CN209676570U - Shield radiator structure and display device - Google Patents
Shield radiator structure and display device Download PDFInfo
- Publication number
- CN209676570U CN209676570U CN201821753347.3U CN201821753347U CN209676570U CN 209676570 U CN209676570 U CN 209676570U CN 201821753347 U CN201821753347 U CN 201821753347U CN 209676570 U CN209676570 U CN 209676570U
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- bottom plate
- cooling fin
- shielding
- radiator structure
- wiring board
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of shielding radiator structure, comprising: wiring board, wiring board are equipped with euthermic chip；Cooling fin is set on euthermic chip；Shielding case covers on wiring board and has been enclosed accommodating chamber with wiring board, and cooling fin and euthermic chip are set in accommodating chamber；Thermally conductive sheet is connected between cooling fin and shielding case, for conducting the heat of cooling fin to shielding case.The utility model additionally provides a kind of display device, including liquid crystal display panel and backlight module, and liquid crystal display panel includes above-mentioned shielding radiator structure.Shielding radiator structure provided by the utility model, to improve the heat dissipation effect of shielding radiator structure, improves the service life of the display device by increasing thermally conductive sheet between cooling fin and shielding case.
Description
Technical field
The utility model belongs to field of display technology, is to be related to a kind of shielding radiator structure and display dress more specifically
It sets.
Background technique
Electronic element on PCB (Printed circuit board printed wiring board) plate has radiativity, in order to anti-
Only the other structures of display device are radiated, and are generally covered on pcb board using shielding case, then by setting on master chip
Cooling fin is set to radiate to the heat on master chip, but such heat dissipation effect is not highly desirable.
Utility model content
The purpose of this utility model is to provide a kind of shielding radiator structures, are set to master chip and screen to solve cooling fin
Cover the bad technical problem of heat dissipation effect between cover.
In order to achieve the above purposes, the technical solution adopted by the utility model is: provides a kind of shielding radiator structure, packet
It includes:
Wiring board, the wiring board are equipped with euthermic chip；
Cooling fin is set on the euthermic chip；
Shielding case covers on the wiring board and has been enclosed accommodating chamber with the wiring board, the cooling fin and
The euthermic chip is set in the accommodating chamber；
Thermally conductive sheet is connected between the cooling fin and the shielding case, for by the heat of the cooling fin conduct to
The shielding case.
Optionally, one layer of heat-conducting layer is coated between the euthermic chip and the cooling fin.
Optionally, the heat-conducting layer is thermal grease layer.
Optionally, the cooling fin is fin-shaped cooling fin.
Optionally, the euthermic chip includes
First side is abutted with the wiring board；
Second side is oppositely arranged with the first side；
The cooling fin includes:
First bottom plate is abutted with the second side；
Fin-shaped piece is set on first bottom plate, abuts with the thermally conductive sheet.
Optionally, the euthermic chip also includes
Third side is connected between the first side and the second side；
4th side is connected between the first side and the second side, and opposite with the third side is set
It sets；
5th side connects with the first side, the second side, the third side and the 4th side respectively
It connects；
6th side connects with the first side, the second side, the third side and the 4th side respectively
It connects, and is oppositely arranged with the 5th side；
The cooling fin further include:
Second bottom plate connect with first bottom plate and abuts against with the third side；
Third bottom plate connect with first bottom plate and abuts against with the 4th side；
4th bottom plate connect with first bottom plate and abuts against with the 5th side；
5th bottom plate connect with first bottom plate and abuts against with the 6th side；
Wherein, fin-shaped is designed on second bottom plate, the third bottom plate, the 4th bottom plate and the 5th bottom plate
Piece.
Optionally, first bottom plate is greater than or equal to the euthermic chip along first direction along the length of first direction
Length, the width of first bottom plate in a second direction are greater than or equal to the width of the euthermic chip in a second direction.
Optionally, the shielding case includes:
Top plate is oppositely arranged with the wiring board；
Side plate is connected between the top plate and the wiring board；
The thermally conductive sheet is connected between the fin-shaped piece and the top plate inner wall.
Optionally, the thermally conductive sheet is heat-conducting silica gel sheet.
The utility model additionally provides a kind of display device, including liquid crystal display panel and backlight module, the liquid crystal display panel packet
Include above-mentioned shielding radiator structure.
The beneficial effect of shielding radiator structure provided by the utility model is: shielding heat dissipation knot provided by the utility model
Structure, by the setting of cooling fin and thermally conductive sheet, and cooling fin is set on euthermic chip, and thermally conductive sheet is connected to cooling fin and shielding case
Between, in this way, cooling fin can by euthermic chip issue heat spreader go out, thermally conductive sheet the heat on cooling fin can be conducted to
On shielding case, not only expand heat dissipation area and achieve the effect that fast cooling, at the same the structure of the shielding radiator structure it is simple, at
This is low, and production operation is easy to operate.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only that this is practical new
Some embodiments of type for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the structural schematic diagram for the display device that the utility model embodiment one provides；
Fig. 2 is the structural schematic diagram for the shielding heat radiation structure device that the utility model embodiment one provides；
Fig. 3 is the schematic cross-sectional view of Fig. 2；
Fig. 4 is the structural schematic diagram of cooling fin in Fig. 3；
Fig. 5 is the structural schematic diagram of cooling fin and euthermic chip that the utility model embodiment two provides.
Wherein, each appended drawing reference in figure:
1- shields radiator structure；2- liquid crystal display panel；3- backlight module；10- accommodating chamber；11- wiring board；12 (12a)-dissipate
Backing；13- shielding case；14- thermally conductive sheet；15- euthermic chip；The first bottom plate of 121-；122- fin-shaped piece；The second bottom plate of 123-；
124- third bottom plate；The 4th bottom plate of 125-；The 5th bottom plate of 126-；131- top plate；132- side plate；151- first side；152-
Two side faces；153- third side；The 4th side 154-；The 5th side 155-；The 6th side 156-；X- first direction；Y- second
Direction.
Specific embodiment
In order to which technical problem to be solved in the utility model, technical solution and beneficial effect is more clearly understood, with
Lower combination accompanying drawings and embodiments carry out optional detailed description to the utility model.It should be appreciated that specific implementation described herein
Example is only used to explain the utility model, is not used to limit the utility model.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or indirectly on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" "inner", "outside" is that orientation based on the figure or position are closed
System, is merely for convenience of describing the present invention and simplifying the description, rather than the device or element of indication or suggestion meaning are necessary
It with specific orientation, is constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.The meaning of " plurality " is two or two in the description of the present invention,
More than, unless otherwise specifically defined.
Please refer to figs. 2 and 3 together, is now illustrated to shielding radiator structure 1 provided by the utility model.The shielding dissipates
Heat structure 1 include wiring board 11, cooling fin 12, shielding case 13 and thermally conductive sheet 14, wiring board 11 can be mobile phone, tablet computer,
The pcb board (Printed circuit board printed wiring board) of all kinds of display products such as liquid crystal display and LCD TV,
Wiring board 11 is also possible to the pcb board of each electronic equipment such as air-conditioning, refrigerator, and wiring board 11 is equipped with euthermic chip 15, heat generating core
Piece 15 refers to the biggish chip that generates heat on wiring board 11, refers in particular to CPU (Central Processing Unit/
Processor central processing unit) chip, on euthermic chip 15, cooling fin 12 is used for euthermic chip 15 cooling fin 12
Heat distribute into air, shielding case 13 covers on wiring board 11, and shielding case 13 and wiring board 11 have been enclosed receiving
Chamber 10, thermally conductive sheet 14, cooling fin 12 and euthermic chip 15 are set in accommodating chamber 10, and thermally conductive sheet 14 is connected to cooling fin 12 and shielding
Between cover 13, thermally conductive sheet 14 is for guiding the heat of cooling fin 12 to shielding case 13.
Shielding radiator structure 1 provided by the utility model, by the setting of cooling fin 12 and thermally conductive sheet 14, and cooling fin 12
On euthermic chip 15, thermally conductive sheet 14 is connected between cooling fin 12 and shielding case 13, in this way, cooling fin 12 can be by heat generating core
The heat spreader that piece 15 issues is gone out, and thermally conductive sheet 14 can conduct the heat on cooling fin 12 to shielding case 13, not only expand
Heat dissipation area achievees the effect that fast cooling, while the structure of the shielding radiator structure 1 is simple, at low cost, production operation behaviour
Facilitate.
Optionally, a kind of specific embodiment as shielding radiator structure 1 provided by the utility model, above-mentioned heat generating core
One layer of heat-conducting layer (not shown) is coated between piece 15 and cooling fin 12, heat-conducting layer is used for the heat on euthermic chip 15
On conduction to cooling fin 12, by the design of heat-conducting layer, the heat on euthermic chip 15 is quickly conducted to heat dissipation
It on piece 12 and distributes, to prevent euthermic chip 15 from causing the service life to shorten since temperature is excessively high.
Optionally, a kind of specific embodiment as shielding radiator structure 1 provided by the utility model, above-mentioned heat-conducting layer
For thermal grease layer, heat-conducting silicone grease is filled in the gap between cooling fin 12 and euthermic chip 15, can be to cooling fin 12
The heat of conduction 15 radiating treatment of euthermic chip makes euthermic chip 15 be maintained at the level that can be worked with temperature, prevents from sending out
Hot chip 15 is damaged because of radiating bad, and extends the service life of euthermic chip 15.
Optionally, referring to Fig. 4, as a kind of specific embodiment provided by the utility model for shielding radiator structure 1,
Above-mentioned cooling fin 12 is fin-shaped cooling fin 12, and 12 structure of fin-shaped cooling fin is simple, while heat dissipation effect.In the present embodiment, on
Cooling fin 12 is stated to be made of aluminum alloy materials.Certainly, in the other embodiments of the utility model, according to the actual situation and have
Body requirement, above-mentioned cooling fin 12 can also be used the materials such as brass or bronze and be made, and not do unique restriction herein.
Optionally, Fig. 3 and Fig. 4 is please referred to, a kind of specific implementation as shielding radiator structure 1 provided by the utility model
Mode, above-mentioned euthermic chip 15 have first side 151 and second side 152, and first side 151 is abutted with wiring board 11, the
Two side faces 152 are oppositely arranged with first side 151.Cooling fin 12 includes the first bottom plate 121 and muti-piece fin-shaped piece 122, the first bottom
Plate 121 is abutted with second side 152, and each fin-shaped piece 122 is set on the first bottom plate 121 side by side and abuts 14 with thermally conductive sheet.At this
In embodiment, above-mentioned first bottom plate 121 is integrally formed with fin-shaped piece 122, so that the manufacturing cost of the cooling fin 12 is low.Certainly,
In the other embodiments of the utility model, according to the actual situation and specific requirement, above-mentioned first bottom plate 121 and fin-shaped piece 122
It can also be separately formed and be connected by fastener, not do unique restriction herein.
Optionally, Fig. 3 and Fig. 4 is please referred to, a kind of specific implementation as shielding radiator structure 1 provided by the utility model
Mode, above-mentioned first bottom plate 121 along first direction X length be greater than or equal to euthermic chip 15 along first direction X length,
The width of first bottom plate 121 Y in a second direction is greater than or equal to the width of the Y in a second direction of euthermic chip 15, i.e. the first bottom plate
121 area of plane is greater than the area of plane of euthermic chip 15, in this way, making the contact surface of euthermic chip 15 and cooling fin 12 most
Bigization, so that the heat dissipation effect of cooling fin 12 is more preferable.In the present embodiment, above-mentioned euthermic chip 15 and the first bottom plate 121
It is all direction structure, above-mentioned first direction X is the transverse direction in Fig. 4, and second direction Y is the longitudinal direction in Fig. 4, first party
It is mutually perpendicular to X and second direction Y.Certainly, it in the other embodiments of the utility model, wants according to the actual situation and specifically
It asks, above-mentioned first direction X is also the longitudinal direction in Fig. 4, and second direction Y is the transverse direction or first direction X and second party in Fig. 4
It is certain specific directions to Y, does not do unique restriction herein.
In some other embodiment of the utility model, according to the actual situation and specific requirement, above-mentioned cooling fin 12
Length and width might be less that the length and width of euthermic chip 15, not do unique restriction herein.
Optionally, please refer to figs. 2 and 3, a kind of specific implementation as shielding radiator structure 1 provided by the utility model
Mode, above-mentioned shielding case 13 include top plate 131 and side plate 132, and top plate 131 is oppositely arranged with wiring board 11, and side plate 132 connects
Between top plate 131 and wiring board 11, thermally conductive sheet 14 is connected between 131 inner wall of fin-shaped piece 122 and top plate.Specifically, shielding
Cover 13 includes four side plates 132, and four side plates 132 are connect with top plate 131 respectively, top plate 131, four side plates 132 and wiring boards
11 are enclosed above-mentioned accommodating chamber 10.In the present embodiment, above-mentioned shielding case 13 is made of materials such as Alpaka or foreign white coppers,
Foreign white copper good welding performance, wiring board 11 are equipped with pad, and the bottom end of side plate 132 is welded on pad.
Optionally, a kind of specific embodiment as shielding radiator structure 1 provided by the utility model, above-mentioned thermally conductive sheet
14 be heat-conducting silica gel sheet, heat-conducting silica gel sheet have it is thermally conductive, will not solidification and will not be conductive characteristic, pass through heat-conducting silica gel sheet energy
It is enough preferably to conduct the heat of cooling fin 12 to shielding case 13.In the present embodiment, above-mentioned thermally conductive sheet 14 is along first direction X
On length be greater than length of the cooling fin 12 on first direction X, thermally conductive sheet 14 in a second direction the width on Y be greater than it is thermally conductive
The width on Y in a second direction of piece 14, so that the heat-conducting effect of thermally conductive sheet 14 is more preferable.Certainly, the utility model its
In his embodiment, according to the actual situation and specific requirement, above-mentioned thermally conductive sheet 14 can also be heat conductive graphite piece, above-mentioned thermally conductive sheet 14
Length and width might be less that the length and width of cooling fin 12, do not do unique restriction herein.
Optionally, in the present embodiment, the coefficient of heat transfer of above-mentioned heat-conducting silica gel sheet is 1.1w/-k, the material of heat-conducting silica gel sheet
Material hardness is 30shorec, and fire-retardant coefficient is UL94V-0, proof voltage 8KV/mm, inventors have found that using having above-mentioned heat dissipation system
Several and material heat-conducting silica gel sheet, can make above-mentioned 15 temperature of euthermic chip reduce by 8 ° -15 °.
Referring to Fig. 1, the utility model additionally provides a kind of display device, including liquid crystal display panel 2, backlight module 3, center
4 and front frame 5, liquid crystal display panel 2 includes above-mentioned shielding radiator structure 1.The display device of the utility model is radiated by above-mentioned shielding
The design of structure 1, so that the heat dissipation effect of the display device is more preferable, the service life is longer.
Embodiment two
The shielding radiator structure of the present embodiment and the technical characteristic of the shielding radiator structure in embodiment one are essentially identical,
Difference is: referring to Fig. 5, euthermic chip described above 15 also has third side 153, the 4th side 154, the 5th side
155 and the 6th side 156, third side 153 be connected between first side 151 and second side 152, the 4th side 154 connects
It is connected between first side 151 and second side 152, and is oppositely arranged with third side 153, the 5th side 155 is respectively with
One side 151, second side 152, third side 153 and the 4th side 154 connection, the 6th side 156 respectively with first side
151, second side 152, third side 153 and the connection of the 4th side 154, and be oppositely arranged with the 5th side 155.Above-mentioned heat dissipation
Piece 12a further includes the second bottom plate 123, third bottom plate 124, the 4th bottom plate 125 and the 5th bottom plate 125, the second bottom plate 123 and
One bottom plate 121 connect simultaneously abutted against with third side 153, third bottom plate 124 connect with the first bottom plate 121 and with the 4th side
154 abut against, and the 4th bottom plate 125 connect with the first bottom plate 121 and abuts against with the 5th side 155, the 5th bottom plate 125 and
One bottom plate 121 connect simultaneously abutted against with the 6th side 156, wherein the second bottom plate 123, third bottom plate 124, the 4th bottom plate 125 and
Fin-shaped piece 122 is designed on 5th bottom plate 125.In this way, passing through the first bottom plate 121, the second bottom plate 123, third bottom plate 124, the
Four bottom plates 125 and the 5th bottom plate 125 have been enclosed an accommodating cavity, and entire euthermic chip 15 is placed in accommodating cavity, from
And the heat dissipation area of euthermic chip 15 is made to reach maximization, so that the heat of euthermic chip 15 can quickly radiate out
It goes, improves the service life of euthermic chip 15.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (10)
1. shielding radiator structure characterized by comprising
Wiring board, the wiring board are equipped with euthermic chip；
Cooling fin is set on the euthermic chip；
Shielding case covers on the wiring board and has been enclosed accommodating chamber with the wiring board, the cooling fin and described
Euthermic chip is set in the accommodating chamber；
Thermally conductive sheet is connected between the cooling fin and the shielding case, for conducting the heat of the cooling fin to described
Shielding case.
2. shielding radiator structure as described in claim 1, which is characterized in that applied between the euthermic chip and the cooling fin
Equipped with one layer of heat-conducting layer.
3. shielding radiator structure as claimed in claim 2, which is characterized in that the heat-conducting layer is thermal grease layer.
4. shielding radiator structure as described in claim 1, which is characterized in that the cooling fin is fin-shaped cooling fin.
5. shielding radiator structure as claimed in claim 4, which is characterized in that the euthermic chip includes
First side is abutted with the wiring board；
Second side is oppositely arranged with the first side；
The cooling fin includes:
First bottom plate is abutted with the second side；
Fin-shaped piece is set on first bottom plate, abuts with the thermally conductive sheet.
6. shielding radiator structure as claimed in claim 5, which is characterized in that the euthermic chip also includes
Third side is connected between the first side and the second side；
4th side is connected between the first side and the second side, and is oppositely arranged with the third side；
5th side is connect with the first side, the second side, the third side and the 4th side respectively；
6th side is connect with the first side, the second side, the third side and the 4th side respectively,
And it is oppositely arranged with the 5th side；
The cooling fin further include:
Second bottom plate connect with first bottom plate and abuts against with the third side；
Third bottom plate connect with first bottom plate and abuts against with the 4th side；
4th bottom plate connect with first bottom plate and abuts against with the 5th side；
5th bottom plate connect with first bottom plate and abuts against with the 6th side；
Wherein, fin-shaped piece is designed on second bottom plate, the third bottom plate, the 4th bottom plate and the 5th bottom plate.
7. shielding radiator structure as claimed in claim 5, which is characterized in that first bottom plate is big along the length of first direction
In or equal to the euthermic chip along the length of first direction, the width of first bottom plate in a second direction is more than or equal to institute
State the width of euthermic chip in a second direction.
8. shielding radiator structure as claimed in claim 5, which is characterized in that the shielding case includes:
Top plate is oppositely arranged with the wiring board；
Side plate is connected between the top plate and the wiring board；
The thermally conductive sheet is connected between the fin-shaped piece and the top plate inner wall.
9. shielding radiator structure as claimed in any one of claims 1 to 8, which is characterized in that the thermally conductive sheet is heat conductive silica gel
Piece.
10. display device, including liquid crystal display panel and backlight module, which is characterized in that the liquid crystal display panel further includes that right such as is wanted
Seek 1 to 9 described in any item shielding radiator structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821753347.3U CN209676570U (en) | 2018-10-26 | 2018-10-26 | Shield radiator structure and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821753347.3U CN209676570U (en) | 2018-10-26 | 2018-10-26 | Shield radiator structure and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209676570U true CN209676570U (en) | 2019-11-22 |
Family
ID=68560901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821753347.3U Active CN209676570U (en) | 2018-10-26 | 2018-10-26 | Shield radiator structure and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209676570U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113099704A (en) * | 2021-05-20 | 2021-07-09 | 特兰旗（厦门）科技有限公司 | Graphene heating sheet assembly and corrugated heat dissipation device |
| CN113225971A (en) * | 2020-01-21 | 2021-08-06 | 华为技术有限公司 | Terminal equipment |
-
2018
- 2018-10-26 CN CN201821753347.3U patent/CN209676570U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225971A (en) * | 2020-01-21 | 2021-08-06 | 华为技术有限公司 | Terminal equipment |
| CN113099704A (en) * | 2021-05-20 | 2021-07-09 | 特兰旗（厦门）科技有限公司 | Graphene heating sheet assembly and corrugated heat dissipation device |
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