JPH08264910A - Manufacture of printed wiring board with heat sink and method for mounting high-power component on the board - Google Patents

Abstract

PURPOSE: To improve the heat radiating efficiency of a printed wiring board by sticking a heat sink to an insulating plate with a bonding agent and, at the same time, to easily mount high-power electronic components on the board by simplifying the mounting structure of the board. CONSTITUTION: After a printed wiring board 3 having a wiring pattern 2 on an insulating plate 1 is prepared, released paper 9 coated with a bonding agent 7a is stuck to the surface of the insulating plate 1 on which the wiring pattern 2 is not formed with the bonding agent 7a. Then a through hole 5 having such a size that high-power component package 4 can be put in the hole 5 is formed at a prescribed position to which the package 4 is to be positioned. After the hole 5 is formed, the paper 9 is removed from the insulating plate 1 and a metallic heat sink 6 is stuck to the insulating plate 1 with the bonding agent 7a left on the surface of the plate 1. Then the package 4 is put in the through hole 5 of the board 3 and the base of the package 4 is stuck to the heat sink 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board with a heat sink and a method for mounting high power components on the printed wiring board.

[0002]

2. Description of the Related Art Conventionally, a mounting structure as shown in FIG. 3 has been proposed for mounting a high power electronic component on a printed wiring board and radiating the heat generated by the high power electronic component (Japanese Patent Laid-Open Publication No. Sho. 60-32346).

In FIG. 3, a convex portion substantially equal to the bottom surface of the semiconductor package 23 is formed on the metal heat radiating portion of the printed wiring board 20 to which the metal heat radiating plate 21 and the printed wiring board 20 provided with the through hole 22 in an arbitrary portion are adhered. A solder connection portion 25 composed of 24 is provided, the solder connection portion 25 and the bottom surface of the semiconductor package are soldered, and the wiring pattern of the printed wiring board 20 and the lead 26 of the semiconductor package are connected to mount the semiconductor device. There is.

In the mounting method of the semiconductor package having the mounting structure, the printed wiring board 20 is provided with a wiring pattern up to the vicinity of the lead 26 of the semiconductor package 23 as a connection portion, and a portion corresponding to the bottom surface of the semiconductor package 23 is hollowed out. Pattern of printed wiring board 20 and lead 2
After soldering 6 together, the bottom surface of the semiconductor package 23 is exposed.

The metal heat dissipation plate 21 is made of a metal having a good thermal conductivity, and the metal heat dissipation plate 21 is provided with a projection 24 so as to be inserted into the through hole 22 of the printed wiring board 20 to form a solder connection part 25. Then, a preliminary solder is formed on the convex portion 24,
A metal heat dissipation plate 21 is fitted and closely attached to the printed wiring board 20 to form an integrated structure with an adhesive material.

In the mounting structure, since the semiconductor package 23 and the heat radiation metal plate 21 are directly connected via the solder layer, the heat resistance is reduced and the heat radiation effect is improved.
When a plurality of packages are mounted on the printed wiring board 20, a process of forming the convex portion 24 on the
The metal heat dissipation plate 21 must be provided with a plurality of protrusions, the height of the protrusions is adjusted to the thickness of the printed wiring board, and
Precision is required to process the position 4 in accordance with the position of the through hole 22 of the printed wiring board 20.

In addition, the printed circuit board 20 and the metal heat sink 2
When the 1 is bonded, it is necessary to align the through hole 22 and the convex portion 24, and particularly in the case of a high-density mounting board, the alignment becomes difficult.

[0008]

SUMMARY OF THE INVENTION In view of the above problems, the present invention has a good heat dissipation effect and does not complicate the mounting structure.
Another object of the present invention is to provide a method for producing a printed wiring board with a heat sink and a method for mounting a high power component on a printed wiring board, which facilitates mounting of high power electronic components.

[0009]

A printed wiring board with a metal heat sink and a method of mounting a high power component on the printed wiring board according to the present invention include the following steps (a) to (e). (A) a step of adhering a release paper coated with an adhesive to the other surface of the insulating board of a printed wiring board having a wiring pattern on one surface of the insulating board via the adhesive, (b) the release A step of forming a through hole at a high power component mounting position of a printed wiring board to which paper is adhered, (c) a step of peeling the release paper, and (d) a step of attaching a heat dissipation plate to the insulating plate with the adhesive. And (e) a step of fixing the high power component to the heat sink through the through hole formed in the step (b).

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, a mounting structure of a high power component according to the present invention will be described with reference to FIG. Reference numeral 1 denotes an insulating plate, and a wiring pattern 2 is formed on the insulating plate 1 to form a printed wiring board 3. The printed wiring board 3 is provided with a through hole 5 into which the high power component package 4 can be fitted.

Reference numeral 6 denotes a metal heat dissipation plate having a good heat conductivity, and it is preferable that the heat dissipation plate 6 is made of, for example, an aluminum plate. The metal heat dissipation plate 6 is attached to the insulating plate 1 of the printed wiring board 3 via the adhesive layer 7. Then, the high power component package 4 is fitted into the through hole 5 and mounted so as to be in close contact with the metal heat sink plate 6. At this time,
The bottom surface of the high power component package 4 and the metal heat sink 6
It is fixed to the surface of the substrate with an adhesive having good thermal conductivity or soldering.

Then, the leads 8, 8 of the high-power component package 4 are connected to the wiring patterns 2, 2 of the printed wiring board 3 by soldering. When the high power component package 4 has a bonding pad, the wiring pattern 2 and the bonding pad may be connected by wire bonding.

When the high power component package 4 is bonded to the metal heat dissipation plate 6 by soldering, the soldering and the soldering of the leads 8 and the wiring pattern 2 can be performed simultaneously.

Hereinafter, a method for producing the printed wiring board with the metal heat sink and a method for mounting high power components on the printed wiring board 3 provided with the metal heat sink 6 will be described in detail with reference to the steps shown in FIG. .

First, as shown in FIG. 1A, a printed wiring board 3 having a wiring pattern 2 provided on an insulating plate 1 is prepared.

Next, as shown in FIG. 1 (B), the release paper 9 coated with the adhesive 7a is adhered to the surface of the insulating board 1 on which the wiring pattern 2 of the printed wiring board 3 is not formed. Bond with agent 7a.

A commercially available so-called double-sided adhesive tape can be used as an adhesive means composed of the release paper 9 coated with the adhesive 7a. The release paper 9 is applied to the insulating plate 1 by the adhesive 7a. When bonded, only the release paper 9 is attached to the insulating plate 1
It is an adhesive means that can be easily separated from.

Next, in the printed wiring board 3 to which such a release paper 9 is attached, as shown in FIG. 1C, a predetermined position where the high power component package 4 is to be mounted is subjected to press working or the like. It is punched out and removed, and a through hole 5 is formed so that the high power component package 4 can be fitted therein.

Next, as shown in FIG. 1D, the release paper 9 is stripped from the insulating plate 1.

Next, as shown in FIG. 1E, the metal heat dissipation plate 6 is attached to the insulating plate 1 with the adhesive 7a on the insulating plate 1. Through the above steps, a printed wiring board with a heat sink can be manufactured.

Next, as shown in FIG. 1F, a predetermined high power component package 4 is fitted into the through hole 5 of the printed wiring board 3 to which the metal heat dissipation plate 6 is attached,
The bottom surface of the high power component package 4 is adhered to the heat dissipation metal plate 6. At this time, the high-power component package 4 and the heat-dissipating metal plate 6 are bonded by an adhesive having good thermal conductivity or by soldering. Through the steps described above, as shown in FIG. 2, the mounting of the high power component package 4 on the printed wiring board 3 with the metal heat dissipation plate is completed.

[0022]

According to the method of manufacturing a printed wiring board with a heat dissipation plate and the method of mounting a high power component package of the present invention, the metal heat dissipation plate is projected in accordance with the position of the through hole formed in the printed wiring board as in the prior art. A simple manufacturing method and mounting method can be realized without the step of forming a part. Further, a metal heat dissipation plate can be provided on the printed wiring board by the double-sided adhesive means without requiring any alignment at the position of the through hole provided for mounting the high power component package.

[Brief description of drawings]

FIG. 1 is a process drawing of the present invention.

FIG. 2 is a sectional view of a mounting structure of a high power component package mounted by the mounting method of the present invention.

FIG. 3 is a cross-sectional view of a conventional high-power component package mounting structure.

[Explanation of symbols]

 1 Insulation Plate 2 Wiring Pattern 3 Printed Wiring Board 4 High Power Component Package 5 Through Hole 6 Metal Heat Sink 7 Adhesive Layer 7a Adhesive 8 Lead 9 Release Paper

Claims (2)

[Claims] 1. A method of manufacturing a printed wiring board with a heat sink, which comprises the following steps (a) to (d). (A) a step of adhering a release paper coated with an adhesive to the other surface of the insulating board of a printed wiring board having a wiring pattern on one surface of the insulating board via the adhesive, (b) the release A step of forming a through hole at a high power component mounting position of a printed wiring board to which paper is adhered, (c) a step of peeling the release paper, and (d) a step of attaching a heat dissipation plate to the insulating plate with the adhesive. . 2. A method of mounting a high power component on a printed wiring board, which comprises steps (a) to (e) below. (A) a step of adhering a release paper coated with an adhesive to the other surface of the insulating board of a printed wiring board having a wiring pattern on one surface of the insulating board via the adhesive, (b) the release A step of forming a through hole at a high power component mounting position of a printed wiring board to which paper is adhered, (c) a step of peeling the release paper, and (d) a step of attaching a heat dissipation plate to the insulating plate with the adhesive. And (e) a step of fixing the high power component to the heat sink through the through hole formed in the step (b).