JP6200716B2 - Laminated structure and laminated unit - Google Patents

Description

  The present invention relates to a laminated structure in which a semiconductor module and cooling pipes for cooling the semiconductor module are alternately laminated, and a laminated unit including the laminated structure.

  Conventionally, a power conversion device configured by alternately stacking semiconductor modules and cooling pipes for cooling the semiconductor modules is known (see, for example, Patent Document 1). This power conversion device is provided at the end of the stacking direction of the semiconductor module and the cooling pipe between the spring member that generates a pressing force along the stacking direction and the spring member and the stacking structure, and is uniform in the stacking direction. And a contact plate for generating a pressing force. According to the power conversion device having such a configuration, the adjacent semiconductor module and the cooling pipe are brought into close contact with each other by the pressing force of the spring member, so that the semiconductor module can be sufficiently cooled.

JP 2007-166820 A

  However, in the above-described prior art, in addition to the necessity of the spring member and the contact plate, it is necessary to provide a fixing pin for fixing the spring member to the casing of the power conversion device. In addition to the increase in size, there was a problem that assembly was difficult.

  The present invention has been made in view of the above, and an object of the present invention is to provide a laminated structure and a laminated unit that are suitable for miniaturization and easy to assemble while maintaining the cooling performance of the semiconductor module. .

  In order to solve the above-described problems and achieve the object, a laminated structure according to the present invention is obtained by alternately laminating a semiconductor module and cooling pipes laminated on the semiconductor module and cooling the semiconductor module. A laminated structure in which the cooling pipes are arranged on both surfaces of the semiconductor module along a direction, and the cooling pipe surrounds the outer package body in which a contact portion with the semiconductor module forms a flat plate shape and the outer package body A partition plate that divides an internal space into two regions along the laminating direction, and two spring members that are respectively provided in the two regions and have a load in the laminating direction. A flat plate-like base portion that comes into contact with or is bonded to the exterior body, and each of them rises from the base portion, extends to the same main surface side of the base portion, and a tip contacts the partition plate to apply a load. And having a plurality of extending portions that live.

  The laminated structure according to the present invention is characterized in that, in the above-mentioned invention, the cooling pipe has flange portions that are formed at both ends in the width direction and are deformed as a load is generated in the spring member.

  In the laminated structure according to the present invention as set forth in the invention described above, the spring member is characterized in that directions in which the plurality of extending portions rise with respect to the base portion are aligned with each other.

  The laminated structure according to the present invention is characterized in that, in the above invention, the spring member is different from the other extending portions in a direction in which a part of the plurality of extending portions rises with respect to the base portion.

  In the laminated structure according to the present invention, in the above invention, the extending portions of the two spring members rise from the base portions at positions different from the extending portions of the other spring members along the stacking direction. It is characterized by.

  In the laminated structure according to the present invention as set forth in the invention described above, the spring member has a height of the extension portion positioned at a central portion of the cooling pipe with respect to the base portion of the extension portion positioned at another portion. It is characterized by being higher than the height with respect to the base part.

  A laminated unit according to the present invention includes the laminated structure according to the invention, a housing that houses the laminated structure, and a fixing member that fixes the laminated structure to the housing. It is characterized by.

  ADVANTAGE OF THE INVENTION According to this invention, while maintaining the cooling performance of a semiconductor module, the laminated structure and laminated unit which are suitable for size reduction and easy to assemble can be provided.

FIG. 1 is a front view showing a configuration of a main part of a laminated structure according to an embodiment of the present invention. FIG. 2 is a perspective view showing a configuration of a main part of the laminated structure according to one embodiment of the present invention. FIG. 3 is a perspective view showing a configuration of a cooling pipe provided in the laminated structure according to the embodiment of the present invention. 4 is a cross-sectional view taken along line AA in FIG. FIG. 5 is a partially enlarged view of FIG. 6 is a cross-sectional view taken along line BB in FIG. FIG. 7 is a perspective view showing a configuration of a spring member provided in the laminated structure according to the embodiment of the present invention. FIG. 8 is a diagram showing an outline of the shape change of the spring member before and after the load is generated on the spring member. FIG. 9 is a diagram showing an outline of the shape change of the flange portion before and after the load is generated on the spring member. FIG. 10 is a partial cross-sectional view showing the configuration of the laminated unit according to one embodiment of the present invention. FIG. 11 is a perspective view illustrating a configuration of a spring member included in the laminated structure according to the first modification of the embodiment of the present invention. FIG. 12 is a diagram illustrating a configuration of a main part of a spring member included in the laminated structure according to the second modification of the embodiment of the present invention. FIG. 13: is a top view which shows the structure of the principal part of the spring member with which the laminated structure which concerns on the modification 3 of one embodiment of this invention is provided.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as “embodiments”) will be described with reference to the accompanying drawings. It should be noted that the drawings are schematic, and the relationship between the thickness and width of each part, the ratio of the thickness of each part, and the like may be different from the actual ones. In some cases, there may be a portion having a different dimensional relationship or ratio.

  FIG. 1 is a front view showing a configuration of a main part of a laminated structure according to an embodiment of the present invention. FIG. 2 is a perspective view showing a configuration of a main part of the laminated structure according to the present embodiment. A laminated structure 1 shown in these drawings is provided in an electric vehicle, a hybrid vehicle, or the like, and is a part of a PCU (Power Control Unit) including an inverter that converts DC power of a battery into AC power and supplies the AC motor. Configure.

  The laminated structure 1 includes a predetermined number of semiconductor modules 2 having a substantially rectangular parallelepiped shape and cooling pipes 3 that circulate a cooling medium that cools the semiconductor modules 2 and are stacked in close contact with the semiconductor modules 2. Prepare one by one. In the stacked structure 1, two semiconductor modules 2 are arranged in parallel in a direction orthogonal to the stacking direction between the cooling pipes 3 adjacent in the stacking direction. The laminated structure 1 shown in FIG. 1 has nine layers in which two semiconductor modules 2 are arranged in parallel, a total of 18 semiconductor modules 2 are provided, and 10 cooling pipes 3 are provided. The number of semiconductor modules 2 and cooling pipes 3 in the laminated structure 1 is merely an example. The number of semiconductor modules 2 arranged in parallel in one layer is just an example.

  Both ends in the longitudinal direction of the adjacent cooling pipes 3 along the stacking direction are connected by a connecting member 4 having a cylindrical shape, and the insides of the adjacent cooling pipes 3 communicate with each other via the connecting member 4. ing.

  An inflow pipe 5 into which a cooling medium flows from the outside is connected to one end (left end in FIG. 1) in the longitudinal direction of the cooling pipe 3 located at one end in the stacking direction (lower end in FIG. 1). ing. Moreover, the outflow which flows out a cooling medium with respect to the exterior to the other end part (right end part of FIG. 1) of the longitudinal direction of the cooling pipe 3 located in one edge part (lower end part of FIG. 1) of a lamination direction A tube 6 is connected.

  A lid member 7 having a bottomed cylindrical shape is provided on the side in the stacking direction end of the cooling pipe 3 located at the other end in the stacking direction (upper end in FIG. 1).

  The semiconductor module 2 has a configuration in which, for example, two types of silicon chips of IGBT (Insulated-Gate Bipolar Transistor) and FWD (Free Wheeling Diode) are arranged in parallel, and heat spreaders are provided on both sides via conductive spacers. doing.

  FIG. 3 is a perspective view showing the configuration of the cooling pipe 3. FIG. 4 is a cross-sectional view taken along the line AA in FIG. FIG. 5 is a partially enlarged view of FIG. 6 is a cross-sectional view taken along line BB in FIG. Hereinafter, the configuration of the cooling pipe 3 will be described in detail with reference to FIGS.

  The cooling pipe 3 has a substantially oval main surface and has a flat exterior body 31, and an internal space surrounded by the exterior body 31 in a direction parallel to the main surface of the exterior body 31. A partition plate 32 that divides the space into two regions, and two spring members 33 that are respectively provided in the two regions divided by the partition plate 32 and generate a load in the stacking direction.

  The exterior body 31 has two flat plates parallel to each other, and a flat plate portion 311 in close contact with the semiconductor module 2 adjacent in the stacking direction on the surface of each flat plate, and both end portions in the short direction (width direction) of the flat plate portion 311 The two flange portions 312 formed on the flat plate portion 311 and the opening portions 313 are provided at both ends in the longitudinal direction of the flat plate portion 311 and communicate with the other cooling pipes 3 and the internal spaces via the connecting member 4. And two communicating portions 314 formed on the surface of 311 respectively. A cylindrical connecting member 4 is joined to the opening 313 by brazing or the like. Moreover, the diaphragm part is provided in the junction part of the opening part 313 and the connection member 4, and it is possible to change the space | interval with the cooling pipe 3 adjacent in the lamination direction. The exterior body 31 is made of a metal such as aluminum having good thermal conductivity.

  The partition plate 32 is in contact with the two spring members 33 on a different surface. The partition plate 32 is made of a highly rigid metal such as SUS. The partition plate 32 may be a material other than SUS as long as it has no problem in strength. As such a material, for example, a material having a relatively low thermal conductivity is preferably used because it is possible to suppress the transfer of heat between two adjacent semiconductor modules 2 via the cooling pipe 3.

  FIG. 7 is a perspective view showing the configuration of the spring member 33. The spring member 33 has a flat base portion 331 and a plurality of extending portions that are arranged in a lattice shape along the length and breadth of the base portion 331 and rise from the base portion 331 in substantially the same direction and extend in a strip shape. 332. In the case shown in FIG. 7, three columns in which ten extending portions 332 are formed in one column are arranged, but the number of rows and columns is merely an example.

  The base portion 331 is in contact with the back surface of the exterior body 31 and is fixed by contact pressure. The base portion 331 may be joined to the back surface of the exterior body 31 by brazing or the like.

  The extending portion 332 includes a base end portion 332a having a curved surface that protrudes downward with respect to the surface of the base portion 331, when the side where the extending portion 332 extends with respect to the base portion 331 is located above the base portion 331. And a tip portion 332b having a curved surface convex upward with respect to the surface of the base portion 331. The tangent of the curved surface at the tip of the tip portion 332b is substantially parallel to the base portion 331. A distal end portion 332 b of the extending portion 332 is in contact with the partition plate 32.

  The spring member 33 is formed using a conductive material such as phosphor bronze, spring steel, copper, stainless steel, nickel, nickel alloy. When the spring member 33 is manufactured, it can be manufactured only by press molding, for example. Further, when the spring member 33 is manufactured, a single flat plate is etched to form a portion of the extended portion 332, and then the formed extended portion 332 is subjected to press molding or the like. The extending portion 332 may be raised with respect to the base portion 331 by performing plastic working.

  In the cooling pipe 3, the two spring members 33 pass through the center of the partition plate 32 and are in a mirror image symmetrical relationship with respect to a plane parallel to the surface of the partition plate 32, but this is only an example. For example, it is possible to arrange the two spring members 33 so as to have a 180-degree rotational symmetry with respect to the center of the partition plate 32. The mirror image symmetry and the 180 degree rotational symmetry are not limited to the case of being strictly symmetrical, but generally coincide with the other spring member 33 when one of the two spring members 33 is mirror image transformed or rotated 180 degrees. Such cases are also included.

  Further, the rising direction of the extending part 332 may not be the direction along the longitudinal direction of the base part 331. For example, the extending portion 332 may rise in a direction along the short direction of the base portion 331, or may not be parallel to the longitudinal direction and the short side direction in a plan view in which the main surface of the base portion 331 is a projection surface. You may make it the extension part 332 stand up in the direction which is not.

  The cooling medium that circulates inside the cooling pipe 3 includes, for example, water, natural refrigerant such as ammonia mixed with ethylene glycol antifreeze, fluorinated refrigerant such as fluorinate, chlorofluorocarbon refrigerant such as HCFC123 and HFC134a, Either an alcohol-based refrigerant such as methanol or alcohol, or a ketone-based refrigerant such as acetone.

  When the laminated structure 1 having the above configuration is formed, a plurality of semiconductor modules 2 and a plurality of cooling pipes 3 are laminated according to a predetermined rule, and then an external force is applied to the laminated portions to load the spring member 33. Is generated. 8 and 9 are diagrams showing an outline of a change in the shape of the cooling pipe 3 before and after the load is generated. Specifically, FIG. 8 is a diagram showing an outline of a shape change of the spring member 33, and FIG. 9 is a diagram showing an outline of a shape change of the flange portion 312. When an external force is applied to the stacked portion, the extension portion 332 of the spring member 33 bends and generates a load, as shown in FIG. Thereby, the thickness of the cooling pipe 3 in the stacking direction is reduced. At this time, the flange portion 312 follows the decrease in the thickness of the cooling pipe 3 in the stacking direction and undergoes elasto-plastic deformation as shown in FIG.

  As a means for generating a load on the spring member 33, for example, a band-shaped metal binding member can be used. When applying this constraining member, after laminating the semiconductor module 2 and the cooling pipe 3, the constraining member is circulated around a part of the laminated portion, and both ends of the constraining member are joined using a predetermined jig. Thus, a desired external force is applied to the laminated portion, and a load is generated on the spring member 33. At this time, since the diaphragm portions are provided at both ends of the cooling pipe 3 in the longitudinal direction, the thickness of the both ends in the longitudinal direction is reduced following the decrease in the thickness of the cooling pipe 3 in the laminated portion. Become. Note that the binding member may be removed after the laminated structure 1 is completed.

  FIG. 10 is a partial cross-sectional view showing the configuration of the multilayer unit including the multilayer structure 1 having the above configuration. A laminated unit 100 shown in the figure includes a laminated structure 1, a casing 11 that houses the laminated structure 1, and a fixing member that abuts the laminated structure 1 and fixes the laminated structure 1 to the casing 11. 12. In the laminated structure 1 shown in FIG. 10, the case where the restraint member 8 equivalent to the metal restraint member mentioned above is employ | adopted as a means to generate | occur | produce a load to the spring member 33 is shown.

  In the laminated structure 1, the semiconductor module 2 and the cooling pipe 3 are in close contact with each other due to the load of the spring member 33 inside the cooling pipe 3. After the body 1 is attached, it is only necessary to fix the laminated structure 1 to the housing 11 by the fixing member 12. Accordingly, the laminated unit 100 includes, for example, a leaf spring and a fixing pin for fixing the leaf spring, and a space for accommodating the leaf spring and the fixing pin is provided, thereby pressing the laminated structure 1 and the semiconductor module. The conventional structure which makes 2 and the cooling pipe 3 contact | adhere is unnecessary.

  The stacked unit 100 having the above configuration constitutes a PCU together with a control board or the like that transmits a control signal to the semiconductor module 2.

  According to the embodiment of the present invention described above, the spring member 33 is provided inside the cooling pipe 3, and the semiconductor module 2 and the cooling pipe 3 are brought into close contact with each other by generating a desired load on the spring member 33. Therefore, it is possible to improve the cooling performance of the semiconductor module 2 without using a pressing spring or providing a pressing projection on the housing as a mechanism for pressing the stacked portion as in the prior art. it can. Therefore, it is possible to provide a laminated structure and a laminated unit that are suitable for downsizing and can be easily assembled while maintaining the cooling performance of the semiconductor module.

  In addition, according to the present embodiment, since the flange portion 312 is formed at both ends in the width direction of the cooling pipe 3 and deformed with the generation of the load in the spring member 33, the semiconductor module 2 and the cooling pipe 3 are When an external force is applied to enhance the adhesion, the thickness of the cooling pipe 3 including the end portion in the width direction of the cooling pipe 3 can be reduced substantially uniformly.

  Up to this point, the mode for carrying out the present invention has been described, but the present invention should not be limited only by the above-described embodiment.

  FIG. 11 is a perspective view illustrating a configuration of a spring member included in the laminated structure according to the first modification of the present embodiment. The spring member 34 shown in the figure is arranged side by side along the longitudinal direction with the base part 341, and is arranged side by side along the longitudinal direction with the first extending part 342 rising in the same direction, and the rising direction is the first extension. A second extending part 343 different from the existing part 342 is provided. The first extending part 342 and the second extending part 343 are alternately arranged along the short direction of the base part 341. The first extending portion 342 has a proximal end portion 342a and a distal end portion 342b, like the extending portion 332 described above. The second extending part 343 has the same shape as the first extending part 342, and has a base end part 343a and a distal end part 343b.

  In the first modification, when the two spring members 34 are arranged, they may be arranged so as to be mirror-symmetric with respect to a plane passing through the center of the partition plate 32 and parallel to the surface of the partition plate 32. Alternatively, they may be arranged so as to be 180 degrees rotationally symmetric with respect to the center of the partition plate 32. In the first modified example, the mirror image symmetry and the 180 degree rotational symmetry are not only strictly symmetrical, but also when one of the two spring members 33 is mirror image transformed or rotated 180 degrees, the other spring The case where it almost coincides with the member 33 is also included.

  FIG. 12 is a diagram illustrating a configuration of a main part of a spring member included in the laminated structure according to the second modification of the present embodiment. The spring member 35 shown in the figure has a base portion 351 and an extending portion 352. The extending portion 352 has a base end portion 352a that forms a curved surface that protrudes downward with respect to the surface of the base portion 351, when the side where the extending portion 352 extends with respect to the base portion 351 is located above the base portion 351. And a tip portion 352b having a curved surface convex upward with respect to the surface of the base portion 351.

  The tip portion 352 b is a curved surface that is convex upward and further extends from a portion having a tangent line parallel to the base portion 351. For this reason, the front-end | tip part 352b will be in approximate line contact with the partition plate 32. FIG. The spring member 35 having such a configuration is suitable when it is desired to increase the resistance when the cooling medium flows inside the cooling pipe 3.

  FIG. 13 is a plan view showing the configuration of the main part of the spring member provided in the laminated structure according to Modification 3 of the present embodiment. It is a figure which shows another arrangement | positioning aspect of the extension part in a spring member, and is the top view seen from the direction orthogonal to the base part of a spring member. The spring member 36 shown in the figure has a base portion 361 and a plurality of extending portions 362 extending from the base portion 361. The extending portions 362 are staggered on the base portion 361. The shape of the extending part 362 is the same as that of the extending part 332 of the spring member 33 described above.

  In the present invention, the extending portions of the two spring members included in the cooling pipe are respectively separated from the base portions at positions different from the extending portions of the other spring members along the stacking direction of the semiconductor module and the cooling pipe. You may make it stand up. In this case, the surface pressure applied to the partition plate 32 can be made more uniform.

  Further, in the present invention, the spring member has a configuration in which the height of the extending portion located in the central portion of the cooling pipe is higher than the height of the extending portion located in the other portion relative to the base portion. May be. This configuration is particularly effective when a large pressing force in the stacking direction is applied to the central portion of the cooling pipe and it is difficult to keep the thickness of the cooling pipe in the stacking direction uniform.

  As described above, the present invention can include various embodiments and the like not described herein, and the design can be changed without departing from the technical idea described in the claims. Is possible.

DESCRIPTION OF SYMBOLS 1 Laminated structure 2 Semiconductor module 3 Cooling pipe 4 Connecting member 5 Inflow pipe 6 Outflow pipe 7 Lid member 8 Binding member 11 Case 12 Fixing member 31 Exterior body 32 Partition plates 33, 34, 35, 36 Spring member 100 Laminating unit 311 Flat portion 312 Flange portion 313 Opening portion 314 Communication portion 331, 341, 351, 361 Base portion 332, 352, 362 Extension portion 332a, 342a, 343a, 352a Base end portion 332b, 342b, 343b, 352b Tip portion 342 First Extension part 343 Second extension part

Claims (7)

A laminated structure in which a semiconductor module and cooling pipes stacked on the semiconductor module and cooling the semiconductor module are alternately stacked, and the cooling pipes are arranged on both surfaces of the semiconductor module along a stacking direction. ,
The cooling pipe is
An exterior body having a flat plate portion in which the contact portion with the semiconductor module forms a flat plate shape;
A partition plate that divides the internal space surrounded by the exterior body into two regions along the stacking direction;
Two spring members respectively provided in the two regions and having a load in the stacking direction;
With
The spring member is
A flat plate-like base portion that contacts or is joined to the flat plate portion;
A plurality of extending portions each rising from the base portion and extending to the same main surface side of the base portion, the tip contacting the partition plate and generating a load;
A laminated structure comprising: A laminated structure in which a semiconductor module and cooling pipes stacked on the semiconductor module and cooling the semiconductor module are alternately stacked, and the cooling pipes are arranged on both surfaces of the semiconductor module along a stacking direction. ,
The cooling pipe is
An exterior body in which the contact portion with the semiconductor module has a flat plate shape;
A partition plate that divides the internal space surrounded by the exterior body into two regions along the stacking direction;
Two spring members respectively provided in the two regions and having a load in the stacking direction;
With
The spring member is
A plate-like base portion that contacts or is joined to the exterior body;
A plurality of extending portions each rising from the base portion and extending to the same main surface side of the base portion, the tip contacting the partition plate and generating a load;
Have
The stacked structure according to claim 1, wherein a height of the extending portion located in a central portion of the cooling pipe with respect to the base portion is higher than a height of the extending portion located in another portion with respect to the base portion. The cooling pipe is
3. The laminated structure according to claim 1, further comprising flange portions that are formed at both ends in the width direction and are deformed as a load is generated in the spring member. The spring member is
The stacked structure according to any one of claims 1 to 3, wherein directions in which the plurality of extending portions rise with respect to the base portion are aligned with each other. The spring member is
The stacked structure according to any one of claims 1 to 4, wherein a direction in which a part of the plurality of extending portions rises with respect to the base portion is different from that of the other extending portions. The extending portions of the two spring members are respectively
Multilayer structure according to any one of claims 1 to 5, characterized in that standing up from the base portion at the extended portion and the positions different from each other other spring member along the stacking direction. The laminated structure according to any one of claims 1 to 6,
A housing for housing the laminated structure;
A fixing member for fixing the laminated structure to the housing;
A laminated unit comprising:

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