JPS6271300A - Heat sink structure for electronic device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a heat dissipation structure for an electronic device having high heat dissipation ability.

[Conventional technology]

A conventional electronic device heat dissipation structure constructed using a plurality of electronic circuit packages each consisting of a board on which high-heating electronic components are mounted will be explained by taking an example of shelf mounting shown in FIG. 6. Here, 1 is an electronic circuit package, 2 is a casing for holding the electronic circuit package, 3 is a guide for inserting the electronic circuit package, and 4 is an opening for ventilating a refrigerant, that is, air. Figure 7 shows the area indicated by A in Figure 6 in more detail and enlarged, and the numbers correspond to those in Figure 6, with 5 and 5' indicating low heat generation. Electronic components, 5a indicate high heat generation electronic components, 6
7 represents a terminal, and 7 represents a heat radiation fin. This structure is an electronic circuit package 1a equipped with a high heat generating electronic component 5a.
In this structure, the pitch between the electronic circuit package 1 and the electronic circuit package 1 is widened to increase the air velocity, and heat dissipation fins 7 are provided on the high heat generation electronic components 5a-J:. In this case, the heat dissipation capacity of the high heat generation electronic component 5a can be increased by increasing the wind speed and the heat dissipation area.

[Problem that the invention seeks to solve]

However, in the conventional technology, as shown in FIG. 7, the electronic component 5' located downstream of the high heat generation electronic component 5a with respect to the air flow is exposed to high temperature air heated by the high heat generation electronic component 5a. The temperature may exceed the permissible temperature due to exposure to
Even if heat can be dissipated from the high heat generation electronic component 5a, other electronic components 5
There is a problem that heat dissipation is not sufficient. Therefore, if all the electronic components 5.5', 5a are to be operated at a temperature below the allowable temperature, the power consumption of the high heat generation electronic component 5a will be limited, and it will not be possible to mount the high heat generation electronic component 5a. There is a problem.

The present invention solves the above-mentioned problems of the prior art, and separates the heat radiation space of high heat generation electronic components and the heat radiation space of low heat generation electronic components in an electronic circuit package in which high heat generation electronic components and low heat generation electronic components coexist. The present invention aims to provide a heat dissipation structure for an electronic device that allows extremely high heat generating electronic components to be mixed and mounted in an electronic circuit package by eliminating interference between mutually flowing refrigerant air.

[Means for solving problems]

According to the present invention, the above-mentioned problem can be solved in an electronic device including an electronic circuit package including a board on which high-heating electronic components and low-heating electronic components are mounted, with respect to the board of the electronic circuit package. A heat dissipation fin base having substantially the same shape as the board is fixed on the side where the electronic components are mounted, away from the mounted electronic components, and a heat dissipation fin is provided on the side opposite to the high heat generation electronic components with respect to the heat dissipation fin base on the side opposite to the high heat generation electronic components. The electronic components are connected to the base of the heat dissipation fin via heat transfer studs and grease with good thermal conductivity, and the base of the heat dissipation fin separates a heat dissipation space for high heat generation electronic components and a heat dissipation space for low heat generation electronic components. Solved by separation.

[For production]

In an electronic device including an electronic circuit package consisting of a board on which high heat generation electronic components and low heat generation electronic components are mounted, a heat dissipation fin base portion of approximately the same shape as the electronic circuit package is fixed to the electronic circuit package at a distance, and The heat dissipation space for heat generating electronic components and the heat dissipation space for low heat generating/electronic components are separated, with high heat generating electronic components passing through the heat dissipation fin, and low heat generating electronic components passing through the space between the electronic circuit package and the base of the heat dissipation fin. It radiates heat, eliminates mutual interference between refrigerant air flowing through each heat radiating space, and allows extremely high heat generating electronic components to be mixed in an electronic circuit board.

〔Example〕

Below, several embodiments of the invention will be described with reference to the drawings.

First Embodiment FIG. 1 is a perspective view for explaining the first embodiment of the present invention. la is an electronic circuit package; 2 is a housing for holding the electronic circuit package; 3 is a guide for inserting the electronic circuit package; 4 is an opening for ventilation; 5 and 5' are low heat generation electronic components; 5a is a high heat generation electronic component, 6 is a terminal, 7 is a heat radiation fin, 8 is a spacer that holds the base of the heat radiation fin and the electronic circuit package a certain distance apart, 9 is a heat transfer stud, and 10 is grease with good thermal conductivity. , 13 is the base of the heat dissipation fin. Note that the electronic circuit package 1 and the heat dissipation fin base portion 13 are partially cut away.

In the electronic circuit package [a] in which high heat generation electronic components 5a and low heat generation electronic components 5.5' are mixed, a heat dissipation fin base portion 13 having substantially the same shape as the substrate of the electronic circuit package is separated from the mounted electronic components. , and fixed with spacers 8. In this case, the heat dissipation fin base portion 13 is placed at a distance equal to the thickness of the heat transfer stud 9 from the high-energy p5 electron a[) product 5a.

In this embodiment, a low heat generation electronic component 5.5' is placed on a high heat generation electronic component 5a! One side of the heat transfer stud 9 is connected through a good thermal conductive grease IO to ensure sufficient space for heat, and an electronic It has a structure in which a heat dissipation fin base portion 13 having substantially the same shape as the circuit package 1 is fixed, and a heat dissipation space for the low heat generation electronic components 5, 5' and a heat dissipation space for the high heat generation electronic component 5a are separated.

The reason why the thermally conductive grease 10 is used is to facilitate the attachment and detachment of the radiation fins 7 and the high heat generation electronic components 5a. The heat dissipation of the low heat generation electronic component 5 is performed by the low heat generation electronic component 5.
The heat radiation of the high heat generation electronic component 5a is carried out by the air flowing through the heat radiation space near 5'.
The heat transfer is performed by air flowing between the heat-transferring fins 7 via the heat-transferring stud 9, the heat-radiating fin base 13, and the heat-radiating fins 7. The radiation fins 7 are all connected to the radiation fin base 13
is provided on the opposite side of the high heat generation component 5a.

Since the heat radiation space is separated, the low heat generation electronic components 5 and 5' are not exposed to the high temperature air heated by the high heat generation electronic component 5a, and sufficient heat radiation is performed and the heat generated from the high heat generation electronic component 5a is removed. is a large-area heat dissipation fin base 13
The heat spreads inside and is radiated from the surface of the heat radiation fin 7 to the air. As mentioned above, the heat dissipation force is proportional to the surface area of the heat dissipation surface, but in the present invention, by separating the heat dissipation space, it is possible to provide the heat dissipation fin 7 with a large surface area, so that the electronic component 5a generates a high heat compared to the conventional example. The allowable power consumption can be significantly increased.

Second Embodiment FIG. 2 is a perspective view for explaining the second embodiment of the present invention, in which the numbers correspond to those in FIG. An example heat pipe is shown.

In this embodiment, a heat vibrator 1j is attached to the base part 13 of the radiation fin.
Since a plurality of radiating fin base portions 13 are inserted, and a member having isometrically high thermal conductivity is used, the spread of heat in the radiation fin base portion 13 is even better than in the first embodiment. Therefore, the heat spreads almost evenly over the entire area of the heat dissipation fin base 3, that is, to each of the heat dissipation fins 7, and the effective heat dissipation area increases, so compared to the first embodiment, the allowable power consumption of the high heat generation electronic component 5a is reduced. It can be increased further.

Note that the same effect can be obtained even if a good heat conductive member is fixed to the surface of the heat dissipation fin base portion 13.

Third Embodiment FIG. 3 is a perspective view for explaining the third embodiment of the present invention, in which the numbers correspond to those in FIG. It is a heat transfer stud that is attached from the surface and whose cross-sectional area increases in the direction of the surface when attached to the heat dissipation fins 7. Note that FIG. 4 is an enlarged cross-sectional view of the mounting portion of the high heat generation electronic component 5a in FIG. 3, where 12 electrically connects the high heat generation electronic component 5a and the electronic circuit package 1. It is an electrode.

In this embodiment, the heat transfer stud 9a is fixed on the high heat generation electronic component 58, and the heat transfer stud 9a and the heat dissipation fin base I
3 is connected via grease 10 with good thermal conductivity. From the high heat generation electronic component 5a to the radiation fin 7
Because the thermal conductivity of the good thermal conductive grease 10 is the smallest among the heat dissipation paths up to the 10 has a high thermal resistance. For this reason, in this embodiment, the cross-sectional area of the heat transfer stud 9a is expanded toward the connection surface with the heat radiation fin 7, and the contact area of the good thermal conductive grease 10 is expanded. The thermal resistance of the parts is reduced.

Therefore, the thermal resistance from the high heat generation electronic component 5a to the radiation fin 7 is set to 1. This can be further reduced compared to the second embodiment, and the allowable power consumption of the high heat generation electronic component 5a can be increased.

Fourth Embodiment FIG. 5 is a cross-sectional view of a connection portion between a high heat generation electronic component and a heat transfer stud in a fourth embodiment of the present invention, and shows 13a
9b shows the base part of the heat dissipation fin whose surface is corrugated when attached to the heat transfer stud 9b, and 9b shows the base part of the heat dissipation fin 13a.
The ``and'' designations indicate heat transfer studs whose surfaces have the same wave shape.

The present example has a structure in which the contact surface between the heat transfer stud 9b and the base portion 13a of the heat dissipation fin is made into a wave shape, and a grease IO with good thermal conductivity is interposed in the gap.

Therefore, the contact area of the good thermally conductive grease 10 can be further expanded compared to the third embodiment, so the thermal resistance of the good thermally conductive grease 10 can be reduced, and the allowable power consumption of the high heat generating electronic component 5a can be further increased. can be increased.

In the above description, a heat pipe was used as an example of the good heat conduction member 11, but any member may be used as long as it has a higher thermal conductivity than the radiation fin member 7.7a. Not even.

Furthermore, in the fourth embodiment, the contact surface was made into a corrugated shape to increase the contact area of the portion of the grease 10 with good thermal conductivity. However, any structure that can increase the contact area may be used. It goes without saying that even if this structure is adopted, the thermal resistance of the portion of the grease 10 with good thermal conductivity can be reduced.

Note that the present invention is not limited to the above-described embodiments, and various modifications can be made within the technical scope thereof.

〔Effect of the invention〕

As explained above, the heat dissipation structure of the electronic device according to the present invention is characterized in that the heat dissipation spaces of the high heat generation electronic components 5a and the low heat generation electronic components 5, which are mixedly arranged on the electronic circuit package 1, are separated. Low heat generation electronic components 5.5'
The heat dissipation of the high heat generation electronic component 5a is not affected by the heat dissipation of the high heat generation electronic component 5a.
Since the heat dissipation is performed using the large-area heat dissipation fins 7, the allowable power consumption can be significantly increased.

Therefore, there is an advantage that extremely high heat generation electronic components 5a and low heat generation electronic components 5 can be placed together on the same electronic circuit package 1.

4. WfJ simple explanation of box arrangement FIG. 1 is a perspective view of the first embodiment of the present invention, FIG. 2 is a perspective view of the second embodiment of the present invention, and FIG. 3 is a perspective view of the third embodiment of the present invention. FIG. 4 is a cross-sectional view of the connecting portion between the high heat generation electronic component and the heat transfer stud in the third embodiment, and FIG. 5 is a perspective view of the high heat generation electronic component in the fourth embodiment of the present invention. FIG. 6 is an explanatory diagram of a conventional electronic device heat dissipation structure, and FIG. 7 is an enlarged view of the area shown in FIG. 6.

1.1a... Electronic circuit package, 2... Housing for holding the electronic circuit package, 3... Guide for inserting the electronic circuit package, 4... Opening for air ventilation, 5.5'...Low heat generation electronic component, 5a...
- High heat generation electronic component, 6... Terminal, 7.7a... Heat radiation fin, 8... Spacer for holding the heat radiation fin and electronic circuit package, 9.9a, 9b... Heat transfer stud, DESCRIPTION OF SYMBOLS 10... Good thermal conductivity grease, 11... Heat pipe, 12... Electrode, 13... Radiation fin base part

Claims (5)

[Claims] (1) In an electronic device including an electronic circuit package consisting of a board on which a mixture of high-heating electronic components and low-heating electronic components are mounted, mounting on the side on which the electronic components are mounted with respect to the board of the electronic circuit package. A heat dissipation fin base having substantially the same shape as the board is fixed away from the electronic components, and the heat dissipation fin is provided on the side opposite to the high heat generation electronic components with respect to the heat dissipation fin base, and the high heat generation electronic components are connected to heat transfer studs and An electronic device connected to the base of the heat dissipation fin via thermally conductive grease, and further, the base of the heat dissipation fin separates a heat dissipation space for high heat generation electronic components and a heat dissipation space for low heat generation electronic components. heat dissipation structure. (2) The heat transfer stud is characterized in that one surface thereof is fixed to the high heat generation electronic component, and the surface opposite to the above surface is connected to the base of the radiation fin through thermally conductive grease. A heat dissipation structure for an electronic device according to claim 1. (3) The heat transfer stud is characterized in that one surface thereof is fixed to the base of the radiation fin, and the surface opposite to the surface is connected to the high heat generation electronic component via thermally conductive grease. A heat dissipation structure for an electronic device according to claim 1. (4) The heat transfer stud has a shape in which its cross-sectional area increases in the direction from the surface connected to the high heat generation electronic component to the surface connected to the base of the radiation fin. A heat dissipation structure for an electronic device according to scope 1, 2, or 3. (5) The heat dissipation fin base has a good heat conductive member inserted or fixed inside or on the surface of the heat dissipation fin base. Heat dissipation structure of the electronic device described in section.