JP2790044B2 - Power amplifier heat dissipation mounting structure - Google Patents
Power amplifier heat dissipation mounting structureInfo
- Publication number
- JP2790044B2 JP2790044B2 JP6170625A JP17062594A JP2790044B2 JP 2790044 B2 JP2790044 B2 JP 2790044B2 JP 6170625 A JP6170625 A JP 6170625A JP 17062594 A JP17062594 A JP 17062594A JP 2790044 B2 JP2790044 B2 JP 2790044B2
- Authority
- JP
- Japan
- Prior art keywords
- radiator
- printed circuit
- circuit board
- power amplifier
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、発熱密度の高いパワー
トランジスタを擁する電力増幅器の放熱実装構造に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation mounting structure of a power amplifier having a power transistor having a high heat generation density.
【０００２】[0002]
【従来の技術】従来の技術は、プリント基板上のトラン
ジスタを放熱器に取り付け放熱させる方法として、たと
えば実開平２−１３８４９４号「被冷却電子部品の実装
構造」に示されるように、放熱フィンと垂直な反対側の
面（ベース部）にトランジスタを固定しそのトランジス
タの端子をプリント板の接続穴に挿入し、半田付けによ
り接続固定している。そしてそのトランジスタから発生
する熱を放熱フィンを介して空気中に放熱させている。2. Description of the Related Art A conventional technique is to attach a transistor on a printed circuit board to a radiator to dissipate heat, as disclosed in, for example, Japanese Utility Model Application Laid-Open No. 2-138494, entitled "Mounting structure of electronic components to be cooled". A transistor is fixed to the opposite vertical surface (base portion), the terminal of the transistor is inserted into a connection hole of a printed board, and the connection is fixed by soldering. Then, the heat generated from the transistor is radiated into the air through radiating fins.
【０００３】[0003]
【発明が解決しようとする課題】前述した従来の技術
は、プリント板の表面側に電子部品を実装しトランジス
タの発熱量が大きいと、大型の放熱器を取りつける必要
があるためプリント板の大型化を招き、それに伴い電力
増幅器の占有体積も大きくなる。又、トランジスタが基
板の表面側に放熱器と一体となって実装されているので
他の電子部品が放熱器の熱の影響を受ける等の欠点があ
った。In the above-mentioned prior art, when an electronic component is mounted on the surface side of a printed board and the amount of heat generated by the transistor is large, a large radiator needs to be mounted, so that the printed board is increased in size. And the volume occupied by the power amplifier increases accordingly. Further, since the transistor is mounted on the front surface of the substrate integrally with the radiator, other electronic components are affected by the heat of the radiator.
【０００４】[0004]
【課題を解決するための手段】本発明の電力増幅器の放
熱実装構造は、Ｈ形のベースを有し、ベースの中央から
両側へ放熱フィンが出ている放熱器を具備し、その放熱
フィン側にプリント基板を少なくとも１枚配し、パワー
トランジスタを前記放熱器外周面に配している。A heat radiation mounting structure of a power amplifier according to the present invention includes an H-shaped base, a radiator having radiation fins protruding from the center of the base to both sides, and the radiation fin side. And at least one printed circuit board, and a power transistor disposed on the outer peripheral surface of the radiator.
【０００５】[0005]
【実施例】次に本発明について図面を参照して説明す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.
【０００６】図１は本発明の一実施例の電力増幅器の斜
視図である。また図２，図３はそれぞれ実施例の正面
図，右側面図である。FIG. 1 is a perspective view of a power amplifier according to one embodiment of the present invention. 2 and 3 are a front view and a right side view of the embodiment, respectively.
【０００７】図で１はパワートランジスタで２はプリン
ト基板である。パワートランジスタ１はＨ型のベース部
を持った放熱器４の側面５1 の中心にくるようにねじ６
で取り付けられている。放熱器４はトランジスタ１が取
り付けられた面５1 と図のような直角な面がＨ型の断面
形状をもち、中央部ベース５2 から上下方向に百足形に
放熱フィン７が設けられている。尚、図面においてプリ
ント基板２に搭載される電子部品３の個々の具体的詳細
図は省略している。また電子部品３を搭載しているプリ
ント基板２は、前記放熱器４のフィン７側に少なくとも
１枚取り付けられていて、プリント基板２上の電子部品
３はパワートランジスタ１とプリント基板２をはさんで
熱的に遮蔽されることになり、電子部品３を熱から保護
することができる。（実施例ではフィン７側の両側に取
り付けられている。）８は入出力用のコネクタで、プリ
ント基板２にねじ９で固定されている。１０はサポート
でねじ１１を使ってプリント基板２と放熱器４とを固定
させている。１２はカバーで強制空冷によってフィン７
間を流れる冷却風の流れをスムーズにし、フィン７の放
熱効果を高める役割をしていて、前記サポート１０と前
記放熱器４にはさみこまれるように固定されている。In FIG. 1, 1 is a power transistor and 2 is a printed circuit board. The power transistor 1 is to come to the side surface 5 1 of the center of the radiator 4 with a base portion of the H-type screw 6
Installed with. Radiator 4 is a plane perpendicular like figure and the surface 5 1 transistor 1 is attached has the H-shaped cross section, the central portion base 5 second heat radiation fins 7 in the vertical direction in one hundred footprint from is provided . In the drawings, specific detailed views of the electronic components 3 mounted on the printed circuit board 2 are omitted. At least one printed circuit board 2 on which the electronic components 3 are mounted is mounted on the fin 7 side of the radiator 4, and the electronic components 3 on the printed circuit board 2 sandwich the power transistor 1 and the printed circuit board 2. Therefore, the electronic component 3 can be protected from heat. (In the embodiment, attached to both sides of the fin 7 side.) 8 is an input / output connector, which is fixed to the printed circuit board 2 with screws 9. Reference numeral 10 denotes a support for fixing the printed circuit board 2 and the radiator 4 using screws 11. 12 is a cover and fins 7 by forced air cooling
It serves to smooth the flow of cooling air flowing between the fins 7 and enhance the heat radiation effect of the fins 7, and is fixed so as to be sandwiched between the support 10 and the radiator 4.
【０００８】以上のような構造で、ベース部側面５1 の
中心に取り付けられているパワートランジスタ１で発生
する熱は、ベース部側面５1 からベース部５2 へとスム
ーズに伝達し、ベース部５2 の両面から突出しているフ
ィン７に均等に伝熱され空気中に放熱される。従って本
発明においては非常に高い放熱効果を得ることが出来
る。[0008] In the structure described above, heat generated by the power transistor 1 is attached to the center of the base portion side 5 1 is to smoothly transmitted from the base side 5 1 to the base portion 5 2, the base portion 5 is evenly transferred to the fins 7 which projects from the double-sided heat is radiated into the air. Therefore, in the present invention, a very high heat radiation effect can be obtained.
【０００９】また、本発明の取り付け構造は放熱効果が
高く、従来の電力増幅器２台分の放熱器を１台分の放熱
器でまかなうことが出来るので、電力増幅器の占有体積
が減少し小型軽量化が可能になる。Further, the mounting structure of the present invention has a high heat radiation effect, and the heat radiator for two conventional power amplifiers can be covered by one heat radiator. Becomes possible.
【００１０】[0010]
【発明の効果】以上説明したように本発明の電力増幅器
の放熱構造は、少なくとも１枚のプリント基板を百足形
をした非常に放熱効果の高い放熱器に接して設け、これ
にパワートランジスタを取り付けることで電力増幅器を
非常にコンパクトにできる。As described above, in the heat dissipation structure of the power amplifier of the present invention, at least one printed circuit board is provided in contact with a radiator having a very high heat dissipation effect and has a power transistor attached thereto. This makes the power amplifier very compact.
【００１１】また、放熱器がプリント基板を介して電子
部品実装面とは反対側の面にあるので、基板上の電子部
品への発熱体からの熱の影響が少なく電力増幅器の信頼
性向上につながる。Further, since the radiator is located on the side opposite to the electronic component mounting surface via the printed circuit board, the effect of heat from the heating element on the electronic components on the substrate is small, and the reliability of the power amplifier is improved. Connect.
【００１２】更に放熱器の両側にプリント基板を配置す
ることで、２つの電力増幅器を１台分の占有体積に納め
ることもできる。Further, by arranging printed circuit boards on both sides of the radiator, two power amplifiers can be accommodated in the occupied volume of one unit.
【図１】本発明の一実施例の斜視図。FIG. 1 is a perspective view of one embodiment of the present invention.
【図２】図１の実施例の正面図。FIG. 2 is a front view of the embodiment of FIG.
【図３】図１の実施例の右側面図。FIG. 3 is a right side view of the embodiment of FIG. 1;
１ パワートランジスタ ２ プリント基板 ３ 電子部品 ４ 放熱器 ５1 放熱器のトランジスタ取付側面 ５2 Ｈ型放熱器の中央部ベース ７ 放熱フィン部 ８ 入出力コネクター １０ サポート １２ カバーREFERENCE SIGNS LIST 1 power transistor 2 printed board 3 electronic component 4 radiator 5 1 transistor mounting side of radiator 5 2 center base of H-type radiator 7 radiating fin 8 input / output connector 10 support 12 cover
Claims (2)
向に放熱フィンが配置された放熱器と、電子部品を搭載
し搭載面とは逆の面を放熱器の放熱フィン側に向けるよ
うに放熱器の両面に配置したプリント基板と、前記放熱
器の側面に配置され前記プリント基板から駆動を受ける
トランジスタとを具備することを特徴とする電力増幅器
の放熱実装構造。1. A radiator having an H-shaped cross-sectional shape and radiating fins arranged vertically from a central portion, and a surface opposite to a mounting surface on which electronic components are mounted and directed toward the radiating fin of the radiator . A heat dissipation mounting structure for a power amplifier, comprising: a printed circuit board disposed on both sides of a radiator; and a transistor disposed on a side surface of the radiator and driven by the printed circuit board.
との間で放熱フィンに接しかつプリント基板と隙間もっ
てプレートを介在させることを特徴とする請求項１の電
力増幅器の放熱実装構造。2. A radiator fin for the printed circuit board and a radiator.
Between the fin and the printed circuit board.
2. The heat dissipation mounting structure for a power amplifier according to claim 1, wherein a plate is interposed .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6170625A JP2790044B2 (en) | 1994-07-22 | 1994-07-22 | Power amplifier heat dissipation mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6170625A JP2790044B2 (en) | 1994-07-22 | 1994-07-22 | Power amplifier heat dissipation mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0837387A JPH0837387A (en) | 1996-02-06 |
| JP2790044B2 true JP2790044B2 (en) | 1998-08-27 |
Family
ID=15908350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6170625A Expired - Fee Related JP2790044B2 (en) | 1994-07-22 | 1994-07-22 | Power amplifier heat dissipation mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2790044B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100336124B1 (en) * | 2000-03-29 | 2002-05-10 | 송재인 | Rediant structure of moving telecommunication system |
| WO2009157080A1 (en) * | 2008-06-26 | 2009-12-30 | 三菱電機株式会社 | Power supply unit |
| JP4829276B2 (en) * | 2008-08-06 | 2011-12-07 | 株式会社東芝 | Electronics |
| WO2011155247A1 (en) * | 2010-06-07 | 2011-12-15 | 三菱電機株式会社 | Heat sink, and method for producing same |
| JP5785788B2 (en) * | 2011-06-10 | 2015-09-30 | 株式会社アイ・オー・データ機器 | Universal serial bus device |
| JP6728591B2 (en) * | 2015-08-10 | 2020-07-22 | 日産自動車株式会社 | Power converter |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0322951Y2 (en) * | 1985-02-01 | 1991-05-20 | ||
| JP3039894U (en) * | 1997-01-24 | 1997-07-31 | 川鉄鉱業株式会社 | Movable grizzly |
-
1994
- 1994-07-22 JP JP6170625A patent/JP2790044B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0837387A (en) | 1996-02-06 |
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