CN113539096A - Display module assembly and display device - Google Patents
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- CN113539096A CN113539096A CN202110800745.6A CN202110800745A CN113539096A CN 113539096 A CN113539096 A CN 113539096A CN 202110800745 A CN202110800745 A CN 202110800745A CN 113539096 A CN113539096 A CN 113539096A
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 89
- 239000000463 material Substances 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910002804 graphite Inorganic materials 0.000 claims description 7
- 239000010439 graphite Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 87
- 229920002120 photoresistant polymer Polymers 0.000 description 18
- 238000005530 etching Methods 0.000 description 14
- 238000005452 bending Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
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- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application provides a display module and a display device; the display module comprises a display panel main body, a back plate and a heat dissipation layer; the back plate is arranged on one side of the display panel main body far away from the light emergent direction, and a first groove is formed on the first surface of the back plate far away from the light emergent direction of the display panel main body; the heat dissipation layer is arranged on one side of the back plate far away from the display panel main body, and the heat dissipation layer is at least partially filled in the first groove. This application is through forming first recess to at least part is filled the heat dissipation layer in this first recess, has reduced display module's thickness when guaranteeing the radiating effect.
Description
Technical Field
The application relates to the technical field of display, especially, relate to a display module assembly and display device.
Background
At present, the market demand for folding screen OLED cell-phone is frivolous, and along with the promotion of cell-phone hardware performance, cell-phone self consumption also increases thereupon, leads to cell-phone self calorific capacity also to increase by a wide margin. The current folding screen OLED mobile phone is generally attached with graphite in a corresponding area of a folding back plate due to the requirement of heat dissipation, but the thickness of the attached graphite is thicker along with the improvement of the hardware performance of the folding screen OLED mobile phone, and the requirement is deviated from the lightening and thinning requirement of the current folding screen OLED mobile phone.
Disclosure of Invention
The embodiment of the application provides a display module and a display device to reduce the thickness of a folding screen OLED mobile phone.
The application provides a display module assembly, include:
a display panel main body;
the back plate is arranged on one side, far away from the light emitting direction, of the display panel main body, and a first groove is formed in the first surface, far away from the light emitting direction, of the display panel main body;
the heat dissipation layer is arranged on one side, far away from the display panel main body, of the back plate, and at least part of the heat dissipation layer is filled in the first groove.
In the display module of this application, the heat dissipation layer includes the first part of filling in the first recess and is located the second part outside the first recess, the shape of first part with first recess matches.
In the display module of this application, the second portion with the first surface laminating, just the orthographic projection of second portion on the backplate covers the opening of first recess is in the orthographic projection on the backplate.
In the display module assembly of this application, the thickness on heat dissipation layer is not more than the degree of depth of first recess, the shape on heat dissipation layer with first recess matches.
In the display module assembly of this application, the backplate is keeping away from the first surface of display panel main part light-emitting direction is formed with a plurality of first recesses, the part packing of radiator is in the first recess to through surpassing the part of first surface is connected.
In the display module of this application, the degree of depth of first recess is one-third to two-thirds of backplate thickness.
In the display module of the present application, the shape of the cross section of the first groove includes at least one of a rectangle, a trapezoid, and an inverted trapezoid.
In the display module of the present application, the heat dissipation layer is a lamellar structure.
In the display module of this application, the heat dissipation layer material includes graphite.
The application also provides a display device, which comprises a display module and a driving chip, wherein the display module is any one of the display modules.
Has the advantages that: the application provides a display module and a display device; the display module comprises a display panel main body, a back plate and a heat dissipation layer; the back plate is arranged on one side of the display panel main body far away from the light emergent direction, and a first groove is formed on the first surface of the back plate far away from the light emergent direction of the display panel main body; the heat dissipation layer is arranged on one side of the back plate far away from the display panel main body, and the heat dissipation layer is at least partially filled in the first groove. The first surface of backplate in this application keeping away from display panel main part light-emitting direction is formed with first recess to at least part is filled in this first recess with the heat dissipation layer, makes the heat dissipation layer needn't directly laminate and keeps away from one side of display panel main part light-emitting direction at the backplate, has reduced display module assembly's thickness when guaranteeing the heat dissipation, satisfies the frivolousization demand of current folding screen OLED cell-phone.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic view of a film layer structure of a display module according to an embodiment of the present disclosure.
Fig. 2 is a schematic diagram of a film structure of a display module in the prior art.
Fig. 3a to 3c are schematic structural diagrams of a back plate according to an embodiment of the present disclosure.
Fig. 4a is a schematic view of a first structure in which a heat dissipation layer is embedded in a backplane according to an embodiment of the present disclosure.
Fig. 4b is a schematic view of a second structure in which a heat dissipation layer is embedded in a backplane according to an embodiment of the present disclosure.
Fig. 5a is a schematic view of a third structure in which a heat dissipation layer is embedded in a backplane according to an embodiment of the present disclosure.
Fig. 5b is a schematic diagram of a fourth structure in which the heat dissipation layer is embedded in the backplane according to the embodiment of the present disclosure.
Fig. 6 is a schematic view of a fifth structure in which a heat dissipation layer is embedded in a backplane according to an embodiment of the present disclosure.
Fig. 7a to 7f are schematic views of a back plate structure in a process of preparing the back plate according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
The embodiment of the application provides a display module and a display device, which are used for reducing the thickness of the display module while ensuring heat dissipation and meeting the light and thin requirements of the current folding screen OLED mobile phone.
As shown in fig. 1, a film layer structure diagram of a display module provided in an embodiment of the present application, the display module includes: a display panel main body 101, a back plate 102 and a heat dissipation layer 103.
The back plate 102 is disposed on a side of the display panel body 101 away from the light emitting direction, and a first groove 105 is formed on a first surface 104 of the back plate 102 away from the light emitting direction of the display panel body 101;
the heat dissipation layer 103 is disposed on a side of the back plate 102 away from the display panel main body 101, and the heat dissipation layer 103 is at least partially filled in the first groove 105. In the embodiment of the present application, the display panel main body is an oled (organic electroluminescent display) display panel, which is mainly made of organic electroluminescent diodes. The OLED display panel comprises a base layer, an anode, an organic layer, a conductive layer, an emission layer and a cathode; wherein, the material of the base layer can comprise transparent plastic, glass, metal foil and the like, and is mainly used for supporting the whole OLED; the anode, which is primarily used to eliminate electrons (i.e., to add electron "holes") when current is passed through the device, may be transparent; the organic layer is composed of organic molecules or organic polymers; the conducting layer is composed of organic plastic molecules, the molecules are mainly used for transmitting 'holes' from the anode, and polyaniline can be used as a conducting polymer of the OLED; the emitting layer is composed of organic plastic molecules different from the conducting layer, the molecules are mainly used for transmitting electrons from the cathode, the light emitting process of the OLED display panel is carried out on the emitting layer, and polyfluorene can be used as an emitting layer polymer; the cathode is mainly used for injecting electrons into a circuit when current flows in the device, and the cathode can be transparent or opaque, and whether the cathode is transparent or not is mainly determined by the type of the OLED. In addition, the OLED display panel is made of plastic, so that the OLED display panel can be folded.
In the embodiment of the present application, the back plate 102 further includes a planar area 10 and a bending area 20 connected to the planar area 10, the back plate 102 forms a hollow pattern in the bending area 20, a first groove is formed in the planar area 10, and the heat dissipation layer 103 is at least partially filled in the first groove. The material of the back plate 102 may be Stainless Steel (SUS), the hollow pattern formed in the bending region 20 may be a mesh design of Stainless Steel, and the bending region 20 is designed to achieve the folding function of the OLED mobile phone. Note that the material of the back plate 102 is not limited in this embodiment.
In the embodiment of the present application, the structure of the heat dissipation layer 103 may be a laminar structure; the heat dissipation layer 103 mainly includes a graphite layer, a foam layer, and a metal layer. The material of the heat dissipation layer 103 may include graphite, which is a good material for uniform heat and can dissipate the heat inside the mobile phone quickly. It should be noted that the structure type and the material of the heat dissipation layer 103 are not limited in the embodiments of the present application.
As shown in fig. 2, which is a schematic diagram of a film structure of a display module in the prior art, in fig. 2, a heat dissipation layer 103 is directly attached to one side of a back plate 102 away from a display panel main body 101, wherein a bottom surface of the heat dissipation layer 103 is attached to a first surface 104 of the back plate 102, the display module further includes a planar area 10 and a bending area 20 connected to the planar area 10, the back plate 102 forms a hollow pattern in the bending area 20, the heat dissipation layer 103 is disposed in the planar area 10, and the whole display module is folded, wherein the thickness of the heat dissipation layer is twice as large as the thickness of the display panel main body 101 and the thickness of the back plate 102 as that of the heat dissipation layer 103. Due to the improvement of the hardware performance of the folding screen OLED mobile phone, the thickness of the heat dissipation layer attached to the folding screen OLED mobile phone is thicker, so that the thickness of the display module formed by the display panel main body 101, the back plate 102 and the heat dissipation layer 103 is thicker, the display module deviates from the light and thin requirements of the current folding screen OLED mobile phone, and the market requirements cannot be met.
In the present application, the heat dissipation layer 103 is at least partially filled in the first groove 105, and the first groove 105 is formed on the first surface 104 of the back plate 102 away from the light emitting direction of the display panel body. Therefore, in order to meet the light and thin requirements of the market on the folding screen OLED mobile phone, the area of the back plate 102, to which the heat dissipation layer 103 needs to be attached, is subjected to half etching, the heat dissipation layer 103 is at least partially filled and attached in the first groove of the back plate 102, and the thickness of the whole display module can be reduced while the heat dissipation performance is ensured.
Fig. 3a to 3c are further illustrations of the structure of the backplate 102. The structure of the back plate 102 is not limited thereto, and in an embodiment, as shown in fig. 3a to 3c, fig. 3a to 3c are schematic structural diagrams of the back plate 102. The back plate 102 includes a planar area 10 and a bending area 20 connected to the planar area 10, the back plate 102 forms a hollow pattern in the bending area 20, and forms a first groove 105 in the planar area 10.
Specifically, the shape of the cross section of the first groove 105 includes a rectangle whose bottom side is open, a trapezoid, and an inverted trapezoid. As shown in fig. 3a, the cross-section of the first groove 105 may be shaped as a rectangle with its bottom side open; as shown in fig. 3b, the cross-section of the first groove 105 may be shaped like a trapezoid with an open bottom; as shown in fig. 3c, the cross-section of the first groove 105 may also be shaped as an inverted trapezoid with an open bottom; wherein, the bottom opening of the first groove 105 is on the same horizontal line with the first surface 104. It should be noted that the shape of the cross section of the first groove 105 may be other patterns, and the shape of the interface of the first groove 105 is not specifically limited herein.
The relationship between the depth of the first groove 105 and the thickness of the backplate 102 is not limited thereto, and in one embodiment, the depth of the first groove 105 is one third to two thirds of the thickness of the backplate 102. For example, the thickness of the back plate 102 is 150um, the depth of the first groove 105 may be 50um to 100 um.
In an embodiment, taking the shape of the cross section of the first groove 105 as a rectangle with an open bottom as an example, as shown in fig. 4a and 4b, fig. 4a and 4b show two schematic structural diagrams of the back plate 102 and the heat dissipation layer when the thickness of the heat dissipation layer 103 is greater than the depth of the first groove 105, wherein the heat dissipation layer 103 includes a first portion 201 filled in the first groove 105 and a second portion 202 located outside the first groove 105, the shape of the first portion 201 matches the first groove 105, the second portion 202 is attached to the first surface 104, and an orthographic projection of the second portion 202 on the back plate 102 covers an orthographic projection of the opening of the first groove 105 on the back plate 102.
Specifically, as shown in fig. 4a, fig. 4a is a schematic view of a first structure of the application where the back plate 102 and the heat dissipation layer 103 are attached, where a shape of the first portion 201 is completely matched with a shape of the first groove 105, that is, the shape of the first portion 201 is the same as the shape of the first groove 105, and an orthographic projection of the second portion 202 on the back plate 102 is larger than an orthographic projection of an opening of the first groove 105 on the back plate 102 and coincides with the first surface 104. As shown in fig. 4b, fig. 4b is a schematic diagram of a second structure of the application of the back plate 102 and the heat dissipation layer 103, where the shape of the first portion 201 is completely matched with the shape of the first groove 105, that is, the shape of the first portion 201 is the same as the shape of the first groove 105, and an orthogonal projection of the second portion 202 on the back plate is exactly equal to an orthogonal projection of the opening of the first groove 105 on the back plate 102. The display module assembly that is provided with backplate and heat dissipation layer like fig. 4a or fig. 4b is folding, and the thickness of its whole display module assembly after folding is the twice of display panel main part 101, backplate 102 and the thickness sum of the partial heat dissipation layer 103 that surpasss backplate 102 thickness, and its thickness is less than the thickness that the display module assembly that possesses the heat dissipation layer 103 of the same thickness among the prior art folds up, when having reached the realization radiating effect, reduces the purpose of whole display module assembly thickness.
Taking the shape of the cross section of the first groove 105 as a rectangle with an open bottom as an example, as shown in fig. 5a to 5b, fig. 5a to 5b show two schematic structural views of the back plate 102 and the heat dissipation layer when the thickness of the heat dissipation layer 103 is not greater than (i.e., not greater than) the depth of the first groove 105, wherein the shape of the heat dissipation layer 103 matches the shape of the first groove 105.
Specifically, as shown in fig. 5a, fig. 5a is a schematic view of a third structure of the application where the back plate 102 and the heat dissipation layer 103 are attached, where the shape of the heat dissipation layer 103 is exactly the same as the shape of the first groove 105, that is, the bottom edge of the heat dissipation layer 103 is exactly on the same horizontal line with the opening of the first groove 105, so that the depth of the first groove 105 is the same as the thickness of the heat dissipation layer 103, and it can be ensured that the heat dissipation layer 103 is equal to the back plate 102 after being embedded in the first groove 105, and thus the thickness of the display module is not increased by attaching the heat dissipation layer 103. As shown in fig. 5b, fig. 5b is a schematic diagram of a fourth structure of the back plate 102 and the heat dissipation layer 103 attached together according to the embodiment of the present application, wherein the thickness of the heat dissipation layer 103 is smaller than the depth of the first groove 105, that is, the bottom edge of the heat dissipation layer 103 is lower than a horizontal line where the opening of the first groove 105 is located, and the width of the heat dissipation layer 103 is equal to the width of the first groove 105. The display module assembly that is provided with backplate and heat dissipation layer like fig. 5a or fig. 5b is folding, and the thickness of its whole display module assembly after folding is the twice of the thickness sum of display panel main part 101 and backplate 102, and its thickness is less than the thickness that the display module assembly that possesses the heat dissipation layer 103 of the same thickness among the prior art was folded, when having reached the realization radiating effect, reduces the purpose of whole display module assembly thickness.
Meanwhile, a plurality of first grooves 105 may be further provided, as shown in fig. 6, fig. 6 is a fifth structural diagram illustrating that the back plate 102 and the heat dissipation layer 103 are attached to each other according to the embodiment of the present application. The back plate 102 has a plurality of first grooves 105 formed on a first surface 104 away from the light emitting direction of the display panel body, and the heat dissipation layer 103 is partially filled in the plurality of first grooves 105 and connected by a portion exceeding the first surface 104. The display module assembly that is provided with backplate and heat dissipation layer like fig. 6 is folding, and the thickness of its whole display module assembly after folding is the twice of display panel main part 101, backplate 102 and the thickness sum that surpasss backplate 102 thickness's partial heat dissipation layer 103, and its thickness is less than the thickness that the display module assembly that possesses the heat dissipation layer 103 of the same thickness among the prior art was folded, when having reached the realization radiating effect, reduces the purpose of whole display module assembly thickness.
In addition, the bottom surface of the first groove 105 may also be a curved surface, and the bottom surface of the first groove 105 is attached to the second surface (not shown) of the heat dissipation layer 103. Because the curved surface can increase the contact area between the heat dissipation layer 103 and the backplate 102, the bottom surface of the first groove 105 adopts the curved surface design, which can increase the heat dissipation area and enhance the heat dissipation performance.
In one embodiment, the bottom surface of the first groove 105 is attached to the second surface (not shown) of the heat dissipation layer 103, and one of the bottom surface and the second surface of the first groove 105 is formed with at least one protrusion, and the other is formed with the same number of second grooves, wherein the protrusion and the second grooves are engaged with each other, so that the heat dissipation layer 103 can be better fixed in the first groove 105.
In the present application, the back plate 102 is prepared by exposure, development and etching, in the preparation process, a first groove 105 is formed, taking the shape of the cross section of the first groove 105 as a rectangle as an example, as shown in fig. 7a to 7f, fig. 7a to 7f show the basic process for manufacturing the back plate 102, and the final structure of the back plate 102 shown in fig. 7f is obtained by exposure, development and etching.
Specifically, as shown in fig. 7a, in one embodiment, one side of the backplate 102 is covered with a layer of positive photoresist 304, wherein the photoresist is a photosensitive material used in industrial processes, and the positive photoresist means that a portion irradiated with light can be removed by a developing solution, the unexposed photoresist is not removed by the developer, and is exposed by different masks (including the opaque region 301, the semi-transparent region 302 and the transparent region 303), then removing the photoresist portion irradiated by light through a developing solution to obtain a structure in which the positive photoresist 304 is laminated with the back plate 102 as shown in FIG. 7b, wherein the photoresist portion exposed through the transparent region 303 forms a hollow pattern as shown in FIG. 7b, the portion of the photoresist exposed through the semi-transmissive region 302 is partially stripped, and the portion of the photoresist exposed through the opaque region 301 is not stripped.
Then, the laminated structure shown in fig. 7b is etched by the etching solution, the portion of the backplate 102 not covered by the positive photoresist 304 is etched by the etching solution, and the portion of the backplate 102 covered by the positive photoresist is not etched away, so as to obtain the structure shown in fig. 7c in which the positive photoresist 304 and the backplate 102 are laminated. By etching with the etching solution, the back plate 102 generates a hollow pattern as shown in fig. 7c, corresponding to the bending region 20 of the back plate 102.
Next, the structure shown in fig. 7c is exposed, the part originally exposed under the semi-transparent region 302 is replaced by the part exposed under the transparent region 303, the part originally exposed under the transparent region 303 is replaced by the part exposed under the opaque region 301, and then the photoresist part irradiated by light is removed by the developing solution, so as to obtain the structure in which the positive photoresist 304 and the back plate 102 are laminated as shown in fig. 7 d.
Then, the laminated structure shown in fig. 7d is etched by using an etching solution, the portion of the backplate 102 not covered by the positive photoresist 304 is etched by the etching solution, the portion of the backplate 102 covered by the positive photoresist is not etched away, and the etching degree of the backplate 102 can be controlled by controlling the etching duration of the etching solution, so as to obtain the structure in which the positive photoresist 304 and the backplate 102 are laminated as shown in fig. 7 e.
Finally, the positive photoresist 304 portion is removed from the structure in FIG. 7e, resulting in the final structure of the backplate 102 as shown in FIG. 7 f. The back plate 102 comprises a plane area 10 and a bending area 20, wherein the bending area 20 is formed with a hollow pattern structure for facilitating folding; the planar area 10 is formed with a first groove 105, which facilitates embedding the heat dissipation layer 103, so as to reduce the thickness of the display module while achieving heat dissipation.
In the above process, the first groove is formed by half etching, and the outer shape of the graphite to be embedded is reserved by half etching.
The application also provides a display device, which comprises a display module and a driving chip, wherein the display module is the display module in any of the above embodiments. The driving chip is used for obtaining a driving voltage value of the pixel when displaying the target content so as to drive the display module to work.
According to the above embodiment:
the application provides a display module and a display device; the display module comprises a display panel main body, a back plate and a heat dissipation layer, wherein the back plate is arranged on one side of the display panel main body far away from the light emergent direction, and a first groove is formed in the first surface of the back plate far away from the light emergent direction of the display panel main body; the heat dissipation layer is arranged on one side, far away from the display panel main body, of the back plate, and at least part of the heat dissipation layer is filled in the first groove. This application is kept away from the first surface of display panel main part light-emitting direction at the backplate and is formed with first recess, consequently, through the mode with the at least partial packing of heat dissipation layer in first recess, has realized when guaranteeing the radiating effect, has reduced display module assembly's thickness to the demand of market to the frivolous of folding screen OLED cell-phone has been satisfied.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The foregoing describes in detail a display template and a display device provided in an embodiment of the present application, and specific examples are applied herein to explain the principle and the implementation of the present application, and the description of the foregoing embodiments is only used to help understand the technical solutions and the core ideas of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. A display module, comprising:
a display panel main body;
the back plate is arranged on one side, far away from the light emitting direction, of the display panel main body, and a first groove is formed in the first surface, far away from the light emitting direction, of the display panel main body;
the heat dissipation layer is arranged on one side, far away from the display panel main body, of the back plate, and at least part of the heat dissipation layer is filled in the first groove.
2. The display module according to claim 1, wherein the heat dissipation layer comprises a first portion filled in the first groove and a second portion located outside the first groove, and the shape of the first portion matches the shape of the first groove.
3. The display module of claim 2, wherein the second portion is attached to the first surface, and an orthographic projection of the second portion on the back plate covers an orthographic projection of the opening of the first groove on the back plate.
4. The display module of claim 1, wherein the thickness of the heat dissipation layer is not greater than the depth of the first recess, and the shape of the heat dissipation layer matches the first recess.
5. The display module of claim 1, wherein the backplane has a plurality of first grooves formed on a first surface thereof away from a light exit direction of the display panel body, and the heat sink is partially filled in the first grooves and connected thereto by a portion thereof extending beyond the first surface.
6. The display module according to claim 1, wherein the depth of the first groove is one-third to two-thirds of the thickness of the back plate.
7. The display module of claim 1, wherein the shape of the cross section of the first groove comprises a rectangle, a trapezoid and an inverted trapezoid.
8. The display module of claim 1, wherein the heat dissipation layer is a laminate structure.
9. The display module of claim 1, wherein the material of the heat sink comprises graphite.
10. A display device, comprising a display module and a driving chip, wherein the display module is the display module according to any one of claims 1 to 9.
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