JPH05251842A - Printed board - Google Patents

Abstract

PURPOSE:To make it possible to perform efficient heat radiation and cooling of a printed circuit board having much heat generating mounted parts and conductors with simple construction which needs fewer soldering processes. CONSTITUTION:A heat radiating copper block 4 which is also used as a conductor is directly glued to an insulating board 1 at the time of forming a printed board, and a chip part 5 is soldered onto this copper block 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board in which mounting components and conductors generate a large amount of heat and can be efficiently cooled with a simple structure.

[0002]

2. Description of the Related Art A conventional printed circuit board in which mounted components and conductors generate a large amount of heat will be described with reference to FIGS. In these figures, a copper foil pattern 2 formed by etching is integrally bonded to the upper surface of an insulating plate 1. A heat-dissipating copper block 4 also serving as a conductor is fixed by soldering to the upper surface of the copper foil pattern 2, and a chip component 5 is soldered and mounted on the copper block 4. The heat generated by the chip component 5 is mainly generated by the copper block 4.
Heat is radiated from the surface of.

[0003]

In the above structure, the copper block 4 is first attached to the insulating plate 1 by the copper foil pattern 2.
Since it requires two steps of adhering to the insulating plate 1 and then fixing the copper block 4 to the copper foil pattern 2 by soldering, there is a drawback that the mounting work requires a lot of labor.

In order to eliminate the above-mentioned drawbacks, the present invention provides
An object of the present invention is to provide a printed circuit board capable of efficiently cooling with a simple structure in which the number of soldering steps is reduced.

[0005]

In order to achieve the above object, the present invention directly adheres a heat-dissipating copper block 4 also serving as a conductor to an insulating plate 1 and solders a chip component 5 on the copper block 4. The heat-dissipating copper block 24 is attached and mounted on the back surface of the insulating plate 1 if necessary.

[0006]

If the copper block 4 is directly adhered to the insulating plate 1 and the chip component 5 is mounted on the copper block 4, the soldering process can be reduced as compared with the one described in the conventional example, and the structure can be simplified. it can. If the heat dissipation copper block 24 is attached to the back surface of the insulating plate 1 as well, even if the heat generated by the chip component 5 and the conductor becomes large, for example, a cooling fan is provided or a radiation fin is attached to the mounted component. It is possible to efficiently radiate and cool the substrate without the need.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an embodiment corresponding to claim 1 of the present invention, and the same reference numerals as those in FIGS. 3 and 4 are the same parts. In this figure, the conventional copper foil pattern is abolished, and a heat-dissipating copper block 4 also serving as a conductor is directly bonded to the upper surface of the insulating plate 1 by heat pressing when the printed circuit board is formed. Is mounted by soldering. According to this embodiment, the number of soldering steps is smaller than that described in the conventional example, so that the structure is not only simple, but also the copper block 4 has the conventional copper foil pattern 2.
Since it also serves as the above, the printed circuit board can be inexpensive because the copper foil pattern 2 is eliminated.

FIG. 2 shows an embodiment corresponding to claim 2 of the present invention, and the same parts as those shown in FIGS. 1, 3 and 4 are the same parts. In the printed circuit board in this figure, a copper block 24 for heat dissipation is also adhesively attached over the entire back surface of the insulating plate 1 described in FIG. According to this embodiment, even if the heat generated by the chip component 5 and the conductor becomes large, the substrate can be efficiently radiated and cooled without providing, for example, a cooling fan or mounting a radiation fin on the mounting component.

[0009]

According to the present invention, in a printed circuit board in which a mounting component and a conductor generate a large amount of heat, a heat-dissipating copper block also serving as a conductor is directly bonded to an insulating plate, and a chip component is soldered onto the copper block. Since the heat dissipation copper block is attached to the back surface of the insulating plate by adhesive bonding if necessary, it is possible to efficiently dissipate and cool the heat with a simple structure with fewer soldering steps than the one explained in the conventional example. It is also possible to obtain the effect that the copper foil pattern can be made inexpensive.

[Brief description of drawings]

FIG. 1 is a longitudinal sectional view of an embodiment corresponding to claim 1 of the present invention.

FIG. 2 is a vertical sectional view of an embodiment corresponding to claim 2 of the present invention.

FIG. 3 is a vertical sectional view of a conventional example.

FIG. 4 is a plan view of FIG.

[Explanation of symbols]

 1 Insulation plate 4 Copper block 5 Chip parts 12 Copper foil pattern 24 Copper block

Claims (2)

[Claims] 1. A printed circuit board, wherein a heat-dissipating copper block also serving as a conductor is directly bonded to an insulating plate, and a chip component is soldered and mounted on the copper block. 2. The printed circuit board according to claim 1, further comprising a heat dissipation copper block bonded to the back surface of the insulating plate.