CN113129761A

CN113129761A - Display module and display device

Info

Publication number: CN113129761A
Application number: CN202110553973.8A
Authority: CN
Inventors: 刘伟; 杨皓天; 魏向东; 罗淼; 王康; 郝晓东; 朴劲宇; 沈家铭
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2021-05-20
Filing date: 2021-05-20
Publication date: 2021-07-16

Abstract

The invention relates to the technical field of display equipment, in particular to a display module and a display device comprising the display module. The display module comprises a flexible panel, a driving chip and a bending gasket, wherein the flexible panel comprises a body section, a bending section and a connecting section which are sequentially connected, and the body section and the connecting section are arranged side by side; the driving chip is arranged on one side of the body section, which is far away from the connecting section; the bent gasket comprises a first heat-conducting adhesive, a metal layer and a second heat-conducting adhesive which are sequentially arranged, the metal layer is connected with the body section through the first heat-conducting adhesive, and the metal layer is connected with the connecting section through the second heat-conducting adhesive. The base material of the bent gasket is adjusted to be the metal base material, and the heat conducting glue is matched, so that the fixation of the bent gasket after the bent flexible panel is bent is not influenced, the metal with high heat conductivity coefficient is used for conducting heat generated by the driving chip to the heat dissipation film through the change of the base material, and the heat dissipation effect of the driving chip in the display module is improved.

Description

Display module and display device

Technical Field

The invention relates to the technical field of display equipment, in particular to a display module and a display device comprising the display module.

Background

The requirements of the current mobile phone on the screen are gradually improved, and the requirements on the D-IC are correspondingly improved while the screen is improved; therefore, a series of new problems of power consumption, heat dissipation and the like are brought, and how to effectively and rapidly dissipate heat of the D-IC is related to the performance and the service life of the D-IC. At present, the OLED module D-IC is generally arranged on Panel, and is bent to the back of the module along with the Panel and then is fixed on the SCF heat dissipation film by utilizing a bent gasket, wherein the Panel and the bent gasket are separated between the D-IC and the SCF heat dissipation film, the bent gasket is a mode of gluing PET or other plastic base materials, and the bent gasket is not easy to conduct heat.

Disclosure of Invention

In view of this, embodiments of the present invention provide a display module and a display device including the same, so as to solve the technical problem in the prior art that a D-IC in the display module has a poor heat dissipation effect.

In order to achieve the above object, according to an aspect of an embodiment of the present invention, a display module is provided.

According to a first aspect of the embodiments of the present invention, a display module includes:

the flexible panel comprises a body section, a bending section and a connecting section which are sequentially connected, wherein the body section and the connecting section are arranged side by side;

the driving chip is arranged on one side of the body section, which is far away from the connecting section;

the bent gasket comprises a first heat-conducting adhesive, a metal layer and a second heat-conducting adhesive which are sequentially arranged, wherein the metal layer is connected with the body section through the first heat-conducting adhesive, and the metal layer is connected with the connecting section through the second heat-conducting adhesive.

In the display module provided by the embodiment of the invention, the metal layer is made of copper, gold, silver or an alloy of the copper, the gold and the silver.

In the display module provided by the embodiment of the invention, the thickness of the metal layer is 0.05mm-0.075 mm.

In the display module provided by the embodiment of the invention, the surface of the metal layer is provided with the nano coating, and the nano coating is made of a nano carbon material.

In the display module provided by the embodiment of the invention, the display module further comprises a heat dissipation film, and the heat dissipation film is arranged between the connecting section and the second heat-conducting glue.

In the display module provided by the embodiment of the invention, the orthographic projection of the metal layer on the plane where the driving chip is located completely covers the driving chip.

In order to achieve the above object, according to a second aspect of the embodiments of the invention, a display module is provided.

According to the display module in the second aspect of the embodiment of the invention, the display module comprises a protective layer, a driving chip and a flexible panel which are sequentially stacked, wherein the protective layer comprises first conductive cloth, a graphene layer, second conductive cloth and an insulating tape which are sequentially arranged, and the insulating tape is connected with the driving chip.

In the display module provided in the embodiment of the present invention, the graphene layer is completely wrapped between the first conductive cloth and the second conductive cloth.

In the display module provided by the embodiment of the invention, the orthographic projection of the graphene layer on the plane where the driving chip is located completely covers the driving chip.

In the display module provided by the embodiment of the invention, the display module further includes a heat dissipation film and a curved gasket, the flexible panel includes a body section, a bending section and a connecting section which are connected in sequence, the body section and the connecting section are arranged side by side, the driving chip is arranged on one side of the body section, which is far away from the connecting section, the heat dissipation film is arranged on one side of the connecting section, which is far towards the body section, the curved gasket includes a first heat conduction adhesive, a metal layer and a second heat conduction adhesive which are arranged in sequence, the metal layer is connected with the body section through the first heat conduction adhesive, and the metal layer is connected with the heat dissipation film through the second heat conduction adhesive.

In order to achieve the above object, according to a third aspect of the embodiments of the present invention, there is also provided a display device including the display module according to the first aspect or the second aspect of the embodiments of the present invention.

In the display module and the display device provided by the embodiment of the invention, the material of the bent gasket is changed, the base material of the bent gasket is adjusted to be the metal base material, and the heat-conducting glue is matched, so that the fixation of the bent gasket on the flexible panel after bending is not influenced, and the heat generated by the driving chip is conducted to the heat-radiating film by changing the base material and using the metal with high heat-conducting coefficient; in addition, graphene with higher heat conductivity coefficient is added to the protective layer on the upper side of the D-IC on the basis of the common basic composition of the conductive cloth and the insulating glue, and the heat generated by the driving chip is conducted out and dissipated by the aid of the large-area graphene, so that the heat dissipation effect of the driving chip in the display module is improved.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, serve to provide a further understanding of the application and to enable other features, objects, and advantages of the application to be more apparent. The drawings and their description illustrate the embodiments of the invention and do not limit it. In the drawings:

fig. 1 is a stacked structure diagram of a display module according to an embodiment of the present invention;

FIG. 2 is a schematic view of a curved spacer of a display module according to the related art;

FIG. 3 is a diagram illustrating a structure of a passivation layer of a display module according to the related art;

FIG. 4 is a diagram illustrating a stacked structure of a bending pad of a display module according to an embodiment of the present invention;

FIG. 5 is a diagram of a stack structure of a passivation layer of a display module according to an embodiment of the present invention; and

fig. 6 is a stacked structure diagram of a display module according to an embodiment of the invention.

In the figure:

1. a protective layer; 101. a conductive cloth; 102. a conductive adhesive; 103. an insulating tape; 104. insulating glue; 105. first conductive cloth, 106, second conductive cloth; 107. a graphene layer; 108. a first conductive paste; 109. a second conductive paste; 110. a third conductive adhesive; 2. a driving chip; 3. a flexible panel; 301. a body section; 302. bending the section; 303. a connecting section; 4. bending the gasket; 401. a plastic substrate layer; 402. a bonding layer; 403. a first thermally conductive adhesive; 404. a metal layer; 405. a second thermally conductive adhesive; 406. a nano-coating; 5. and a heat dissipation film.

Detailed Description

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It is noted that the terms "comprises" and "comprising," and any variations thereof, in the description and claims of this application and the above-described drawings are intended to cover non-exclusive inclusions, such that a system, product or apparatus that comprises a list of elements is not necessarily limited to those elements explicitly listed, but may include other elements not expressly listed or inherent to such product or apparatus.

In this application, the terms "upper", "lower", "inner", "middle", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "disposed," "connected," and "secured" are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

As shown in fig. 1, a common lamination method for a display module in the related art is shown. As shown in the figure, the display module includes protective layer 1, driver chip 2 and flexible panel 3 that set up in proper order stromatolite, and wherein flexible panel 3 is buckled to its back, and flexible panel 3 is buckling the back, and flexible panel 3 forms body section 301, bending segment 302 and linkage segment 303 that connect gradually, and body section 301 and linkage segment 303 set up side by side, in addition still need to be in additionUsing a bent shim 4 (bend)_gspacer) connects the body section 301 and the bending section 302 of the bent flexible panel 3 together. Specifically, the heat dissipating membrane 5(SCF) is directly connected to the connecting section 303, and the heat dissipating membrane 5 is located between the bent section 302 and the connecting section 303, and the bent shim 4 connects the body section 301 and the heat dissipating membrane 5 together. The laminated structure of the display module can prevent the driving chip 2 from being damaged in the strength tests such as falling/rolling/extrusion of the whole machine by using the buffering effect of the bent gasket 4.

As shown in fig. 2, the structure of the curved gasket 4 in the stacked structure of fig. 1 is shown, the curved gasket 4 includes a plastic substrate layer 401 and bonding layers 402 located on two sides of the plastic substrate layer 401, wherein the plastic substrate layer 401 is generally made of PET, the bonding layers can be made of AD glue, and the AD glue is a relatively common heat-conducting glue and is generally formed by curing acrylic glue. As shown in fig. 1, the D-IC (driving chip 2) in the display module is generally mounted on the flexible panel 3, and is bent to the back of the display module along with the flexible panel 3 and then fixed on the heat dissipation film 5 by using the bending pad 4, at this time, the panel body of the flexible panel 3 and the bending pad 4 are separated between the driving chip 2 and the heat dissipation film 5, and the bending pad 4 in fig. 2 is formed by adding glue to plastic substrates such as PET, so that the bending pad 4 is not easy to conduct heat, and the heat dissipation effect of the driving chip 2 is seriously affected.

As shown in fig. 3, a structure of a protective layer 1 in the laminated structure of fig. 1 is given, and the protective layer 1 includes a conductive cloth 101, a conductive paste 102, an insulating tape 103, and an insulating paste 104, which are sequentially laminated. As shown in fig. 1, in the current display module, a protection layer 1 directly covers a D-IC (driving chip 2), and the structure and material of the protection layer 1 also cause poor heat dissipation effect of the driving chip 2.

Example 1

As shown in fig. 1 and 4, an embodiment of the present invention provides a display module, which includes a flexible panel 3, a driving chip 2, and a bending pad 4, wherein the flexible panel 3 includes a body segment 301, a bending segment 302, and a connecting segment 303 connected in sequence, and the body segment 301 and the connecting segment 303 are arranged side by side; the driver chip 2 is arranged on the side of the body segment 301 facing away from the connecting segment 303; the curved gasket 4 comprises a first heat-conducting adhesive 403, a metal layer 404 and a second heat-conducting adhesive 405 which are sequentially arranged, wherein the metal layer 404 is connected with the body section 301 through the first heat-conducting adhesive 403, the metal layer 404 is connected with the heat dissipation film 5 through the second heat-conducting adhesive 405, and the heat dissipation film 5 is arranged between the connecting section 303 and the second heat-conducting adhesive 405. The display module provided by the embodiment of the invention changes the material of the bent gasket 4, adjusts the substrate of the bent gasket 4 into the metal substrate, and matches the first heat-conducting glue 403 and the second heat-conducting glue 405, so that the fixation of the bent gasket 4 to the flexible panel 3 after bending is not influenced, and the heat generated by the driving chip 2 is conducted to the heat dissipation film 5 by changing the substrate and using the metal with high heat conductivity coefficient.

In the above embodiments, the material of the metal layer 404 may be one or a combination of any of high thermal conductive materials such as silver, copper, aluminum, steel, gold, and alloys thereof. The metal layer 404 is disposed between the first heat-conducting adhesive 403 and the second heat-conducting adhesive 405, so that heat dissipation can be better performed by using high heat-conducting performance and a large area of the metal layer, heat generated by the driving chip 2 is rapidly conducted to the outside through the metal layer 404, and the thickness of the structure is not increased. The material of the metal layer 404 is preferably gold, silver, copper, or an alloy thereof in view of thermal conductivity, but the material of the metal layer 404 is most preferably copper, brass, or red copper in view of cost.

The improved bending pad 4 in the above embodiment not only plays a role of fixing the main body of the flexible panel 3, but also has a role of heat conduction, and compared with a plastic material, the advantage of heat conduction of the metal layer 404 is more obvious, and by using it as a medium between the heat conduction film and the driving chip 2, the heat of the driving chip 2 can be more effectively conducted to the heat-conducting film, but at the same time, in order to achieve the same effect as using a plastic substrate without causing the problem of film printing, in the embodiment of the present invention, the selection of the substrate thickness of the metal layer 404 is compared, and it is found that the effect after the bonding is affected by the too thin metal layer 404, and metal level 404 is too thick can be unfavorable for crooked gasket 4 to cut, and the edge can appear cutting badly, causes the membrane seal, and through the material object with the trial production verification, the thickness of the metal level 404 of selecting at last is 0.05mm-0.075mm, and this thickness range is applicable to the metal level 404 of copper material more.

In order to further improve the heat dissipation effect of the curved pad 4, a nano-coating 406 is formed on the surface of the metal layer 404, and the nano-coating 406 is made of a nano-carbon material. The nano carbon material is a carbon material with at least one dimension smaller than 100nm of the size of a disperse phase, and the disperse phase can be composed of carbon atoms, can also be composed of heterogeneous atoms (non-carbon atoms) and even can be nano holes. Nanocarbon materials include, but are not limited to, carbon nanotubes, carbon nanofibers, and nanocarbon spheres. For metals, the longitudinal heat transfer capacity is strong, but the lateral heat radiation capacity is poor, whereas for most carbon materials, the lateral heat radiation capacity is strong. In this application with carbon nanometer coating at the surface formation nanometer coating 406 of metal level 404, its thickness can be set for as required, usually in the micron level can, the formation mode of coating includes but not limited to coating and UV solidification, obtains to have the metal level 404 of nanometer coating 406 and can promote coefficient of heat conductivity to make full use of carbon atom's heat radiation advantage, it becomes more smooth and easy to let whole heat conduction process, and the heat conduction effect is better. Specifically, the nano-carbon material needs to be uniformly coated on the surface of the metal layer 404, and the nano-carbon material can convert heat energy into infrared radio frequency by utilizing the high thermal conductivity among carbon atoms and the high thermal radiation efficiency of the carbon atoms, and the nano-coating 406 has a large area, light weight, good thermal conductivity, thermal convection and thermal radiation, and the overall heat dissipation effect is greatly improved compared with the metal layer 404 substrate.

In order to obtain a larger heat dissipation area, under the condition that the space structure and design requirements of the display module allow, the orthographic projection of the metal layer 404 on the plane where the driving chip 2 is located completely covers the driving chip 2, so that heat at any position of the driving chip 2 can be directly conducted to the metal layer 404, and is transferred to the heat dissipation film 5 through the relatively larger area of the metal layer 404, so that the heat is dissipated outwards.

It should be noted that, in the curved gasket 4, the first thermal conductive adhesive 403 and the second thermal conductive adhesive 405 may be selected from various thermal conductive adhesive products in the prior art, and the raw materials of the first thermal conductive adhesive include, but are not limited to, colloidal materials such as silica gel, acrylic adhesive, polystyrene adhesive, and polyester, and those skilled in the art may specifically select the first thermal conductive adhesive 403 and the second thermal conductive adhesive 405 according to the thermal conductive and bonding requirements.

Example 2

As shown in fig. 1 and 5, an embodiment of the present invention provides a display module, which includes a protection layer 1, a driving chip 2, and a flexible panel 3, which are sequentially stacked, where the protection layer 1 includes a first conductive cloth 105, a graphene layer 107, a second conductive cloth 106, a third conductive adhesive 110, and an insulating tape 103, which are sequentially disposed, an insulating adhesive 104 may be further disposed on a surface of the insulating tape 103, and the insulating tape 103 is connected to the driving chip 2. In the display module assembly of this embodiment, also increased the higher graphite alkene of coefficient of heat conductivity in the basic constitution of usual electrically conductive cloth with insulating cement to protective layer 1 of drive chip 2 upside, utilize the graphite alkene of large tracts of land to derive the heat that drive chip 2 produced and distribute to drive chip 2's radiating effect in the display module assembly has been improved. For the protection layer 1, due to the limitation of the use scene and action, hard metal materials such as copper and the like cannot be utilized, materials as soft as those of the conductive cloth need to be used, since the graphene is in a powder state, the graphene can be adapted to the conductive cloth, and the thermal conductivity coefficient of the graphene is better than that of metal, so that the graphene is very suitable for the use condition of the protection layer 1.

On the basis of the above embodiment, the graphene layer 107 is completely wrapped between the first conductive cloth 105 and the second conductive cloth, and the structural design can facilitate the formation of graphene and prevent the leakage of graphene in a powder state, which may cause a short circuit of the display module. More preferably, in the display module provided in the embodiment of the present invention, the protective layer 1 further includes a first conductive adhesive 108 and a second conductive adhesive 109, the graphene layer 107 is connected to the first conductive cloth 105 through the first conductive adhesive 108, the graphene layer 107 is connected to the second conductive cloth 106 through the second conductive adhesive 109, and the graphene layer 107 is wrapped by the first conductive adhesive 108 and the second conductive adhesive 109, so that on one hand, graphene in a powder state can be further gathered and molded, leakage can be prevented, and a good electrical conduction effect can be achieved. The types and materials of the first conductive paste 108 and the second conductive paste 109 may be selected from various types of conductive pastes 102 in the prior art, for example, the first conductive paste 108 and the second conductive paste 109 may be a mixture of resin paste and conductive material, and the thickness of the mixture may be several micrometers to several tens micrometers, so that the first conductive paste 108 and the second conductive paste 109 have good adhesion and conductive functions, and the whole structure of the protective layer 1 may be thinner.

In order to obtain a large heat dissipation area, under the condition that the space structure and design requirements of the display module allow, the orthographic projection of the graphene layer 107 on the plane where the driving chip 2 is located completely covers the driving chip 2, so that heat at any position of the driving chip 2 can be directly conducted to the graphene layer 107, and the graphene layer 107 has a relatively large area, and the heat is dissipated outwards by utilizing the large-area contact between the protective layer 1 and air.

Example 3

As shown in fig. 6, the embodiment of the present invention includes both the structure of the curved pad 4 modified in embodiment 1 and the structure of the protection layer 1 modified in embodiment 2. The display module assembly includes protective layer 1, driver chip 2 and the flexible panel 3 that the stromatolite set up in proper order, protective layer 1 can also set up insulating cement 104 on insulating cement 103's surface including the first electrically conductive cloth 105, graphite alkene layer 107, the electrically conductive cloth 106 of second, third conducting resin 110 and the insulating cement area 103 that set gradually, insulating cement area 103 with driver chip 2 is connected. The display module assembly still includes heat dissipation membrane 5 and crooked gasket 4, flexible panel 3 is including this section 301, bending segment 302 and the linkage segment 303 that connect gradually, this section 301 with the linkage segment 303 sets up side by side, driver chip 2 sets up this section 301 deviates from one side of linkage segment 303, heat dissipation membrane 5 sets up linkage segment 303 orientation one side of this section 301, crooked gasket 4 is including the first heat-conducting glue 403, metal level 404 and the second heat-conducting glue 405 that set gradually, metal level 404 passes through first heat-conducting glue 403 with this section 301 is connected, metal level 404 passes through the second heat-conducting glue 405 with heat dissipation membrane 5 connects. Therefore, on one hand, the display module changes the material of the bent gasket 4, adjusts the base material of the bent gasket 4 into a metal base material, and matches the first heat-conducting glue 403 and the second heat-conducting glue 405, so that the bent gasket 4 is not influenced to be fixed after being bent on the flexible panel 3, and the metal with high heat conductivity coefficient is used for guiding the heat generated by the driving chip 2 to the heat dissipation film 5 through the change of the base material; on the other hand, the protective layer 1 on the upper side of the driving chip 2 in the display module is also added with graphene with higher heat conductivity coefficient on the basis of the common basic composition of the conductive cloth 101 and the insulating glue 104, and the heat generated by the driving chip 2 is led out and dissipated by utilizing the large-area graphene, so that the heat dissipation effect of the driving chip 2 in the display module is improved. That is, in the display module provided in the embodiment of the present invention, the heat generated by the driving chip 2 may be transferred downward and guided to the copper surface of the heat dissipation film 5 by the curved pad 4, and then the heat dissipation film 5 is used to dissipate the heat; the heat generated by the driving chip 2 can also be transferred upwards, and the heat generated by the driving chip 2 is conducted away by the large-area graphene wrapped in the protective layer 1. Each technical solution described in embodiment 1 is applicable to embodiment 3 of the present invention, and will not be described in detail in embodiment 3 again

The above is an exemplary description and illustration of the display module according to the embodiments of the present invention, and other configurations of the display module and other operations of the manufacturing method thereof will be known to those skilled in the art, and will not be described in detail herein, and those skilled in the art can understand and apply the description of the prior art. The embodiment of the application further provides a display device which comprises the display module provided by the embodiment of the application. The display device may be: any product or component with a display function, such as a liquid crystal panel, electronic paper, an Organic Light Emitting Diode (OLED) panel, an Active Matrix Organic Light Emitting Diode (AMOLED) panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, or a navigator. The display device disclosed in the embodiment of the present application includes the display module provided in the above embodiment, and therefore the display device having the display module also has all the above technical effects, which are not described in detail herein. Other configurations, principles and manufacturing methods of the display module and the display device will be known to those skilled in the art and will not be described in detail herein.

Some embodiments in this specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display module, comprising:

2. The display module according to claim 1, wherein the metal layer is made of copper, gold, silver or an alloy thereof.

3. The display module according to claim 1, wherein the metal layer has a thickness of 0.05mm to 0.075 mm.

4. The display module according to claim 1, wherein a nano-coating layer is formed on the surface of the metal layer, and the nano-coating layer is made of a nano-carbon material.

5. The display module according to claim 1, further comprising a heat dissipation film disposed between the connection section and the second thermal conductive paste.

6. The display module of claim 1, wherein an orthographic projection of the metal layer on a plane of the driving chip completely covers the driving chip.

7. The utility model provides a display module assembly, its characterized in that, is including protective layer, driver chip and the flexible panel that the stromatolite set up in proper order, the protective layer is including the first electrically conductive cloth, graphite alkene layer, the electrically conductive cloth of second and the insulating sticky tape that sets gradually, the insulating sticky tape with driver chip connects.

8. The display module of claim 7, wherein the graphene layer is completely wrapped between the first conductive cloth and the second conductive cloth.

9. The display module assembly according to claim 7, wherein the protective layer further comprises a first conductive adhesive and a second conductive adhesive, the graphene layer is connected with the first conductive cloth through the first conductive adhesive, and the graphene layer is connected with the second conductive cloth through the second conductive adhesive.

10. The display module of claim 7, wherein an orthographic projection of the graphene layer on a plane where the driving chip is located completely covers the driving chip.

11. The display module according to any one of claims 7-10, wherein the display module further comprises a heat dissipation film and a bending pad, the flexible panel comprises a body section, a bending section and a connecting section, the body section and the connecting section are sequentially connected, the driving chip is disposed on a side of the body section away from the connecting section, the heat dissipation film is disposed on a side of the connecting section facing the body section, the bending pad comprises a first thermal conductive adhesive, a metal layer and a second thermal conductive adhesive, the first thermal conductive adhesive, the metal layer and the second thermal conductive adhesive are sequentially connected, the metal layer is connected to the body section through the first thermal conductive adhesive, and the second thermal conductive adhesive is connected to the heat dissipation film through the metal layer.

12. A display device comprising a display module according to any one of claims 1 to 11.