TW202318581A - Chip-on-film structure and electronic device - Google Patents

Abstract

The present disclosure provides a chip-on-film structure including: a flexible circuit board, a driver chip, and a heat dissipating patch. The flexible circuit board includes a substrate and a circuit wiring arranged on the substrate. The driver chip is arranged on the flexible circuit board, electrically connected with the circuit wiring, and used for sending or receiving electrical signals through the circuit wiring. The heat dissipating patch is glued to the drive chip on a side away from the flexible circuit board. The dissipating patch covers the drive chip at least partially, and extends to the flexible circuit board along the drive chip. The present disclosure also provides an electronic device.

Description

Thin Film Chip-on-Chip Packaging Structure and Electronic Devices

The present application relates to the field of chips, in particular to a film-on-chip packaging structure and an electronic device.

The known Chip on Film (COF) packaging structure (Chip on Film, COF) is widely used in electronic equipment, by setting driver chips (such as gate driver chips, source driver chips) on flexible circuit boards, and Connecting the display panel and the main board at the same time can save the area on the display panel for setting the driver chip, thereby increasing the screen-to-body ratio of the display panel and reducing the size of the electronic device. Since the heat generated by the driver chip during operation will affect the service life, how to dissipate heat from the driver chip arranged on the flexible circuit board has become an urgent problem to be solved. The known heat dissipation methods are mainly divided into two types. One is to install a heat dissipation layer on the side of the flexible circuit board away from the driver chip. However, this method has a poor heat dissipation effect because there is a flexible circuit board between the heat dissipation layer and the driver chip. . The other is to completely wrap the driver chip with a heat dissipation material, which is equivalent to increasing the surface area of the chip in contact with the outside world to dissipate heat. This method needs to ensure that the heat dissipation of each part of the chip is as uniform as possible. When air is contained between the heat dissipation material and the driver chip, due to the poor thermal conductivity of the air itself, the local temperature of the chip will be high and the heat dissipation will be poor. Therefore, when installing the heat dissipation material, it is necessary to ensure that there is no air between the driver chip and the heat dissipation material, which is difficult to implement. And because the driver chip is a raised structure on the surface of the flexible circuit board, if the heat dissipation material is only set to completely wrap the driver chip, the heat dissipation material may fall off when the film-on-chip packaging structure needs to be bent according to the situation.

In one aspect, the present application provides a chip-on-film package structure, which includes: A flexible circuit board, which includes a substrate and circuit traces arranged on the substrate; a driver chip, located on the flexible circuit board, the driver chip is electrically connected to the circuit traces, and is used to send or receive electrical signals through the circuit traces; A heat dissipation patch is bonded to a side of the driver chip away from the flexible circuit board, the heat dissipation patch at least partially covers the driver chip, and extends along the driver chip to the flexible circuit board.

In the film-on-chip packaging structure provided by the present application, by adhering a heat dissipation patch on the side of the driver chip away from the flexible circuit board, and extending the heat dissipation patch to the flexible circuit board, the The heat generated by the driving chip is conducted along the extending direction of the heat dissipation patch, so as to achieve a better heat dissipation effect.

In one embodiment, the heat dissipation patch completely covers the driver chip.

In one embodiment, the heat dissipation patch includes a first part covering the driver chip and a second part perpendicular to the first part and extending to the flexible circuit board, the width of the second part is less than or equal to The width of the first section.

In one embodiment, the width of the heat dissipation patch decreases as the distance from the driving chip increases.

In one embodiment, the width of the heat dissipation patch increases as it gets away from the driving chip, and the side of the heat dissipation patch away from the driving chip is parallel to the side covering the driving chip.

In the embodiments of the present application, by setting the shape and area of the heat dissipation patch, the material used for the heat dissipation patch can be reduced while improving the heat dissipation effect, thereby saving cost.

In one embodiment, the side of the flexible circuit board away from the driver chip is further provided with a heat dissipation layer, and the projection of the heat dissipation layer on the flexible circuit board covers the driver chip on the flexible circuit board. projection.

In one embodiment, the part of the flexible circuit board covered by the driver chip is provided with at least one heat dissipation through hole, and the heat dissipation through hole is filled with a heat dissipation material, and the heat dissipation material is compatible with the driver chip and the The thermal layer is in direct contact.

In the embodiment of the present application, the heat dissipation layer is provided at the same time as the heat dissipation patch, which is beneficial to better heat dissipation.

In one embodiment, the opposite sides of the flexible circuit board are respectively provided with an input part and an output part electrically connected to the circuit trace; the input part is electrically connected to an external printed circuit board for transmitting Electrical signals between the printed circuit board and the driving chip; the output part is electrically connected to an external display panel for transmitting electrical signals between the driving chip and the display panel.

In an embodiment, the heat dissipation patch extends from the driving chip toward the input portion and does not cover the input portion.

In the embodiment of the present application, by setting the heat dissipation patch to extend to the maximum extent along the direction of the input part, the heat generated by the driver chip can be conducted along the heat dissipation patch to the external printed circuit board connected to the input part. for better heat dissipation.

In one embodiment, a portion of the heat dissipation patch extending to the flexible circuit board is bonded to the flexible circuit board.

In the embodiment of the present application, by adhering the heat dissipation patch on the flexible circuit board, it is beneficial to fix the heat dissipation patch, and at the same time better conduct the heat generated by the driver chip.

In one embodiment, the driving chip is a gate driving chip or a source driving chip of the display panel, or an integrated chip of gate driving and source driving, or a touch control chip integrated on the display panel. control driver chip.

Another aspect of the present application provides an electronic device, which includes: The above-mentioned film-on-chip packaging structure; a printed circuit board, electrically connected to the chip-on-film package structure, and used to input electrical signals to the chip-on-film package structure; a display panel, electrically connected to the chip-on-film package structure, and used to receive electrical signals output by the chip-on-film package structure; The film-on-chip packaging structure is used to receive signals from the printed circuit board, so as to drive the display panel to display images.

The electronic device provided by the embodiment of the present application can better dissipate heat while increasing the screen-to-body ratio of the display panel by providing the above-mentioned film-on-chip package structure, which is beneficial to realize lightness and thinness and increase service life.

The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them.

Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used in the description of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application.

In order to further explain the technical means and effects adopted by the present invention to achieve the intended purpose, the following detailed description of the present application will be given in conjunction with the accompanying drawings and preferred implementation modes.

The present application provides a chip-on-film packaging structure, which includes: A flexible circuit board, including a substrate and circuit traces arranged on the substrate; a driver chip, located on the flexible circuit board, the driver chip is electrically connected to the circuit traces, and is used to send or receive electrical signals through the circuit traces; A heat dissipation patch, bonded to the side of the driver chip away from the flexible circuit board, the heat dissipation patch at least partially covers the driver chip, and extends to the flexible circuit board along at least one side of the driver chip superior.

The above-mentioned thin film chip-on-chip package structure will be specifically described below in conjunction with specific embodiments.

Embodiment one

In this embodiment, please refer to FIG. 1 and FIG. 2 together. The film-on-chip packaging structure 100 includes a flexible circuit board 110, a driver chip 130, and a heat dissipation patch 150. The flexible circuit board 110 includes a substrate 111, circuit traces 113 and The insulating layer 115 is disposed on a side of the circuit trace 113 away from the substrate 111 . The driver chip 130 is electrically connected to the circuit trace 113, and the heat dissipation patch 150 is arranged on the side of the driver chip 130 away from the circuit trace 113, which includes a first part 151 that completely covers the driver chip 130 and extends along one side of the driver chip 130. As for the second part 153 on the flexible circuit board 110 , the side of the second part 153 close to the driving chip 130 is defined as the first side W _c , and the side away from the driving chip 130 is defined as the second side W _b .

In this embodiment, please refer to FIG. 1 and FIG. 2 together. The opposite ends of the flexible circuit board 110 are respectively provided with an input portion 141 and an output portion 143 electrically connected to the circuit trace 113 . Wherein the input part 141 is used for being electrically connected with an external printed circuit board, transmits the electric signal between described printed circuit board and driver chip 130, and this printed circuit board can be the motherboard of an electronic equipment, for example; Output part 143 is used for and An external display panel is electrically connected to transmit electrical signals between the driving chip 130 and the display panel.

In this embodiment, the substrate 111 is a flexible substrate and has flexibility. The material thereof may include polymer materials such as polyimide (PI). In other embodiments, the material of the substrate 111 may also include polyethylene (Polyethylene, PE), polyvinylchloride (Polyvinylchloride, PVC), polystyrene (Polystyrene, PS), acrylic (acrylic), fluorinated polymer One or a combination of (Fluoropolymer), polyester or nylon.

In this embodiment, the circuit trace 113 may include a plurality of metal conductive wires, such as copper conductive wires and the like. The circuit formed by the circuit traces 113 is electrically connected to the input part 141 and the driving chip 130 on the one hand, and is electrically connected to the output part 143 and the driving chip 130 on the other hand, so as to transmit electrical signals.

In this embodiment, the insulating layer 115 covers the circuit traces 113 to protect the circuit traces 113 . The material of the insulating layer 115 may be the same as that of the substrate 111 , including a polymer material such as polyimide (Polyimide, PI). In other embodiments, the material of the insulating layer 115 may also include polyethylene (Polyethylene, PE), polyvinylchloride (Polyvinylchloride, PVC), polystyrene (Polystyrene, PS), acrylic (acrylic), fluorinated polymer One or a combination of Fluoropolymer, polyester or nylon.

In this embodiment, the driving chip 130 can be a gate driving chip or a source driving chip of the display panel, or an integrated chip of gate driving and source driving, or a touch control chip integrated on the display panel. control driver chip. The driving chip 130 is flip chip bonded (Flip Chip Bonding) on the flexible circuit board 110 to form a chip on film (COF). In different embodiments, the driver chip 130 may also have other driving or control functions.

In this embodiment, the heat dissipation patch 150 itself includes an adhesive material, which is directly bonded on the driving chip 130 . The material of the heat dissipation patch 150 also includes graphene, that is, the heat dissipation patch 150 is a graphene heat-conducting film, which has a good thermal guiding function, and can make the heat emitted by the driver chip 130 conduct along the direction in which the heat dissipation patch 150 extends. The heat dissipation is carried out, so that the heat dissipation patch 150 has good heat dissipation performance. In other embodiments, the heat dissipation material in the heat dissipation patch 150 can also include one or any combination of artificial graphite, natural graphite, carbon nanotubes, aluminum oxide, boron nitride, and zinc oxide, so as to realize the thermal conductivity of the graphene film. Same cooling effect.

In other embodiments, the heat dissipation patch 150 may also be bonded to the surface of the driving chip 130 away from the circuit trace 113 via an adhesive (not shown in the figure). The adhesive can include heat-resistant adhesives, such as pressure-sensitive adhesives, and the adhesive material can also include materials with thermal conductivity, such as graphene microsheets, artificial graphite, natural graphite, carbon nanotubes, aluminum oxide, One or any combination of boron nitride and zinc oxide. This application does not limit this.

In this embodiment, please refer to FIG. 1 and FIG. 2 together. The heat dissipation patch 150 extends to the flexible circuit board 110 along the side of the driver chip 130 close to the input portion 141, and the extended length L is such that it does not cover the input portion. 141 , the longer the heat dissipation effect, the better. In this embodiment, the extension length L takes the maximum value under the condition that the input portion 141 is not covered. In other embodiments, the extended length L of the heat dissipation patch 150 may be any value that does not cover the input portion 141 , and the heat dissipation patch 150 may also extend along other sides of the driving chip 130 .

In this embodiment, please refer to FIG. 2 , the heat dissipation patch 150 includes a first part 151 covering the driving chip 130 and a second part 153 perpendicular to the first part 151 and extending to the flexible circuit board 110 , the second part of the second part The length of the side _Wb is less than or equal to the length of the first side _Wc of the first part.

In this embodiment, the heat dissipation patch 150 is also bonded to the flexible circuit board 110 to facilitate fixing the heat dissipation patch 150 and prevent it from falling off. The heat dissipation patch 150 itself includes an adhesive material, and is directly attached to the flexible circuit board 110 . In other embodiments, an adhesive (not shown) may also be provided between the heat dissipation patch 150 and the flexible circuit board 110 . When the film-on-chip package structure 100 is arranged in an electronic device, the heat dissipation patch 150 can also be combined with other structures in the electronic device (such as a support for supporting the film-on-chip package structure 100, the outer frame of the electronic device, etc. ) to fit together to play a fixed role.

In the thin film chip-on-chip package structure 100 provided in the embodiment of the present application, the heat dissipation patch 150 is arranged on the side of the driver chip 130 away from the flexible circuit board 110, and the heat dissipation patch 150 is arranged to extend along the side of the driver chip 130 to The flexible circuit board 110 can have a better heat dissipation effect. Please refer to Fig. 3, in which no heat dissipation structure is provided in advance for the FPC package structure A, and the known heat dissipation scheme f1 is used for the FPC package structure B, that is, a heat dissipation layer is provided on the side of the flexible circuit board away from the driver chip, and On this basis, other heat dissipation structures are added. The abscissa in FIG. 3 represents different heat dissipation schemes, and the ordinate represents the temperature of the driving chip when it is working. Among them, the heat dissipation scheme f2 is to wrap a layer of high thermal conductivity plastic on the driver chip, the heat dissipation scheme f3 is to attach a layer of metal heat dissipation plate on the top of the driver chip, and the metal heat dissipation plate just completely covers the driver chip, and the heat dissipation scheme f4 is to put a layer of metal heat dissipation plate on the driver chip. A layer of metal heat dissipation plate is pasted on the top of the chip. The metal heat dissipation plate completely covers the driver chip and is three times the size of the driver chip. The heat dissipation scheme f5 is the heat dissipation method used in Embodiment 1 of this application, that is, when the driver chip is far A heat dissipation patch is arranged on one side of the flexible circuit board, and the heat dissipation patch is extended to the flexible circuit board along one side of the driving chip. It can be seen that the heat dissipation scheme f5 has a better heat dissipation effect than other heat dissipation schemes, and even if the heat dissipation scheme f5 is added on the basis of the known heat dissipation scheme f1, it can also reduce the temperature of the driver chip, thereby prolonging the life of the driver chip. service life.

In the thin film chip-on-chip packaging structure 100 provided by the embodiment of the present application, by setting the heat dissipation patch 150 to extend to the flexible circuit board 110 along the side of the driver chip 130 close to the input portion 141, the heat generated by the driver chip 130 can be kept along the Conduction is conducted along the direction in which the heat dissipation patch 150 extends, that is, conduction is conducted in the direction of the input portion 141 . Since the input portion 141 is connected to an external printed circuit board, and the printed circuit board generally includes a metal material with good thermal conductivity, the heat generated by the driver chip 130 can continue to be conducted into the printed circuit board, thereby facilitating further cooling. Relatively speaking, since the display panel connected to the output portion 143 generally includes a glass structure that is not easy to conduct heat, if the heat generated by the driver chip 130 is conducted to the direction of the output portion 143, the heat is easy to accumulate at the display panel, Not conducive to heat dissipation.

In the film-on-chip packaging structure 100 provided in the embodiment of the present application, by setting the extended length L of the heat dissipation patch 150 to the maximum value not covering the input portion 141, the heat generated by the driver chip 130 can be conducted to the outside as much as possible. Thereby improving the cooling effect.

Embodiment two

Please refer to FIG. 4 and FIG. 5 together. The film-on-chip packaging structure 300 provided in this embodiment includes a flexible circuit board 310, a driver chip 330, and a heat dissipation patch 350. The flexible circuit board 310 includes a substrate 311, circuit traces 313 and devices. The insulation layer 315 on the side of the circuit trace 313 away from the substrate 311 . The driver chip 330 is electrically connected to the circuit trace 313, and the heat dissipation patch 350 is arranged on the side of the driver chip 330 away from the circuit trace 313, which includes a first part 351 that completely covers the driver chip 330 and extends along one side of the driver chip 330. to the second portion 353 on the flexible circuit board 310 . The opposite ends of the flexible circuit board 310 are respectively provided with an input portion 341 and an output portion 343 electrically connected to the circuit trace 313 . The difference from the first embodiment is that the chip-on-film packaging structure 300 further includes a heat dissipation layer 370 disposed on the side of the flexible circuit board 310 away from the driving chip 330 . And the width of the heat dissipation patch 350 is set to decrease with the increase of the distance from the driving chip 330 .

In this embodiment, the size of the heat dissipation layer 370 is the same as that of the flexible circuit board 310 to assist in dissipating the heat generated by the driver chip 330. The material of the heat dissipation layer 370 can be the same as that of the heat dissipation patch 350, including the adhesive The graphene heat conduction film of the material can also be a heat dissipation material bonded to the flexible circuit board 310 via an adhesive, such as one or more of artificial graphite, natural graphite, carbon nanotubes, aluminum oxide, boron nitride, and zinc oxide. Any combination of heat dissipation films can also be metal heat dissipation sheets such as copper foil or aluminum foil. In other embodiments, the size of the heat dissipation layer 370 may also be such that the projection on the flexible circuit board 310 is larger than any size of the projection of the driving chip 330 on the flexible circuit board 310 . The heat dissipation layer 370 provided in this embodiment can also be applied to the thin film chip-on-chip package structure 100 in the first embodiment.

In this embodiment, please refer to FIG. 5, the second part 353 of the heat dissipation patch 350 is specifically an isosceles trapezoid whose width gradually decreases as it moves away from the driver chip 330, that is, the two parallel sides of the isosceles trapezoid are respectively One side W _c and the second side W _b . For example, the length of the second side W _b is 6.1 mm, the length of the first side W _c is 21.1 mm, and the length of the first side W _c is equal to the width of the driving chip 330 . In another embodiment, when the length of the second side W _b is zero, the shape of the second portion 353 becomes an isosceles triangle. In other embodiments, the length of the first side W _c may also vary with the size of the driving chip 330 , and the ratio of the length of the second side W _b to the length of the first side W _c is preferably 0.25-0.35. For example, please refer to FIG. 6 , where the abscissa is the length of the second side W _b of the heat dissipation patch 350 away from the driver chip 330 , and the ordinate is the temperature of the driver chip 330 . It can be seen that in the thin film chip-on-chip package structure 300 provided in this embodiment, when the length of the first side W _c is 21.1 mm and the length of the second side W _b is shorter than the length of the first side W _c , the second side W _b The length of 6.1mm and 16.1mm can both achieve good heat dissipation effect. At this time, 6.1mm is selected as the width of the heat dissipation patch 350 on the side away from the driver chip 330, which can reduce the heat dissipation effect of the heat dissipation patch 350 at the same time. area, thereby saving costs. The heat dissipation patch 350 provided in this embodiment can also be applied to the thin film chip-on-chip package structure 100 in the first embodiment.

In the thin film chip-on-chip package structure 300 provided in the embodiment of the present application, the width of the second part 353 of the heat dissipation patch 350 decreases with the increase of the distance from the driver chip 330, and the second side W _b is set The ratio of the length to the length of the first side W _c is 0.25-0.35, which can reduce the area of the heat dissipation patch 350 while improving the heat dissipation effect, thereby reducing the cost.

Embodiment three

Please refer to FIG. 7 and FIG. 8 together. The film-on-chip packaging structure 500 provided in this embodiment includes a flexible circuit board 510, a driver chip 530, and a heat dissipation patch 550. The flexible circuit board 510 includes a substrate 511, circuit traces 513 and devices. The insulation layer 515 on the side of the circuit trace 513 away from the substrate 511 . The driver chip 530 is electrically connected to the circuit trace 513, and the heat dissipation patch 550 is arranged on the side of the driver chip 530 away from the circuit trace 513, which includes a first part 551 that completely covers the driver chip 530 and extends along one side of the driver chip 530. to the second portion 553 on the flexible circuit board 510 . The opposite ends of the flexible circuit board 510 are respectively provided with an input portion 541 and an output portion 543 electrically connected to the circuit trace 513 . The difference from Embodiment 2 is that the film-on-chip packaging structure 500 also includes at least one heat dissipation via 580, the heat dissipation via 580 is opened on the part of the flexible circuit board 510 covered by the driver chip 530, and the heat dissipation via 580 is filled with heat dissipation material 590 , the heat dissipation material 590 is in direct contact with the driver chip 530 and the heat dissipation layer 570 . And the heat dissipation patch 550 is set such that its width increases as it moves away from the driver chip 530 , and the side of the heat dissipation patch 550 away from the driver chip 530 is parallel to the side close to the driver chip 530 .

In this embodiment, the heat dissipation via 580 is used to communicate with the driver chip 530 and the heat dissipation layer 570. By filling the heat dissipation via 580 with the heat dissipation material 590, compared with the structure in the second embodiment, the The heat emitted by the driver chip 530 is conducted to the heat dissipation layer 570 to improve the heat dissipation effect.

In this embodiment, the heat dissipation material 590 can be a part of the heat dissipation layer 570 itself, or can be independent from the heat dissipation layer 570, and bonded to the heat dissipation layer 570 by an adhesive (not shown). The heat dissipation material 590 may specifically be a material including one or any combination of artificial graphite, natural graphite, carbon nanotubes, aluminum oxide, boron nitride, and zinc oxide, and may also be metal parts such as copper pillars and aluminum pillars. The heat dissipation vias 580 and the heat dissipation material 590 provided in this embodiment can also be applied to the above embodiments.

In this embodiment, please refer to FIG. 8 , the second part 553 of the heat dissipation patch 550 is specifically an isosceles trapezoid whose width gradually increases as it moves away from the driver chip 530, that is, the two parallel sides of the isosceles trapezoid are respectively One side W _c and the second side W _b . For example, the length of the first side W _c is 21.1 mm, the length of the second side W _b is 28.6 mm, and the length of the first side W _c is equal to the width of the driving chip 530 . In other embodiments, the length of the first side _Wc can also vary with the size of the driver chip 330. A preferred size is: the ratio of the length of the second side _Wb to the length of the first side _Wc 1.3-1.4. Please refer to FIG. 6 , where the abscissa is the length of the second side _Wb of the heat dissipation patch 550 away from the driver chip 530 , and the ordinate is the temperature of the driver chip 530 . It can be seen that in the thin film chip-on-chip package structure 500 provided in this embodiment, when the length of the first side W _c is 21.1 mm, and the length of the second side W _b is greater than the length of the first side W _c , the second side W The length of _b is 28.6mm to achieve a better heat dissipation effect. The heat dissipation patch 550 provided in this embodiment can also be applied to the above embodiments.

In the film-on-chip packaging structure 500 provided in the embodiment of the present application, the width of the second part 553 of the heat dissipation patch 550 increases with the increase of the distance from the driver chip 530, and the second side W _b is set The ratio of the length to the length of the first side _Wc is 1.3-1.4, which can maximize the cooling effect.

To sum up, in the film-on-chip packaging structure provided by the embodiment of the present application, a heat dissipation patch is provided on the side of the driver chip away from the flexible circuit board, and the heat dissipation patch is extended in a direction close to the input part, Can play a better heat dissipation effect. At the same time, the shape and size of the heat dissipation patch can be selected according to better heat dissipation effect or lower cost, and heat dissipation layers and heat dissipation through holes can be selectively provided.

The embodiment of the present application also provides an electronic device, please refer to FIG. 9 , the electronic device 10 includes the chip-on-film packaging structure 100 ( 300 , 500 ) provided in the above embodiment, a printed circuit board 41 and a display panel 43 . The printed circuit board 41 is electrically connected to the film-on-chip package structure 100 (300,500), specifically to the input part 141 for transmitting electrical signals; the display panel 43 is electrically connected to the film-on-chip package structure 100 (300,500), specifically In order to be electrically connected with the output part 143, it is used for transmitting electric signals. For example, the thin film chip-on-chip packaging structure 100 ( 300 , 500 ) receives electrical signals from the printed circuit board 41 and transmits them to the display panel 43 , thereby driving the display panel 43 to display images.

In one embodiment, the display panel 43 also includes a touch panel, and the film-on-chip packaging structure 100 ( 300 , 500 ) is also used to receive electrical signals output from the touch panel and transmit them to the printed circuit board 41 for subsequent computation.

In one embodiment, the printed circuit board 41 is stacked with the display panel 43 after being turned over. At this time, the film-on-chip packaging structure 100 (300, 500) is bent, and the driving chip 130 can be located inside the bent structure, or can be located on the inside of the bent structure. Outside, the present application does not limit this.

Those skilled in the art should recognize that the above embodiments are only used to illustrate the present invention, rather than to limit the present invention, as long as within the scope of the spirit of the present invention, appropriate changes made to the above embodiments And changes all fall within the scope of protection of the present invention.

100, 300, 500, A, B: film-on-chip package structure 110, 310, 510: flexible circuit board 111, 311, 511: substrate 113, 313, 513: circuit wiring 115, 315, 515: insulating layer 130, 330, 530: driver chip 150, 350, 550: heat dissipation patch 151, 351, 551: first part 153, 353, 553: second part 141, 341, 541: input part 143, 343, 543: output part 370, 570: heat dissipation layer 590: heat dissipation material 580: heat dissipation through holes f1, f2, f3, f4, f5: heat dissipation scheme T: temperature W _c : first side W _b : second side L: length 10: electronic equipment 41: printing Board 43: Display Panel

FIG. 1 is a cross-sectional view of a chip-on-film packaging structure according to Embodiment 1 of the present application.

FIG. 2 is a top view of a chip-on-film package structure according to Embodiment 1 of the present application.

FIG. 3 is a comparison diagram of heat dissipation effects of different types of thin film chip-on-chip packaging structures.

FIG. 4 is a cross-sectional view of a chip-on-film packaging structure according to Embodiment 2 of the present application.

FIG. 5 is a top view of a chip-on-film packaging structure according to Embodiment 2 of the present application.

FIG. 6 is a comparison diagram of heat dissipation effects of Embodiments 2 and 3 of the present application.

FIG. 7 is a cross-sectional view of a chip-on-film packaging structure according to Embodiment 3 of the present application.

FIG. 8 is a top view of a chip-on-film packaging structure according to Embodiment 3 of the present application.

FIG. 9 is a schematic diagram of component connections of an electronic device according to an embodiment of the present application.

100: Film-on-chip packaging structure

110:Flexible circuit board

111: Substrate

113: Circuit routing

115: insulation layer

130: Driver chip

141: input part

150: cooling patch

151: Part 1

153: Part Two

Claims (12)

A chip-on-film packaging structure, the improvement of which includes: A flexible circuit board, which includes a substrate and circuit traces arranged on the substrate; a driver chip, located on the flexible circuit board, the driver chip is electrically connected to the circuit traces, and is used to send or receive electrical signals through the circuit traces; A heat dissipation patch is bonded to a side of the driver chip away from the flexible circuit board, the heat dissipation patch at least partially covers the driver chip, and extends along the driver chip to the flexible circuit board. The chip-on-film packaging structure according to claim 1, wherein the heat dissipation patch completely covers the driver chip. The chip-on-film packaging structure according to claim 2, wherein the heat dissipation patch includes a first part covering the driver chip and a second part perpendicular to the first part and extending to the flexible circuit board, The width of the second portion is smaller than or equal to the width of the first portion. The chip-on-film packaging structure according to claim 2, wherein the width of the heat dissipation patch decreases as the distance from the driving chip increases. The film-on-chip packaging structure according to claim 2, wherein the width of the heat dissipation patch increases as it moves away from the driver chip, and the heat dissipation patch is far away from the side of the driver chip and covers the The sides of the drive chip are parallel. The film-on-chip packaging structure according to claim 1, wherein a heat dissipation layer is provided on the side of the flexible circuit board away from the driving chip, and the projection of the heat dissipation layer on the flexible circuit board covers the The projection of the driving chip on the flexible circuit board. The film-on-chip packaging structure according to claim 6, wherein the part of the flexible circuit board covered by the driving chip is provided with at least one heat dissipation via hole, and the heat dissipation via hole is filled with heat dissipation material. The material is in direct contact with the driving chip and the heat dissipation layer. The film-on-chip packaging structure according to claim 1, wherein the opposite sides of the flexible circuit board are respectively provided with an input part and an output part electrically connected to the circuit trace; the input part is connected to an external The printed circuit board is electrically connected to transmit electrical signals between the printed circuit board and the driving chip; the output part is electrically connected to an external display panel and used to transmit electrical signals between the driving chip and the display panel between electrical signals. The chip-on-film packaging structure according to claim 8, wherein the heat dissipation patch extends from the driving chip toward the input portion and does not cover the input portion. The chip-on-film packaging structure according to claim 1, wherein the portion of the heat dissipation patch extending to the flexible circuit board is bonded to the flexible circuit board. The film-on-chip packaging structure according to any one of claims 1-10, wherein the driver chip is a gate driver chip or a source driver chip of a display panel, or an integrated chip of a gate driver and a source driver , or a touch driver chip integrated with a touch structure on the display panel. An electronic device, the improvement of which includes: The film-on-chip packaging structure described in any one of Claims 1-11; a printed circuit board, electrically connected to the chip-on-film package structure, and used to input electrical signals to the chip-on-film package structure; a display panel, electrically connected to the chip-on-film package structure, and used to receive electrical signals output by the chip-on-film package structure; The film-on-chip packaging structure is used to receive signals from the printed circuit board, so as to drive the display panel to display images.

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