JP2012064705A - Radiator attachment structure and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a radiator attachment structure and an electronic apparatus, which improve heat radiation properties by adjusting the pressure between a heating unit and a radiator attached to a housing and reduce the thickness of the electronic apparatus.SOLUTION: A radiator attachment structure is used for attaching a radiator plate 2, which presses and covers an electronic component 5 provided on a substrate 4, to a housing 10 in which the substrate 4 and the electronic component 5 are housed. The radiator attachment structure includes screws 7 which adjust the pressure between the electronic component 5 and the radiator plate 2, and the radiator plate 2 is attached to the housing 10 by using the screws 7.

Description

  The present invention relates to a radiator mounting structure and an electronic device.

  In order to dissipate heat from electronic components such as IC (Integrated Circuit), LSI (Large Scale Integration), and transistors, a heat radiator is attached to the electronic components. For example, Patent Document 1 discloses a thin display device in which heat dissipating fins that are exposed to the outside of a casing are formed on a flat chassis on which a backlight and a control circuit are attached.

JP 2005-84270 A

  However, since the thin display device of Patent Document 1 does not have a function of adjusting the degree of adhesion between the electronic component or the flat chassis and the heat radiation fins, the heat radiation characteristics are inferior. The heat generated from the electronic components is a barrier to reducing the thickness of the electronic device, and ingenuity of the heat dissipation structure is required to further reduce the thickness of the electronic device.

  This invention is made | formed in view of such a situation, The objective is to provide the heat sink mounting structure and electronic device which enable thickness reduction.

  A radiator mounting structure according to the present application is a radiator mounting structure in which a radiator that presses and covers a heating element provided on a substrate is attached to a housing that accommodates the substrate and the heating element. An attachment member capable of adjusting the pressure between the bodies is provided, and the radiator is attached to the housing by the attachment member.

  The radiator mounting structure according to the present application includes a mounting member capable of adjusting the pressure between the heating element provided on the substrate and the radiator that presses and covers the heating element. The radiator is attached to the housing by an attachment member.

  In the radiator mounting structure according to the present application, the mounting member is a screw.

  In the radiator mounting structure according to the present application, the mounting member for mounting the radiator to the housing is a screw.

  In the radiator mounting structure according to the present application, the radiator has a fixing portion that protrudes from the radiator and is fixed to the housing, and the radiator is interposed by the mounting member via the fixing portion. It is attached to a housing.

  In the radiator mounting structure according to the present application, the fixing portion protrudes from the radiator, and the fixing portion of the radiator is attached to the housing by the mounting member.

  The radiator mounting structure according to the present application is characterized in that the casing has an opening through which a part or all of the radiator can be exposed to the outside of the casing.

  In the radiator mounting structure according to the present application, the housing is provided with an opening. Part or all of the radiator can be exposed to the outside of the casing through the opening of the casing.

  In the radiator mounting structure according to the present application, the radiator has a substrate fixing portion protruding from the radiator and fixed to the substrate, and the radiator is fixed to the substrate via the substrate fixing portion. It is characterized by being.

  In the radiator mounting structure according to the present application, the substrate fixing portion protrudes from the radiator, and the substrate fixing portion of the radiator is fixed to the substrate.

  The radiator mounting structure according to the present application is provided with a heat transfer sheet that is provided between the heating element and the radiator and conducts heat from the heating element to the radiator.

  In the radiator mounting structure according to the present application, a heat transfer sheet is provided between the heating element and the radiator. The heat transfer sheet conducts heat from the heating element to the heat radiating body.

  The radiator mounting structure according to the present application is characterized in that the radiator and the substrate are collectively attached to the casing by the mounting member.

  In the radiator mounting structure according to the present application, the radiator and the substrate are collectively attached to the casing by the mounting member.

  The radiator mounting structure according to the present application is characterized in that the fixing portion is detachable from the radiator.

  In the radiator mounting structure according to the present application, the fixing portion can be attached to or removed from the radiator.

  The radiator mounting structure according to the present application is characterized in that the substrate fixing portion is detachable from the radiator.

  In the radiator mounting structure according to the present application, the substrate fixing portion can be attached to or removed from the radiator.

  An electronic apparatus according to the present application includes the above-described radiator mounting structure.

  The electronic device according to the present application includes a radiator mounting structure.

  According to the present invention, the electronic device can be thinned.

It is a schematic perspective view of a thin television receiver. It is a typical top view of an example of a heat sink. It is a typical perspective view of a heat sink. It is a typical perspective view of a heat sink fixing bracket. It is a typical perspective view of a heat sink fixing stopper. It is a top view of an example of the heat dissipation structure of a thin-screen television receiver. It is sectional drawing cut | disconnected by the VII-VII line of FIG. It is sectional drawing cut | disconnected by the VIII-VIII line of FIG.

Hereinafter, an electronic device having a radiator mounting structure according to an embodiment of the present invention will be described with reference to the drawings illustrating embodiments. Examples of the electronic device include a thin television receiver, a thin display, a portable thin computer, a thin mobile phone, and a thin electronic dictionary.
Note that the present invention is not limited to the following embodiments.

The present embodiment relates to a form in which a heat radiating plate (heat radiating body) and a casing of a thin television receiver (electronic device) are fastened together with screws (attachment members).
FIG. 1 is a schematic perspective view of a flat-screen television receiver 1. In FIG. 1, the thin-screen television receiver 1 is shown from diagonally upward on the front side.
The flat-screen television receiver 1 includes a panel module, a housing 10, a receiving unit T that receives television broadcasting, a power source P, and a stand S. The panel module is, for example, a liquid crystal panel module, and is housed in a casing 10 including a front cabinet on the front side and a back cabinet on the rear side. The stand S supports the panel module and the housing 10 in an upright state. The receiver T and the power source P are attached to the rear side of the panel module and the front side of the back cabinet.

FIG. 2 is a schematic plan view of an example of the heat sink 2. FIG. 3 is a schematic perspective view of the heat sink 2. For example, the heat radiating plate 2 emits heat generated from electronic components constituting the receiving unit T and the power source P into the air.
The heat sink 2 has a rectangular parallelepiped shape and is made of aluminum, copper, stainless steel, iron, or the like having thermal conductivity. The heat radiating plate 2 includes a heat transfer plate 21 and heat radiating fins 22. The heat transfer plate 21 is a rectangular flat plate disposed on the side facing the electronic component when the heat radiating plate 2 is attached to the electronic component. The heat radiating fins 22 are rectangular and plate-like members that protrude from the surface of the heat transfer plate 21 on the side opposite to the electronic component in a direction substantially perpendicular to the surface. In the example of FIGS. 2 and 3, the heat radiating plate 2 includes four heat radiating fins 22.

  The groove-like space sandwiched between the heat transfer plate 21 and the radiation fins 22 is occupied by air as a heat exchange medium. The air diffuses the heat conducted from the heat radiating plate 2 and the heat radiating fins 22 to the surrounding air by heat convection. A pleat 221 protrudes from the vicinity of the base of the radiating fin 22 close to the heat transfer plate 21 so as to be substantially parallel to the in-plane direction of the heat transfer plate 21. The heat radiating plate 2 improves the heat radiating characteristics by increasing the contact area with air by the pleats 221.

The heat sink 2 includes a heat sink fixing bracket (fixing portion) and a heat sink fixing stopper (substrate fixing portion).
FIG. 4 is a schematic perspective view of the heat sink fixing bracket 23.
The heat sink fixing bracket 23 is a fixed member for fastening the housing 10 and the heat sink 2 together with screws. The material of the heat sink fixing bracket 23 is made of a metal having thermal conductivity, and may or may not be the same as the material of the heat sink 2. The heat sink fixing bracket 23 is an angle having a step shape including two steps in a side sectional view. The plate portion 231 at one end of the heat radiating plate fixture 23 is provided with a substantially symmetrical cut at each of the opposite side portions. The shape of the cut provided in the plate portion 231 is L-shaped when viewed from the normal direction of the plate surface. A screw hole 233 for fixing the heat radiating plate 2 to the substrate and the housing 10 with screws is provided in the approximate center of the plate portion 232 at the other end of the heat radiating plate fixing bracket 23. The plate portion 231 at one end and the plate portion 232 at the other end are coupled to each other by a plate portion 234 that is bent at a substantially right angle.

  The plate portion 231 provided with the cuts is fitted into the gap formed between the adjacent heat radiating fins 22 and the heat radiating fins 22 and between the heat transfer plate 21 and the pleats 221, thereby fixing the heat radiating plate fixing bracket. 23 is attached to the heat sink 2. When the plate portion 231 is fitted into the gap, the arm-shaped side portion formed by the L-shaped cut is bent. This bent arm-shaped side portion presses the heat radiating fins 22 between the heat transfer plate 21 and the pleats 221, so that the heat radiating plate fixing bracket 23 protrudes from the heat radiating plate 2. When the heat sink fixing bracket 23 is removed from the heat sink 2, the plate portion 231 is pulled out from the gap in the longitudinal direction of the heat sink fins 22. That is, the heat sink fixing bracket 23 is detachable from the heat sink 2.

The number of cuts, the shape, and the installation position of the plate portion 231 are not limited to the above example as long as the heat sink fixing bracket 23 can be attached to the heat sink 2, and various modifications are possible. Conceivable. For example, one or more straight, L-shaped, J-shaped or T-shaped cuts may be provided from the tip of the plate portion 231. Alternatively, the heat sink fixing bracket 23 may be attached to the heat dissipation plate 2 by making the shape of the plate portion 231 thin like a wedge toward the tip and inserting the plate portion 231 into the gap.
In addition, when the heat sink fixing bracket 23 is attached to the heat sink 2, the portion of the pleat 221 that contacts the plate portion 231 is protruded in the intermediate direction between the heat sink fin 22 and the heat sink fin 22 between which the plate portion 231 is sandwiched. May be. Thereby, the contact area of the heat sink fixing bracket 23 and the heat sink 2 can be increased, and the amount of conduction heat can be increased. Or you may join the part of the two pleats 221 which contact | abuts to the board part 231, and opposes.

  In the example of FIG. 2 and FIG. 3, one of the three heat sink plates 21 and the heat dissipating fins 22 is attached to each end of the center groove, and one heat sink fixing bracket 23 is attached to each end. Yes. The heat radiating plate fixing bracket 23 is attached to the heat radiating plate 2 so that the plate portion 232 provided with the screw holes 233 protrudes to the side opposite to the protruding direction of the heat radiating fins 22.

FIG. 5 is a schematic perspective view of the heat sink fixing stopper 24.
The heat sink fixing stopper 24 is a fixing member for temporarily fixing the heat sink 2 to the substrate. The material of the heat sink fixing stopper 24 is, for example, iron, but may be other than iron as long as the heat sink 2 can be temporarily fixed to the substrate. The heat sink fixing stopper 24 is an angle having an L shape in a side sectional view. Like the heat sink fixing bracket 23, one plate portion 241 of the heat sink fixing stopper 24 is provided with a substantially symmetrical cut at each of the opposite side portions. Various modifications of the heat sink fixing stopper 24 can be considered, as in the case of the heat sink fixing bracket 23. A rectangular protrusion 243 for temporarily fixing the heat radiating plate 2 to the substrate is provided at the tip of the other plate portion 242 of the heat radiating plate fixing stopper 24. The width of the protrusion 243 in a direction substantially parallel to the direction in which the sides of the plate portion 241 and the plate portion 242 are joined is narrower than the width of the plate portion 242 in the same direction.

  The plate portion 241 provided with the cuts is fitted into the gap formed between the adjacent heat radiating fins 22 and the heat radiating fins 22 and between the heat transfer plate 21 and the pleats 221, and the heat radiating plate fixing stopper 24 is attached to the heat sink 2. Thus, the heat sink fixing stopper 24 protrudes from the heat sink 2. When the heat sink fixing stopper 24 is removed from the heat sink 2, the plate portion 241 is pulled out from the gap in the longitudinal direction of the heat sink fins 22. That is, the heat sink fixing stopper 24 can be attached to and detached from the heat sink 2.

  In the example of FIGS. 2 and 3, one of the three grooves formed by the heat transfer plate 21 and the heat radiation fins 22 is provided with one heat radiation plate fixing stopper 24 at each end of the two grooves at both ends. It is worn. Each of the heat sink fixing stoppers 24 is attached to a position facing the diagonal direction of the heat transfer plate 21.

  FIG. 6 is a plan view of an example of the heat dissipation structure of the thin television receiver 1. 7 is a cross-sectional view taken along line VII-VII in FIG. In FIG. 7, the heat sink mounting structure has a structure in which a chassis frame 3, a substrate 4, an electronic component 5, a heat dissipation sheet (heat transfer sheet) 6, a heat sink 2, and a housing 10 are stacked in this order.

The chassis frame 3 is mounted, for example, on the back side of the panel module of the thin television receiver 1. On the back side of the chassis frame 3, a claw portion 31 having a hook shape protruding from the side cross-section and having a hook shape is formed. The claw portion 31 of the chassis frame 3 is in contact with the substrate 4.
The substrate 4 is an insulating plate to which the electronic component 5 is fixed. For example, the substrate 4 is a printed circuit board to which wiring for connecting the electronic components 5 is attached.

The electronic component 5 is, for example, a resistor, a capacitor, a transistor, a diode, an integrated circuit (IC, LSI, ultra LSI, or the like). In the example of FIG. 7, the electronic component 5 has a flat plate shape. The electronic component 5 is soldered to the surface of the substrate 4 opposite to the side facing the chassis frame 3 with solder 5a.
A heat dissipation sheet 6 is attached to the electronic component 5 with an adhesive. The heat radiating sheet 6 is sandwiched between the heat generating electronic component 5 and the heat radiating plate 2, and conducts heat from the electronic component 5 to the heat radiating plate 2. The size of the heat dissipation sheet 6 is substantially the same as the size of the electronic component 5. The heat radiating sheet 6 is formed using a material having electrical insulation and thermal conductivity, such as a silicon resin or an elastomer resin containing a thermal conductive filler.

  A heat sink fixing bracket 23 is provided so as to protrude from the two opposite sides of the heat sink 2 to the opposite side. The heat sink fixing bracket 23 is bent stepwise in the direction from the plate portion 231 toward the substrate 4 and in the in-plane direction of the heat transfer plate 21 away from the heat sink 2. The plate portion 232 of the heat sink fixing bracket 23 is in contact with the substrate 4.

As shown in FIG. 6, the housing 10 is provided with an opening 10 a through which the heat radiating plate 2 can be exposed to the outside of the housing 10. The shape of the opening 10 a is substantially the same rectangle as the shape of the heat transfer plate 21, and the size of the opening 10 a is larger than the size of the heat transfer plate 21. The opening 10a includes a rectangular notch 10b at an edge portion where the plate portion 231 of the heat sink fixing bracket 23 protrudes. The size of the notch 10b is such that when the heat sink 2 is exposed from the opening 10a to the outside of the housing 10, the portion of the plate portion 231 protruding from the heat sink 2 can be inserted, but a screw hole 233 is provided. The plate portion 232 has a size that cannot be inserted.
When the heat sink 2 and the housing 10 are aligned with the thin television receiver 1 assembled, a substantially cylindrical boss 10c is integrated on the inner surface of the housing 10 at a position overlapping the screw hole 233 of the heat sink 2. Is projected. A screw hole is provided at substantially the center in the height direction of the boss 10c.

  When the chassis frame 3, the substrate 4, the heat sink 2 and the housing 10 are aligned with the thin television receiver 1 assembled, the chassis frame 3 and the substrate 4 have screw holes 233 and bosses 10 c in the heat sink 2. Screw holes are formed at positions overlapping with the screw holes. The screws 7 are screwed into the screw holes of the chassis frame 3, the substrate 4, and the boss 10 c and the screw holes 233 of the heat sink 2 from the outside of the housing 10, and the chassis frame 3, the substrate 4, the heat sink 2, and the housing 10. Are tightened together. The screw 7 is made of a metal having thermal conductivity, and is, for example, a screw having a truss head portion provided with a cross hole. The shape of the head of the screw 7 may be a dish shape, a pan shape, a bind shape, or the like. Further, the shape of the groove and the hole of the head of the screw 7 may be a slot, a plus / minus hole, a hexagonal hole, or the like.

  Usually, the heat sink and the substrate are fixed by soldering. However, in the thin television receiver 1, the heat sink 2 and the substrate 4 are fastened together with screws 7.

8 is a cross-sectional view taken along line VIII-VIII in FIG.
The plate portions 242 of the heat radiation plate fixing stopper 24 protrude from the two opposite side edges of the heat radiation plate 2 in the direction facing the substrate 4. The angle formed by the plate portion 242 and the heat transfer plate 21 is substantially a right angle. When the flat-screen television receiver 1 is assembled, a linear opening 4a into which the protrusion 243 can be inserted is provided in a portion of the substrate 4 corresponding to the protrusion 243 provided at the tip of the plate portion 242. The protrusion 243 passes through the opening 4a from the surface side of the substrate 4 to which the electronic component 5 is fixed. The protrusion 243 extending from the opening 4a is kinked. The heat sink 2 is temporarily fixed to the substrate 4 by the constriction of the projections 243 provided by the kink processing engaging with the substrate 4.

Next, attachment of the heat sink 2 will be described.
The electronic component 5 is soldered on the substrate 4. The heat dissipation sheet 6 is attached to the electronic component 5 with an adhesive. The heat radiating sheet 6 is covered with the heat radiating plate 2. In such a case, the heat radiating plate 2 is brought closer to the heat radiating sheet 6 while being aligned so that the screw holes 233 of the heat radiating plate 2 and the screw holes of the substrate 4 overlap. The protrusion 243 of the heat radiating plate 2 is inserted into the opening 4 a of the substrate 4. The protrusion 243 extending from the substrate 4 is kinked, and the heat sink 2 is temporarily fixed to the substrate 4.

  The board 4 on which the heat sink 2 is temporarily fixed is brought close to the chassis frame 3. The substrate 4 is aligned with the chassis frame 3 so that the screw holes of the substrate 4 and the screw holes of the chassis frame 3 overlap. The inner surface of the housing 10 is brought close to the substrate 4 or the like so that the heat radiating plate 2 is exposed to the outside through the opening 10a of the housing 10. Positioning is performed so that the screw hole 233 of the heat sink 2 and the screw hole of the boss 10c of the housing 10 overlap. The shaft portion of the screw 7 is screwed into the screw hole of the boss 10c from the outside of the housing 10, and the chassis frame 3, the substrate 4, the heat sink 2 and the housing 10 are fastened together. In such a case, an appropriate tightening torque is applied for each type of electronic component 5.

The internal temperature of the electronic device rises due to heat generated from the electronic component. As a result, the life of electronic components on the substrate is shortened, thermal runaway occurs, and the functionality of the electronic device is degraded. Therefore, measures for heat dissipation of electronic devices include expansion of the heat sink area, installation of a ventilation fan, reduction of electronic component mounting density on the board due to expansion of the board area, and the like. However, all of these measures are a cause of cost increase.
On the other hand, a reduction in the thickness of the electronic device causes a decrease in the volume and heat capacity inside the electronic device, which causes an increase in the internal temperature of the electronic device. Therefore, when thinning an electronic device, it is necessary to improve the heat dissipation characteristics of the electronic device.

According to the heat sink mounting structure according to the present embodiment, the electronic device can be thinned by improving the heat dissipation characteristics.
The shape and size of the electronic component 5 are different for each electronic component 5. Therefore, when fixing the heat sink 2 to the substrate 4 by soldering, which is a conventional method, it is difficult to make the degree of adhesion of the heat sink 2 to the electronic component 5 constant. However, according to the heat sink mounting structure, the tightening torque can be adjusted by fastening the heat sink 2 and the substrate 4 together with the screws 7. Therefore, the pressing force and pressing force distribution of the heat sink 2 with respect to the electronic component 5 can be adjusted, and the overall adhesion of the heat sink 2 to the electronic component 5 can be increased. The higher the degree of adhesion of the heat sink 2 to the electronic component 5, the better the heat dissipation characteristics.

  According to the heat sink mounting structure, the heat sink fixing bracket 23 and the substrate 4 are fixed not by soldering but by screws. Therefore, it is easy to remove and attach the heat radiating plate 2 to the substrate 4, and it is possible to repair or replace the electronic component 5 quickly.

According to the heat sink mounting structure, the heat sink fixing bracket 23 is manufactured as a separate component from the heat sink 2, between the heat sink fins 22 and the heat sink fins 22 adjacent to each other, and between the heat transfer plate 21 and the pleats 221. The heat radiating plate fixing bracket 23 is attached to the heat radiating plate 2. The heat sink fixing bracket 23 can be removed from the heat sink 2. Thereby, the attachment position and attachment number of the heat sink fixing bracket 23 with respect to the heat sink 2 can be changed easily. Therefore, the types of molds to be prepared may be small.
In addition, you may project the heat sink fixing bracket 23 from the heat sink 2 integrally.

  According to the heat sink mounting structure, since the heat sink 2 is exposed to the outside from the openings 10a and 10b of the housing 10, there is no need for a space for housing the heat sink 2 inside the housing 10 and the electronic device can be made thinner. To contribute. Moreover, according to the heat sink mounting structure, part or all of the heat sink 2 is exposed to the outside of the housing 10, so that the heat dissipation effect is great.

  According to the heat sink mounting structure, the housing 10 also acts as a heat radiator by fastening the heat sink 2 and the housing 10 together with the screws 7 via the heat sink fixing bracket 23 having thermal conductivity. Thereby, the heat dissipation characteristic is improved.

  According to the heat sink mounting structure, the heat sink 2 has the heat sink fixing stopper 24, and can be temporarily fixed to the substrate 4 via the heat sink fixing stopper 24. Thereby, when the chassis frame 3, the board 4, the heat radiating plate 2 and the housing 10 are fastened together with the screws 7, since the board 4 and the heat radiating plate 2 are fixed in advance, the positioning of each member becomes easy. Assembling accuracy and assembling work efficiency of the electronic device can be improved. Moreover, the heat sink fixing stopper 24 can be removed from the heat sink 2, and the attachment position and the number of attachments of the heat sink fixing stopper 24 with respect to the heat sink 2 can be easily changed.

  According to the heat sink mounting structure, the heat dissipation sheet 6 is provided between the electronic component 5 and the heat sink 2. The heat radiating sheet 6 has the ability to follow unevenness on the surface of the heating element and has high adhesion. Thereby, the contact area of the electronic component 5 and the heat radiating sheet 6 increases, and the heat dissipation characteristics of the heat radiating plate 2 can be improved.

  According to the heat radiating plate mounting structure, the chassis frame 3, the substrate 4 and the heat radiating plate 2 are collectively fixed to the housing 10 by screws 7, and other fixing members are not used. Therefore, the number of parts can be reduced. In addition, when a component to which the chassis frame 3 is attached (for example, a panel module of the flat-screen television receiver 1) generates heat, the heat generation also occurs from the chassis frame 3 via the substrate 4 and the screws 7 and the heat sink 2 and the housing 10. And is discharged to the outside of the electronic device. The heat of the electronic component 5 is also conducted through the substrate 4 to the heat radiating plate 2 and the housing 10 and released to the outside of the electronic device.

In the thin television receiver 1, the heat sink 2 and the housing 10 are fixed with screws 7. However, you may fix the heat sink 2 and the housing | casing 10 with a rivet or a spring.
When a rivet is selected as the fixing member, it is not necessary to screw in like the screw 7, and the heat sink 2 can be attached to the housing 10 only by pressing. When a spring is selected as the fixing member, for example, the spring is sandwiched between the heat radiating plate 2 and the housing 10 and the heat radiating plate 2 is pressed by the elastic force of the spring. The heat of the heat sink 2 can also be transmitted to the housing 10 via a spring.

  In FIG. 6, two heat sink fixing brackets 23 project from the heat sink 2 in two different directions. However, the number of heat sink fixing brackets 23 is not limited to two. By providing three or more heat sink fixing brackets 23 on the heat sink 2 and attaching them to the substrate 4 with three or more screws 7, the distribution of the pressing force of the heat sink 2 against the electronic component 5 can be adjusted more finely.

DESCRIPTION OF SYMBOLS 1 Thin-screen television receiver 2 Heat sink 23 Heat sink fixing bracket 24 Heat sink fixing stopper 4 Board | substrate 5 Electronic component 6 Heat sink 7 Screw 10 Case 10a Opening

Claims (10)

In the radiator mounting structure for mounting the radiator that presses and covers the heating element provided on the substrate to the housing that accommodates the substrate and the heater,
An attachment member capable of adjusting the pressure between the heating element and the radiator;
A radiator mounting structure, wherein the radiator is mounted on the casing by the mounting member. The radiator mounting structure according to claim 1, wherein the mounting member is a screw. The radiator has a fixing portion that protrudes from the radiator and is fixed to the housing.
The radiator mounting structure according to claim 1 or 2, wherein the radiator is attached to the casing by the mounting member via the fixing portion. 4. The heat dissipation according to claim 1, wherein the housing has an opening through which a part or all of the heat radiating body can be exposed to the outside of the housing. Body mounting structure. The radiator has a substrate fixing portion that protrudes from the radiator and is fixed to the substrate.
The radiator mounting structure according to any one of claims 1 to 4, wherein the radiator is fixed to the substrate via the substrate fixing portion. 6. A heat transfer sheet provided between the heat generating body and the heat radiating body and conducting heat from the heat generating body to the heat radiating body is provided. 6. Radiator mounting structure. The radiator mounting structure according to any one of claims 1 to 6, wherein the radiator and the substrate are collectively attached to the casing by the mounting member. The radiator mounting structure according to claim 3, wherein the fixing portion is detachable from the radiator. The radiator mounting structure according to claim 5, wherein the board fixing portion is detachable from the radiator. An electronic device comprising the radiator mounting structure according to any one of claims 1 to 8.

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