CN210274985U - Ultra-thin type electronic equipment heat dissipation paster - Google Patents
Ultra-thin type electronic equipment heat dissipation paster Download PDFInfo
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- CN210274985U CN210274985U CN201921088673.1U CN201921088673U CN210274985U CN 210274985 U CN210274985 U CN 210274985U CN 201921088673 U CN201921088673 U CN 201921088673U CN 210274985 U CN210274985 U CN 210274985U
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Abstract
The utility model discloses an ultra-thin type electronic equipment heat dissipation paster, it includes: the heat conducting substrate is fixedly attached to the electronic equipment; the middle part of the graphite flake is provided with a window, the graphite flake is attached to the lower end surface of the heat-conducting substrate and is fixedly adhered through glue or first double-sided adhesive, and the outer edge of the heat-conducting substrate protrudes out of the outer edge of the graphite flake; and the shape of the first heat-conducting double-sided adhesive tape is matched with that of the window, the first heat-conducting double-sided adhesive tape is fixedly attached to the lower end face of the heat-conducting substrate and is arranged in the window, and the lower end face of the first heat-conducting double-sided adhesive tape is flush with the lower end face of the graphite flake. When the electronic equipment runs, a large amount of heat generated by the electronic equipment is absorbed by the heat-conducting substrate and conducted to the graphite sheet and is dissipated by the graphite sheet, so that the high-efficiency heat-conducting and heat-dissipating effect is achieved; the utility model is a sheet product, which has thinner thickness, so that the utility model is suitable for thinner electronic equipment; the window that wireless charger sees through the graphite flake carries out wireless charging to electronic equipment, and the graphite flake can not exert an influence to wireless charging, guarantees the wireless normal clear that charges.
Description
The technical field is as follows:
the utility model relates to an electronic equipment heat dissipation technical field refers in particular to an ultra-thin type electronic equipment heat dissipation paster.
Background art:
in order to facilitate life, modern microelectronic technology is developing at a high speed, and various electronic devices such as computers, mobile phones, tablet computers and the like are continuously developed. The electronic device generates a large amount of heat energy during operation, and the heat energy affects the operation speed of the electronic device or causes the electronic device to overheat and crash.
Therefore, the electronic device may be provided with a heat sink in cooperation with a fan to dissipate heat, but the thickness of the electronic device may be increased, which is not suitable for thinner electronic devices, such as mobile phones and tablet computers.
Therefore, a material which is efficient in heat conduction, light and thin in thickness is urgently needed to rapidly transfer heat out, and normal operation of electronic equipment is guaranteed.
In view of the above, the present inventors propose the following.
The utility model has the following contents:
an object of the utility model is to overcome prior art not enough, provide an ultra-thin type electronic equipment heat dissipation paster.
In order to solve the technical problem, the utility model discloses a following technical scheme: this ultra-thin type electronic equipment heat dissipation paster includes: the heat conducting substrate is used for being fixedly attached to the electronic equipment; the middle part of the graphite flake is provided with a window, the graphite flake is attached to the lower end surface of the heat-conducting substrate and is fixedly adhered through glue or first double-sided adhesive, and the outer edge of the heat-conducting substrate protrudes out of the outer edge of the graphite flake; and the shape of the first heat-conducting double-sided adhesive tape is matched with that of the window, the first heat-conducting double-sided adhesive tape is fixedly attached to the lower end face of the heat-conducting substrate and is placed in the window, and the lower end face of the first heat-conducting double-sided adhesive tape is flush with the lower end face of the graphite flake.
Further, in the above technical solution, the heat conducting substrate is a heat conducting silica gel sheet.
Further, in the above technical solution, the heat conducting substrate is a heat conducting metal sheet.
Further, in the above technical solution, the heat conducting substrate is a heat conducting plastic sheet.
Further, in the above technical solution, the heat conducting substrate is a heat conducting double-sided adhesive tape.
Furthermore, in the above technical scheme, a first notch and a second notch are formed at two ends of the graphite flake respectively, a second heat-conducting double-sided tape and a third heat-conducting double-sided tape are fixedly attached to two ends of the lower end surface of the heat-conducting substrate respectively, the first notch and the second notch are filled with the second heat-conducting double-sided tape and the third heat-conducting double-sided tape respectively, and the thicknesses of the second heat-conducting double-sided tape and the third heat-conducting double-sided tape are the same as the thickness of the graphite flake.
Further, in the above technical solution, the window is cross-shaped, and the first thermally conductive double-sided adhesive tape is cross-shaped; or, the window is rectangular, and the first heat-conducting double-sided adhesive tape is rectangular; or, the window is circular, and the first heat-conducting double-sided adhesive tape is circular.
Further, in the above technical solution, the thickness of the first double-sided thermal adhesive tape is the same as the thickness of the graphite sheet.
Furthermore, in the above technical scheme, the upper end surface of the heat conducting substrate is provided with a second double-sided adhesive, the upper surface of the second double-sided adhesive is pasted with a first release paper, and after the first release paper is torn off, the second double-sided adhesive is pasted on the electronic device.
Further, in the above technical solution, the thickness of the ultra-thin electronic device heat dissipation patch is 0.5-3 mm.
After the technical scheme is adopted, compared with the prior art, the utility model has following beneficial effect: the utility model discloses a heat conduction base plate and the fixed laminating of electronic equipment, when electronic equipment operation produced a large amount of heats, this heat conduction base plate can adsorb a large amount of heats to the conduction sends the graphite flake, so that gives off the heat by this graphite flake, so as to reach radiating effect, and this graphite flake has extremely strong heat conduction radiating effect, makes the utility model discloses have fabulous radiating effect, moreover, the utility model discloses a slice product, its thickness is thinner to it is applicable to thinner electronic equipment (like cell-phone, panel computer), and can carry out high-efficient heat conduction to thin electronic equipment, ensures electronic equipment normal operating, makes the utility model discloses extremely strong market competition has. Additionally, the utility model discloses be provided with the window in the graphite flake middle part, when adopting wireless charger to carry out wireless charging to electronic equipment (like the cell-phone), wireless charger sees through this window and directly carries out wireless charging to electronic equipment (like the cell-phone), and this graphite flake can not exert an influence to wireless charging, guarantees the normal clear of wireless charging, and it is very convenient to use, and this window intussuseption is filled with first heat conduction double faced adhesive tape, and this first heat conduction double faced adhesive tape still can further improve the radiating efficiency.
Description of the drawings:
fig. 1 is a perspective view of the present invention;
fig. 2 is a cross-sectional view of the present invention;
fig. 3 is an exploded perspective view of the present invention;
fig. 4 is a front view of the present invention;
fig. 5 is a rear view of the present invention.
The specific implementation mode is as follows:
the present invention will be further described with reference to the following specific embodiments and accompanying drawings.
As shown in fig. 1-5, the heat dissipation patch for ultra-thin electronic device includes: a heat-conducting substrate 1 for fixedly attaching to an electronic device; a graphite sheet 2, wherein a window 21 is arranged in the middle of the graphite sheet 2, the graphite sheet 2 is attached to the lower end face of the heat-conducting substrate 1 and is fixed by glue or first double-sided adhesive, and the outer edge of the heat-conducting substrate 1 protrudes out of the outer edge of the graphite sheet 2; and the shape of the first heat-conducting double-sided adhesive tape 3 is matched with that of the window 21, the first heat-conducting double-sided adhesive tape 3 is fixedly attached to the lower end face of the heat-conducting substrate 1 and is placed in the window 21, and the lower end face of the first heat-conducting double-sided adhesive tape 3 is flush with the lower end face of the graphite sheet 2. The utility model discloses a heat conduction base plate 1 and the fixed laminating of electronic equipment, when electronic equipment operation produced a large amount of heats, this heat conduction base plate 1 can adsorb a large amount of heats to the conduction sends the graphite flake, so as to give off the heat by this graphite flake, so as to reach radiating effect, and this graphite flake has extremely strong heat conduction radiating effect, makes the utility model discloses have fabulous radiating effect, moreover, the utility model discloses a slice product, its thickness is thinner to it is applicable to thinner electronic equipment (like cell-phone, panel computer), and can carry out high-efficient heat conduction to thin electronic equipment, ensures electronic equipment normal operating, makes the utility model discloses extremely strong market competition has. Additionally, the utility model discloses be provided with window 21 in 2 middle parts of graphite flake, when adopting wireless charger to carry out wireless charging to electronic equipment (like the cell-phone), wireless charger sees through this window 21 and directly carries out wireless charging to electronic equipment (like the cell-phone), and this graphite flake 3 can not exert an influence to wireless charging, guarantees wireless normal clear of charging, and it is very convenient to use, and this window 21 intussuseption is filled with first heat conduction double faced adhesive tape 3, and this first heat conduction double faced adhesive tape 3 still can further improve the heat dissipation efficiency.
The heat conducting substrate 1 is a heat conducting silica gel sheet. Alternatively, the heat conducting substrate 1 is a heat conducting metal sheet. Or, the heat conducting substrate 1 is a heat conducting plastic sheet. Alternatively, the heat-conducting substrate 1 is a double-sided heat-conducting adhesive tape. Preferably, the heat conducting substrate 1 is a heat conducting silica gel sheet which is soft, good in heat conducting effect and good in laminating effect.
The graphite flake is a brand new heat-conducting and heat-dissipating material, has unique crystal grain orientation, conducts heat uniformly along two directions, and the lamellar structure can be well adapted to any surface, shield heat sources and components and simultaneously improve the performance of consumer electronic products. The novel natural graphite solution has high heat dissipation efficiency, small occupied space and light weight, conducts heat uniformly along two directions, eliminates a 'hot spot' area, shields a heat source and components and improves the performance of consumer electronic products.
The two ends of the graphite sheet 2 are respectively provided with a first notch and a second notch, the two ends of the lower end face of the heat-conducting substrate 1 are respectively and fixedly attached with a second heat-conducting double-sided adhesive tape 4 and a third heat-conducting double-sided adhesive tape 5, the first notch and the second notch are respectively filled with the second heat-conducting double-sided adhesive tape 4 and the third heat-conducting double-sided adhesive tape 5, and the thicknesses of the second heat-conducting double-sided adhesive tape 4 and the third heat-conducting double-sided adhesive tape 5 are the same as the thickness of the graphite sheet 2.
The window 21 is in a cross shape, and the first heat-conducting double-sided adhesive tape 3 is in a cross shape; alternatively, the window 21 is rectangular, and the first bond ply 3 is rectangular; alternatively, the window 21 is circular, and the first bond ply 3 is circular. In this embodiment, the window 21 is cross-shaped, and the first bond tape 3 is cross-shaped.
The thickness of the first heat-conducting double-sided adhesive tape 3 is the same as that of the graphite sheet 2. The thickness of the ultra-thin electronic equipment heat dissipation patch is 0.5-3 mm.
The upper end face of the heat conduction substrate 1 is provided with second double-sided adhesive, the upper surface of the second double-sided adhesive is pasted with first release paper, and after the first release paper is torn off, the second double-sided adhesive is pasted on the electronic equipment.
To sum up, the utility model discloses a fixed laminating of heat conduction base plate 1 and electronic equipment, when electronic equipment operation produced a large amount of heats, this heat conduction base plate 1 can adsorb a large amount of heats to the graphite flake is sent in the conduction, so that give off the heat by this graphite flake, so as to reach radiating effect, and this graphite flake has extremely strong heat conduction radiating effect, makes the utility model discloses have fabulous radiating effect, moreover, the utility model discloses a slice product, its thickness is thinner to it can be applicable to thinner electronic equipment (like cell-phone, panel computer), and can carry out high-efficient heat conduction to thin electronic equipment, ensures electronic equipment normal operating, makes the utility model discloses extremely strong market competition has. Additionally, the utility model discloses be provided with window 21 in 2 middle parts of graphite flake, when adopting wireless charger to carry out wireless charging to electronic equipment (like the cell-phone), wireless charger sees through this window 21 and directly carries out wireless charging to electronic equipment (like the cell-phone), and this graphite flake 3 can not exert an influence to wireless charging, guarantees wireless normal clear of charging, and it is very convenient to use, and this window 21 intussuseption is filled with first heat conduction double faced adhesive tape 3, and this first heat conduction double faced adhesive tape 3 still can further improve the heat dissipation efficiency.
Of course, the above description is only an exemplary embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes and modifications made by the constructions, features, and principles of the present invention in accordance with the claims of the present invention are intended to be included in the scope of the present invention.
Claims (10)
1. The utility model provides an ultra-thin type electronic equipment heat dissipation paster which characterized in that: it includes:
the heat conducting substrate (1) is used for being fixedly attached to the electronic equipment;
the middle part of the graphite sheet (2) is provided with a window (21), the graphite sheet (2) is attached to the lower end face of the heat-conducting substrate (1) and is fixedly attached through glue or first double-sided adhesive, and the outer edge of the heat-conducting substrate (1) protrudes out of the outer edge of the graphite sheet (2);
and the shape of the first heat-conducting double-sided adhesive tape (3) is matched with that of the window (21), the first heat-conducting double-sided adhesive tape (3) is fixedly attached to the lower end face of the heat-conducting substrate (1) and is arranged in the window (21), and the lower end face of the first heat-conducting double-sided adhesive tape (3) is flush with the lower end face of the graphite sheet (2).
2. The ultra-thin electronic device heat sink patch as claimed in claim 1, wherein: the heat conduction substrate (1) is a heat conduction silica gel sheet.
3. The ultra-thin electronic device heat sink patch as claimed in claim 1, wherein: the heat conducting substrate (1) is a heat conducting metal sheet.
4. The ultra-thin electronic device heat sink patch as claimed in claim 1, wherein: the heat-conducting substrate (1) is a heat-conducting plastic sheet.
5. The ultra-thin electronic device heat sink patch as claimed in claim 1, wherein: the heat-conducting substrate (1) is a heat-conducting double-sided adhesive tape.
6. The ultra-thin electronic device heat sink patch as claimed in any one of claims 1-5, wherein: graphite flake (2) both ends are formed with first breach and second breach respectively, terminal surface both ends are fixed the laminating respectively under heat conduction base plate (1) have second heat conduction double faced adhesive tape (4) and third heat conduction double faced adhesive tape (5), and this first breach and second breach are filled respectively to this second heat conduction double faced adhesive tape (4) and third heat conduction double faced adhesive tape (5), and the thickness of this second heat conduction double faced adhesive tape (4) and third heat conduction double faced adhesive tape (5) all is the same with the thickness of graphite flake (2).
7. The ultra-thin electronic device heat sink patch as recited in claim 6, wherein: the window (21) is in a cross shape, and the first heat-conducting double-sided adhesive tape (3) is in a cross shape; or, the window (21) is rectangular, and the first heat-conducting double-sided adhesive tape (3) is rectangular; or the window (21) is circular, and the first heat-conducting double-sided adhesive tape (3) is circular.
8. The ultra-thin electronic device heat sink patch as recited in claim 6, wherein: the thickness of the first heat-conducting double-sided adhesive tape (3) is the same as that of the graphite sheet (2).
9. The ultra-thin electronic device heat sink patch as recited in claim 7, wherein: the upper end face of the heat conduction substrate (1) is provided with second double-sided adhesive, the upper surface of the second double-sided adhesive is pasted with first release paper, and after the first release paper is torn off, the second double-sided adhesive is pasted on the electronic equipment.
10. The ultra-thin electronic device heat sink patch as recited in claim 7, wherein: the thickness of the ultra-thin electronic equipment heat dissipation patch is 0.5-3 mm.
Priority Applications (1)
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CN201921088673.1U CN210274985U (en) | 2019-07-10 | 2019-07-10 | Ultra-thin type electronic equipment heat dissipation paster |
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CN201921088673.1U CN210274985U (en) | 2019-07-10 | 2019-07-10 | Ultra-thin type electronic equipment heat dissipation paster |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110278694A (en) * | 2019-07-10 | 2019-09-24 | 东莞市源冠塑胶模具有限公司 | A kind of ultrathin type electronic equipment dissipating heat patch |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110278694A (en) * | 2019-07-10 | 2019-09-24 | 东莞市源冠塑胶模具有限公司 | A kind of ultrathin type electronic equipment dissipating heat patch |
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Address after: No.1, Wusha Haibin Road, Chang'an Town, Dongguan City, Guangdong Province 523000 Patentee after: Dongguan Yuanguan Technology Co., Ltd Address before: 523000 Guangdong Province, Dongguan city Changan Town Industrial Zone sixth usha Beach Road No. 3 1 Patentee before: DONGGUAN YUANGUAN PLASTIC MOULD Co.,Ltd. |
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