WO2013105138A1 - Heat dissipation structure - Google Patents
Heat dissipation structure Download PDFInfo
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- WO2013105138A1 WO2013105138A1 PCT/JP2012/000185 JP2012000185W WO2013105138A1 WO 2013105138 A1 WO2013105138 A1 WO 2013105138A1 JP 2012000185 W JP2012000185 W JP 2012000185W WO 2013105138 A1 WO2013105138 A1 WO 2013105138A1
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- heat
- surface portion
- generating component
- dissipation structure
- heat dissipation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
Definitions
- the present invention relates to a heat dissipating structure for releasing heat of a heat generating component arranged in a housing, for example.
- Patent Document 1 discloses a heat dissipation structure 100 as shown in FIG.
- electronic components 120 of different sizes mounted on the circuit board 110 are brought into contact with the shield cover 150 via the heat conducting member 130.
- the heat of the heat generating component 120 is directly transmitted to the shield cover 150, and thus the shield cover 150 may locally become hot.
- An object of the present invention is to provide a heat dissipation structure capable of suppressing the outer shell member from locally becoming high temperature.
- a heat dissipation structure includes a circuit board, a heat generating component mounted on the circuit board and having a flat main surface, and an external cover that covers the circuit board apart from the heat generating component.
- a heat sink disposed between a shell member, the heat generating component, and the outer member, and a first surface portion that transmits heat from the heat generating component along the main surface of the heat generating component, the first surface portion A connecting portion that rises from the edge of the outer shell member so as to approach the outer shell member, and extends from the front end of the connecting portion along the outer shell member to the side opposite to the first surface portion, from the first surface portion via the connecting portion.
- a heat radiating plate having a second surface portion for transmitting heat to be conducted to the outer shell member.
- fever of a heat generating component is the inside of a heat sink. Is radiated (radiated) into the space from the first surface portion and the connecting portion. Therefore, the heat transmitted from the second surface portion of the heat radiating plate to the outer shell member can be reduced, and the outer shell member can be prevented from becoming locally hot.
- FIG. 1 to 3 show a display device 1 employing a heat dissipation structure 10 (see FIG. 3) according to an embodiment of the present invention.
- the display device 1 include a television receiver and an outdoor display.
- the display device 1 includes a display panel 11 that displays an image according to a signal input from the outside, a bezel 12 that borders the periphery of the display panel 11, and a back cover that covers the back surface of the display panel 11 (the outer shell member of the present invention). 2).
- the display panel 11 is a liquid crystal panel, for example. In the present embodiment, the screen of the display panel 11 faces the horizontal direction.
- the bezel 12 is made of resin, and a steel plate is used as a material constituting the back cover 2.
- the material which comprises the back cover 2 should just have sufficient thermal radiation performance as the exterior of an electronic device, and is not limited to a steel plate. However, it is preferable to use a steel plate from the viewpoint of low cost and easy processing. Of course, other metals with high radiation performance can also be used.
- the back cover 2 has a horizontally long rectangular main wall 21 parallel to the back surface of the display panel 11, an upper wall 22 that is bent obliquely from the upper side of the main wall 21, and a lower wall that is bent vertically from the lower side of the main wall 21.
- the wall 23 and the side wall 24 bent vertically from the left and right sides of the main wall 21 are provided.
- the main wall 21 of the back cover 2 is formed with a heat radiation port 25 composed of a plurality of through holes.
- the heat radiation port 25 is for directly releasing the heat inside the display device 1 to the outside air.
- the ventilation port which consists of a some through-hole may be formed in the upper direction or the downward direction of the thermal radiation port 25.
- FIG. Thereby, the cooling function can be enhanced by the flow of air through the heat radiation port 25.
- a vent hole may be provided in the upper wall 22 or the lower wall 23 of the back cover 2.
- the vent When the vent is formed below the heat radiation port 25, the vent functions as an intake port, and the outside air taken in from the vent is discharged from the heat radiation port 25. This is because heat convection occurs.
- the vent when the vent is formed above the heat radiation port 25, the vent functions as an exhaust port, and the outside air taken in from the heat radiation port 25 is discharged from the vent.
- the heat dissipation structure 10 is a structure that releases heat generated inside the display device 1 to the outside through the back cover 2.
- the back cover 2 is omitted in order to clarify the internal structure.
- the circuit board 3 is attached to the back surface of the display panel 11 in parallel with the back surface. In other words, the circuit board 3 is parallel to the vertical direction.
- a heat generating component 4 is mounted on the surface of the circuit board 3 facing the back cover 2 side. The back cover 2 is separated from the heat generating component 4 and covers the circuit board 3.
- the circuit board 3 is a board on which components for controlling signals output to the display panel 11 are mounted. There are various parts that control the output signal, and there are parts that become hot during operation. This component is the heat generating component 4. Heat generated by the heat generating component 4 is radiated by the heat radiating structure 10.
- the heat generating component 4 is, for example, a semiconductor chip.
- a semiconductor chip has a package structure in which a large number of circuits are integrated.
- the main surface of the heat generating component 4 facing away from the circuit board 3 is flat, and the manufacturer name and product number are printed on the main surface.
- the heat generating component 4 generates heat during the operation of the display device 1 and reaches, for example, 100 degrees or more.
- a heat sink 6 is disposed between the heat generating component 4 and the back cover 2.
- the heat radiating plate 6 constitutes a heat radiating structure 10 together with the circuit board 3, the heat generating component 4 and the back cover 2.
- the heat sink 6 receives heat from the heat generating component 4, radiates a part of the heat, and transmits the rest to the back cover 2.
- an aluminum plate is used as a material constituting the heat radiating plate 6.
- Aluminum is suitable for the heat sink 6 because of its high radiation performance and high thermal conductivity. However, depending on the amount of heat generated by the heat-generating component, other metals can be substituted.
- the heat sink 6 is fixed to the back cover 2 with screws 9.
- the heat radiating plate 6 is formed in a shape that forms a groove extending in the vertical direction by bending an aluminum plate having a certain thickness.
- the direction in which the groove extends is not necessarily a vertical direction, and may be a horizontal direction or an oblique direction.
- the heat radiating plate 6 includes a first surface portion 61 located right above the heat generating component 4, and a connecting portion 62 and a second surface portion 63 located on both sides of the first surface portion 61.
- the first surface portion 61 is a portion along the main surface of the heat generating component 4 where heat is transmitted from the heat generating component 4.
- the first surface portion 61 has a size larger than the main surface of the heat generating component 4, and the first surface portion 61 protrudes around the heat generating component 4.
- the size of the first surface portion 61 is preferably 1.5 times or more of the main surface of the heat generating component 4, and more preferably 2 times or more.
- the heat radiation port 25 described above is formed in a region facing the first surface portion 61 in the main wall 21 of the back cover 2.
- the size of the first surface portion 61 may be smaller than the size of the main surface of the heat generating component 4 as shown in FIG. 6A.
- a heat conductive member 5 having elasticity is sandwiched between the first surface portion 61 and the heat generating component 4, and the first surface portion 61 contacts the heat generating component 4 via the heat conductive member 5.
- the heat conductive member 5 for example, rubber having high heat conductivity can be used.
- the connecting portion 62 rises from the left and right edges of the first surface portion 61 so as to approach the back cover 2 and integrally connects the first surface portion 61 and the second surface portion 63.
- the connecting portion 62 rises at an obtuse angle with respect to the first surface portion 61.
- the connecting portion 62 may rise at a right angle to the first surface portion 61 as shown in FIG. 6A, or may rise at an acute angle with respect to the first surface portion 61 as shown in FIG. 6B.
- the second surface portion 63 extends from the tip of the connecting portion 62 to the opposite side of the first surface portion 61 along the back cover 2.
- the second surface portion 63 plays a role of transmitting heat conducted from the first surface portion 61 through the connecting portion 62 to the back cover 2.
- the number of locations where heat is transmitted increases, so that the heat of the heat generating component 4 can be efficiently radiated.
- a heat conductive member 7 having elasticity is sandwiched between each second surface portion 63 and the back cover 2, and the second surface portion 63 contacts the back cover 2 via the heat conductive member 7. is doing.
- the second surface portion 63 is provided with a fixing portion 64 (see FIG. 4) having an L-shaped cross section that protrudes vertically.
- a screw hole is provided in the center of each fixing portion 64, and the second surface portion 63 is fastened to the back cover 2 by screwing the screw 9 into the screw hole through a through hole provided in the back cover 2. .
- the first surface portion 61 projects around the heat generating component 4 and the connecting portion 62 rises at an obtuse angle with respect to the first surface portion 61, so that it is orthogonal to the main surface of the heat generating component 4.
- the second surface portion 63 is located outside the heat generating component 4 when viewed from the direction of the heating.
- the heat of the heat generating component 4 is diffused even when the size of the first surface portion 61 is smaller than the main surface of the heat generating component 4 or when the connecting portion 62 rises at a right angle or an acute angle with respect to the first surface portion 61.
- the second surface portion 63 is located outside the heat generating component 4 when viewed from a direction orthogonal to the main surface of the heat generating component 4.
- the heat dissipation phenomenon performed by the heat dissipation structure 10 is explained by heat radiation, heat conduction, and heat transfer. Each will be described below.
- the heat generated from the heat generating component 4 is transmitted to the first surface portion 61 via the heat transfer rubber 5.
- the heat accumulated in the first surface portion 61 is not only radiated to the space surrounded by the first surface portion 61, the connecting portion 62, and the back cover 2, but is also released directly from the heat radiation port 25 to the outside air by heat radiation. The Therefore, heat radiation is efficiently performed by the heat radiation port 25.
- the heat radiation port 25 is formed in the back cover 2, but the present invention is not limited to this. Even if the heat radiation port 25 is not formed, the heat radiated from the first surface portion 61 is transmitted to the back cover 2 and radiated from the back cover 2 over time. Thereby, sufficient heat dissipation performance can be satisfied.
- the contact area between the heat generating component 4 and the heat radiating plate 6 rather than the first surface portion 61 that is a metal directly contacting the heat generating component 4. can be increased. Therefore, the heat of the heat generating component 4 can be efficiently transmitted to the first surface portion 61. As a result, the amount of heat radiated from the first surface portion 61 increases.
- the heat sink 6 has a configuration in which the first surface portion 61, the connecting portion 62, and the second surface portion 63 are continuous. As described above, the heat of the heat generating component 4 is transmitted to the first surface portion 61. The heat transmitted to the first surface portion 61 moves to the second surface portion 63 via the connecting portion 62 by heat conduction. Also during this time, the heat of the heat generating component 4 is radiated from the connecting portion 62 to the space surrounded by the first surface portion 61, the connecting portion 62, and the back cover 2.
- the connecting portion 62 rises at an obtuse angle with respect to the first surface portion 61. That is, the connecting part 62 extends outward from the first surface part 61.
- the connecting part 62 since the amount of composition breakdown inside the heat sink 6 (cracks generated inside the heat sink 6) is small at the corners of the first surface portion 61 and the connecting portion 62, the heat conductivity of the heat sink 6 itself is lowered. Can be prevented. Further, there is an effect that the thermal radiation of the first surface portion 61 is not inhibited. Furthermore, when the connecting portion 62 spreads outward from the first surface portion 61, the stress applied to the back cover 2 by the heat radiating plate 6 can be reduced.
- the second surface portion 63 is parallel to the first surface portion 61, the second surface portion 63 also forms an obtuse angle with respect to the connecting portion 62. That is, in this embodiment, the amount of composition breakdown inside the heat sink 6 is small even at the corners of the connecting portion 62 and the second surface portion 63, and a decrease in the thermal conductivity of the heat sink 6 itself can be prevented.
- Heat transfer As described above, heat corresponding to the heat of the heat-generating component 4 excluding the heat radiated from the heat of the heat generating component 4 reaches the second surface portion 63. The heat of the second surface portion 63 is transmitted to the back cover 2 via the heat conductive member 7.
- heat can be sufficiently radiated even if the second surface portion 63 is brought close to or directly in contact with the back cover 2 without using the heat conductive member 7.
- the heat conductive member 7 is interposed as in the present embodiment, the contact between the back cover 2 and the second surface portion 63 rather than the metal second surface portion 63 directly contacting the back cover 2. The area can be increased. Therefore, the heat of the second surface portion 63 can be efficiently transmitted to the back cover 2. As a result, the amount of heat transferred from the second surface portion 63 to the back cover 2 increases.
- the tolerance generated between the back cover 2 and the heat sink 6 can be absorbed by the expansion / contraction width of the heat conductive member 7. As a result, the possibility that a gap is generated between the back cover 2 and the heat sink 6 can be reduced.
- the second surface portion 63 is fastened to the back cover 2. If it does in this way, when the heat conductive member 7 is pinched
- two connecting portions 62 and two second surface portions 63 are provided, but these may be provided one by one, or may be provided by three or more.
- the heat sink 6 is manufactured by bending an aluminum plate having a constant thickness, but the heat sink 6 may be manufactured by extrusion molding. In this case, it is also possible to form irregularities for improving the radiation performance on the surface of the first surface portion 61 opposite to the heat generating component 4.
- the heat dissipating structure of the present invention is useful as a structure for dissipating heat in a housing such as a flat-screen television or an outdoor display.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This heat dissipation structure is provided with a heat dissipation plate (6) that is arranged between a heat generating component (4) and an outer shell member (2). The heat dissipation plate (6) comprises: a first surface portion (61) that extends along the main surface of the heat generating component (4); a linking portion (62) that rises from the edge of the first surface portion (61); and a second surface portion (63) that extends from the front edge of the linking portion (62) along the outer shell member (2) in the direction opposite to the first surface portion (61). Heat is transmitted to the first surface portion (61) from the heat generating component (4), and the second surface portion (63) transmits the heat, which has been transmitted thereto from the first surface portion (61) through the linking portion (62), to the outer shell member (2).
Description
本発明は、例えば筐体内に配置された発熱部品の熱を外部に逃がすための放熱構造に関する。
The present invention relates to a heat dissipating structure for releasing heat of a heat generating component arranged in a housing, for example.
近年、電子機器の小型化および電子部品の集積化が進んでいる。電子機器の小型化および電子部品の集積化に伴い、電子機器に使用される電子部品の放熱対策が重要となる。一般的に電子機器が小型になればなるほど放熱スペースが減少し、電子部品の集積度が上がる。
In recent years, downsizing of electronic devices and integration of electronic components are progressing. With the downsizing of electronic devices and the integration of electronic components, heat dissipation measures for electronic components used in electronic devices become important. In general, the smaller the electronic device, the smaller the heat dissipation space and the higher the integration of electronic components.
従来、電子部品の放熱構造としては種々のものが提案されている。例えば、特許文献1には、図7に示すような放熱構造100が開示されている。この放熱構造100では、回路基板110に実装された大きさの異なる電子部品120が熱伝導部材130を介してシールドカバー150に接触させられている。
Conventionally, various heat dissipation structures for electronic parts have been proposed. For example, Patent Document 1 discloses a heat dissipation structure 100 as shown in FIG. In the heat dissipation structure 100, electronic components 120 of different sizes mounted on the circuit board 110 are brought into contact with the shield cover 150 via the heat conducting member 130.
しかしながら、図7に示す放熱構造100では、発熱部品120の熱が直接的にシールドカバー150に伝達されるため、シールドカバー150が局所的に高温になるおそれがある。
However, in the heat dissipation structure 100 shown in FIG. 7, the heat of the heat generating component 120 is directly transmitted to the shield cover 150, and thus the shield cover 150 may locally become hot.
本発明は、外殻部材が局所的に高温になることを抑制することができる放熱構造を提供することを目的とする。
An object of the present invention is to provide a heat dissipation structure capable of suppressing the outer shell member from locally becoming high temperature.
前記課題を解決するために、本発明の放熱構造は、回路基板と、前記回路基板に実装された、フラットな主面を有する発熱部品と、前記発熱部品から離間して前記回路基板を覆う外殻部材と、前記発熱部品と前記外郭部材との間に配置された放熱板であって、前記発熱部品の主面に沿う、前記発熱部品から熱が伝達される第1面部、前記第1面部の縁から前記外殻部材に近づくように立ち上がる連結部、および前記連結部の先端から前記外殻部材に沿って前記第1面部と反対側に広がる、前記第1面部から前記連結部を介して伝導する熱を前記外殻部材に伝達する第2面部、を有する放熱板と、を備えた、ことを特徴とする。
In order to solve the above problems, a heat dissipation structure according to the present invention includes a circuit board, a heat generating component mounted on the circuit board and having a flat main surface, and an external cover that covers the circuit board apart from the heat generating component. A heat sink disposed between a shell member, the heat generating component, and the outer member, and a first surface portion that transmits heat from the heat generating component along the main surface of the heat generating component, the first surface portion A connecting portion that rises from the edge of the outer shell member so as to approach the outer shell member, and extends from the front end of the connecting portion along the outer shell member to the side opposite to the first surface portion, from the first surface portion via the connecting portion. And a heat radiating plate having a second surface portion for transmitting heat to be conducted to the outer shell member.
上記の構成によれば、発熱部品に沿う放熱板の第1面部と外殻部材との間に放熱板の連結部に面する空間が確保されるため、発熱部品の熱は、放熱板の内部を熱伝導するだけでなく、第1面部および連結部からその空間に放射(輻射)される。従って、放熱板の第2面部から外殻部材に伝達される熱が低減し、外殻部材が局所的に高温になることを抑制することができる。
According to said structure, since the space which faces the connection part of a heat sink is ensured between the 1st surface part of a heat sink along an exothermic component, and an outer shell member, the heat | fever of a heat generating component is the inside of a heat sink. Is radiated (radiated) into the space from the first surface portion and the connecting portion. Therefore, the heat transmitted from the second surface portion of the heat radiating plate to the outer shell member can be reduced, and the outer shell member can be prevented from becoming locally hot.
以下、本発明の実施形態について図面を参照しながら説明する。ただし、本発明は以下の実施形態に限定されるものではない。
Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments.
図1~3に、本発明の一実施形態に係る放熱構造10(図3参照)が採用された表示装置1を示す。表示装置1の具体例としてはテレビジョン受信機や屋外表示用ディスプレイがある。
1 to 3 show a display device 1 employing a heat dissipation structure 10 (see FIG. 3) according to an embodiment of the present invention. Specific examples of the display device 1 include a television receiver and an outdoor display.
表示装置1は、外部から入力した信号に応じた映像を表示する表示パネル11と、表示パネル11の周縁を縁取るベゼル12と、表示パネル11の背面を覆うバックカバー(本発明の外殻部材に相当)2とを備える。表示パネル11は、例えば液晶パネルである。本実施形態では、表示パネル11の画面が水平方向を向いている。
The display device 1 includes a display panel 11 that displays an image according to a signal input from the outside, a bezel 12 that borders the periphery of the display panel 11, and a back cover that covers the back surface of the display panel 11 (the outer shell member of the present invention). 2). The display panel 11 is a liquid crystal panel, for example. In the present embodiment, the screen of the display panel 11 faces the horizontal direction.
例えば、ベゼル12は樹脂からなり、バックカバー2を構成する材料としては鋼板が用いられる。バックカバー2を構成する材料は、電子機器の外装として十分な熱放射性能があればよく、鋼板に限定されない。ただし、コストが安く、加工がしやすいという観点から、鋼板を使用することが好ましい。もちろん、放射性能が高い他の金属も使用することができる。
For example, the bezel 12 is made of resin, and a steel plate is used as a material constituting the back cover 2. The material which comprises the back cover 2 should just have sufficient thermal radiation performance as the exterior of an electronic device, and is not limited to a steel plate. However, it is preferable to use a steel plate from the viewpoint of low cost and easy processing. Of course, other metals with high radiation performance can also be used.
具体的に、バックカバー2は、表示パネル11の背面と平行な横長長方形状の主壁21と、主壁21の上辺から斜めに折れ曲がる上壁22と、主壁21の下辺から垂直に折れ曲がる下壁23と、主壁21の左右の辺から垂直に折れ曲がる側壁24とを有している。
Specifically, the back cover 2 has a horizontally long rectangular main wall 21 parallel to the back surface of the display panel 11, an upper wall 22 that is bent obliquely from the upper side of the main wall 21, and a lower wall that is bent vertically from the lower side of the main wall 21. The wall 23 and the side wall 24 bent vertically from the left and right sides of the main wall 21 are provided.
バックカバー2の主壁21には、複数の貫通孔からなる熱放射口25が形成されている。この熱放射口25は、表示装置1の内部の熱を直接的に外気へ逃がすためのものである。なお、図示は省略するが、バックカバー2には、熱放射口25の上方または下方に、複数の貫通孔からなる通気口が形成されていてもよい。これにより、熱放射口25を通じた空気の流通により冷却機能を高めることができる。例えば、通気口をバックカバー2の上壁22または下壁23に設けてもよい。通気口を熱放射口25の下方に形成した場合は、通気口が吸気口として機能し、通気口から取り込まれた外気が熱放射口25から排出される。熱の対流が生じるからである。反対に、通気口を熱放射口25の上方に形成した場合は、通気口が排気口として機能し、熱放射口25から取り込まれた外気が通気口から排出される。
The main wall 21 of the back cover 2 is formed with a heat radiation port 25 composed of a plurality of through holes. The heat radiation port 25 is for directly releasing the heat inside the display device 1 to the outside air. In addition, although illustration is abbreviate | omitted, in the back cover 2, the ventilation port which consists of a some through-hole may be formed in the upper direction or the downward direction of the thermal radiation port 25. FIG. Thereby, the cooling function can be enhanced by the flow of air through the heat radiation port 25. For example, a vent hole may be provided in the upper wall 22 or the lower wall 23 of the back cover 2. When the vent is formed below the heat radiation port 25, the vent functions as an intake port, and the outside air taken in from the vent is discharged from the heat radiation port 25. This is because heat convection occurs. On the contrary, when the vent is formed above the heat radiation port 25, the vent functions as an exhaust port, and the outside air taken in from the heat radiation port 25 is discharged from the vent.
次に、図3~5を参照して、放熱構造10の詳細を説明する。放熱構造10は、表示装置1の内部で発生した熱をバックカバー2を介して外部に逃がす構造である。なお、図4では、内部構造を明らかにするために、バックカバー2を省略している。
Next, details of the heat dissipation structure 10 will be described with reference to FIGS. The heat dissipation structure 10 is a structure that releases heat generated inside the display device 1 to the outside through the back cover 2. In FIG. 4, the back cover 2 is omitted in order to clarify the internal structure.
表示パネル11の背面には、回路基板3が当該背面と平行に取り付けられている。換言すれば、回路基板3は鉛直方向に平行である。回路基板3のバックカバー2側を向く面には、発熱部品4が実装されている。バックカバー2は、発熱部品4から離間して回路基板3を覆っている。
The circuit board 3 is attached to the back surface of the display panel 11 in parallel with the back surface. In other words, the circuit board 3 is parallel to the vertical direction. A heat generating component 4 is mounted on the surface of the circuit board 3 facing the back cover 2 side. The back cover 2 is separated from the heat generating component 4 and covers the circuit board 3.
回路基板3は、表示パネル11に出力する信号をコントロールする部品を搭載した基板である。出力する信号をコントロールする部品には様々なものがあり、中には動作時に高熱になる部品が存在する。この部品が発熱部品4である。発熱部品4で発生する熱は、放熱構造10により放熱される。
The circuit board 3 is a board on which components for controlling signals output to the display panel 11 are mounted. There are various parts that control the output signal, and there are parts that become hot during operation. This component is the heat generating component 4. Heat generated by the heat generating component 4 is radiated by the heat radiating structure 10.
発熱部品4は、例えば半導体チップである。半導体チップは、多数の回路が集積されたパッケージ構造を有する。回路基板3と反対側を向く発熱部品4の主面はフラットであり、当該主面にはメーカ名や品番がプリントされている。発熱部品4は、表示装置1の動作時に発熱して例えば100度以上になる。
The heat generating component 4 is, for example, a semiconductor chip. A semiconductor chip has a package structure in which a large number of circuits are integrated. The main surface of the heat generating component 4 facing away from the circuit board 3 is flat, and the manufacturer name and product number are printed on the main surface. The heat generating component 4 generates heat during the operation of the display device 1 and reaches, for example, 100 degrees or more.
発熱部品4とバックカバー2との間には、放熱板6が配置されている。放熱板6は、回路基板3、発熱部品4およびバックカバー2と共に放熱構造10を構成する。
A heat sink 6 is disposed between the heat generating component 4 and the back cover 2. The heat radiating plate 6 constitutes a heat radiating structure 10 together with the circuit board 3, the heat generating component 4 and the back cover 2.
放熱板6は、発熱部品4の熱を受け、その熱の一部を放射し、残りをバックカバー2に伝達する。放熱板6を構成する材料としては、例えばアルミニウム板が用いられる。アルミニウムは放射性能と熱伝導率が高いため、放熱板6に好適である。しかし、発熱部品の熱量によっては、他の金属でも代用が可能と考えられる。放熱板6は、ビス9によりバックカバー2に固定されている。
The heat sink 6 receives heat from the heat generating component 4, radiates a part of the heat, and transmits the rest to the back cover 2. For example, an aluminum plate is used as a material constituting the heat radiating plate 6. Aluminum is suitable for the heat sink 6 because of its high radiation performance and high thermal conductivity. However, depending on the amount of heat generated by the heat-generating component, other metals can be substituted. The heat sink 6 is fixed to the back cover 2 with screws 9.
本実施形態では、放熱板6は、一定の厚さのアルミニウム板が折り曲げ加工されることにより、鉛直方向に延びる溝を形成する形状に形成されている。ただし、溝が延びる方向は必ずしも鉛直方向である必要はなく、水平方向や斜め方向であってもよい。具体的に、放熱板6は、発熱部品4の真上に位置する第1面部61と、第1面部61の両側に位置する連結部62および第2面部63と、を含む。このように連結部62および第2面部63が第1面部61を挟んで対をなすように複数設けられていれば、組み立て時のバランスが良くなり、第1面部61にかかる圧力が分散されやすくなる。
In the present embodiment, the heat radiating plate 6 is formed in a shape that forms a groove extending in the vertical direction by bending an aluminum plate having a certain thickness. However, the direction in which the groove extends is not necessarily a vertical direction, and may be a horizontal direction or an oblique direction. Specifically, the heat radiating plate 6 includes a first surface portion 61 located right above the heat generating component 4, and a connecting portion 62 and a second surface portion 63 located on both sides of the first surface portion 61. Thus, if a plurality of connecting portions 62 and second surface portions 63 are provided so as to form a pair with the first surface portion 61 interposed therebetween, the balance at the time of assembly is improved, and the pressure applied to the first surface portion 61 is easily dispersed. Become.
第1面部61は、発熱部品4の主面に沿う、発熱部品4から熱が伝達される部分である。本実施形態では、第1面部61が発熱部品4の主面よりも大きな大きさを有しており、第1面部61が発熱部品4の周囲に張り出している。第1面部61の大きさは、発熱部品4の主面の1.5倍以上であることが好ましく、2倍以上であることがより好ましい。上述した熱放射口25は、バックカバー2の主壁21における第1面部61と対向する領域に形成されている。ただし、第1面部61の大きさは、図6Aに示すように発熱部品4の主面の大きさよりも小さくてもよい。
The first surface portion 61 is a portion along the main surface of the heat generating component 4 where heat is transmitted from the heat generating component 4. In the present embodiment, the first surface portion 61 has a size larger than the main surface of the heat generating component 4, and the first surface portion 61 protrudes around the heat generating component 4. The size of the first surface portion 61 is preferably 1.5 times or more of the main surface of the heat generating component 4, and more preferably 2 times or more. The heat radiation port 25 described above is formed in a region facing the first surface portion 61 in the main wall 21 of the back cover 2. However, the size of the first surface portion 61 may be smaller than the size of the main surface of the heat generating component 4 as shown in FIG. 6A.
本実施形態では、第1面部61と発熱部品4との間に弾性を有する熱伝導性部材5が挟まれており、第1面部61が熱伝導性部材5を介して発熱部品4に接触している。熱伝導性部材5としては、例えば熱伝導率が高いゴムを使用することができる。
In the present embodiment, a heat conductive member 5 having elasticity is sandwiched between the first surface portion 61 and the heat generating component 4, and the first surface portion 61 contacts the heat generating component 4 via the heat conductive member 5. ing. As the heat conductive member 5, for example, rubber having high heat conductivity can be used.
連結部62は、第1面部61の左右の縁からバックカバー2に近づくように立ち上がり、第1面部61と第2面部63とを一体的に連結している。本実施形態では、連結部62が第1面部61に対して鈍角に立ち上がっている。ただし、連結部62は、図6Aに示すように第1面部61に対して直角に立ち上がっていてもよいし、図6Bに示すように第1面部61に対して鋭角に立ち上がっていてもよい。
The connecting portion 62 rises from the left and right edges of the first surface portion 61 so as to approach the back cover 2 and integrally connects the first surface portion 61 and the second surface portion 63. In the present embodiment, the connecting portion 62 rises at an obtuse angle with respect to the first surface portion 61. However, the connecting portion 62 may rise at a right angle to the first surface portion 61 as shown in FIG. 6A, or may rise at an acute angle with respect to the first surface portion 61 as shown in FIG. 6B.
第2面部63は、連結部62の先端からバックカバー2に沿って第1面部61と反対側に広がっている。第2面部63は、第1面部61から連結部62を介して伝導する熱をバックカバー2に伝達する役割を果たす。本実施形態のように第2面部63が複数存在すると、熱を伝達する箇所が増えるので、発熱部品4の熱を効率的に放熱することができる。
The second surface portion 63 extends from the tip of the connecting portion 62 to the opposite side of the first surface portion 61 along the back cover 2. The second surface portion 63 plays a role of transmitting heat conducted from the first surface portion 61 through the connecting portion 62 to the back cover 2. When there are a plurality of second surface portions 63 as in the present embodiment, the number of locations where heat is transmitted increases, so that the heat of the heat generating component 4 can be efficiently radiated.
本実施形態では、各第2面部63とバックカバー2との間に弾性を有する熱伝導性部材7が挟まれており、第2面部63が熱伝導性部材7を介してバックカバー2に接触している。熱伝導性部材7としては、熱伝導性部材5と同様に、例えば熱伝導率が高いゴムを使用することができる。
In the present embodiment, a heat conductive member 7 having elasticity is sandwiched between each second surface portion 63 and the back cover 2, and the second surface portion 63 contacts the back cover 2 via the heat conductive member 7. is doing. As the heat conductive member 7, as with the heat conductive member 5, for example, rubber having high heat conductivity can be used.
第2面部63には、上下に突出する断面L字状の固定部64(図4参照)が設けられている。各固定部64の中央にはネジ穴が設けられており、このネジ孔にビス9がバックカバー2に設けられた貫通孔を通じてねじ込まれることにより、第2面部63がバックカバー2に締結される。
The second surface portion 63 is provided with a fixing portion 64 (see FIG. 4) having an L-shaped cross section that protrudes vertically. A screw hole is provided in the center of each fixing portion 64, and the second surface portion 63 is fastened to the back cover 2 by screwing the screw 9 into the screw hole through a through hole provided in the back cover 2. .
本実施形態では、上述したように第1面部61が発熱部品4の周囲に張り出しているとともに連結部62が第1面部61に対して鈍角に立ち上がっているため、発熱部品4の主面と直交する方向から見たときに、第2面部63が発熱部品4の外側に位置している。ただし、第1面部61の大きさが発熱部品4の主面よりも小さい場合、または連結部62が第1面部61に対して直角または鋭角に立ち上がる場合でも、発熱部品4の熱を拡散するという観点から、発熱部品4の主面と直交する方向から見たときに、第2面部63が発熱部品4の外側に位置することが好ましい。
In the present embodiment, as described above, the first surface portion 61 projects around the heat generating component 4 and the connecting portion 62 rises at an obtuse angle with respect to the first surface portion 61, so that it is orthogonal to the main surface of the heat generating component 4. The second surface portion 63 is located outside the heat generating component 4 when viewed from the direction of the heating. However, the heat of the heat generating component 4 is diffused even when the size of the first surface portion 61 is smaller than the main surface of the heat generating component 4 or when the connecting portion 62 rises at a right angle or an acute angle with respect to the first surface portion 61. From the viewpoint, it is preferable that the second surface portion 63 is located outside the heat generating component 4 when viewed from a direction orthogonal to the main surface of the heat generating component 4.
次に、以上説明した放熱構造10により、表示装置1内の発熱部品4から発生した熱が放熱される様子を説明する。放熱構造10が行う放熱現象は、熱放射と熱伝導と熱伝達によって説明される。以下個別に説明する。
Next, how the heat generated from the heat generating component 4 in the display device 1 is radiated by the heat dissipation structure 10 described above will be described. The heat dissipation phenomenon performed by the heat dissipation structure 10 is explained by heat radiation, heat conduction, and heat transfer. Each will be described below.
(熱放射)
発熱部品4から発生した熱は、伝熱ゴム5を介し、第1面部61へ伝達する。第1面部61で蓄積された熱は、第1面部61、連結部62およびバックカバー2で囲まれる空間に放射されるだけでなく、熱放射によって熱放射口25から直接的に外気へ放出される。そのため、熱放射口25によって効率的に熱放射が行われている。 (Thermal radiation)
The heat generated from theheat generating component 4 is transmitted to the first surface portion 61 via the heat transfer rubber 5. The heat accumulated in the first surface portion 61 is not only radiated to the space surrounded by the first surface portion 61, the connecting portion 62, and the back cover 2, but is also released directly from the heat radiation port 25 to the outside air by heat radiation. The Therefore, heat radiation is efficiently performed by the heat radiation port 25.
発熱部品4から発生した熱は、伝熱ゴム5を介し、第1面部61へ伝達する。第1面部61で蓄積された熱は、第1面部61、連結部62およびバックカバー2で囲まれる空間に放射されるだけでなく、熱放射によって熱放射口25から直接的に外気へ放出される。そのため、熱放射口25によって効率的に熱放射が行われている。 (Thermal radiation)
The heat generated from the
本実施形態においては、バックカバー2に熱放射口25を形成したが、本発明はこれに限定されない。熱放射口25を形成しなくとも、第1面部61から放射される熱はバックカバー2に伝達され、時間をかけてバックカバー2から放射される。これにより、十分な放熱性能を満たすことができる。
In the present embodiment, the heat radiation port 25 is formed in the back cover 2, but the present invention is not limited to this. Even if the heat radiation port 25 is not formed, the heat radiated from the first surface portion 61 is transmitted to the back cover 2 and radiated from the back cover 2 over time. Thereby, sufficient heat dissipation performance can be satisfied.
また、発熱部品4の発熱量によっては、熱伝導性部材5を介さずに、第1面部61を発熱部品4に近接させたり直接的に接触させたりしても十分放熱することができる。ただし、本実施形態のように熱伝導性部材5を介した場合は、金属である第1面部61が直接的に発熱部品4に接触するよりも、発熱部品4と放熱板6との接触面積を増やすことができる。よって、発熱部品4の熱を効率よく第1面部61に伝達することができる。結果として第1面部61から放射される熱量が増加する。
Depending on the amount of heat generated by the heat generating component 4, sufficient heat dissipation can be achieved even if the first surface portion 61 is brought close to or directly in contact with the heat generating component 4 without using the heat conductive member 5. However, when the heat conductive member 5 is interposed as in the present embodiment, the contact area between the heat generating component 4 and the heat radiating plate 6 rather than the first surface portion 61 that is a metal directly contacting the heat generating component 4. Can be increased. Therefore, the heat of the heat generating component 4 can be efficiently transmitted to the first surface portion 61. As a result, the amount of heat radiated from the first surface portion 61 increases.
(熱伝導)
放熱板6は、第1面部61と連結部62と第2面部63が連続した構成を有している。上述したように第1面部61には発熱部品4の熱が伝達する。第1面部61に伝達した熱は、熱伝導によって連結部62を介して第2面部63へ移動する。この間にも、発熱部品4の熱は連結部62から第1面部61、連結部62およびバックカバー2で囲まれる空間に放射される。 (Heat conduction)
Theheat sink 6 has a configuration in which the first surface portion 61, the connecting portion 62, and the second surface portion 63 are continuous. As described above, the heat of the heat generating component 4 is transmitted to the first surface portion 61. The heat transmitted to the first surface portion 61 moves to the second surface portion 63 via the connecting portion 62 by heat conduction. Also during this time, the heat of the heat generating component 4 is radiated from the connecting portion 62 to the space surrounded by the first surface portion 61, the connecting portion 62, and the back cover 2.
放熱板6は、第1面部61と連結部62と第2面部63が連続した構成を有している。上述したように第1面部61には発熱部品4の熱が伝達する。第1面部61に伝達した熱は、熱伝導によって連結部62を介して第2面部63へ移動する。この間にも、発熱部品4の熱は連結部62から第1面部61、連結部62およびバックカバー2で囲まれる空間に放射される。 (Heat conduction)
The
本実施形態では、連結部62が第1面部61に対して鈍角に立ち上がっている。すなわち、連結部62は第1面部61から外側に向かって広がっている。この構成では、第1面部61と連結部62とのコーナーにおいて放熱板6内部の組成破壊の量(放熱板6の内部に発生するクラック)が少ないため、放熱板6自身の熱伝導率の低下を防ぐことができる。また、第1面部61の熱放射を阻害しないという効果もある。さらには、連結部62が第1面部61から外側に向かって広がっていると、放熱板6がバックカバー2に与える応力を減少させることができる。
In the present embodiment, the connecting portion 62 rises at an obtuse angle with respect to the first surface portion 61. That is, the connecting part 62 extends outward from the first surface part 61. In this configuration, since the amount of composition breakdown inside the heat sink 6 (cracks generated inside the heat sink 6) is small at the corners of the first surface portion 61 and the connecting portion 62, the heat conductivity of the heat sink 6 itself is lowered. Can be prevented. Further, there is an effect that the thermal radiation of the first surface portion 61 is not inhibited. Furthermore, when the connecting portion 62 spreads outward from the first surface portion 61, the stress applied to the back cover 2 by the heat radiating plate 6 can be reduced.
また、第2面部63は第1面部61と平行であるために、第2面部63も連結部62に対して鈍角をなしている。すなわち、本実施形態では、連結部62と第2面部63のコーナーにおいても放熱板6内部の組成破壊の量が少なく、放熱板6自身の熱伝導率の低下を防ぐことができる。
Further, since the second surface portion 63 is parallel to the first surface portion 61, the second surface portion 63 also forms an obtuse angle with respect to the connecting portion 62. That is, in this embodiment, the amount of composition breakdown inside the heat sink 6 is small even at the corners of the connecting portion 62 and the second surface portion 63, and a decrease in the thermal conductivity of the heat sink 6 itself can be prevented.
(熱伝達)
上述したように第2面部63には発熱部品4の熱から熱放射された熱を除いた分の熱が到達する。第2面部63の熱は熱伝導性部材7を介してバックカバー2に伝達される。 (Heat transfer)
As described above, heat corresponding to the heat of the heat-generatingcomponent 4 excluding the heat radiated from the heat of the heat generating component 4 reaches the second surface portion 63. The heat of the second surface portion 63 is transmitted to the back cover 2 via the heat conductive member 7.
上述したように第2面部63には発熱部品4の熱から熱放射された熱を除いた分の熱が到達する。第2面部63の熱は熱伝導性部材7を介してバックカバー2に伝達される。 (Heat transfer)
As described above, heat corresponding to the heat of the heat-generating
発熱部品4の発熱量によっては、熱伝導性部材7を介さずに、第2面部63をバックカバー2に近接させたり直接的に接触させたりしても十分放熱することができる。ただし、本実施形態のように熱伝導性部材7を介した場合は、金属である第2面部63が直接的にバックカバー2に接触するよりも、バックカバー2と第2面部63との接触面積を増やすことができる。よって、第2面部63の熱を効率よくバックカバー2に伝達することができる。結果として第2面部63からバックカバー2に伝達される熱量が増加する。また、本実施形態のように熱伝導性部材7を介すると、バックカバー2と放熱板6との間に生じる公差を熱伝導性部材7の伸縮幅で吸収することができる。結果としてバックカバー2と放熱板6との間に隙間が生じるおそれを減少させることができる。
Depending on the amount of heat generated by the heat generating component 4, heat can be sufficiently radiated even if the second surface portion 63 is brought close to or directly in contact with the back cover 2 without using the heat conductive member 7. However, when the heat conductive member 7 is interposed as in the present embodiment, the contact between the back cover 2 and the second surface portion 63 rather than the metal second surface portion 63 directly contacting the back cover 2. The area can be increased. Therefore, the heat of the second surface portion 63 can be efficiently transmitted to the back cover 2. As a result, the amount of heat transferred from the second surface portion 63 to the back cover 2 increases. Further, when the heat conductive member 7 is interposed as in the present embodiment, the tolerance generated between the back cover 2 and the heat sink 6 can be absorbed by the expansion / contraction width of the heat conductive member 7. As a result, the possibility that a gap is generated between the back cover 2 and the heat sink 6 can be reduced.
また、本実施形態においては、第2面部63はバックカバー2に締結されている。このようにすると、第2面部63とバックカバー2との間に熱伝導性部材7を挟んだ場合に、当該熱伝導性部材7の使用量を減らすことができる。締結の度合いを調整することによって、第2面部63とバックカバー2との距離を任意に調節することが可能になるからである。なお、第2面部63とバックカバー2との間に熱伝導性部材7を挟まない場合であっても、バックカバー2と第2面部63とを近接もしくは接触させた状態で固定することができる。締結に用いる部品は適宜選択することができ、ビス9以外にもクランパーやリベットなどを用いることができる。
Further, in the present embodiment, the second surface portion 63 is fastened to the back cover 2. If it does in this way, when the heat conductive member 7 is pinched | interposed between the 2nd surface part 63 and the back cover 2, the usage-amount of the said heat conductive member 7 can be reduced. This is because the distance between the second surface portion 63 and the back cover 2 can be arbitrarily adjusted by adjusting the degree of fastening. Even when the heat conductive member 7 is not sandwiched between the second surface portion 63 and the back cover 2, the back cover 2 and the second surface portion 63 can be fixed in the proximity or in contact with each other. . Parts used for fastening can be selected as appropriate, and a clamper, a rivet or the like can be used in addition to the screw 9.
<変形例>
前記実施形態では、連結部62および第2面部63が2つずつ設けられていたが、これらは1つずつ設けられていてもよいし、3つ以上ずつ設けられていてもよい。 <Modification>
In the embodiment, two connectingportions 62 and two second surface portions 63 are provided, but these may be provided one by one, or may be provided by three or more.
前記実施形態では、連結部62および第2面部63が2つずつ設けられていたが、これらは1つずつ設けられていてもよいし、3つ以上ずつ設けられていてもよい。 <Modification>
In the embodiment, two connecting
前記実施形態では、一定の厚さのアルミニウム板が折り曲げ加工されることにより放熱板6が製造されていたが、放熱板6は押し出し成型により製造されてもよい。この場合には、第1面部61の発熱部品4と反対側の面に放射性能を向上させるための凹凸を形成することも可能である。
In the embodiment, the heat sink 6 is manufactured by bending an aluminum plate having a constant thickness, but the heat sink 6 may be manufactured by extrusion molding. In this case, it is also possible to form irregularities for improving the radiation performance on the surface of the first surface portion 61 opposite to the heat generating component 4.
本発明の放熱構造は、薄型テレビや屋外表示用ディスプレイなどの筐体内の熱を放熱する構造として有用である。
The heat dissipating structure of the present invention is useful as a structure for dissipating heat in a housing such as a flat-screen television or an outdoor display.
Claims (11)
- 回路基板と、
前記回路基板に実装された、フラットな主面を有する発熱部品と、
前記発熱部品から離間して前記回路基板を覆う外殻部材と、
前記発熱部品と前記外郭部材との間に配置された放熱板であって、前記発熱部品の主面に沿う、前記発熱部品から熱が伝達される第1面部、前記第1面部の縁から前記外殻部材に近づくように立ち上がる連結部、および前記連結部の先端から前記外殻部材に沿って前記第1面部と反対側に広がる、前記第1面部から前記連結部を介して伝導する熱を前記外殻部材に伝達する第2面部、を有する放熱板と、
を備えた、放熱構造。 A circuit board;
A heat-generating component having a flat main surface mounted on the circuit board;
An outer shell member that is spaced apart from the heat generating component and covers the circuit board;
A heat radiating plate disposed between the heat generating component and the outer member, the first surface portion along which the heat is transmitted from the heat generating component along the main surface of the heat generating component, from the edge of the first surface portion A connecting portion that rises so as to approach the outer shell member, and heat conducted from the first surface portion through the connecting portion that spreads from the tip of the connecting portion along the outer shell member to the side opposite to the first surface portion. A heat sink having a second surface portion for transmitting to the outer shell member;
With heat dissipation structure. - 前記第2面部は、前記発熱部品の主面と直交する方向から見たときに、前記発熱部品の外側に位置する、請求項1に記載の放熱構造。 The heat dissipation structure according to claim 1, wherein the second surface portion is located outside the heat generating component when viewed from a direction orthogonal to the main surface of the heat generating component.
- 前記第1面部は、前記発熱部品の周囲に張り出している、請求項1に記載の放熱構造。 The heat dissipation structure according to claim 1, wherein the first surface portion projects around the heat generating component.
- 前記連結部および前記第2面部は、前記第1面部を挟んで対をなすように複数設けられている、請求項1に記載の放熱構造。 2. The heat dissipation structure according to claim 1, wherein a plurality of the connection portions and the second surface portions are provided so as to form a pair with the first surface portion interposed therebetween.
- 前記連結部は、前記第1面部に対して鈍角に立ち上がる、請求項1に記載の放熱構造。 The heat dissipation structure according to claim 1, wherein the connecting portion rises at an obtuse angle with respect to the first surface portion.
- 前記第1面部と前記発熱部品との間に挟まれた、弾性を有する熱伝導性部材をさらに備える、請求項1に記載の放熱構造。 The heat dissipation structure according to claim 1, further comprising a heat conductive member having elasticity sandwiched between the first surface portion and the heat generating component.
- 前記第2面部と前記外殻部材との間に挟まれた、弾性を有する熱伝導性部材をさらに備える、請求項1に記載の放熱構造。 The heat dissipation structure according to claim 1, further comprising an elastic heat conductive member sandwiched between the second surface portion and the outer shell member.
- 前記第2面部は、前記外殻部材に締結されている、請求項1に記載の放熱構造。 The heat dissipation structure according to claim 1, wherein the second surface portion is fastened to the outer shell member.
- 前記外殻部材における前記第1面部と対向する領域には、複数の貫通孔からなる熱放射口が形成されている、請求項1に記載の放熱構造。 The heat dissipation structure according to claim 1, wherein a heat radiation port including a plurality of through holes is formed in a region of the outer shell member facing the first surface portion.
- 前記回路基板は、鉛直方向に平行であり、
前記外殻部材は、前記熱放射口の下方に形成された吸気口、または前記熱放射口の上方に形成された排気口を有する、請求項9に記載の放熱構造。 The circuit board is parallel to the vertical direction,
The heat dissipation structure according to claim 9, wherein the outer shell member has an intake port formed below the thermal radiation port or an exhaust port formed above the thermal radiation port. - 映像を表示する表示パネルをさらに備え、
前記外殻部品は、前記表示パネルの背面を覆うバックカバーである、請求項1に記載の放熱構造。 A display panel for displaying images;
The heat dissipation structure according to claim 1, wherein the outer shell part is a back cover that covers a back surface of the display panel.
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