TWM519359U - Heat dissipation buffer shield composite structure of mobile electronic device - Google Patents

Description

Thermal buffer shielding composite structure of mobile electronic device

The present invention relates to a heat dissipation structure of a mobile electronic device, and more particularly to a composite structure combining three functions of heat dissipation, buffering, and electronic shielding.

According to mobile electronic devices such as smart phones and tablet PCs, which have evolved from dual-core, quad-core, and eight-core... to increasingly higher processing clock processing chips; and the development of mobile electronic devices is designed to be short and light. Trends, so in order to achieve high computing efficiency and short and light requirements, the heat dissipation efficiency of mobile electronic devices is important.

Sub-press, the current heat dissipation method of mobile electronic devices mainly uses simple opening, heat conduction, heat convection, etc., but these heat dissipation methods can not load the heat energy generated by high-performance wafers today, so there is a problem of heat accumulation. The thermal energy cannot be evenly distributed, resulting in lowering the heat dissipation efficiency inside the mobile electronic device.

In addition, usually, the chip of the electronic device is the main heat source during operation, and the heat dissipation is not only to lower the temperature of the chip itself to ensure that it can work normally within the required temperature range, but also to prevent partial overheating of the casing when the heat is dissipated. Consumers experience a bad experience.

The invention discloses a heat dissipation structure of a mobile electronic device, which comprises an upper cover 11, a liquid crystal display module 12, a back cover 16 and a heat conducting component 15, and the liquid crystal display module 12 is provided on one side. The substrate 14 is provided with at least one electronic component 141. The back cover 16 has a receiving space 161, and a middle frame 13 is attached to the liquid crystal display module 12, and the substrate 14 is embedded in the substrate 14 In the middle frame 13, the heat conducting component 15 is disposed between the electronic component 141 and the back cover 16, the one side of the heat conducting component 15 correspondingly contacts the electronic component 141, and the other side correspondingly contacts the back cover 16; The thermal energy of the electronic component 121 is evenly distributed without generating heat. However, it is found that the heat-dissipating component 15 as the heat-dissipating component and the back cover 16 are respectively fabricated, and then the heat-conducting component 15 is bonded to the inner edge surface of the back cover 16, so that the heat dissipation efficiency or the electronic shielding function is still insufficient, and further, it is not The buffer structure for protecting the liquid crystal display module 12 is disclosed, so that there is still room for improvement.

Therefore, solving the above problems of the traditional mobile electronic device is the main subject of the creation.

The main purpose of this creation is to provide a thermal buffering conductive shielding structure for mobile electronic devices, which combines three functions of heat dissipation, buffering and electronic shielding, which can maintain the reliability of the mobile electronic device and save The cost of the effect.

In order to achieve the above object, the technical means adopted by the present invention include: an upper cover having a transparent substrate; a liquid crystal display module disposed under the upper cover; and a middle case support disposed under the liquid crystal display module a circuit board disposed under the middle case bracket, at least one electronic component is disposed thereon; a battery is disposed under the middle case bracket; and a back cover is oppositely coupled to the bottom edge of the upper cover The utility model has an accommodating space for accommodating the foregoing component; the middle casing bracket is configured to form a shielding cover, and simultaneously fix the liquid crystal display module, fix the circuit board downward, and the middle casing bracket a high thermal conductive metal sheet is disposed on the circuit board; an insulating fin is disposed on the circuit board for providing heat dissipation of the electronic chip, and the high thermal conductive metal sheet is blocked from contacting the electronic chip to provide insulation; and the electronic chip contacts The insulating fin is configured to transfer the heat of the electronic chip upward in a vertical direction, and the heat generated by the electronic chip is transmitted; the high thermal conductive metal sheet is disposed above a layer of thermal conductive film, the heat transferred from the high thermal conductive metal sheet is horizontally dispersed; a thermal insulation film is disposed above the thermal conductive film to prevent the thermal conductive film from radiating heat outward; and the outer side of the thermal insulation film A foam layer is provided for buffering the liquid crystal display module.

By means of the above-mentioned technical means, the present invention uses the high-heat-conducting metal piece embedded in the middle shell as a longitudinal heat transfer and electromagnetic shielding medium to improve the problem of poor heat conduction of the middle-shell bracket, and the heat emitted by the chip is continuously transmitted in the longitudinal direction, thereby The heat transferred from the electronic chip is longitudinally transmitted to the heat conductive film through the heat sink and the high heat conductive metal sheet, and then uniformly dispersed by the heat conductive film being laterally parallelized; further, a heat insulating film is disposed outside the heat conductive film, Preventing the heat from continuing to spread out to the outside of the casing, so as to avoid causing a bad user experience of overheating, and protecting the liquid crystal display module by the foam layer on the outer side of the heat insulating film, thereby combining the heat dissipation, the buffering, and the The three functions of electronic shielding are integrated, which has the effect of maintaining the reliability of the mobile electronic device and saving cost.

First, please refer to FIG. 2 to FIG. 5 , the heat dissipation buffer shielding structure of the mobile electronic device disclosed in the present disclosure, and a possible embodiment thereof includes: an upper cover 20 having a transparent substrate 21 ; and a liquid crystal display module (LCD) 30 is disposed under the upper cover 20; a middle case holder 40 is disposed under the liquid crystal display module 30; a circuit board 50 is disposed under the middle case holder 40, and at least one is disposed thereon An electronic chip 51; a battery 60 is disposed under the middle case holder 40; and a back cover 70 is oppositely coupled to the bottom edge of the upper cover 20, and has an accommodation space 71 for receiving the aforementioned member; However, the above-mentioned components are prior art (Prior Art), and the patents that are not the original ones are not described here.

The main feature of the present invention is that the middle case bracket 40 is used to form a shield cover, and the liquid crystal display module 30 is fixed upwardly, and the circuit board 50 is fixed downward. The middle case bracket 40 is provided with a high thermal conductive metal piece 81. The high thermal conductive metal sheet 81 can be pasted by the thermal conductive adhesive or can be embedded in the middle housing bracket 40. In this embodiment, the middle housing bracket 40 can be formed of an aluminum-magnesium alloy to form an electronic shield. The electronic chip 51 is required to prevent the electronic interference. The liquid crystal display module 30 is fixed upward and the circuit board 50 is fixed downward. In this embodiment, the high thermal conductive metal sheet 81 can be made of copper, but is not limited thereto. Metals can also be implemented.

The circuit board 50 is provided with an insulating thermal pad 82, which may be made of alumina which may be added with silica gel to provide heat dissipation of the electronic chip 51 while blocking the high thermal conductive metal sheet 81. The electronic chip 51 is in contact to achieve insulation. The electronic chip 51 contacts the insulating fins 82, and functions to transfer the heat of the electronic chip 51 upward in the vertical direction (thermal conduction), and the heat generated by the electronic chip 51 is transmitted.

Further, a high-heat conductive metal sheet 81 is covered with a heat conductive film 83. The heat conductive film 83 can disperse heat from the high heat conductive metal sheet 81 horizontally to achieve uniform heat generation.

In addition, a thermal insulation film 84 is disposed on the thermal conductive film 83 for preventing the thermal conduction film 83 from radiating heat outward to prevent the user from feeling overheated.

Furthermore, a foam layer 85 is disposed on the outer side of the heat insulating film 84 for protecting the liquid crystal display module 30 to achieve the buffering effect.

With the above-mentioned technical means, the present invention uses the middle shell bracket 40 to inlay the high thermal conductive metal sheet 81 as a longitudinal heat transfer and electromagnetic shielding medium, improving the problem of poor heat conduction of the middle shell bracket 40, and continuing the heat emitted by the electronic chip 51. The heat is transmitted longitudinally, and the heat transferred from the electronic chip 51 is longitudinally transmitted to the heat conductive film 83 through the insulating heat sink 82 and the high heat conductive metal sheet 81, and then spread laterally in parallel through the heat conductive film 83 to achieve uniform heat dissipation; Furthermore, a heat-insulating film 84 is disposed on the outer side of the heat-transmissive film 83 to prevent heat from continuing to diffuse outside the casing, so as to avoid a bad user experience of overheating, and provide a buffer with the foam layer 85 outside the heat-insulating film 84. The utility model protects the liquid crystal display module 30; thereby, the creation has three functions of combining heat dissipation, buffering and electronic shielding, which can not only maintain the reliability of the mobile electronic device but also save cost.

In summary, the structure revealed by this creation is unprecedented, and it can achieve the improvement of efficacy, and it can be used for industrial utilization. It fully complies with the new patent requirements, and invites the bureau to grant patents to encourage innovation. There is no sense of morality.

However, the drawings and descriptions disclosed above are only preferred embodiments of the present invention, and modifications or equivalent changes made by those skilled in the art in accordance with the spirit of the present invention should still be included in the scope of the patent application.

20‧‧‧Upper cover
21‧‧‧Transparent substrate
30‧‧‧LCD module
40‧‧‧Shed bracket
50‧‧‧ boards
51‧‧‧Electronic chip
60‧‧‧Battery
70‧‧‧Back cover
71‧‧‧ accommodating space
81‧‧‧High thermal conductivity metal sheet
82‧‧‧Insulated heat sink
83‧‧‧heat film
84‧‧‧Insulation film
85‧‧·bubble layer

1A is an exploded perspective view of a heat dissipation structure of a mobile electronic device. FIG. 1B is a perspective view showing a combination of a heat dissipation structure of a mobile electronic device. 1C is a cross-sectional view of a heat dissipation structure of a mobile electronic device. Figure 1D is an enlarged view of 1D in Figure 1C. Figure 2 is an exploded perspective view of a preferred embodiment of the present invention. Figure 3 is a perspective view of the combination of the preferred embodiment of the present invention. Figure 4 is a cross-sectional view of a preferred embodiment of the present invention. Figure 5 is an enlarged view of 5 in Figure 4.

20‧‧‧Upper cover

21‧‧‧Transparent substrate

30‧‧‧LCD module

40‧‧‧Shed bracket

50‧‧‧ boards

51‧‧‧Electronic chip

60‧‧‧Battery

70‧‧‧Back cover

71‧‧‧ accommodating space

81‧‧‧High thermal conductivity metal sheet

82‧‧‧Insulated heat sink

83‧‧‧heat film

84‧‧‧Insulation film

85‧‧·bubble layer

Claims (6)

The heat dissipation buffer shielding composite structure of the mobile electronic device comprises: an upper cover having a transparent substrate; a liquid crystal display module disposed under the upper cover; and a middle case support disposed under the liquid crystal display module a circuit board disposed under the middle housing bracket, at least one electronic chip is disposed thereon; a battery is disposed under the middle housing bracket; and a back cover is oppositely coupled to the bottom edge of the upper cover The utility model has an accommodating space for accommodating the foregoing component; the middle casing bracket is configured to form a shielding cover, and the liquid crystal display module is fixed upwardly, the circuit board is fixed downward, and the middle casing is fixed a high thermal conductive metal sheet is disposed on the circuit board; an insulating fin is disposed on the circuit board for providing heat dissipation of the electronic chip, and the high thermal conductive metal sheet is blocked from contacting the electronic chip to provide insulation; and the electronic chip contacts The insulating heat sink is configured to transfer the heat of the electronic chip upward in a vertical direction, and transfer the heat generated by the electronic chip; the high thermal conductive metal sheet a heat conducting film, the heat transferred from the high heat conductive metal sheet is horizontally dispersed; the heat conducting film is provided with a heat insulating film for preventing the heat conductive film from radiating heat outward; and the heat insulating film A foam layer is arranged on the outer side for buffering the liquid crystal display module. The heat dissipation buffer shielding composite structure of the mobile electronic device according to claim 1, wherein the middle casing is made of an aluminum-magnesium alloy. The heat dissipation buffer shielding composite structure of the mobile electronic device according to claim 1, wherein the high thermal conductive metal sheet is made of copper. The heat-dissipating buffer shielding composite structure of the mobile electronic device according to the third aspect of the invention, wherein the high thermal conductive metal sheet can be fixed in the middle-shell bracket by a thermal adhesive. The heat dissipation buffer shielding composite structure of the mobile electronic device of claim 3, wherein the high thermal conductive metal sheet is insertably fitted into the middle housing bracket. The heat dissipation buffer shielding composite structure of the mobile electronic device according to claim 1, wherein the insulating heat sink is made of alumina added with silica gel.