JPH0347599B2 - - Google Patents
Info
- Publication number
- JPH0347599B2 JPH0347599B2 JP59166428A JP16642884A JPH0347599B2 JP H0347599 B2 JPH0347599 B2 JP H0347599B2 JP 59166428 A JP59166428 A JP 59166428A JP 16642884 A JP16642884 A JP 16642884A JP H0347599 B2 JPH0347599 B2 JP H0347599B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- connector pin
- generating component
- circuit board
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000017525 heat dissipation Effects 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000000034 method Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
Description
【発明の詳細な説明】
(イ) 産業上の利用分野
本発明はハーネスを利用して放熱を行なうよう
にした電子機器の放熱構造に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a heat dissipation structure for electronic equipment that uses a harness to dissipate heat.
(ロ) 従来技術
車載用電子機器の回路基板には電力負荷駆動用
のパワートランジスタなどの発熱部品が設けられ
ているが、同じ回路基板上に配置されている集積
回路やコンデンサなどの熱に弱い部品が長時間熱
を受けると特性が変化して信頼性が失なわれるの
で従来種々の放熱対策が施こされている。放熱対
策としては、たとえば実開昭56−162692号に示さ
れるように回路基板を収納する金属ケースを放熱
手段として利用したり、発熱部品に専用のヒート
シンクを設ける方法が知られている。(b) Conventional technology The circuit boards of in-vehicle electronic devices are equipped with heat-generating components such as power transistors for driving power loads, but they are susceptible to heat from integrated circuits, capacitors, etc. placed on the same circuit board. When components are exposed to heat for a long time, their characteristics change and reliability is lost, so various heat dissipation measures have been taken in the past. As heat dissipation measures, there are known methods, such as using a metal case housing a circuit board as a heat dissipation means, as shown in Utility Model Application Publication No. 56-162692, or providing a dedicated heat sink for heat-generating components.
(ハ) 発明が解決しようとする問題点
このような放熱方法は電子機器のまわりの対流
放熱を利用するものであるが、電子機器が装着さ
れる場所は狭いダツシユサイドの内側やインスト
ルメントパネルの内側であるために充分な放熱効
果が期待できない場合が多い。また最近は燃費向
上の観点から車両の軽量化やコスト低下を狙つて
電子機器のケースに樹脂材料を用いることが多
く、このような場合はケースを利用した放熱がで
きないという問題がある。(c) Problems to be Solved by the Invention This heat dissipation method utilizes convection heat dissipation around electronic devices, but the electronic devices are mounted in narrow spaces inside the side of the dash or inside the instrument panel. Therefore, in many cases, a sufficient heat dissipation effect cannot be expected. Furthermore, recently, resin materials are often used for the cases of electronic devices in order to reduce the weight and cost of vehicles from the perspective of improving fuel efficiency, and in such cases, there is a problem that heat dissipation cannot be performed using the case.
(ニ) 発明の目的および構成
本発明は上記の点にかんがみてなされたもの
で、樹脂材料を用いたケースを有する電子機器に
接続される外部ハーネスが熱の良伝導体であるこ
とに着目し、特別な放熱機構を設けずに有効な放
熱を行なうことを目的とし、この目的を達成する
ために、電子機器の発熱部品と外部ハーネスと電
気的に接続されるコネクタピンとを熱伝達可能に
接続し、発熱部品からの熱をハーネスを介して放
熱するように構成した。(d) Object and structure of the invention The present invention has been made in view of the above points, and focuses on the fact that an external harness connected to an electronic device having a case made of resin material is a good conductor of heat. , the purpose is to perform effective heat dissipation without providing a special heat dissipation mechanism, and to achieve this purpose, the heat-generating parts of electronic equipment and the connector pins that are electrically connected to the external harness are connected to enable heat transfer. The system is configured to radiate heat from the heat-generating components through the harness.
(ホ) 実施例 以下図面に基づいて本発明を説明する。(e) Examples The present invention will be explained below based on the drawings.
第１図は本発明による放熱構造の実施例を示す
側面図、第２図は同平面図である。図において１
は印刷回路基板、２はこの印刷回路基板１上に実
装されたパワートランジスタなどの発熱部品、３
はコネクタハウジング、４はコネクタハウジング
３から伸びて印刷回路基板１の所定位置に差込ま
れるコネクタピン、５は発熱部品２からの熱をコ
ネクタピン４に伝導する熱伝導性のすぐれた伝熱
部材である。発熱部品２からの熱をできるだけ多
くハーネスに放熱させるためには、伝熱部材５は
コネクタピン４の全部と結合させるのが好ましい
が、コネクタピン４は本来電気信号を伝達する機
能を有するので、コネクタピン４と伝熱部材５の
接触部分は例えば雲母等の熱伝導性は良く電気的
には絶縁体である絶縁体層６を介して電気的に絶
縁する必要がある。 FIG. 1 is a side view showing an embodiment of the heat dissipation structure according to the present invention, and FIG. 2 is a plan view thereof. In the figure 1
2 is a printed circuit board, 2 is a heat generating component such as a power transistor mounted on this printed circuit board 1, and 3 is a printed circuit board.
4 is a connector housing, 4 is a connector pin extending from the connector housing 3 and inserted into a predetermined position on the printed circuit board 1, and 5 is a heat transfer member with excellent thermal conductivity that conducts heat from the heat generating component 2 to the connector pin 4. It is. In order to radiate as much heat from the heat generating component 2 as possible to the harness, it is preferable that the heat transfer member 5 be coupled to all of the connector pins 4, but since the connector pins 4 originally have the function of transmitting electrical signals, The contact portion between the connector pin 4 and the heat transfer member 5 needs to be electrically insulated via an insulator layer 6 made of mica or the like which has good thermal conductivity and is an electrical insulator.
このように構成すれば、発熱部品２により発生
した熱は伝導部材５を介してコネクタピン４に伝
達され、さらにコネクタピン４を介してハーネス
（図示せず）に伝達され放熱される。 With this configuration, the heat generated by the heat generating component 2 is transmitted to the connector pin 4 via the conductive member 5, and further transmitted to the harness (not shown) via the connector pin 4, where the heat is radiated.
第３図および第４図は本発明による放熱構造の
他の実施例を示しており、図中第１図および第２
図と同じ参照数字は同じ構成部分を示す。 3 and 4 show other embodiments of the heat dissipation structure according to the present invention.
The same reference numbers as in the figures indicate the same parts.
この実施例では第１図および第２図に示した実
施例における伝熱部材をコネクタピンで兼ねてい
る。すなわちコネクタピン４′の基板側突出部分
に平面部分４′ａを設け、この平面部分４′ａで発
熱部品２を固定している。この実施例ではコネク
タピン１個に対して１つの発熱部品を取付ける構
造を採用したので、発熱部品２からの熱はそのコ
ネクタピン４′に接続される１本のハーネスを介
して放熱されるが、コネクタハウジング３の内部
構造を改良することにより他のコネクタピンにも
熱を伝達し複数のハーネスを介して放熱させるよ
うにすることも可能である。 In this embodiment, a connector pin serves as the heat transfer member in the embodiments shown in FIGS. 1 and 2. That is, a flat portion 4'a is provided on the protruding portion of the connector pin 4' on the board side, and the heat generating component 2 is fixed by this flat portion 4'a. In this embodiment, a structure is adopted in which one heat generating component is attached to one connector pin, so the heat from the heat generating component 2 is radiated through one harness connected to the connector pin 4'. By improving the internal structure of the connector housing 3, it is also possible to transmit heat to other connector pins and radiate the heat through a plurality of harnesses.
第５図および第６図は本発明による放熱構造の
他の実施例を示しており、図中同じ構成部分には
同じ参照数字を付して示した。 FIGS. 5 and 6 show other embodiments of the heat dissipation structure according to the present invention, in which the same components are designated by the same reference numerals.
この実施例においては、伝熱部材５′自体は比
較的簡単な構造とし、その代りにコネクタピン４
の側にコネクタピン４との熱的な結合を良好にす
るための平面部５′ａを設けている。このように
すれば発熱部品２により発生する熱を伝熱部材
５′、特にその平面部５′ａを介してコネクタピン
４に伝達することができハーネスを介して放熱す
ることができる。 In this embodiment, the heat transfer member 5' itself has a relatively simple structure, and instead the connector pin 4
A flat portion 5'a is provided on the side thereof to improve thermal coupling with the connector pin 4. In this way, the heat generated by the heat-generating component 2 can be transmitted to the connector pin 4 via the heat transfer member 5', particularly its flat surface 5'a, and can be radiated via the harness.
(ヘ) 発明の効果
以上説明したように、本発明においては、樹脂
材料を用いたケースを有する電子機器の発熱部品
と外部ハーネスとの電気接続を行なうコネクタピ
ンとを熱的に結合して発熱部品から発生する熱を
充分な熱容量を有するハーネスを介して放熱する
ようにしたので、ダツシユサイドの内側やインス
トルメントパネルの内側などのような狭い場所に
装着される電子機器に対してもその周囲の対流条
件の悪さにかかわらず良好な放熱が可能になる。
また電子機器に放熱用のヒートシンクを設ける必
要がなく、放熱ができる。本発明のように、ハー
ネスを用いて放熱を行なうようにすれば、極めて
自由度の高く且つ低コストの放熱が可能になり発
熱部品を有する電子機器の信頼性を高めることが
できる。(f) Effects of the Invention As explained above, in the present invention, the heat generating component of an electronic device having a case using a resin material and the connector pin for electrical connection with an external harness are thermally coupled to each other to produce a heat generating component. Since the heat generated by the device is dissipated through a harness with sufficient heat capacity, convection around the electronic device can be avoided even if it is installed in a narrow place such as inside the side of a dartshi or inside an instrument panel. Good heat dissipation is possible regardless of poor conditions.
Further, it is not necessary to provide a heat sink for heat radiation to the electronic device, and heat can be radiated. If heat is dissipated using a harness as in the present invention, heat dissipation can be performed with extremely high flexibility and at low cost, and the reliability of electronic equipment having heat generating components can be improved.
第１図および第２図は本発明による放熱構造の
一実施例で、第１図は断面図、第２図は平面図、
第３図および第４図は本発明による放熱構造の他
の実施例で、第３図は断面図、第４図は平面図、
第５図および第６図は本発明による放熱構造のさ
らに他の実施例で、第５図は断面図、第６図は平
面図である。
１……プリント回路基盤、２……発熱部品、３
……コネクタハウジング、４……コネクタピン、
５……伝熱部材。
1 and 2 show an embodiment of the heat dissipation structure according to the present invention, in which FIG. 1 is a sectional view, FIG. 2 is a plan view,
3 and 4 show other embodiments of the heat dissipation structure according to the present invention, in which FIG. 3 is a sectional view, FIG. 4 is a plan view,
5 and 6 show still other embodiments of the heat dissipation structure according to the present invention, in which FIG. 5 is a sectional view and FIG. 6 is a plan view. 1...Printed circuit board, 2...Heating components, 3
... Connector housing, 4 ... Connector pin,
5... Heat transfer member.
Claims (1)
と、該回路基板を収納する樹脂材料を用いたケー
スと、前記回路基板に電気的に接続されるコネク
タピンを有するコネクタと、該コネクタピンと電
気的に接続される外部ハーネスと、前記発熱部品
と前記コネクタピンとを熱伝達可能に接続する熱
伝達部材とを有することを特徴とする電子機器の
放熱構造。1. A heat-generating component, a circuit board on which the heat-generating component is mounted, a case made of a resin material that houses the circuit board, a connector having a connector pin electrically connected to the circuit board, and a connector having a connector pin electrically connected to the circuit board. 1. A heat dissipation structure for an electronic device, comprising: an external harness that is connected to the heat generating component and the connector pin; and a heat transfer member that connects the heat generating component and the connector pin in a heat transfer manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59166428A JPS6146098A (en) | 1984-08-10 | 1984-08-10 | Heat sink structure of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59166428A JPS6146098A (en) | 1984-08-10 | 1984-08-10 | Heat sink structure of electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6146098A JPS6146098A (en) | 1986-03-06 |
| JPH0347599B2 true JPH0347599B2 (en) | 1991-07-19 |
Family
ID=15831230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59166428A Granted JPS6146098A (en) | 1984-08-10 | 1984-08-10 | Heat sink structure of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6146098A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5766451B2 (en) * | 2011-01-28 | 2015-08-19 | 矢崎総業株式会社 | Terminal and terminal connection structure |
| JP5920634B2 (en) * | 2013-04-15 | 2016-05-18 | 住友電装株式会社 | Printed board |
| JP6108957B2 (en) * | 2013-05-24 | 2017-04-05 | 本田技研工業株式会社 | Electronic equipment |
| JP6437833B2 (en) * | 2015-01-26 | 2018-12-12 | 本田技研工業株式会社 | In-vehicle electric circuit device |
| JP2021168280A (en) * | 2020-04-13 | 2021-10-21 | 株式会社オートネットワーク技術研究所 | Connector device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5998580A (en) * | 1982-11-29 | 1984-06-06 | 株式会社日立製作所 | Method of dissipating heat of electronic controller |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59104590U (en) * | 1982-12-29 | 1984-07-13 | 金剛株式会社 | heat dissipation device |
-
1984
- 1984-08-10 JP JP59166428A patent/JPS6146098A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5998580A (en) * | 1982-11-29 | 1984-06-06 | 株式会社日立製作所 | Method of dissipating heat of electronic controller |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6146098A (en) | 1986-03-06 |
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