WO2020052028A1

WO2020052028A1 - Flexible electronic device

Info

Publication number: WO2020052028A1
Application number: PCT/CN2018/113954
Authority: WO
Inventors: 刘景�; 陈松亚
Original assignee: 深圳市柔宇科技有限公司
Priority date: 2018-09-14
Filing date: 2018-11-05
Publication date: 2020-03-19
Also published as: WO2020052030A1; CN112639671A; CN112640395A; WO2020051904A1; CN112640597A

Abstract

A flexible electronic device (100), of which a first part (10) comprises a first heat dissipating body (11), a second part (20) comprises a second heat dissipating body (21), a connecting part (30) is bendable, the connecting part (30) is connected to the first part (10) and to the second part (20), a flexible thermally-conductive layer (40) is thermal-conductively connected to the first heat dissipating body (11) and to the second heat dissipating body (21), a bending area (403) of the flexible thermally-conductive layer (40) corresponds to the connecting part (30), and the bending area (403) of the flexible thermally-conductive layer (40) is not fixedly connected to the connecting part (30).

Description

Flexible electronic device

Technical field

The present application relates to the field of consumer electronics technology, and more particularly, to a flexible electronic device.

Background technique

A flexible electronic device in the related art, such as a flexible mobile phone, includes a first part and a second part. Generally, the first part is provided with a motherboard, and the second part is provided with a battery. Since the heat generated by the motherboard heat is relatively large, the flexible electronic device in the related art is provided with a flexible heat-conducting layer connecting the first part and the second part, so that the first part transmits heat to the second part to form uniform temperature heat dissipation. However, after the flexible electronic device is folded and bent for many times, the flexible thermally conductive layer is susceptible to force and generates blistering and wrinkling, which may cause the flexible thermally conductive layer to break, and affect the heat dissipation capacity of the flexible thermally conductive layer, and then affect the user experience.

Application content

The present application provides a flexible electronic device.

The flexible electronic device according to the embodiment of the present application includes a first portion, a second portion, a bendable connection portion, and a flexible thermally conductive layer. The first portion includes a first heat sink, and the second portion includes a second heat sink. A connecting portion connects the first portion and the second portion, the flexible heat-conducting layer thermally connects the first heat sink and the second heat sink, and a bent region of the flexible heat-conducting layer and the connecting portion Correspondingly, the bent area of the flexible thermally conductive layer is not fixedly connected to the connecting portion.

In the above-mentioned flexible electronic device, since the bending area of the flexible thermally conductive layer is not fixedly connected to the connection portion, this can reduce the stress on the bending area of the flexible thermally conductive layer during bending, so the flexible thermally conductive layer is not easily caused by the connection portion. Foaming or wrinkling occurs after multiple bending, and the flexible thermally conductive layer is not prone to faults, which can ensure the ability of the flexible thermally conductive layer to conduct heat and improve the user experience.

Additional aspects and advantages of the embodiments of the present application will be partially given in the following description, and part of them will become apparent from the following description, or be learned through practice of the present application.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

1 is a schematic perspective view of a flexible electronic device according to an embodiment of the present application when it is flattened;

2 is a schematic perspective view of a flexible electronic device according to an embodiment of the present application when it is folded;

3 is a schematic exploded perspective view of a part of a structure of a flexible electronic device during flattening according to an embodiment of the present application;

4 is a schematic perspective exploded view of another aspect of the flexible electronic device during flattening according to an embodiment of the present application;

5 is an exploded perspective view of another aspect of the flexible electronic device during flattening according to an embodiment of the present application;

6 is an exploded perspective view of another part of the structure of the flexible electronic device during flattening according to an embodiment of the present application;

7 is a schematic exploded perspective view of a flexible electronic device according to an embodiment of the present application when it is flattened;

8 is a schematic cross-sectional view of a flexible electronic device according to an embodiment of the present application when flattened;

9 is a schematic cross-sectional view of a part of a structure of a flexible electronic device during flattening according to an embodiment of the present application;

10 is a schematic cross-sectional view of a flexible electronic device according to an embodiment of the present application when it is folded.

Explanation of main component symbols:

Flexible electronic device 100;

The first part 10, the first heat sink 11, the receiving groove 110, the first groove 111, the main board component 12, the main board 121, the first chip part 122, the first shielding cover 1221, the first chip 1222, the first heat conductive layer 1223, The second chip portion 123, the second shield cover 1231, the second chip 1232, the second heat conductive layer 1233, the sub-plate 124, the first cover 13, the first mounting cavity 130, the third heat conductive layer 14, the second portion 20, The second heat sink 21, the second groove 211, the battery component 22, the second cover 23, the second mounting cavity 230, the fourth heat conductive layer 24, the connection portion 30, the support plate 31, the bending piece 32, and the connection piece 33 , First notch 34, second notch 35, flexible thermally conductive layer 40, first non-bent region 401, second non-bent region 402, bent region 403, gap 41, adhesive layer 50, first adhesive layer 51. The second adhesive layer 52, the flexible screen assembly 60, the supporting frame 61, and the flexible display screen 62.

detailed description

The embodiments of the present application are described in detail below. Examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application, and should not be construed as limiting the present application.

In the description of this application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Rear "," left "," right "," vertical "," horizontal "," top "," bottom "," inside "," outside "," clockwise "," counterclockwise ", etc. or The positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, structure and operation in a specific orientation, Therefore, it cannot be understood as a limitation on this application. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be interpreted as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality" is two or more, unless specifically defined otherwise.

In the description of this application, it should be noted that the terms "installation", "connected", and "connected" should be understood in a broad sense unless explicitly stated and limited otherwise. For example, they may be fixed connections or removable. Connected, or integrated. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

Please refer to FIGS. 1-10 together. The flexible electronic device 100 according to the embodiment of the present application can be bent. The flexible electronic device 100 may be, for example, a flexible folding mobile phone or a flexible folding tablet computer. The flexible electronic device 100 includes a first portion 10, a second portion 20, a connection portion 30, and a flexible thermally conductive layer 40.

The first portion 10 includes a first heat sink 11. The second portion 20 includes a second heat sink 21. The connecting portion 30 can be bent. The connecting portion 30 connects the first portion 10 and the second portion 20. The flexible thermally conductive layer 40 thermally connects the first heat sink 11 and the second heat sink 21. The bending area 403 of the flexible thermally conductive layer 40 corresponds to the connecting portion 30 and the bending area of the flexible thermally conductive layer 40 is not fixedly connected to the connecting portion 30. In this way, since the bending area 403 of the flexible thermally conductive layer 40 is not fixedly connected to the connection portion 30, the stress applied to the bending area 403 of the flexible thermally conductive layer 40 during bending can be reduced, so the flexible thermally conductive layer 40 is not easily caused by the connection. The foaming or wrinkling phenomenon is caused by the multiple bending of the portion 30, and the flexible thermally conductive layer 40 is not prone to generate faults, which can ensure the ability of the flexible thermally conductive layer 40 to conduct heat and improve the user experience.

It should be noted that the connecting portion 30 can realize the relative rotation of the first portion 10 and the second portion 20. The bending region 403 of the flexible thermally conductive layer 40 can be bent as the connecting portion 30 is bent.

In some embodiments, a gap 41 is provided between the bending region 403 of the flexible thermally conductive layer 40 and the connection portion 30.

It can be understood that the size of the gap 41 left between the bending area 403 of the flexible thermally conductive layer 40 and the connecting portion 30 can be set according to specific conditions, and the setting of the gap 41 can provide cushioning to the flexible thermally conductive layer 40 that is bent by force. The space, in turn, allows the entire flexible heat conducting layer 40 to be more uniformly stressed, thereby preventing wrinkles from occurring. In addition, since there is a gap 41 between the flexible thermally conductive layer 40 and the connection portion 30, this also prevents the connection portion 30 from contacting the flexible thermally conductive layer 40 and abrasion of the flexible thermally conductive layer 40.

In some embodiments, the bending region 403 of the flexible thermally conductive layer 40 can be in contact with the connecting portion 30 when subjected to an external force. In this way, when an external force is applied (for example, a pressing force), a hollow phenomenon is unlikely to occur between the bending region 403 of the flexible thermally conductive layer 40 and the connection portion 30.

In some embodiments, when the external force disappears, the bending region 403 of the flexible thermally conductive layer 40 can be separated from the connecting portion 30. In this way, there is a certain buffer space between the bending area 403 of the flexible thermally conductive layer 40 and the connection portion 30, which can reduce the generation of wrinkles to a certain extent.

In some embodiments, when the flexible electronic device 100 is bent, the bending region 403 of the flexible thermally conductive layer 40 slides relative to the connecting portion 30. It can be understood that the bent area 403 of the flexible thermally conductive layer 40 and the connection portion 30 may be non-fixedly attached.

In some embodiments, the heat conducted by the first heat sink 11 is higher than the heat conducted by the second heat sink 21. In this way, the heat of the first portion 10 can be conducted to the second heat sink 21 via the first heat sink 11 for dissipation.

In some embodiments, the connection portion 30, the first heat sink 11, and the second heat sink 21 are disposed on the same side of the flexible heat-conducting layer 40 to facilitate heat dissipation.

In some embodiments, the flexible electronic device 100 includes an adhesive layer 50. The adhesive layer 50 is located between the flexible heat-conducting layer 40 and the first heat sink 11 and the second heat sink 21. The provision of the adhesive layer 50 can improve the stability of the flexible thermally conductive layer 40 connected to the first heat sink 11 and the second heat sink 21.

In some embodiments, the flexible thermally conductive layer 40 includes a first non-bent region 401 and a second non-bent region 402. The bending region 403 connects the first non-bending region 401 and the second non-bending region 402. The first non-bent region 401 corresponds to the first heat sink 11. The second non-bent region 402 corresponds to the second heat sink 21. The adhesive layer 50 includes a first adhesive layer 61 and a second adhesive layer 62 that are spaced apart. The first adhesive layer 51 is located between the first non-bent region 401 and the first heat sink 11, and the second adhesive layer 52 is located between the second non-bent region 402 and the second heat sink 21. In this way, the stability of the arrangement of the flexible thermally conductive layer 40 can be improved.

In some embodiments, the flexible electronic device 100 includes a support plate 31. The support plate 31 is located between the flexible heat-conducting layer 40 and the first heat sink 11 and the second heat sink 21. The first adhesive layer 51 bonds the first non-bent region 401 and one end of the support plate 31. The second adhesive layer 52 bonds the second non-bent region 402 and the other end of the support plate 31. In this way, the support plate 31 can have a certain supporting effect on the flexible thermally conductive layer 40, and at the same time, the support plate 31 can separate the connecting portion 30 from the flexible thermally conductive layer 40, which can prevent the connecting portion 30 from abrading the flexible thermally conductive layer 40 when bending, thereby The flexible thermally conductive layer 40 has a protective effect.

In this embodiment, the first heat radiating body 11 and the second heat radiating body 21 are provided on one side of the support plate 31. The flexible thermally conductive layer 40 is disposed on the other side of the support plate 31. The flexible thermally conductive layer 40 is supported by the support plate 31. In this way, the heat dissipating body having a higher temperature among the first heat dissipating body 11 and the second heat dissipating body 21 can conduct heat from the support plate 31 to the flexible heat conductive layer 40, and the flexible heat conducting layer 40 can conduct heat to the first heat radiating body 11 and The lower-temperature heat-radiating body in the second heat-radiating body 21 achieves uniform temperature heat dissipation.

Preferably, the orthographic projection area of the support plate 31 on the flexible heat-conducting layer 40 substantially covers the flexible heat-conducting layer 40 (the size of the support plate 31 may be consistent with the size of the flexible heat-conducting layer 40, or the size of the support plate 31 is slightly larger than the flexible heat-conducting layer Layer 40), so that the support plate 31 can completely separate the flexible thermally conductive layer 40 and the connection portion 30.

In some embodiments, the portion of the flexible thermally conductive layer 40 located between the first adhesive layer 61 and the second adhesive layer 62 covers the connection portion 30 at an orthographic projection of the connection portion 30. In this way, the portion of the flexible heat-conducting layer 40 facing the connection portion 30 is not provided with the adhesive layer 50, so that free bending can be achieved.

In the present embodiment, the orthographic projection of the bending region 403 on the connecting portion 30 covers the connecting portion 30.

In some embodiments, the flexible thermally conductive layer 40 is a graphene material or a graphite material. The support plate 31 is made of metal. In this way, the thermally conductive effect of the flexible thermally conductive layer 40 and the support plate 31 is better. In one example, the support plate 31 may be made of a metal steel sheet.

In this embodiment, the adhesive layer 50 bonds the flexible thermally conductive layer 40 and the support plate 31. The adhesive layer 50 is located between the flexible thermally conductive layer 40 and the support plate 31. The provision of the adhesive layer 50 can improve the stability of the flexible thermally conductive layer 40 connected to the support plate 31. Specifically, the first adhesive layer 61 bonds the first non-bent region 401 and one end of the support plate 31, and the second adhesive layer 62 bonds the second non-bent region 402 and the other end of the support plate 31. That is, the two ends of the flexible thermally conductive layer 40 are bonded to the support plate 31 through the adhesive layer 50, and the bending region 403 (the middle portion of the flexible thermally conductive layer 40) is separated from the support plate 31. In this way, when the flexible electronic device 100 is bent, since the bending area 403 has no adhesive layer 50, the bending area 403 can be bent freely, and wrinkles and blistering are less likely to occur, which will not affect the uniform temperature and heat dissipation capability of the flexible thermal conductive layer 40.

In some embodiments, the adhesive layer 50 is a double-sided tape. This can further improve the stability of the flexible thermally conductive layer 40 connected to the support plate 31.

In some embodiments, the first heat sink 11 is formed with a first groove 111. The second heat sink 21 is formed with a second groove 211. The first groove 111 and the second groove 211 together form a receiving groove 110. The flexible thermally conductive layer 40 is partially or completely contained in the receiving groove 110. In this way, the placement of the receiving groove 110 improves the installation stability of the flexible heat-conducting layer 40, and increases the contact area between the first and

second heat sinks

11 and 21 and the flexible heat-conducting layer 40. In some embodiments, the first portion 10 includes a motherboard component 12. The motherboard component 12 is thermally connected to one side of the first heat sink 11. The second portion 20 includes a battery component 22. The battery component 22 is thermally connected to one side of the second heat sink 21.

It can be understood that the flexible heat conducting layer 40 is thermally connected to the first heat sink 11 and the second heat sink 21, and the heat of the motherboard component 12 can be transferred to the second heat sink 21 via the first heat sink 11 and the flexible heat conducting layer 40 for heat dissipation. The heat of the battery component 22 can also be transferred to the first heat sink 11 through the second heat sink 21 and the flexible heat-conducting layer 40 for heat dissipation. When the amount of heat generated by the motherboard component 12 or the battery component 22 is large, due to the large heat dissipation area, heat can be better dissipated, thereby preventing local overheating of the flexible electronic device 100, thereby improving the user experience. In particular, since the heat generation amount of the main board component 12 is greater than the heat generation amount of the battery component 22, the flexible heat-conducting layer 40 can transfer heat from the area of the main board component 12 to the area of the battery component 22, thereby achieving a better uniform temperature effect.

In addition, the shape of the flexible electronic device 100 can be set according to specific conditions, for example, it can be rectangular parallelepiped. The flexible electronic device 100 is capable of switching between an unfolded state and a folded state. When the flexible electronic device 100 is bent to approximately 180 degrees (as shown in FIG. 2 and FIG. 10), the first portion 10 and the second portion 20 substantially overlap, and the distance between the main board component 12 and the battery component 22 is relatively small. If the flexible heat-conducting layer 40 is not provided, heat dissipation between each other will be affected. In the embodiment of the present application, the first heat dissipating body 11 and the second heat dissipating body 21 are located on the same side of the flexible heat conducting layer 40. The flexible heat conducting layer 40 can increase the heat dissipation area of the motherboard component 12 and the battery component 22, thereby facilitating heat dissipation. In addition, the “thermally conductively connected” in the present application means that two heat conductively connected components can perform heat exchange.

It can be understood that, in order to make the first heat radiating body 11 and the second heat radiating body 21 have a large heat radiation area, the first heat radiating body 11 can be made into a plate shape, and the second heat radiating body 21 can be made into a plate shape.

In some embodiments, the first heat dissipating body 11 and the second heat dissipating body 21 are generally close to each other when the flexible electronic device 100 is bent, and are generally far from each other when the flexible electronic device 100 is unfolded. In this way, even when the main board part 12 and the battery part 22 are close to each other when the flexible electronic device 100 is bent, the first heat radiating body 11 and the second heat radiating body 21 combined with the flexible heat-conducting layer 40 can even heat the main board part 12 and the battery part 22 The generated heat is dissipated, and when the flexible electronic device 100 is deployed, the first heat dissipating body 11 and the second heat dissipating body 21 are far away as a whole, which is beneficial to heat dissipation.

In some embodiments, the flexible thermally conductive layer 40 is used to transfer heat between the first heat sink 11 and the second heat sink 21. In this embodiment, the flexible thermally conductive layer 40 is used to transfer the heat of the first heat sink 11 to the second heat sink 21 for dissipation. In this way, the heat generated by the motherboard component 12 can be dissipated in time, and then the heat can be evenly distributed.

In some embodiments, the flexible thermal conductive layer 40 is located on the opposite side of the first heat sink 11 from the main board component 12 and the battery component 22. In this way, the flexible heat-conducting layer 40 and the first heat-dissipating body 11 are in full contact, so that the heat generated by the motherboard component 12 can be fully dissipated to the flexible heat-conducting layer 40 through the first heat-dissipating body 11, and then the purpose of balanced heat dissipation is achieved.

In the present embodiment, the entire connection portion 30 is bendable. The first portion 10 and the second portion 20 are symmetrically disposed on both sides of the connecting portion 30. The first portion 10 and the second portion 20 can be rotated around the connection portion 30 to switch the flexible electronic device 100 between an unfolded state and a folded state.

In this embodiment, the support plate 31, the adhesive layer 50, and the flexible heat-conducting layer 40 are stacked and adhered in the receiving groove 110 in this order. The shape of both ends of the support plate 31 matches the shape of the adhesive layer 50. The support plate 31 is located between the adhesive layer 50 and the bottom wall of the receiving groove 110. The adhesive layer 50 is located between the support plate 31 and the flexible thermally conductive layer 40. The flexible heat-conducting layer 40 is completely contained in the containing groove 110, and the thickness of the flexible heat-conducting layer 40 is smaller than the depth of the containing groove 110, so that other components can be contained in the containing groove 110.

Further, the connecting portion 30 includes a bendable bending piece 32 and two bendable connecting pieces 33 provided on the bendable piece 32. The bending piece 32 connects the first portion 10 and the second portion 20. A first notch 34 is opened on one side of the first groove 111, and a second notch 35 is opened on one side of the second groove 211. The top surface of the bending member 32 is substantially coplanar with the bottom surface of the first groove 111 and the bottom surface of the second groove 211. Two connecting members 33 are oppositely disposed on both sides of the top surface of the bending member 32 near the edge. The connecting member 33 connects the edges of the first notch 34 and the second notch 35, that is, the connecting member 33 can connect the first heat sink 11 and the first heat sink 11. The two heat sinks 21 can play a role of heat conduction to a certain extent.

It should be noted that the bending member 32 may be a hinge, for example.

In some embodiments, referring to FIGS. 6-8, the motherboard component 12 includes a motherboard 121 and a first chip portion 122. The first chip portion 122 includes a first shield cover 1221 and a first chip 1222. The first chip 1222 and the first shielding cover 1221 are disposed on the main board 121. The first shielding cover 1221 covers the first chip 1222 and is thermally connected to the first chip 1222. The first shield cover 1221 is thermally connected to the first heat sink 11. In this way, the heat generated by the first chip 1222 can be conducted to the first heat sink 11 and dissipated by the first shield 1221. The first shielding cover 1221 may be used to protect the first chip 1222.

It should be noted that the flexible electronic device 100 may further include a sub-board 124. The main board 121 may be connected to the sub board 124 through a line. The auxiliary board 124 can be provided with a wiring port (Universal Serial Bus (USB) port) or electrical components such as a speaker.

In some embodiments, the first chip portion 122 includes a first thermally conductive layer 1223. The first thermally conductive layer 1223 thermally connects the first shielding cover 1221 and the first chip 1222 in a thermally conductive manner. As such, the first thermally conductive layer 1223 improves the efficiency of thermal conduction between the first chip 1222 and the first shield 1221. The first thermally conductive layer 1223 may be, for example, a thermally conductive silicon gel or a thermally conductive silicone grease.

In some embodiments, the motherboard component 12 includes a second chip portion 123. The second chip portion 123 includes a second shield cover 1231 and a second chip 1232. The second chip portion 123 is disposed on a side of the motherboard 121 facing away from the first chip portion 122. The second shielding cover 1231 covers the second chip 1232 and is thermally connected to the second chip 1232. The second shield cover 1231 increases the heat dissipation area of the motherboard component 12 and protects the second chip 1232. The heat dissipation between the first chip portion 122 and the second chip portion 123 does not affect each other, and the heat dissipation efficiency is improved.

In some embodiments, the second chip portion 123 includes a second thermally conductive layer 1233. The second thermally conductive layer 1233 is thermally connected to the second shielding cover 1231 and the second chip 1232. As such, the second heat-conducting layer 1233 improves the efficiency of heat conduction between the second chip 1232 and the second shield cover 1231. The second thermally conductive layer 1233 may be, for example, a thermally conductive silicon gel or a thermally conductive silicone grease.

In some embodiments, the first portion 10 includes a thermally conductive first cover 13. The first cover 13 and the first heat sink 11 are connected to form a first mounting cavity 130 together. The motherboard component 12 is housed in the first mounting cavity 130. The second shield cover 1231 is thermally connected to the first cover 13. In this way, the first cover 13 not only increases the heat dissipation area of the motherboard component 12, but also protects the motherboard component 12.

In some embodiments, the first portion 10 includes a third thermally conductive layer 14. The third thermally conductive layer 14 thermally connects the second shielding cover 1231 and the first cover 13. In this way, the third thermally conductive layer 14 improves the efficiency of heat conduction between the second shielding cover 1231 and the first cover 13. The third thermally conductive layer 14 may be made of a graphite material. For example, the third thermally conductive layer 14 may be a graphite sheet.

In some embodiments, the second portion 20 includes a thermally conductive second cover body 23. The second cover body 23 and the second heat sink 21 are connected to form a second mounting cavity 230 together. The battery component 22 is located in the second mounting cavity 230. The battery component 22 is thermally connected to the second cover 23. In this way, the second cover 23 can increase the heat radiation area of the battery component 22 and protect the battery component 22.

It can be understood that during the bending process of the connecting portion 30, the first cover body 13 and the second cover body 23 are close to each other as a whole, and the distance between the first cover body 13 and the second cover body 23 is smaller than that of the first heat sink 11 and The distance between the second heat sinks 21. In this way, when the connecting portion 30 is bent, the first heat dissipating body 11 and the second heat dissipating body 21 are located on the outer side of the bending with respect to the first cover body 13 and the second cover body 23, which is more conducive to heat dissipation.

In some embodiments, the second portion 20 includes a fourth thermally conductive layer 24. The fourth thermally conductive layer 24 thermally connects the battery component 22 and the second cover 23. As such, the fourth thermally conductive layer 24 improves the efficiency of heat conduction between the battery component 22 and the second cover 23. The fourth thermally conductive layer 24 may be made of a graphite material. For example, the fourth thermally conductive layer 24 may be a graphite sheet.

In some embodiments, the flexible electronic device 100 includes a flexible screen assembly 60. The flexible screen assembly 60 is mounted on the flexible thermally conductive layer 40. Specifically, the flexible screen assembly 60 is installed on a side of the flexible heat conductive layer 40 facing away from the first heat sink and the second heat sink. In this way, this is beneficial to the heat dissipation of the flexible screen assembly 60.

In this embodiment, the flexible heat-conducting layer 40 is located between the flexible screen assembly 60 and the adhesive layer 50.

In some embodiments, the flexible screen assembly 60 includes a support frame 61 and a flexible display screen 62. The supporting frame 61 is disposed on a side of the flexible thermally conductive layer 40 facing away from the first portion 10 and the second portion 20. The flexible display screen 62 is disposed on a side of the support frame 61 facing away from the flexible heat conductive layer 40. In this way, the support frame 61 can improve the overall stability of the flexible screen assembly 60. In one example, the support frame 61 is a liquid metal support frame.

It should be noted that the first cover 13 and the second cover 23 respectively form two heat dissipation paths, that is, the first cover 13 can dissipate the heat of the motherboard component 12 and the second cover 23 can provide the battery component 22 The heat is dissipated. When the flexible electronic device 100 is in the unfolded state, the first cover 13 and the second cover 23 do not affect each other, and each emits heat. However, when the flexible electronic device 100 is in a folded state, the first cover body 13 and the second cover body 23 are close to each other or even contact each other, and there is less space for emitting heat to the outside, and the heat dissipation efficiency is low. In addition, when the first cover body 13 and the second cover body 23 are made of a non-thermally conductive material such as plastic, the heat emission is further affected. Therefore, in the folded state, heat is mainly dissipated through another heat dissipation path, that is, through a heat sink that is still located outside. The heat of the motherboard component 12 is homogenized to the second heat sink 21 of the battery component 22 through the thermally conductive component. The heat of the battery component 22 and the heat transferred from the motherboard component 12 is dissipated through the second heat radiator 21, and the heat of the 12 motherboard components is simultaneously Dissipation is performed by the first heat radiating body 11 to ensure the overall heat dissipation efficiency. When the flexible electronic device 100 is in the unfolded state, the first cover 13, the second cover 23, the first heat sink 11, and the second heat sink 21 all radiate heat as main heat dissipation paths.

Understandably, the thermally conductive component may also include only the flexible thermally conductive layer 40 (which may include the adhesive layer 50), that is, the flexible thermally conductive layer 40 simultaneously performs the thermally conductive function and the supporting function. At this time, the support plate 31 may be omitted.

Further, when the connecting portion 30 is made of a metal material, it can also be used as a heat dissipation path to dissipate the heat of the battery component 22 and the motherboard component 12. That is, the first cover 13, the second cover 23, the heat-conducting component, the first heat radiating body 11 and the second heat radiating body 21 can further transfer heat to the connecting portion 30 and then radiate to the outside through the connecting portion 30 to further improve the heat dissipation effect. .

In this application, unless explicitly stated and limited otherwise, the "first" or "under" of the second feature may include the first and second features in direct contact, and may also include the first and second features. Not directly, but through another characteristic contact between them. Moreover, the first feature is "above", "above", and "above" the second feature, including that the first feature is directly above and obliquely above the second feature, or merely indicates that the first feature is higher in level than the second feature. The first feature is “below”, “below”, and “below” of the second feature, including the fact that the first feature is directly below and obliquely below the second feature, or merely indicates that the first feature is less horizontal than the second feature.

The above disclosure provides many different implementations or examples for implementing different structures of the present application. In order to simplify the disclosure of this application, the components and settings of the specific examples are described above. Of course, they are merely examples and are not intended to limit the application. In addition, the present application may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, examples of various specific processes and materials are provided in this application, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

In the description of this specification, the description with reference to the terms “one embodiment”, “some embodiments”, “exemplary embodiments”, “examples”, “specific examples”, or “some examples”, etc., means that the embodiments are combined The specific features, structures, materials, or characteristics described by the examples are included in at least one implementation or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same implementation or example. Moreover, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more implementations or examples.

Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirit of the present application, The scope of the application is defined by the claims and their equivalents.

Claims

A flexible electronic device, comprising:

A first part, the first part including a first heat sink;

A second part, the second part including a second heat sink;

A bendable connection portion that connects the first portion and the second portion;

A flexible thermally conductive layer that thermally connects the first heat sink and the second heat sink, a bending area of the flexible heat conducting layer corresponding to the connection portion and a bending of the flexible heat conducting layer The region is not fixedly connected to the connection portion.
The flexible electronic device according to claim 1, wherein a gap is provided between a bending region of the flexible heat conductive layer and the connection portion.
The flexible electronic device according to claim 1, wherein when the external force is applied, the bent area of the flexible heat-conducting layer can contact the connection portion.
The flexible electronic device according to claim 1, wherein when the external force disappears, the bent area of the flexible heat-conducting layer can be separated from the connecting portion.
The flexible electronic device according to claim 1, wherein, when the flexible electronic device is bent, the bent area of the flexible heat conductive layer slides relative to the connecting portion.
The flexible electronic device according to claim 1, wherein the conductive heat of the first heat sink is higher than that of the second heat sink.
The flexible electronic device according to claim 1, wherein the connection portion, the first heat sink, and the second heat sink are disposed on the same side of the flexible heat conductive layer.
The flexible electronic device according to claim 1, wherein the flexible electronic device comprises an adhesive layer, and the adhesive layer is located on the flexible thermally conductive layer and the first heat sink and the second heat sink between.
The flexible electronic device according to claim 8, wherein the flexible thermally conductive layer comprises a first non-bent region and a second non-bent region, and the bent region connects the first non-bent region and The second non-bent area; the first non-bent area corresponds to the first heat sink, and the second non-bend area corresponds to the second heat sink;

The adhesive layer includes a spaced first adhesive layer and a second adhesive layer, the first adhesive layer is located between the first non-bent area and the first heat sink, and the second An adhesive layer is located between the second non-bent region and the second heat sink.
The flexible electronic device according to claim 9, wherein the flexible electronic device comprises a support plate, and the support plate is located between the flexible heat conductive layer and the first heat sink and the second heat sink ; The first adhesive layer bonds the first non-bent region and one end of the support plate, and the second adhesive layer bonds the second non-bent region and another end of the support plate; One end.
The flexible electronic device according to claim 9, wherein a portion of the flexible thermally conductive layer located between the first adhesive layer and the second adhesive layer is covered by an orthographic projection of the connection portion. The connection portion.
The flexible electronic device according to claim 8, wherein the adhesive layer is a double-sided tape.
The flexible electronic device according to claim 10, wherein the flexible thermally conductive layer is made of a graphene material or a graphite material, and the support plate is made of a metal.
The flexible electronic device according to claim 1, wherein the flexible thermally conductive layer is used to transfer heat between a first heat sink and the second heat sink.
The flexible electronic device according to claim 1, wherein the first heat sink is formed with a first groove, the second heat sink is formed with a second groove, the first groove and the The second grooves together form a receiving groove, and the flexible thermally conductive layer is partially or completely received in the receiving groove.
The flexible electronic device according to claim 1, wherein the first portion includes a motherboard component, the motherboard component is thermally connected to one side of the first heat sink, and the second portion includes a battery portion, The battery is partially thermally connected to one side of the second heat sink, and the flexible heat conductive layer is located on an opposite side of the first heat sink from the main board component and the battery component.
The flexible electronic device according to claim 16, wherein the motherboard component includes a motherboard and a first chip portion, and the first chip portion includes a first shield cover and a first chip, and the first chip and the first chip portion The first shielding cover is provided on the main board, the first shielding cover covers the first chip and is thermally connected to the first chip, and the first shielding cover is thermally connected to the first heat sink. body.
The flexible electronic device according to claim 17, wherein the motherboard component includes a second chip portion, the second chip portion includes a second shield cover and a second chip, and the second core portion is disposed in the The side of the motherboard facing away from the first chip portion, and the second shielding cover covers the second chip and is thermally connected to the second chip.
The flexible electronic device according to claim 17, wherein the first chip portion includes a first thermally conductive layer, and the first thermally conductive layer is thermally connected to the first shield and the first chip.
The flexible electronic device according to claim 18, wherein the second chip portion includes a second thermally conductive layer, and the second thermally conductive layer is thermally connected to the second shield and the second chip.
The flexible electronic device according to claim 18, wherein the first portion comprises a first cover body that conducts heat, and the first cover body and the first heat sink are connected to form a first mounting cavity together, The main board component is located in the first mounting cavity, and the second shielding cover is thermally connected to the first cover.
The flexible electronic device according to claim 21, wherein the first portion includes a third thermally conductive layer, and the third thermally conductive layer is thermally connected to the second shield and the first cover.
The flexible electronic device according to claim 1, wherein the second portion comprises a second cover body that conducts heat, and the second cover body is connected to the second heat sink and forms a second mounting cavity together. The battery component is located in the second mounting cavity, and the battery component is thermally connected to the second cover.
The flexible electronic device of claim 23, wherein the second portion includes a fourth thermally conductive layer that thermally connects the battery component and the second cover.
The flexible electronic device according to claim 1, wherein the electronic device comprises a flexible screen assembly, and the flexible screen assembly is mounted on the flexible thermally conductive layer.