JPH05251842A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH05251842A JPH05251842A JP5008092A JP5008092A JPH05251842A JP H05251842 A JPH05251842 A JP H05251842A JP 5008092 A JP5008092 A JP 5008092A JP 5008092 A JP5008092 A JP 5008092A JP H05251842 A JPH05251842 A JP H05251842A
- Authority
- JP
- Japan
- Prior art keywords
- copper block
- heat
- insulating plate
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は実装部品及び導体の発
生熱が大きいプリント基板において、簡易な構造で効率
よく冷却することができるようにしたものに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board in which mounting components and conductors generate a large amount of heat and can be efficiently cooled with a simple structure.
【0002】[0002]
【従来の技術】実装部品及び導体の発生熱が大きいプリ
ント基板の従来例を図3及び図4にもとづいて説明す
る。これらの図において、絶縁板1の上面にエッチング
により形成した銅はくパターン2を一体的に接着してい
る。前記銅はくパターン2の上面には導体を兼ねる放熱
用銅ブロック4がはんだ付けで固着され、この銅ブロッ
ク4上にチップ部品5がはんだ付けして実装されてい
る。前記チップ部品5の発生熱は主として銅ブロック4
の表面から放熱される。2. Description of the Related Art A conventional printed circuit board in which mounted components and conductors generate a large amount of heat will be described with reference to FIGS. In these figures, a copper foil pattern 2 formed by etching is integrally bonded to the upper surface of an insulating plate 1. A heat-dissipating copper block 4 also serving as a conductor is fixed by soldering to the upper surface of the copper foil pattern 2, and a chip component 5 is soldered and mounted on the copper block 4. The heat generated by the chip component 5 is mainly generated by the copper block 4.
Heat is radiated from the surface of.
【0003】[0003]
【発明が解決しようとする課題】前記構造では銅ブロッ
ク4を絶縁板1に取付けるのに、まず銅はくパターン2
を絶縁板1に接着し、つぎに銅ブロック4を銅はくパタ
ーン2にはんだ付けで固着するという2工程を要するの
で、取付け作業に多くの手数を要するという欠点があっ
た。In the above structure, the copper block 4 is first attached to the insulating plate 1 by the copper foil pattern 2.
Since it requires two steps of adhering to the insulating plate 1 and then fixing the copper block 4 to the copper foil pattern 2 by soldering, there is a drawback that the mounting work requires a lot of labor.
【0004】この発明は前記の欠点を除去するために、
はんだ付け工程を減らした簡易な構造で効率よく冷却す
ることができるようにしたプリント基板を提供すること
を目的とする。In order to eliminate the above-mentioned drawbacks, the present invention provides
An object of the present invention is to provide a printed circuit board capable of efficiently cooling with a simple structure in which the number of soldering steps is reduced.
【0005】[0005]
【課題を解決するための手段】この発明は前記の目的を
達成するために、絶縁板1に導体を兼ねる放熱用銅ブロ
ック4を直接接着するとともに、この銅ブロック4上に
チップ部品5をはんだ付けして実装し、要すれば絶縁板
1の裏面にも放熱用銅ブロック24を接着取付けするよ
うにしたものである。In order to achieve the above object, the present invention directly adheres a heat-dissipating copper block 4 also serving as a conductor to an insulating plate 1 and solders a chip component 5 on the copper block 4. The heat-dissipating copper block 24 is attached and mounted on the back surface of the insulating plate 1 if necessary.
【0006】[0006]
【作用】前記銅ブロック4を絶縁板1に直接接着し、こ
の銅ブロック4上にチップ部品5を実装すれば、従来例
で説明したものよりはんだ付け工程を減らして簡易な構
造とすることができる。また絶縁板1の裏面にも放熱用
銅ブロック24を接着取付けするようにすれば、チップ
部品5及び導体の発生熱が大きくなっても例えば冷却フ
ァンを設けたり実装部品に放熱フィンを取付けたりする
ことなく基板を効率よく放熱、冷却することができる。If the copper block 4 is directly adhered to the insulating plate 1 and the chip component 5 is mounted on the copper block 4, the soldering process can be reduced as compared with the one described in the conventional example, and the structure can be simplified. it can. If the heat dissipation copper block 24 is attached to the back surface of the insulating plate 1 as well, even if the heat generated by the chip component 5 and the conductor becomes large, for example, a cooling fan is provided or a radiation fin is attached to the mounted component. It is possible to efficiently radiate and cool the substrate without the need.
【0007】[0007]
【実施例】図1はこの発明の請求項1に対応する実施例
を示すもので、図3及び図4と同一符号で示すものは同
一部品である。この図において、従来の銅はくパターン
を廃止し、絶縁板1の上面に導体を兼ねる放熱用銅ブロ
ック4をプリント基板の形成時にヒートプレスで直接接
着し、この銅ブロック4上にチップ部品5がはんだ付け
して実装されている。この実施例によれば従来例で説明
したものよりはんだ付け工程が減るので簡易な構造とな
るのみでなく、銅ブロック4が従来の銅はくパターン2
を兼ねるので銅はくパターン2を無くした分だけプリン
ト基板を安価にすることができる。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an embodiment corresponding to claim 1 of the present invention, and the same reference numerals as those in FIGS. 3 and 4 are the same parts. In this figure, the conventional copper foil pattern is abolished, and a heat-dissipating copper block 4 also serving as a conductor is directly bonded to the upper surface of the insulating plate 1 by heat pressing when the printed circuit board is formed. Is mounted by soldering. According to this embodiment, the number of soldering steps is smaller than that described in the conventional example, so that the structure is not only simple, but also the copper block 4 has the conventional copper foil pattern 2.
Since it also serves as the above, the printed circuit board can be inexpensive because the copper foil pattern 2 is eliminated.
【0008】図2はこの発明の請求項2に対応する実施
例を示すもので、図1,図3及び図4と同一符号で示す
ものは同一部品である。この図におけるプリント基板は
図1で説明した絶縁板1の裏面にも全面にわたって放熱
用銅ブロック24が接着取付けされている。この実施例
によればチップ部品5及び導体の発生熱が大きくなって
も例えば冷却ファンを設けたり実装部品に放熱フィンを
取付けたりすることなく基板を効率よく放熱、冷却する
ことができる。FIG. 2 shows an embodiment corresponding to claim 2 of the present invention, and the same parts as those shown in FIGS. 1, 3 and 4 are the same parts. In the printed circuit board in this figure, a copper block 24 for heat dissipation is also adhesively attached over the entire back surface of the insulating plate 1 described in FIG. According to this embodiment, even if the heat generated by the chip component 5 and the conductor becomes large, the substrate can be efficiently radiated and cooled without providing, for example, a cooling fan or mounting a radiation fin on the mounting component.
【0009】[0009]
【発明の効果】この発明によれば実装部品及び導体の発
生熱が大きいプリント基板において、絶縁板に導体を兼
ねる放熱用銅ブロックを直接接着するとともに、この銅
ブロック上にチップ部品をはんだ付けして実装し、要す
れば絶縁板の裏面にも放熱用銅ブロックを接着取付けす
るようにしたので、従来例で説明したものよりはんだ付
け工程を減らした簡易な構造で効率よく放熱、冷却する
ことができ、さらに銅はくパターンを安価にすることも
できるという効果が得られる。According to the present invention, in a printed circuit board in which a mounting component and a conductor generate a large amount of heat, a heat-dissipating copper block also serving as a conductor is directly bonded to an insulating plate, and a chip component is soldered onto the copper block. Since the heat dissipation copper block is attached to the back surface of the insulating plate by adhesive bonding if necessary, it is possible to efficiently dissipate and cool the heat with a simple structure with fewer soldering steps than the one explained in the conventional example. It is also possible to obtain the effect that the copper foil pattern can be made inexpensive.
【図1】この発明の請求項1に対応する実施例の縦断面
図FIG. 1 is a longitudinal sectional view of an embodiment corresponding to claim 1 of the present invention.
【図2】この発明の請求項2に対応する実施例の縦断面
図FIG. 2 is a vertical sectional view of an embodiment corresponding to claim 2 of the present invention.
【図3】従来例の縦断面図FIG. 3 is a vertical sectional view of a conventional example.
【図4】図3の平面図FIG. 4 is a plan view of FIG.
1 絶縁板 4 銅ブロック 5 チップ部品 12 銅はくパターン 24 銅ブロック 1 Insulation plate 4 Copper block 5 Chip parts 12 Copper foil pattern 24 Copper block
Claims (2)
直接接着するとともに、この銅ブロック上にチップ部品
をはんだ付けして実装したことを特徴とするプリント基
板。1. A printed circuit board, wherein a heat-dissipating copper block also serving as a conductor is directly bonded to an insulating plate, and a chip component is soldered and mounted on the copper block.
縁板の裏面にも放熱用銅ブロックを接着取付けしたこと
を特徴とするプリント基板。2. The printed circuit board according to claim 1, further comprising a heat dissipation copper block bonded to the back surface of the insulating plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5008092A JPH05251842A (en) | 1992-03-09 | 1992-03-09 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5008092A JPH05251842A (en) | 1992-03-09 | 1992-03-09 | Printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05251842A true JPH05251842A (en) | 1993-09-28 |
Family
ID=12849039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5008092A Pending JPH05251842A (en) | 1992-03-09 | 1992-03-09 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05251842A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108200729A (en) * | 2018-01-12 | 2018-06-22 | 奥士康精密电路(惠州)有限公司 | A kind of PCB isolation patterns paving copper shunting second etch method |
-
1992
- 1992-03-09 JP JP5008092A patent/JPH05251842A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108200729A (en) * | 2018-01-12 | 2018-06-22 | 奥士康精密电路(惠州)有限公司 | A kind of PCB isolation patterns paving copper shunting second etch method |
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