a result, the pressure member 3 is elastically deformed. At this time, the bearing target position, which is the position of the supported portion 32 with respect to the bearing wall 41, is measured. It should be noted that the "pair of portions on opposite sides of the pressing portion 31", which is the portion to be pushed in the pressure member 3, may be outside or inside the supported portion 32 in the Y direction. May be good. In the present embodiment, the portion is outside the supported portion 32 and is both ends in the Y direction of the pressurizing member 3.

Then, for example, as shown in FIG. 14, a plurality of bearing blocks 50 prepared in advance are appropriately combined, and the bearing body 5 is assembled so as to have the dimensions of the stacking direction X according to the bearing target position.
After that, as shown in FIGS. 11 to 13, the bearing body 5 is arranged between each of the pair of bearing portions 32 and the bearing wall 41 of the housing 4.
Then, the bearing body 5 is sandwiched between the bearing portion 32 and the bearing wall 41.

As described above, the bearing target position refers to the position of the supported portion 32 with respect to the bearing wall 41 when the pressure member 3 is pushed in by the pressing force F having a predetermined size. That is, as shown in FIGS. 8 to 10, both ends of the pressurizing member 3 are pushed toward the semiconductor laminated unit 2 side in the X direction by the pressing jig 6. Then, the pressurizing member 3 is elastically deformed and the semiconductor laminated unit 2 is also compressed according to the pressing force. The pressing force F having a predetermined magnitude is a pressing force having an appropriate magnitude when pressurizing the semiconductor laminated unit 2 in the X direction. This predetermined pressing force F is a pressing force within an appropriate range necessary for preventing damage to the semiconductor laminated unit 2 including the semiconductor module 21 while sufficiently ensuring the cooling property of the semiconductor module 21. The predetermined pressing force F is designed in advance.

When the pressurizing member 3 is pushed in by the pressing force F having a predetermined size, as shown in FIGS. 8 to 10, the compression amount thereof is caused by the semiconductor laminated unit 2 due to the solid variation of the semiconductor laminated unit 2. Can be different. As a result, the dimensions between the supported portion 32 of the pressure member 3 and the support wall 41 may differ depending on the product. Therefore, the position of the supported portion 32 with respect to the bearing wall 41 at this time, that is, the bearing target position is measured. The bearing target position is also a position where the semiconductor laminated unit 2 can be pressurized with a pressing force F having a predetermined size by supporting the supported portion 32 at this position. Here, the dimension in the X direction between the bearing wall 41 and the bearing portion 32 when the bearing portion 32 is in the bearing target position is referred to as a bearing target dimension G.

Next, the pressurizing member 3 is pushed toward the semiconductor laminated unit 2 side in the X direction with a pressing force even larger than the pressing force F having the predetermined size. As a result, the dimension between the bearing portion 32 and the bearing wall 41 is made slightly larger than the bearing target dimension G. In this state, the bearing bodies 5 are arranged between each of the pair of bearing portions 32 and the bearing wall 41. At this time, the bearing body 5 is assembled and arranged between the bearing wall 41 and the supported portion 32 so that the size of the bearing body 5 in the X direction becomes the size corresponding to the bearing target position. At this time, the positioning recess 512 of the support block 50 at the end of the support body 5 on the side of the support wall 41 is fitted into the wall-side positioning portion 411 provided on the support wall 41.

After that, the pressing force for pushing the pressing member 3 by the pressing jig 6 is reduced. As a result, the pair of supported portions 32 are displaced toward the bearing wall 41 in the direction in which the pressure member 3 is restored. Then, the pair of supported portions 32 each come into contact with the pair of bearings 5. In this state, the pressurizing member 3 is interposed between the semiconductor laminated unit 2 and the bearing wall 41 in a state where the pressing force F having the predetermined size is applied.

As described above, a plurality of bearing blocks 50 are combined to assemble the bearing body 5 so that the size of the bearing body 5 in the X direction becomes an appropriate dimension according to the measured bearing target position. That is, a large number of bearing blocks 50 are prepared in advance, and the dimensions are appropriately adjusted by changing the number and types of the bearing blocks 50 to be combined.

In the present embodiment, the plurality of bearing blocks 50 prepared in advance include a plurality of types of bearing blocks 50 having different dimensions in the stacking direction X, as shown in FIG. For example, a plurality of three types of bearing blocks 50a, 50b, and 50c having different dimensions in the X direction are prepared. Here, the dimension in the X direction is the dimension between the bottom surface of the positioning recess 512 and the top surface of the positioning protrusion 511.

Then, depending on how these three types of bearing blocks 50a, 50b, and 50c are combined, it is possible to obtain bearings 5 having various dimensions that greatly exceed the three types. In assembling the bearing body 5, only two types of the three types of bearing blocks 50a, 50b, and 50c may be used, or a plurality of one type may be used. Alternatively, the number of the bearing blocks 50 to be stacked may be two or more, and three or more bearing blocks 50 may be used. Then, by combining the three types of bearing blocks 50, it is possible to obtain bearings 5 having an extremely large number of types of dimensions.

Therefore, for example, a bearing in which the measured bearing target dimension G is relatively large as shown in FIG. 8, relatively small as shown in FIG. 10, and intermediate as shown in FIG. 9 is combined. Assemble the bearing 5 by changing the type and number of blocks 50. Then, as shown in FIGS. 11 to 13, appropriately assembled bearings 5 are arranged between the supported portion 32 of the pressure member 3 and the bearing wall 41. As a result, an appropriate pressing force can be easily generated on the pressurizing member 3 in response to the dimensional variation in the X direction of the semiconductor laminated unit 2.

Next, the action and effect of this embodiment will be described.
In the power conversion device 1, each bearing 5 is formed by stacking a plurality of bearing blocks 50 in the X direction. Therefore, the dimensions of the bearing 5 in the X direction can be appropriately adjusted by combining the plurality of bearing blocks 50. Therefore, it is possible to easily cope with the dimensional variation in the X direction of the semiconductor laminated unit 2.

That is, the heat dissipation of the semiconductor module 21 can be ensured by appropriately adjusting the dimensions of the support 5 in the X direction according to the dimensions of the semiconductor laminated unit 2 in the X direction. On the other hand, when a plurality of bearing blocks 50 are stacked to form the bearing body 5, variations in the dimensions of the bearing bodies 5 can be increased depending on how the bearing blocks 50 are combined. That is, it is possible to increase the variation in the dimensions of the bearing body 5 without particularly increasing the types of the bearing blocks 50. Therefore, the number of types of bearing blocks 50 to be prepared can be reduced. As a result, the manufacturing cost of the power conversion device 1 can be reduced.

The bearing block 50 has a block positioning unit 51. This makes it possible to position the bearing blocks 50 that are overlapped with each other. As a result, the pressure member 3 can be stably supported.

The bearing wall 41 has a wall-side positioning portion 411. As a result, the bearing body 5 can be easily and reliably positioned with respect to the bearing wall 41.

The bearing block 50 has a positioning convex portion 511 and a positioning concave portion 512 as a block positioning portion 51. Then, the positioning convex portion 511 and the positioning concave portion 512 are fitted to each other. As a result, stable positioning can be realized while simplifying the shape of the bearing block 50.

The bearing block 50 is formed by continuously forming the positioning convex portion 511 and the positioning concave portion 512 over the entire height direction (that is, the Z direction). This makes it possible to easily assemble the bearing block 50 and install it in the housing 4. In addition, it is possible to reliably prevent the support blocks 50 from being displaced in the Y direction. Further, it is possible to reliably prevent the position shift of the support body 5 with respect to the support wall 41 in the Y direction.

Further, in the method of manufacturing the power conversion device, a plurality of bearing blocks 50 prepared in advance are appropriately combined, and the bearing body 5 is assembled so as to have dimensions in the X direction according to the bearing target position. Thereby, a small number of types of bearing blocks 50 can be appropriately combined to obtain bearings 5 having various dimensions. As a result, it is possible to reduce the manufacturing cost while applying an appropriate pressing force to the pressurizing member 3. That is, the manufacturing cost can be reduced while ensuring the heat dissipation of the semiconductor module 21.

Further, the plurality of bearing blocks 50 prepared in advance include a plurality of types of bearing blocks 50a, 50b, 50c having different dimensions in the X direction. Thereby, the variation in the dimensions of the bearing 5 can be particularly increased depending on the combination method. As a result, the pressing force of the pressurizing member 3 can be adjusted more finely.

As described above, according to the present embodiment, it is possible to provide a power conversion device and a method for manufacturing the same, which can reduce the manufacturing cost while ensuring the heat dissipation of the semiconductor module.

(Embodiment 2)
In the present embodiment, as shown in FIG. 15, the shape of the bearing block 50 is different from that of the first embodiment.
That is, the wing portion 502 of the bearing block 50 is formed obliquely with respect to the X direction. Further, the inclined surface 503 on the positioning convex portion 511 side of the wing portion 502 is connected to the top surface of the positioning convex portion 511. The inclined surface 503 is inclined from the top surface of the positioning convex portion 511 toward the outside in the Y direction toward the side opposite to the pressurizing member 3 in the X direction.

The inclined surface 504 on the positioning recess 512 side in the wing portion 502 is connected to the bottom surface of the positioning recess 512. The inclined surface 504 is inclined from the bottom surface of the positioning recess 512 toward the outside in the Y direction toward the side opposite to the pressurizing member 3 in the X direction.

The wall-side positioning portion 411 has a top surface 412 facing the bottom surface of the positioning recess 512 and an inclined surface 413 facing the inclined surface 504.
Also in this embodiment, a plurality of bearing blocks 50 are superposed to form a bearing body 5. Then, the bearing body 5 is interposed between the bearing wall 41 and the supported portion 32 of the pressure member 3.

Other configurations are the same as those in the first embodiment. In addition, among the reference numerals used in the second and subsequent embodiments, the same reference numerals as those used in the above-mentioned embodiments represent the same components and the like as those in the above-mentioned embodiments, unless otherwise specified.

In this embodiment, the positioning recess 512 has a shape that expands toward the opening direction thereof. Therefore, it is easier to fit the positioning convex portion 511 or the wall-side positioning portion 411 into the positioning concave portion 512.
In addition, it has the same effect as that of the first embodiment.

(Embodiment 3)
Also in this embodiment, as shown in FIG. 16, the shape of the bearing block 50 is different from that of the first embodiment.
In this embodiment, the bearing block 50 is provided with a positioning convex portion 511 on the bearing wall 41 side and a positioning concave portion 512 on the supported portion 32 side.

That is, the wing portion 502 is inclined toward the pressure member 3 side toward the outside in the Y direction.
The wall-side positioning portion 411 has a concave surface 414 to which the positioning convex portion 511 of the bearing block 50 is fitted.

Also in this embodiment, a plurality of bearing blocks 50 are superposed to form a bearing body 5. Then, the bearing body 5 is interposed between the bearing wall 41 and the supported portion 32 of the pressure member 3. At this time, the supported portion 32 of the pressure member 3 comes into contact with the bottom surface of the positioning recess 512 of the support block 50.
Other configurations are the same as those in the first embodiment.

In the present embodiment, the positioning convex portion 511 is more easily fitted into the positioning concave portion 512 or the wall-side positioning portion 411.
In addition, it has the same effect as that of the first embodiment.

In the above embodiment, a part of the outer peripheral wall portion of the housing is used as a bearing wall, but the mode of the bearing wall is not particularly limited to this. For example, the bearing wall may be arranged inside the housing.

Further, in the first embodiment, a manufacturing method in which three types of bearing blocks are prepared is shown, but the number of types of bearing blocks to be prepared is not limited to this. For example, by setting the types of bearing blocks to be prepared to four or more, it is possible to further increase the variation in the dimensions of the bearings. Further, it is possible to further reduce the manufacturing cost by using two types of bearing blocks to be prepared. Alternatively, the type of bearing block to be prepared may be one type. In this case, it is also possible to create variations in the dimensions of the bearings by changing the number of laminated bearing blocks of one type.

The present invention is not limited to each of the above embodiments, and can be applied to various embodiments without departing from the gist thereof.

1 Power converter 2 Semiconductor laminated unit 21 Semiconductor module 22 Cooling pipe 3 Pressurizing member 31 Pressing part 32 Supported part 4 Housing 41 Supporting wall 5 Supporting body 50 Supporting block

Claims (6)

It is a method of manufacturing a power conversion device (1).
The above power converter
A semiconductor laminated unit (2) formed by laminating a semiconductor module (21) constituting a part of a power conversion circuit and a cooling tube (22) for cooling the semiconductor module.
A pressure member (3) arranged at one end of the semiconductor stacking unit in the stacking direction (X) and elastically pressurizing the semiconductor stacking unit in the stacking direction.
A housing (4) for accommodating the semiconductor laminated unit and the pressurizing member, and
A bearing body (5) interposed between the bearing wall (41) provided in the housing and the pressurizing member, and
Have,
The pressurizing member has a pressing portion (31) for pressing the semiconductor laminated unit and a pair of bearing portions (32) formed on both sides of the pressing portion.
The bearings are individually provided between each of the pair of bearings and the bearing wall.
Each bearing body, Ri plurality of bearing blocks (50) Na superimposed on the lamination direction,
In manufacturing the above power conversion device,
The semiconductor laminated unit and the pressurizing member are arranged in the housing.
In the pressurizing member, a pair of portions on opposite sides of the pressing portion are pushed into the semiconductor laminating unit side in the laminating direction with a pressing force of a predetermined size to elastically deform the pressurizing member. At the same time, measure the bearing target position, which is the position of the bearing portion with respect to the bearing wall.
A plurality of the above-mentioned bearing blocks prepared in advance are appropriately combined, and the above-mentioned bearing body is assembled so as to have the dimensions in the above-mentioned stacking direction according to the above-mentioned bearing target position.
The bearing bodies are arranged between each of the pair of bearing portions and the bearing wall of the housing.
A method for manufacturing a power conversion device, in which the bearing body is sandwiched between the bearing portion and the bearing wall. The method for manufacturing a power conversion device according to claim 1, wherein the bearing block has a block positioning unit (51) for positioning in a direction orthogonal to the stacking direction between the bearing blocks and other bearing blocks stacked on each other. The power conversion device according to claim 2, wherein the bearing wall has a wall-side positioning portion (411) for positioning in a direction orthogonal to the stacking direction with the bearing block in contact with the bearing wall . Manufacturing method . The bearing block has, as the block positioning portion, a positioning convex portion (511) protruding toward the supported portion side and a positioning concave portion (512) provided on the surface on the bearing wall side, and the positioning convex portion. The method for manufacturing a power conversion device according to claim 2 or 3, wherein the portion and the positioning recess are fitted to each other. The bearing block continuously forms the positioning convex portion and the positioning concave portion over the entire height direction (Z) orthogonal to both the stacking direction and the arrangement direction (Y) of the pair of bearings. The method for manufacturing a power conversion device according to claim 4. The power conversion device according to any one of claims 1 to 5, wherein the plurality of bearing blocks prepared in advance include a plurality of types of bearing blocks (50a, 50b, 50c) having different dimensions in the stacking direction. Manufacturing method.

Images