JP5573761B2 - Power converter - Google Patents

Description

  The present invention relates to a power converter including a stacked cooler in which a plurality of cooling pipes are stacked and a plurality of semiconductor modules sandwiched between adjacent cooling pipes.

A power conversion device in which a plurality of cooling pipes for circulating a cooling medium are stacked and connected and a plurality of semiconductor modules sandwiched between adjacent cooling pipes are housed in a housing There is.
Since the stacked cooler is configured by connecting a plurality of cooling pipes, the rigidity in the direction orthogonal to the stacking direction tends to be low.

  When such a power conversion device is mounted on a vehicle such as an electric vehicle or a hybrid vehicle, vibration is transmitted to the power conversion device, and the stacked cooler vibrates with respect to the housing. Among these vibrations, particularly when vibrations in a direction perpendicular to the stacking direction are applied, the stacked cooler vibrates in this direction, and there is a possibility of deformation in some cases.

  Therefore, Patent Document 1 discloses a power conversion device in which a pair of guide units are disposed so as to surround the multilayer cooler from three directions orthogonal to the stacking direction in order to improve the rigidity of the multilayer cooler. .

Japanese Patent No. 4016907

However, in the power converter using the guide unit, the provision of the guide unit leads to an increase in the weight and size of the device and an increase in the number of parts.
Moreover, since the guide unit has a shape that surrounds the stacked cooler from three directions, the assembly work may be complicated.
In addition, since a predetermined gap is provided between the guide unit and the stacked cooler, when the stacked cooler vibrates, a part of the stacked cooler may collide with the guide unit. As a result, there is a problem that the stacked cooler may be partially deformed to affect the cooling performance.

  The present invention has been made in view of such problems, and provides a power conversion device that can suppress vibrations of a stacked cooler without affecting cooling performance, and can be easily assembled with a reduced number of components. It is something to try.

A first aspect of the present invention is a laminated cooler formed by laminating and connecting a plurality of cooling pipes through which a cooling medium flows.
A plurality of semiconductor modules sandwiched between adjacent cooling pipes;
A housing for housing the stacked cooler and the semiconductor module;
The housing has a base plate disposed to face the stacked cooler in a direction orthogonal to the stack direction in the stacked cooler,
The stacked cooler includes a protrusion that protrudes toward the base plate,
The protrusion may Ri Thea configured to regulate the position of the laminated condenser for the base plate for the normal direction of the base plate,
The protrusion is engaged with the base plate,
The base plate includes a through-engagement hole into which the protruding portion is inserted and engaged, and the protruding portion includes a spring portion that is elastically deformable in a direction orthogonal to the protruding direction, and the spring portion passes through the through-hole. The protrusion is engaged with the base plate by being pressed against the inner surface of the engagement hole,
The through engagement hole is formed with a through portion penetrating in the normal direction of the base plate, and a step portion adjacent to the through portion and recessed from the surface opposite to the stacked cooler. Comprises a side wall surface facing the penetrating portion side and a bottom wall surface facing the penetrating direction of the penetrating portion, and the spring portion has a stopper portion that can come into surface contact with the bottom wall surface of the stepped portion. (1).
A second aspect of the present invention is a laminated cooler formed by laminating and connecting a plurality of cooling pipes through which a cooling medium flows.
A plurality of semiconductor modules sandwiched between adjacent cooling pipes;
A housing for housing the stacked cooler and the semiconductor module;
The housing has a base plate disposed to face the stacked cooler in a direction orthogonal to the stack direction in the stacked cooler,
The stacked cooler includes a protrusion that protrudes toward the base plate,
The protrusion is configured to regulate the position of the stacked cooler relative to the base plate with respect to the normal direction of the base plate;
The protrusion is formed in a power conversion device, wherein the protrusion is formed so as to protrude from a connecting portion that connects the adjacent cooling pipes (claim 8).

  In the power conversion device, the stacked cooler includes the protrusion. And the protrusion part is comprised so that the position of the said lamination | stacking cooler with respect to this base plate about the normal line direction of the said base plate may be controlled. As a result, in the stacked cooler, the position of the base plate in the normal direction relative to the casing is restricted. Therefore, when the vibration is applied to the power conversion device, the stacked cooler can be prevented from vibrating in the normal direction with respect to the housing.

  Further, as described above, as a means for regulating the position of the stacked cooler with respect to the base plate, a protruding portion protruding from the stacked cooler is used. Therefore, the portion for positioning with the base plate is formed in a portion away from the cooling pipe or the like in the stacked cooler. Therefore, it is possible to suppress external force such as vibration from being applied to the cooling pipe or the like from the base plate and to prevent the cooling performance from being affected.

  Further, since the protruding portion is formed so as to protrude from the stacked cooler, there is no need for positioning by assembling another member with respect to the stacked cooler. Therefore, the number of parts of the power conversion device can be reduced, and the number of assembly steps can be reduced.

  As described above, according to the present invention, it is possible to provide a power conversion device that can suppress the vibration of the stacked cooler without affecting the cooling performance, and can be easily assembled with a reduced number of components.

Plane | planar explanatory drawing of the power converter device in the reference example 1. FIG. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. Explanatory drawing of the power converter device equivalent to the BB line cross section of FIG. Plane explanatory drawing of the base plate in the reference example 1. FIG. The perspective explanatory drawing of the assembly | attachment of the laminated cooler in the reference example 1. FIG. Side surface explanatory drawing of the state before the assembly | attachment of the protrusion part and a base plate in the reference example 1. FIG. Side surface explanatory drawing of the state after the assembly | attachment of the protrusion part and a base plate in the reference example 1. FIG. Explanatory drawing equivalent to FIG. 3 of the power converter device in the reference example 2. FIG. Plane explanatory drawing of the base plate in the reference example 2. FIG. The perspective explanatory drawing of the assembly | attachment of the laminated cooler in the reference example 2. FIG. Side surface explanatory drawing of the state before the assembly | attachment of the protrusion part and a base plate in Example 1. FIG. Side surface explanatory drawing of the state after the assembly | attachment of the protrusion part and a base plate in Example 1. FIG. Explanatory drawing equivalent to FIG. 3 of the power converter device in Example 2. FIG. Explanatory drawing equivalent to FIG. 3 of the power converter device in Example 3. FIG. Explanatory drawing equivalent to FIG. 3 of the power converter device in Example 4. FIG. Explanatory drawing equivalent to FIG. 3 of the power converter device in Example 5. FIG. Explanatory drawing equivalent to FIG. 3 of the power converter device in Example 6. FIG.

  In the power converter, as the material of the cooling pipe and the casing, for example, a metal such as an aluminum material having excellent thermal conductivity can be used. Further, the protruding portion may be constituted by a part integrated with the laminated cooler, or may be constituted by attaching another member to the laminated cooler.

Also, the projections are preferably more rigid than the lower wall portion of the cooling tube (claim 15). In this case, the protrusion can be preferentially deformed over the cooling pipe. Thereby, it can suppress that external forces, such as a vibration, apply to the said cooling pipe from the said base plate, and can prevent the deformation | transformation of the said cooling pipe. Therefore, it is possible to effectively prevent the cooling performance from being affected.

Also, the projections are preferably formed at a plurality of locations in the lamination direction in the laminated cooler (claim 16). In this case, it is possible to easily regulate the position of the base plate in the normal direction with respect to the casing with respect to the stacked cooler. Therefore, it is possible to effectively suppress the laminated cooler from vibrating in the normal direction with respect to the casing.

In the first aspect of the present invention, the protrusion that engaged with the above base plate. Thereby , the position restriction | limiting of the said laminated cooler with respect to the said housing | casing can be easily performed about both the normal line directions of the said baseplate. Therefore, it is possible to effectively suppress the laminated cooler from vibrating in the normal direction with respect to the casing. Further, it is possible to regulate the position of the stacked cooler in the direction parallel to the base plate.

The base plate includes a through-engagement hole into which the protruding portion is inserted and engaged, and the protruding portion includes a spring portion that can be elastically deformed in a direction orthogonal to the protruding direction. the protruding portion by pressure contact with the inner surface of the through engagement holes is that in engagement with the base plate. Thereby , the protrusion can be easily and stably engaged with the base plate.

Moreover, it is preferable that the said spring part is formed so that it may elastically deform in the direction orthogonal to the said lamination direction (Claim 2, 11 ). In this case, the position of the stacked cooler with respect to the base plate is also restricted in a direction perpendicular to the stacking direction in addition to the normal direction of the base plate. In addition, with such a configuration, the position of the stacked cooler can be prevented from being regulated with respect to the base plate in the stacking direction. As a result, it is possible to perform adjustments such as compressing the stacked cooler in the stacking direction after the stacked cooler is assembled to the housing together with the semiconductor module.

Further, the through engagement hole is formed with a through portion penetrating in the normal direction of the base plate, and a step portion adjacent to the through portion and recessed from the surface opposite to the stacked cooler, The step portion includes a side wall surface facing the penetrating portion side and a bottom wall surface facing the penetrating direction of the penetrating portion, and the spring portion includes a stopper portion that can come into surface contact with the bottom wall surface of the step portion. that Yusuke. Thereby , the stopper part of the spring part can be brought into surface contact with the bottom wall surface of the step part. Therefore, the protrusion can be reliably engaged with the base plate, and the protrusion of the protrusion from the base plate can be reliably prevented. Therefore, even when a large vibration is applied to the power conversion device, the stacked cooler can be reliably suppressed from greatly vibrating with respect to the casing.

The housing includes a pair of base plates arranged to face each other, the stacked cooler is sandwiched between the pair of base plates, and the projecting portion abuts at least one of the pair of base plates. (Claim 12 ). In this case, it is easy to simplify the structure of the base plate and to easily assemble the stacked cooler to the housing. That is, by adopting a structure in which the stacked cooler is sandwiched between a pair of the base plates, for example, processing such as forming an engaged portion with which the protruding portion engages with the base plate becomes unnecessary. Further, as a result, the work of engaging the protruding portion with the engaged portion becomes unnecessary, so that the assembly can be facilitated. In addition, by controlling the position of the stacked cooler by bringing the protruding portion into contact with the base plate, it is possible to prevent the cooling pipe of the stacked cooler from being deformed.

Further, the laminated cooler toward the pair of base plates will protrude respectively the projecting portion, it is preferable that the protruding portions in both of the pair of base plates are in contact with (claim 13). In this case, the stacked cooler can be prevented from coming into contact with the base plate at a portion other than the protruding portion, so that the cooling pipe of the stacked cooler can be more reliably prevented from being deformed. .

Further, the protruding portion is preferably formed to project from said cooling pipe (claim 3). In this case, the protrusion can be easily formed.

Moreover, the cooling tube at a plurality of locations in a direction perpendicular to the normal direction of the stacking direction and the base plate is preferably provided with the projecting portion (claim 4). In this case, it can suppress more effectively that the said lamination | stacking cooler vibrates with respect to the said housing | casing.

Also, the projections are preferably all of the cooling pipes are projectingly formed (claim 5). In this case, it can suppress more effectively that the said laminated cooler vibrates with respect to the said housing | casing. Moreover, since it becomes possible to make the shape of all the cooling pipes the same shape, it becomes easy to improve productivity.

Further, the protruding portion may be formed to protrude from a plurality of the cooling pipes that are not adjacent to each other (claim 6 ). In this case, the material cost can be reduced and the assembly of the laminated cooler to the base plate can be facilitated as compared with the case where the protruding portions are formed in all the cooling pipes.

In the second aspect of the present invention, the protrusion that is protruded from the connecting portion for connecting the cooling pipe adjacent. Thereby, since the part which positions between the said base plates will be formed in a different part from a cooling pipe, a deformation | transformation of a cooling pipe can be prevented reliably. As a result, the influence on the cooling performance of the stacked cooler can be further reduced.

Moreover, it is preferable that the said protrusion part protrudes to the said baseplate side rather than the said cooling pipe (Claim 14 ). In this case, for example, the stacked cooler can be sandwiched between a pair of flat plate-like base plates. Therefore, the structure of the base plate can be simplified and the assembly can be facilitated.

( Reference Example 1)
A power converter according to a reference example of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the power conversion device 1 of the present example is sandwiched between a stacked cooler 2 in which a plurality of cooling pipes 21 for circulating a cooling medium are stacked and connected, and an adjacent cooling pipe 21. It has a plurality of semiconductor modules 3 and a housing 4 that houses the stacked cooler 2 and the semiconductor modules 3.

As shown in FIG. 2, the housing 4 includes a base plate 41 that is disposed to face the stacked cooler 2 in a direction (Z direction) orthogonal to the stacked direction (X direction) in the stacked cooler 2.
The stacked cooler 2 includes a protruding portion 22 that protrudes toward the base plate 41. And the protrusion part 22 is comprised so that the position of the lamination | stacking cooler 2 with respect to the baseplate 41 about the normal line direction (Z direction) of the baseplate 41 may be controlled.

In the following, the stacking direction of the stacked cooler 2 is “X direction”, the normal direction of the base plate 41 is “Z direction”, and the stacking direction of the stacked cooler 2 and the direction orthogonal to the normal direction of the base plate 41 are “Y direction”. ".
In FIG. 3, the semiconductor module 3 is omitted.

  As shown in FIGS. 1 to 3, the cooling pipe 21 includes a pair of main surfaces facing opposite sides. A plurality of cooling pipes 21 are stacked such that the main surface is in the stacking direction (X direction), thereby forming the stacked cooler 2. The cooling pipe 21 has an elongated shape in the Y direction, and is configured such that the cooling medium flows in the Y direction through the inside thereof. The cooling pipe 21 has its wall portion made of a metal having excellent thermal conductivity such as aluminum. In addition to the cooling pipe 21, the stacked cooler 2 is made of a metal such as aluminum.

The coolers 21 adjacent to each other in the X direction are connected to each other by a connecting portion 23 in the vicinity of both ends in the Y direction. In this example, the connecting portion 23 is formed by fitting a protruding opening tube 210 integrated with one cooling tube 21 and a protruding opening tube 210 integrated with the other cooling tube 21. However, the structure of the connection part 23 is not restricted to this, For example, it can also form by joining the annular member which is a member different from the cooling pipe 21 to both the adjacent cooling pipes 21 (Example 6 mentioned later). reference).

In addition, a refrigerant introduction pipe 24 and a refrigerant discharge pipe 25 are attached in the vicinity of both ends in the Y direction of the cooling pipe 21 arranged at one end in the X direction so as to protrude in the X direction. As a result, the cooling medium can be introduced into the stacked cooler 2 from the refrigerant introduction pipe 24 and can be discharged from the refrigerant discharge pipe 25 after being circulated through the plurality of cooling pipes 21.
The semiconductor module 3 is sandwiched between adjacent cooling pipes 21 in the stacked cooler 2 configured as described above. Therefore, the semiconductor module 3 can be cooled by exchanging heat with the semiconductor module 3 while the cooling medium circulates in the stacked cooler 2.

  Further, as shown in FIGS. 2 and 3, a protruding portion 22 is formed to protrude in the Z direction from the end portion of the cooling pipe 21 in the Z direction. The protruding portion 22 is formed integrally with the cooling pipe 21 and is made of a metal such as aluminum, like the cooling pipe 21. However, the protrusion 22 has a lower rigidity than the wall of the cooling pipe 21.

  As shown in FIG. 3, the protrusions 22 are formed at a plurality of locations in the stacking direction (X direction) of the stacked cooler 2. In this example, the protruding portions 22 are formed in all the cooling pipes 21. Each cooling pipe 21 includes protrusions 22 at two locations in the Y direction.

Further, as shown in FIG. 2, the protrusion 22 is engaged with the base plate 41.
The base plate 41 has a through engagement hole 42 into which the protruding portion 22 is inserted and engaged. Here, as shown in FIG. 4, the through-engagement hole 42 of this example is formed in a rectangular shape elongated in the X direction at two locations in the Y direction of the base plate 41. One projecting portion 22 of the plurality of cooling pipes 21 is engaged with one through-engagement hole 42, and the other projecting portion 22 of the plurality of cooling pipes 21 is engaged with the other through-engagement hole 42. To do.

  In addition, as shown in FIG. 2, the protruding portion 22 includes a spring portion 220 that can be elastically deformed in a direction (Y direction) orthogonal to the protruding direction (Z direction) and the stacking direction (X direction). As shown in FIG. 7, the projecting portion 22 is engaged with the base plate 41 by the spring portion 220 being pressed against the inner side surface 420 of the through engagement hole 42.

As shown in FIG. 6, the spring portion 220 is formed so as to be folded back inward in the Y direction from the protruding end portion of the protruding portion 22. The protruding portion 22 including the spring portion 220 is formed of a plate-like body, and is formed so that the thickness direction of the plate-like body is the Y direction. The plate-like body is folded back in the thickness direction as described above to form a spring portion 220, and the folded portion is curved.
When the spring portion 220 formed in this manner is inserted into the through-engagement hole 42 in the base plate 41, the through-engagement hole 42 is in a state in which a biasing force (restoring force) is applied toward both sides in the Y direction. It will press-contact with the inner wall surface 420 of this.

  Further, in this state, the spring portion 220 comes into contact with the corner portion of the opening portion that opens on the surface opposite to the stacked cooler 2 in the through-engagement hole 42, so that the stacked cooler 2 contacts the base plate 41. A force that is pulled toward the target acts. As a result, the stacked cooler 2 and the semiconductor module 3 are held in the housing 4 in a state where the semiconductor module 3 sandwiched between the stacked coolers 2 is in contact with the base plate 41.

Next, the procedure for assembling the stacked cooler 2 to the housing 4 will be described with reference to FIGS.
First, as shown in FIGS. 5 and 6, the protruding portion 22 of the stacked cooler 2 is inserted into the through-engaging hole 42 of the base plate 41 from above (Z direction). In FIG. 5, only a part of the stacked cooler 2 is illustrated, and only the base plate 41 is illustrated for the housing 4.

As shown in FIG. 7, in the elastically deformed spring portion 220 after assembly, a restoring force is generated toward the inner side surface 420 of the through-engagement hole 42, and the protruding portion 22 is applied to the base plate 41 by this restoring force. It will be in the engaged state.
Next, the semiconductor module 3 is disposed between the adjacent cooling pipes 21. Note that the semiconductor module 3 may be disposed in the stacked cooler 2 before the stacked cooler 2 is disposed in the casing 4, and the semiconductor module 3 may be disposed in the casing 4 together with the stacked cooler 2. .

Next, the stacked cooler 2 in which the semiconductor module 3 is arranged is pressurized in the stacking direction (X direction) to increase the adhesion between the semiconductor module 3 and the cooling pipe 21. At this time, each cooling pipe 21 may move in the stacking direction (X direction) with respect to the base plate 41, but a through-engagement hole 42 with which the protrusion 22 is engaged is formed to be long in the X direction. Therefore, this movement can be allowed.
Moreover, the laminated cooler 2 after assembly is pressurized in the laminating direction (X direction) by a pressurizing member (not shown) composed of, for example, a leaf spring and the like, and the semiconductor module 3 and the cooling pipe 21 are in close contact. Power is retained.

Next, the effect of the power converter device 1 of this example is demonstrated.
In the power conversion device 1 of this example, the stacked cooler 2 includes a protrusion 22. And the protrusion part 22 is comprised so that the position of the lamination | stacking cooler 2 with respect to the baseplate 41 about the normal line direction (Z direction) of the baseplate 41 may be controlled. Thereby, the position of the stacked cooler 2 in the Z direction with respect to the housing 4 is regulated. Therefore, when the vibration is applied to the power conversion device 1, the stacked cooler 2 can be prevented from vibrating in the Z direction with respect to the housing 4.

  Further, as described above, the protruding portion 22 protruding from the stacked cooler 2 is used as means for regulating the position of the stacked cooler 2 with respect to the base plate 41. Therefore, a portion for positioning with respect to the base plate 41 is formed in a portion away from the cooling pipe 21 and the like in the stacked cooler 2. Therefore, it is possible to suppress external force such as vibration from being applied to the cooling pipe 21 and the like from the base plate 41 and to prevent the cooling performance from being affected.

  Further, since the protruding portion 22 is formed so as to protrude from the stacked cooler 2, it is not necessary to perform positioning by assembling another member with respect to the stacked cooler 2. Therefore, the number of parts of the power conversion device 1 can be reduced and the number of assembly steps can be reduced.

  Further, the protruding portion 22 has lower rigidity than the wall portion of the cooling pipe 21. Thereby, the protrusion 22 can be preferentially deformed over the cooling pipe 21. Thereby, it can suppress that external forces, such as a vibration, are applied to the cooling pipe 21 from the base plate 41, and the deformation | transformation of the cooling pipe 21 can be prevented. Therefore, it is possible to effectively prevent the cooling performance from being affected.

  The protrusions 22 are formed at a plurality of locations in the stacking direction (X direction) of the stacked cooler 2. Thereby, the position of the stacked cooler 2 in the Z direction with respect to the housing 4 can be easily regulated. Therefore, it is possible to effectively suppress the laminated cooler 2 from vibrating in the Z direction with respect to the housing 4.

  Further, the protrusion 22 is engaged with the base plate 41. Thereby, the position restriction | limiting of the laminated cooler 2 with respect to the housing | casing 4 can be easily performed about both of a Z direction. Therefore, it is possible to effectively suppress the laminated cooler 2 from vibrating in the Z direction with respect to the housing 4. In addition, the position of the stacked cooler 2 in the direction parallel to the base plate 41 can be restricted.

  The base plate 41 includes a through-engagement hole 42 into which the protruding portion 22 is inserted and engaged. The protruding portion 22 includes a spring portion 220 that is elastically deformable in a direction orthogonal to the protruding direction. The projecting portion 22 is engaged with the base plate 41 by 220 being in pressure contact with the inner surface of the through engagement hole 42. Thereby, the protrusion 22 can be easily and stably engaged with the base plate 41.

  Further, the spring part 220 is formed to be elastically deformed in a direction (Y direction) orthogonal to the stacking direction (X direction). Thereby, the position of the stacked cooler 2 with respect to the base plate 41 is also regulated in the Y direction in addition to the Z direction. In addition, with this configuration, the position of the stacked cooler 2 can be prevented from being restricted with respect to the base plate 41 in the X direction. As a result, after the stacked cooler 2 is assembled to the housing 4 together with the semiconductor module 3, it is possible to make adjustments such as compressing the stacked cooler 2 in the X direction.

  The cooling pipe 21 includes protrusions 22 at a plurality of locations in the stacking direction (X direction) and the direction (Y direction) orthogonal to the normal direction (Z direction) of the base plate 41. Thereby, it can suppress more effectively that the lamination | stacking cooler 2 vibrates with respect to the housing | casing 4. FIG.

  Further, the protruding portion 22 is formed so as to protrude from all the cooling pipes 21. Thereby, it can suppress more effectively that the lamination | stacking cooler 2 vibrates with respect to the housing | casing 4. FIG. Moreover, since it becomes possible to make the shape of all the cooling pipes 21 into the same shape, it becomes easy to improve productivity.

  As described above, according to this example, it is possible to provide a power conversion device that can suppress the vibration of the stacked cooler without affecting the cooling performance, and can be easily assembled with a reduced number of components.

In addition, in the power converter device 1 of this example, as shown in FIG. 3, the protruding portions 22 are formed in all the cooling pipes 21, but the invention is not limited to this, and some of the cooling pipes 21 are not limited thereto. You may form only. For example, the protruding portions 22 may be formed to protrude from a plurality of cooling pipes 21 that are not adjacent to each other. In this case, the material cost can be reduced and the assembly of the stacked cooler 2 to the base plate 41 can be facilitated as compared with the case where the protruding portions 22 are formed in all the cooling pipes 21.
In some cases, the protrusion 22 may be formed only on one cooling pipe 21.

Moreover, although the protrusion part 22 of this example is integrally formed with the cooling pipe 21, you may form the protrusion part 22 separately from the cooling pipe 21, for example.
Moreover, although the cooling pipe 21 of this example is equipped with the protrusion part 22 in two places of the Y direction, it is not limited to this, For example, the formation location of the protrusion part 22 in each cooling pipe 21 is 3 It may be more than one location, or may be one.

( Reference Example 2)
In this example, as shown in FIGS. 8 to 10, the spring portion 220 in the protruding portion 22 is formed to be elastically deformed in the stacking direction (X direction).
Also in this example, the protruding portion 22 is formed by bending a plate-like body protruding from the cooling pipe 21, and is arranged so that the plate thickness direction of the plate-like body is the X direction. .

As shown in FIG. 9, the through-engagement holes 42 of the base plate 41 are formed according to the number of protrusions 22 formed. That is, one through-engagement hole 42 is formed at a predetermined position of the base plate 41 with respect to one protrusion 22.
The through-engagement hole 42 is formed in a rectangular shape that is slightly long in the Y direction so that the spring portion 220 of the protruding portion 22 can be through-engaged.

Also in the power conversion device 1 of the present example, when the stacked cooler 2 is disposed in the housing 4, the protruding portion 22 of the stacked cooler 2 is placed above the through-engagement hole 42 of the base plate 41 as shown in FIG. 10. Insert and assemble from (Z direction). However, in this example, since the through-engagement hole 42 is not formed long in the X direction, the stacked body of the stacked cooler 2 and the semiconductor module 3 is formed after the protrusion 22 is engaged with the base plate 41. It is difficult to compress in the X direction. Therefore, in the case of this example, the laminated cooler 2 and the semiconductor module 3 are combined outside the housing 4 and compressed in the laminating direction (X direction), and then these laminated bodies are placed in the housing 4. It will be arranged.
Others are the same as in Reference Example 1.

The spring portion 220 of this example is elastically deformed in a direction parallel to the stacking direction (X direction), and the shape of the through-engagement hole 42 of the base plate 41 is such that the spring portion 220 of the protruding portion 22 can be through-engaged. These are formed according to the number of protrusions 22. Thereby, positioning of the laminated cooler 2 with respect to the base plate 41 of the housing 4 when assembled can be facilitated.
In addition, the same effects as those of Reference Example 1 are obtained.

(Example 1 )
In this example, as shown in FIGS. 11 and 12, a through portion 421 and a step portion 422 are formed in the through engagement hole 42, and a stopper portion 221 that can come into surface contact with the step portion 422 is formed in the spring portion 220. This is an example.

  As shown in FIGS. 11 and 12, the through-engagement hole 42 penetrates in the normal direction (Z direction) of the base plate 41, and is adjacent to the through-part 421 and opposite to the stacked cooler 2 ( A stepped portion 422 that is recessed from the lower surface in FIGS. 11 and 12 is formed. The step portion 422 includes a side wall surface 423 facing the penetrating portion 421 side and a bottom wall surface 424 facing the penetrating direction of the penetrating portion 421.

  Further, the spring portion 220 has a stopper portion 221 that can come into surface contact with the bottom wall surface 424 of the step portion 422. That is, the spring portion 220 is bent at the tip of the folded portion that is folded back from the tip of the protruding portion 22 so as to be orthogonal to the protruding direction (Z direction) of the protruding portion 22 to form the stopper portion 221. ing.

As shown in FIG. 12, when the spring part 220 is fitted into the through-engagement hole 42, a part of the spring part 220 comes into contact with the corner part of the side wall part 423 of the step part 422, and the stopper part 221 is the bottom wall. Opposed to the part 424. Here, the stopper part 221 may be in contact with the bottom wall part 424, or may be opposed through a gap.
Others are the same as in Reference Example 1.

In the case of this example, the stopper portion 221 of the spring portion 220 can be brought into surface contact with the bottom wall surface 424 of the step portion 422. Therefore, the protrusion 22 can be reliably engaged with the base plate 41, and the protrusion 22 can be reliably prevented from coming off from the base plate 41. Therefore, even when a large vibration is applied to the power conversion device 1, the stacked cooler 2 can be reliably suppressed from greatly vibrating with respect to the housing 4.
In addition, the same effects as those of Reference Example 1 are obtained.

(Example 2 )
In this example, as shown in FIG. 13, the protruding portion 22 is provided at the connecting portion 23 in the stacked cooler 2, and the stacked cooler 2 is sandwiched between a pair of base plates 41.
The protruding portion 22 is formed to protrude from a connecting portion 23 that connects adjacent cooling pipes 21. Specifically, the protruding portion 22 is formed by extending a part of one protruding opening tube 210 constituting the connecting portion 23.

  As shown in FIG. 13, the housing 4 includes a pair of base plates 41 arranged to face each other. Specifically, the housing 4 includes a case body 401 having a substantially rectangular parallelepiped box shape in which one surface in the Z direction is opened, and a lid body 402 disposed so as to close the open surface of the case body 401. It consists of. One of the pair of base plates 41 constitutes the bottom surface portion of the case main body 401, and the other is the lid body 402. The lid 402 is fixed to the case main body 401 with bolts or the like.

  In the power conversion device 1 of this example, the stacked cooler 2 is sandwiched between a pair of base plates 41, and the protruding portion 22 is in contact with one of the pair of base plates 41 (lid body 402). The cooling pipe 21 of the stacked cooler 2 is brought into contact with the other base plate 41 (the bottom surface of the case main body 401).

Further, in this example, the protruding portion 22 does not protrude in the Z direction from the cooling pipe 21. For this reason, the base plate 41 (lid body 402) on the side in contact with the protruding portion 22 is formed with a plurality of convex portions 43 that protrude toward the protruding portion 22. The protruding portion 22 is in contact with the convex portion 43.
Others are the same as in Reference Example 1.

In the case of this example, it is easy to simplify the structure of the base plate 41 and to easily assemble the stacked cooler 2 to the housing 4. That is, by adopting a structure in which the stacked cooler 2 is sandwiched between a pair of base plates 41, for example, an engaged portion in which the protruding portion 22 engages with the base plate 41 (for example, FIGS. 2 to 5 of Reference Example 1). The processing such as forming the through-engagement hole 42) shown in FIG. Moreover, since the operation | work which engages the protrusion part 22 with a to-be-engaged part becomes unnecessary in connection with this, an assembly | attachment can be made easier. In addition, by restricting the position of the stacked cooler 2 by bringing the protruding portion 22 into contact with the base plate 41, it is possible to prevent the cooling pipe 21 and the like of the stacked cooler 2 from being deformed.

Further, the protruding portion 22 is formed to protrude from a connecting portion 23 that connects adjacent cooling pipes 21 to each other. Accordingly, a portion for positioning with respect to the base plate 41 is formed in a portion different from the cooling pipe 21, so that the deformation of the cooling pipe 21 can be reliably prevented. As a result, the influence on the cooling performance of the stacked cooler 2 can be further reduced.
In addition, the same effects as those of Reference Example 1 are obtained.

(Example 3 )
In this example, as shown in FIG. 14, the stacked cooler 2 is sandwiched between a pair of base plates 41, and the projecting portions 22 are brought into contact with both the pair of base plates 41.
The stacked cooler 2 is formed by projecting protrusions 22 from the connecting pipe 23 toward the pair of base plates 41, and the protrusions 22 are in contact with both of the pair of base plates 41.
Further, in this example, convex portions 43 with which the protruding portions 22 can abut are formed on both of the pair of base plates 41 (the lid portion 402 and the bottom surface portion of the case main body 401).
Others are the same as in the second embodiment.

In the case of this example, it is possible to prevent the stacked cooler 2 from coming into contact with the base plate 41 at a portion other than the projecting portion 22, so that the cooling pipe 21 and the like of the stacked cooler 2 can be more reliably deformed. Can be prevented.
In addition, the same effects as those of the second embodiment are obtained.

(Example 4 )
In this example, as shown in FIG. 15, the protruding portion 22 is formed to protrude from the cooling pipe 21 toward the base plate 41.
The stacked cooler 2 is sandwiched between the pair of base plates 41, and the protruding portion 22 is brought into contact with one of the pair of base plates 41 (the lid body 402). The cooling pipe 21 of the stacked cooler 2 is in contact with the other base plate 41 (the bottom surface of the case body 401).
The protrusion 22 may be in contact with the bottom surface of the case main body 401 and the cooling pipe 21 may be in contact with the lid 402.
Others are the same as in the second embodiment.

In the case of this example, the stacked cooler 2 can be sandwiched between a pair of flat base plates 41. Therefore, the structure of the base plate 41 can be simplified and the assembly can be facilitated.
In addition, the same effects as those of the second embodiment are obtained.

(Example 5 )
In this example, as shown in FIG. 16, the protruding portion 22 is protruded from the cooling pipe 21 toward both the pair of base plates 41.
Thus, both the protruding portion 22 protruding from the connecting portion 23 toward the one base plate 41 (the bottom surface portion of the case main body 401) and the protruding portion 22 protruding toward the other base plate 41 (the lid portion 402) are 41 abuts.
Others are the same as in the fourth embodiment.
According to this example, both the operational effects of the third embodiment and the operational effects of the fourth embodiment described above can be achieved.

(Example 6 )
In this example, as shown in FIG. 17, the connecting portion 23 is configured by an annular member that is a member different from the cooling pipe 21, and the protruding portion 22 is protruded from the outer peripheral surface of the annular member.
That is, the connecting portion 23 is formed by joining an annular member to the cooling pipe 21. From the outer peripheral surface of this connection part 23, the protrusion part 22 is protruded and formed to at least one side of the Z direction. Further, the protruding portion 22 protrudes from the cooling pipe 21 toward one base plate 41 (lid portion 402). Thereby, the protrusion part 22 is contact | abutting to the flat cover part 402 (base plate 41).
The stacked cooler 2 is in contact with the other base plate 41 (the bottom surface of the case body 401) in the cooling pipe 21.
Others are the same as in the fourth embodiment.

In the case of this example, since the protrusion 22 is formed in the connecting pipe 23 (annular member) which is a member different from the cooling pipe 21, the processing becomes easy.
In addition, the same effects as those of the fourth embodiment can be obtained.

In addition, the protrusion part 22 can also be formed cyclically | annularly over the perimeter of the connection part 23. FIG. In this case, the protruding portion 22 can be protruded from the cooling pipe 21 in both the Z directions. Therefore, similarly to the fifth embodiment, the protruding portion 22 can be brought into contact with the pair of base plates 41.

The power conversion device of the present invention can take various modes other than the above-described embodiments.
For example, it is possible to adopt a configuration in which a protruding portion protruding from the cooling pipe is brought into contact with the base plate, or a protruding portion protruding from the connecting portion can be engaged with the base plate.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Laminated cooler 21 Cooling pipe 22 Protruding part 3 Semiconductor module 4 Housing 41 Base plate

Claims (16)

A laminated cooler in which a plurality of cooling pipes for circulating a cooling medium are laminated and connected;
A plurality of semiconductor modules sandwiched between adjacent cooling pipes;
A housing for housing the stacked cooler and the semiconductor module;
The housing has a base plate disposed to face the stacked cooler in a direction orthogonal to the stack direction in the stacked cooler,
The stacked cooler includes a protrusion that protrudes toward the base plate,
The protrusion may Ri Thea configured to regulate the position of the laminated condenser for the base plate for the normal direction of the base plate,
The protrusion is engaged with the base plate,
The base plate includes a through-engagement hole into which the protruding portion is inserted and engaged, and the protruding portion includes a spring portion that is elastically deformable in a direction orthogonal to the protruding direction, and the spring portion passes through the through-hole. The protrusion is engaged with the base plate by being pressed against the inner surface of the engagement hole,
The through engagement hole is formed with a through portion penetrating in the normal direction of the base plate, and a step portion adjacent to the through portion and recessed from the surface opposite to the stacked cooler. Comprises a side wall surface facing the penetrating portion side and a bottom wall surface facing the penetrating direction of the penetrating portion, and the spring portion has a stopper portion that can come into surface contact with the bottom wall surface of the stepped portion. The power converter characterized by this. The power converter according to claim 1, wherein the spring portion is formed to be elastically deformed in a direction orthogonal to the stacking direction . 3. The power conversion device according to claim 1, wherein the protruding portion is formed to protrude from the cooling pipe . 4. The power conversion device according to claim 3, wherein the cooling pipe includes the protrusions at a plurality of locations in a direction orthogonal to the stacking direction and a normal direction of the base plate. . 5. The power conversion device according to claim 3, wherein the protrusion is formed so as to protrude from all the cooling pipes . 6. 5. The power conversion device according to claim 3, wherein the protrusion is formed to protrude from the plurality of cooling pipes that are not adjacent to each other . 3. The power conversion device according to claim 1, wherein the protruding portion is formed to protrude from a connecting portion that connects the adjacent cooling pipes . A laminated cooler in which a plurality of cooling pipes for circulating a cooling medium are laminated and connected;
A plurality of semiconductor modules sandwiched between adjacent cooling pipes;
A housing for housing the stacked cooler and the semiconductor module;
The housing has a base plate disposed to face the stacked cooler in a direction orthogonal to the stack direction in the stacked cooler,
The stacked cooler includes a protrusion that protrudes toward the base plate,
The protrusion is configured to regulate the position of the stacked cooler relative to the base plate with respect to the normal direction of the base plate;
The power converter according to claim 1, wherein the protruding portion is formed to protrude from a connecting portion that connects the adjacent cooling pipes . The power conversion device according to claim 8, wherein the protruding portion is engaged with the base plate . The power conversion device according to claim 9, wherein the base plate includes a through-engagement hole into which the protrusion is inserted and engaged, and the protrusion is elastically deformable in a direction perpendicular to the protrusion direction. A power conversion device comprising: a spring portion, wherein the protrusion is engaged with the base plate when the spring portion is in pressure contact with an inner surface of the through engagement hole . The power converter according to claim 10, wherein the spring portion is formed to be elastically deformed in a direction orthogonal to the stacking direction . 9. The power conversion device according to claim 8, wherein the casing includes a pair of the base plates arranged to face each other, the stacked cooler being sandwiched between the pair of base plates, and the protruding portion being the A power converter, wherein the power converter is in contact with at least one of a pair of base plates . 13. The power conversion device according to claim 12, wherein the stacked cooler is formed by protruding the protruding portions toward the pair of base plates, and the protruding portions are in contact with both of the pair of base plates. The power converter characterized by the above-mentioned. 14. The power conversion device according to claim 7, wherein the protruding portion protrudes toward the base plate from the cooling pipe . The power converter according to any one of claims 1 to 14, wherein the protruding portion has a lower rigidity than a wall portion of the cooling pipe .   16. The power conversion device according to claim 1, wherein the protrusions are formed at a plurality of locations in the stacking direction of the stacked cooler.

Images