CN117479771A - Display module and display device - Google Patents
Display module and display device Download PDFInfo
- Publication number
- CN117479771A CN117479771A CN202311056210.8A CN202311056210A CN117479771A CN 117479771 A CN117479771 A CN 117479771A CN 202311056210 A CN202311056210 A CN 202311056210A CN 117479771 A CN117479771 A CN 117479771A
- Authority
- CN
- China
- Prior art keywords
- heat
- display
- display panel
- composite film
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009413 insulation Methods 0.000 claims abstract description 54
- 239000002131 composite material Substances 0.000 claims abstract description 46
- 230000017525 heat dissipation Effects 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 7
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 6
- 239000006260 foam Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- 229910002804 graphite Inorganic materials 0.000 description 8
- 239000010439 graphite Substances 0.000 description 8
- 238000005452 bending Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 5
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L59/00—Thermal insulation in general
- F16L59/02—Shape or form of insulating materials, with or without coverings integral with the insulating materials
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application discloses a display module and a display device, wherein the module comprises a display panel, a composite film, a heat conducting layer, a driving part and a circuit board, wherein the display panel comprises a display area and a non-display area, and the non-display area comprises a binding area; the composite film is arranged on one side surface of the display panel; the heat conduction layer is arranged on one side surface of the composite film, which is away from the display panel, and the binding area is bent to one side surface of the heat conduction layer, which is away from the composite film; the driving part is positioned on one side surface of the binding area, which faces away from the display panel; the circuit board is electrically connected with the driving part, is arranged on one side surface of the heat conduction layer, which is away from the display panel, and is positioned in the non-display area; the composite film is provided with a heat insulation part, the heat conductivity coefficient of the heat insulation part is smaller than that of the heat conduction layer, and the projection of the driving part and the circuit board is at least partially overlapped with the heat insulation part along the thickness direction of the display panel. The temperature difference between the non-display area and the display area of the display panel is reduced, and the service life and the display effect of the display module are improved.
Description
Technical Field
The application belongs to the technical field of display, and particularly relates to a display module and a display device.
Background
An organic light emitting diode (Organic Light Emitting Diode, OLED) device is an electroluminescent device based on organic semiconductor materials, which has a high light conversion efficiency and very low power consumption. With the development of OLED display technology, the OLED display device is widely applied to various fields.
The OLED display module comprises an IC (drive integrated circuit) and a PCBA, and components of the IC and the PCBA generate higher heat, so that local high temperature is caused, and the damage to electronic devices is easy to cause; and the luminous efficiency and the service life of the OLED are deteriorated, the phenomenon of screen burning occurs, and the display effect is affected.
Disclosure of Invention
The embodiment of the application provides a display module and display device to solve the components and parts of current display module and generate heat and cause the electronic components damage, influence the problem of display effect.
In a first aspect, an embodiment of the present application provides a display module, including:
the display panel comprises a display area and a non-display area, wherein the non-display area comprises the binding area;
a composite film disposed on one side of the display panel;
the binding area is bent to one side surface of the heat conduction layer, which is away from the composite film;
the driving part is positioned on one side surface of the binding area, which faces away from the display panel;
the circuit board is electrically connected with the driving part, is arranged on one side surface of the heat conduction layer, which is away from the display panel, and is positioned in the non-display area; wherein,
the composite film is provided with a heat insulation part, the heat conductivity coefficient of the heat insulation part is smaller than that of the heat conduction layer, and the projection of the driving part and the circuit board is at least partially overlapped with the heat insulation part along the thickness direction of the display panel.
Optionally, the composite film is provided with a plurality of openings, the depth of the openings is the same as the thickness of the composite film, the heat insulation part is arranged in the openings, and the openings are respectively arranged corresponding to the driving part and the circuit board.
Optionally, the composite film includes heat dissipation layer and buffer layer that the range upon range of set up, the heat dissipation layer is located the heat conduction layer with between the buffer layer, a plurality of openings are seted up to the heat dissipation layer, the open-ended degree of depth with the thickness of heat dissipation layer is the same, thermal-insulated portion is located in the opening.
Optionally, the heat insulation part is filled in the opening or made of air or a material with a heat conductivity coefficient smaller than that of air.
Optionally, the side of the composite film facing away from the display panel is provided with the heat insulation part, the heat conduction layer is provided with a groove aligned with the heat insulation part, and the heat insulation part is positioned in the groove.
Optionally, the heat insulation part is foam arranged in the groove.
Optionally, the thickness of the heat insulation part is m, m is more than or equal to 0.1mm, and the thickness of the heat insulation part is smaller than the thickness of the heat conduction layer.
Optionally, the circuit board is adhered to the heat conducting layer through pressure sensitive adhesive.
Optionally, the thickness of the pressure-sensitive adhesive is n, and n is more than 0 and less than or equal to 0.015mm.
In a second aspect, embodiments of the present application further provide a display device, including: the display module of any one of the above.
The embodiment of the application provides a display module and display device, including display panel, the complex film, the heat conduction layer, drive division and circuit board, through setting up thermal-insulated portion at the complex film, thermal-insulated portion is located the below of drive division and circuit board, thermal conductivity of thermal-insulated portion is less than the thermal conductivity of heat conduction layer, thermal-insulated portion can cut off the heat transfer of drive division and circuit board production to the display panel of below, the heat conduction layer is quick with the other regional transfer of heat to display panel, avoid display panel and the relative position of drive division and circuit board to appear the condition that local high temperature appears, so overcome the components and parts of current display module and generate heat and cause the electronic components damage, influence the problem of display effect, reduce the difference in temperature of the non-display area and the display area of display panel, and then reached protection electronic components, improve display module life and display effect's purpose.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort to a person skilled in the art.
For a more complete understanding of the present application and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts throughout the following description.
Fig. 1 is a top view of a display panel according to an embodiment of the present application.
Fig. 2 is a cross-sectional view of a first form of a display module according to an embodiment of the present application.
Fig. 3 is a sectional view of a second form of the display module provided in the embodiment of the present application.
Fig. 4 is a cross-sectional view of a third form of a display module according to an embodiment of the present disclosure.
Fig. 5 is a cross-sectional view of a fourth form of a display module according to an embodiment of the present disclosure.
Fig. 6 is a sectional view of a fifth form of a display module according to an embodiment of the present disclosure.
Fig. 7 is a cross-sectional view of a sixth form of a display module according to an embodiment of the present disclosure.
Fig. 8 is a sectional view of a seventh form of a display module according to an embodiment of the present application.
Fig. 9 is a cross-sectional view of an eighth form of a display module according to an embodiment of the present disclosure.
Fig. 10 is a sectional view of a ninth form of a display module provided in an embodiment of the present application.
Fig. 11 is a cross-sectional view of a tenth form of the display module provided in the embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
The embodiment of the application provides a display module and display device to solve the components and parts of current display module and generate heat and cause the electronic components damage, influence the problem of display effect. The following description will be given with reference to the accompanying drawings.
Referring to fig. 1 and fig. 2, fig. 1 is a top view of a display panel provided in an embodiment of the present application, and fig. 2 is a cross-sectional view of a first form of a display module provided in an embodiment of the present application.
A display module includes a display panel 100, a composite film 200, a heat conductive layer 300, a driving part 400, and a circuit board 500.
In this embodiment, the display panel 100 includes a display area (AA) 110 for displaying an image, and a non-display area 120 extending from the display area, wherein the non-display area 120 includes a wiring area (not shown), a bonding area 130, and a bending area 140, the wiring area is adjacent to the display area, and the bending area 140 connects the wiring area and the bonding area 130. The display panel in this embodiment may be an OLED display panel.
In this embodiment, the composite film 200 is disposed on one side of the display panel 100, and the composite film 200 covers the display area 110 and the non-display area 120 of the display panel 100 except for the bending area 140 and the binding area 130.
In this embodiment, the heat conducting layer 300 is disposed on a side of the composite film 200 facing away from the display panel 100, the binding region 130 is bent to a side of the heat conducting layer 300 facing away from the composite film 200, the heat conducting layer 300 is made of graphite, the heat conductivity coefficients of the graphite in the X-axis and Y-axis directions are 1200W/m.k, and the heat conductivity coefficient of the graphite in the Z-axis direction is 20W/m.k, wherein the Z-axis direction refers to the thickness direction of the heat conducting layer 300.
In this embodiment, the driving part 400 is disposed on a side of the bonding area 130 facing away from the display panel 100, and the driving part 400 includes a driving Integrated Circuit (IC).
In this embodiment, the circuit board 500 is electrically connected to the driving portion 400 through a flexible circuit board (FPC) 700, the flexible circuit board 700 is fixed to the heat conductive layer 300 by gluing, the circuit board 500 is disposed on a side of the heat conductive layer 300 facing away from the display panel 100, and the circuit board 500 is located in the non-display area 110. The circuit board 500 is a printed wiring board Assembly (PCBA) on which various electronic devices are assembled by a surface packaging process to form the PCBA. The circuit board 500 may include a printed wiring board and an electronic component soldered on the printed wiring board, and the printed wiring board is located at a side of the electronic component near the display panel. The electronic components may include at least one of a power management circuit PM-IC, a step-down circuit Buck, a timing control circuit T-CON, a display driving circuit EL-IC, and a Flash memory chip Flash.
In this embodiment, the heat insulation part 210 is disposed on the composite film 200, the heat conductivity of the heat insulation part 210 is smaller than that of the heat conduction layer 300, such as the heat conductivity of the heat insulation part 210 in the Z-axis direction is smaller than that of the heat conduction layer 300 such as graphite, the heat insulation part 210 is located below the driving part 400 and the circuit board 500, and along the thickness direction of the display panel 100, the projections of the driving part 400 and the circuit board 500 overlap with the heat insulation part 210 at least partially.
It can be appreciated that in this embodiment, the composite film 200 has the heat insulation portion 210, the heat insulation portion 210 is located below the driving portion 400 and the circuit board 500, when the driving portion 400 and the circuit board 500 generate heat in the working process, the heat is simultaneously transferred along the X-axis direction, the Y-axis direction and the Z-axis direction of the heat conducting layer 300, because the heat conductivity coefficient of the heat insulation portion 210 in the Z-axis direction is smaller than that of the heat conducting layer 300 in the Z-axis direction, the heat transferred along the Z-axis direction is blocked by the heat insulation portion 210, the heat is blocked from being transferred onto the display panel below the heat insulation portion 210, as much heat as possible is transferred along the X-axis direction and the Y-axis direction, the heat generated by the driving portion 400 and the circuit board 500 is thermally insulated and dissipated through the composite film 200, so that the situation that the heat is accumulated in the display panel 100 below the driving portion 400 and the circuit board 500 is partially occurs is avoided, the problem that the electronic components of the existing display module are damaged due to the heat generation of the components is overcome, the problem that the display effect is affected is reduced, the temperature difference between the non-display area and the display area of the display module is further achieved, the purpose of protecting the electronic components is achieved, and the service life and the display effect is improved.
In some embodiments, referring to fig. 2 and 3, the composite film 200 is provided with a plurality of openings 220, such as two openings 220, wherein the two openings 220 are respectively disposed corresponding to the driving part 400 and the circuit board 500, one opening 220 is disposed in alignment with the driving part 400, the other opening 220 is disposed in alignment with the circuit board 500, the depth of the opening 220 is the same as the thickness of the composite film 200, and the heat insulation part 210 is disposed in the opening 220. The size of the opening 220 is adapted to the driving part 400 and the circuit board 500, respectively, such that the long and wide size of the opening 220 opposite to the driving part 400 is slightly larger than the long and wide size of the driving part 400, such that the long and wide size of the opening 220 is 3mm larger than the long and wide size of the driving part 400, and the long and wide size of the opening 220 opposite to the circuit board 500 is smaller than the long and wide size of the circuit board 500, but the long and wide size of the opening 220 is larger than the long and wide size of the electronic component on the circuit board 500, such as the long and wide size of the opening 220 is 3mm larger than the long and wide size of the electronic component.
It can be appreciated that the composite film 200 is provided with a plurality of openings 220, which correspond to the driving part 400 and the circuit board 500, so that the overall structural strength of the display module can be ensured while satisfying the requirement of cutting off the heat transfer paths generated by different electronic components, respectively.
As a variant, referring to fig. 4 and 5, an opening 220 is formed in the composite film 200, the depth of the opening 220 is the same as the thickness of the composite film 200, and the heat insulating portion 210 is disposed in the opening 220. One opening 220 corresponds to the driving part 400, the circuit board 500 and the area between the driving part 400 and the circuit board 500 at the same time, the opening 220 can simultaneously meet the heat transfer path stage of the driving part 400 and the circuit board 500, and the structure of the opening 220 can be processed by only one opening on the composite film 200, so that the processing technological process is reduced.
In some embodiments, referring to fig. 6, fig. 7, fig. 8 and fig. 9, the composite film 200 includes a heat dissipation layer 230 and a buffer layer 240 that are stacked, the buffer layer 240 is disposed on a side surface of the display panel 100, the heat dissipation layer 230 is located between the heat conduction layer 300 and the buffer layer 240, the heat dissipation layer 230 is connected to the heat conduction layer 300 and the buffer layer 240, the heat dissipation layer 230 is made of a metal material, such as copper, stainless steel, aluminum magnesium alloy, titanium alloy, and the like, the heat dissipation layer 230 not only plays a role in heat dissipation, but also plays a supporting role, the heat dissipation layer 230 is provided with a plurality of openings 220, the plurality of openings 220 are disposed corresponding to the driving portion 400 and the circuit board 500, and the positions and the sizes of the openings 220 can be seen in other embodiments, which are not repeated in this embodiment. The material of the buffer layer 240 may be foam, silicone gel, TPU, or the like, and may also serve as a heat insulating material.
As a modification, referring to fig. 8 and 9, it is also possible that one opening 220 is formed on the heat dissipation layer 230, one opening 220 corresponds to the driving part 400, the circuit board 500, and the region between the driving part 400 and the circuit board 500 at the same time, and the opening 220 can satisfy the heat transfer path stage of both the driving part 400 and the circuit board 500.
In addition to the above embodiments, referring to fig. 2, 4, 6 and 8, the heat insulating part 210 is air filled in the opening 220. Referring to fig. 9, the heat insulating part 210 is a material having a thermal conductivity smaller than that of air.
In this embodiment, the opening 220 is formed on the composite film 200, the display panel 100 and the heat conducting layer 300 are respectively disposed on the upper and lower sides of the opening 220, so as to form a cavity structure, the heat-conducting portion 210 is air filled in the cavity structure, the heat conductivity of the air is 0.0267W/m.k, which is far smaller than the heat conductivity of the heat conducting layer 300 in the Z-axis direction, so that a good heat insulation effect can be achieved, and the processing technology is simpler.
In other embodiments, referring to fig. 3, 5, 7 and 9, the heat insulation portion 210 is a material filled in the opening 220 with a thermal conductivity smaller than that of air. The material with the thermal coefficient smaller than the thermal coefficient of air can be foam, and the thermal coefficient of the foam is 0.024W/m.k.
In some embodiments, referring to fig. 10 and 11, a heat insulation portion 210 is disposed on a side of the composite film 200 facing away from the display panel 100, the heat insulation portion 210 protrudes from a surface of the composite film 200, the heat conductive layer 300 has a groove 310 aligned with the heat insulation portion 210, the heat insulation portion 210 is located in the groove 310, and a side of the heat insulation portion 210 facing the display panel 100 is flush with a side of the heat conductive layer 300 facing the display panel 100.
In this embodiment, the composite film 200 includes a heat dissipation layer 230 and a buffer layer 240 that are stacked, the buffer layer 240 is disposed on a side of the display panel 100, the heat dissipation layer 230 is located between the heat conduction layer 300 and the buffer layer 240, the heat dissipation layer 230 connects the heat conduction layer 300 and the buffer layer 240, and a heat insulation portion 210 is disposed on a side of the heat dissipation layer 230 facing the heat conduction layer 300.
As shown in fig. 10, the recess 310 may be an entire recess region, as shown in fig. 11, or may be two separate recess regions, each of which is filled with the heat insulating portion 210.
On the basis of the above embodiment, referring to fig. 10 and 11, the heat insulating part 210 is foam disposed in the groove 310.
On the basis of the above embodiment, the thickness of the heat insulation part 210 is m, m is greater than or equal to 0.1mm, and the thickness of the heat insulation part 210 is smaller than the thickness of the heat conduction layer 300. The thickness m of the insulation 210 may be 0.1mm, 0.15mm or 0.2mm.
The thickness m of the heat insulation part 210 is designed reasonably, and ensures that the heat conduction layer 300 can meet the heat dissipation requirement while meeting the heat insulation requirement.
In some embodiments, and as shown in fig. 1, the circuit board 500 is bonded to the thermally conductive layer 300 by a pressure sensitive adhesive.
Based on the above embodiment, the thickness of the pressure-sensitive adhesive 600 is n,0 < n.ltoreq.0.015 mm.
The embodiment of the application also provides a display device, which comprises the display module of any one of the above.
Referring to fig. 1, the display device may be: any product or component with a display function, such as electronic paper, mobile phone, tablet computer, television, display, notebook computer, digital photo frame, navigator, etc., which is not limited in this disclosure.
The display module includes a display panel 100, a composite film 200, a heat conductive layer 300, a driving part 400, and a circuit board 500. The display panel 100 includes a display area (AA) 110 for displaying an image, and a non-display area 120 extending from the display area, wherein the non-display area 120 includes a wiring area (not shown), a bonding area 130, and a bending area 140, the wiring area being adjacent to the display area, the bending area 140 connecting the wiring area and the bonding area 130. The display panel in this embodiment may be an OLED display panel. The composite film 200 is disposed on one side of the display panel 100, and the composite film 200 covers the display region 110 and the non-display region 120 of the display panel 100 except for the bending region 140 and the binding region 130. The heat conducting layer 300 is disposed on a side of the composite film 200 facing away from the display panel 100, the binding region 130 is bent to a side of the heat conducting layer 300 facing away from the composite film 200, the heat conducting layer 300 is made of graphite, the heat conductivity coefficients of the graphite in the X-axis and Y-axis directions are 1200W/m.k, and the heat conductivity coefficient of the graphite in the Z-axis direction is 20W/m.k, wherein the Z-axis direction refers to the thickness direction of the heat conducting layer 300. The driving part 400 is disposed on a side of the bonding area 130 facing away from the display panel 100, and the driving part 400 includes a driving Integrated Circuit (IC). The circuit board 500 is electrically connected with the driving part 400 through a flexible circuit board (FPC), the flexible circuit board is fixed with the heat conductive layer 300 through adhesion, the circuit board 500 is disposed on a side of the heat conductive layer 300 facing away from the display panel 100, and the circuit board 500 is located in the non-display area 110. The composite film 200 is provided with a heat insulating part 210, the heat insulating part 210 having a heat conductivity smaller than that of the heat conductive layer 300, such as the heat insulating part 210 having a heat conductivity smaller than that of the heat conductive layer 300 such as graphite in the Z-axis direction, the heat insulating part 210 being located under the driving part 400 and the circuit board 500, and the projections of the driving part 400 and the circuit board 500 at least partially overlapping the heat insulating part 210 in the thickness direction of the display panel 100.
It can be appreciated that in this embodiment, the composite film 200 has the heat insulation portion 210, the heat insulation portion 210 is located below the driving portion 400 and the circuit board 500, when the driving portion 400 and the circuit board 500 generate heat in the working process, the heat is simultaneously transferred along the X-axis direction, the Y-axis direction and the Z-axis direction of the heat conducting layer 300, because the heat conductivity coefficient of the heat insulation portion 210 in the Z-axis direction is smaller than that of the heat conducting layer 300 in the Z-axis direction, the heat transferred along the Z-axis direction is blocked by the heat insulation portion 210, the heat is blocked from being transferred onto the display panel below the heat insulation portion 210, as much heat as possible is transferred along the X-axis direction and the Y-axis direction, the heat generated by the driving portion 400 and the circuit board 500 is thermally insulated and dissipated through the composite film 200, so that the situation that the heat is accumulated in the display panel 100 below the driving portion 400 and the circuit board 500 is partially occurs is avoided, the problem that the electronic components of the existing display module are damaged due to the heat generation of the components is overcome, the problem that the display effect is affected is reduced, the temperature difference between the non-display area and the display area of the display module is further achieved, the purpose of protecting the electronic components is achieved, and the service life and the display effect is improved.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
In the description of the present application, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features.
The display module and the display device provided by the embodiments of the present application are described in detail, and specific examples are applied to illustrate the principles and embodiments of the present application, and the description of the above embodiments is only used to help understand the method and core ideas of the present application; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope according to the ideas of the present application, the contents of the present specification should not be construed as limiting the present application in summary.
Claims (10)
1. A display module, comprising:
the display panel comprises a display area and a non-display area, wherein the non-display area comprises the binding area;
a composite film disposed on one side of the display panel;
the binding area is bent to one side surface of the heat conduction layer, which is away from the composite film;
the driving part is positioned on one side surface of the binding area, which faces away from the display panel;
the circuit board is electrically connected with the driving part, is arranged on one side surface of the heat conduction layer, which is away from the display panel, and is positioned in the non-display area; wherein,
the composite film is provided with a heat insulation part, the heat conductivity coefficient of the heat insulation part is smaller than that of the heat conduction layer, and the projection of the driving part and the circuit board is at least partially overlapped with the heat insulation part along the thickness direction of the display panel.
2. The display module assembly of claim 1, wherein the composite film is provided with a plurality of openings, the depth of the openings is the same as the thickness of the composite film, the heat insulation portion is disposed in the openings, and the openings are disposed corresponding to the driving portion and the circuit board, respectively.
3. The display module assembly of claim 1, wherein the composite film comprises a heat dissipation layer and a buffer layer that are stacked, the heat dissipation layer is located between the heat conduction layer and the buffer layer, the heat dissipation layer is provided with a plurality of openings, the depth of the openings is the same as the thickness of the heat dissipation layer, and the heat insulation portion is arranged in the openings.
4. A display module according to claim 2 or 3, wherein the heat insulating part is air filled in the opening or a material having a thermal conductivity smaller than that of air.
5. The display module of claim 1, wherein the heat insulation part is disposed on a side of the composite film facing away from the display panel, the heat conduction layer has a groove aligned with the heat insulation part, and the heat insulation part is disposed in the groove.
6. The display module assembly of claim 5, wherein the thermal insulation portion is foam disposed within the recess.
7. The display module of claim 5, wherein the thickness of the thermal insulation portion is m, m is greater than or equal to 0.1mm, and the thickness of the thermal insulation portion is less than the thickness of the heat conducting layer.
8. The display module of claim 1, wherein the circuit board is bonded to the thermally conductive layer by a pressure sensitive adhesive.
9. The display module of claim 8, wherein the pressure sensitive adhesive has a thickness n,0 < n < 0.015mm.
10. A display device, comprising: a display module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311056210.8A CN117479771A (en) | 2023-08-21 | 2023-08-21 | Display module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311056210.8A CN117479771A (en) | 2023-08-21 | 2023-08-21 | Display module and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117479771A true CN117479771A (en) | 2024-01-30 |
Family
ID=89631962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311056210.8A Pending CN117479771A (en) | 2023-08-21 | 2023-08-21 | Display module and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117479771A (en) |
-
2023
- 2023-08-21 CN CN202311056210.8A patent/CN117479771A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI322915B (en) | Heat dissipation structure of backliht module | |
| KR100509382B1 (en) | A light-emitting module | |
| EP2685797A2 (en) | Composite material and electron device | |
| JPH0955459A (en) | Semiconductor device | |
| US11917859B2 (en) | Display module and display device | |
| US8174839B2 (en) | Mounting structure of semiconductor package and plasma display device having the same | |
| JP2012164846A (en) | Semiconductor device, semiconductor device manufacturing method and display device | |
| US20070259160A1 (en) | Circuit board with heat radiating sheet | |
| CN114181641B (en) | Composite adhesive tape and display device | |
| US7943855B2 (en) | Flexible printed circuit board and electronic component assembly | |
| US20080284765A1 (en) | Plasma display device and signal transmitting unit for plasma display device | |
| JP2009010213A (en) | Hybrid integrated circuit device | |
| CN106959538B (en) | Heat radiation structure and display device | |
| CN210839659U (en) | Electronic device | |
| CN113782694B (en) | Display module and display device | |
| TWI805098B (en) | Chip-on-film structure and electronic device | |
| CN117479771A (en) | Display module and display device | |
| JP2014123645A (en) | Electronic apparatus | |
| CN214705926U (en) | Intelligent power module | |
| CN215162316U (en) | Heat dissipation insulating tape, display module and display device | |
| CN111477099B (en) | Display module and display device | |
| CN112562524B (en) | Display panel and display panel manufacturing method | |
| US8217506B2 (en) | Semiconductor packaging structure having conductive gel to package semiconductor device | |
| CN111171746B (en) | Anti-static heat dissipation adhesive tape and preparation method thereof, and display device and preparation method thereof | |
| CN112490232A (en) | Intelligent power module and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |