CN207800590U - A kind of package structure membrane of flip chip package - Google Patents
A kind of package structure membrane of flip chip package Download PDFInfo
- Publication number
- CN207800590U CN207800590U CN201721742184.4U CN201721742184U CN207800590U CN 207800590 U CN207800590 U CN 207800590U CN 201721742184 U CN201721742184 U CN 201721742184U CN 207800590 U CN207800590 U CN 207800590U
- Authority
- CN
- China
- Prior art keywords
- layer
- heat sink
- flexible heat
- printed circuit
- flip chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of package structure membrane of flip chip package; its driving chip that is cascading, printed circuit film layer, the first adhesive layer, the first flexible heat sink layer, the second flexible heat sink layer, third flexible heat sink layer, the second adhesive layer; and first protective layer; extending design forms extension outward for the first flexible heat sink layer, the second flexible heat sink layer and third flexible heat sink layer; the extension includes opposite first surface and second surface, and the second protective layer is equipped on the first surface and second surface.The utility model can effectively radiate to driving chip, improve the operation stability of driving chip, extend its service life.
Description
Technical field
The utility model is related to a kind of display technology fields, more particularly, to a kind of membrane of flip chip suitable for display screen
Encapsulating structure.
Background technology
The driving chip of display screen is for driving display screen to show image, by the electric current or voltage of control display screen, from
And changes display screen and show different pictures.With the development of COF (Chip on Film, membrane of flip chip) encapsulation technology, display
The driving chip of screen is encapsulated in by using COF encapsulation technologies in flexible circuit board mostly.
With the increase of display or monitor resolution, the calorific value of driving chip with the working time growth
Growth slowly, when heat reaches a certain level, driving chip job insecurity influences the image quality of display, or drives
Dynamic chip is stopped so that display screen can not show image.The heat that can not be dispersed is it is also possible to cause driving chip to damage.
Utility model content
The purpose of the utility model is to overcome the defects of the prior art, provide a kind of membrane of flip chip suitable for display screen
Encapsulating structure can effectively radiate to driving chip, improve the operation stability of driving chip, extends it and uses the longevity
Life.
To achieve the above object, the utility model proposes following technical solutions：A kind of package structure membrane of flip chip package comprising
Printed circuit film layer, and the driving chip in the printed circuit film layer, the package structure membrane of flip chip package further include
The first adhesive layer, the first flexible heat sink layer, the second flexible heat sink layer, third flexible heat sink layer, the second glue being cascading
Adhesion coating and the first protective layer；For the printed circuit film layer between driving chip and the first adhesive layer, described first is flexible
Heat dissipating layer, the second flexible heat sink layer and third flexible heat sink layer extend to form extension outward, and the extension includes opposite
First surface and second surface, be equipped with the second protective layer on the first surface and second surface.
Preferably, the printed circuit film layer includes the printed circuit wiring layer being stacked and printed circuit film base,
For the printed circuit wiring layer between driving chip and printed circuit film base, first adhesive layer is located at printed circuit
Between film base and the first flexible heat sink layer.
Preferably, it is equipped with third adhesive layer between second protective layer and first surface and second surface, described
Two protective layers are pasted over the first and second surface by third adhesive layer.
Preferably, the package structure membrane of flip chip package further includes the third protective layer for protecting printed circuit film layer, institute
Third protective layer is stated between the first adhesive layer and the first flexible heat sink layer.
Preferably, the first flexible heat sink layer is copper foil layer, and the second flexible heat sink layer is graphene layer, and third flexibility dissipates
Thermosphere is copper foil layer.
Preferably, the first flexible heat sink layer is graphene layer, and the second flexible heat sink layer is copper foil layer, and third flexibility dissipates
Thermosphere is graphene layer.
Preferably, the extension is connected with the mainboard of equipment.
Preferably, the extension can also be connected with the metal shell of equipment or the cooling fin on apparatus casing.
The utility model has the beneficial effects that：
Compared with prior art, package structure membrane of flip chip package described in the utility model, by setting with extension
Flexible heat sink layer, and extension is connected with equipment mainboard or metal shell, is effectively carried out to the heat that driving chip generates
Heat is transmitted, and is made driving chip rapid cooling, is improved its stable row and service life.
Description of the drawings
Fig. 1 is one block diagram representation of structure of the utility model；
Fig. 2 is two block diagram representation of structure of the utility model.
Reference numeral：1, driving chip, 2, printed circuit film layer, 21, printed circuit wiring layer, 22, printed circuit film base
Layer, the 3, first adhesive layer, the 4, first flexible heat sink layer, the 41, second flexible heat sink layer, 42, third flexible heat sink layer, the 5, second glue
Adhesion coating, the 6, first protective layer, 7, extension, 71, first surface, 72, second surface, 73, third adhesive layer, the 8, second protection
Layer, 9, third protective layer.
Specific implementation mode
Below in conjunction with the attached drawing of the utility model, the technical solution of the utility model embodiment is carried out clear, complete
Description.
As shown in Figure 1, a kind of revealed package structure membrane of flip chip package of the utility model, including driving chip 1 and printing
Circuit film layer 2.Wherein, driving chip 1 is used for driving display screen to show that image, printed circuit film layer 2 are connected with display screen
In transmission drive signal comprising the printed circuit wiring layer 21 being cascading and printed circuit film base 22, printing electricity
Road wiring layer 21 is between driving chip 1 and printed circuit film base 22.Printed circuit wiring layer 21 and printed circuit film base
Layer 22 can be linked together by way of gluing or plating.Printed circuit wiring layer 21 is additionally provided with several electrodes, described
Driving chip 1 is electrically connected with the electrode.
As shown in Figure 1, package structure membrane of flip chip package further includes being cascading from top to bottom according to direction shown in FIG. 1
First adhesive layer 3, the first flexible heat sink layer 4, the second flexible heat sink layer 41, third flexible heat sink layer 42, the second adhesive layer 5,
One protective layer 6.Wherein, the first adhesive layer 3 is between the first flexible heat sink layer 4 and printed circuit film base 22, be used for by
First flexible heat sink layer 4 is pasted onto in printed circuit film base 22.Further, the first flexible heat sink layer 4, the second flexible heat sink
Layer 41, third flexible heat sink layer 42 are used to radiate to the heat that driving chip 1 generates.First flexible heat sink layer 4, second
Flexible heat sink layer 41, third flexible heat sink layer 42 extend design outward, and printed circuit film layer 2, the first glue are protruded to be formed
The extension 7 of adhesion coating 3, the second adhesive layer 5 and the first protective layer 6.The extension 7 include be to extend outwardly shape from a side
At, and the different embodiments that are extended to form simultaneously from multiple lateral surfaces.
Extension 7 can be connected with the mainboard of equipment, transfer heat to equipment mainboard, pass through equipment mainboard rapid cooling.
Certainly, extension 7 can also be connected with the metal shell of equipment, transfer heat on apparatus casing, radiated by shell.
When shell is nonmetallic, extension 7 can be made to be connected with cooling fin by increasing cooling fin on non-metal shell, or
Extension 7 is connected with equipment mainboard using above-mentioned.
Further, extension 7 has opposite first surface 71 and second surface 72, the first surface 71 and second
The second protective layer 8 is equipped on surface 72.Second protective layer 8 prevents its damage for protecting extension 7.
Preferably, it is equipped with third adhesive layer 73 between the second protective layer 8 and first surface 71 and second surface 72, second
Protective layer 8 is pasted onto by third adhesive layer 73 on first surface 71 and second surface 72.
Preferably, the first flexible heat sink layer 4 is copper foil layer, and the second flexible heat sink layer 41 is graphene layer, and third flexibility dissipates
Thermosphere 42 is copper foil layer.Certainly, the first flexible heat sink layer 4 is graphene layer, and the second flexible heat sink layer 41 is copper foil layer, and third is soft
Property heat dissipating layer 42 be graphene layer, can also use other that there are flexible, heat sinking function materials the first flexible heat sink layer is made
4, the second flexible heat sink layer 41 and third flexible heat sink layer 42.
As shown in Fig. 2, in order to be protected to printed circuit film base 22, above-mentioned package structure membrane of flip chip package further includes
Three protective layers 9, the third protective layer 9 is between the first adhesive layer 3 and the first flexible heat sink layer 44.
Package structure membrane of flip chip package described in the utility model, by flexible heat sink layer 4 of the setting with extension 7, and
Extension 7 is connected with equipment mainboard or metal shell, effectively carries out hot transmission to the heat that driving chip 1 generates, makes drive
1 rapid cooling of dynamic chip, improves its stable row and service life.
Package structure membrane of flip chip package described in the utility model, by flexible heat sink layer 4 of the setting with extension 7, and
Extension 7 is connected with equipment mainboard or metal shell, effectively carries out hot transmission to the heat that driving chip 1 generates, makes drive
1 rapid cooling of dynamic chip, improves its stable row and service life.
The technology contents and technical characteristic of the utility model have revealed that as above, however those skilled in the art still may be used
Teaching and announcement that can be based on the utility model and make various replacements and modification without departing substantially from the spirit of the present invention, therefore, this
Utility model protection range should be not limited to the revealed content of embodiment, and should include the various replacements without departing substantially from the utility model
And modification, and covered by present patent application claim.
Claims (6)
1. a kind of package structure membrane of flip chip package comprising printed circuit film layer, and the drive in the printed circuit film layer
Dynamic chip, it is characterised in that：The package structure membrane of flip chip package further includes the first adhesive layer being cascading, the first flexibility
Heat dissipating layer, the second flexible heat sink layer, third flexible heat sink layer, the second adhesive layer and the first protective layer；The printed circuit film
Between driving chip and the first adhesive layer, the first flexible heat sink layer, the second flexible heat sink layer and third flexibility dissipate layer
Thermosphere extends to form extension outward, and the extension includes opposite first surface and second surface, the first surface
With the second protective layer is equipped on second surface；The first flexible heat sink layer is copper foil layer, and the second flexible heat sink layer is graphite
Alkene layer, third flexible heat sink layer is copper foil layer or the first flexible heat sink layer is graphene layer, and the second flexible heat sink layer is copper
Layers of foil, third flexible heat sink layer are graphene layer.
2. package structure membrane of flip chip package according to claim 1, which is characterized in that the printed circuit film layer includes stacking
The printed circuit wiring layer of setting and printed circuit film base, the printed circuit wiring layer are located at driving chip and printed circuit
Between film base, first adhesive layer is located between printed circuit film base and the first flexible heat sink layer.
3. package structure membrane of flip chip package according to claim 1, which is characterized in that second protective layer and first surface
Third adhesive layer is equipped between second surface, second protective layer is pasted onto first surface and by third adhesive layer
On two surfaces.
4. package structure membrane of flip chip package according to claim 1, which is characterized in that the package structure membrane of flip chip package also wraps
The third protective layer for protecting printed circuit film layer is included, the third protective layer is located at the first adhesive layer and the first flexible heat sink
Between layer.
5. package structure membrane of flip chip package according to claim 1, which is characterized in that the mainboard phase of the extension and equipment
Connection.
6. package structure membrane of flip chip package according to claim 1, which is characterized in that the extension can also be with equipment
Metal shell or the cooling fin on apparatus casing are connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721742184.4U CN207800590U (en) | 2017-12-14 | 2017-12-14 | A kind of package structure membrane of flip chip package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721742184.4U CN207800590U (en) | 2017-12-14 | 2017-12-14 | A kind of package structure membrane of flip chip package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207800590U true CN207800590U (en) | 2018-08-31 |
Family
ID=63282908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721742184.4U Active CN207800590U (en) | 2017-12-14 | 2017-12-14 | A kind of package structure membrane of flip chip package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207800590U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110262105A (en) * | 2019-06-13 | 2019-09-20 | 武汉华星光电技术有限公司 | Display device |
-
2017
- 2017-12-14 CN CN201721742184.4U patent/CN207800590U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110262105A (en) * | 2019-06-13 | 2019-09-20 | 武汉华星光电技术有限公司 | Display device |
| CN110262105B (en) * | 2019-06-13 | 2020-10-16 | 武汉华星光电技术有限公司 | Display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518000 a1102, Shenzhen national engineering laboratory building, No. 20, Gaoxin South seventh Road, high tech Zone community, Yuehai street, Nanshan District, Shenzhen, Guangdong Patentee after: Howell touch and display technology (Shenzhen) Co.,Ltd. Address before: 518000 Room 601, east block, Haibin City, Wenxin 5th Road, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: GIGADISPLAY SEMICONDUCTOR Co.,Ltd. |
|
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 2405, yuemeite building, No. 1, Gaoxin South seventh Road, high tech Zone community, Yuehai street, Nanshan District, Shenzhen, Guangdong 518000 Patentee after: Howell touch and display technology (Shenzhen) Co.,Ltd. Address before: 518000 a1102, Shenzhen national engineering laboratory building, No. 20, Gaoxin South seventh Road, high tech Zone community, Yuehai street, Nanshan District, Shenzhen, Guangdong Patentee before: Howell touch and display technology (Shenzhen) Co.,Ltd. |