CN110911582A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
- Publication number
- CN110911582A CN110911582A CN201911191074.7A CN201911191074A CN110911582A CN 110911582 A CN110911582 A CN 110911582A CN 201911191074 A CN201911191074 A CN 201911191074A CN 110911582 A CN110911582 A CN 110911582A
- Authority
- CN
- China
- Prior art keywords
- layer
- heat dissipation
- display panel
- light emitting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention relates to a display panel and a display device. The display panel includes a substrate; the light emitting layer comprises a plurality of light emitting areas and non-light emitting areas which are arranged at intervals; the packaging layer is positioned on one side, far away from the substrate, of the light emitting layer and comprises a first inorganic layer and an organic layer, the first inorganic layer is positioned on one side, close to the substrate, of the packaging layer, and a first groove is formed in one side, far away from the substrate, of the first inorganic layer; the heat conductivity coefficient of the first heat dissipation layer is larger than that of the organic layer, and the first heat dissipation layer is located in the first groove. The technical scheme provided by the embodiment of the invention improves the heat dissipation function of the display panel, avoids the damage of the light-emitting device caused by the accumulation of heat in the light-emitting device, improves the display efficiency of the display panel, and simultaneously, the first heat dissipation layer is positioned in the first groove, so that the thickness of the display panel can be prevented from being additionally increased, and the requirements of lightness and thinness are met.
Description
Technical Field
The embodiment of the invention relates to the technical field of display panels, in particular to a display panel and a display device.
Background
Organic Light-Emitting Diode (OLED) devices have the advantages of Light weight, wide viewing angle, and fast response time, and are therefore considered as a next-generation new display technology.
However, the OLED light emitting material is easily corroded by water and oxygen, which results in a reduced lifetime, and the prior art generally adopts an overlapping arrangement of inorganic, organic and inorganic film layers to encapsulate the OLED device, thereby blocking water and oxygen intrusion. However, the packaging structure has a risk that heat generated by the OLED device during operation cannot be effectively transferred, and thus, the material of the OLED device is thermally decomposed, and the efficiency and the service life of the device are reduced. Therefore, how to effectively isolate external water and oxygen and reduce thermal decomposition caused by device heating is very important to improve the service life of the device.
Disclosure of Invention
The embodiment of the invention provides a display panel and a display device, which aim to solve the problem of device damage caused by the fact that heat of the display panel cannot be conducted out in time.
In order to realize the technical problem, the invention adopts the following technical scheme:
in a first aspect, an embodiment of the present invention provides a display panel, including: a substrate, a first electrode and a second electrode,
the light emitting layer comprises a plurality of light emitting areas and non-light emitting areas which are arranged at intervals;
the packaging layer is positioned on one side, far away from the substrate, of the light emitting layer and comprises a first inorganic layer and an organic layer, the first inorganic layer is positioned on one side, close to the substrate, of the packaging layer, and a first groove is formed in one side, far away from the substrate, of the first inorganic layer;
the first heat dissipation layer is located in the first groove, and the heat conductivity coefficient of the first heat dissipation layer is larger than that of the first organic layer.
Further, the first groove is arranged corresponding to the light emitting area.
Further, the thickness of at least partial area of the first heat dissipation layer is smaller than the depth of the first groove.
Further, the first heat dissipation layer material comprises at least one of graphene, copper, aluminum and acrylic polyurethane heat conduction materials.
Further, the organic layer is doped with the thermally conductive material.
Further, the first inorganic layer is doped with the thermally conductive material.
Further, the LED packaging structure further comprises a second heat dissipation layer, wherein the second heat dissipation layer is located between the packaging layer and the light emitting layer.
Further, the organic light-emitting diode further comprises a third heat dissipation layer, wherein the third heat dissipation layer is located on the surface, far away from the substrate, of the organic layer.
Furthermore, one side of the third heat dissipation layer, which is far away from the substrate, is a concave-convex surface.
In a second aspect, an embodiment of the present invention further provides a display device, including the display panel set forth in any of the first aspects.
The display panel provided by the embodiment of the invention comprises a substrate, a light-emitting layer and a light-emitting layer, wherein the light-emitting layer comprises a plurality of light-emitting areas and non-light-emitting areas which are arranged at intervals; the packaging layer is positioned on one side, far away from the substrate, of the light emitting layer and comprises a first inorganic layer and an organic layer, the first inorganic layer is positioned on one side, close to the substrate, of the packaging layer, and a first groove is formed in one side, far away from the substrate, of the first inorganic layer; the heat conductivity coefficient of the first heat dissipation layer is larger than that of the organic layer, and the first heat dissipation layer is located in the first groove. The technical scheme provided by the embodiment of the invention improves the heat dissipation function of the display panel, avoids the damage of the light-emitting device caused by the accumulation of heat in the light-emitting device, improves the display efficiency of the display panel, and simultaneously, the first heat dissipation layer is positioned in the first groove, so that the thickness of the display panel can be prevented from being additionally increased, and the requirements of lightness and thinness are met.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another display panel according to an embodiment of the present invention.
A substrate 100;
a light-emitting layer 200; a light emitting region 210; a non-light emitting region 220;
an encapsulation layer 300; a first inorganic layer 310; an organic layer 320; a second inorganic layer 330;
a first heat dissipation layer 410, a first heat dissipation structure 411; a second heat dissipation layer 420; and a third heat dissipation layer 430.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Just as the problem mentioned in the background art that the luminous efficiency of the display panel is affected by the heat generated by the existing display panel during operation, the inventor finds that the heat generated by the light emitting device layer cannot be timely led out due to the packaging structure, and the heat accumulation causes the thermal decomposition of the light emitting device material, which causes the efficiency attenuation of the device, and affects the display effect and the service life of the display device.
Based on the above technical problem, the present embodiment proposes the following solutions: a display panel, comprising:
a substrate; the light emitting layer comprises a plurality of light emitting areas and non-light emitting areas which are arranged at intervals; the packaging layer is positioned on one side, away from the substrate, of the light emitting layer and comprises a first inorganic layer and an organic layer, the first inorganic layer is positioned on one side, close to the substrate, of the packaging layer, and a first groove is formed in one side, away from the substrate, of the first inorganic layer; the heat conductivity coefficient of the first heat dissipation layer is larger than that of the first inorganic layer, and the first heat dissipation layer is located in the first groove. Because set up first heat dissipation layer, and first heat dissipation layer coefficient of heat conductivity is greater than first inorganic layer, can derive the heat of luminescent device to the rete of keeping away from luminescent device rapidly, moreover because first heat dissipation layer is located first inorganic layer and keeps the encapsulation effect of first inorganic layer in the first recess of keeping away from base plate one side, can satisfy the frivolous demand of display panel simultaneously.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention, in which the display panel includes a substrate 100; the light emitting layer 200 comprises a plurality of light emitting regions 210 and non-light emitting regions 220 which are arranged at intervals, the packaging layer 300 is positioned on one side of the light emitting layer 200, which is far away from the substrate 100, the packaging layer 300 comprises a first inorganic layer 310 and an organic layer 320, the first inorganic layer 310 is positioned on one side of the packaging layer 300, which is close to the substrate 100, and a first groove is formed in one side of the first inorganic layer 310, which is far away from the substrate 100; the first heat dissipation layer 410, the first heat dissipation layer 410 is located in the first groove, and the thermal conductivity of the first heat dissipation layer 410 is greater than that of the first inorganic layer 310. The first heat dissipation layer 410 is located in the first groove, and the thermal conductivity of the first heat dissipation layer 410 is greater than that of the first inorganic layer 310, which can improve the heat dissipation performance of the display panel without increasing the thickness of the display panel, and the first heat dissipation layer 410 is located in the first inorganic layer 310, and the first inorganic layer 310 is located on the side of the packaging layer 300 close to the substrate 100, that is, the first heat dissipation layer 410 is located on the side of the packaging layer 300 close to the light emitting layer 200, which can rapidly conduct away the heat generated in the light emitting device, especially the light emitting material layer, and further avoid the problem of the efficiency reduction of the light emitting device caused by the accumulation of heat, furthermore, the first heat dissipation layer 410 is located in the groove of the first inorganic layer 310, which can improve the heat dissipation performance of the display panel while maintaining the packaging performance of the display panel, and because of the groove, the surface of the first inorganic layer 310 far away from the substrate, the path of water oxygen invasion is prolonged, and the improvement of the packaging performance is facilitated. In this embodiment, the first groove is disposed corresponding to the light emitting region 210, that is, the first heat dissipation layer 410 is disposed corresponding to the light emitting region 210, so that a heat conduction path can be reduced, and heat in the light emitting device can be rapidly conducted out. It is understood that, in other embodiments, the first groove may be disposed corresponding to the non-light emitting region 220, and thus, since the light emitting region 210 is not shielded by the first heat dissipation layer 410, the light emitting of the light emitting device is not affected, the material of the first heat dissipation layer 410 may include any material having a thermal conductivity greater than that of the first inorganic layer 310, and since the light emitting region 210 is not provided with the groove, the first inorganic layer 310 maintains the original thickness, which can further ensure the water and oxygen blocking effect of the light emitting region 210. In other embodiments, the first groove may be disposed simultaneously corresponding to the light emitting region 210 and the non-light emitting region 220, such as disposing the groove in the light emitting region 210, the non-light emitting region 220, respectively, or corresponding to the communication between the adjacent light emitting region 210 and the non-light emitting region 220. Specifically, the present invention is not limited to the specific configuration, a first groove is disposed on a side of the first inorganic layer 310 away from the substrate 100, the first heat dissipation layer 410 is disposed in the first groove, and the thermal conductivity of the first heat dissipation layer 410 is greater than that of the first organic layer 320.
The existing OLED display panel usually adopts a thin film encapsulation technology, and generally, the thin film encapsulation is a structure in which inorganic material layers and organic materials are alternately arranged, the inorganic layers are located on the outer side, and the inorganic layers are one more layer than the organic layers. In this embodiment, the encapsulation layer further includes a second inorganic layer 330 located on the organic layer 320 far from the substrate side, so as to improve the water-oxygen barrier effect of the encapsulation layer 300. The light emitting region 210 refers to a pixel formed by a light emitting material, and generally, an opening region is formed by a pixel defining structure, and the light emitting material deposited in the opening region forms a light emitting layer 200 formed by the pixel and the pixel defining structure, which is referred to as a non-light emitting region 220 in the present application.
In the embodiment, the first grooves are disposed corresponding to the light emitting regions 210, the first grooves have the same depth, the process for forming the grooves is simple, the first heat dissipation layer 410 is completely filled in the first grooves, and the first heat dissipation layer has a uniform thickness, that is, the first heat dissipation layer has the same heat dissipation effect corresponding to each light emitting region of the display panel. In other embodiments, the depth of the plurality of grooves may be different, and the heat dissipation effect of the corresponding region may be changed by adjusting the depth of the grooves. For example, when the first groove is disposed corresponding to both the light emitting region 210 and the non-light emitting region 220, the groove depth corresponding to the light emitting region 210 is greater than the groove depth corresponding to the non-light emitting region 220, and the portion of the first heat dissipation layer 410 corresponding to the light emitting region 210 is relatively closer to the light emitting layer, so that heat can be timely conducted out, and the deeper groove depth can relatively fill the thicker first heat dissipation layer in the groove, so as to further improve the heat dissipation effect. In other embodiments, the first groove depth corresponding to the middle area of the display panel is greater than the first groove depth corresponding to the edge area, that is, the display panel generally includes a display area and a non-display area surrounding the display area, the middle area of the display panel refers to the middle area of the light emitting area 210 of the display panel, the edge area refers to an area relatively close to the non-display area, and the edge area may be an edge located at one side of the display area or an edge surrounding the entire middle area, thereby further avoiding the accumulation of heat inside the middle area of the display panel, and further improving the heat dissipation effect of the middle area of the display panel. It is understood that, under the condition that other conditions are consistent, the depth of the first groove is limited, and therefore the first heat dissipation layer corresponding to the deeper first groove region is ensured to have the capability of rapidly guiding out the heat inside the light emitting device, and it is understood that the other conditions include the material and thickness of the first heat dissipation layer.
In an embodiment, the thickness of at least a partial region of the first heat dissipation layer 410 is smaller than the depth of the first groove. That is, the surface of the first heat dissipation layer 410 away from the substrate 100 is closer to the substrate 100 than the surface of the first inorganic layer 310 away from the substrate 100.
Fig. 2 is a schematic view of another display panel structure according to an embodiment of the present invention, in this embodiment, a thickness of the first heat dissipation layer 410 is smaller than a depth of the first groove, the organic layer 320 is located on a surface of the first inorganic layer 310, that is, the organic layer 320 is partially located in the first groove, the organic layer 320 and the first inorganic layer 310 form a snap structure, so as to increase a bonding force between the first inorganic layer 310 and the organic layer 320, and meanwhile, the presence of the first heat dissipation layer 410 improves a heat dissipation performance of the display panel, thereby avoiding a problem of efficiency reduction and failure of a light emitting device due to heat accumulation.
In this embodiment, the first heat dissipation layer 410 includes a plurality of first heat dissipation structures 411 disposed corresponding to the light emitting areas 210, the first grooves have the same depth, the first heat dissipation structures 411 in the first heat dissipation layer 410 have the same thickness, and a surface of one side of the first heat dissipation structures 411 away from the substrate 100 is a flat surface. In other embodiments, the surface of the first heat dissipation structure 411 may be a concave-convex structure, and the convex portion may completely fill the corresponding first groove, that is, the surface of the convex portion away from the substrate 100 may be flush with the surface of the first inorganic layer 310 away from the substrate 100, and the surface of the concave portion away from the substrate 100 is closer to the substrate 100 than the surface of the first inorganic layer 310 away from the substrate 100, so as to increase the disposition range of the first heat dissipation layer 410 and improve the bonding force between the first inorganic layer 310 and the organic layer 320. In yet another embodiment, a portion of the first heat dissipation structure 411 may completely fill the corresponding first recess, and a portion of the thickness of the first heat dissipation structure 411 is smaller than that of the first recess, for example, the first heat dissipation structure 411 close to the middle area of the display panel completely fills the first recess, and the first heat dissipation structure 411 around the edge area of the middle area of the display panel partially fills the first recess, so as to improve the heat dissipation effect of the middle area and simultaneously improve the bonding force between the film layers of the panel, especially the flexible display panel, and improve the bending resistance of the display panel.
In one embodiment, the first heat dissipation layer material includes at least one of graphene, copper, aluminum, acrylic urethane heat conduction material. That is, the first heat dissipation layer 410 may be doped with a heat conductive material having a thermal conductivity greater than that of the material of the first inorganic layer 310, or the first heat dissipation layer 410 is made of a heat conductive material having a thermal conductivity greater than that of the material of the first inorganic layer 310, so that the thermal conductivity of the first heat dissipation layer 410 is greater than that of the first inorganic layer 310. For example, the heat conductive material is any one of graphene, copper, aluminum, an acrylic urethane material, and the like, or a mixture of heat conductive materials. In other embodiments, the first heat dissipation layer 310 may also be a doped material of the first inorganic layer 310 and the heat conductive material, and due to the similarity of the properties of the film layers, the packaging effect of the display panel and the adhesion between the film layers can be better maintained. The specific material of the first heat dissipation layer may be determined according to the material of the first inorganic layer, as long as the heat conductivity is greater than that of the first inorganic layer.
In other embodiments, the organic layer 320 is doped with a thermal conductive material, and the organic layer 320 is doped with a thermal conductive material to improve the thermal conductivity of the organic layer 320 and improve the heat dissipation effect of the encapsulation layer 300. In addition, the first heat dissipation layer 410 and the organic layer 320 may be made of the same material, i.e., the same material composition and the same doping concentration, so that they may be made in the same process, thereby simplifying the manufacturing process. The organic layer 320 doped with a thermally conductive material, the entire thermally conductive layer, and the first thermally conductive layer located in the first recess all may improve thermal conductivity. In yet another embodiment, the doping concentration of the organic layer 320 may be less than the doping concentration of the first heat dissipation layer 410 to maintain the flexibility of the inorganic layer in the encapsulation layer 300.
In other embodiments, the first inorganic layer 310 may be doped with a thermally conductive material with a doping concentration less than that of the first heat dissipation layer 410, or the first heat dissipation layer 410 may be a single thermally conductive material and the first inorganic layer 310 may be a thermally conductive material doped with an inorganic material, and the thermally conductive material doped with the first inorganic layer 310 may be the same material as or a different material from the thermally conductive material of the first heat dissipation layer 410.
As shown in fig. 3, in another structure of a display panel, in this embodiment, the display panel further includes a second heat dissipation layer 420, and the second heat dissipation layer 420 is located between the encapsulation layer 300 and the light emitting layer 200. The second heat dissipation layer 420 is located between the light emitting layer 200 and the package layer 300, that is, the second heat dissipation layer 420 is disposed independently of the package layer 300, and the second heat dissipation layer 420 is disposed closer to the light emitting layer 200, which is beneficial to timely heat dissipation of the light emitting device. In this embodiment, the second heat dissipation layer 420 is disposed corresponding to the non-light emitting region 220, the material selection of the second heat dissipation layer 420 is not limited by the light transmittance of the material, and the light emitting region 210 is the structure of the package layer 300, and a fastening structure is formed between the first inorganic layer 310 and the second heat dissipation layer 420 in this embodiment, so as to improve the adhesion between the display panel layers.
It is understood that, in this embodiment, the thickness of the first inorganic layer 310 may be the conventional thickness of the existing design, that is, the total thickness of the first heat dissipation layer 410 and the corresponding first inorganic layer structure thickness, or the total thickness of the second heat dissipation layer 420 and the corresponding first inorganic layer structure thickness may be the conventional thickness of the existing design, that is, the first heat dissipation layer 410 and the second heat dissipation layer 420 are disposed without increasing the thickness of the display panel, so as to improve the heat dissipation effect of the display light emitting device, improve the light emitting effect of the device, and prolong the service life of the device. It may also be thicker than the existing first inorganic layer to enhance the water oxygen barrier effect of the first inorganic layer.
In other embodiments, the second heat dissipation layer 420 is a whole layer structure, that is, the second heat dissipation layer 420 is disposed corresponding to both the light emitting region 210 and the non-light emitting region 220 of the light emitting layer 200, so as to improve the heat dissipation performance of the display panel. When the light emitting region 210 is provided with a heat dissipation layer, a heat dissipation material meeting the light transmission requirement can be selected to meet the light emission requirement of the display panel. It will be appreciated that the particular choice of materials may be selected by those skilled in the art according to particular needs.
In an embodiment, the display panel further includes a third heat dissipation layer 430, and the third heat dissipation layer 430 is disposed on a side of the organic layer 320 away from the substrate 100. It is understood that the third heat dissipation layer 430 may be disposed in a whole layer, may be disposed in a partial region, such as corresponding to the non-light emitting 220 region. Further, the package layer 300 further includes a second inorganic layer 330, and the second inorganic layer 330 is disposed on a surface of the third heat dissipation layer 430 away from the substrate. When the third heat dissipation layer 430 is disposed corresponding to the non-light emitting region 220, the portion corresponding to the light emitting region 210 may be the organic layer 320 or the second inorganic layer 330. For example, the organic layer 320 corresponding to the light emitting region 210 can be formed by forming a second groove on the surface of the organic layer 320 far from the substrate 100 and forming a third heat dissipation layer 430 in the second groove, and correspondingly, the second inorganic layer 330 can be prepared by forming a whole heat dissipation layer on the surface of the organic layer 320 and forming the third heat dissipation layer 430 corresponding to the non-light emitting region 220 by removing the heat dissipation layer structure corresponding to the light emitting region 210. The above are merely examples of possible preparation methods and are not intended to be limiting.
The third heat dissipation layer 430 may be disposed on the whole layer, or disposed corresponding to a portion of the light emitting region 210, or disposed corresponding to only the light emitting region 210, and the specific disposition mode is not limited in this application, and the presence of the third heat dissipation layer 430 improves the heat dissipation effect of the display panel.
Further, as shown in fig. 4, a side of the third heat dissipation layer 430 away from the substrate 100 is a concave-convex surface, which is a schematic structural diagram of another display panel of the present invention, in this embodiment, the third heat dissipation layer 430 is a whole heat dissipation layer, a surface of the third heat dissipation layer 430 away from the substrate 100 is a concave-convex structure, and the existence of the concave-convex structure increases a contact area between the film layers, thereby improving the heat dissipation efficiency of the display panel. It is understood that the surface of the third heat dissipation layer 430 away from the substrate 100 is not limited to be an uneven structure, but may also be a curved surface, as long as the rough surface can increase the contact area between adjacent films and increase the adhesion between the films, thereby improving the heat dissipation effect of the display panel and the bonding force between the films.
The invention also provides a display device which comprises any display panel, wherein the display device can be a mobile phone, a tablet personal computer, wearable equipment and the like, and the effects of enhancing the heat dissipation performance and improving the display efficiency can be realized as long as the display panel is included.
In the display panel and the display device provided by the invention, the first inorganic layer 310 in the encapsulation layer 300 is provided with the first groove at the side far away from the substrate 100; the first heat dissipation layer 410 is located in the first groove, and the heat conductivity coefficient of the first heat dissipation layer 410 is greater than that of the first organic layer 320, so that heat generated in the light emitting device can be rapidly conducted out, heat accumulation is avoided, the heat dissipation effect of the display panel is improved, the light emitting efficiency of the display panel is improved, and the service life of the display panel is prolonged.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A display panel, comprising:
a substrate;
the light emitting layer comprises a plurality of light emitting areas and non-light emitting areas which are arranged at intervals;
the packaging layer is positioned on one side, far away from the substrate, of the light emitting layer and comprises a first inorganic layer and an organic layer, the first inorganic layer is positioned on one side, close to the substrate, of the packaging layer, and a first groove is formed in one side, far away from the substrate, of the first inorganic layer;
the first heat dissipation layer is located in the first groove, and the heat conductivity coefficient of the first heat dissipation layer is larger than that of the first inorganic layer.
2. The display panel according to claim 1, wherein the first groove is disposed corresponding to the light emitting region.
3. The display panel according to claim 1, wherein the first heat dissipation layer has at least a partial area thickness smaller than the first groove depth.
4. The display panel of claim 1, wherein the first heat sink material comprises at least one of graphene, copper, aluminum, acrylic urethane thermal conductive material.
5. The display panel of claim 4, wherein the organic layer is doped with the thermally conductive material.
6. The display panel of claim 4, wherein the first inorganic layer is doped with the thermally conductive material.
7. The display panel according to any one of claims 1 to 6, further comprising a second heat dissipation layer between the encapsulation layer and the light emitting layer.
8. The display panel according to any one of claims 1 to 7, further comprising a third heat dissipation layer on a surface of the organic layer remote from the substrate.
9. The display panel according to claim 8, wherein a side of the third heat dissipation layer away from the substrate is a concave-convex surface.
10. A display device characterized by comprising the display panel according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911191074.7A CN110911582A (en) | 2019-11-28 | 2019-11-28 | Display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911191074.7A CN110911582A (en) | 2019-11-28 | 2019-11-28 | Display panel and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110911582A true CN110911582A (en) | 2020-03-24 |
Family
ID=69820274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911191074.7A Pending CN110911582A (en) | 2019-11-28 | 2019-11-28 | Display panel and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110911582A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113224016A (en) * | 2021-03-25 | 2021-08-06 | 深圳市华星光电半导体显示技术有限公司 | Display panel and display device |
| CN113299846A (en) * | 2021-04-13 | 2021-08-24 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN113539096A (en) * | 2021-07-15 | 2021-10-22 | 武汉华星光电半导体显示技术有限公司 | Display module assembly and display device |
| CN114355652A (en) * | 2021-12-20 | 2022-04-15 | 北海惠科光电技术有限公司 | Array substrate, color film substrate, preparation method of color film substrate and display panel |
| WO2022227121A1 (en) * | 2021-04-26 | 2022-11-03 | 武汉华星光电技术有限公司 | Oled display panel |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002009478A1 (en) * | 2000-07-24 | 2002-01-31 | Tdk Corporation | Luminescent device |
| US20150014640A1 (en) * | 2013-07-09 | 2015-01-15 | Samsung Display Co., Ltd. | Organic light emitting diode display and manufacturing method thereof |
| CN105470409A (en) * | 2016-01-04 | 2016-04-06 | 京东方科技集团股份有限公司 | Organic light-emitting diode (OLED) package structure, fabrication method thereof and display device |
| CN106384743A (en) * | 2016-10-20 | 2017-02-08 | 武汉华星光电技术有限公司 | Oled display and manufacturing method thereof |
| CN106784405A (en) * | 2016-12-23 | 2017-05-31 | 武汉华星光电技术有限公司 | The preparation method and OLED of OLED |
| CN106972113A (en) * | 2017-05-25 | 2017-07-21 | 深圳市华星光电技术有限公司 | The package assembling and method for packing of OLED, display device |
| CN107154465A (en) * | 2017-05-26 | 2017-09-12 | 深圳市华星光电技术有限公司 | The package assembling and method for packing of OLED, display device |
| CN107210384A (en) * | 2015-12-31 | 2017-09-26 | 深圳市柔宇科技有限公司 | Encapsulating structure, flexible display screen and encapsulating structure preparation method |
-
2019
- 2019-11-28 CN CN201911191074.7A patent/CN110911582A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002009478A1 (en) * | 2000-07-24 | 2002-01-31 | Tdk Corporation | Luminescent device |
| US20150014640A1 (en) * | 2013-07-09 | 2015-01-15 | Samsung Display Co., Ltd. | Organic light emitting diode display and manufacturing method thereof |
| CN107210384A (en) * | 2015-12-31 | 2017-09-26 | 深圳市柔宇科技有限公司 | Encapsulating structure, flexible display screen and encapsulating structure preparation method |
| CN105470409A (en) * | 2016-01-04 | 2016-04-06 | 京东方科技集团股份有限公司 | Organic light-emitting diode (OLED) package structure, fabrication method thereof and display device |
| CN106384743A (en) * | 2016-10-20 | 2017-02-08 | 武汉华星光电技术有限公司 | Oled display and manufacturing method thereof |
| CN106784405A (en) * | 2016-12-23 | 2017-05-31 | 武汉华星光电技术有限公司 | The preparation method and OLED of OLED |
| CN106972113A (en) * | 2017-05-25 | 2017-07-21 | 深圳市华星光电技术有限公司 | The package assembling and method for packing of OLED, display device |
| CN107154465A (en) * | 2017-05-26 | 2017-09-12 | 深圳市华星光电技术有限公司 | The package assembling and method for packing of OLED, display device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113224016A (en) * | 2021-03-25 | 2021-08-06 | 深圳市华星光电半导体显示技术有限公司 | Display panel and display device |
| CN113299846A (en) * | 2021-04-13 | 2021-08-24 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| WO2022227121A1 (en) * | 2021-04-26 | 2022-11-03 | 武汉华星光电技术有限公司 | Oled display panel |
| CN113539096A (en) * | 2021-07-15 | 2021-10-22 | 武汉华星光电半导体显示技术有限公司 | Display module assembly and display device |
| CN114355652A (en) * | 2021-12-20 | 2022-04-15 | 北海惠科光电技术有限公司 | Array substrate, color film substrate, preparation method of color film substrate and display panel |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110911582A (en) | Display panel and display device | |
| KR102436248B1 (en) | Organic light emitting diodes display | |
| US9196869B2 (en) | Manufacturing method of light-emitting device with nano-imprinting wiring | |
| US8872201B2 (en) | Organic light emitting diode display | |
| US10270047B2 (en) | Flexible organic light-emitting diode display panel | |
| US11605795B2 (en) | Organic light-emitting display panel and display device with earth metal dopants | |
| US9620738B2 (en) | Flat panel display device and manufacturing method thereof | |
| US8389981B2 (en) | Organic light emitting diode lighting equipment | |
| TWI552403B (en) | Large area light emitting electrical package with current spreading bus | |
| KR20180030957A (en) | Light-emitting device and article | |
| KR100984362B1 (en) | Organic electro-luminescence panel | |
| CN111864106B (en) | Display panel, manufacturing method of display panel and display device | |
| WO2006033312A1 (en) | Organic el display | |
| WO2019052314A1 (en) | Display panel and preparation method therefor, and display device | |
| US20060022589A1 (en) | OLED display with electrode | |
| CN110690362B (en) | Display panel and display device | |
| KR20110050985A (en) | Organic electro-luminescence device | |
| CN113437241A (en) | Display substrate, display device and preparation method of display substrate | |
| KR101383490B1 (en) | Light emitting device | |
| CN115911241A (en) | Display panel and display device | |
| CN216120359U (en) | Light-emitting substrate and light-emitting device | |
| CN111834418B (en) | Display panel and electronic device | |
| CN113178528A (en) | Display panel and display device | |
| CN113193150A (en) | Top-emitting display panel and display device | |
| US8564189B2 (en) | Organic EL element and organic EL device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200324 |