JPH06268341A - Method and structure for dissipating heat from electronic component - Google Patents
Method and structure for dissipating heat from electronic componentInfo
- Publication number
- JPH06268341A JPH06268341A JP5349193A JP5349193A JPH06268341A JP H06268341 A JPH06268341 A JP H06268341A JP 5349193 A JP5349193 A JP 5349193A JP 5349193 A JP5349193 A JP 5349193A JP H06268341 A JPH06268341 A JP H06268341A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- wiring board
- printed wiring
- radiator
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子部品の放熱構造、特
にプリント配線基板上に表面実装型発熱部品を搭載する
とき放熱性を良くするための放熱方法及び同装置に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating structure for electronic parts, and more particularly to a heat radiating method and apparatus for improving the heat radiating property when a surface mount heat generating part is mounted on a printed wiring board.
【０００２】[0002]
【従来の技術】挿入実装型発熱部品をプリント配線基板
に搭載する場合の放熱方法は、金属等の熱伝導性の良い
材料で構成された放熱器を発熱部品に接触する構成とす
るのが一般的である。また、プリント配線基板に搭載さ
れる全ての部品が表面実装型部品のみより構成され、そ
の部品の中に何れかの放熱対策を要する発熱部品を含む
場合には、プリント配線基板の裏面全体に金属材を貼り
付け、プリント配線基板から裏面の金属材への熱伝導に
より放熱性を改善する構成が用いられる。また、ハイブ
リットＩＣ等のように熱伝導率の良いセラミック基板な
どの上にプリントパターンを形成し、そこに面実装型発
熱部品を搭載することにより放熱性を改善する方法も知
られている。また、特開昭６２−１２５１に述べられて
いるように発熱部品と同一面上の近傍で、かつ発熱部品
を搭載するプリントパターン上に放熱器を搭載する方法
も公知である。2. Description of the Related Art A heat radiation method for mounting an insertion mounting type heat generating component on a printed wiring board is generally such that a radiator made of a material having a good thermal conductivity such as metal is brought into contact with the heat generating component. Target. In addition, if all the components mounted on the printed wiring board consist only of surface mount type components, and if any of these components include heat-generating components that require heat dissipation measures, the entire back surface of the printed wiring substrate must be covered with metal. A structure is used in which a material is attached and heat dissipation is improved by heat conduction from the printed wiring board to the metal material on the back surface. Also known is a method of improving heat dissipation by forming a print pattern on a ceramic substrate having a high thermal conductivity such as a hybrid IC and mounting a surface-mounted heat generating component thereon. Further, as described in JP-A-62-1251, a method of mounting a radiator on the same plane as the heat-generating component and on a print pattern for mounting the heat-generating component is also known.
【０００３】[0003]
【発明が解決しようとする課題】上記従来技術では、プ
リント配線板に搭載される部品の中に、挿入実装型部品
と表面実装型発熱部品とが混在する場合についての放熱
器の取付け方法については考慮されていなかった。すな
わち、挿入実装型発熱部品の放熱方法と同様に表面実装
型発熱部品の表面に放熱器を取付ける場合には、例えば
図４（Ａ）に示すように発熱部品に接触させて上側から
取り付ける構造を考えると、放熱器の形状が複雑になり
更にプリント配線板への組立作業性が悪くなり、経済的
でない。また、前記の公知例のように発熱部品の近傍に
放熱器を搭載する方法では、プリント配線基板の表面の
実装面積を多く必要とした。プリント配線基板の母材と
して金属などの熱伝導性にすぐれたものを使用すること
も考えられるが、金属などの母材とパターン配線との間
に絶縁処置が必要となるため経済的ではかった。また、
従来技術を一部変更してプリント配線基板の裏面の一部
分のみに放熱器としての金属材を貼り付ける図４（Ｂ）
の構成のときは、通常はプリント配線基板の厚さを厚く
する（例えば１．６ｍｍ位）ことによりプリント配線基
板の強度を保つ構成とするので、表面実装型発熱部品か
らその裏面に取り付けた金属材等までの熱抵抗が大き
く、放熱性が良くないという問題点があった。本発明の
目的は、プリント配線基板上に挿入実装型部品と表面実
装型部品とが混在して搭載される場合でも、放熱性を悪
くすることなく放熱器の形状を簡単化し、プリント基板
の裏面の有効利用ができ、しかも基板の材料に放熱性の
すぐれた高価な材料を使う必要がなく、経済性にすぐれ
た放熱方法および放熱構造を提供することである。In the above-mentioned prior art, regarding the mounting method of the radiator when the insertion mounting type component and the surface mounting type heat generating component are mixed in the components mounted on the printed wiring board, Was not considered. That is, when mounting a radiator on the surface of the surface mount type heat generating component in the same manner as the heat radiation method of the insertion mount type heat generating component, for example, as shown in FIG. Considering this, the shape of the radiator becomes complicated, and the workability of assembling to the printed wiring board becomes poor, which is not economical. Further, the method of mounting the radiator near the heat-generating component as in the above-mentioned known example requires a large mounting area on the surface of the printed wiring board. It is possible to use a material with excellent thermal conductivity such as metal as the base material of the printed wiring board, but it was not economical because insulation treatment was required between the base material such as metal and the pattern wiring. . Also,
Part of the conventional technique is modified to attach a metal material as a radiator to only a part of the back surface of the printed wiring board.
In the case of the configuration, since the strength of the printed wiring board is normally maintained by increasing the thickness of the printed wiring board (for example, about 1.6 mm), the metal mounted on the back surface of the surface-mounted heat-generating component is used. There is a problem that the heat resistance up to the material etc. is large and the heat dissipation is not good. An object of the present invention is to simplify the shape of a radiator without deteriorating the heat dissipation even when the insertion mounting type component and the surface mounting type component are mixedly mounted on the printed wiring board, and to reduce the back surface of the printed circuit board. It is an object of the present invention to provide a heat dissipation method and a heat dissipation structure which can be effectively used and which does not require the use of an expensive material having excellent heat dissipation as the material of the substrate and which is excellent in economic efficiency.
【０００４】[0004]
【課題を解決するための手段】上記の目的（簡単で安価
な放熱方法を提供する）を達成するため本発明に係る電
子部品の放熱方法は、プリント配線基板上に搭載された
複数個の表面実装型発熱部品が発生する熱を放散せしめ
る方法において、上記複数個の表面実装型発熱部品のそ
れぞれに対応せしめて複数個の部品取付用導体パターン
を前記プリント配線基板の片面に配設し、上記プリント
配線基板の他面には、前記複数個の表面実装型発熱部品
に共用される単一の放熱器を設け、前記複数個の部品取
付用導体パターンと、前記共用の放熱器とを、伝熱性の
部材で接続することを特徴とする。本発明の構造は、プ
リント配線基板上に搭載された複数個の表面実装型発熱
部品から発生する熱を放散せしめる構造において、上記
プリント基板の片面には、上記複数個の表面実装型発熱
部品のそれぞれに対応せしめた複数個の部品取付用導体
パターンが形成されており、上記プリント基板の他面に
は、前記複数個の表面実装型発熱部品に共用される単一
の放熱器が設置されており、前記複数個の部品取付用導
体パターンと、前記共用の放熱器とを、伝熱性の部材に
よって接続されていることを特徴とする。In order to achieve the above object (to provide a simple and inexpensive heat dissipation method), a heat dissipation method for electronic parts according to the present invention comprises a plurality of surfaces mounted on a printed wiring board. In a method of dissipating heat generated by a mounting type heat generating component, a plurality of component mounting conductor patterns are provided on one surface of the printed wiring board so as to correspond to each of the plurality of surface mounting type heat generating components. On the other surface of the printed wiring board, a single radiator that is shared by the plurality of surface mount heat generating components is provided, and the plurality of component mounting conductor patterns and the common radiator are connected to each other. It is characterized in that they are connected by a thermal member. The structure of the present invention is a structure for dissipating heat generated from a plurality of surface-mounted heat generating components mounted on a printed wiring board, wherein one surface of the printed circuit board has a plurality of surface-mounted heat generating components. A plurality of component mounting conductor patterns corresponding to each are formed, and a single radiator shared by the plurality of surface mount heat generating components is installed on the other surface of the printed circuit board. In addition, the plurality of component mounting conductor patterns and the common radiator are connected by a heat conductive member.
【０００５】[0005]
【作用】上述の手段によれば、プリント基板の片面に配
置された複数個の表面実装型発熱部品から発生した熱
は、該プリント基板の他面に設けられた放熱器に伝導さ
れ、効率よく放散される。特に、複数の表面実装型発熱
部品のそれぞれに対して部品取付用導体パターンが設け
られているので、該表面実装型発熱部品に蓄熱されるこ
となく、上記部品取付用導体パターンによって熱が奪わ
れる。さらに、これらの部品取付用導体パターンは単一
の放熱器を共用するので、構造が簡単であり、小形，軽
量に構成されて製造コストが安価である。According to the above means, the heat generated from the plurality of surface mount heat generating components arranged on one surface of the printed circuit board is conducted to the radiator provided on the other surface of the printed circuit board so that the heat is efficiently generated. Dissipated. In particular, since the component mounting conductor pattern is provided for each of the plurality of surface mounting heat generating components, heat is taken away by the component mounting conductor pattern without being stored in the surface mounting heat generating component. . Further, since these component mounting conductor patterns share a single radiator, the structure is simple, and the structure is small and lightweight, and the manufacturing cost is low.
【０００６】[0006]
【実施例】図１（Ａ）は本発明の第一の実施例を示し、
表面実装型発熱部品の一例としてのＤＰＡＫ形面付けト
ランジスタを搭載したプリント配線基板の断面図であ
る。図１（Ｃ）、図１（Ｄ）は各々（Ａ）図のプリント
配線基板３の表面および裏面に形成された導体パターン
である。図１（Ａ）において、プリント配線基板３上に
搭載されたＤＰＡＫ形面付けトランジスタ１下に部品取
り付け用導体パターン２を図１（Ｃ）のようにＤＰＡＫ
形面付けトランジスタの大きさに合わせて、コレクタ端
子用に２ａ、エミッタ端子用に２ｂ、ベース端子用に２
ｃを設ける。ＤＰＡＫ形面付けトランジスタはこれらの
電極端子用パターンに半田付けすることで固定する。コ
レクタ端子用導体パターン２ａ中からスルーホール４を
形成する。スルーホール電極４を介してＤＰＡＫ形面付
けトランジスタ１の搭載面の裏面に設けた裏面側導体パ
ターン５を接続し、裏面側導体パターン５上に放熱器６
を取り付ける。前記スルーホール電極４の模式的な断面
図を図１（Ｂ）に示す。スルーホールとは元来、透孔の
意であるが、電子部品技術においては基板に穿たれた透
孔の意に用いられる。このスルーホールの内面および、
その開口部付近に金属薄層（例えば無電解銅メッキ層）
を設けたものがスルーホール電極である。スルーホール
電極は従来一般に、導電作用を利用する構成部材であっ
たが、本発明においては伝熱作用を利用する。スルーホ
ール電極は公知の部材であるが、これを伝熱用に用いる
ことは本発明の特徴の一つである。図１（Ｂ）の例で
は、プリント配線基板３の片面に設けられた部品取付用
導体パターン２と、該プリント配線基板３の他面に設け
られた導体パターン５とを、スルーホール電極４が熱的
に接続している。このように、伝熱用部材としてスルー
ホール電極を活用すると、プリント配線基板を介して対
向する部材を、小形，軽量，安価に、熱的接続すること
ができる。FIG. 1A shows a first embodiment of the present invention,
It is sectional drawing of the printed wiring board carrying the DPAK type surface mounting transistor as an example of a surface mount type heat generating component. 1C and 1D are conductor patterns formed on the front surface and the back surface of the printed wiring board 3 of FIG. 1A, respectively. In FIG. 1A, the component mounting conductor pattern 2 is provided under the DPAK-type imposition transistor 1 mounted on the printed wiring board 3 as shown in FIG. 1C.
2a for the collector terminal, 2b for the emitter terminal, and 2 for the base terminal according to the size of the imposition transistor.
c is provided. The DPAK type imposition transistor is fixed by being soldered to these electrode terminal patterns. A through hole 4 is formed in the collector terminal conductor pattern 2a. A back surface side conductor pattern 5 provided on the back surface of the mounting surface of the DPAK type imposition transistor 1 is connected via the through hole electrode 4, and a radiator 6 is provided on the back surface side conductor pattern 5.
Attach. A schematic sectional view of the through-hole electrode 4 is shown in FIG. The through-hole originally means a through-hole, but in electronic component technology, it is used as a through-hole formed in a substrate. The inner surface of this through hole, and
A thin metal layer (eg, electroless copper plating layer) near the opening
A through hole electrode is provided with. In general, the through-hole electrode has conventionally been a constituent member that utilizes a conductive action, but in the present invention, a heat transfer action is utilized. The through-hole electrode is a known member, but using it for heat transfer is one of the features of the present invention. In the example of FIG. 1B, the through-hole electrode 4 includes a component mounting conductor pattern 2 provided on one surface of the printed wiring board 3 and a conductor pattern 5 provided on the other surface of the printed wiring board 3. Thermally connected. In this way, by utilizing the through-hole electrode as the heat transfer member, the members facing each other via the printed wiring board can be thermally connected in a small size, light weight, and at low cost.
【０００７】図１（Ａ）において、ＤＰＡＫ形面付けト
ランジスタ１から発生した熱は部品取り付つ用導体パタ
ーン２へ伝わりスルーホール電極４介して裏面側導体パ
ターン５に伝わり放熱器６から効果的に放熱される。一
般に使用されるプリント配線基板３の導体パターンやス
ルーホール電極４は銅などの金属であり、プリント配線
基板３の表面から裏面への方向に熱を逃がす構造なので
熱伝導性が良い。本実施例ではスルーホール３は１個の
ＤＰＡＫ形面付けトランジスタ１個につき３個あるが、
発熱部品の大きさやスルーホール電極の大きさによって
スルーホール電極の数を変えることで対応できる。放熱
器６としては、銅、アルミニウム、鉄などの金属材料が
適用でき、ネジ止めまたはかしめによってプリント配線
基板へ固定する。図２（Ａ）は本発明の第二の実施例に
よるプリント配線基板の断面図である。図２（Ｂ）、図
２（Ｃ）は各々図２（Ａ）のプリント配線基板３の表面
および裏面導体パターンである。In FIG. 1 (A), the heat generated from the DPAK type surface mounting transistor 1 is transmitted to the component mounting conductor pattern 2 and is transmitted to the back side conductor pattern 5 via the through hole electrode 4 and is effectively transmitted from the radiator 6. Is radiated to. The generally used conductor pattern of the printed wiring board 3 and the through-hole electrode 4 are made of a metal such as copper and have a structure that allows heat to escape in the direction from the front surface to the back surface of the printed wiring board 3 and thus has good thermal conductivity. In this embodiment, there are three through holes 3 for each DPAK type imposition transistor.
This can be dealt with by changing the number of through-hole electrodes depending on the size of the heat-generating component and the size of the through-hole electrodes. A metal material such as copper, aluminum, or iron can be applied to the radiator 6, and is fixed to the printed wiring board by screwing or caulking. FIG. 2A is a sectional view of a printed wiring board according to the second embodiment of the present invention. 2 (B) and 2 (C) are front and back conductor patterns of the printed wiring board 3 of FIG. 2 (A), respectively.
【０００８】図２（Ａ）はＤＰＡＫ形面付けトランジス
タ１が少なくとも２個以上プリント配線基板３上に搭載
される場合のプリント配線基板の断面図で、複数個所の
部品搭載面の裏面に複数個の発熱部品共用の放熱器６を
設けた構成とする一実施例である。FIG. 2A is a cross-sectional view of a printed wiring board in which at least two DPAK type imposition transistors 1 are mounted on the printed wiring board 3. This is an embodiment in which a radiator 6 for both heat generating components is provided.
【０００９】図２（Ｂ）において、部品取り付け用導体
パターン２は裏面放熱器接続用スルーホール４を設けな
い２ａ2部分と裏面接続用スルーホールを設けた２ａ1部
分の２つの部分に分割する。２ａ2部分はＤＰＡＫ形ト
ランジスタのコレクタ端子を例えばはんだ付けによって
電気的な接続を確保し、２ａ1部分はＤＰＡＫ形トラン
ジスタと例えば熱伝導性の良い接着剤で接続することに
よりＤＰＡＫ形トランジスタから発生した熱はスルーホ
ール電極４を経由し、裏面側ベタ導体パターン５へ熱を
伝え共通の放熱器６から放熱を実現するものである。本
実施例によって電気的に絶縁された複数の表面実装型発
熱部品の搭載が可能となる。[0009] In FIG. 2 (B), the component mounting conductor pattern 2 is divided into two parts 2a 1 part provided with 2a 2 portions and a through hole for the back connection without the backside radiator connecting through-hole 4 . The 2a 2 portion is generated from the DPAK transistor by securing the electrical connection of the collector terminal of the DPAK transistor by, for example, soldering, and the 2a 1 portion is connected to the DPAK transistor by, for example, an adhesive having good thermal conductivity. The heat is transferred to the solid conductor pattern 5 on the back surface side through the through-hole electrode 4 and is radiated from the common radiator 6. According to this embodiment, it is possible to mount a plurality of surface-mounted heat-generating components that are electrically insulated.
【００１０】図３（Ａ）は本発明の第三の実施例による
プリント配線基板の断面図である。図３（Ｂ）、図３
（Ｃ）は各々図３（Ａ）のプリント配線基板３の表面お
よび裏面導体パターンである。FIG. 3A is a sectional view of a printed wiring board according to the third embodiment of the present invention. 3 (B) and FIG.
3C is the front and back conductor patterns of the printed wiring board 3 shown in FIG.
【００１１】図３（Ａ）はＤＰＡＫ形面付けトランジス
タ１が少なくとも２個以上プリント配線基板３上に搭載
される場合のプリント配線基板の断面図で、しかもプリ
ント配線基板３の裏面導体パターン５に絶縁シート７を
設け、図２（Ａ）の実施例と同様な放熱器６を取り付け
た構成とする。上記導体パターン５と放熱器６′との間
に絶縁シート７を介装することにより、プリント配線基
板３の裏面に別な配線パターン８を実装することができ
る。本実施例によって複雑な配線パターンを必要とする
高密度実装が可能となる。FIG. 3A is a cross-sectional view of the printed wiring board in the case where at least two DPAK type imposition transistors 1 are mounted on the printed wiring board 3, and moreover, on the back surface conductor pattern 5 of the printed wiring board 3. An insulating sheet 7 is provided and a radiator 6 similar to that of the embodiment of FIG. 2A is attached. By inserting the insulating sheet 7 between the conductor pattern 5 and the radiator 6 ′, another wiring pattern 8 can be mounted on the back surface of the printed wiring board 3. This embodiment enables high-density mounting that requires a complicated wiring pattern.
【００１２】[0012]
【発明の効果】放熱器と発熱部品間の熱抵抗が下がり放
熱性が良くなる。また発熱部品と放熱器とを直接接触さ
れる構造でないので放熱器の形状を発熱部品に合わせる
必要がなく、放熱器が簡単な形にできるので組立性に優
れ経済的な放熱方法が実現できる。The thermal resistance between the radiator and the heat-generating component is reduced, and the heat dissipation is improved. Further, since the heat-generating component and the radiator are not in direct contact with each other, it is not necessary to match the shape of the radiator with the heat-generating component, and the radiator can be made into a simple shape, so that the assembling property is excellent and the economical heat-dissipating method can be realized.
【図１】本発明の一実施例を示し、（Ａ）はプリント配
線基板の断面図、（Ｂ）はスルーホール電極の説明図、
（Ｃ）はプリント配線基板の片面を描いた外観図、
（Ｄ）は該プリント配線基板の他面を描いた外観図であ
る。1 shows an embodiment of the present invention, (A) is a sectional view of a printed wiring board, (B) is an explanatory view of through-hole electrodes,
(C) is an external view of one side of the printed wiring board,
(D) is an external view showing the other surface of the printed wiring board.
【図２】上記と異なる実施例を示し、（Ａ）は断面図，
（Ｂ），（Ｃ）はそれぞれプリント基板の両面の外観図
である。FIG. 2 shows an embodiment different from the above, (A) is a sectional view,
(B) and (C) are external views of both surfaces of the printed circuit board.
【図３】前記とさらに異なる実施例を示し、（Ａ）は断
面図、（Ｂ），（Ｃ）はそれぞれプリント基板の両面の
外観図である。FIG. 3 shows an embodiment different from the above, in which (A) is a cross-sectional view and (B) and (C) are external views of both surfaces of the printed circuit board.
【図４】（Ａ），（Ｂ）はそれぞれ従来例の断面図であ
る。4A and 4B are cross-sectional views of a conventional example.
１…ＤＰＡＫ形面付けトランジスタ、２…部品取り付け
用導体パターン、３…プリント配線板、４…スルーホー
ル電極、５，５′…裏面側ベタ導体パターン、６，６′
…放熱器、７…絶縁シート、８…配線パターン、９…金
属材。DESCRIPTION OF SYMBOLS 1 ... DPAK type imposition transistor, 2 ... Component mounting conductor pattern, 3 ... Printed wiring board, 4 ... Through hole electrode, 5, 5 '... Back side solid conductor pattern, 6, 6'
... radiator, 7 ... insulating sheet, 8 ... wiring pattern, 9 ... metal material.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 脇川 研二 東京都小平市上水本町五丁目22番１号 株 式会社日立マイコンシステム内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kenji Wakikawa 5-22-1 Kamimizuhoncho, Kodaira-shi, Tokyo Inside Hitachi Microcomputer System Co., Ltd.
Claims (10)
の表面実装型発熱部品が発生する熱を放散せしめる方法
において、 上記複数個の表面実装型発熱部品のそれぞれに対応せし
めて複数個の部品取付用導体パターンを、前記プリント
配線基板の片面に配設し、 上記プリント配線基板の他面には、前記複数個の表面実
装型発熱部品に共用される単一の放熱器を設け、 前記複数個の部品取付用導体パターンと、前記共用の放
熱器とを、伝熱性の部材で接続することを特徴とする、
電子部品の放熱方法。1. A method of dissipating heat generated by a plurality of surface-mounted heat-generating components mounted on a printed wiring board, wherein a plurality of components are provided corresponding to each of the plurality of surface-mounted heat-generating components. A mounting conductor pattern is disposed on one surface of the printed wiring board, and a single radiator shared by the plurality of surface mount heat generating components is provided on the other surface of the printed wiring board. Characterized in that the individual component mounting conductor pattern and the common radiator are connected by a heat conductive member,
How to dissipate electronic components.
実装型発熱部品の１個あたり複数個設けることを特徴と
する、請求項１に記載した電子部品の放熱方法。2. The method for radiating heat of an electronic component according to claim 1, wherein a plurality of the component mounting conductor patterns are provided for each surface mount heat generating component.
の放熱器との接続は、プリント配線基板に穿たれた透孔
の内面および開口部に形成した金属薄層を介して行なう
ことを特徴とする、請求項１又は同２に記載した電子部
品の放熱方法。3. The component mounting conductor pattern and the shared radiator are connected through a thin metal layer formed on the inner surface and the opening of a through hole formed in a printed wiring board. The method for radiating heat of an electronic component according to claim 1 or 2.
との接続は、表面実装型発熱部品の１個あたり設けた複
数個の部品取付用導体パターンの内の何れか１個につい
て行なうことを特徴とする、請求項２に記載した電子部
品の放熱方法。4. The connection between the component mounting conductor pattern and the radiator is performed for any one of a plurality of component mounting conductor patterns provided for each surface mount heat generating component. The method for radiating heat of an electronic component according to claim 2, which is characterized in that.
成された導体パターンを介して該プリント配線基板に取
り付けることを特徴とする、請求項１ないし同４の内の
何れかに記載した電子部品の放熱方法。5. The electronic device according to claim 1, wherein the radiator is attached to the printed wiring board via a conductor pattern formed on the printed wiring board. How to radiate components.
体パターンと、前記の放熱器との間に、電気絶縁材料製
のシートを介装することを特徴とする、請求項５に記載
した電子部品の放熱方法。6. The electronic device according to claim 5, wherein a sheet made of an electrically insulating material is interposed between the conductor pattern formed on the printed wiring board and the radiator. How to radiate components.
の表面実装型発熱部品から発生する熱を放散せしめる構
造において、 上記プリント基板の片面には、上記複数個の表面実装型
発熱部品のそれぞれに対応せしめた複数個の部品取付用
導体パターンが形成されており、 上記プリント基板の他面には、前記複数個の表面実装型
発熱部品に共用される単一の放熱器が設置されており、 前記複数個の部品取付用導体パターンと、前記共用の放
熱器とが、伝熱性の部材によって接続されていることを
特徴とする、電子部品の放熱構造。7. A structure for dissipating heat generated from a plurality of surface-mounted heat-generating components mounted on a printed wiring board, wherein one surface of the printed-circuit board has each of the plurality of surface-mounted heat-generating components. A plurality of component mounting conductor patterns corresponding to the above are formed, and on the other surface of the printed circuit board, a single radiator shared by the plurality of surface mount heat generating components is installed. A heat dissipation structure for an electronic component, wherein the plurality of component mounting conductor patterns and the common radiator are connected by a heat conductive member.
実装型発熱部品の１個に対応せしめて複数個設けられて
いることを特徴とする、請求項７に記載した電子部品の
放熱構造。8. The heat dissipation structure for an electronic component according to claim 7, wherein a plurality of the component mounting conductor patterns are provided so as to correspond to one surface mount heat generating component.
に導体パターンが介装されていることを特徴とする、請
求項７又は同８に記載した電子部品の放熱構造。9. The heat dissipation structure for an electronic component according to claim 7, wherein a conductor pattern is interposed between the printed wiring board and the radiator.
電気絶縁シートが介装されていることを特徴とする、請
求項９に記載した電子部品の放熱構造。10. The heat dissipation structure for an electronic component according to claim 9, wherein an electrically insulating sheet is interposed between the conductor pattern and the radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5349193A JPH06268341A (en) | 1993-03-15 | 1993-03-15 | Method and structure for dissipating heat from electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5349193A JPH06268341A (en) | 1993-03-15 | 1993-03-15 | Method and structure for dissipating heat from electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06268341A true JPH06268341A (en) | 1994-09-22 |
Family
ID=12944317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5349193A Withdrawn JPH06268341A (en) | 1993-03-15 | 1993-03-15 | Method and structure for dissipating heat from electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06268341A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005166981A (en) * | 2003-12-03 | 2005-06-23 | Matsushita Electric Ind Co Ltd | Electronic controller |
| US7606038B2 (en) | 2006-09-20 | 2009-10-20 | Sumitomo Wiring Systems, Ltd. | Method for producing a printed circuit board with a heat radiating structure and a printed circuit board with a heat radiating structure |
| JP2010129759A (en) * | 2008-11-27 | 2010-06-10 | Ihi Corp | Heat sink for electronic equipment |
| JP2014083701A (en) * | 2012-10-19 | 2014-05-12 | Seiko Epson Corp | Liquid injection device and printing apparatus |
| TWI463612B (en) * | 2008-10-16 | 2014-12-01 | Irex Inc | Heat dissipation structure |
| US20150062220A1 (en) * | 2013-08-30 | 2015-03-05 | Seiko Epson Corporation | Liquid ejecting apparatus, print head unit, and drive substrate |
| US9539390B2 (en) | 2012-09-06 | 2017-01-10 | Seiko Epson Corporation | Medical instrument |
| JP2017117928A (en) * | 2015-12-24 | 2017-06-29 | 株式会社ケーヒン | Electronic control circuit board and electronic controller |
| WO2019189645A1 (en) * | 2018-03-30 | 2019-10-03 | 日本電産エレシス株式会社 | Electronic control unit for electric power steering |
| CN110654452A (en) * | 2018-06-29 | 2020-01-07 | 日本电产艾莱希斯株式会社 | Circuit board, electronic control unit for electric power steering, and electric power steering apparatus |
| CN114801491A (en) * | 2021-01-29 | 2022-07-29 | 精工爱普生株式会社 | Liquid ejecting apparatus |
-
1993
- 1993-03-15 JP JP5349193A patent/JPH06268341A/en not_active Withdrawn
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005166981A (en) * | 2003-12-03 | 2005-06-23 | Matsushita Electric Ind Co Ltd | Electronic controller |
| US7606038B2 (en) | 2006-09-20 | 2009-10-20 | Sumitomo Wiring Systems, Ltd. | Method for producing a printed circuit board with a heat radiating structure and a printed circuit board with a heat radiating structure |
| TWI463612B (en) * | 2008-10-16 | 2014-12-01 | Irex Inc | Heat dissipation structure |
| JP2010129759A (en) * | 2008-11-27 | 2010-06-10 | Ihi Corp | Heat sink for electronic equipment |
| US9539390B2 (en) | 2012-09-06 | 2017-01-10 | Seiko Epson Corporation | Medical instrument |
| JP2014083701A (en) * | 2012-10-19 | 2014-05-12 | Seiko Epson Corp | Liquid injection device and printing apparatus |
| US20150062220A1 (en) * | 2013-08-30 | 2015-03-05 | Seiko Epson Corporation | Liquid ejecting apparatus, print head unit, and drive substrate |
| JP2017117928A (en) * | 2015-12-24 | 2017-06-29 | 株式会社ケーヒン | Electronic control circuit board and electronic controller |
| WO2019189645A1 (en) * | 2018-03-30 | 2019-10-03 | 日本電産エレシス株式会社 | Electronic control unit for electric power steering |
| CN111903198A (en) * | 2018-03-30 | 2020-11-06 | 日本电产艾莱希斯株式会社 | Electronic control unit for electric power steering |
| CN110654452A (en) * | 2018-06-29 | 2020-01-07 | 日本电产艾莱希斯株式会社 | Circuit board, electronic control unit for electric power steering, and electric power steering apparatus |
| CN114801491A (en) * | 2021-01-29 | 2022-07-29 | 精工爱普生株式会社 | Liquid ejecting apparatus |
| CN114801491B (en) * | 2021-01-29 | 2023-08-25 | 精工爱普生株式会社 | Liquid ejecting apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20000530 |