WO2020051904A1

WO2020051904A1 - Electronic device

Info

Publication number: WO2020051904A1
Application number: PCT/CN2018/105815
Authority: WO
Inventors: 刘景�; 陈松亚
Original assignee: 深圳市柔宇科技有限公司
Priority date: 2018-09-14
Filing date: 2018-09-14
Publication date: 2020-03-19
Also published as: WO2020052030A1; CN112640597A; CN112640395A; WO2020052028A1; CN112639671A

Abstract

An electronic device (100), comprising a first part (10), a second part (20) and a flexible heat conduction layer (30). The first part (10) comprises a first heat sink (11) and a motherboard component (12), the motherboard component (12) being heat-conductingly connected to a side of the first heat sink (11); the second part (20) comprises a second heat sink (21) and a battery component (22), the battery component (22) being heat-conductingly connected to a side of the second heat sink (21); and the flexible heat conduction layer (30) is heat-conductingly connected to the first heat sink (11) and the second heat sink (21). Since the flexible heat conduction layer (30) is heat-conductingly connected to the first heat sink (11) and the second heat sink (21), the heat of the motherboard component (12) may be transferred to the second heat sink (21) by means of the first heat sink (11) and the flexible heat conduction layer (30) for heat dissipation, and similarly, the heat of the battery component (22) may also be transferred to the first heat sink (11) by means of the second heat sink (21) and the flexible heat conduction layer (30) for heat dissipation. When the amount of heat generated by the motherboard component (12) or the battery component (22) is large, heat may be better dissipated due to the heat dissipation area being large, thus localized overheating of the electronic device (100) may be prevented, thereby improving user experience.

Description

Electronic device

Technical field

The present invention relates to the field of consumer electronics technology, and more particularly, to an electronic device.

Background technique

An electronic device in the related art, such as a mobile phone, includes a first part and a second part. Generally, the first part is provided with a motherboard, and the second part is provided with a battery. The heat generated by the motherboard heat is radiated through the back cover of the first part and the natural convection heat is dissipated, while the heat generated by the battery is heat radiated through the back cover of the second part and the natural convection heat is radiated. However, due to the large amount of heat generated by the motherboard, the first part and the second part are two separate areas, and the first part cannot transfer heat to the second part to form uniform temperature and heat dissipation, which easily causes the surface temperature of the rear cover of the first part to be higher. This in turn affects the user experience.

Summary of the Invention

The invention provides an electronic device.

An electronic device according to an embodiment of the present invention includes a first part, a second part, and a flexible heat-conducting layer. The first part includes a first heat sink and a motherboard component, and the motherboard component is thermally connected to one side of the first heat sink. The second part includes a second heat sink and a battery part, the battery part is thermally connected to one side of the second heat sink, and the flexible thermally conductive layer is thermally connected to the first heat sink and the first heat sink. Two heat sinks.

In the above electronic device, since the flexible heat conductive layer is thermally connected to the first heat sink and the second heat sink, so that the heat of the motherboard components can be transferred to the second heat sink through the first heat sink and the flexible heat conduction layer for heat dissipation. The heat of the battery component can also be transferred to the first heat sink for heat dissipation through the second heat sink and the flexible heat-conducting layer. When the heat generation of the motherboard component or the battery component is large, the heat dissipation area is larger, which can better dissipate heat, thereby preventing local overheating of the electronic device, thereby improving the user experience.

Additional aspects and advantages of the embodiments of the present invention will be given in part in the following description, part of which will become apparent from the following description, or be learned through practice of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

1 is a schematic diagram of an electronic device according to an embodiment of the present invention;

2 is a schematic perspective view of an electronic device according to an embodiment of the present invention when it is flattened;

3 is a schematic perspective view of an electronic device according to an embodiment of the present invention when folded;

4 is a schematic exploded perspective view of a part of a structure of an electronic device during flattening according to an embodiment of the present invention;

5 is an exploded perspective view of another part of the structure of the electronic device during flattening according to an embodiment of the present invention from another perspective;

6 is a schematic exploded perspective view of an electronic device according to an embodiment of the present invention when it is flattened;

FIG. 7 is another perspective exploded view of the electronic device according to the embodiment of the present invention when it is flattened; FIG.

8 is an exploded perspective view of a part of a structure of an electronic device during flattening according to an embodiment of the present invention;

9 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention when it is flattened;

10 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention when it is folded.

Explanation of main component symbols:

Electronic device 100;

The first part 10, the first heat sink 11, the receiving groove 110, the first groove 111, the main board component 12, the main board 121, the first chip part 122, the first shielding cover 1221, the first chip 1222, the first heat conductive layer 1223, The second chip portion 123, the second shield cover 1231, the second chip 1232, the second heat conductive layer 1233, the first cover 13, the first mounting cavity 130, the third heat conductive layer 14, the second portion 20, and the second heat sink 21 , Second heat sink 21, second groove 211, battery component 22, second cover 23, second mounting cavity 230, fourth heat conductive layer 24, flexible heat conductive layer 30, support plate 31, hinge assembly 40, hinge body 41 , A connecting member 42, a first notch slot 43, a second notch slot 44, a flexible screen assembly 50, a support frame 51, and a flexible display screen 52.

detailed description

Hereinafter, embodiments of the present invention will be described in detail. Examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention, but should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Rear "," left "," right "," vertical "," horizontal "," top "," bottom "," inside "," outside "," clockwise "," counterclockwise ", etc. or The positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, structure and operation in a specific orientation, Therefore, it cannot be understood as a limitation to the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless specifically defined otherwise.

In the description of the present invention, it should be noted that the terms "installation", "connected", and "connected" should be understood in a broad sense unless otherwise specified and limited. For example, they may be fixed connections or removable. Connected, or integrated. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

Please refer to FIGS. 1-10 together. The electronic device 100 according to the embodiment of the present invention may be a flexible folding electronic device, such as a flexible folding mobile phone or a flexible folding tablet computer. The electronic device 100 includes a first portion 10, a second portion 20, and a flexible thermally conductive layer 30.

The first portion 10 includes a first heat sink 11 and a main board member 12. The motherboard component 12 is thermally connected to one side of the first heat sink 11. The second portion 20 includes a second heat sink 21 and a battery component 22. The battery component 22 is thermally connected to one side of the second heat sink 21. The flexible thermally conductive layer 30 thermally connects the first heat sink 11 and the second heat sink 21. In this way, since the flexible heat conducting layer 30 is thermally connected to the first heat sink 11 and the second heat sink 21, the heat of the motherboard component 12 can be transferred to the second heat sink 21 via the first heat sink 11 and the flexible heat conducting layer 30 for heat dissipation. Similarly, the heat of the battery component 22 can also be transferred to the first heat sink 11 via the second heat sink 21 and the flexible heat-conducting layer 30 for heat dissipation. When the amount of heat generated by the motherboard component 12 or the battery component 22 is large, due to the large heat dissipation area, heat can be better dissipated, thereby preventing local overheating of the electronic device 100, thereby improving the user experience. In particular, since the heat generation amount of the motherboard component 12 is greater than the heat generation amount of the battery component 22, the flexible heat-conducting layer 30 can transfer heat from the area of the motherboard component 12 to the area of the battery component 22, achieving a better uniform temperature effect.

It should be noted that the shape of the electronic device 100 can be set according to specific conditions, for example, it can be rectangular parallelepiped. The electronic device 100 can switch between an unfolded state and a folded state. When the electronic device 100 is bent to approximately 180 degrees (as shown in FIGS. 3 and 10), the first portion 10 and the second portion 20 substantially overlap, and the distance between the main board component 12 and the battery component 22 is small. If the flexible heat-conducting layer 30 is not provided, heat dissipation between each other will be affected. In the embodiment of the present invention, a flexible heat conducting layer 30 is provided on the other side of the first heat sink 11 and the other side of the second heat sink 21, and the flexible heat conducting layer 30 can increase the heat dissipation area of the motherboard component 12 and the battery component 22. , Which is conducive to heat dissipation.

It can be understood that, in order to make the first heat radiating body 11 and the second heat radiating body 21 have a large heat radiation area, the first heat radiating body 11 can be made into a plate shape, and the second heat radiating body 21 can be made into a plate shape. In addition, the first heat radiating body 11 and the second heat radiating body 21 can be spaced, which is more conducive to heat dissipation.

In some embodiments, the first heat sink 11 and the second heat sink 21 are close to each other when the electronic device 100 is bent, and are far away from each other when the electronic device 100 is unfolded. In this way, even when the main board part 12 and the battery part 22 are close to each other when the electronic device 100 is bent, the first heat sink 11 and the second heat sink 21 combined with the flexible heat conductive layer 30 can generate heat even if the heat generated by the main board part 12 and the battery part 22 The heat is released, and when the electronic device 100 is deployed, the first heat sink 11 and the second heat sink 21 are away from each other, which facilitates heat dissipation.

In some embodiments, the flexible heat-conducting layer 30 is used to transfer the heat of the first heat sink 11 to the second heat sink 21 for dissipation. In this way, the heat generated by the motherboard component 12 can be dissipated in time, and then the heat can be evenly distributed.

In some embodiments, the flexible thermal conductive layer 30 is located on the opposite side of the first heat sink 11 from the main board component 12 and the battery component 22. In this way, the flexible heat-conducting layer 30 and the first heat-dissipating body 11 are in full contact, so that the heat generated by the motherboard component 12 can be fully dissipated to the flexible heat-conducting layer 30 through the first heat-dissipating body 11, and then the purpose of balanced heat dissipation is achieved.

In some embodiments, the electronic device 100 includes a hinge assembly 40. The hinge assembly 40 connects the first portion 10 and the second portion 20. The hinge assembly 40, the first heat sink 11, and the second heat sink 21 are disposed on the same side of the flexible heat conductive layer 30. As such, the hinge assembly 40 can achieve relative rotation of the first portion 10 and the second portion 20.

In the present embodiment, the entire hinge assembly 40 is bendable. The first part 10 and the second part 20 are symmetrically disposed on both sides of the hinge assembly 40. The first part 10 and the second part 20 can be switched between the unfolded state and the folded state around the hinge assembly 40.

In some embodiments, the flexible thermally conductive layer 30 covers the hinge assembly 40 and is thermally connected to the hinge assembly 40. In this way, the flexible thermally conductive layer 30 has a larger thermally conductive area and can further dissipate the heat of the hinge assembly 40.

In some embodiments, the electronic device 100 includes a support plate 31 attached to the flexible thermally conductive layer 30. The support plate 31 is located between the hinge assembly 40 and the flexible thermally conductive layer 30. In this way, the support plate 31 has a certain supporting effect on the flexible heat-conducting layer 30, and at the same time, the support plate 31 separates the hinge assembly 40 from the flexible heat-conducting layer 30, so that the hinge assembly 40 can be prevented from wearing the flexible heat-conducting layer 30 when being bent, thereby conducting heat transfer to the flexible The layer 30 has a protective effect.

In this embodiment, the first heat radiating body 11 and the second heat radiating body 21 are provided on one side of the support plate 31. The flexible thermally conductive layer 30 is disposed on the other side of the support plate 31. In this way, the heat dissipating body with a higher temperature among the first heat dissipating body 11 and the second heat dissipating body 21 can conduct heat from the support plate 31 to the flexible heat conducting layer 30, and the flexible heat conducting layer 30 can conduct heat to the first heat dissipating body 11 and The lower-temperature heat-radiating body in the second heat-radiating body 21 achieves uniform temperature heat dissipation.

Preferably, the orthographic projection area of the support plate 31 on the flexible heat-conducting layer 30 basically covers the flexible heat-conducting layer 30 (the size of the support plate 31 may be consistent with the size of the flexible heat-conducting layer 30, or the size of the support plate 31 is slightly larger than the flexible heat-conducting layer 30 Layer 30), so that the support plate 31 can completely separate the flexible thermally conductive layer 30 and the hinge assembly 40.

In some embodiments, the flexible thermally conductive layer 30 is a graphene material or a graphite material. The support plate 31 is made of metal. In this way, the heat conducting effect of the flexible heat conducting layer 30 and the supporting plate 31 is better. In one example, the support plate 31 may be made of a metal steel sheet.

In some embodiments, the first heat sink 11 is formed with a first groove 111. The second heat sink 21 is formed with a second groove 211. The first groove 111 and the second groove 211 together form a receiving groove 110. The flexible heat-conducting layer 30 is partially or completely contained in the receiving groove 110. In this way, the arrangement of the receiving groove 110 improves the installation stability of the flexible thermally conductive layer 30 and increases the contact area between the first and

second heat sinks

11 and 21 and the flexible thermally conductive layer 30.

In this embodiment, the support plate 31 and the flexible heat-conducting layer 30 are sequentially stacked and attached to the receiving groove 110. The shape of the support plate 31 matches the shape of the flexible thermally conductive layer 30. The support plate 31 is located between the flexible heat conductive layer 30 and the bottom wall of the receiving groove 110. The flexible thermally conductive layer 30 is completely contained in the receiving groove 110, and the thickness of the flexible thermally conductive layer 30 is less than the depth of the receiving groove 110, so that the receiving groove 110 can also accommodate other components.

Further, the hinge assembly 40 includes a bendable hinge body 41 and two bendable connecting members 42 provided on the hinge body 41. The hinge body 41 connects the first portion 10 and the second portion 20. A first notch 43 is provided on one side of the first groove 111, and a second notch 44 is provided on one side of the second groove 211. The top surface of the hinge body 41 is substantially coplanar with the bottom surface of the first groove 111 and the bottom surface of the second groove 211. The two connecting members 42 are oppositely disposed on both sides of the top surface of the hinge body 41 near the edge. The connecting member 42 connects the edge of the first notch 43 and the edge of the second notch 44, that is, the connecting member 42 can connect the first heat sink 11 and第二热体 21。 The second heat sink 21. The support plate 31 and the flexible thermally conductive layer 30 are both located above the two connecting members 42 on the side away from the hinge body 41.

In some embodiments, combining FIG. 6 and FIG. 9, the motherboard component 12 includes a motherboard 121 and a first chip portion 122. The first chip portion 122 includes a first shield cover 1221 and a first chip 1222. The first chip 1222 and the first shielding cover 1221 are disposed on the main board 121. The first shielding cover 1221 covers the first chip 1222 and is thermally connected to the first chip 1222. The first shield cover 1221 is thermally connected to the first heat sink 11. In this way, the heat generated by the first chip 1222 can be conducted to the first heat sink 11 and dissipated by the first shield 1221. The first shielding cover 1221 may be used to protect the first chip 1222.

In some embodiments, the first chip portion 122 includes a first thermally conductive layer 1223. The first thermally conductive layer 1223 thermally connects the first shielding cover 1221 and the first chip 1222 in a thermally conductive manner. As such, the first thermally conductive layer 1223 improves the efficiency of thermal conduction between the first chip 1222 and the first shield 1221. The first thermally conductive layer 1223 may be, for example, a thermally conductive silicon gel or a thermally conductive silicone grease.

In some embodiments, the motherboard component 12 includes a second chip portion 123. The second chip portion 123 includes a second shield cover 1231 and a second chip 1232. The second chip 1232 and the second shield cover 1231 are disposed on a side of the main board 121 facing away from the first chip portion 122. The second shielding cover 1231 covers the second chip 1232 and is thermally connected to the second chip 1232. The second shield cover 1231 increases the heat dissipation area of the motherboard component 12 and protects the second chip 1232. The heat dissipation between the first chip portion 122 and the second chip portion 123 does not affect each other, and the heat dissipation efficiency is improved.

In some embodiments, the second chip portion 123 includes a second thermally conductive layer 1233. The second thermally conductive layer 1233 is thermally connected to the second shielding cover 1231 and the second chip 1232. As such, the second heat-conducting layer 1233 improves the efficiency of heat conduction between the second chip 1232 and the second shield cover 1231. The second thermally conductive layer 1233 may be, for example, a thermally conductive silicone gel or a thermally conductive silicone grease.

In some embodiments, the first portion 10 includes a thermally conductive first cover 13. The first cover 13 and the first heat sink 11 are connected and together form a first mounting cavity 130. The motherboard component 12 is housed in the first mounting cavity 130. The second shield cover 1231 is thermally connected to the first cover 13. In this way, the first cover 13 not only increases the heat dissipation area of the motherboard component 12, but also protects the motherboard component 12.

In some embodiments, the first portion 10 includes a third thermally conductive layer 14. The third thermally conductive layer 14 thermally connects the second shielding cover 1231 and the first cover 13. As such, the third thermally conductive layer 14 improves the efficiency of thermal conduction between the second shield cover 1231 and the first cover 13. The third thermally conductive layer 14 may be, for example, a graphite sheet.

In some embodiments, the second portion 20 includes a thermally conductive second cover 23. The second cover 23 and the second heat sink 21 are connected and together form a second mounting cavity 230. The battery component 22 is located in the second mounting cavity 230. The battery component 22 is thermally connected to the second cover 23. In this way, the second cover 23 is provided to increase the heat radiation area of the battery component 22 and protect the battery component 22.

In some embodiments, when the electronic device 100 is bent, the first cover 13 and the second cover 23 are close to each other, and the distance between the first cover 13 and the second cover 23 is smaller than that of the first heat sink 11 and the second heat sink. The distance between the bodies 21. In this way, when the electronic device 100 is bent, this is more conducive to the dissipation of heat.

In some embodiments, the second portion 20 includes a fourth thermally conductive layer 24. The fourth thermally conductive layer 24 thermally connects the battery component 22 and the second cover 23. As such, the fourth thermally conductive layer 24 improves the efficiency of heat conduction between the battery component 22 and the second cover 23. The fourth thermally conductive layer 24 may be, for example, a graphite sheet.

In some embodiments, the electronic device 100 includes a flexible screen assembly 50. The flexible screen assembly 50 is installed on a side of the flexible heat conductive layer 30 facing away from the first portion 10 and the second portion 20. In this way, this facilitates the heat dissipation of the flexible screen assembly 50.

In this embodiment, the flexible thermally conductive layer 30 is located between the flexible screen assembly 50 and the support plate 31.

In some embodiments, the flexible screen assembly 50 includes a support frame 51 and a flexible display screen 52. The support frame 51 is disposed on a side of the flexible heat conductive layer 30 facing away from the first portion 10 and the second portion 20. The flexible display screen 52 is disposed on a side of the support frame 51 facing away from the flexible thermal conductive layer 30. In this way, the supporting frame 51 can improve the overall stability of the flexible screen assembly 50. In one example, the support frame 51 is a liquid metal support frame.

The first cover 13 and the second cover 23 respectively form two heat dissipation paths, that is, the first cover 13 can dissipate the heat of the motherboard component 12, and the second cover 23 can dissipate the heat of the battery component 22. When the flexible electronic device 100 is in the unfolded state, the first cover 13 and the second cover 23 do not affect each other, and each emits heat. However, when the flexible electronic device 100 is in the folded state, the first cover 13 and the second cover 23 are close to each other or even come into contact with each other, and there is less space for emitting heat to the outside, and the heat dissipation efficiency is lower. In addition, when the first cover 13 and the second cover 23 are made of a non-thermally conductive material such as plastic, the heat emission is further affected. Therefore, in the folded state, heat is mainly dissipated through another heat dissipation path, that is, through a heat sink that is still located on the outside. The heat of the motherboard component 12 is homogenized to the second heat sink 21 of the battery component 22 through the thermally conductive component. The heat of the battery component 22 and the heat transferred from the motherboard component 12 is dissipated through the second heat radiator 21, and the heat of the 12 motherboard components is simultaneously Dissipation is performed by the first heat radiating body 11 to ensure the overall heat dissipation efficiency. When the flexible electronic device 100 is in the unfolded state, the first cover 13, the second cover 23, the first heat sink 11, and the second heat sink 21 all serve as main heat dissipation paths for heat dissipation.

Understandably, the thermally conductive component may also include only the flexible thermally conductive layer 30, that is, the flexible thermally conductive layer 30 simultaneously performs the thermally conductive function and the supporting function, and the support plate 31 may be omitted at this time.

Further, when the hinge assembly 40 is made of a metal material, it can also be used as a heat dissipation path to dissipate the heat of the battery component 22 and the motherboard component 12. That is, the first cover 13, the second cover 23, the heat-conducting component, the first heat sink 11, and the second heat sink 21 can further transfer heat to the hinge assembly 40, and then dissipate the heat through the hinge assembly 40 to further improve the heat dissipation effect.

In the present invention, unless specifically stated and defined otherwise, the "first" or "down" of the second feature may include the first and second features in direct contact, and may also include the first and second features. Not directly, but through another characteristic contact between them. Moreover, the first feature is "above", "above", and "above" the second feature, including that the first feature is directly above and obliquely above the second feature, or merely indicates that the first feature is higher in level than the second feature. The first feature is “below”, “below”, and “below” of the second feature, including the fact that the first feature is directly below and obliquely below the second feature, or merely indicates that the first feature is less horizontal than the second feature.

The following disclosure provides many different implementations or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

In the description of this specification, the description with reference to the terms “one embodiment”, “some embodiments”, “exemplary embodiments”, “examples”, “specific examples”, or “some examples”, etc., means that the embodiments are combined The specific features, structures, materials, or characteristics described by the examples are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same implementation or example. Moreover, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more implementations or examples.

Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirit of the present invention, The scope of the invention is defined by the claims and their equivalents.

Claims

An electronic device, comprising:

A first part, the first part includes a first heat sink and a motherboard component, and the motherboard component is thermally connected to one side of the first heat sink;

A second part, the second part including a second heat sink and a battery component, the battery part being thermally connected to one side of the second heat sink;

A flexible thermally conductive layer that thermally connects the first heat sink and the second heat sink.
The electronic device according to claim 1, wherein the first heat sink and the second heat sink are close to each other when the electronic device is bent, and are far away from each other when the electronic device is deployed.
The electronic device according to claim 1, wherein the flexible heat-conducting layer is configured to transfer heat of the first heat sink to the second heat sink for dissipation.
The electronic device according to claim 1, wherein the flexible thermally conductive layer is located on an opposite side of the first heat sink from the motherboard component and the battery component.
The electronic device according to claim 1, wherein the electronic device comprises a hinge assembly, the hinge assembly connecting the first part and the second part, the hinge assembly, the first heat sink, and The second heat sink is disposed on the same side of the flexible thermally conductive layer.
The electronic device according to claim 5, wherein the flexible thermally conductive layer covers the hinge assembly and is thermally connected to the hinge assembly.
The electronic device according to claim 1, wherein the electronic device comprises a support plate attached to the flexible thermally conductive layer, and the support plate is located between the hinge assembly and the flexible thermally conductive layer.
The electronic device according to claim 7, wherein the flexible thermally conductive layer is made of a graphene material or a graphite material, and the support plate is made of a metal.
The electronic device according to claim 1, wherein the first heat sink is formed with a first groove, the second heat sink is formed with a second groove, the first groove and the first groove The two grooves together form a receiving groove, and the flexible thermally conductive layer is partially or completely received in the receiving groove.
The electronic device according to claim 1, wherein the motherboard component includes a motherboard and a first chip portion, and the first chip portion includes a first shield cover and a first chip, the first chip and the first chip portion A first shield cover is disposed on the main board, the first shield cover covers the first chip and is thermally connected to the first chip, and the first shield cover is thermally connected to the first heat sink. .
The electronic device according to claim 10, wherein the motherboard component includes a second chip portion, the second chip portion includes a second shield cover and a second chip, the second chip and the second chip A shielding cover is disposed on a side of the main board facing away from the first chip portion, and the second shielding cover covers the second chip and is thermally connected to the second chip.
The electronic device according to claim 10, wherein the first chip portion includes a first thermally conductive layer, and the first thermally conductive layer is thermally connected to the first shield and the first chip.
The electronic device according to claim 11, wherein the second chip portion includes a second thermally conductive layer, and the second thermally conductive layer is thermally connected to the second shield and the second chip.
The electronic device according to claim 11, wherein the first part comprises a first cover that conducts heat, the first cover is connected to the first heat sink and forms a first mounting cavity together, and the main board The component is located in the first mounting cavity, and the second shield is thermally connected to the first cover.
The electronic device according to claim 11, wherein the first portion includes a third thermally conductive layer, and the third thermally conductive layer is thermally connected to the second shield cover and the first cover.
The electronic device according to claim 1, wherein the second part comprises a second cover that conducts heat, the second cover is connected to the second heat sink and forms a second mounting cavity together, and A battery component is located in the second mounting cavity, and the battery component is thermally connected to the second cover.
The electronic device according to claim 14 or 16, wherein when the electronic device is bent, the first cover and the second cover are close to each other, and the first cover and the second cover The distance between them is smaller than the distance between the first heat sink and the second heat sink.
The electronic device according to claim 16, wherein the second portion includes a fourth thermally conductive layer, and the fourth thermally conductive layer thermally connects the battery component and the second cover.
The electronic device according to claim 1, wherein the electronic device comprises a flexible screen assembly, and the flexible screen assembly is mounted on the flexible thermally conductive layer.
The electronic device according to claim 12 or 13, wherein the first thermally conductive layer is made of thermally conductive silicone, and the second thermally conductive layer is made of thermally conductive silicone.
The electronic device according to claim 15 or 18, wherein the third thermally conductive layer is made of a graphite material, and the fourth thermally conductive layer is made of a graphite material.