CN112351662A - Heat dissipation composite layer, preparation method thereof and display panel - Google Patents
Heat dissipation composite layer, preparation method thereof and display panel Download PDFInfo
- Publication number
- CN112351662A CN112351662A CN202011404951.7A CN202011404951A CN112351662A CN 112351662 A CN112351662 A CN 112351662A CN 202011404951 A CN202011404951 A CN 202011404951A CN 112351662 A CN112351662 A CN 112351662A
- Authority
- CN
- China
- Prior art keywords
- layer
- heat
- groove
- buffer layer
- composite layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
Abstract
The invention discloses a heat dissipation composite layer, a preparation method thereof and a display panel, wherein the heat dissipation composite layer comprises: a support layer; the buffer layer is arranged on the supporting layer, and a groove is arranged on the upper surface of the buffer layer, which is far away from the supporting layer; the heat conduction layer is arranged in the groove; compared with the prior art, the heat dissipation composite layer provided by the invention can improve the transverse conductivity of heat, and improve the temperature and the temperature uniformity of the display panel, so that the problem of screen residual image of the display panel is solved, and the display effect is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a heat dissipation composite layer, a preparation method thereof and a display panel with the heat dissipation composite layer.
Background
With the continuous development of the OLED technology, the performance requirements of the customers for the screen are also continuously improved, and the problem of the screen residual image is more and more emphasized by the customers.
The screen residual image is that the screen is lighted for a period of time under a picture (checkerboard picture) with black and white alternated, and then is switched into a white picture, the time required for observing the residual image disappearance of the previous picture in the white picture is shorter, the display performance of the screen is better, experiments show that the time for the residual image disappearance is mainly related to the temperature uniformity and the temperature of the whole screen, the higher the temperature is, the smaller the temperature difference of the whole screen is, the shorter the time for the residual image disappearance is, but in the existing OLED display panel, the luminous power of the luminous layers corresponding to different colors is different, so that the heat generated by the luminous layers is different, therefore, a certain temperature difference exists in different areas, and each film layer in the panel main body is poorer, so that the soaking capacity of the panel main body is limited, the whole temperature difference is obvious, and the residual image disappearance is not facilitated.
At present, usually, a back plate and a heat dissipation composite layer are attached to the back surface of a panel main body, wherein, please refer to fig. 1A and 1B, the heat dissipation composite layer includes a laminated metal layer 1, a graphite layer 2 and foam 3, and a glue layer 4 is coated on the foam 3, and is attached to a back plate 5 through the glue layer 4, and then is attached to the panel main body 6 at one side of the back plate 5, which is opposite to the heat dissipation composite layer, but the back plate 5 and the foam 3 are poor heat conductors, so that the heat of the panel main body 6 is difficult to be transversely transferred, and further the temperature difference of different regions of the panel main body 6 is increased, and the effect of balancing the temperatures of different regions of the display.
Disclosure of Invention
The embodiment of the invention provides a heat dissipation composite layer, a preparation method thereof and a display panel, and can solve the technical problems that in the prior art, due to the poor soaking property of the heat dissipation composite layer, the transverse transfer of heat is difficult to realize, the temperature difference of different areas of a panel main body is large, and the screen afterimage time is long.
To solve the above technical problem, an embodiment of the present invention provides a heat dissipation composite layer, which includes:
a support layer;
the buffer layer is arranged on the supporting layer, and a groove is arranged on the upper surface of the buffer layer, which is far away from the supporting layer; and
and the heat conduction layer is arranged in the groove.
In one embodiment of the invention, the upper surface of the heat conducting layer is flush with the upper surface of the buffer layer away from the support layer.
In an embodiment of the invention, a side of the buffer layer facing away from the support layer is formed with a plurality of sidewalls, and the plurality of sidewalls include first sidewalls continuously arranged along an edge of an upper surface of the buffer layer, and a middle region surrounded by the first sidewalls forms the groove.
In an embodiment of the invention, the plurality of sidewalls further includes a second sidewall continuously or discontinuously distributed in the middle region, and the first sidewall and the second sidewall together define the patterned groove.
In one embodiment of the present invention, the depth of the groove is greater than or equal to 30 microns and less than or equal to 40 microns.
In one embodiment of the invention, the cushioning layer is made of foam and has a thickness greater than 150 microns.
According to the above object of the present invention, there is provided a method for preparing a heat dissipation composite layer, the method comprising the steps of:
providing a support layer;
preparing a buffer layer with grooves on the supporting layer, wherein the grooves are positioned on one side of the buffer layer away from the supporting layer;
and preparing a heat conduction layer in the groove.
In an embodiment of the present invention, the preparing the buffer layer having the grooves on the support layer includes:
manufacturing a die with a slot body, wherein the slot body is at least continuously distributed on the periphery of one side of the die;
coating a buffer layer material on one side of the die, which is provided with the groove body, and filling the groove body with the buffer layer material and covering one side of the die, which is provided with the groove body, so as to form the buffer layer;
disposing the buffer layer on the support layer.
According to the above object of the present invention, a display panel is provided, where the display panel includes the heat dissipation composite layer, a back plate disposed on the heat dissipation composite layer, and a panel main body disposed on the back plate, and one side of the heat dissipation composite layer, where the heat conduction layer is disposed, is attached to the back plate.
In an embodiment of the invention, the display panel includes a bending region and a non-bending region adjacent to the bending region, and the groove is correspondingly disposed in the non-bending region.
The invention has the beneficial effects that: compared with the prior art, the heat-conducting layer in the heat-radiating composite layer is arranged in the groove of the buffer layer, so that the transverse transfer of heat in the heat-radiating composite layer is improved, the heat-conducting layer is arranged in the groove and surrounded by the buffer layer, so that the heat loss can be reduced, when the groove is formed in the heat-radiating composite layer and one side of the heat-conducting layer is attached to the back surface of the panel main body, the transverse transfer of heat in the panel main body can be increased, the heat loss is reduced, the temperature of the panel main body and the temperature uniformity of different regions are improved, the screen residual image time of the display panel is reduced, and the display effect is improved.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
Fig. 1A is a schematic structural view of a conventional heat dissipation composite layer;
FIG. 1B is a schematic diagram of a heat transfer structure of a conventional display panel;
fig. 2A is a schematic structural diagram of a heat dissipation composite layer according to an embodiment of the present invention;
fig. 2B is a schematic diagram of a heat transfer structure of a display panel according to an embodiment of the invention;
fig. 3A is a schematic plan view of a groove according to an embodiment of the present invention;
FIG. 3B is a schematic diagram of another exemplary groove structure according to the present invention;
fig. 4 is a flowchart of a method for manufacturing a heat dissipation composite layer according to an embodiment of the present invention;
fig. 5A is a schematic view of a process flow structure for preparing a buffer layer according to an embodiment of the present invention;
fig. 5B is a schematic view of a process flow structure for preparing a buffer layer according to an embodiment of the present invention;
fig. 5C is a schematic view of a process flow structure for preparing a buffer layer according to an embodiment of the present invention;
fig. 5D is a schematic view of a process flow structure of preparing a buffer layer according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
The embodiment of the invention aims at the technical problem that in the prior art, the transverse transfer of heat is difficult to realize due to poor soaking property of a heat dissipation composite layer, so that the temperature difference of different regions of a panel main body is large, and the screen residual image time is long.
Referring to fig. 1A and fig. 1B, the structural schematic diagrams of a conventional heat dissipation composite layer and a display panel are shown, wherein the display panel sequentially includes a heat dissipation composite layer, a back plate 5 and a panel main body 6 from bottom to top, the heat dissipation composite layer sequentially includes a metal layer 1, a graphite layer 2 and foam 3 from bottom to top, a glue layer 4 is disposed on the foam 3, the heat dissipation composite layer is attached to the back plate 5 through the glue layer 4 and is attached to the panel main body 6, and the back plate 5 and the foam 3 have poor thermal conductivity and poor transverse heat transfer capability, so that when temperatures of different regions of the panel main body 6 are different, the conventional heat dissipation composite layer cannot perform a function of transversely transferring heat, and thus it is difficult to make the temperatures of the panel main body 6 uniform.
Referring to fig. 1B, the panel main body 6 is configured to have regions 61 and 62 with different temperatures, the temperature of the region 61 is set to be higher than that of the region 62 (the arrow density in the figure indicates the heat density), when heat is transferred to the back plate 5 and the foam 3, the temperatures of the regions 61 and 62 are still different due to the poor lateral heat transfer performance of the back plate 5 and the foam 3, and the heat is greatly reduced and uneven when the heat is transferred to the graphite layer 2, so that the heat soaking effect of the graphite layer 2 in the prior art is very limited, and it is difficult to improve the temperature difference problem of the different regions of the panel main body 6.
Referring to fig. 2A and 2B, the display panel includes a heat dissipation composite layer, a back plate 50 disposed on the heat dissipation composite layer, and a panel main body 60 disposed on the back plate 50.
Wherein the heat-dissipating composite layer includes: a support layer 10; the buffer layer 20 is arranged on the support layer 10, and a groove 201 is arranged on the upper surface of the buffer layer 20 away from the support layer 10; and a heat conducting layer 30 disposed in the recess 201.
Further, with reference to fig. 2A and 2B, the heat dissipation composite layer provided in the embodiment of the present invention includes an adhesive layer 40 disposed on the buffer layer 20 and the heat conductive layer 30, and the back plate 50 is attached to the side of the heat dissipation composite layer where the heat conductive layer 30 is disposed through the adhesive layer 40.
Fig. 2B is a schematic diagram illustrating heat transfer in each film structure of the display panel according to an embodiment of the present invention, wherein the panel main body 60 is set to have different temperatures corresponding to a first area 601 and a second area 602, and the temperature of the first area 601 is greater than the temperature of the second area 602 (the arrow density indicates the heat density).
When heat is transferred downward from the panel main body 60, the heat transfer capability of the back plate 50 is poor in the transverse direction, so that after the heat passes through the back plate 50, the temperature of the first area 601 and the second area 602 is greatly different according to the old temperature, and then the heat reaches the heat conduction layer 30, because the transverse direction and the longitudinal direction of the heat conduction layer 30 are good, after the heat passes through the heat conduction layer 30, the heat corresponding to the first area 601 and the second area 602 is the same or slightly different, when the heat reaches the buffer layer 20, because the heat conduction layer 30 in the embodiment of the present invention is located in the groove 201 on the buffer layer 20, the heat passing through the buffer layer 20 can be reduced, the heat loss can be reduced, and the temperature of the first area 601 and the second area 602 of the panel main body 60 is the same and higher, effectively improving the problem of afterimage of the screen.
In the embodiment of the present invention, the material of the supporting layer 10 may be a metal material, and specifically may include copper, the buffer layer 20 may be foam, and the thickness of the buffer layer 20 is greater than 150 micrometers and greater than the thickness of the existing buffer layer.
A groove 201 is formed in one side of the buffer layer 20, which is far away from the support layer 10, and the groove 201 may be located in a middle region of the buffer layer 20 or a region with a large temperature difference, and a depth of the groove 201 is greater than or equal to 30 micrometers and less than or equal to 40 micrometers.
The heat conduction layer 30 is correspondingly arranged in the groove 201, the material of the heat conduction layer 30 comprises graphite or other materials with better heat conductivity, and the upper surface of the heat conduction layer 30 is flush with the upper surface of the buffer layer 20 far away from the support layer 10, so that one side of the buffer layer 20, which is back to the support layer 10, is provided with a flat surface, and in the subsequent attaching process, the smooth attaching can be realized, and the uniformity of heat transfer is further improved.
Referring to fig. 2A, 3A and 3B, a plurality of side walls 203 are formed on a side of the buffer layer 20 facing away from the support layer 10, and the side walls 203 include first side walls 2031 continuously arranged along an edge of an upper surface of the buffer layer 20, and a middle area surrounded by the first side walls 2031 forms the groove 201 to accommodate the heat conductive layer 30.
In an embodiment of the invention, referring to fig. 2A and fig. 3A, the plurality of sidewalls 203 only includes the first sidewall 2031 continuously disposed along an edge of the upper surface of the buffer layer 20 to form one groove 201 in the middle region.
In another embodiment of the present invention, referring to fig. 2A and fig. 3B, the plurality of sidewalls 203 include not only the first sidewalls 2031 continuously disposed along the edge of the upper surface of the cushioning layer 20, but also second sidewalls 2032 spaced apart from each other in the middle region, the first sidewalls 2031 and the second sidewalls 2032 together define the grooves 201 in a grid shape, and the grid shape may be rectangular, circular or diamond, and may be changed according to the arrangement and shape of the plurality of sidewalls 203, which is not limited herein.
In other embodiments of the present invention, the second side wall 2032 may also be formed as a plurality of circles distributed in the middle area, so that the groove 201 is formed to include a circular groove in the middle and a plurality of circles of annular grooves distributed at intervals.
It should be noted that the position, the occupied area and the number of the grooves 201 on the buffer layer 20 are not limited, the groove 201 may be a groove located in the middle region of the buffer layer 20, or one or more grooves patterned according to the distribution of the side walls 203, correspondingly, in different cases, the heat conducting layer 30 needs to be disposed in the one or more grooves to transfer heat to the middle region or different regions of the buffer layer 20, wherein when the groove 201 is a groove disposed in the middle region of the buffer layer 20, the heat transferring and heat equalizing effects are optimal.
In the embodiment of the present invention, when the display panel is a flexible display panel, the display panel includes a bending region and a non-bending region adjacent to the bending region, and the groove 201 is correspondingly disposed in the non-bending region, that is, the heat conduction layer 30 is not disposed in the bending region, and the buffer layer 20 is correspondingly disposed in each bending region, so as to improve the bending performance of the display panel.
In the embodiment of the present invention, the heat conductive layer 30 is disposed in the groove 201, rather than fixing the heat conductive layer 30 on the buffer layer 20 by punching, so that after the display panel is assembled, a hole-shaped mark on the surface of the panel main body 60 can be avoided, thereby improving the product quality.
In addition, an embodiment of the present invention further provides a method for manufacturing a heat dissipation composite layer in the above embodiment, with reference to fig. 2A, fig. 4, fig. 5A, fig. 5B, fig. 5C, and fig. 5D, the method includes the following steps:
s10, providing the support layer 10.
The support layer 10 is made of a metal material, and the metal material includes copper.
S20, preparing a buffer layer 20 having a groove 201 on the support layer 10, wherein the groove 201 is located on a side of the buffer layer 20 away from the support layer 10.
Specifically, the process of preparing the buffer layer 20 includes:
first, a mold 70 is manufactured, and a grooving process is performed on one side of the mold 70 to form a groove 701 on the mold 70.
In one embodiment of the present invention, the groove 701 is formed continuously at least around the mold 70, so that the area surrounded by the groove 701 in the middle of the mold 70 forms a protrusion 702.
The buffer layer material 202 is coated on one side of the die 70 where the groove body 701 is arranged, the buffer layer material 202 fills the groove body 701 and covers one side of the die 70 where the groove body 701 is arranged, and specifically covers the protrusion 702.
The buffer layer material 202 comprises a foaming resin material, the buffer layer material 202 is subjected to foaming treatment to form the buffer layer 20, wherein the groove 201 is formed at the position of the buffer layer 20 corresponding to the protrusion 702, and a flat surface is formed on the side of the buffer layer 20 opposite to the mold 70.
It should be noted that, in the embodiment of the present invention, the groove body 701 is disposed on the mold 70, the one or more protrusions 702 are defined on the mold 70 through the groove body 701, and when the buffer layer material 202 is subsequently coated, one or more grooves 201 are formed on the buffer layer 20 corresponding to the one or more protrusions 702 to accommodate the heat conduction layer 30.
And the position, size and shape of the protrusion 702 or the groove 201 are not limited by the embodiment of the present invention.
The buffer layer 20 prepared in the above step is disposed on the support layer 10.
S30, preparing the heat conduction layer 30 in the groove 201.
Graphite or other materials with good heat conductivity are adopted to form the heat conduction layer 30 in the groove 201, and the upper surface of the heat conduction layer 30 is flush with the upper surface of the buffer layer 20 far away from the support layer 10, so that one side of the buffer layer 20, which is back to the support layer 10, is provided with a flat surface, and the flat surface can be smoothly attached in the subsequent attaching process, and further the uniformity of heat transfer is improved.
And arranging an adhesive layer 40 on the buffer layer 20 and the heat conduction layer 30 so as to be convenient for being attached to other modules in a follow-up manner.
In the embodiment of the present invention, the back plate 50 is attached to the buffer layer 20 and the heat conductive layer 30 through the adhesive layer 40 (not shown in fig. 2B).
In summary, in the embodiment of the invention, the heat conduction layer 30 in the heat dissipation composite layer is disposed in the groove 201 of the buffer layer 20, so that the transverse transfer of heat in the heat dissipation composite layer is improved, and the heat conduction layer is disposed in the groove 201 and surrounded by the buffer layer 20, so that the heat loss can be reduced.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The heat dissipation composite layer, the preparation method thereof, and the display panel provided by the embodiment of the invention are described in detail above, a specific example is applied in the description to explain the principle and the embodiment of the invention, and the description of the embodiment is only used to help understanding the technical scheme and the core idea of the invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A heat-dissipating composite layer, comprising:
a support layer;
the buffer layer is arranged on the supporting layer, and a groove is arranged on the upper surface of the buffer layer, which is far away from the supporting layer; and
and the heat conduction layer is arranged in the groove.
2. A heat dissipating composite layer according to claim 1, wherein the upper surface of the thermally conductive layer is flush with the upper surface of the buffer layer remote from the support layer.
3. The heat dissipating composite layer as claimed in claim 1, wherein a side of the buffer layer facing away from the support layer is formed with a plurality of sidewalls, and the plurality of sidewalls includes a first sidewall continuously arranged along an edge of an upper surface of the buffer layer, and a middle region surrounded by the first sidewall forms the groove.
4. The heat dissipating composite layer of claim 3, wherein the plurality of sidewalls further comprises a second sidewall continuously or discontinuously disposed in the intermediate region, and the first sidewall and the second sidewall together define the patterned groove.
5. The heat dissipating composite layer of claim 1, wherein the depth of the groove is greater than or equal to 30 micrometers and less than or equal to 40 micrometers.
6. Composite heat-dissipating layer according to claim 1, wherein the buffer layer is made of foam and has a thickness greater than 150 μm.
7. A method for preparing a heat-dissipating composite layer, comprising the steps of:
providing a support layer;
preparing a buffer layer with grooves on the supporting layer, wherein the grooves are positioned on one side of the buffer layer away from the supporting layer;
and preparing a heat conduction layer in the groove.
8. The method of manufacturing a heat dissipating composite layer according to claim 7, wherein the step of preparing the buffer layer having the grooves on the support layer comprises the steps of:
manufacturing a die with a slot body, wherein the slot body is at least continuously distributed on the periphery of one side of the die;
coating a buffer layer material on one side of the die, which is provided with the groove body, and filling the groove body with the buffer layer material and covering one side of the die, which is provided with the groove body, so as to form the buffer layer;
disposing the buffer layer on the support layer.
9. A display panel, comprising the heat-dissipating composite layer according to any one of claims 1 to 6, a back plate disposed on the heat-dissipating composite layer, and a panel body disposed on the back plate, wherein the side of the heat-dissipating composite layer on which the heat-conductive layer is disposed is attached to the back plate.
10. The display panel according to claim 9, wherein the display panel comprises a bending region and a non-bending region adjacent to the bending region, and the groove is correspondingly disposed in the non-bending region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011404951.7A CN112351662B (en) | 2020-12-02 | 2020-12-02 | Heat dissipation composite layer, preparation method thereof and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011404951.7A CN112351662B (en) | 2020-12-02 | 2020-12-02 | Heat dissipation composite layer, preparation method thereof and display panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112351662A true CN112351662A (en) | 2021-02-09 |
| CN112351662B CN112351662B (en) | 2023-02-28 |
Family
ID=74428143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011404951.7A Active CN112351662B (en) | 2020-12-02 | 2020-12-02 | Heat dissipation composite layer, preparation method thereof and display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112351662B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113068380A (en) * | 2021-03-26 | 2021-07-02 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN113115569A (en) * | 2021-04-08 | 2021-07-13 | 昆山国显光电有限公司 | Display panel, display device and buffering heat radiation structure |
| CN113539096A (en) * | 2021-07-15 | 2021-10-22 | 武汉华星光电半导体显示技术有限公司 | Display module assembly and display device |
| CN113539111A (en) * | 2021-07-28 | 2021-10-22 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| EP4171187A4 (en) * | 2021-09-10 | 2024-02-28 | Honor Device Co Ltd | Electronic device |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101488434A (en) * | 2008-01-16 | 2009-07-22 | 西安东旺精细化学有限公司 | Graphite composite heat conducting sheet |
| JP2014156387A (en) * | 2013-12-25 | 2014-08-28 | Kaneka Corp | Method for producing graphite film and graphite composite film |
| CN104241223A (en) * | 2013-06-14 | 2014-12-24 | 莱尔德技术股份有限公司 | Methods for establishing thermal joints between heat spreaders or lids and heat sources |
| US20150257251A1 (en) * | 2014-03-05 | 2015-09-10 | Seiji Kagawa | Heat-dissipating sheet having high thermal conductivity and its production method |
| CN108447886A (en) * | 2018-01-19 | 2018-08-24 | 昆山国显光电有限公司 | Flexible display screen and preparation method thereof with the display of the flexible display screen |
| CN108582939A (en) * | 2018-03-29 | 2018-09-28 | 霸州市云谷电子科技有限公司 | A kind of attaching film and flexible display screen |
| KR20190037729A (en) * | 2017-09-29 | 2019-04-08 | 엘지디스플레이 주식회사 | Display apparatus |
| CN209552600U (en) * | 2018-12-16 | 2019-10-29 | 青岛太敬机器人有限公司 | A kind of single side reticulate pattern membrane type foam |
| CN209974681U (en) * | 2019-04-26 | 2020-01-21 | 苏州益邦电子材料有限公司 | Aluminum foil adhesive tape assembly |
| CN209989306U (en) * | 2019-04-26 | 2020-01-24 | 苏州佳值电子工业有限公司 | Heat dissipation shock attenuation integrated form sticky tape |
| CN211879244U (en) * | 2020-03-05 | 2020-11-06 | 苏州松控电子科技有限公司 | Heat dissipation and shock absorption integrated electrolytic capacitor |
-
2020
- 2020-12-02 CN CN202011404951.7A patent/CN112351662B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101488434A (en) * | 2008-01-16 | 2009-07-22 | 西安东旺精细化学有限公司 | Graphite composite heat conducting sheet |
| CN104241223A (en) * | 2013-06-14 | 2014-12-24 | 莱尔德技术股份有限公司 | Methods for establishing thermal joints between heat spreaders or lids and heat sources |
| JP2014156387A (en) * | 2013-12-25 | 2014-08-28 | Kaneka Corp | Method for producing graphite film and graphite composite film |
| US20150257251A1 (en) * | 2014-03-05 | 2015-09-10 | Seiji Kagawa | Heat-dissipating sheet having high thermal conductivity and its production method |
| KR20190037729A (en) * | 2017-09-29 | 2019-04-08 | 엘지디스플레이 주식회사 | Display apparatus |
| CN108447886A (en) * | 2018-01-19 | 2018-08-24 | 昆山国显光电有限公司 | Flexible display screen and preparation method thereof with the display of the flexible display screen |
| CN108582939A (en) * | 2018-03-29 | 2018-09-28 | 霸州市云谷电子科技有限公司 | A kind of attaching film and flexible display screen |
| CN209552600U (en) * | 2018-12-16 | 2019-10-29 | 青岛太敬机器人有限公司 | A kind of single side reticulate pattern membrane type foam |
| CN209974681U (en) * | 2019-04-26 | 2020-01-21 | 苏州益邦电子材料有限公司 | Aluminum foil adhesive tape assembly |
| CN209989306U (en) * | 2019-04-26 | 2020-01-24 | 苏州佳值电子工业有限公司 | Heat dissipation shock attenuation integrated form sticky tape |
| CN211879244U (en) * | 2020-03-05 | 2020-11-06 | 苏州松控电子科技有限公司 | Heat dissipation and shock absorption integrated electrolytic capacitor |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113068380A (en) * | 2021-03-26 | 2021-07-02 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN113068380B (en) * | 2021-03-26 | 2022-08-05 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| US11864363B2 (en) | 2021-03-26 | 2024-01-02 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display panel and display device |
| CN113115569A (en) * | 2021-04-08 | 2021-07-13 | 昆山国显光电有限公司 | Display panel, display device and buffering heat radiation structure |
| CN113539096A (en) * | 2021-07-15 | 2021-10-22 | 武汉华星光电半导体显示技术有限公司 | Display module assembly and display device |
| CN113539111A (en) * | 2021-07-28 | 2021-10-22 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| EP4171187A4 (en) * | 2021-09-10 | 2024-02-28 | Honor Device Co Ltd | Electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112351662B (en) | 2023-02-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112351662B (en) | Heat dissipation composite layer, preparation method thereof and display panel | |
| CN109148721B (en) | Display substrate, preparation method thereof and display device | |
| CN113725514B (en) | Flexible display device | |
| US5990618A (en) | Plasma display panel and heat sink | |
| US20100097783A1 (en) | Light emitting device, display device and solid-state light emitting element substrate | |
| JP6813616B2 (en) | Wiring board module and its heat dissipation board structure | |
| JP2014514771A (en) | Composite materials and electronic devices | |
| CN105899041A (en) | Electronic device enclosures and heatsink structures with thermal management features | |
| KR100406815B1 (en) | Plasma display device | |
| WO2022100128A1 (en) | Heat dissipation assembly, electronic device, and chip package structure | |
| CN111033724B (en) | Circuit block assembly | |
| CN114265243A (en) | Backlight module and display device | |
| CN113129761A (en) | Display module and display device | |
| CN114660851A (en) | Backlight module and display device | |
| CN217933975U (en) | Liquid cooling plate and battery module | |
| US11294229B2 (en) | Backlight module and display device | |
| JP2012146828A (en) | Heat radiation structure and heat radiation member | |
| CN210714830U (en) | Engine radiator multirow water tank aluminium core | |
| JP6080929B2 (en) | Semiconductor module | |
| JPH08162680A (en) | Thermo-electric converter | |
| CN220099533U (en) | Bisphenol A modified phenolic paper-based copper-clad plate capable of radiating heat | |
| CN111565545B (en) | Heat dissipation assembly, terminal device and manufacturing method of terminal device | |
| US11837706B2 (en) | Adhesive bond setting with pre-cured adhesive standoffs | |
| CN214046500U (en) | Heat dissipation assembly, heat dissipation device and electronic equipment | |
| CN215577411U (en) | Display module and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |