JP3351234B2 - Heat dissipation structure of input module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiation structure of an input module for inputting measurement signals from a large number of measurement points, such as a recorder or a data collection device, and more particularly, to an A / D converter and a DC / DC converter. The present invention relates to a heat dissipation structure when a conversion unit is provided on an input module side.

[0001]

2. Description of the Related Art FIG. 4 is a block diagram showing a conventional example of a recording apparatus.
It is a lock block diagram. In the figure, 1 ₁~ 1_nIs analog
An input terminal to which an input signal is applied, 2 is an input terminal 1₁~ 1_n
Sequentially select multiple analog input signals applied to
Input switching means (scanner).

Reference numeral 3 denotes an amplifier for amplifying a selected analog input signal to a predetermined size corresponding to a range, 4 denotes an A / D converter for converting the analog signal amplified by the amplifier 3 into a digital signal, and 21 denotes a bus. is there. The part indicated by a surrounded by a dashed line is an arithmetic control unit including a keyboard 20, a display unit 19, a microprocessor 17 for controlling each element constituting the apparatus based on a predetermined program, and a RAM.
5, a ROM 18 and the like. A portion indicated by B surrounded by a dashed line is a print control section, which is composed of a drive circuit 10 for the print head 9, a circuit 12 for sending a signal for driving the head scanner 11, and the like.

FIG. 5 is a side view showing an input terminal of a conventional recording apparatus. In FIG. 5, terminals 31 (six sets in the figure) are fixed to a terminal block 32 formed of an insulating member, and are connected to a printed board 34 via lead terminals 33. The internal wiring of the apparatus is connected to the lead terminal 33 directly or via a connector (not shown) provided on a printed board. Reference numeral 35 denotes a temperature sensor for measuring the temperature of the printed wiring board 34 itself, for example, a reference junction compensation temperature sensor when a thermocouple is used as a measuring device. Reference numeral 36 denotes a wiring formed on the printed wiring board.

FIG. 6 is a block diagram showing such a conventional recording apparatus for each functional block. The input terminal section 1, the multiplexer 2, the A / D converter 4, the microprocessor 17,
A print processing unit 60, an alarm output unit 61, a general-purpose communication function 62, and a remote communication function 63 are formed for each block, and these are housed in one housing. 5 is used as the input terminal unit, the input module is composed of the multiplexer 2 and the A / D converter 4, and the output module is the alarm output terminal unit 6.
4. Although it is composed of the alarm output unit 61 and the like, the configuration is fixed, and it is difficult to freely change the enlargement / reduction of the function.

[0005] Each unit is a microprocessor 1
7, it must be arranged in the same housing. For example, it is not possible to install only one analog input block away from the housing. As a result, specification changes are limited. As a means to solve such a problem, the data collection part and the recording part are configured as separate bodies, and the data collection part can be increased or decreased. An apparatus has been developed which takes in the data collected by the part into a personal computer or the like to process and manage the data. In such a case, the input module constituting the data collection part includes, for example, an input terminal, a temperature sensor for reference junction compensation, and a DC / DC as a power supply.
DC conversion means, A / D conversion means and the like are provided.

[0006]

However, an input terminal, a reference junction compensation temperature sensor, a DC
When a DC / DC converter, A / D converter, etc. are provided, the DC
Since the / DC conversion means and the A / D conversion means have heat-generating portions, especially when an input from a thermocouple is performed, if the temperature of the measurement terminal portion is higher than room temperature, the temperature difference between the measurement terminal and the sensor will occur. As a result, the accuracy of the reference junction compensation is not satisfied, so that there has been a problem that heat radiation measures must be thoroughly taken.

Means for Solving the Problems The present invention to achieve a heat radiation structure of the input module subjected to the heat dissipation purposes, according to claim 1, the temperature sensor and the first flop
Measurement terminals including the printed circuit board and electrical signal conversion
A second printed circuit board on which a step is formed;
A first heat sink disposed between the lint substrates;
For electrical signal conversion means formed on one side of the lint substrate
A second heat sink that contacts the first and second printed circuit boards;
And the first and second heat sinks
The first printed circuit board uses a good conductor of heat as a core member.
The electric power formed on the other surface of the second printed circuit board.
The signal conversion means is connected to the first heat radiating plate via a heat conductive heat radiating member.
Between the first printed circuit board and the first heat sink.
By providing an air flow passage, the measurement terminal and the temperature
3. A heat radiation structure for an input module , wherein a temperature difference between the input module and the temperature sensor is reduced .
The heat radiation structure of the input module according to claim 1
The electric power formed on one surface of the second printed circuit board.
The signal conversion means is A / D conversion means, formed on the other surface.
The electric signal converter is a DC / DC converter.
It is a sign .

[0007]

[0008]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic perspective view of the overall configuration of an input module according to an embodiment of the present invention, FIG. 2 is a sectional view of a main part of FIG. 1, and FIG. 3 is a plan view of FIG. In these figures, 40 is a front cover, 41 is a connection member, and a terminal block 43 to which an input terminal 42 is fixed is arranged between the front cover 40 and the connection member 41.

A measurement terminal including a first printed circuit board 44 on which a reference contact compensation temperature sensor 45 and an input switching means (scanner) 46 for sequentially selecting and transmitting input signals are mounted on the back surface of the terminal block 43. The part 44a is arranged. A radiating air flow passage 46 is formed between the first printed circuit board 44 and the connecting member 41 and between the first printed board 44 and the first radiating plate 47 supported by the connecting member 41. First printed circuit board 44
Uses a core made of metal such as aluminum or copper and insulating members formed on both sides.

Reference numeral 48 denotes a second printed circuit board, on which A / D conversion means 49 is formed on one surface. 50 is a DC / DC conversion means formed on a third printed circuit board;
It is arranged near the end of the other surface of the printed circuit board 48 in a stacked state, and is connected to the A / D conversion means 49 via the connector 51. The second printed circuit board 48 is connected to the first printed circuit board 44 via the connector 52 with the side on which the A / D conversion means 49 is formed facing the first heat radiating plate 47 side.

Numerals 55a and 55b denote heat conductive heat radiating members (here, a material formed by mixing silicon gel with special ceramics) disposed between the second printed circuit board 48 and the first heat radiating plate 47. In addition, the heat radiated from the heat-generating component of the A / D conversion means 49 is transmitted to the first heat sink 47.

Reference numeral 56 denotes a second heat radiating plate which radiates heat from the heat-generating component forming the DC / DC converter 50 via a heat-conducting heat-radiating member 55c arranged in contact with the heat-generating component. 57 is the second on which the DC / DC conversion means 50 is laminated.
This is a rear cover that fixes the heat sink 56 and has the convex storage portion 59 at the lamination point. The rear cover is fixed together with the front cover 40 so as to cover the connection member 41 while being engaged with the connection member 41.

According to the above configuration, the first printed circuit board 4
4 and an air flow passage 46 are formed between the first heat sink 47 and
The heat-generating components constituting the A / D conversion means formed on the second printed circuit board 48 are radiated to the first radiating plate 47 via the heat-conducting radiating members 55a and 55b. The heat-generating components constituting the DC / DC converter 50 are radiated to the second radiator plate 56 via the heat-conducting radiator 55c. Although not shown in the drawing, the second heat radiating plate 56 is brought into contact with another heat radiating plate having a larger area to enhance the heat radiating effect.

The input signal digitally converted by the A / D converter 49 is transmitted to a recorder main body, a personal computer, or the like via a connector (not shown). The front cover 40, the terminal block, the connecting member 41, and the rear cover 57 shown in the embodiment of the present invention are integrally formed of plastic resin, respectively, and the engaging claws and the engaging holes formed on these parts are formed. (Not shown).

[0015]

As described above, according to the present invention,
If the temperature rises due to the heat generated by the electronic components incorporated in the first printed circuit board, heat is diffused because the board itself is formed of a good heat conductor, and one surface of the board is subjected to air circulation. Since it is a road, heat is radiated quickly. In addition, since the heat-generating electronic components incorporated in the second printed circuit board are in contact with the first and second heat radiating plates via the heat conducting and radiating members, heat is radiated by these heat radiating plates. (2) A heat radiation structure of the input module, which is thermally insulated between the printed circuit board and the heat countermeasure, can be realized.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part configuration showing an embodiment of a heat radiation structure of an input module of the present invention.

FIG. 2 is a sectional view of a main part of FIG.

FIG. 3 is a plan view of FIG. 2;

FIG. 4 is a block diagram showing a conventional example of a recording apparatus.

FIG. 5 is a side view showing an input terminal of a conventional recording apparatus.

FIG. 6 is a configuration diagram showing a conventional recording apparatus for each functional block.

[Explanation of symbols]

 Reference Signs List 40 front cover 41 connecting member 42 input terminal 43 terminal block 44 first printed circuit board 44a measuring terminal section 45 temperature sensor for reference junction compensation 46 input switching means (scanner) 47 first heat sink 48 second printed circuit board 49 A / D Conversion means 50 DC / DC conversion means 51 Connector (connection between A / D-DC / DC) 52 Connector (connection between A / D-measurement terminal) 53 Third printed circuit board 55 Heat conduction / radiation member 56 Second radiation member 57 Rear cover 59 Convex section storage section

Claims (2)

(57) [Claims] 1. A temperature sensor and a first printed circuit board are included.
A measurement terminal part and a second terminal having electric signal conversion means formed on both surfaces.
2 between the printed circuit board and the first and second printed circuit boards
A first heatsink disposed and one of the second printed circuit boards;
Second heat radiation contacting the electric signal conversion means formed on the surface of
Board, the first and second printed circuit boards, and first and second heat radiation
The first pudding
The printed circuit board uses a good conductor of heat as a core member and
The electric signal conversion means formed on the other side of the substrate is heat conductive
The first heat sink contacts the first heat sink through a heat dissipation member,
An air flow passage is provided between the lint substrate and the first heat sink.
The temperature between the measurement terminal and the temperature sensor.
A heat dissipation structure for the input module, characterized by reduced stagger. 2. A printed circuit board formed on one surface of the second printed circuit board.
The converted electric signal conversion means is A / D conversion means, and is formed on the other surface.
The formed electric signal conversion means is a DC / DC conversion means.
The heat radiation of the input module according to claim 1, wherein:
Construction.