JPH0680911B2 - Heat dissipation structure of printed wiring board with electronic components - Google Patents
Heat dissipation structure of printed wiring board with electronic componentsInfo
- Publication number
- JPH0680911B2 JPH0680911B2 JP10377286A JP10377286A JPH0680911B2 JP H0680911 B2 JPH0680911 B2 JP H0680911B2 JP 10377286 A JP10377286 A JP 10377286A JP 10377286 A JP10377286 A JP 10377286A JP H0680911 B2 JPH0680911 B2 JP H0680911B2
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- wiring board
- printed wiring
- heat
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、LSI等の電子部品を搭載したプリント配線板
の放熱構造に関し、特に熱伝導作用を利用した放熱構造
に関するものである。Description: TECHNICAL FIELD The present invention relates to a heat dissipation structure of a printed wiring board on which an electronic component such as an LSI is mounted, and more particularly to a heat dissipation structure utilizing a heat conduction effect.
近年、LSI等の電子部品の小形化、容量の増大化等に伴
って、プリント配線板は、電子部品の実装が高密度化さ
れるようになり、このため単位面積当りの発生熱量が増
大化されることになり、この発生熱を効率良く放熱して
搭載された各電子部品を所定温度以下に冷却することが
要求される。In recent years, with the miniaturization of electronic components such as LSI and the increase in capacity, the mounting density of electronic components on printed wiring boards has become higher, and the amount of heat generated per unit area has increased accordingly. Therefore, it is required to efficiently radiate the generated heat and cool each mounted electronic component to a predetermined temperature or lower.
従来の技術としては、プリント配線板の基板そのものを
セラミック等のような熱伝導率の比較的良好な絶縁体か
ら形成し、このプリント配線板に放熱フィンを有する放
熱板を部分的に取付けて構成した放熱構造が知られてい
る。In the conventional technology, the printed circuit board itself is made of an insulator having a relatively good thermal conductivity such as ceramics, and a heat dissipation plate having heat dissipation fins is partially attached to the printed circuit board. A heat dissipation structure is known.
また、別の従来技術としては、エポキシ又はポリイミド
樹脂等から形成したプリント配線板に、搭載電子部品を
避けた空間部分を設けて形成された放熱用金属板を薄い
絶縁板を介して密着させて構成した放熱構造が知られて
いる。Further, as another conventional technique, a printed wiring board formed of epoxy or polyimide resin or the like is provided with a heat-dissipating metal plate formed by providing a space portion avoiding the mounted electronic components through a thin insulating plate. A constructed heat dissipation structure is known.
上記前者の従来例にあっては、放熱フィンを部分的に取
付けているため、放熱効果が低いという問題があり、ま
た収容筐体が大形化されること、高価であること等の問
題がある。In the former conventional example, since the heat radiation fins are partially attached, there is a problem that the heat radiation effect is low, and there is a problem that the housing is large and expensive. is there.
また、上記後者の従来例にあっては、放熱用金属板の構
造が複雑であるため、構造及び組立が複雑化されるこ
と、プリント配線板上の電子部品の配置に制限があるこ
と等の問題がある。Further, in the latter conventional example, since the structure of the heat-dissipating metal plate is complicated, the structure and assembly are complicated, and the arrangement of electronic components on the printed wiring board is limited. There's a problem.
更にまた、従来技術では電子部品への放熱部材の接触力
を均一にするという発想は全くなく、従って、搭載電子
部品の高さによって該電子部品への接触力が不均一とな
り、場合によっては電子部品を破損する可能性があり、
信頼性を損ねていた。Furthermore, in the prior art, there is no idea of making the contact force of the heat dissipation member to the electronic component uniform, and therefore, the height of the mounted electronic component makes the contact force to the electronic component non-uniform, and in some cases, Parts may be damaged,
It was unreliable.
本発明は、このような問題点にかんがみて創作されたも
ので、簡易構造で電子部品の配置が制限されることなく
良好な放熱作用及び収容筐体の小型化が可能な信頼性の
高いプリント配線板の放熱構造を提供することを目的と
している。The present invention was created in view of the above problems, and has a simple structure and a highly reliable print capable of good heat dissipation and a miniaturization of a housing without restricting the arrangement of electronic components. It is intended to provide a heat dissipation structure for a wiring board.
上記問題点を解決するための手段として、本発明によれ
ば、電子部品を搭載したプリント配線板の部品搭載面で
ある表面とその反対面である裏面の少くとも一方の面上
に、その略全域にわたって、弾性、電気絶縁性及び熱伝
導性を有しかつ所定暑さを有する放熱シートを配置し、
該放熱シートを前記プリント配線板の収容筐体の壁板又
は放熱板に密着させると共に放熱板と放熱シートとの少
くとも一方に搭載電子部品の高さ及び断面積に応じた凹
部を形成して電子部品の頂部をほぼ均一な圧力で放熱シ
ートに弾撥的に接触せしめ得るようにしたことを特徴と
する電子部品を搭載したプリント配線板の放熱構造が提
供される。As a means for solving the above problems, according to the present invention, on at least one surface of a surface which is a component mounting surface of a printed wiring board on which an electronic component is mounted and a back surface which is the opposite surface thereof, A heat-dissipating sheet having elasticity, electrical insulation and thermal conductivity and having a predetermined heat is arranged over the entire area,
The heat dissipation sheet is closely attached to the wall plate or heat dissipation plate of the housing for the printed wiring board, and at least one of the heat dissipation plate and the heat dissipation sheet is provided with a recess corresponding to the height and cross-sectional area of the mounted electronic component. There is provided a heat dissipation structure for a printed wiring board on which an electronic part is mounted, characterized in that the top part of the electronic part can be elastically contacted with the heat dissipation sheet with a substantially uniform pressure.
電子部品の発生熱をプリント配線板の板面又は電子部
品、若しくはこれら双方から放熱シートによって吸熱
し、これを収容筐体の壁板又は放熱板に伝導し、これら
筐体又は放熱板から効率良く外部に放熱させることがで
きる。また、放熱シートをプリント配線板と、上記壁板
又は放熱板の間に圧接状に介在配置した構造とすること
により、収容筐体の小形化を図ることができる。The heat generated by the electronic components is absorbed by the heat dissipation sheet from the board surface of the printed wiring board, the electronic components, or both, and is conducted to the wall plate or the heat sink of the housing to efficiently transfer heat from these housings or the heat sink. The heat can be dissipated to the outside. Further, the heat-dissipating sheet has a structure in which the heat-dissipating sheet is interposed between the printed wiring board and the wall plate or the heat-dissipating plate in a pressure-contact manner, whereby the housing can be downsized.
そして、放熱シートあるいは放熱板には電子部品に対応
した凹所が形成されており、従って、全体として電子部
品の高さのばらつきを吸収した状態で略均一な接触力が
電子部品に作用する。Further, the heat dissipation sheet or the heat dissipation plate is formed with a recess corresponding to the electronic component. Therefore, a substantially uniform contact force acts on the electronic component in a state of absorbing the height variation of the electronic component as a whole.
まず初めに、本発明の実施例を説明する上で必要とな
る、本発明の前提となるいくつかの基本構造を第１図〜
第５図を参照して説明する。本発明の実施例そのものは
第6,7図に示される。First, some basic structures which are necessary for explaining the embodiment of the present invention and which are the premise of the present invention are shown in FIGS.
This will be described with reference to FIG. An embodiment of the invention itself is shown in FIGS.
第１図（ａ），（ｂ），（ｃ）は本発明の前提となる基
本構造を示す図であって、（ａ）はその側面断面図、
（ｂ）は（ａ）のＰ部の詳細図、（ｃ）は（ａ）のＱ部
の詳細図である。同図において、符号１はLSI等の電子
部品２を搭載したプリント配線板、３は本発明に係わる
放熱シート、４はプリント配線板１を収容するための金
属製の収容筐体、５は蓋をそれぞれ示す。本例は、第１
図に示すように、プリント配線板１の部品搭載面（表
面）1aの反対面である裏面（この場合は半田付面）1b上
に略全域にわたって密着状に放熱シート３を配置し、さ
らにこの放熱シート３を筐体４の底壁板4a上に密着状に
配置し、これら両者（1,3）を固定ねじ６によって筐体
４の底壁板4a上に固定して構成される。プリント配線板
１はガラスエポキシ等の基板から形成されたものであ
る。放熱シート３は、弾性、電気絶縁性及び熱伝導性を
有するもので、例えば、導熱シリコンゴム等からその表
面大きさがプリント配線板１の表面大きさと略同等の大
きさを有し、かつその厚さが第１図（ｂ）に示すように
電子部品２のリード2aの突出部2bの長さｌ（例えば、1.
5mm程度）に対し十分な厚さ（例えば、４〜5mm程度）を
有して板状に形成されている。そして、放熱シート３
は、第１図（ｃ）に示すように、プリント配線板１と底
壁板4aとが間隔管７を介して所定間隔を隔てて互に固定
され、これら両者（1,4a）に予め定めた適当な押圧力で
圧接された状態で配設される。従って、放熱シート３
は、その弾性によって第１図（ｂ）に示すように、電子
部品２のリード2aの突出部2bを吸収してプリント配線板
１の裏面1bに密着状に圧接されると同時に底壁板4a上に
密着状に圧接される。尚、この放熱シート３は、例え
ば、導熱シリコンゴム系の材料から作製されたクールシ
ート（商品名；藤倉化成）や導熱シート（商品名；
（株）電化）等を用いて形成することが好ましい。1 (a), (b) and (c) are diagrams showing a basic structure which is a premise of the present invention, and (a) is a side sectional view thereof,
(B) is a detailed view of the P section of (a), and (c) is a detailed view of the Q section of (a). In the figure, reference numeral 1 is a printed wiring board on which an electronic component 2 such as an LSI is mounted, 3 is a heat dissipation sheet according to the present invention, 4 is a metal housing for housing the printed wiring board 1, and 5 is a lid. Are shown respectively. This example is the first
As shown in the figure, a heat dissipation sheet 3 is arranged in close contact over substantially the entire area on a back surface (a soldering surface in this case) 1b opposite to the component mounting surface (front surface) 1a of the printed wiring board 1. The heat dissipation sheet 3 is arranged in close contact with the bottom wall plate 4a of the housing 4, and both (1, 3) are fixed to the bottom wall plate 4a of the housing 4 by fixing screws 6. The printed wiring board 1 is formed of a substrate such as glass epoxy. The heat dissipation sheet 3 has elasticity, electrical insulation, and thermal conductivity. For example, the surface size of the heat conductive silicon rubber is substantially the same as the surface size of the printed wiring board 1, and As shown in FIG. 1 (b), the thickness of the protrusion 2b of the lead 2a of the electronic component 2 is 1 (for example, 1.
It is formed in a plate shape having a sufficient thickness (for example, about 4 to 5 mm) with respect to about 5 mm. And the heat dissipation sheet 3
As shown in FIG. 1 (c), the printed wiring board 1 and the bottom wall board 4a are fixed to each other with a predetermined distance therebetween via a spacing tube 7, and these two (1, 4a) are predetermined. Further, they are arranged in a state of being pressed against each other with an appropriate pressing force. Therefore, the heat dissipation sheet 3
Due to its elasticity, as shown in FIG. 1 (b), the protrusion 2b of the lead 2a of the electronic component 2 is absorbed and pressed into close contact with the back surface 1b of the printed wiring board 1, and at the same time, the bottom wall board 4a. It is pressed tightly on top. The heat dissipation sheet 3 is, for example, a cool sheet (trade name: Fujikura Kasei) or a heat conduction sheet (product name;
It is preferably formed by using Denka Co., Ltd. or the like.
本例は、このようにプリント配線板１の一方の面、つま
り裏面1b上に放熱シート３を配置した例であり、電子部
品２のリード2aの突出部2bが筐体４に接触すること（短
絡すること）を防止するために必要なプリント配線板１
と底壁板4aの間隔空間を巧みに利用し、この間隔空間に
放熱シートを配設して構成されたものであり、筐体４
（及び蓋５）が放熱体及び電波のシールドカバーの役割
も果たしているものである。This example is an example in which the heat dissipation sheet 3 is arranged on one surface of the printed wiring board 1, that is, the back surface 1b in this way, and the protruding portions 2b of the leads 2a of the electronic component 2 contact the housing 4 ( Printed wiring board 1 required to prevent short circuit)
The space between the bottom wall plate 4a and the bottom wall plate 4a is skillfully utilized, and a heat dissipation sheet is arranged in this space, and the housing 4
(And the lid 5) also serve as a radiator and a radio wave shield cover.
このように構成された本例は、プリント配線板１に伝導
した電子部品２の発生熱がプリント配線板１の裏面1b全
面から放熱シート３に吸熱され、この放熱シート３を介
して底壁板4aに伝導され、筐体４から外部に効率良く放
熱される。これにより、プリント配線板１の表面1a側、
つまり部品搭載面側へ放出される熱量を最小限に抑える
ことができ、このため従来放熱のために必要としていた
第１図（ａ）のL1に相当する空間をほとんど不要とする
ことが可能となり、収容筐体４の高さＬを小さくして収
容筐体４の小形化を図ることができる。また、本例は筐
体４及び蓋５によって、電子部品２を実装したプリント
配線板１をほとんど密閉状に収容する構成であるため、
外部から侵入しようとする電波を確実にシールド（遮
蔽）することができるので、侵入電波によって悪影響を
受け易い光モジュール（光装置）等に適用すれば特に有
用性が高く実用的である。さらに、本例は、放熱シート
３の厚さと弾性を適宜に選定することにより、プリント
配線板１の裏面1bへ電子部品２を実装（プリント配線板
両面実装）しても上記のように効率良く放熱することが
可能である。In this example configured as described above, the heat generated by the electronic component 2 conducted to the printed wiring board 1 is absorbed by the heat radiation sheet 3 from the entire back surface 1b of the printed wiring board 1, and the bottom wall plate is passed through this heat radiation sheet 3. The heat is conducted to the outside 4a and is efficiently radiated from the housing 4 to the outside. As a result, the surface 1a side of the printed wiring board 1,
In other words, the amount of heat radiated to the component mounting surface side can be minimized, and therefore the space corresponding to L 1 in FIG. 1 (a), which was conventionally required for heat dissipation, can be almost eliminated. Therefore, the height L of the housing 4 can be reduced to make the housing 4 smaller. In addition, in this example, the printed wiring board 1 on which the electronic component 2 is mounted is housed in a substantially sealed manner by the housing 4 and the lid 5,
Since it is possible to reliably shield (block) radio waves that try to enter from the outside, it is particularly useful and practical when applied to an optical module (optical device) or the like that is easily adversely affected by intruding radio waves. Further, in this example, by appropriately selecting the thickness and elasticity of the heat dissipation sheet 3, even if the electronic component 2 is mounted on the back surface 1b of the printed wiring board 1 (both sides of the printed wiring board are mounted), the efficiency can be improved as described above. It is possible to dissipate heat.
第２図は上記第１図の変形構造例を示す側面図である。
本例は、プリント配線板１の一端縁にプリント板コネク
タ８が設けられ、シェルフと呼ばれる箱形の筐体（図示
なし）に複数枚挿着収容されるように形成されたもの
で、コネクタ８がシェルフのバックボードに設けられた
バックボードコネクタ（図示なし）に嵌合接続される。
本例は、放熱シート３が第１実施例と同様にプリント配
線板１の裏面1bに配置され、この放熱シート３をはさむ
形態で放熱フィン9aを有する放熱板９が配置され、固定
ねじ６によってこれら三者（1,3,9）が一体状に結合さ
れて構成される。放熱板９は放熱フィン9aを有するので
プリント配線板１から放熱シート３を介して伝導してき
た熱を効率良く外部に放熱することができ、シールドカ
バーの役割も兼ねている。本例は、このように構成され
ることにより、全体の厚さを最小限に薄く設定するこ
と、つまり小形化を図ることができ、このためシェルフ
に収容される隣のプリント配線板との間隔を従来よりも
せばめることができるという利点があり、その他の作用
効果に関しては第１図のものと同様である。FIG. 2 is a side view showing an example of the modified structure of FIG.
In this example, a printed board connector 8 is provided at one end of the printed wiring board 1, and a plurality of box-shaped casings (not shown) called shelves are formed so as to be inserted and accommodated. Is fitted and connected to a backboard connector (not shown) provided on the backboard of the shelf.
In this example, the heat radiating sheet 3 is arranged on the back surface 1b of the printed wiring board 1 as in the first embodiment, and the heat radiating plate 9 having the heat radiating fins 9a sandwiching the heat radiating sheet 3 is arranged. These three (1,3,9) are integrally connected. Since the heat dissipation plate 9 has the heat dissipation fins 9a, the heat conducted from the printed wiring board 1 through the heat dissipation sheet 3 can be efficiently dissipated to the outside, and also serves as a shield cover. With this configuration, the present example allows the overall thickness to be set as thin as possible, that is, downsizing can be achieved. Therefore, the space between the printed wiring board and the adjacent printed wiring board housed in the shelf can be reduced. Is advantageous over the conventional one, and other operational effects are the same as those in FIG.
第３図は更に別の構造例を示す側面断面図である。同図
に示すように、本例は、電子部品２を搭載したプリント
配線板１の表面（部品搭載面）1aと裏面（半田付面）1b
の双方の面上に略全域にわたって放熱シート３を配置し
て構成した例である。プリント配線板１はその裏面1b側
に前出の第１実施例の場合と同様にして配置された放熱
シート３を介して収容筐体４の底壁板4a上に配置され、
表面1a側に配置された放熱シート３上に配置された放熱
板９を筐体４に固定ねじ10によって固定することによ
り、上下双方の放熱シート３の弾性によって所定の圧力
で挟持された状態で固定されると共に筐体４内に密閉状
に配設される。従って、上下双方の放熱シート３はプリ
ント配線板１の表面1a側及び裏面1b側に所定の圧力で圧
接されている。裏面1b側の放熱シート３は、部品２のリ
ード2aの突出部2bを前出の第１実施例と同様に弾性によ
って吸収し、裏面1bと底壁板4a間を絶縁すると共にこれ
ら両者（1b,4a）に密着状で圧接されている。表面1a側
の放熱シート３は、その弾性によって電子部品２の相互
間の高さのバラツキｌ１を吸収して各部品２の上面に密
着状で圧接されると共に放熱板９にも密着状で圧接され
る。尚、本例は、各部品２の高低差によって上側の放熱
シート３の部品２に対する圧接力に多少のばらつきが生
ずる。FIG. 3 is a side sectional view showing still another structural example. As shown in the figure, in this example, a front surface (component mounting surface) 1a and a back surface (soldering surface) 1b of a printed wiring board 1 on which an electronic component 2 is mounted are mounted.
Is an example in which the heat dissipation sheet 3 is arranged over substantially the entire area of both surfaces. The printed wiring board 1 is arranged on the bottom wall plate 4a of the housing case 4 via the heat dissipation sheet 3 arranged on the back surface 1b side in the same manner as in the case of the first embodiment described above.
By fixing the heat radiating plate 9 arranged on the heat radiating sheet 3 arranged on the front surface 1a side to the housing 4 with the fixing screw 10, it is sandwiched by the elasticity of the upper and lower heat radiating sheets 3 at a predetermined pressure. It is fixed and disposed in the housing 4 in a sealed manner. Therefore, the upper and lower heat dissipation sheets 3 are pressed against the front surface 1a side and the back surface 1b side of the printed wiring board 1 with a predetermined pressure. The heat dissipation sheet 3 on the back surface 1b side absorbs the protruding portion 2b of the lead 2a of the component 2 by elasticity similarly to the first embodiment described above, and insulates the back surface 1b and the bottom wall plate 4a from each other (1b , 4a) is pressed in close contact. Due to its elasticity, the heat dissipation sheet 3 on the front surface 1a side absorbs the variation in height l 1 between the electronic components 2 and is press-fitted tightly to the upper surfaces of the components 2 as well as to the heat dissipation plate 9. Pressed. In this example, the pressure contact force of the upper heat radiating sheet 3 with respect to the component 2 is slightly varied due to the height difference of the components 2.
このように構成された本例は、前出の第１図と同様の裏
面1b側の放熱作用に加えて、各電子部品２の発生熱をそ
の上面から上側の放熱シート３によって吸熱し、この熱
を放熱板９に伝導して放熱フィン9aから外部に放熱する
ことができるので、全体として非常に良好な放熱効果が
得られる。また、本例はプリント配線板１が上下の放熱
シート３を介して一定の圧力で押圧されて固定されてい
るのでプリント配線板１の反り等の変形を防止すること
ができ、これにより電子部品２のプリント配線板１への
半田付部の信頼性を高めることができるという利点があ
る。また、本例は、L1寸法が２枚の放熱シート３を所定
量だけ弾性変形させてプリント配線板１を押圧固定でき
る寸法となっており、前出の第１実施例の場合と同様に
Ｌ寸法を小さく設定することができるので収容筐体４の
小形化が可能であり、その他の作用効果については第１
図のものと同様である。In this example configured as described above, in addition to the heat radiation effect on the back surface 1b side similar to that of FIG. 1 described above, the heat generated by each electronic component 2 is absorbed from the upper surface by the heat radiation sheet 3 on the upper side. Since heat can be conducted to the heat dissipation plate 9 and dissipated to the outside from the heat dissipation fin 9a, a very good heat dissipation effect can be obtained as a whole. Further, in this example, since the printed wiring board 1 is pressed and fixed with a constant pressure via the upper and lower heat dissipation sheets 3, it is possible to prevent the printed wiring board 1 from being deformed, such as warped. 2 has an advantage that the reliability of the soldered portion to the printed wiring board 1 can be improved. Also, in this example, the L 1 dimension is such that the two heat dissipation sheets 3 can be elastically deformed by a predetermined amount to press and fix the printed wiring board 1, and as in the case of the first embodiment described above. Since the L dimension can be set small, the housing 4 can be downsized, and the other action and effect are the first.
It is similar to that in the figure.
第４図は第３図の変形例を示す図である。本例は、前出
の第２実施例と基本的には同様に構成されたものである
が、電子部品２のうち高さが特に高い電子部品２−１が
存在する場合に、上側の放熱シート３と放熱板９にこの
部品２−１の逃げ部Ａを設けた点が第３図と構造的に異
なる点であり、その他の作用効果はほとんど同様であ
る。FIG. 4 is a diagram showing a modification of FIG. This example has basically the same configuration as that of the second example described above, but when there is an electronic component 2-1 having a particularly high height among the electronic components 2, heat radiation on the upper side is performed. 3 is that the relief portion A of the component 2-1 is provided on the sheet 3 and the heat dissipation plate 9, which is a structural difference from FIG. 3, and other operational effects are almost the same.
第５図は第３図、第４図の矢印Ｐで示す固定部の変形例
を示す図である。同図において、11は段付ねじ、12はコ
イルばねである。本例はコイルばね12を装着した段付ね
じ11を放熱板９に摺動自在に挿通して筐体４にねじ込む
ことにより、筐体４と放熱板９がばね12の反発力によっ
て上下双方の放熱シート３を一定の圧力で弾撥的に押圧
している構造に構成される。従って、本例によれば、放
熱シート３にへたりが生じた場合でも、ばね12のばね力
によって双方の放熱シート３を常に一定の適当な圧力で
圧接することができるので、へたりによる放熱シート３
の熱伝導の低下を防止できる。FIG. 5 is a view showing a modified example of the fixing portion shown by the arrow P in FIGS. 3 and 4. In the figure, 11 is a stepped screw and 12 is a coil spring. In this example, a stepped screw 11 having a coil spring 12 is slidably inserted into a heat radiating plate 9 and screwed into a case 4, so that the case 4 and the heat radiating plate 9 are moved upward and downward by a repulsive force of the spring 12. The heat dissipation sheet 3 is configured to be elastically pressed with a constant pressure. Therefore, according to the present example, even when the heat dissipation sheet 3 is settled, the spring force of the spring 12 can press the two heat dissipation sheets 3 with each other at a constant and appropriate pressure. Sheet 3
It is possible to prevent a decrease in heat conduction.
第６図（ａ），（ｂ）は本発明の基本構成を示す図であ
って、（ａ）はその側面断面図、（ｂ）は（ａ）の放熱
シート３の単体図である。FIGS. 6 (a) and 6 (b) are views showing the basic configuration of the present invention, FIG. 6 (a) is a side sectional view thereof, and FIG. 6 (b) is a single view of the heat dissipation sheet 3 of FIG.
以下に述べる本発明の基本思想は以上のいずれの構造例
にも適用できるものである。本発明によれば、電子部品
２を搭載したプリント配線板１の表面（部品搭載面）1a
上に略全域にわたって放熱シート３を配置し、かつこの
放熱シート３に搭載部品２の形状に対応した凹所3aが設
けられる。プリント配線板１は間隔管７を介して固定ね
じ６によって筐体４の底壁板4a上に固定される。放熱シ
ート３は、この場合、モールド成形法等によってブロッ
ク状に形成されたもので、プリント配線板１上の各部品
２をそれぞれ密接状に収納可能な複数個の凹所3aを設け
て形成される。このように形成された放熱シート３はそ
の各凹所3aに各部品２をそれぞれ収容して凹所3aを除く
部分が表面1aに密接した状態でプリント配線板１上に配
置され、全体として各電子部品の高さのばらつきを吸収
した状態で放熱シート３上に密着状に配置されて固定ね
じ10で収容筐体４に固定された放熱板９によって所定の
圧力で各部品２及び表面1aに圧接される。The basic idea of the present invention described below can be applied to any of the above structural examples. According to the present invention, the surface (component mounting surface) 1a of the printed wiring board 1 on which the electronic component 2 is mounted
The heat radiating sheet 3 is arranged over the substantially entire area, and the heat radiating sheet 3 is provided with a recess 3a corresponding to the shape of the mounting component 2. The printed wiring board 1 is fixed on the bottom wall plate 4a of the housing 4 by a fixing screw 6 via a spacing tube 7. In this case, the heat dissipation sheet 3 is formed in a block shape by a molding method or the like, and is formed by providing a plurality of recesses 3a in which the respective parts 2 on the printed wiring board 1 can be closely packed. It The heat dissipation sheet 3 formed in this manner is arranged on the printed wiring board 1 in a state in which the respective parts 2 are accommodated in the respective recesses 3a, and the portions other than the recesses 3a are in close contact with the surface 1a, and as a whole. A heat radiating plate 9 which is tightly arranged on the heat radiating sheet 3 in a state where the height variations of the electronic components are absorbed and fixed to the housing 4 with the fixing screw 10 is applied to each component 2 and the surface 1a with a predetermined pressure. Pressed.
このように構成された本例は、放熱シート３がプリント
配線板１及び各電子部品２の双方から各電子部品２の発
生熱を吸収して放熱板９に伝導し、放熱フィン9aから効
率良く外部に放熱することができる。また、本例は、L1
寸法が放熱シート３を適当量だけ弾性変形させてプリン
ト配線板１及び部品２に弾撥的に押圧する寸法に設定さ
れており、Ｌ寸法を小さく設定して収容筐体４の小形化
を図ることができる。In this example configured as described above, the heat dissipation sheet 3 absorbs the heat generated from each electronic component 2 from both the printed wiring board 1 and each electronic component 2 and conducts it to the heat dissipation plate 9 so that the heat dissipation fins 9a efficiently. Can radiate heat to the outside. Also, in this example, L 1
The size is set so as to elastically deform the heat dissipation sheet 3 by an appropriate amount and elastically press against the printed wiring board 1 and the component 2, and the L size is set small to miniaturize the housing 4. be able to.
更に、本発明によれば各電子部品には略均一の接触圧力
がかかることになり、従って相対的に高さの高い電子部
品があってもそれに大きな接触圧力がかかってこれを破
損するなどの問題も解消される。Further, according to the present invention, a substantially uniform contact pressure is applied to each electronic component, so that even if there is an electronic component having a relatively high height, a large contact pressure is applied to the electronic component and the electronic component is damaged. The problem is also solved.
尚、第１〜５図について説明した作用、効果を保有する
ことは勿論である。It goes without saying that the functions and effects described with reference to FIGS. 1 to 5 are retained.
第７図は第６図の変形例を示す側面断面図である。本例
は、第６図と基本的には同様な着想で構成されたもので
あり、電子部品２を搭載したプリント配線板１の表面1a
上にその略全域にわたって板状の放熱シート３を配置
し、この放熱シート３上に配置される放熱板９の下面に
各電子部品２の形状に対応した凹所9bを設けて構成した
例である。放熱板９の凹所9bは前出の第３実施例の放熱
シート３の凹所3aよりも大き目でかつなだらかに形成さ
れる。本例は、下面をこのように形成した放熱板９を放
熱シート３上に圧接して筐体４に固定することにより、
放熱シート３が凹所9bによって弾性変形され各部品２の
少くとも上面に密着し、かつプリント配線板１に対して
は比較的高さの低い部品２の周辺部等の上面1aに部分的
に密着する構造に構成される。従って、本例は、プリン
ト配線板１の上面1aからの吸熱量が第３実施例よりも若
干少いが、その他の作用効果については第６図と同様で
ある。FIG. 7 is a side sectional view showing a modification of FIG. This example has basically the same concept as that of FIG. 6, and the surface 1a of the printed wiring board 1 on which the electronic component 2 is mounted is mounted.
In an example in which a plate-shaped heat dissipation sheet 3 is disposed on the upper surface of the heat dissipation sheet 3, and a recess 9b corresponding to the shape of each electronic component 2 is provided on the lower surface of the heat dissipation plate 9 disposed on the heat dissipation sheet 3. is there. The recess 9b of the heat dissipation plate 9 is larger and gentler than the recess 3a of the heat dissipation sheet 3 of the third embodiment described above. In this example, the heat radiating plate 9 having the lower surface thus formed is pressed against the heat radiating sheet 3 and fixed to the housing 4,
The heat dissipation sheet 3 is elastically deformed by the recess 9b and adheres to at least the upper surface of each component 2 and partially on the upper surface 1a such as the peripheral portion of the component 2 which is relatively low in height with respect to the printed wiring board 1. It is structured in close contact. Therefore, in this example, the amount of heat absorbed from the upper surface 1a of the printed wiring board 1 is slightly smaller than that in the third example, but the other functions and effects are the same as in FIG.
以上説明してきたように、本発明によれば、電子部品
（２）を搭載したプリント配線板（１）の表面（1a）又
は裏面（1b）のいずれか一方の面上、若しくはこれら双
方の面（1a,1b）上に、その略全域にわたって放熱シー
ト（３）を配置し、これを収容筐体（４）の壁板（4a）
又は放熱板（９）によって圧接する構成とすることによ
り、簡易構造で電子部品（２）の配列を制限することな
く、電子部品（２）の発生熱を熱伝導作用によって効率
良く放熱することができ、かつ収容筐体（４）の小形化
を図ることができるという好ましい効果が得られる。As described above, according to the present invention, either one of the front surface (1a) and the back surface (1b) of the printed wiring board (1) on which the electronic component (2) is mounted, or both of these surfaces. On (1a, 1b), a heat dissipation sheet (3) is arranged over substantially the entire area, and the heat dissipation sheet (3) is placed on the wall plate (4a) of the housing (4).
Alternatively, by adopting a structure in which the heat dissipating plate (9) presses the heat, the generated heat of the electronic component (2) can be efficiently dissipated by the heat conduction action without restricting the arrangement of the electronic component (2) with a simple structure. It is possible to obtain the preferable effect that the housing case (4) can be downsized.
また、本発明によれば、放熱シートが電子部品のみなら
ず電子部品を搭載しているプリント基板の実質上全面に
接触するため、電子部品からの熱に加え基板全体からも
熱を取り込むので放熱効果が極めて大きい、凸部での基
板の反り、ねじれ等が起きない、凹部で電子部品を全体
的に包み込む状態となり位置決めの容易さ、ゴミ等の侵
入の防止が図れる、等の顕著な効果を奏する。Further, according to the present invention, since the heat dissipation sheet contacts not only the electronic components but also substantially the entire surface of the printed circuit board on which the electronic components are mounted, heat is taken in not only from the electronic components but also from the entire substrate. Significant effects such as extremely large effect, warpage of the board at the convex portion, twisting etc. do not occur, the electronic component is entirely wrapped in the concave portion, positioning is easy, dust can be prevented from entering, etc. Play.
放熱シートあるいは放熱板には電子部品に対応した凹所
（3a,9b）が形成されているので全体として電子部品の
高さのばらつきを吸収した状態で略均一な接触力が電子
部品に作用し、その結果、特定の電子部品に過大の押圧
力が作用してこれを破損するということがなくなる。Since the heat dissipation sheet or the heat dissipation plate has recesses (3a, 9b) corresponding to the electronic parts, a substantially uniform contact force acts on the electronic parts while absorbing the variation in the height of the electronic parts as a whole. As a result, it is possible to prevent an excessive pressing force from acting on a specific electronic component to damage it.
第１図（ａ），（ｂ），（ｃ）は本発明の前提となる基
本構成を示す図、 第２図は第１図の変形例を示す図、 第３図は更に別の前提基本構成を示す図、 第４図は第３図の変形例を示す図、 第５図は第３図及び第４図の矢印Ｐで示す固定部の変形
例を示す図、 第６図（ａ），（ｂ）は本発明の特徴を示す図、 第７図は第６図の変形例を示す図である。 第１〜７図において、 １は電子部品（２）を搭載したプリント配線板、 1a表面（部品搭載面）、 1bは裏面（半田付面）、 2,2−１は電子部品、 2aはリード、2bは突出部、 ３は放熱シート、3aは凹所、 ４は収容筐体、4aは底壁板、 ５は蓋、6,10は固定ねじ、７は間隔管、８はプリント板
コネクタ、 ９は放熱板、9aは放熱フィン、 11は段付ねじ、12はコイルばね、 をそれぞれ示す。FIGS. 1 (a), (b), and (c) are diagrams showing a basic configuration on which the present invention is based, FIG. 2 is a diagram showing a modified example of FIG. 1, and FIG. FIG. 4 is a diagram showing the configuration, FIG. 4 is a diagram showing a modification of FIG. 3, FIG. 5 is a diagram showing a modification of the fixing portion shown by an arrow P in FIGS. 3 and 4, and FIG. 6 (a). , (B) are views showing the features of the present invention, and FIG. 7 is a view showing a modification of FIG. 6. 1 to 7, 1 is a printed wiring board on which an electronic component (2) is mounted, 1a is a front surface (component mounting surface), 1b is a rear surface (soldering surface), 2,2-1 is an electronic component, and 2a is a lead. , 2b is a protrusion, 3 is a heat dissipation sheet, 3a is a recess, 4 is a housing, 4a is a bottom wall plate, 5 is a lid, 6 and 10 are fixing screws, 7 is a spacing tube, 8 is a printed board connector, Reference numeral 9 indicates a heat radiating plate, 9a indicates a heat radiating fin, 11 indicates a stepped screw, and 12 indicates a coil spring.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 山地 宏 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (56)参考文献 特開 昭58−101497（ＪＰ，Ａ) 実開 昭54−120373（ＪＰ，Ｕ) 実開 昭60−83254（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroshi Yamaji 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited (56) References JP-A-58-101497 (JP, A) Actual Development Shou 54-120373 (JP, U) Actually open sho-83-254 (JP, U)
Claims (1)
（１）の部品搭載面である表面（1a）とその反対面であ
る裏面（1b）の少くとも部品搭載面上に、その略全域に
わたって、弾性、電気絶縁性及び熱伝導性を有しかつ所
定厚さを有する放熱シート（３）を配置し、該放熱シー
ト（３）を前記プリント配線板（１）の収容筐体（４）
の壁板（4a）又は放熱板（９）に密着させると共に放熱
板と放熱シートとの少くとも一方に搭載電子部品の高さ
及び断面積に応じた凹部（3a,9b）を形成して電子部品
の頂部及びプリント配線板の部品非搭載部分をほぼ均一
な圧力で放熱シートに弾撥的に接触せしめ得るようにし
たことを特徴とする電子部品を搭載したプリント配線板
の放熱構造。1. A printed wiring board (1) on which an electronic component (2) is mounted, a front surface (1a) which is a component mounting surface and a back surface (1b) which is an opposite surface thereof, at least on the component mounting surface, A heat radiating sheet (3) having elasticity, electrical insulation and thermal conductivity and having a predetermined thickness is arranged over the entire area, and the heat radiating sheet (3) accommodates the housing (4) of the printed wiring board (1). )
The wall plate (4a) or the heat radiating plate (9) of the electronic component, and at least one of the heat radiating plate and the heat radiating sheet is provided with a concave portion (3a, 9b) corresponding to the height and cross-sectional area of the mounted electronic component. A heat dissipation structure for a printed wiring board on which an electronic component is mounted, characterized in that the top of the component and the non-mounted portion of the printed wiring board can be elastically brought into contact with the heat dissipation sheet with a substantially uniform pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10377286A JPH0680911B2 (en) | 1986-05-08 | 1986-05-08 | Heat dissipation structure of printed wiring board with electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10377286A JPH0680911B2 (en) | 1986-05-08 | 1986-05-08 | Heat dissipation structure of printed wiring board with electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62261199A JPS62261199A (en) | 1987-11-13 |
| JPH0680911B2 true JPH0680911B2 (en) | 1994-10-12 |
Family
ID=14362743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10377286A Expired - Fee Related JPH0680911B2 (en) | 1986-05-08 | 1986-05-08 | Heat dissipation structure of printed wiring board with electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0680911B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09175399A (en) * | 1995-12-28 | 1997-07-08 | Motohiro Seisakusho:Kk | Dolly for container |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02136386U (en) * | 1989-04-19 | 1990-11-14 | ||
| JP2536657B2 (en) * | 1990-03-28 | 1996-09-18 | 三菱電機株式会社 | Electric device and manufacturing method thereof |
| JPH0474489U (en) * | 1990-11-08 | 1992-06-30 | ||
| JPH06220880A (en) * | 1993-01-28 | 1994-08-09 | Komatsu Ltd | Boom structure for construction machine |
| JPH073186U (en) * | 1993-06-17 | 1995-01-17 | 富士通株式会社 | Electronic component fixing structure |
| JPH11220278A (en) * | 1998-01-29 | 1999-08-10 | Yazaki Corp | Heat dissipating structure of heat releasing part |
| JP2003101270A (en) * | 2001-09-27 | 2003-04-04 | Toshiba Corp | Cooling structure for electronic component, magnetic disk device provided therewith and manufacturing method for cooling structure |
| JP4096711B2 (en) * | 2002-11-20 | 2008-06-04 | 松下電器産業株式会社 | Circuit board manufacturing method |
| JP4851154B2 (en) * | 2005-10-17 | 2012-01-11 | 古河電気工業株式会社 | Circuit board built-in housing |
| JP2014056186A (en) * | 2012-09-13 | 2014-03-27 | Sumitomo Electric Ind Ltd | Optical device and method of manufacturing optical device |
| JP2014187233A (en) * | 2013-03-25 | 2014-10-02 | Panasonic Corp | Heat radiation sheet and heat radiation structure using the same |
| JP6672724B2 (en) * | 2015-11-10 | 2020-03-25 | Tdk株式会社 | Power supply |
| JP7048214B2 (en) * | 2017-03-15 | 2022-04-05 | エドワーズ株式会社 | The control device, the substrate mounted on the control device, and the vacuum pump to which the control device is applied. |
-
1986
- 1986-05-08 JP JP10377286A patent/JPH0680911B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09175399A (en) * | 1995-12-28 | 1997-07-08 | Motohiro Seisakusho:Kk | Dolly for container |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62261199A (en) | 1987-11-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3281220B2 (en) | Circuit module cooling system | |
| US6570764B2 (en) | Low thermal resistance interface for attachment of thermal materials to a processor die | |
| KR100924547B1 (en) | Semiconductor package module | |
| JP4228753B2 (en) | Electronic control unit | |
| JPH1093280A (en) | Electronic device enclosure with electromagnetic energy sealing characteristics and heat-removing characteristics | |
| JPH1174427A (en) | Heat radiation structure of circuit element | |
| JP2002217343A (en) | Electronic device | |
| JPH0680911B2 (en) | Heat dissipation structure of printed wiring board with electronic components | |
| EP1178594B1 (en) | Electronic apparatus provided with an electronic circuit substrate | |
| JPH09321468A (en) | Heat radiating device | |
| JP4822855B2 (en) | Heat dissipation structure for electronic devices | |
| JP2002134970A (en) | Electronic controller | |
| JP2003318337A (en) | Electronic instrument | |
| JP7115032B2 (en) | substrate | |
| JP3378174B2 (en) | Heat dissipation structure of high heating element | |
| JPH11266090A (en) | Semiconductor device | |
| JPH1098287A (en) | Cooler for circuit board module and portable electronic equipment having the cooler | |
| JP4380061B2 (en) | Heat dissipation structure | |
| JP2000252657A (en) | Heat dissipation unit for control apparatus | |
| JPH01186700A (en) | Printed wiring board structure | |
| JPH10335860A (en) | Heat sink | |
| JP3318511B2 (en) | Mounting structure of card type semiconductor device | |
| JP2717865B2 (en) | Heat dissipation device | |
| JPH07321485A (en) | Cooling structure for device mounted on printed board | |
| JP2008226890A (en) | Electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |