JPH08264910A - Manufacture of printed wiring board with heat sink and method for mounting high-power component on the board - Google Patents

Manufacture of printed wiring board with heat sink and method for mounting high-power component on the board

Info

Publication number
JPH08264910A
JPH08264910A JP8876895A JP8876895A JPH08264910A JP H08264910 A JPH08264910 A JP H08264910A JP 8876895 A JP8876895 A JP 8876895A JP 8876895 A JP8876895 A JP 8876895A JP H08264910 A JPH08264910 A JP H08264910A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
board
power component
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8876895A
Other languages
Japanese (ja)
Inventor
Masataka Kondo
正高 近藤
Tadao Endo
忠雄 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YOKOHAMA TEIKOUKI KK
Original Assignee
YOKOHAMA TEIKOUKI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YOKOHAMA TEIKOUKI KK filed Critical YOKOHAMA TEIKOUKI KK
Priority to JP8876895A priority Critical patent/JPH08264910A/en
Publication of JPH08264910A publication Critical patent/JPH08264910A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

PURPOSE: To improve the heat radiating efficiency of a printed wiring board by sticking a heat sink to an insulating plate with a bonding agent and, at the same time, to easily mount high-power electronic components on the board by simplifying the mounting structure of the board. CONSTITUTION: After a printed wiring board 3 having a wiring pattern 2 on an insulating plate 1 is prepared, released paper 9 coated with a bonding agent 7a is stuck to the surface of the insulating plate 1 on which the wiring pattern 2 is not formed with the bonding agent 7a. Then a through hole 5 having such a size that high-power component package 4 can be put in the hole 5 is formed at a prescribed position to which the package 4 is to be positioned. After the hole 5 is formed, the paper 9 is removed from the insulating plate 1 and a metallic heat sink 6 is stuck to the insulating plate 1 with the bonding agent 7a left on the surface of the plate 1. Then the package 4 is put in the through hole 5 of the board 3 and the base of the package 4 is stuck to the heat sink 6.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、放熱板付きプリント配
線板の作製方法及びハイパワー部品のプリント配線板へ
の実装方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board with a heat sink and a method for mounting high power components on the printed wiring board.

【0002】[0002]

【従来の技術】従来、ハイパワー電子部品をプリント配
線板に実装し、ハイパワー電子部品が発生した熱を放熱
するために、図3に示すような実装構造が提案されてい
る(特開昭60ー32346号公報)。
2. Description of the Related Art Conventionally, a mounting structure as shown in FIG. 3 has been proposed for mounting a high power electronic component on a printed wiring board and radiating the heat generated by the high power electronic component (Japanese Patent Laid-Open Publication No. Sho. 60-32346).

【0003】図3において、金属放熱板21と任意部分
に貫通孔22が設けられたプリント配線板20とが接着
されたプリント配線板20の金属放熱部分に半導体パッ
ケージ23の底面とほぼ等しい凸部24からなる半田接
続部25を設け、この半田接続部25と半導体パッケー
ジ底面とが半田付けされ、かつプリント配線板20の配
線パターンと半導体パッケージのリード26とを接続し
て半導体装置を実装している。
In FIG. 3, a convex portion substantially equal to the bottom surface of the semiconductor package 23 is formed on the metal heat radiating portion of the printed wiring board 20 to which the metal heat radiating plate 21 and the printed wiring board 20 provided with the through hole 22 in an arbitrary portion are adhered. A solder connection portion 25 composed of 24 is provided, the solder connection portion 25 and the bottom surface of the semiconductor package are soldered, and the wiring pattern of the printed wiring board 20 and the lead 26 of the semiconductor package are connected to mount the semiconductor device. There is.

【0004】前記実装構造の半導体パッケージの実装方
法において、前記プリント配線板20は、半導体パッケ
ージ23のリード26の近辺まで配線パターンを施して
接続部とし、半導体パッケージ23の底面に当たる部分
をくり貫き、プリント配線板20のパターンとリード2
6を半田接続したあと、半導体パッケージ23の底面が
露出するようにする。
In the mounting method of the semiconductor package having the mounting structure, the printed wiring board 20 is provided with a wiring pattern up to the vicinity of the lead 26 of the semiconductor package 23 as a connection portion, and a portion corresponding to the bottom surface of the semiconductor package 23 is hollowed out. Pattern of printed wiring board 20 and lead 2
After soldering 6 together, the bottom surface of the semiconductor package 23 is exposed.

【0005】また、金属放熱板21は熱伝導性の良い金
属を用い、プリント配線板20の貫通孔22に入るよう
に金属放熱板21に凸部24を設け、半田接続部25を
形成する。そして、前記凸部24に予備半田を形成し、
プリント配線板20に金属放熱板21を嵌合密着させて
接着材で一体構造とする。
The metal heat dissipation plate 21 is made of a metal having a good thermal conductivity, and the metal heat dissipation plate 21 is provided with a projection 24 so as to be inserted into the through hole 22 of the printed wiring board 20 to form a solder connection part 25. Then, a preliminary solder is formed on the convex portion 24,
A metal heat dissipation plate 21 is fitted and closely attached to the printed wiring board 20 to form an integrated structure with an adhesive material.

【0006】前記実装構造は、半導体パッケージ23と
放熱金属板21が半田層を介して直結しているため、熱
抵抗が低減して放熱効果は向上するが、金属放熱板21
に前記凸部24を形成するという工程が必要となり、プ
リント配線板20に複数のパッケージを装着する場合、
金属放熱板21に複数の凸部を設けなければならず、凸
部の高さをプリント配線板の厚みに合わせ、且つ凸部2
4の位置をプリント配線板20の貫通孔22の位置に合
わせて加工するのに精密さを要する。
In the mounting structure, since the semiconductor package 23 and the heat radiation metal plate 21 are directly connected via the solder layer, the heat resistance is reduced and the heat radiation effect is improved.
When a plurality of packages are mounted on the printed wiring board 20, a process of forming the convex portion 24 on the
The metal heat dissipation plate 21 must be provided with a plurality of protrusions, the height of the protrusions is adjusted to the thickness of the printed wiring board, and
Precision is required to process the position 4 in accordance with the position of the through hole 22 of the printed wiring board 20.

【0007】また、プリント配線板20に金属放熱板2
1を接着する際、前記貫通孔22と前記凸部24との位
置合わせを要し、特に高密度実装基板の場合、前記位置
合わせも困難になる。
In addition, the printed circuit board 20 and the metal heat sink 2
When the 1 is bonded, it is necessary to align the through hole 22 and the convex portion 24, and particularly in the case of a high-density mounting board, the alignment becomes difficult.

【0008】[0008]

【発明が解決しようとする課題】本発明は、前記問題点
に鑑み、放熱効果が良好で、実装構造が複雑にならず、
ハイパワー電子部品の実装が容易な、放熱板付きプリン
ト配線板の作製方法及びハイパワー部品のプリント配線
板への実装方法を提供する点にある。
SUMMARY OF THE INVENTION In view of the above problems, the present invention has a good heat dissipation effect and does not complicate the mounting structure.
Another object of the present invention is to provide a method for producing a printed wiring board with a heat sink and a method for mounting a high power component on a printed wiring board, which facilitates mounting of high power electronic components.

【0009】[0009]

【課題を解決するための手段】本発明金属放熱板付きプ
リント配線板及びプリント配線板へのハイパワー部品の
実装方法は、以下の工程(a)〜(e)から構成され
る。 (a)絶縁板の一方の面に配線パターンを備えるプリン
ト配線板の前記絶縁板の他の面に、接着剤を塗布した剥
離紙を該接着剤を介して接着する工程、(b)前記剥離
紙を接着したプリント配線板のハイパワー部品装着位置
に貫通孔を形成する工程、(c)前記剥離紙を剥ぎ取る
工程、(d)放熱板を前記接着剤にて前記絶縁板に貼り
付ける工程、(e)前記(b)の工程で形成した貫通孔
を通してハイパワー部品を前記放熱板に固定する工程。
A printed wiring board with a metal heat sink and a method of mounting a high power component on the printed wiring board according to the present invention include the following steps (a) to (e). (A) a step of adhering a release paper coated with an adhesive to the other surface of the insulating board of a printed wiring board having a wiring pattern on one surface of the insulating board via the adhesive, (b) the release A step of forming a through hole at a high power component mounting position of a printed wiring board to which paper is adhered, (c) a step of peeling the release paper, and (d) a step of attaching a heat dissipation plate to the insulating plate with the adhesive. And (e) a step of fixing the high power component to the heat sink through the through hole formed in the step (b).

【0010】[0010]

【実施例】まず、本発明におけるハイパワー部品の実装
構造を図2に基づいて説明する。1は絶縁板で該絶縁板
1上に配線パターン2が形成されてプリント配線板3を
構成している。該プリント配線板3にはハイパワー部品
パッケージ4を嵌合できる貫通孔5が設けられている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, a mounting structure of a high power component according to the present invention will be described with reference to FIG. Reference numeral 1 denotes an insulating plate, and a wiring pattern 2 is formed on the insulating plate 1 to form a printed wiring board 3. The printed wiring board 3 is provided with a through hole 5 into which the high power component package 4 can be fitted.

【0011】6は熱伝導性の良好な金属放熱板であっ
て、例えば、アルミニューム板にて構成するのが好適で
ある。そして、該金属放熱板6はプリント配線板3の絶
縁板1に接着層7を介して貼り付けられている。そし
て、前記貫通孔5にハイパワー部品パッケージ4が嵌合
し金属放熱板6に密着するように装着するが、この際、
ハイパワー部品パッケージ4の底面と前記金属放熱板6
の表面とを熱伝導性の良好な接着剤又は半田付けにて固
定する。
Reference numeral 6 denotes a metal heat dissipation plate having a good heat conductivity, and it is preferable that the heat dissipation plate 6 is made of, for example, an aluminum plate. The metal heat dissipation plate 6 is attached to the insulating plate 1 of the printed wiring board 3 via the adhesive layer 7. Then, the high power component package 4 is fitted into the through hole 5 and mounted so as to be in close contact with the metal heat sink plate 6. At this time,
The bottom surface of the high power component package 4 and the metal heat sink 6
It is fixed to the surface of the substrate with an adhesive having good thermal conductivity or soldering.

【0012】そして、ハイパワー部品パッケージ4のリ
ード8、8をプリント配線板3の配線パターン2、2に
半田付けにて接続する。また、ハイパワー部品パッケー
ジ4がボンディングパッドを備えている場合は、前記配
線パターン2とボンディングパッドとをワイヤボンディ
ングにて接続すれば良い。
Then, the leads 8, 8 of the high-power component package 4 are connected to the wiring patterns 2, 2 of the printed wiring board 3 by soldering. When the high power component package 4 has a bonding pad, the wiring pattern 2 and the bonding pad may be connected by wire bonding.

【0013】また、ハイパワー部品パッケージ4を金属
放熱板6に半田付けにて接着する場合は、該半田付けと
前記リード8と配線パターン2との半田付けを同時に行
うことも可能である。
When the high power component package 4 is bonded to the metal heat dissipation plate 6 by soldering, the soldering and the soldering of the leads 8 and the wiring pattern 2 can be performed simultaneously.

【0014】以下、前記金属放熱板付きプリント配線板
の作製方法及び前記金属放熱板6が設けられたプリント
配線板3へのハイパワー部品実装方法を、図1に示す工
程に基づいて詳述する。
Hereinafter, a method for producing the printed wiring board with the metal heat sink and a method for mounting high power components on the printed wiring board 3 provided with the metal heat sink 6 will be described in detail with reference to the steps shown in FIG. .

【0015】まず、図1の(A)に示すように、絶縁板
1上に配線パターン2を設けたプリント配線板3を用意
する。
First, as shown in FIG. 1A, a printed wiring board 3 having a wiring pattern 2 provided on an insulating plate 1 is prepared.

【0016】次に、図1の(B)に示すように、プリン
ト配線板3の配線パターン2が形成されていない絶縁板
1の面に、接着剤7aが塗布された剥離紙9を前記接着
剤7aにて接着する。
Next, as shown in FIG. 1 (B), the release paper 9 coated with the adhesive 7a is adhered to the surface of the insulating board 1 on which the wiring pattern 2 of the printed wiring board 3 is not formed. Bond with agent 7a.

【0017】該接着剤7aが塗布された剥離紙9で構成
される接着手段は、いわゆる両面接着テープとして市販
されているものを利用でき、絶縁板1に剥離紙9が前記
接着剤7aにて接着されると、剥離紙9のみを絶縁板1
から容易に分離できる接着手段である。
A commercially available so-called double-sided adhesive tape can be used as an adhesive means composed of the release paper 9 coated with the adhesive 7a. The release paper 9 is applied to the insulating plate 1 by the adhesive 7a. When bonded, only the release paper 9 is attached to the insulating plate 1
It is an adhesive means that can be easily separated from.

【0018】次に、このような剥離紙9が貼り付けられ
たプリント配線板3において、図1の(C)に示すよう
に、ハイパワー部品パッケージ4を装着すべき所定位置
をプレス加工等で打ち抜いて除去し、ハイパワー部品パ
ッケージ4が嵌合できる程度の貫通孔5を形成する。
Next, in the printed wiring board 3 to which such a release paper 9 is attached, as shown in FIG. 1C, a predetermined position where the high power component package 4 is to be mounted is subjected to press working or the like. It is punched out and removed, and a through hole 5 is formed so that the high power component package 4 can be fitted therein.

【0019】次に、図1の(D)に示すように、前記剥
離紙9を絶縁板1から剥ぎ取る。
Next, as shown in FIG. 1D, the release paper 9 is stripped from the insulating plate 1.

【0020】次に、図1の(E)に示すように、絶縁板
1上の接着剤7aにて金属放熱板6を絶縁板1に貼り付
ける。以上の工程を経て、放熱板付きプリント配線板を
作製することができる。
Next, as shown in FIG. 1E, the metal heat dissipation plate 6 is attached to the insulating plate 1 with the adhesive 7a on the insulating plate 1. Through the above steps, a printed wiring board with a heat sink can be manufactured.

【0021】次に、図1の(F)に示すように、前記金
属放熱板6が貼り付けられたプリント配線板3の前記貫
通孔5に所定のハイパワー部品パッケージ4を嵌合し、
放熱金属板6にハイパワー部品パッケージ4の底面を接
着する。この際、ハイパワー部品パッケージ4と前記放
熱金属板6とは熱伝導性の良好な接着剤で接着するか半
田付けにて接着する。以上のような工程を経て、図2に
示すように、金属放熱板付きプリント配線板3へのハイ
パワー部品パッケージ4の実装が完了する。
Next, as shown in FIG. 1F, a predetermined high power component package 4 is fitted into the through hole 5 of the printed wiring board 3 to which the metal heat dissipation plate 6 is attached,
The bottom surface of the high power component package 4 is adhered to the heat dissipation metal plate 6. At this time, the high-power component package 4 and the heat-dissipating metal plate 6 are bonded by an adhesive having good thermal conductivity or by soldering. Through the steps described above, as shown in FIG. 2, the mounting of the high power component package 4 on the printed wiring board 3 with the metal heat dissipation plate is completed.

【0022】[0022]

【発明の効果】本発明放熱板付きプリント配線板の作製
方法及びハイパワー部品パッケージの実装方法によれ
ば、従来のようにプリント配線板に形成した貫通穴の位
置に合わせて金属放熱板に凸部を形成するという工程を
必要とせず、簡易な作製方法及び実装方法を実現でき
る。また、ハイパワー部品パッケージを装着するために
設けた、貫通孔の位置に、何ら位置合わせを必要とする
ことなく、プリント配線板に金属放熱板を前記両面接着
手段にて設けることができる。
According to the method of manufacturing a printed wiring board with a heat dissipation plate and the method of mounting a high power component package of the present invention, the metal heat dissipation plate is projected in accordance with the position of the through hole formed in the printed wiring board as in the prior art. A simple manufacturing method and mounting method can be realized without the step of forming a part. Further, a metal heat dissipation plate can be provided on the printed wiring board by the double-sided adhesive means without requiring any alignment at the position of the through hole provided for mounting the high power component package.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の工程図である。FIG. 1 is a process drawing of the present invention.

【図2】本発明実装方法にて実装されたハイパワー部品
パッケージの実装構造の断面図である。
FIG. 2 is a sectional view of a mounting structure of a high power component package mounted by the mounting method of the present invention.

【図3】従来のハイパワー部品パッケージの実装構造の
断面図である。
FIG. 3 is a cross-sectional view of a conventional high-power component package mounting structure.

【符号の説明】[Explanation of symbols]

1 絶縁板 2 配線パターン 3 プリント配線板 4 ハイパワー部品パッケージ 5 貫通孔 6 金属放熱板 7 接着層 7a 接着剤 8 リード 9 剥離紙 1 Insulation Plate 2 Wiring Pattern 3 Printed Wiring Board 4 High Power Component Package 5 Through Hole 6 Metal Heat Sink 7 Adhesive Layer 7a Adhesive 8 Lead 9 Release Paper

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 以下の工程(a)〜(d)から構成され
る放熱板付きプリント配線板の作製方法。 (a)絶縁板の一方の面に配線パターンを備えるプリン
ト配線板の前記絶縁板の他の面に、接着剤を塗布した剥
離紙を該接着剤を介して接着する工程、(b)前記剥離
紙を接着したプリント配線板のハイパワー部品装着位置
に貫通孔を形成する工程、(c)前記剥離紙を剥ぎ取る
工程、(d)放熱板を前記接着剤にて前記絶縁板に貼り
付ける工程。
1. A method of manufacturing a printed wiring board with a heat sink, which comprises the following steps (a) to (d). (A) a step of adhering a release paper coated with an adhesive to the other surface of the insulating board of a printed wiring board having a wiring pattern on one surface of the insulating board via the adhesive, (b) the release A step of forming a through hole at a high power component mounting position of a printed wiring board to which paper is adhered, (c) a step of peeling the release paper, and (d) a step of attaching a heat dissipation plate to the insulating plate with the adhesive. .
【請求項2】 以下の工程(a)〜(e)から構成され
るプリント配線板へのハイパワー部品の実装方法。 (a)絶縁板の一方の面に配線パターンを備えるプリン
ト配線板の前記絶縁板の他の面に、接着剤を塗布した剥
離紙を該接着剤を介して接着する工程、(b)前記剥離
紙を接着したプリント配線板のハイパワー部品装着位置
に貫通孔を形成する工程、(c)前記剥離紙を剥ぎ取る
工程、(d)放熱板を前記接着剤にて前記絶縁板に貼り
付ける工程、(e)前記(b)の工程で形成した貫通孔
を通してハイパワー部品を前記放熱板に固定する工程。
2. A method of mounting a high power component on a printed wiring board, which comprises steps (a) to (e) below. (A) a step of adhering a release paper coated with an adhesive to the other surface of the insulating board of a printed wiring board having a wiring pattern on one surface of the insulating board via the adhesive, (b) the release A step of forming a through hole at a high power component mounting position of a printed wiring board to which paper is adhered, (c) a step of peeling the release paper, and (d) a step of attaching a heat dissipation plate to the insulating plate with the adhesive. And (e) a step of fixing the high power component to the heat sink through the through hole formed in the step (b).
JP8876895A 1995-03-22 1995-03-22 Manufacture of printed wiring board with heat sink and method for mounting high-power component on the board Pending JPH08264910A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8876895A JPH08264910A (en) 1995-03-22 1995-03-22 Manufacture of printed wiring board with heat sink and method for mounting high-power component on the board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8876895A JPH08264910A (en) 1995-03-22 1995-03-22 Manufacture of printed wiring board with heat sink and method for mounting high-power component on the board

Publications (1)

Publication Number Publication Date
JPH08264910A true JPH08264910A (en) 1996-10-11

Family

ID=13952047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8876895A Pending JPH08264910A (en) 1995-03-22 1995-03-22 Manufacture of printed wiring board with heat sink and method for mounting high-power component on the board

Country Status (1)

Country Link
JP (1) JPH08264910A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008171894A (en) * 2007-01-09 2008-07-24 Matsushita Electric Ind Co Ltd Power device equipment
EP2063455A2 (en) 2007-11-12 2009-05-27 NEC Corporation Device mounting structure and device mounting method
JP2011100959A (en) * 2009-10-05 2011-05-19 Sumitomo Electric Ind Ltd Flexible board, flexible board module, and method for manufacturing both
FR2959062A1 (en) * 2010-04-15 2011-10-21 Mitsubishi Electric Corp SEMICONDUCTOR APPARATUS

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008171894A (en) * 2007-01-09 2008-07-24 Matsushita Electric Ind Co Ltd Power device equipment
EP2063455A2 (en) 2007-11-12 2009-05-27 NEC Corporation Device mounting structure and device mounting method
US7929312B2 (en) 2007-11-12 2011-04-19 Nec Corporation Device mounting structure and device mounting method
JP2011100959A (en) * 2009-10-05 2011-05-19 Sumitomo Electric Ind Ltd Flexible board, flexible board module, and method for manufacturing both
FR2959062A1 (en) * 2010-04-15 2011-10-21 Mitsubishi Electric Corp SEMICONDUCTOR APPARATUS
JP2011228335A (en) * 2010-04-15 2011-11-10 Mitsubishi Electric Corp Semiconductor device
US9006879B2 (en) 2010-04-15 2015-04-14 Mitsubishi Electric Corporation Semicondutor device package placed within fitting portion of wiring member and attached to heat sink

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