JPS62274695A - Multilayer interconnection board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a multilayer wiring board, and particularly to its wiring structure.

[Prior Art] Conventionally, this type of multilayer wiring board has been required to have a higher density mounting surface for electronic components as computers become larger, faster, and have larger capacities.

FIG. 2 is a perspective view showing the structure of a multilayer wiring board according to the prior art.

In the figure, reference numeral 4 denotes a multilayer wiring board, and together with components 5 mounted on the surface of this multilayer wiring board 4, connection pads (hereinafter abbreviated as IO pads) are used to connect with external circuits and external devices.
6 are arranged in large numbers so as to surround the periphery of the component 5.

[Problems to be Solved] The conventional multilayer wiring board 4 described above has a structure in which the IO pad 6 for connection with an external circuit is provided together with the component 5 on one surface of the multilayer wiring board 4. A dedicated area for the IO pad 6 is required on the surface of the wiring board 4, and the existence of this area has been a factor in reducing the packaging density of the components 5 on the multilayer wiring board 4.

In particular, in the field of large computers and supercomputers that require many electronic components, high-density packaging on multilayer wiring boards is required more than in other fields, so the above-mentioned factors for lower packaging density are important. It was a problem.

[Means for solving the problems] The multilayer wiring board of the present invention that solves the above-mentioned conventional problems has the following features:
In a multilayer wiring board in which a conductor wiring pattern is formed on an insulating substrate, connection pads for connecting to external devices, external circuits, etc. are provided on the side surface of the multilayer wiring board.

[Example] Next, an example of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of the present invention. In addition, since each component itself is the same as that of the conventional example, it is indicated by the common code|symbol below.

As shown in the figure, on the upper surface of a multilayer wiring board l formed by forming conductor wiring patterns on an insulating substrate, components 2 are provided at high density all over the surface, making so-called high-density mounting possible.

Further, on the side surface of the multilayer wiring board 1, IO pads 3 for connection with external circuits are also formed at high density. This (1)0 pad 3 is formed using a thin film printing method or a thick film printing method.

Note that this IO pad 3 is configured so that it can be connected to the internal circuit of the multilayer wiring board l by penetrating the side surface of the multilayer wiring board l.

In the illustrated example, the pads 3 are provided on the entire two sides of the multilayer wiring board 1 shown, but of course they may be provided on only one side of the multilayer wiring board 1 or on the entire length of the multilayer wiring board 1.

[Effects of the Invention] As explained above, the multilayer wiring board according to the present invention has connection pads for connecting with an external circuit on a side surface different from that of the components. -A dedicated area for connection pads that was previously required within the surface is no longer required, and the entire -surface can be used for component mounting, expanding the mounting area and improving mounting density. There is an effect.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a multilayer wiring board according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional multilayer wiring board. l: Multilayer board 2 2 parts 3: Connection pad

Claims (1)

[Scope of Claims] A multilayer wiring board in which a conductive wiring pattern is formed on an insulating substrate, characterized in that a pad for connection to an external device, an external circuit, etc. is provided on a side surface of the insulating substrate. substrate.