JPH04369891A - Flexible module - Google Patents

Abstract

PURPOSE:To enable a printed board unit flexible module mounted on the circuit structures of various kinds of electronic equipments to be easily modified in mounting structure corresponding to the structure of an equipment. CONSTITUTION:A wiring pattern is formed on a flexible insulating film, an edge contact 11a connected to the outside is formed on both the rear and the front side of both the lengthwise edges of the film, and holes 11b are arranged outside of an electronic part 2 mounting region to provide bendable parts to the film for the formation of a flexible substrate 11, and electronic parts 2 are mounted on the surface of the substrate 11, whereby the flexible board 11 can be bent into an optional shape.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible module of a printed board unit installed in the circuit configuration of various electronic devices.

[0002]Recently, memory modules installed in computer mainframes, workstations, personal computers, etc. have recently been manufactured using rigid printed wiring boards (
Since many electronic components such as memory ICs are surface-mounted on both sides of a rigid board (hereinafter abbreviated as a rigid board), it is necessary to use a rigid board that has a different shape and size for each device depending on the mounting method and mounting space on the device side. Therefore, there is a need for a flexible module that can be easily installed without being affected by installation restrictions imposed by the equipment side.

0003

2. Description of the Related Art As shown in FIG. 5, a memory module that has been widely used in the past has an edge contact 1a with excellent conductivity arranged on both sides of one edge of an insulating substrate, and a conductive pattern (not shown). A plurality of electronic components 2 such as memory ICs are surface-mounted on both surfaces of the formed rigid substrate 1, respectively.

As shown in FIG. 6, the memory module is mounted inside the device by inserting the edge contacts of the rigid board 1 into the connector 4 mounted on the device board 3.

[0005]

[Problems to be Solved by the Invention] Problems with the conventional memory module described above are the number of surface-mounted electronic components 2 such as memory ICs, and the size and shape of their packages, as shown in FIG. Although the shape and size of the rigid board 1 vary depending on the type of device, the most restrictive conditions generally come from the mounting method and mounting space on the device board 3 on the equipment side, as shown in FIG.

[0006] Therefore, since the rigid board 1 must be created for each device, the development period of the device becomes longer and the cost increases. In view of the above problems, the present invention aims to provide a new flexible module whose mounting structure can be easily changed in accordance with the structure of equipment.

[0007]

[Means for Solving the Problems] As shown in FIG. 1, the present invention forms a wiring pattern on a flexible insulating film, and also forms edge contacts 11a for connecting to the outside on both the front and back sides of both longitudinal edges. The electronic component 2 is surface-mounted on both sides of the flexible substrate 11, which has a bending portion formed by arranging a plurality of holes 11b outside the mounting area of the electronic component 2, so that it can be bent into any shape.

[0008]

[Operation] In the present invention, edge contacts 11a are formed on both edges as shown in FIG.
Since the electronic components 2 are surface-mounted on the flexible substrate 11 on which the holes 11b are arranged, as shown in FIGS. By inserting the edge contact 11a, it becomes possible to adapt to the structure of the device.

Furthermore, since a plurality of holes 11b are arranged at the bent portion of the flexible substrate 11, the stress generated inside the flexible substrate 11 due to the bending escapes from the arranged holes 11b, and It is also possible to improve the bonding reliability between the wiring pattern 11 and the lead of the mounted electronic component 2.

0010

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to FIGS. 1 to 4. FIG. 1 is a schematic diagram showing a flexible module according to an embodiment of the present invention, FIG. 2 is a schematic diagram showing a first embodiment of the mounting method of the present flexible module, and FIG. 3 is a schematic diagram showing a second embodiment of the mounting method. , FIG. 4 shows a schematic diagram of a third embodiment of the mounting method, and in the figure, the same members as in FIGS. 5 and 6 are given the same symbols.

As shown in FIG. 1, the flexible module according to this embodiment has a flexible insulating film formed into a rectangular shape with a constant width, on which a wiring pattern for the electronic component 2 to be mounted is formed, and on both longitudinal edges. A plurality of holes 11b are formed between the mounting areas of the electronic component 2 by forming edge contacts 11a with excellent conductivity to connect with the outside on the front and back sides of the electronic component 2.
are arranged perpendicularly to the longitudinal direction of the insulating film to form a flexible substrate 11 in which bent portions are formed.

By surface-mounting electronic components 2 such as memory ICs on both surfaces of the flexible substrate 11 at a high density, electrical conduction is established between leads (not shown) of the electronic components 2 and the edge contacts 11a. ing.

[0013] In a first embodiment of this flexible module mounting method, as shown in FIG.
That is, by bending along the line in which the plurality of holes 11b are arranged, as shown in FIG.
b) By inserting the edge contacts 11a formed at both ends of the flexible substrate 11 into the connector 4 of the device board 3 as shown in FIG. flexible modules will be installed at high density.

In addition, in the second embodiment, as shown in FIG. 3, both edges of a flexible substrate 11, on which electronic components 2 of a memory IC are surface-mounted at high density, are bent into an F-shape. By inserting the edge contact formed on the edge into the connector 4 of the device board 3, the device is mounted on a device with a low upper space.

Furthermore, in the third embodiment, as shown in FIG. 4, the bent portions of the flexible substrate 11, on which the electronic components 2 of the memory IC are surface-mounted at high density on both sides, are aligned with each other. By bending in the opposite direction and inserting the edge contacts formed on both ends into the connector 4 of the device board 3, the flexible module can be mounted in a smaller area than in the second embodiment.

As a result, by bending each part of the plurality of holes 11b arranged in the flexible substrate 11 into an arbitrary shape, it becomes possible to immediately correspond to the structure of the equipment to be mounted, and by developing one flexible module. Since it is not affected by installation constraints on the equipment side, it is possible to improve installation efficiency and streamline the development of new models.

[0017]

[Effects of the Invention] As is clear from the above explanation, according to the present invention, it is possible to immediately adapt to the structure of the equipment to be mounted with an extremely simple configuration, thereby improving mounting efficiency and increasing the efficiency of new model development. It is possible to provide a flexible module that has advantages such as the ability to measure

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing a flexible module according to an embodiment of the present invention.

FIG. 2 is a schematic diagram showing a first embodiment of the flexible module mounting method.

FIG. 3 is a schematic diagram showing a second embodiment of the mounting method.

FIG. 4 is a schematic diagram showing a third embodiment of the mounting method.

FIG. 5 is a schematic diagram showing a conventional memory module.

FIG. 6 is a schematic diagram showing a conventional mounting method.

[Explanation of symbols]

Claims (3)

[Claims] [Claim 1] A flexible substrate (11a) on which edge contacts (11a) are formed on the wiring pattern and the edges.
) by mounting an electronic component (2) on the flexible board (11) and bending the flexible board (11) into an arbitrary shape so that there are no restrictions on the mounting form or mounting area on the device. module. [Claim 2] A hole (11b) is formed in the bent portion of the flexible substrate (11) to prevent stress from being generated at the joint between the flexible substrate (11) and the electronic component (2) when the flexible substrate (11) is bent. The flexible module according to claim 1, characterized in that: [Claim 3] The above-mentioned electronic components (
2) is mounted on one surface of the flexible substrate (11), and the electronic component (2) is mounted on the other surface to increase the cooling effect. module.