JPH09321468A - Heat radiating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make heat of a semiconductor chip radiate efficiently without damaging the chip by a method wherein a heat conduction member is constituted of core materials having an elasticity and a heat conductive metal layer covering the outer surfaces of the core materials. SOLUTION: A radiating device 14 for radiating heat generated from a bare chip 12 is constituted of a heat conduction member 16 contactedly provided on the upper surface 12b of the chip 12 and a heat sink 18, which is provided on the member 16 and is used as a radiating member. The member 16 is constituted of a plurality of rod-shaped bodies 20 covered with a heat conductive metal layer 21. The volume, which is occupied by the layer 21, of the member 16 is great, specially, the volume of the layer 21, which is extended from the upper surface 12a of the chip 12 to the lower surface of the heat sink 19, can be ensured. Each rod-shaped body 20 of the member 16 is provided with a core material having an elasticity and when an external pressure or other shock is exerted on the rod-shaped body 20, the rod-shaped body 20 is elastically deformed to relax the external pressure or the shock.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip heat dissipation device, and more particularly to a bare chip heat dissipation device.

[0002]

2. Description of the Related Art In recent years, bare chips, which can significantly reduce the mounting area as compared with conventional semiconductor packages, have been attracting attention as electronic components. Generally, a semiconductor package is constructed by mounting a semiconductor chip on a lead frame and then covering it with a resin package. On the other hand, since the bare chip is formed of a single semiconductor chip without a lead frame and a resin package, it can be significantly downsized as compared with a semiconductor package.

On the other hand, the bare chip is characterized in that it generates a large amount of heat during operation and is weak against external pressure as compared with other electronic components. Therefore, when using the bare chip, it is necessary to efficiently cool it without applying a large load.

Conventionally, as a structure for radiating heat from a semiconductor package, a structure using a heat sink or a heat radiating plate fixed to a housing of an electronic device as a heat radiating member is known. When applying such a heat dissipation structure to heat dissipation of bare chips,
For example, a heat sink is placed on a bare chip surface-mounted on a printed wiring board via a heat conductive material made of sheet-like resin, and the ends of the heat sink are fixed to the printed wiring board using bolts and nuts. Structure,
Alternatively, a structure in which a heat dissipation plate is placed on the upper surface of the bare chip via a heat conductive material and the heat dissipation plate is fixed to the housing of the electronic device can be considered.

[0005]

However, as described above, since the bare chip has a large amount of heat generation and is weak against external pressure, the above-described heat dissipation structure
The bare chip may not be sufficiently dissipated and the bare chip may be damaged.

That is, the heat conductive material is formed of a sheet-shaped resin and has a function of transmitting the heat generated from the bare chip to the heat radiating member and a function of relieving the impact and pressure acting on the bare chip from the heat radiating member. However, since it is a resin, its thermal conductivity is low, and the amount of heat transfer from the bare chip to the heat dissipation member is small. Therefore, a sufficient heat radiation effect cannot be obtained,
There is a problem that the bare chip malfunctions due to heat.

Further, when a heat sink is used as the heat dissipation member, the bare chip is sandwiched between the heat sink and the printed circuit board. Therefore, if the bolt for fixing the end of the heat sink is strongly tightened, the heat conductive material is interposed. As a result, the bare chip may be pressed and the soldered portion of the bare chip may be damaged. On the contrary, if the bolts are not tightened sufficiently, problems such as instability of the heat sink may occur. The present invention has been made in view of the above problems, and an object thereof is to provide a heat dissipation device that can efficiently dissipate heat without damaging a semiconductor chip.

[0008]

In order to achieve the above object, the heat dissipation device of the present invention according to claim 1 is a heat dissipation device which dissipates heat generated from a semiconductor chip mounted on a printed circuit board. A heat conductive member provided on the chip in contact with the heat conductive member; and a heat radiating member provided on the semiconductor chip with the heat conductive member interposed therebetween, wherein the heat conductive member has an elastic core material, and And a heat conductive metal layer covering the outer surface of the core material.

According to a second aspect of the present invention, there is provided a heat dissipation device for dissipating heat generated from a semiconductor chip mounted on a printed circuit board, wherein the heat dissipation member is provided in contact with the semiconductor chip. A heat dissipation member provided on the semiconductor chip with the heat conduction member interposed therebetween, wherein the heat conduction member has an elastic core member and a heat conductive metal wire wound around an outer surface of the core member. It is characterized by having and.

According to the heat dissipation device having the above-described structure, since the heat conducting member is configured to have the heat conducting metal layer or the heat conducting metal wire, the heat conductivity is significantly improved and the semiconductor chip is The generated heat is efficiently transmitted to the heat dissipation member. This improves the heat dissipation effect of the semiconductor chip.

Further, since the core material of the heat conducting member has elasticity, it is elastically deformed when an external pressure or impact is applied when the heat radiating member is mounted on the semiconductor chip, and these external pressures acting on the semiconductor chip are applied. Relieves shock. Similarly, the heat conducting member relieves the external pressure acting on the semiconductor chip from the heat radiating member due to an assembly error or the like. This makes it possible to prevent damage to the semiconductor chip itself and damage to the soldered portion of the semiconductor chip.

According to a third aspect of the present invention, there is provided a heat dissipation device for dissipating heat generated from a semiconductor chip mounted on a printed circuit board, wherein the heat dissipation member is provided in contact with the semiconductor chip. A heat dissipation member provided on the semiconductor chip with the heat conduction member sandwiched therebetween, wherein the heat conduction member has a core material having elasticity, respectively.
It is characterized in that the heat conductive metal layer covering the outer surface of the core material and a plurality of rod-like bodies that are provided are connected in parallel to each other to form a sheet.

According to a fourth aspect of the present invention, there is provided a heat dissipation device for dissipating heat generated from a semiconductor chip mounted on a printed circuit board, the heat dissipation member being provided in contact with the semiconductor chip. A heat dissipation member provided on the semiconductor chip with the heat conduction member sandwiched therebetween, wherein the heat conduction member has a core material having elasticity, respectively.
It is characterized in that the heat conductive metal wire wound around the outer surface of the core material and a plurality of rod-shaped bodies that the core material has are connected in parallel to each other to form a sheet.

According to a seventh aspect of the present invention, there is provided a heat dissipation device for dissipating heat generated from a semiconductor chip mounted on a printed circuit board, wherein the heat dissipation member is provided in contact with the semiconductor chip. A heat dissipating member provided on the semiconductor chip with the heat conducting member sandwiched therebetween, wherein the heat conducting member comprises a base layer formed of an elastic material and a heat conducting metal laminated on the base layer. It is characterized in that a plurality of rod-shaped bodies formed by winding a laminated sheet having a layer so that the heat conductive metal layer is on the outside are connected in parallel to each other to form a sheet.

According to an eighth aspect of the present invention, there is provided a heat dissipation device for dissipating heat generated from a semiconductor chip mounted on a printed circuit board, wherein the heat dissipation member is provided in contact with the semiconductor chip. A heat-dissipating member provided on the semiconductor chip with the heat-conducting member sandwiched therebetween, wherein the heat-conducting member has a sheet-shaped core material having a large number of through holes and having elasticity; And a heat conductive metal layer covering the outer surface of the core material and the inside of the through hole.

According to the heat dissipation device configured as described above, the heat conducting member is configured to include the heat conducting metal layer or the heat conducting metal wire and the elastic core material or the base layer. Therefore, similarly to the heat dissipation device according to the first and second aspects, it is possible to improve the heat dissipation efficiency and reduce the external pressure and impact acting on the semiconductor chip.

Further, by constituting the heat conducting member by a plurality of rod-shaped bodies, the ratio of the heat conducting metal layer or the heat conducting metal wire increases, and the heat conductivity further improves. Similarly, by forming a large number of through holes in the core material and covering the inner surfaces of these through holes with a heat conductive layer, the proportion of the heat conductive metal layer is increased and the thermal conductivity is further improved.

[0018]

DETAILED DESCRIPTION OF THE INVENTION A heat dissipation device according to an embodiment of the present invention will be described in detail below with reference to the drawings. As shown in FIG. 1, on the printed circuit board 10,
A bare chip 12 is surface-mounted as a semiconductor chip. The bare chip 12 is formed in a substantially rectangular shape, and has a mounting surface 12a on which a plurality of electrodes (not shown) are provided, and a flat upper surface 12b facing in parallel with the mounting surface.
The bare chip 12 is mounted with the mounting surface 12a facing the printed circuit board 10, and its electrodes are soldered to pads (not shown) of the printed circuit board 10.

The heat dissipation device 14 for dissipating heat generated from the bare chip 12 has a heat conducting member 16 provided in contact with the upper surface 12b of the bare chip 12 and a heat sink 18 provided on the heat conducting member 16 as a heat dissipation member. And are provided.

As shown in FIGS. 2 and 3, the heat conducting member 16 is formed in a sheet shape as a whole by connecting a plurality of rod-shaped bodies 20 in parallel with each other. Each rod-shaped body 20 has a columnar core material 21 formed of a material having elasticity and cushioning property such as rubber or synthetic resin, and the entire outer surface of the core material 21 is made of copper having a high thermal conductivity.
Thermally conductive metal layer 22 made of metal such as silver or aluminum
Covered by Further, the entire outer surface of the metal layer 22 is covered with an insulating layer 24 made of a heat conductive insulating material such as heat conductive polyimide. The metal layer 22 and the insulating layer 24 are formed by plating, for example.

The rod-shaped body 20 having the above structure is
The outer peripheral surfaces are connected in parallel with each other in contact with each other to form a sheet-shaped heat conduction member 16. The rod-shaped bodies 20 are connected to each other by an epoxy adhesive, for example.

On the other hand, the heat sink 18, as shown in FIGS. 1 and 2, has a rectangular plate-shaped base 26 and a base 26.
And a large number of heat dissipation pins 28 provided upright on the upper surface of the. Further, through holes 30 for fixing are formed at four corners of the base 26.

The heat-conducting member 16 and the heat sink 18 having the above-mentioned constitutions are two fixing jigs 3 which function as fixing means.
It is fixed to the printed circuit board 10 by using 4. Each fixing jig 34 includes a pair of support posts 36 that are parallel to each other.
And a connecting rod 38 connecting these support posts,
And is integrally formed. Then, one fixing jig 34 is attached to the heat conducting member 16 in a state where the connecting rod 38 is coaxially inserted into the rod-shaped body 20 on one end side of the heat conducting member 16, and the other fixing jig 34 is a heat conducting member. The connecting rod 38 is coaxially inserted into the rod-shaped body 20 on the other end side of the conductive member 16 and is attached to the heat conductive member 16.

The upper end and the lower end of each support post 36 of the fixed shaft 34 are threaded, and the upper end screw part 36, respectively.
a and the lower end threaded portion 36b. Further, each support post 36 integrally includes a flange-shaped upper stopper 40a and a lower stopper 40b. The upper stopper 40a and the lower stopper 40b are the first and second stoppers.
Each function as a stopper.

The upper stopper 40a is provided at a position slightly lower than the upper surface of the heat conducting member 16, and the lower stopper 4a.
0b is provided at a predetermined distance d from the upper stopper 40a. The predetermined distance d is equal to the heat conducting member 16
Is approximately equal to or slightly smaller than the sum of the thickness of the bare chip 12 and the thickness of the bare chip 12.

The heat conducting member 16 and the heat sink 18 are attached to the printed circuit board 10 by using the fixing jig 34 having the above structure.
In the case of fixing to the base 26, first, the upper end screw portion 36a of each support post 36 is inserted into the through hole 30 formed in the base 26 of the heat sink 18 from the lower surface side of the base 26, and the upper end screw portion 36a of the base 26 is inserted. The nut 45 is screwed in from the upper surface side. As a result, the base 26 of the heat sink 18 is sandwiched between the upper stopper 40a and the nut 45, and each support post 36 is fixed in a state substantially vertical to the base 26.

When the heat sink 18 is attached to the fixing jig 34 as described above, the upper stopper 40a of each support post 36 is provided at a position slightly lower than the upper surface of the heat conducting member 16, so The lower surface of the base 26 of 18 surely contacts the upper surface of the heat conducting member 16,
In addition, the heat conduction member 16 is brought into close contact with the lower surface of the base 26 by the elastic deformation of the core material 21 of each rod-shaped body 20 slightly.

Next, the lower end screw portion 36 of each support post 36
b is inserted into the through hole 44 formed in the printed circuit board 10 from the upper surface side of the printed circuit board.
The nut 46 is screwed into b from the lower surface side of the printed circuit board 10. As a result, the lower stopper 40b and the nut 46
The printed circuit board 10 is sandwiched between and, and each support post 36 is fixed in a state substantially vertical to the printed circuit board 10.

Through the above steps, the heat conducting member 16 and the heat sink 18 are attached and fixed to the printed circuit board 10 by the pair of fixing jigs 34. When installed,
Upper and lower stoppers 40a, 4 of each support post 36
Since the distance between 0b is set to a predetermined distance d, the lower surface of the heat conducting member 16 is brought into close contact with the upper surface 12b of the bare chip 12 in a slightly elastically deformed state.

Further, since the upper and lower stoppers 40a and 40b of the support post 36 are provided between the heat sink 18 and the printed circuit board 10, the heat sink 1 can be tightened even when the nuts 45 and 46 are strongly tightened.
8 and the heat conduction member 16 are not excessively pressed against the bare chip 12, and the heat conduction member 16 is attached to the bare chip 12 in a state of being appropriately pressed.

According to the heat dissipation device 14 configured as described above, the heat generated from the bare chip 12 during operation passes through the heat conductive metal layer 22 of the heat conductive member 16 to the heat sink 1
8 and is radiated to the outside air by this heat sink 18. Here, since the metal layer 22 of each rod-shaped body 20 of the heat conducting member 16 has a very high heat conductivity as compared with synthetic resin or the like, the heat conductivity of the heat conducting member 16 is the same as that of a conventional synthetic resin. Significantly improved compared to a heat conductive member made of rubber or the like. Therefore, the heat generated from the bare chip 12 can be efficiently transmitted to the heat sink 18 by the heat conducting member 16 and high heat dissipation can be obtained.

Further, in the present embodiment, since the heat conducting member 16 is composed of the plurality of rod-shaped bodies 20 covered with the heat conducting metal layer 21, the volume occupied by the heat conducting metal layer 21 is small. Large, especially bare chip 1
The volume of the metal layer 21 extending from the upper surface 12a to the lower surface of the heat sink 18 can be sufficiently secured, and the heat of the bare chip 12 can be efficiently transferred to the heat sink 18. Therefore, the heat of the bare chip 12 can be radiated more efficiently.

Further, according to the heat dissipation device 14 having the above structure,
Each rod-shaped body 20 of the heat conductive member 16 has a core material 2 having elasticity.
1, the heat dissipation device 14 is provided on the bare chip 12.
When subjected to an external pressure or other impact when mounting, it is elastically deformed, and these external pressure and impact acting on the bare chip 12 are relieved. Similarly, the heat conducting member 16 can relieve the external pressure acting on the bare chip 12 from the heat sink 18 due to an assembly error or the like. Therefore, it is possible to prevent damage to the bare chip 12 itself and damage to the soldering portion 13 of the bare chip.

Further, the fixing jig 24 for attaching the heat conducting member 16 and the heat sink 18 to the bare chip 12 at a predetermined position is provided with a support post 36, which is provided with the printed circuit board 10 and the heat sink 18.
Upper and lower stoppers 40a, 40 located between
b and the upper and lower threaded portions 36 functioning as bolts
a and 36b are integrally formed. Therefore, assemblability is significantly improved as compared with the conventional case where separate nuts, bolts and spacers are used.

Further, even when the nuts 45 and 46 are strongly tightened, the heat conducting member 16 and the heat sink 18 can be fixedly held at a predetermined position with respect to the bare chip 12, and an excessive load acts on the bare chip 12. It is possible to prevent the damage of the bare chip. Therefore, it is not necessary to pay particular attention to the tightening force of the nut during assembly, and the assembly is facilitated, and the heat dissipation device 14 can be stably fixed to the printed circuit board 10 with sufficient tightening force.

In the heat conducting member 16 of the heat dissipation device 14 described above, each rod-shaped body 20 is not limited to a columnar shape, but may be formed in another shape. According to the embodiment shown in FIG. 4, each rod-shaped body 20 of the heat-conducting member 16 has a quadrangular prism-shaped core member 21, and the heat-conductive metal layer 22 and the insulating layer are provided so as to cover the outer surface of the core member. 24 are formed in order.

Even when the heat conducting member 16 configured as described above is used, it is possible to obtain the same effect as that of the above-described embodiment. Further, according to the embodiment shown in FIG.
Each rod-shaped body 20 constituting the heat conduction member 16 is made of synthetic resin,
Base layer 5 formed of elastic material such as rubber
0 and a heat conductive metal layer 52 laminated on the base layer 50 are wound in a naruto shape so that the heat conductive metal layer 50 is on the outside. The entire outer surface of the rod-shaped body 20 is covered with the insulating layer 24.

Even when the heat conducting member 16 configured as described above is used, it is possible to obtain the same effects as those of the above-described embodiment. Further, according to the present embodiment, the rod-shaped body 20 can be formed only by rolling the laminated sheet 54, and the heat conductive member 16 can be easily manufactured.

According to the embodiment shown in FIG. 6, each rod-shaped body 20 constituting the heat conducting member 16 is formed by using the heat conducting metal wire 56 instead of the heat conducting metal layer. That is, each rod-shaped body 20 has a columnar core material 21 and a core material 21.
And a heat conductive metal wire 56 spirally wound around the outer peripheral surface of the core material 21 at a predetermined pitch, and the outer surface of the core material 21 and the whole heat conductive metal wire 56 are covered with the insulating layer 24. The materials used for the core material 21 and the heat conductive metal wire 56 are the same as those in the above-described embodiment.

Even if the heat conducting member 16 is constructed by using the rod-like body 20 as described above, the same operational effect as that of the above-described embodiment can be obtained. Further, FIG. 7 shows an embodiment in which the heat conducting member 16 is configured by using one sheet-shaped core material. That is, the core material 21 is made of a rectangular sheet having elasticity such as synthetic resin and rubber, and a large number of through holes 60 are provided over the entire surface thereof.
Are formed. The outer surface of the core material 21 and the inner surface of each through hole 60 are covered with a heat conductive metal layer 22 made of a metal having high heat conductivity such as copper, silver and aluminum. Further, the outer surface of the heat conductive metal layer 21 is covered with the insulating layer 22.

Even when the heat conducting member 16 configured as described above is used, the heat generated from the bare chip 12 can be efficiently dissipated and the external pressure acting on the bare chip 12 can be efficiently achieved as in the above-described embodiment. It is also possible to absorb the impact and prevent damage to the bare chip.

Even when the heat conducting member 16 shown in FIGS. 4 to 7 is used, the heat dissipation device 14 can be constructed by using the heat sink 18 and the fixing jig 34 shown in the above-described embodiment. The detailed description of the heat sink and the fixing jig is omitted.

The heat dissipation member of the heat dissipation device 14 is not limited to the heat sink 18 described above, but a heat dissipation plate 62 may be used as shown in FIGS. 8 and 9. The heat dissipation plate 62 is fixed to a housing 66 of an electronic device that functions as a support, is arranged in parallel with the printed circuit board 10, and its lower surface is in contact with the upper surface of the heat conducting member 16. Also,
As the heat conducting member 16 of the heat dissipation device 14, the one shown in any of the above-described embodiments is used.

On the other hand, each fixing jig 34 for fixing the heat conducting member 16 to the printed circuit board 10 is configured by omitting the portion to which the heat sink is attached, as compared with the above-described embodiments. That is, the support post 36 of each fixing jig 34 is formed by removing the upper end screw part and the upper stopper and only including the lower end screw part 36b and the lower stopper 40b, and the upper ends of the pair of support posts 36 are
They are connected by a connecting rod 38. The distance between the connecting rod 38 of the support post 36 and the lower stopper 40b is set to a predetermined value corresponding to the thickness of the bare chip 12.

The heat conducting member 16 is fixed to the fixing jig 34.
The lower end screw portion 36b of each of the support posts 36 is inserted into the through hole 44 of the printed circuit board 10 from above, and the nut 46 is screwed into the lower end screw portion 36b from the lower surface side of the printed circuit board 10. Attached and fixed. In the attached state, the heat conducting member 1
The bottom surface of 6 is bare chip 12 with a slight elastic deformation.
Is in contact with the upper surface 12b.

The other structure of the heat dissipation device 14 is the same as that of the above-mentioned embodiment using the heat sink, and the same parts are designated by the same reference numerals and their detailed description will be omitted.

Even when the heat radiating plate 62 is used as the heat radiating member as in the present embodiment, the heat generated from the bare chip 12 is transferred to the heat conducting member 16 as in the various embodiments described above.
The heat can be efficiently conducted to the heat radiating plate 62 via the, and heat can be sufficiently radiated from the heat radiating plate 62. Further, since the heat conducting member 16 has elasticity, the heat dissipation plate 62 can be removed from the bare chip 12
It is possible to reduce the external pressure and impact acting on the bare chip 12, and prevent the bare chip 12 from being damaged.

Further, each support post 36 of the fixing jig 34 is attached to the upper surface of the printed circuit board 10 by the lower stopper 4
0b, the heat conducting member 16 is attached to the bare chip 12 at a predetermined position. For example, even if the nut 46 is excessively tightened, the bare chip 12 is not tightened.
It is possible to prevent an excessive load from acting on the heat dissipation device 14 and to improve the assemblability of the heat dissipation device 14. As the heat dissipation plate 62, it is possible to use a part of the housing 66 of the electronic device, or a shield plate of a keyboard attached to the housing.

[0049]

As described in detail above, according to the present invention, a heat conducting member is formed by combining a metal layer or a metal wire having a high heat conductivity with an elastic core material or base. It is possible to provide a heat dissipation device that can efficiently dissipate heat generated from a semiconductor chip without damaging the semiconductor chip.

[Brief description of drawings]

FIG. 1 is a side view showing a heat dissipation device and a bare chip dissipating heat by the heat dissipation device according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view of the heat dissipation device.

FIG. 3 is a cross-sectional view showing a part of a heat conduction member of the heat dissipation device.

FIG. 4 is a sectional view showing a part of a heat conducting member according to another embodiment of the present invention.

FIG. 5 is a sectional view showing a part of a heat conducting member according to still another embodiment of the present invention.

FIG. 6 is a perspective view showing a part of a heat conducting member according to still another embodiment of the present invention.

FIG. 7 is a perspective view showing an embodiment of a heat conducting member provided with a sheet-shaped core material.

FIG. 8 is a side view showing a heat dissipation device including a heat dissipation plate according to another embodiment of the present invention and a bare chip dissipated by the heat dissipation device.

9 is an exploded perspective view showing a heat conducting member and a fixing jig of the heat dissipation device shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Printed circuit board 12 ... Bare chip 14 ... Heat dissipation device 16 ... Heat conduction member 18 ... Heat sink 20 ... Rod 21 ... Core material 22 ... Heat conductive metal layer 24 ... Insulation layer 34 ... Fixing jig 36 ... Support post 50 ... Base layer 52 ... Thermally conductive metal layer 54 ... Laminated sheet 60 ... Through hole 62 ... Heat sink

Claims (16)

[Claims] 1. A heat dissipation device for dissipating heat generated from a semiconductor chip mounted on a printed circuit board, wherein a heat conducting member provided in contact with the semiconductor chip and the heat conducting member are sandwiched therebetween. A heat dissipation member provided on a semiconductor chip, wherein the heat conducting member includes an elastic core material and a heat conductive metal layer covering an outer surface of the core material, A heat dissipation device. 2. A heat dissipation device for dissipating heat generated from a semiconductor chip mounted on a printed circuit board, wherein a heat conducting member provided in contact with the semiconductor chip and the heat conducting member are sandwiched therebetween. A heat dissipating member provided on the semiconductor chip, wherein the heat conducting member comprises an elastic core material and a metal wire having thermal conductivity wound around the outer surface of the core material. A heat dissipation device characterized by. 3. A heat dissipation device for dissipating heat generated from a semiconductor chip mounted on a printed circuit board, wherein a heat conducting member provided in contact with the semiconductor chip and the heat conducting member are sandwiched therebetween. A heat dissipation member provided on a semiconductor chip, wherein the heat conducting member has a plurality of rod-shaped bodies each having an elastic core material and a heat conductive metal layer coating the outer surface of the core material. A heat dissipation device, which is formed in a sheet shape by connecting in parallel. 4. A heat dissipation device for dissipating heat generated from a semiconductor chip mounted on a printed circuit board, wherein a heat conducting member provided in contact with the semiconductor chip and the heat conducting member are sandwiched therebetween. A heat dissipating member provided on a semiconductor chip, wherein the heat conducting member has a plurality of rod-shaped bodies each having an elastic core material and a heat conductive metal wire wound around the outer surface of the core material. A heat dissipation device, wherein the heat dissipation device is formed in a sheet shape by connecting in parallel with each other. 5. The heat dissipation device according to claim 3, wherein the core material is formed in a cylindrical shape. 6. The heat dissipation device according to claim 3, wherein the core member is formed in a prismatic shape. 7. A heat dissipation device for dissipating heat generated from a semiconductor chip mounted on a printed circuit board, wherein a heat conducting member provided in contact with the semiconductor chip and the semiconductor with the heat conducting member interposed therebetween. A heat dissipating member provided on the chip, wherein the heat conducting member is a laminated sheet having a base layer formed of an elastic material and a heat conducting metal layer laminated on the base layer. A heat-dissipating device, characterized in that a plurality of rod-shaped bodies formed by winding so that the conductive metal layer is on the outer side are connected in parallel to each other to form a sheet. 8. A heat dissipation device for dissipating heat generated from a semiconductor chip mounted on a printed circuit board, the heat conducting member provided in contact with the semiconductor chip, and the semiconductor device sandwiching the heat conducting member. A heat-dissipating member provided on a chip, wherein the heat-conducting member includes a sheet-shaped core member having a large number of through holes and having elasticity, and an outer surface of the core member and the inside of the through holes. A heat dissipation device, comprising: a heat conductive metal layer that is coated. 9. The heat dissipating member comprises a heat sink provided in contact with the heat conducting member, and fixing means for fixing the heat sink to the printed circuit board. 9. The heat dissipation device according to any one of items 8 to 8. 10. The fixing means comprises a plurality of support posts extending substantially perpendicularly to the printed circuit board, each support post being inserted into the one end screw portion inserted in the heat sink and the printed wiring board. And a first stopper and a second stopper that are located between the heat sink and the printed circuit board and are spaced apart from each other by a predetermined distance and are in contact with the heat sink and the printed circuit board, respectively. The fixing means is screwed into the threaded portion at one end, and the first portion is fixed.
A first nut sandwiching the heat sink between the second heat sink and the second stopper and a second nut sandwiched between the second stopper and the second end. The heat dissipation device according to claim 9, further comprising: 11. The fixing means includes a connecting rod which extends through the heat conducting member and which is connected to the support post and supports the heat conducting member. The heat dissipation device described in. 12. The heat dissipating member comprises a heat dissipating plate which is provided in contact with the heat conducting member and is fixed to a support. The heat dissipation device according to the item. 13. A fixing means for supporting the heat conducting member on the printed circuit board, wherein the fixing means includes a plurality of support posts extending substantially perpendicular to the printed circuit board, and the heat conducting member. A connecting rod extending through the connecting post and connected to one end of the support post; each support post includes the other end screw part inserted into the printed wiring board, the one end and the other end screw part. A stopper that is located between and is in contact with the printed circuit board, and the fixing means is a nut that is screwed into the other end screw portion and that holds the printed circuit board between the stopper and the nut. The heat dissipation device according to claim 12, further comprising: 14. The heat dissipation device according to claim 1, wherein the heat conducting member is provided with an insulating layer covering the heat conducting metal layer. . 15. The heat dissipation device according to claim 2, wherein the heat conducting member includes an insulating layer that covers the metal wire. 16. The semiconductor chip is a substantially rectangular bare lip having a mounting surface having an electrode soldered to the printed wiring board and an upper surface in contact with the heat conducting member. 16. The heat dissipation device according to any one of 1 to 15.