JP2002217343A - Electronic device - Google Patents

Electronic device

Info

Publication number
JP2002217343A
JP2002217343A JP2001008113A JP2001008113A JP2002217343A JP 2002217343 A JP2002217343 A JP 2002217343A JP 2001008113 A JP2001008113 A JP 2001008113A JP 2001008113 A JP2001008113 A JP 2001008113A JP 2002217343 A JP2002217343 A JP 2002217343A
Authority
JP
Japan
Prior art keywords
heat
substrate
electronic device
power transistor
heat radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001008113A
Other languages
Japanese (ja)
Inventor
Tadao Furukawa
Yutaka Obikane
忠男 古川
豊 帯金
Original Assignee
Denso Corp
株式会社デンソー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp, 株式会社デンソー filed Critical Denso Corp
Priority to JP2001008113A priority Critical patent/JP2002217343A/en
Publication of JP2002217343A publication Critical patent/JP2002217343A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049Pressing means used to urge contact, e.g. springs
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401Disposition
    • H01L2224/40135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/40137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401Disposition
    • H01L2224/40135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/40137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/40139Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous strap daisy chain
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/842Applying energy for connecting
    • H01L2224/84201Compression bonding
    • H01L2224/84203Thermocompression bonding
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301Thyristor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

Abstract

(57) Abstract: An electronic device (1) that radiates heat generated by a power transistor (heat generating element) mounted at an arbitrary position on a substrate (2) to a case (5) through a heat radiating member (4). I will provide a. A power transistor (3) is provided by a heat radiating member (4).
Was pressed and fixed to the substrate 2, and a part of the heat radiation member 4 was brought into contact with the case 5. Further, the heat radiating member 4 is held on the substrate 2, and a heat radiating sheet 7 (radiation promoting means) is provided between the heat radiating member 4 and the power transistor 3. Thus, the heat generated by the power transistor 3 mounted at an arbitrary position on the substrate 2 can be reliably and efficiently radiated to the case 5 while the workability is improved by simple means that does not require screw tightening or the like. .

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device in which a substrate on which a plurality of electronic components including a heating element are mounted is housed in a housing.

[0002]

2. Description of the Related Art Conventionally, there are known several techniques for dissipating heat from a heating element (for example, a power element such as a power transistor or a power IC) housed in an electronic device to the outside of a housing. A heat-dissipating member (a metal having good thermal conductivity such as aluminum) is attached to a heat-generating element mounted on a substrate, or the heat-generating element is directly attached to a housing. However, in the former case, since the heat radiating member is not in contact with the housing, the heat transfer from the heat radiating member to the housing must be performed by natural convection heat transfer, and the amount of heat radiated from the heat generating element is limited. In the latter, although the amount of heat radiation from the heating element can be increased, the terminals of the heating element and the substrate are electrically connected by lead wires, so that the number of steps for assembling the electronic device increases and the cost increases. Further, since the heating element is attached to the housing, there is a problem that the arrangement of other electronic components on the substrate is limited. Further, in any of the methods, the fixing of the heating element to the heat radiating member or the housing is performed by screwing, so that the number of assembling steps increases.

On the other hand, in the invention disclosed in Japanese Patent Application Laid-Open No. 6-507049, a heat conductive layer is provided on the surface of a substrate on which a heating element is mounted, and the heating element is brought into contact with the heat conduction layer. The substrate is fixed to the housing while the conductive layer is in contact with the housing. Thereby, heat from the heating element moves to the housing via the heat conductive layer on the substrate, and is radiated to the outside of the housing.

[0004]

In this case, the heat conductive layer utilizes a copper foil laid on a substrate for forming an electric circuit. Since this copper foil thickness is usually as thin as tens of microns,
In order to increase the amount of heat radiation, it is necessary to increase the width or thickness of the copper foil as the heat conductive layer. Increasing the width reduces the mounting space for other electronic components on the board,
There is a problem that an increase in thickness involves an increase in the cost of the substrate. Further, in order to effectively dissipate heat, it is necessary to reduce the length of the copper foil, that is, to mount a heating element on an outer peripheral portion of the substrate closest to the housing. For this reason, the location of the heating element on the substrate is limited, and there is also a problem that the degree of freedom in designing the substrate is reduced.

The present invention has been made in view of the above points, and an object of the present invention is to generate heat generated by a heating element mounted at an arbitrary position on a substrate by pressing the heating element and partially fixing the heat. An object of the present invention is to provide an electronic device capable of dissipating heat to a housing via a heat dissipating member that contacts the housing.

[0006]

In order to achieve the above object, the present invention employs the following technical means.

An electronic device according to a first aspect of the present invention includes a substrate on which a plurality of electronic components including a heating element are mounted, a housing for housing the substrate and having heat conductivity, and a housing for generating heat generated by the heating element. A heat dissipating member for conducting the heat to the body is provided, and the heat dissipating member presses and fixes the heat generating element to the substrate and makes a part of the heat dissipating member contact the housing. As a result, heat generated by the heating element mounted at an arbitrary position on the substrate is
Heat can be reliably dissipated to the housing via the heat dissipating member.
In this case, if the heat radiating member is held on the substrate, the positional relationship between the heat generating element and the heat radiating member can be easily and accurately maintained during the assembling work of the electronic device.
Productivity can be improved. Further, when a heat conduction promoting member for increasing the contact area with the heat generating element is provided between the heat radiating member and the heat generating element, the heat generated by the heat generating element can be efficiently transmitted to the heat radiating member. it can.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on an embodiment shown in the drawings. In each drawing, the same components are denoted by the same reference numerals.

FIG. 1 is a sectional view of an electronic device 1 according to one embodiment of the present invention.

The electronic device 1 includes a substrate 2 on which a resin-molded power transistor 3 (heating element) and a plurality of electronic components (not shown) are mounted in a housing formed by a case 5 and a cover 6. It is housed and configured.

The substrate 2 has a power transistor 3 and a plurality of electric components (for example, a resistor, a capacitor, an IC,
etc. (Not shown)) to constitute an electric circuit that performs a predetermined function when power is supplied. Further, the heat radiating member 4 is held in a state of being in contact with the power transistor 3. As shown in FIG.
Are mounted on both sides of the substrate 2.

The heat radiating member 4 is formed by pressing a metal having good thermal conductivity such as copper. FIG.
2 shows the shape before and after assembling. The solid line indicates the shape after assembly to the electronic device 1, and the broken line indicates the shape before assembly. When the heat radiating member 4 is assembled to the electronic device 1, as shown in FIG. 2, the contact portion 4 a and the contact portion 4 b generate a pressing force against the power transistor 3 and the inner wall 5 a of the case 5, respectively. Contact. Thereby, heat conduction from the power transistor 3 to the heat dissipation member 4 and from the heat dissipation member 4 to the case 5 are reliably performed.

The heat radiation sheet 7 as a heat radiation promotion member is made of a flexible polymer material having good thermal conductivity and electrical insulation, and is disposed between the heat radiation member 4 and the power transistor 3. Thereby, in the contact portion between the power transistor 3 and the heat radiating member 4, minute irregularities on both surfaces are filled with the heat radiating sheet, and the actual contact area effective for heat conduction can be increased to improve heat radiation.

The case 5 is made of a material having good thermal conductivity, for example, aluminum die-cast. The case 5 is provided with a boss 5 b for fixing the substrate 2, and the substrate 2 is fixed via bolts 8.

The cover 6 is also formed by pressing a material having good thermal conductivity, for example, an aluminum plate. The cover 6 is fixed to the case 5 and forms a housing of the electronic device 1.

Next, a method of assembling the electronic device 1 according to one embodiment of the present invention will be described.

FIG. 3 is an exploded perspective view of components constituting a main part of the electronic device 1 according to the first embodiment.

The power transistor 3 and a plurality of electric components are already mounted on the substrate 2. A heat radiation sheet 7 is placed on the surface of the power transistor 3 on the substrate 2 opposite to the surface of the substrate 2.

Next, as shown in FIG. 3, the projection 4d of the heat radiating member 4 is inserted into the hole 2a of the substrate 2, and while the heat radiating sheet 7 on the power transistor 3 is pressed by the contact portion 4a, the regulating portion 4c is Contact 2 Subsequently, when the protrusion 4 d protruding to the rear side of the substrate 2 is bent as shown in FIG. 1, the heat radiation member 4 is held by the substrate 2. At this time, the contact portion 4a is elastically deformed, and the contact portion 4a presses the power transistor 3 via the heat radiation sheet 7 by the elastic force. The heat-dissipating sheet 7 is deformed by this pressing force, and the unevenness of the contact surface between the heat-dissipating member 4 and the power transistor 3 is filled, so that the contact area can be increased and the heat radiation amount can be increased. Also,
The amount of elastic deformation of the contact portion 4a is regulated by the contact of the regulating portion 4c with the substrate 2. In other words, the pressing force of the heat radiating member 4 on the power transistor 3 becomes a predetermined magnitude.
The shapes of the contact portion 4a and the regulating portion 4c are set.
This can prevent the power transistor 3 from being damaged due to excessive pressing force.

Next, the board 2 on which the heat radiating member 4 has been mounted is fixed to the case 5 via bolts 8. At this time, the heat radiating member 4 on the upper surface side of the substrate 2 is elastically deformed, and the contact portion 4b is pressed against the inner wall 5a of the case 5 by the elastic force. Finally, when the cover 6 is fixed to the case 5, the substrate 2
The heat dissipating member 4 on the lower surface side of the cover 6 is elastically deformed, and the contact portion 4b is pressed against the inner wall 6a of the cover 6 by the elastic force. Thus, the assembly of the electronic device 1 is completed.

Here, in order to obtain a sufficient heat radiating effect, it is desirable that the housing for radiating the heat generated by the power transistor 3 through the heat radiating member 4 has good thermal conductivity and large heat capacity. In the electronic device 1 according to one embodiment of the present invention, the case 5 is made of aluminum die-cast, and the cover 6 is made of aluminum plate, and the heat radiation of the case 5 is larger than that of the cover 6. On the other hand, heat generated by the power transistor 3 mounted on the upper surface of the substrate 2 is radiated to the case 5 and
The heat generated by the power transistor 3 mounted on the lower surface of the device is radiated to the cover 6. In the electronic device 1 according to the embodiment of the present invention, the amount of heat generated on the upper surface and the lower surface of the substrate 2 is matched with the amount of heat radiated from the case 5 and the cover 6 so that the power transistor 3 during operation of the electronic device 1 is adjusted. Of the power transistor 3 is determined so that the temperature does not exceed the allowable value.

In the electronic device 1 according to the embodiment of the present invention described above, the heat radiating member 4 is provided.
The surface of the power transistor 3 opposite to the substrate 2 and the inner wall 5a of the case 5 are brought into pressure contact with the elastic deformation force of the heat radiating member 4. Thus, heat from the power transistor 3 mounted at an arbitrary position on the substrate 2 can be reliably radiated to the case 5 by simple means that does not require screwing or the like. The area occupied by the heat radiating member 4 on the substrate 2 is substantially the same as the area occupied by the power transistor 3. Therefore, the space on the substrate 2 can be effectively used for electric circuits.

Since the heat radiating member 4 is held by the substrate 2, the heat radiating member 4 is held at a predetermined position during the assembling work of the electronic device 1, so that the workability can be improved.

Further, a heat radiating sheet 7 is provided between the heat radiating member 4 and the power transistor 3. The heat-dissipating sheet 7 is deformed by the pressing force of the heat-dissipating member 4, and the unevenness of the contact surface between the heat-dissipating member 4 and the power transistor 3 is filled, so that the contact area can be increased and the heat radiation amount can be increased.

Next, a modification of the electronic device 1 according to the embodiment of the present invention described above will be described.

FIG. 4 is a sectional view of a first modification of the electronic device 1 according to one embodiment of the present invention. In the first modified example, the shape of the heat radiation member 4 is changed from that of the above-described embodiment. That is, the contact portion 4 b of the heat radiation member 4 is in press contact with the inner peripheral wall surface (inner surface) of the case 5. Also in this case, the same effect as that of the embodiment can be obtained with respect to heat dissipation of the power transistor 3.

FIG. 5 is a sectional view of a second modification of the electronic device 1 according to one embodiment of the present invention. The second modification is also one in which the shape of the heat radiating member 4 is changed from the above-described embodiment. That is, the contact portion 4b of the heat radiation member 4 is
b and the substrate 2, and by fixing the bolt 8, the fixing of the substrate 2 and the contact of the heat radiation member 4 to the case 5 are simultaneously performed. Also in this case, the same effect as that of the embodiment can be obtained with respect to heat dissipation of the heat generated by the power transistor 3.

FIG. 6 is a sectional view of a third modification of the electronic device 1 according to one embodiment of the present invention. The third modification is also one in which the shape of the heat radiating member 4 is changed from the above-described embodiment. In the third modification, the substrate 2 includes a case 5 and a cover 6.
And is fixed to the case 5 together with the cover 6. As shown in FIG. 6, the contact portion 4 b of the heat radiating member 4 is inserted between the case 5 and the substrate 2, is fixed to the case 5 by fastening together with the cover 6 and the substrate 2, and contacts the case 5. ing. Also in this case, the same effect as that of the embodiment can be obtained with respect to heat dissipation of the power transistor 3.

In the above-described electronic device 1 according to the embodiment of the present invention and its modification, the heating element is the power transistor 3, but is not limited to this, and may be a thyristor, an integrated circuit, or the like. Is also good.

Further, in the electronic device 1 according to the embodiment of the present invention and its modification, the housing (the case 5 and the cover 6) is made of aluminum, but is made of another material such as a heat conductive resin. You may.

Although the heat radiation sheet 7 is used as the heat radiation promotion means, the heat radiation sheet is not limited to this. For example, a silicon gel having good heat conductivity may be applied.

[Brief description of the drawings]

FIG. 1 is a sectional view of an electronic device 1 according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a shape before and after assembly of a heat radiation member 4 according to an embodiment of the present invention.

FIG. 3 is an exploded perspective view showing a configuration of a main part of the electronic device 1 according to the embodiment of the present invention.

FIG. 4 is a sectional view of a first modification of the electronic device 1 according to the embodiment of the present invention.

FIG. 5 is a sectional view of a second modification of the electronic device 1 according to the embodiment of the present invention.

FIG. 6 is a sectional view of a third modification of the electronic device 1 according to the embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic device 2 Substrate 2a hole 3 Power transistor (heating element) 4 Heat dissipation member 4a, 4b Contact part 4c Regulation part 4d Projection 5 Case (housing) 5a Inner wall 6 Cover (housing) 6a Inner wall 7 Heat dissipation sheet (heat dissipation means) ) 8 bolts

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H05K 7/20 H01L 23/36 M

Claims (3)

[Claims]
1. A substrate on which a plurality of electronic components including a heating element are mounted, a housing for housing the substrate and having heat conductivity, and a heat dissipating member for conducting heat generated by the heating element to the housing. The electronic device, wherein the heat radiating member is configured to press and fix the heat generating element to the substrate, and to make a part of the heat radiating member contact the housing.
2. The electronic device according to claim 1, wherein the heat radiating member is held by the substrate.
3. Between the heat dissipating member and the heating element,
3. The electronic device according to claim 1, further comprising a heat conduction promoting member for increasing a contact area with the heating element.
JP2001008113A 2001-01-16 2001-01-16 Electronic device Withdrawn JP2002217343A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001008113A JP2002217343A (en) 2001-01-16 2001-01-16 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001008113A JP2002217343A (en) 2001-01-16 2001-01-16 Electronic device

Publications (1)

Publication Number Publication Date
JP2002217343A true JP2002217343A (en) 2002-08-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP2002217343A (en)

Cited By (28)

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WO2004027315A1 (en) * 2002-09-19 2004-04-01 Matsushita Electric Industrial Co., Ltd. Illumination unit and liquid crystal display comprising it
WO2005029674A1 (en) * 2003-09-18 2005-03-31 Matsushita Electric Industrial Co., Ltd. Capacitor unit
WO2006043634A1 (en) * 2004-10-20 2006-04-27 Pioneer Corporation Disc drive device and method for controlling such disc drive device
US7242585B2 (en) 2003-10-23 2007-07-10 Sony Corporation Electronic device
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JP2008288233A (en) * 2007-05-15 2008-11-27 Ricoh Co Ltd Heat transfer member, heat transfer mechanism and information processing device
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US7515425B2 (en) * 2006-09-28 2009-04-07 Fujitsu Limited Electronic device and cooling unit
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JP2010103370A (en) * 2008-10-24 2010-05-06 Keihin Corp Electronic control device
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JP2010129954A (en) * 2008-12-01 2010-06-10 Kenwood Corp Heat dissipating structure
JP2011023593A (en) * 2009-07-16 2011-02-03 Denso Corp Electronic control unit
WO2011069533A1 (en) * 2009-12-07 2011-06-16 Telefonaktiebolaget Lm Ericsson (Publ) An electronics arrangement
WO2011158638A1 (en) * 2010-06-14 2011-12-22 シャープ株式会社 Electronic device, display device, and television receiver
WO2012008398A1 (en) * 2010-07-16 2012-01-19 シャープ株式会社 Electronic apparatus and display unit
KR200461657Y1 (en) 2011-06-13 2012-07-30 대우지게차물류(주) Power Transistor Module
JP2012256779A (en) * 2011-06-10 2012-12-27 Ryosan Co Ltd Heat sink
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JP2014139986A (en) * 2013-01-21 2014-07-31 Hitachi Automotive Systems Ltd Electronic controller
JP2014229627A (en) * 2013-05-17 2014-12-08 アスモ株式会社 Electronic apparatus
JP2016100512A (en) * 2014-11-25 2016-05-30 日本電気株式会社 Cooling device
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WO2004027315A1 (en) * 2002-09-19 2004-04-01 Matsushita Electric Industrial Co., Ltd. Illumination unit and liquid crystal display comprising it
US7367706B2 (en) 2002-09-19 2008-05-06 Toshiba Matsushita Display Technology Co., Ltd. Illumination unit and liquid crystal display comprising it
WO2005029674A1 (en) * 2003-09-18 2005-03-31 Matsushita Electric Industrial Co., Ltd. Capacitor unit
CN100442631C (en) * 2003-09-18 2008-12-10 松下电器产业株式会社 Capacitor unit
US7427851B2 (en) 2003-09-18 2008-09-23 Matsushita Electric Industrial Co., Ltd. Capacitor unit
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