JP6237312B2 - Power converter - Google Patents

Description

  The present invention relates to a power conversion device including a stacked cooler having a plurality of cooling pipes and an electronic component sandwiched between adjacent cooling pipes in the stacked cooler.

  There is known a power conversion device that performs power conversion between DC power and AC power. For example, the power conversion device disclosed in Patent Document 1 includes a semiconductor stacked unit in which a plurality of semiconductor modules and a plurality of cooling pipes are stacked in a case. The power terminal of the semiconductor module is connected to the bus bar, and the control terminal of the semiconductor module is connected to the circuit board.

  In such a configuration, when the vibration of the semiconductor laminated unit is increased, a stress is applied to the connection portion between the semiconductor module and the bus bar or the circuit board, and the life thereof may be reduced. Therefore, Patent Document 1 proposes a configuration in which a fixing member is provided at the center in the stacking direction of the semiconductor stacked unit where the vibration is greatest.

JP 2011-134413 A

  However, in the configuration of Patent Document 1, since the rigidity of the case itself is not particularly increased, it is conceivable that the case is deformed by an external force. When the case is deformed, the stacked cooler is deformed or displaced, and at the same time, the semiconductor module is displaced. If it becomes so, there exists a possibility that a stress may be applied to the connection part of the power terminal and bus bar of a semiconductor module, and the connection part of a control terminal and a circuit board. That is, when the electronic component sandwiched between the stacked coolers is displaced in the case, stress is applied to the connection portion between the electronic component and another component.

  Moreover, electromagnetic noise is generated due to the current flowing through the semiconductor module. Therefore, when other electronic components such as a circuit board and a capacitor are arranged around the semiconductor module, there is a risk of affecting these.

  In addition to the semiconductor module, the power converter is provided with heat generating components such as capacitors and bus bars in the case. However, in the configuration of Patent Document 1, the entire power converter including these heat generating members is arranged. There is room for improvement in cooling.

  The present invention has been made in view of such a background. Even when an external force is applied to the case, the position of the electronic component disposed in the multilayer cooler is prevented from being changed, the influence of electromagnetic noise is suppressed, and the entire case is cooled. An object of the present invention is to provide a power conversion device with excellent performance.

One aspect of the present invention is a stacked cooler having a plurality of cooling tubes arranged in a stacked manner with a gap between each other, and an electronic component sandwiched between adjacent cooling tubes in the stacked cooler; A power conversion device having a case in which the stacked cooler and the electronic component are housed inside;
The case includes a rear wall portion and a front wall portion respectively arranged at the rear and front in the stacking direction of the stacked cooler,
A pair of side wall portions provided to connect the rear wall portion and the front wall portion at both ends;
The laminated cooler is formed so as to surround from one side of the laminating direction, both of the longitudinal direction of the cooling pipe, and both of the height direction perpendicular to both the laminating direction and the longitudinal direction of the cooling pipe , An enclosing member having conductivity ,
The rear wall has a wall opening that penetrates in the stacking direction,
The wall opening is fixed to the case and closed by a closing member integrated with the stacked cooler ,
The laminated cooler, when viewed from the laminating direction, have a shape that fits inside the contour of the wall opening,
The wall opening has a shape surrounded by a smoothly continuous closed curve when viewed from the stacking direction,
The surrounding member has a surrounding member body formed so as to cover the stacked cooler from the longitudinal direction and the height direction, and a front surrounding portion that covers the stacked cooler from the front,
When viewed from the stacking direction, the stack cooler has a shape that fits inside the outer shape of the front enclosure,
When viewed from the stacking direction, the stacked cooler has a shape that fits inside the outer shape of the closing member,
The surrounding member body is divided into two parts in the longitudinal direction,
The two portions of the surrounding member body have a U-shaped cross section perpendicular to the laminating direction and curved in a U shape with the opening directions facing each other. Is formed along the inner peripheral surface of the part,
The surrounding member main body is formed in the power conversion device characterized in that it is formed over the entire region where the stacked cooler is disposed in the stacking direction .

  In the above power conversion device, the case includes a surrounding member formed so as to surround the stacked cooler from one side in the stacking direction, both the longitudinal direction of the cooling pipe, and both the height direction. Therefore, the rigidity around the stacked cooler in the case can be increased. Thereby, even if an external force is applied to the case, it is possible to prevent the peripheral portion of the stacked cooler from being deformed. As a result, deformation and displacement of the multilayer cooler can be prevented, and position fluctuations of electronic components arranged in the multilayer cooler can be prevented.

  Further, by enclosing the stacked cooler with a surrounding member, electromagnetic noise generated from electronic components sandwiched between adjacent cooling pipes in the stacked cooler is prevented from affecting other surrounding electronic components. be able to.

  Further, since the surrounding member surrounds the stacked cooler, it is easily cooled by the stacked cooler. Accordingly, the entire case is easily cooled. Thereby, the temperature rise of not only the electronic components arranged in the stacked cooler but also other components arranged in the case can be suppressed.

  As described above, according to the present invention, even when an external force is applied to the case, the position of the electronic components disposed in the multilayer cooler is prevented from being changed, the influence of electromagnetic noise is suppressed, and the power in the case is excellent in the cooling performance. A conversion device can be provided.

The top view of the power converter device in Example 1. FIG. II-II arrow sectional drawing of FIG. III-III arrow sectional drawing of FIG. The perspective view for demonstrating the process in which a lamination | stacking cooler, a semiconductor module, and a pressurization member are accommodated in a surrounding member in Example 1. FIG. Side surface sectional drawing for demonstrating the process in which a lamination | stacking cooler, a semiconductor module, and a pressurization member are accommodated in a surrounding member in Example 1. FIG. Sectional drawing which shows the magnitude | size of the opening part of the surrounding member in Example 2. FIG. The top view of the power converter device in Example 3. FIG. The top view of the power converter device in Example 4. FIG. The top view of the power converter device in Example 5. FIG. AA arrow sectional drawing of FIG. The top view of the power converter device in Example 6. FIG. XII-XII arrow sectional drawing of FIG.

The power conversion device of the present invention can be used for, for example, an electric vehicle and a hybrid vehicle.
In the present specification, in the stacking direction of the stacked cooler, the side on which the blocking member is disposed is referred to as the rear, and the opposite direction is referred to as the front.

Example 1
Examples of the power conversion device will be described with reference to FIGS.
As shown in FIGS. 1 and 2, the power conversion device 1 of the present example is adjacent to the stacked cooler 2 having a plurality of cooling pipes 21 that are stacked while providing a gap between them. It has the semiconductor module 3 as an electronic component pinched | interposed between the cooling pipes 21, and the case 4 which accommodates the lamination | stacking cooler 2 and the semiconductor module 3 inside.

  The case 4 includes a rear wall portion 411 and a front wall portion 412 which are respectively arranged on the rear and front sides in the stacking direction of the stacked cooler 2 (hereinafter referred to as “X direction”), the rear wall portion 411 and the front wall. It has a pair of side wall part 413 provided so that the part 412 might be connected in each both ends, and the surrounding member 42. FIG. The surrounding member 42 is perpendicular to the laminated cooler 2 in one of the X directions, both in the longitudinal direction of the cooling pipe 21 (hereinafter referred to as “Y direction”), and in both the X direction and the Y direction of the cooling pipe 21. It is formed so as to surround both from the height direction (hereinafter referred to as “Z direction”).

The rear wall 411 has a wall opening 401 that penetrates in the X direction. The wall opening 401 is closed by the closing member 5 fixed to the case 4.
The stacked cooler 2 has a shape that fits inside the outer shape of the wall opening 401 when viewed from the X direction.

  As shown in FIGS. 1 and 2, the semiconductor module 3 is sandwiched by cooling pipes 21 from both sides in the X direction. The semiconductor module 3 protrudes in one side (hereinafter, referred to as “upward”) in the Z direction, and a main body 33 including a switching element such as an IGBT (insulated gate bipolar transistor) and a diode such as an FWD (free wheel diode). And a control terminal 32 protruding to the other side in the Z direction (hereinafter referred to as “downward”). The power terminal 31 is connected to the bus bar, and the control terminal 32 is connected to the circuit board 11. As shown in FIGS. 2 and 3, the circuit board 11 is fixed to the board fixing portion 46 of the case 4. The board fixing part 46 is formed so as to protrude downward from the surrounding member 42 and a connection bottom part 45 to be described later.

  As shown in FIG. 1, the plurality of cooling pipes 21 are long in the direction orthogonal to the X direction, and adjacent cooling pipes 21 are connected to each other by deformable connecting pipes 22 at both ends in the Y direction. 2 is constituted. The stacked cooler 2 includes a refrigerant introduction pipe 23 that introduces a cooling medium into the stacked cooler 2 and a cooling medium from the stacked cooler 2 on both ends of the rear end cooling pipe 21 a disposed at the rear end in the X direction. The refrigerant discharge pipe 24 is connected to the refrigerant discharge pipe 24. The refrigerant introduction pipe 23 and the refrigerant discharge pipe 24 protrude from the stacked cooler 2 toward the rear wall portion 411. The laminated cooler 2 is made of a metal having excellent thermal conductivity such as aluminum. Note that the arrangement direction of the refrigerant introduction pipe 23 and the refrigerant discharge pipe 24 coincides with the arrangement direction of the pair of side wall portions 413 in the case 4.

  The cooling medium introduced from the refrigerant introduction pipe 23 passes through the connection pipe 22 as appropriate, is distributed to the respective cooling pipes 21 and circulates in the Y direction. The cooling medium exchanges heat with the semiconductor module 3 while flowing through each cooling pipe 21. The cooling medium whose temperature has been increased by heat exchange passes through the downstream connecting pipe 22 as appropriate, is led to the refrigerant discharge pipe 24, and is discharged from the stacked cooler 2.

  Examples of the cooling medium include natural refrigerants such as water and ammonia, water mixed with ethylene glycol antifreeze, fluorocarbon refrigerants such as Fluorinert (registered trademark), Freon refrigerants such as HCFC123 and HFC134a, methanol, alcohol An alcohol-based refrigerant such as acetone or a ketone-based refrigerant such as acetone can be used.

In the case 4, the rear wall portion 411 faces the front wall portion 412, and the pair of side wall portions 413 face each other.
The partition wall 43 is formed by the first partition 431 formed in parallel with the rear wall 411 and the second partition 432 formed to extend from one end of the first partition 431 in the Y direction toward the front side. ing. In the Y direction, one end portion of the first partition wall 431 is connected to one side wall portion 413, and the other end portion is disposed at a position away from the other side wall portion 413. Then, as shown in FIG. 2, a bottom wall portion 44 perpendicular to the Z direction is formed so as to close the space surrounded by the partition wall portion 43, a part of the front wall portion 412, and a part of the side wall portion 413. Has been. The capacitor 12 is arranged in a space surrounded by the partition wall 43, a part of the front wall part 412, a part of the side wall part 413, and the bottom wall part 44.

  As shown in FIGS. 1 and 2, a surrounding member 42 is formed in front of the partition wall 43 in the case 4. As shown in FIGS. 1 and 3, the enclosing member 42 includes an enclosing member main body 421 formed so as to cover the stacked cooler 4 from the Y direction and the Z direction, and a front enclosing portion 422 that is also a part of the first partition 431. It is composed of An opening 420 that is open over the entire X direction is formed at the center of the surrounding member main body 421 in the Y direction. The size of the opening 420 in the Y direction is larger than the size of the semiconductor module 3 in the Y direction. The surrounding member main body 421 is divided into two parts in the Y direction via the opening 420, one of which is directly connected to one side wall 413 and the other connected to the other side wall 413. Connected through. As shown in FIG. 3, the two portions of the enclosing member 42 have a cross-sectional shape orthogonal to the X direction curved in a U shape with the opening directions facing each other.

  As shown in FIGS. 1 and 2, the stacked cooler 2 and the semiconductor module 3 are disposed inside the enclosing member 42. Further, the pressurizing member 6 is disposed between the front end cooling pipe 21 b disposed at the front end portion in the X direction in the stacked cooler 2 and the first partition 431. The stacked cooler 2 is pressed in the X direction by the urging force of the pressing member 6. The pressurizing member 6 can be configured by an elastic member such as a coil spring, a leaf spring, or rubber.

  A closing member 5 for fixing the stacked cooler 2 to the case 4 is joined to the rear side surface of the rear end cooling pipe 21a. When viewed from the X direction, the outer shape of the blocking member 5 has a rectangular shape in which the outer shape of the wall portion opening 401 fits inside. Moreover, the closing member 5 has the closing convex part 51 which protruded toward the front side. The blocking convex portion 51 is formed with an outer shape that fits inside the wall opening 401 when viewed from the X direction, and its front end surface is in close contact with and joined to the rear end surface of the rear end cooling pipe 21a. Has been. The closing projection 51 and the rear end cooling pipe 21a can be joined by brazing, welding, or the like. Further, the thickness in the X direction of the closing projection 51 is larger than the thickness in the X direction of the wall opening 401.

  Further, the closing member 5 is provided with insertion holes for inserting and arranging the refrigerant introduction pipe 23 and the refrigerant discharge pipe 24 side by side in the Y direction. The refrigerant introduction pipe 23 and the refrigerant discharge pipe 24 respectively penetrate two insertion holes provided in the closing member 5. The closing member 5 is provided with a pipe seal member 13 over the entire inner periphery of each insertion hole. The refrigerant introduction pipe 23 and the refrigerant discharge pipe 24 are in close contact with the pipe seal member 13. The blocking member 5 is fixed to the rear wall 411 of the case 4 with bolts or the like (not shown). As a result, the wall opening 401 is sealed by the closing member 5. Further, the case 4 is sealed on both sides in the Z direction by lids (not shown). As described above, the inside of the case 4 is hermetically sealed.

  The case 4 (including the surrounding member 42) and the closing member 5 are made of a metal or an alloy such as aluminum or iron, for example.

The stacked cooler 2, the semiconductor module 3, and the pressure member 6 are accommodated in the surrounding member 42 as follows, for example.
As shown in FIGS. 4 and 5, the pressure member 6 is disposed inside the surrounding member 42 and on the rear surface side of the front surrounding portion 422. Then, the stacked cooler 2 with the closing member 5 bonded to the rear end is inserted into the surrounding member 42 from the front end side through the wall opening 401.

  Next, the semiconductor module 3 is disposed between the adjacent cooling pipes 21 in the stacked cooler 2. At this time, the semiconductor module 3 is inserted into the surrounding member 42 through the opening 420. Then, the closing member 5 is pushed forward and fixed to the rear wall 411. When the closing member 5 is fixed to the rear wall 411, the stacked cooler 2 is pressed forward by the closing member 5. Thereby, the connecting pipe 22 is deformed so as to be short in the X direction, the distance between the adjacent cooling pipes 21 is reduced, and the semiconductor module 3 is sandwiched between the cooling pipes 21. In addition, when the pressurizing member 6 is compressed and deformed by the stacked cooler 2, an urging force is generated in the pressurizing member 6, and the stacked cooler 2 and the semiconductor module 3 are maintained in the X direction.

Next, the function and effect of this example will be described.
In the power conversion device 1, the case 4 includes a surrounding member 42 formed so as to surround the stacked cooler 2 from one side in the X direction, both the Y direction of the cooling pipe 21, and both the Z direction. Therefore, the rigidity around the stacked cooler 2 in the case 4 can be increased. Thereby, even if an external force is applied to the case 4, it is possible to prevent the peripheral portion of the stacked cooler 2 from being deformed. As a result, deformation and displacement of the stacked cooler 2 can be prevented, and position fluctuations of the semiconductor module 3 disposed in the stacked cooler 2 can be prevented.

  Further, by enclosing the multilayer cooler 2 with the surrounding member 42, electromagnetic noise generated from the semiconductor module 3 sandwiched between adjacent cooling pipes 21 in the multilayer cooler 2 affects other surrounding electronic components. Giving can be suppressed.

  Further, since the surrounding member 42 surrounds the stacked cooler 2, it is easily cooled by the stacked cooler 2. Accordingly, the entire case 4 is easily cooled. Thereby, the temperature rise of not only the semiconductor module 3 arranged in the stacked cooler 2 but also other parts arranged in the case 4 can be suppressed.

  A part of the plurality of board fixing portions 46 that fix the circuit board 11 is provided in the surrounding member 42. Thereby, since the circuit board 11 can be fixed near the semiconductor module 3, it is possible to improve the assembly accuracy between the control terminal 32 of the semiconductor module 3 and the circuit board 11. Accordingly, stress applied to the joint between the control terminal 32 and the circuit board 11 and the control terminal 32 itself can be relaxed. The semiconductor module 3 is fixed to the surrounding member 42 through the stacked cooler 2, and the circuit board 11 is fixed through the substrate fixing part 46. Therefore, when the power conversion device 1 vibrates, the semiconductor module 3 and the circuit board 11 vibrate in the same phase. Therefore, when the power conversion device 1 vibrates, it is possible to suppress stress from being applied to the joint portion between the control terminal 32 of the semiconductor module 3 and the circuit board 11.

  A bus bar fixing portion that fixes a bus bar joined to the power terminal 31 of the semiconductor module 3 may be provided in the surrounding member 42. In this case, the assembly accuracy between the power terminal 31 and the bus bar of the semiconductor module 3 can be improved, and the stress applied to the joint between the power terminal 31 and the bus bar and the power terminal 31 itself can be reduced. it can.

  As described above, according to this example, even if an external force is applied to the case, the position of the electronic components arranged in the multilayer cooler is prevented, the influence of electromagnetic noise is suppressed, and the power in the case is excellent in cooling performance. A conversion device can be provided.

(Example 2)
In this example, as shown in FIG. 6, the size in the Y direction of the opening 420 formed in the surrounding member 42 is changed. That is, the size of the upper opening 420 in the surrounding member 42 in the Y direction is reduced.

  Specifically, the size of the upper opening 420 in the surrounding member 42 in the Y direction is made smaller than the size of the semiconductor module 3 in the Y direction, and the power terminal 31 of the semiconductor module 3 protrudes from the opening 420. The size is as large as possible. The size of the lower opening 420 of the surrounding member 42 in the Y direction is larger than the size of the semiconductor module 3 in the Y direction. That is, the lower opening 420 of the surrounding member 42 is larger in the Y direction than the upper opening 420.

The main body 33 of the semiconductor module 3 is in contact with the surrounding member main body 421 on both sides in the Y direction of the opening 420 on the upper side of the surrounding member 42.
In this example, the semiconductor module 3 is inserted from the lower opening 420 into the surrounding member 42.

  Others are the same as in the first embodiment. Of the reference numerals used in this example or the drawings relating to this example, the same reference numerals as those used in the first embodiment denote the same components as in the first embodiment unless otherwise specified.

In this example, positioning when the semiconductor module 3 is arranged in the surrounding member 42 is facilitated.
In addition, the same effects as those of the first embodiment are obtained.

(Example 3)
In this example, as shown in FIG. 7, the enclosing member 42 is provided with a large number of through holes 424 penetrating in the thickness direction. A plurality of rectangular through holes 424 are provided, and the surrounding member main body 421 is formed in a mesh shape. The shape or the like of the through hole 424 is not particularly limited, and may be, for example, a circular shape or a triangular shape.
Others are the same as in the first embodiment. Of the reference numerals used in this example or the drawings relating to this example, the same reference numerals as those used in the first embodiment denote the same components as in the first embodiment unless otherwise specified.

In this example, the weight of the surrounding member 42 can be reduced.
In addition, the same effects as those of the first embodiment are obtained.

Example 4
In this example, as shown in FIG. 8, the surrounding member 42 is provided with a plurality of through holes 424 penetrating in the thickness direction. In this example, a plurality of through holes 424 are formed at equal intervals in the X direction on each side of the open portion 420 in the Y direction. The size of each through hole 424 in the X direction is larger than the size of the semiconductor module 3 in the X direction.

  In other words, the two parts of the surrounding member main body 421 separated through the open part 420 are respectively seen from the X direction while being orthogonal to the linear parts 421a and a plurality of linear parts 421a extending linearly in the X direction. Thus, a plurality of curved portions 421b curved in a substantially U shape are combined with each other. A rectangular through hole 424 is formed between the plurality of linear portions 421a and the plurality of curved portions 421b.

  Others are the same as in the first embodiment. Of the reference numerals used in this example or the drawings relating to this example, the same reference numerals as those used in the first embodiment denote the same components as in the first embodiment unless otherwise specified.

Also in this example, the surrounding member 42 can be reduced in weight.
In addition, a capacitor, a transformer, and the like as power circuit components for driving the semiconductor module 3 do not interfere with the surrounding member 42, and the degree of freedom of arrangement of these components in the case 4 can be improved.
In addition, the same effects as those of the first embodiment are obtained.

(Example 5)
In this example, as shown in FIGS. 9 and 10, the reinforcing rib 425 is partially formed on the surrounding member 42. The reinforcing rib 425 is formed by making the surrounding member main body 421 thicker than other portions. A reinforcing rib 425a is formed on the outer side of the outline of the surrounding member main body 421. Further, a plurality of reinforcing ribs 425b are formed on the outer side of the surrounding member main body 421 at equal intervals in the X direction.

  Others are the same as in the first embodiment. Of the reference numerals used in this example or the drawings relating to this example, the same reference numerals as those used in the first embodiment denote the same components as in the first embodiment unless otherwise specified.

In this example, while the rigidity of the surrounding member 42 is improved by the reinforcing rib 425, the thickness of the portion other than the reinforcing rib 425 can be reduced in the surrounding member 42. Thereby, the rigidity of the surrounding member 42 can be improved, achieving weight reduction.
In addition, the same effects as those of the first embodiment are obtained.

(Example 6)
In this example, as shown in FIGS. 11 and 12, both end portions in the Y direction of the surrounding member main body 421 are directly connected to the pair of side wall portions 413. That is, in this example, the connection bottom portion (reference numeral 45 in FIG. 3) shown in the first embodiment is not formed in the case 4.
Further, as shown in FIG. 11, the front surrounding portion 422 of the surrounding member 42 is formed so as to connect the pair of side wall portions 413. A part of the front enclosure 422 also serves as the first partition 431 of the partition 43.

As shown in FIG. 12, the circuit board 11 is fixed to a board fixing portion 46 formed on the enclosing member 42.
Others are the same as in the first embodiment. Of the reference numerals used in this example or the drawings relating to this example, the same reference numerals as those used in the first embodiment denote the same components as in the first embodiment unless otherwise specified.

In this example, all of the board fixing portions 46 that fix the circuit board 11 are fixed to the surrounding member 42. Thereby, the stress concerning the junction part of the control terminal 32 and the circuit board 11, and control terminal 32 itself can be relieve | moderated further.
In addition, the same effects as those of the first embodiment are obtained.

  In addition, it is good also as an aspect which combined the said some Example suitably. For example, it can be set as the aspect which combined Example 2 and Example 4. FIG.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Laminate cooler 21 Cooling pipe 3 Semiconductor module 4 Case 401 Wall part opening part 411 Rear wall part 412 Front wall part 413 Side wall part 42 Enclosing member 5 Closure member

Claims (3)

A laminated cooler (2) having a plurality of cooling pipes (21) arranged in a stacked manner with a gap between them, and the adjacent cooling pipe (21) in the laminated cooler (2). A power conversion device (1) having an electronic component (3) and a case (4) for accommodating the laminated cooler (2) and the electronic component (3) inside,
The case (4) includes a rear wall portion (411) and a front wall portion (412) arranged respectively in the rear and front in the stacking direction (X) of the stacked cooler (2),
A pair of side wall portions (413) provided to connect the rear wall portion (411) and the front wall portion (412) at both ends;
The laminated cooler (2) is moved in one of the lamination directions (X), in both the longitudinal direction (Y) of the cooling pipe (21), and in the lamination direction (X) and the longitudinal direction of the cooling pipe (21) ( Y) and a conductive surrounding member (42) formed so as to surround from both of the height direction (Z) orthogonal to both,
The rear wall (411) has a wall opening (401) penetrating in the stacking direction (X),
The wall opening (401) is fixed to the case (4) and is closed by a closing member (5) integrated with the stacked cooler (2) ,
The laminated cooler (2), when viewed from the laminating direction (X), have a shape that fits inside the contour of the wall opening (401),
The wall opening (401) has a shape surrounded by a smoothly closed curve when viewed from the stacking direction (X),
The enclosing member (42) includes an enclosing member body (421) formed so as to cover the stacked cooler (2) from the longitudinal direction (Y) and the height direction (Z), and the stacked cooling from the front. A front enclosure (422) covering the vessel (2),
When viewed from the stacking direction (X), the stack cooler (2) has a shape that fits inside the outer shape of the front enclosure (422),
When viewed from the stacking direction (X), the stack cooler (2) has a shape that fits inside the outer shape of the closing member (5),
The surrounding member body (421) is divided into two parts in the longitudinal direction (Y),
Two portions of the surrounding member main body (421) have a cross-sectional shape orthogonal to the stacking direction (X) curved in a U shape with the opening directions facing each other, and the stacking direction (X). Is formed along the inner peripheral surface of the wall opening (401) when viewed from
The said surrounding member main body (421) is formed over the whole area | region where the said lamination | stacking cooler (2) was distribute | arranged in the said lamination direction (X), The power converter device (1) characterized by the above-mentioned .   The power converter (1) according to claim 1, wherein the surrounding member (42) has a plurality of through holes (424) penetrating in the thickness direction.   The power conversion device (1) according to claim 1 or 2, wherein a reinforcing rib (425) is partially formed on the surrounding member (42).

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