JP3324358B2 - Printed circuit board with heat sink - Google Patents
Printed circuit board with heat sinkInfo
- Publication number
- JP3324358B2 JP3324358B2 JP25965995A JP25965995A JP3324358B2 JP 3324358 B2 JP3324358 B2 JP 3324358B2 JP 25965995 A JP25965995 A JP 25965995A JP 25965995 A JP25965995 A JP 25965995A JP 3324358 B2 JP3324358 B2 JP 3324358B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- main body
- lead
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は、電子部品の放熱を
行う放熱板をプリント基板本体に搭載した放熱板付きプ
リント基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board provided with a heat sink for dissipating heat from electronic components mounted on a printed circuit board body.
【0002】[0002]
【従来の技術】例えば、モータコントローラにおいて
は、図5〜図7に示すようにプリント基板本体1に放熱
板2が搭載されている。該放熱板2は、下向き湾曲部2
aと上向き湾曲部2bとが隣接して設けられた波形の構
造をしていて、その下向き湾曲部2aをプリント基板本
体1に当接して該プリント基板本体1に下面側からネジ
3で固定されている。該放熱板2の下向き湾曲部2aの
端部における立上り部2ahには、トランジスタアレイ
の如きモータ駆動用電子部品4がネジ5締めで取付けら
れている。電子部品4の複数のリード端子4aは一方向
に整列して設けられていて、プリント基板本体1の各リ
ード挿入用孔6に通されてその周囲のランド部7に半田
8付け接続されている。プリント基板本体1の他の部分
のリード挿入用孔9には、抵抗器の如き電子部品10の
リード端子10aが通されて該リード挿入用孔9の周囲
のランド部11に半田8付け接続されている。2. Description of the Related Art For example, in a motor controller, a heat radiating plate 2 is mounted on a printed circuit board main body 1 as shown in FIGS. The heat sink 2 has a downwardly curved portion 2.
a and an upwardly curved portion 2b are provided adjacent to each other, and the downwardly curved portion 2a abuts on the printed circuit board main body 1 and is fixed to the printed circuit board main body 1 with screws 3 from the lower surface side. ing. A motor drive electronic component 4 such as a transistor array is attached to a rising portion 2ah at an end of the downward curved portion 2a of the heat sink 2 by tightening a screw 5. The plurality of lead terminals 4 a of the electronic component 4 are arranged in one direction, are passed through the respective lead insertion holes 6 of the printed circuit board main body 1, and are connected to the lands 7 around them by soldering 8. . A lead terminal 10a of an electronic component 10 such as a resistor is passed through the lead insertion hole 9 in the other part of the printed circuit board main body 1, and is connected to a land portion 11 around the lead insertion hole 9 by soldering 8. ing.
【0003】このような放熱板付きプリント基板におい
ては、半田8付け部に応力が残らないように、予め放熱
板2に電子部品4をネジ5締めで取付けておき、該放熱
板2をプリント基板本体1に搭載する際にそのリード端
子4aのリード挿入用孔6に通し、また他の電子部品1
0のリード端子10aもリード挿入用孔9に通し、かか
る状態で放熱板2をプリント基板本体1の下面側からネ
ジ3で該プリント基板本体1に固定し、しかる後、半田
8付けを行っている。In such a printed board with a heat radiating plate, an electronic component 4 is mounted on the heat radiating plate 2 in advance by tightening screws 5 so that no stress remains at the soldered portion, and the heat radiating plate 2 is attached to the printed circuit board. When the electronic component 1 is mounted on the main body 1, the lead terminal 4 a is inserted through the lead insertion hole 6.
Also, the lead terminal 10a is passed through the lead insertion hole 9, and in this state, the heat sink 2 is fixed to the printed circuit board main body 1 from the lower surface side of the printed circuit board main body 1 with the screw 3, and then the solder 8 is attached. I have.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、このよ
うな構造の放熱板付きプリント基板においては、次のよ
うな問題点があった。However, the printed circuit board with a heat sink having such a structure has the following problems.
【0005】(イ)放熱板2の取付け時に、プリント基
板本体1の下面側からネジ3締めする必要があるが、こ
のとき電子部品4,10は半田8付けされる前であり、
既挿入電子部品10の外れや倒れ等が発生する。(A) When mounting the heat sink 2, it is necessary to tighten the screws 3 from the lower surface side of the printed circuit board main body 1. At this time, the electronic components 4 and 10 are not soldered before soldering 8.
The inserted electronic component 10 may come off or fall down.
【0006】(ロ)ネジ3締め部の放熱板2は、プリン
ト基板本体1に接するため、電子部品を実装できる範囲
が狭くなってしまう。(B) Since the heat radiating plate 2 of the screw 3 tightening portion is in contact with the printed circuit board main body 1, the range in which electronic components can be mounted is narrowed.
【0007】本発明の目的は、プリント基板本体に対す
る放熱板の取付けを、ネジ締めをせずに行える放熱板付
きプリント基板を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a printed circuit board with a heat sink that can be attached to a printed circuit board main body without tightening screws.
【0008】本発明の他の目的は、放熱板の搭載をして
も電子部品を実装できる範囲を広くとることができる放
熱板付きプリント基板を提供することにある。Another object of the present invention is to provide a printed circuit board with a heat radiating plate which can have a wide range in which electronic components can be mounted even when a heat radiating plate is mounted.
【0009】[0009]
【課題を解決するための手段】本発明は、プリント基板
本体に放熱板が搭載され、該放熱板に電子部品が取付け
られ、該電子部品のリード端子がプリント基板本体のリ
ード挿入用孔に通されて半田付け接続されている構造の
放熱板付きプリント基板を改良の対象としている。According to the present invention, a radiator plate is mounted on a printed circuit board main body, electronic components are mounted on the radiator plate, and lead terminals of the electronic components are passed through lead insertion holes of the printed circuit board main body. A printed circuit board with a heat sink having a structure that is connected by soldering is targeted for improvement.
【0010】本発明に係る放熱板付きプリント基板にお
いては、放熱板は門型に形成されており、該門型の放熱
板はその脚部の下端の係止突起がプリント基板本体の係
止孔に挿入されて係止されていることを特徴とする。In the printed circuit board with a heat radiating plate according to the present invention, the heat radiating plate is formed in a gate shape, and the locking projection at the lower end of the leg portion has a locking hole in the printed circuit board body. And is locked by being inserted into the horn.
【0011】このように門型の放熱板が、その脚部の下
端の係止突起をプリント基板本体の係止孔に挿入して係
止しておくと、該放熱板に予め取付けられている電子部
品のリード端子をプリント基板本体に半田付けすること
により、該放熱板をプリント基板本体に固定できる。When the locking projections at the lower ends of the legs are inserted into the locking holes of the printed circuit board and locked in this manner, the gate-shaped radiating plate is attached to the radiating plate in advance. By soldering the lead terminals of the electronic components to the printed circuit board main body, the heat sink can be fixed to the printed circuit board main body.
【0012】このため、放熱板の取付け時にプリント基
板本体の下面側からネジ締めする必要がなくなって、既
挿入電子部品の外れや倒れ等の発生の問題がなくなる。This eliminates the need to tighten the screws from the lower surface side of the printed circuit board body when attaching the heat sink, and eliminates the problem of detachment or falling down of the inserted electronic components.
【0013】また、門型の放熱板はその脚部の先端でプ
リント基板本体に接するため、電子部品を実装できる範
囲が狭くなるのを回避することができる。Further, since the gate-shaped heat radiating plate is in contact with the main body of the printed circuit board at the tip of its leg, it is possible to prevent the range in which electronic components can be mounted from being narrowed.
【0014】この場合、電子部品は放熱板の脚部に取付
けることが好ましい。In this case, it is preferable that the electronic component is attached to the leg of the heat sink.
【0015】このように電子部品を放熱板の脚部に取付
けると、いずれもプリント基板本体に対して直交する下
向きになって、電子部品のリード端子をプリント基板本
体のリード挿入用孔に通し、脚部の下端の係止突起をプ
リント基板本体の係止孔に挿入する作業を一括して容易
に行うことができる。When the electronic components are attached to the legs of the heat sink in this manner, the electronic components are directed downward perpendicular to the printed circuit board main body, and the lead terminals of the electronic components are passed through the lead insertion holes of the printed circuit board main body. The operation of inserting the locking projections at the lower ends of the legs into the locking holes of the printed circuit board main body can be easily and collectively performed.
【0016】また、リード端子の整列方向に合わせてプ
リント基板本体に設けられている各リード挿入用孔はそ
の整列方向に対して直交する方向の長孔としてそれぞれ
設けられ、放熱板の係止突起はリード挿入用孔の長手方
向に対して直交する方向のフック部を有し、プリント基
板本体の係止孔はリード挿入用孔の長孔に平行する方向
に設けられると共にその方向の一端側が前記係止突起を
容易に挿入できる幅の幅広部で他端側が前記フック部を
前記プリント基板本体に係止できる幅の幅狭部になって
いることが好ましい。Also, each lead insertion hole provided in the printed circuit board main body in accordance with the alignment direction of the lead terminals is provided as a long hole in a direction perpendicular to the alignment direction, and the locking projection of the heat sink is provided. Has a hook portion in a direction orthogonal to the longitudinal direction of the lead insertion hole, the locking hole of the printed circuit board main body is provided in a direction parallel to the long hole of the lead insertion hole, and one end of the direction is It is preferable that the other end side is a narrow portion having a width capable of locking the hook portion to the printed circuit board main body, the wide portion having a width capable of easily inserting the locking protrusion.
【0017】このような構造にすると、電子部品のリー
ド端子をプリント基板本体のリード挿入用孔に通し、放
熱板の脚部下端の係止突起をプリント基板本体の係止孔
に挿入する際に、放熱板脚部の係止突起をプリント基板
本体の係止孔の幅広部側に挿入することにより、電子部
品のリード端子をプリント基板本体のリード挿入用孔に
通す作業を注意して行えば、係止孔の幅広部側に脚部の
係止突起を挿入する作業は問題なく行うことができる。
このような挿入作業の後に、放熱板を各リード挿入用孔
の長孔の方向にスライドすることにより、放熱板の係止
突起は幅広部側から幅狭部側に移動し、脚部の下端の係
止突起がプリント基板本体に係止される状態になる。With such a structure, when the lead terminals of the electronic components are passed through the lead insertion holes of the printed circuit board body and the locking projections at the lower ends of the legs of the heat sink are inserted into the locking holes of the printed circuit board body, By inserting the locking projections of the radiator plate legs into the wide side of the locking holes of the printed circuit board body, the work of passing the lead terminals of the electronic components through the lead insertion holes of the printed circuit board body should be performed carefully. The operation of inserting the locking projection of the leg into the wide portion of the locking hole can be performed without any problem.
After such insertion work, by sliding the heat sink in the direction of the long hole of each lead insertion hole, the locking projection of the heat sink moves from the wide part side to the narrow part side, and the lower end of the leg part. Are locked to the printed circuit board body.
【0018】また、リード挿入用孔の長孔に対応してプ
リント基板本体に設けられるランド部は、該リード挿入
用孔の長孔の一方でリード端子を半田付けする側のみに
設けることもできる。The land portion provided on the printed circuit board body corresponding to the long hole of the lead insertion hole may be provided only on one of the long holes of the lead insertion hole where the lead terminals are soldered. .
【0019】[0019]
【発明の実施の形態】図1(A)〜(D)は、本発明に
係る放熱板付きプリント基板の実施の形態の一例を示し
たものである。1 (A) to 1 (D) show an embodiment of a printed circuit board with a heat sink according to the present invention.
【0020】本例の放熱板付きプリント基板で用いる放
熱板2は、水平頂部2cと、その両端に下向きに設けら
れている脚部2dとを有する門型になっている。また、
プリント基板本体1において、トランジスタアレイの如
きモータ駆動用電子部品4のリード端子4aの整列方向
に合わせて設けられている各リード挿入用孔6は、その
整列方向に対して直交する方向の長孔としてそれぞれ設
けられている。門型の放熱板2の下端には、係止突起1
2がそれぞれ一体成形で設けられている。これら係止突
起12は、リード挿入用孔6の長手方向に対して直交す
る方向のフック部12aをそれぞれ有する構造になって
いる。またプリント基板本体1には、放熱板2を係止す
る1対の係止孔13が門型の放熱板2の各脚部2dに対
応させて設けられている。該係止孔13は、リード挿入
用孔6の長孔に平行する方向に設けられると共にその方
向の一端側が係止突起12を容易に挿入できる幅の幅広
部13aで他端側がフック部12aをプリント基板本体
1に係止できる幅の幅狭部13bになっている。The heat radiating plate 2 used in the printed circuit board with a heat radiating plate of this embodiment has a gate shape having a horizontal top portion 2c and legs 2d provided downward at both ends thereof. Also,
In the printed circuit board main body 1, each lead insertion hole 6 provided in accordance with the alignment direction of the lead terminals 4a of the motor driving electronic component 4 such as a transistor array is a long hole in a direction orthogonal to the alignment direction. Are provided respectively. A locking projection 1 is provided at the lower end of the gate-shaped heat sink 2.
2 are provided by integral molding. Each of the locking projections 12 has a hook portion 12 a in a direction perpendicular to the longitudinal direction of the lead insertion hole 6. Further, a pair of locking holes 13 for locking the heat radiating plate 2 is provided in the printed circuit board main body 1 so as to correspond to each leg 2 d of the gate-shaped heat radiating plate 2. The locking hole 13 is provided in a direction parallel to the long hole of the lead insertion hole 6, and one end of the locking hole 13 has a wide portion 13 a having a width into which the locking projection 12 can be easily inserted, and the other end has a hook portion 12 a. The narrow portion 13b has a width that can be locked to the printed circuit board body 1.
【0021】このような構造の放熱板付きプリント基板
においては、予め放熱板2の一方の脚部2dに電子部品
4をネジ5締めで取付けておく。かかる状態で、電子部
品4の各リード端子4aをプリント基板本体1の各リー
ド挿入用孔6に通し、放熱板2の脚部2d下端の係止突
起12をプリント基板本体1の係止孔13に挿入する際
に、放熱板脚部2dの係止突起13をプリント基板本体
1の係止孔13の幅広部13a側に挿入することによ
り、電子部品4の各リード端子4aをプリント基板本体
1の各リード挿入用孔6に通す作業を注意して行えば、
係止孔13の幅広部13a側に脚部2dの係止突起12
を挿入する作業は問題なく行うことができる。このよう
な挿入作業の後に、放熱板2を図1(A)に矢印で示す
各リード挿入用孔6の長孔の方向にスライドすることに
より、放熱板2の係止突起12は係止孔13の幅広部1
3a側から幅狭部13b側に移動し、脚部2d下端の係
止突起12のフック部12aがプリント基板本体1に係
止される状態になる。In the printed circuit board with a heat radiator having such a structure, the electronic component 4 is attached to one leg 2d of the heat radiator 2 in advance by tightening the screws 5. In this state, the respective lead terminals 4a of the electronic component 4 are passed through the respective lead insertion holes 6 of the printed circuit board main body 1, and the locking projections 12 at the lower ends of the legs 2d of the heat sink 2 are engaged with the locking holes 13 of the printed circuit board main body 1. By inserting the locking projection 13 of the heat sink leg 2d into the wide portion 13a of the locking hole 13 of the printed circuit board body 1 when inserting the lead terminal 4a of the electronic component 4 into the printed circuit board body 1, If the work of passing through each lead insertion hole 6 is carefully performed,
The locking projection 12 of the leg 2 d is provided on the wide portion 13 a side of the locking hole 13.
Can be performed without any problem. After such insertion work, the heat radiation plate 2 is slid in the direction of the long hole of each lead insertion hole 6 indicated by an arrow in FIG. 13 wide section 1
It moves from the 3a side to the narrow portion 13b side, and the hook portion 12a of the locking projection 12 at the lower end of the leg portion 2d is locked to the printed circuit board body 1.
【0022】また、プリント基板本体1の他の部分のリ
ード挿入用孔9には、抵抗器の如き電子部品10のリー
ド端子10aを通す。The lead terminal 10a of an electronic component 10, such as a resistor, is passed through a lead insertion hole 9 in another portion of the printed circuit board body 1.
【0023】かかる状態で、プリント基板本体1の裏側
で各リード端子4aをランド部7に半田8付け接続し、
リード端子10aをランド部11に半田8付け接続す
る。In this state, each lead terminal 4a is connected to the land portion 7 by soldering 8 on the back side of the printed circuit board main body 1, and
The lead terminal 10a is connected to the land portion 11 by soldering 8.
【0024】この状態になると、放熱板2は電子部品4
の各リード端子4aの半田8付け接続を利用してプリン
ト基板本体1に固定されることになる。In this state, the heat radiating plate 2 becomes the electronic component 4
Then, the lead terminals 4a are fixed to the printed circuit board main body 1 using the connection of the solders 8 by soldering.
【0025】このため、放熱板2の取付け時にプリント
基板本体1の下面側からネジ締めする必要がなくなっ
て、既挿入電子部品10の外れや倒れ等の発生の問題が
なくなる。For this reason, it is not necessary to tighten the screws from the lower surface side of the printed circuit board main body 1 when attaching the heat radiating plate 2, and the problem of the detached or fall-down of the inserted electronic component 10 is eliminated.
【0026】また、門型の放熱板2はその脚部2dの先
端でプリント基板本体1に接するため、電子部品を実装
できる範囲が狭くなるのを回避することができる。Further, since the gate-shaped heat radiating plate 2 is in contact with the printed circuit board main body 1 at the tip of the leg portion 2d, it is possible to prevent the range in which electronic components can be mounted from being narrowed.
【0027】また、本例のように電子部品4を放熱板2
の脚部2dに取付けると、いずれもプリント基板本体1
に対して直交する下向きになって、電子部品4のリード
端子4aをプリント基板本体1のリード挿入用孔6に通
し、脚部2dの下端の係止突起12をプリント基板本体
1の係止孔13に挿入する作業を一括して容易に行うこ
とができる。Further, as in the present embodiment, the electronic component 4 is
Of the printed circuit board body 1
, The lead terminal 4a of the electronic component 4 is passed through the lead insertion hole 6 of the printed circuit board body 1, and the locking projection 12 at the lower end of the leg 2d is inserted into the locking hole of the printed circuit board body 1. 13 can be easily and collectively performed.
【0028】図4は、図3(B)に示すリード挿入用孔
6とランド部7の他の例を示すしたものである。この例
では、ランド部7がリード挿入用孔6の長手方向の一方
でリード端子を半田付けする側にのみ設けられている。
このようにしても、前記例と同様の効果を得ることがで
きる。FIG. 4 shows another example of the lead insertion hole 6 and the land 7 shown in FIG. 3B. In this example, the land portion 7 is one side of the lead insertion hole 6 in the longitudinal direction.
And is provided only on the side where the lead terminals are soldered .
Even in this case, the same effect as in the above example can be obtained.
【0029】このような構造にしても、ランド部7がな
い側でリード挿入用孔6に電子部品4のリード端子4a
が挿入され、次に該リード端子4aがランド部7で囲ま
れた側に移動されて該ランド部7に半田付けされるので
支障がない。また、この構造の場合には、ランド部7の
占有面積を図3(B)に比べて狭くすることができる。Even with such a structure, the lead terminal 4a of the electronic component 4 is inserted into the lead insertion hole 6 on the side without the land portion 7.
Is inserted, and then the lead terminal 4a is moved to the side surrounded by the land 7 and soldered to the land 7, so that there is no problem. Further, in the case of this structure, the occupied area of the land portion 7 can be made smaller than that of FIG.
【0030】また、脚部2dの下端の係止突起12は例
えばその下端に球状のフック部12aを設け、プリント
基板本体1の係止孔13は球状のフック部12aの直径
より若干小さい丸孔とすることもできる。The locking projection 12 at the lower end of the leg 2d is provided with, for example, a spherical hook 12a at the lower end thereof. It can also be.
【0031】[0031]
【発明の効果】本発明に係る放熱板付きプリント基板に
おいては、放熱板を門型に形成し、該門型の放熱板はそ
の脚部の下端の係止突起をプリント基板本体の係止孔に
挿入して係止するので、この状態で該放熱板に予め取付
けられている電子部品のリード端子をプリント基板本体
に半田付けすることにより、該放熱板をプリント基板本
体に固定することができる。このため、放熱板の取付け
時にプリント基板本体の下面側からネジ締めする必要が
なくなって、既挿入電子部品の外れや倒れ等の発生の問
題をなくすことができる。In the printed circuit board with a heat radiating plate according to the present invention, the heat radiating plate is formed in a gate shape, and the locking boss at the lower end of the leg portion of the heat radiating plate has a locking hole in the printed circuit board body. In this state, the heat radiating plate can be fixed to the printed circuit board main body by soldering the lead terminals of the electronic components previously attached to the heat radiating plate to the printed circuit board main body in this state. . For this reason, it is not necessary to tighten the screws from the lower surface side of the printed circuit board body when attaching the heat sink, and it is possible to eliminate the problem of the detached or fall-down of the inserted electronic components.
【0032】また、門型の放熱板はその脚部の先端でプ
リント基板本体に接するため、電子部品を実装できる範
囲が狭くなるのを回避することができる。Further, since the gate-shaped heat radiating plate is in contact with the main body of the printed circuit board at the tip of its leg, it is possible to prevent the range in which electronic components can be mounted from being narrowed.
【0033】また、電子部品を放熱板の脚部に取付ける
ことにより、電子部品とを放熱板の脚部とがいずれもプ
リント基板本体に対して直交する下向きになって、該電
子部品のリード端子をプリント基板本体のリード挿入用
孔に通し、脚部の下端の係止突起をプリント基板本体の
係止孔に挿入する作業を一括して容易に行うことができ
る。Further, by mounting the electronic component on the leg of the radiator plate, the electronic component and the leg of the radiator plate are all directed downward at right angles to the printed circuit board body, and the lead terminals of the electronic component are provided. Through the lead insertion hole of the printed circuit board main body, and the operation of inserting the locking projection at the lower end of the leg portion into the locking hole of the printed circuit board main body can be easily performed collectively.
【0034】また、リード端子の整列方向に合わせてプ
リント基板本体に設けられている各リード挿入用孔をそ
の整列方向に対して直交する方向の長孔としてそれぞれ
設け、放熱板の係止突起にはリード挿入用孔の長手方向
に対して直交する方向のフック部を設け、プリント基板
本体の係止孔はリード挿入用孔の長孔に平行する方向に
設けると共にその方向の一端側が係止突起を容易に挿入
できる幅の幅広部で他端側がフック部をプリント基板本
体に係止できる幅の幅狭部にすると、電子部品のリード
端子をプリント基板本体のリード挿入用孔に通し、放熱
板の脚部下端の係止突起をプリント基板本体の係止孔に
挿入する際に、放熱板脚部の係止突起をプリント基板本
体の係止孔の幅広部側に挿入することにより、電子部品
のリード端子をプリント基板本体のリード挿入用孔に通
す作業を注意して行えば、係止孔の幅広部側に脚部の係
止突起を挿入する作業は問題なく行うことができる。こ
のような挿入作業の後に、放熱板を各リード挿入用孔の
長孔の方向にスライドすることにより、放熱板の係止突
起が幅広部側から幅狭部側に移動し、脚部の下端の係止
突起がプリント基板本体に係止される状態にすることが
できる。Further, each lead insertion hole provided in the printed circuit board main body in accordance with the alignment direction of the lead terminals is provided as an elongated hole in a direction perpendicular to the alignment direction, and is formed in the locking projection of the heat sink. Is provided with a hook portion in a direction perpendicular to the longitudinal direction of the lead insertion hole, the locking hole of the printed circuit board body is provided in a direction parallel to the long hole of the lead insertion hole, and one end in that direction is a locking projection. When the other end is narrow enough to hook the hook to the printed circuit board main body, the lead terminal of the electronic component is passed through the lead insertion hole of the printed circuit board main body, and the heat sink When the locking projections at the lower ends of the legs are inserted into the locking holes of the printed circuit board main body, the locking projections of the radiator plate legs are inserted into the wide portions of the locking holes of the printed circuit board main body, so that the electronic components are Plug the lead terminals of By performing the work through the lead insertion hole of the cement board body care, operation of inserting the locking projections of the legs wide portion side of the locking hole can be carried out without problems. After such insertion work, by sliding the heat sink in the direction of the long hole of each lead insertion hole, the locking projection of the heat sink moves from the wide part side to the narrow part side, and the lower end of the leg part. Can be brought into a state of being locked to the printed circuit board body.
【0035】また、リード挿入用孔の長孔に対応してプ
リント基板本体に設けるランド部を、該リード挿入用孔
の長孔の一方でリード端子を半田付けする側のみに設け
ても、ランド部がない側でリード挿入用孔に電子部品の
リード端子を挿入し、次に該リード端子をランド部で囲
まれた側に移動して該ランド部に半田付けするので支障
がなく、また、この構造の場合には、ランド部の占有面
積を狭くすることができる利点がある。Further, even if the land portion provided on the printed circuit board main body corresponding to the long hole of the lead insertion hole is provided only on one side of the long hole of the lead insertion hole where the lead terminal is to be soldered , Insert the lead terminal of the electronic component into the lead insertion hole on the side without the part, then move the lead terminal to the side surrounded by the land and solder it to the land, so there is no problem, This structure has the advantage that the area occupied by the land can be reduced.
【図1】本発明に係る放熱板付きプリント基板の実施の
形態の一例を示したもので、(A)は正面図、(B)は
(A)の左側面図、(C)は(A)の右側面図、(D)
は(A)の底面図である。FIG. 1 shows an example of an embodiment of a printed circuit board with a heat sink according to the present invention, wherein (A) is a front view, (B) is a left side view of (A), and (C) is (A). ), Right side view, (D)
3 is a bottom view of FIG.
【図2】図1で用いている放熱板を示したもので、
(A)は平面図、(B)は(A)の左側面図、(C)は
(A)の正面図である。FIG. 2 shows a radiator plate used in FIG.
(A) is a plan view, (B) is a left side view of (A), and (C) is a front view of (A).
【図3】(A)は図1で用いているプリント基板本体の
底面図、(B)は(A)のリード挿入用孔部の拡大図で
ある。3A is a bottom view of the printed circuit board main body used in FIG. 1, and FIG. 3B is an enlarged view of the lead insertion hole of FIG. 3A.
【図4】図3(B)に示すリード挿入用孔部の他の例を
示す拡大図である。FIG. 4 is an enlarged view showing another example of the lead insertion hole shown in FIG. 3 (B).
【図5】従来の放熱板付きプリント基板を示したもの
で、(A)は正面図、(B)は(A)の左側面図、
(C)は(A)の底面図である。5A and 5B show a conventional printed circuit board with a heat sink, wherein FIG. 5A is a front view, FIG. 5B is a left side view of FIG.
(C) is a bottom view of (A).
【図6】図5で用いている放熱板を示したもので、
(A)は平面図、(B)は(A)の左側面図、(C)は
(A)の正面図である。FIG. 6 shows a radiator plate used in FIG. 5;
(A) is a plan view, (B) is a left side view of (A), and (C) is a front view of (A).
【図7】(A)は図5で用いているプリント基板本体の
底面図、(B)は(A)のリード挿入用孔部の拡大図で
ある。7A is a bottom view of the printed circuit board main body used in FIG. 5, and FIG. 7B is an enlarged view of the lead insertion hole of FIG.
1 プリント基板本体 2 放熱板 2a 下向き湾曲部 2b 上向き湾曲部 2c 水平頂部 2d 脚部 3 ネジ 4 電子部品 4a リード端子 5 ネジ 6 リード挿入用孔 7 ランド部 8 半田 9 リード挿入用孔 10 電子部品 10a リード端子 11 ランド部 12 係止突起 12a フック部 13 係止孔 13a 幅広部 13b 幅狭部 DESCRIPTION OF SYMBOLS 1 Printed circuit board main body 2 Heat sink 2a Downward curved part 2b Upward curved part 2c Horizontal top part 2d Leg 3 Screw 4 Electronic component 4a Lead terminal 5 Screw 6 Lead insertion hole 7 Land part 8 Solder 9 Lead insertion hole 10 Electronic component 10a Lead terminal 11 Land portion 12 Locking projection 12a Hook portion 13 Locking hole 13a Wide portion 13b Narrow portion
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) H05K 7/20 H05K 1/18 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 7 , DB name) H05K 7/20 H05K 1/18
Claims (2)
脚部の下端の係止突起を前記プリント基板本体の係止孔
に挿入して係止されて搭載され、前記放熱板の脚部に電
子部品が取付けられ、前記電子部品のリード端子が前記
プリント基板本体のリード挿入用孔に通されて半田付け
接続されている放熱板付きプリント基板において、前記リード端子の整列方向に合わせて前記プリント基板
本体に設けられている各リード挿入用孔はその整列方向
に対して直交する方向の長孔としてそれぞれ設けられ、 前記放熱板の係止突起は前記リード挿入用孔の長手方向
に対して直交する方向のフック部を有し、 前記プリント基板本体の係止孔は前記リード挿入用孔の
長孔に平行する方向に設けられると共にその方向の一端
側が前記係止突起を容易に挿入できる幅の幅広部で他端
側が前記フック部を前記プリント基板本体に係止できる
幅の幅狭部になって いることを特徴とする放熱板付きプ
リント基板。1. A gate-shaped on a printed circuit board body radiator plate that
The locking projection at the lower end of the leg is inserted into the locking hole of the printed circuit board body.
The electronic component is attached to the legs of the heat sink, and the lead terminals of the electronic component are passed through the lead insertion holes of the printed circuit board main body and soldered and connected. In a printed circuit board with a heat sink, the printed circuit board is aligned with the alignment direction of the lead terminals.
Each lead insertion hole provided in the main unit is aligned in the alignment direction.
Are provided as long holes in a direction perpendicular to the hole , and the locking projections of the heat sink are in the longitudinal direction of the lead insertion holes.
And a hook portion in a direction perpendicular to the main body.
It is provided in the direction parallel to the long hole and one end of the direction
The other side is a wide portion with a width that allows easy insertion of the locking projection.
The side can lock the hook portion to the printed circuit board body
A printed circuit board with a heat sink characterized by having a narrow portion .
記プリント基板本体に設けられるランド部は、該リード
挿入用孔の長孔の一方で前記リード端子を半田付けする
側のみに設けられていることを特徴とする請求項1に記
載の放熱板付きプリント基板。2. A front end corresponding to a long hole of said lead insertion hole.
The lands provided on the printed circuit board main body include the leads
Solder the lead terminal to one of the long holes of the insertion hole
2. The device according to claim 1, wherein
Radiating plate with a printed circuit board mounting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25965995A JP3324358B2 (en) | 1995-10-06 | 1995-10-06 | Printed circuit board with heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25965995A JP3324358B2 (en) | 1995-10-06 | 1995-10-06 | Printed circuit board with heat sink |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09102687A JPH09102687A (en) | 1997-04-15 |
JP3324358B2 true JP3324358B2 (en) | 2002-09-17 |
Family
ID=17337124
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25965995A Expired - Fee Related JP3324358B2 (en) | 1995-10-06 | 1995-10-06 | Printed circuit board with heat sink |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3324358B2 (en) |
-
1995
- 1995-10-06 JP JP25965995A patent/JP3324358B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH09102687A (en) | 1997-04-15 |
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